Liquid cooling plate and liquid cooling heat dissipation system

Abstract

This application relates to the field of liquid cooling technology and discloses a liquid cooling plate and a liquid cooling heat dissipation system, which can improve the heat dissipation efficiency of the liquid cooling plate while avoiding internal blockage. The liquid cooling plate includes a main body, an inlet connector, and an outlet connector. The main body of the liquid cooling plate has a cavity inside, and the cavity is provided with at least one partition for dividing the cavity into at least two liquid cooling chambers. Multiple parallel-arranged first heat dissipation fins are provided in the liquid cooling chambers, and the partition is provided with multiple connecting holes. One side of the main body of the liquid cooling plate is used for thermally conductive connection with a heat-generating element, and the other side is provided with an inlet connector and an outlet connector. The main body of the liquid cooling plate has an inlet and an outlet, which are respectively connected to the two liquid cooling chambers at both ends. The inlet connector is connected to the inlet, and the outlet connector is connected to the outlet. The orthographic projections of the inlet and the connecting hole connected to the same liquid cooling chamber on the projection plane do not overlap, and the orthographic projections of the outlet and the connecting hole connected to the same liquid cooling chamber on the projection plane do not overlap.

Description

Technical Field

[0001] This application relates to the field of liquid cooling technology, and in particular to a liquid cooling plate and a liquid cooling heat dissipation system. Background Technology

[0002] As server application demands continue to increase, the need for internal server heat dissipation is also rising. Liquid cooling, with its highly efficient heat dissipation capabilities, is increasingly being used in server internal heat dissipation scenarios. For high-power chips, liquid coolers are currently commonly used to dissipate heat.

[0003] Current liquid cooling plates for chips mainly consist of multiple parallel heat sinks. When it is necessary to increase the heat dissipation power of the liquid cooling plate, this is generally achieved by increasing the number of heat sinks. However, increasing the number of heat sinks leads to a decrease in the spacing between them, which not only increases the flow resistance and pressure drop, but also makes the liquid cooling plate prone to internal blockage when the particle size of impurities in the cooling medium is large, thus hindering the improvement of the liquid cooling effect. Utility Model Content

[0004] This application provides a liquid cooling plate and a liquid cooling heat dissipation system, which can improve the heat dissipation efficiency of the liquid cooling plate while avoiding internal blockage.

[0005] In a first aspect, this application provides a liquid cooling plate, including a cooling plate body, a liquid inlet connector, and a liquid outlet connector;

[0006] The interior of the cold plate body has a cavity, and the cavity is provided with at least one partition. The at least one partition is used to divide the cavity into at least two liquid cooling cavities arranged along the thickness direction of the cold plate body. Each liquid cooling cavity is provided with a plurality of parallel first heat dissipation fins. The partition is provided with a plurality of connecting holes to connect two adjacent liquid cooling cavities.

[0007] Along the thickness direction of the cold plate body, one side of the cold plate body is used for thermally conductive connection with the heating element, and the other side of the cold plate body is used for setting the liquid inlet connector and the liquid outlet connector;

[0008] The main body of the cold plate is provided with a liquid inlet and a liquid outlet. The liquid inlet and the liquid outlet are respectively connected to two liquid cooling cavities located at both ends. The liquid inlet connector is connected to the liquid inlet, and the liquid outlet connector is connected to the liquid outlet.

[0009] Let the projection plane be a plane parallel to the partition. The orthographic projections of the liquid inlet and the connecting hole connected to the same liquid cooling cavity on the projection plane do not overlap. The orthographic projections of the liquid outlet and the connecting hole connected to the same liquid cooling cavity on the projection plane do not overlap. Furthermore, the orthographic projections of the connecting holes on two adjacent partitions on the projection plane do not overlap.

[0010] The liquid-cooled plate in this application divides the internal space of the main body of the plate into at least two layers of liquid-cooling cavities, each of which is equipped with a first heat sink. This increases the number of first heat sinks, thereby increasing the heat exchange area between the first heat sinks and the cooling medium, thus improving the heat dissipation efficiency of the liquid-cooled plate. Simultaneously, by arranging at least two layers of first heat sinks vertically, the spacing between the first heat sinks in the same layer can be reasonably controlled. This not only avoids increased flow resistance and pressure drop caused by excessively small spacing between heat sinks, but also prevents blockage within the liquid-cooled plate. Furthermore, the connecting holes are staggered from the inlet and outlet, and the connecting holes of adjacent partitions are also staggered. This prevents the cooling medium from flowing directly between the connecting holes and outlet, between the connecting holes and inlet, and between connecting holes themselves, ensuring sufficient heat exchange between the cooling medium and the heat sinks, further improving the heat dissipation efficiency of the liquid-cooled plate.

[0011] In some possible implementations, the liquid inlet is connected to the liquid cooling cavity near the heating element, and the liquid outlet is connected to the liquid cooling cavity near the liquid outlet connector;

[0012] The liquid inlet is located on the partition near the heating element, and a portion of the liquid inlet connector extends into the cavity and is connected to the liquid inlet.

[0013] In some possible implementations, the plurality of first heat sinks are arranged along a first direction, the first heat sinks extend along a second direction, and a flow channel extending along the second direction is formed between two adjacent first heat sinks;

[0014] The connecting hole and the liquid inlet on the partition plate having the liquid inlet are located on both sides of the first heat sink along the second direction.

[0015] In some possible implementations, the connecting hole on the partition near the liquid outlet connector is located on both sides of the first heat sink along the second direction.

[0016] In some possible implementations, the communicating hole on the partition near the liquid outlet connector is located on the same side of the first heat sink along the second direction as the liquid outlet.

[0017] The liquid cooling cavity near the liquid outlet connector is also provided with a plurality of second heat sinks. The plurality of second heat sinks are disposed on one side of the plurality of first heat sinks along the second direction. The plurality of second heat sinks are arranged along the first direction and extend along the second direction. The orthographic projection of the liquid outlet on the projection plane is located within the orthographic projection area of ​​the plurality of second heat sinks on the projection plane.

[0018] The dimensions of the plurality of first heat sinks in the first direction are greater than the dimensions of the plurality of second heat sinks in the first direction, the height of the second heat sinks is less than the height of the first heat sinks, and the connecting holes are disposed on both sides of the plurality of second heat sinks along the first direction.

[0019] In some possible implementations, two third heat sinks are further provided in the liquid cooling cavity near the liquid outlet connector. The two third heat sinks are respectively located on both sides of the plurality of second heat sinks along the first direction. The height of the second heat sinks is less than the height of the third heat sinks. The dimensions of the plurality of first heat sinks in the first direction are greater than the spacing between the two third heat sinks. The connecting hole is located on the side of the third heat sink away from the second heat sink along the first direction.

[0020] In some possible implementations, the ratio of the height of the second heat sink to the height of the first heat sink is 1 / 2 to 2 / 3.

[0021] In some possible implementations, the ratio of the area occupied by the orthographic projection of the plurality of second heat sinks on the projection plane to the area of ​​the orthographic projection of the connecting hole on the partition near the outlet connector on the projection plane is 1.5 to 3.

[0022] In some possible implementations, two sets of connecting holes on two adjacent partitions are located on opposite sides of the first heat sink along the second direction.

[0023] In some possible implementations, the ratio of the total area of ​​the connecting holes on each of the partitions to the area of ​​the liquid inlet is 2.5 to 4, and the ratio of the total area of ​​the connecting holes to the area of ​​the liquid outlet is 2.5 to 4.

[0024] In a second aspect, this application provides a liquid cooling heat dissipation system, including a server, a heat exchanger, a circulation pump, and a liquid cooling plate as described in any possible embodiment of the first aspect;

[0025] The server includes a housing and a heating element disposed inside the housing, the liquid cooling plate being disposed inside the housing, and the heating element being thermally connected to the liquid cooling plate;

[0026] The liquid inlet connector is connected to the heat exchanger through a liquid inlet pipe passing through the housing, and the liquid outlet connector is connected to the heat exchanger through a liquid outlet pipe passing through the housing.

[0027] The circulating pump is connected to the inlet pipe or the outlet pipe.

[0028] In some possible implementations, the server is equipped with multiple heat-generating elements, and the liquid cooling plate is configured to correspond one-to-one with each of the heat-generating elements;

[0029] The liquid inlet pipeline includes at least one main liquid inlet pipe and at least two parallel liquid inlet branch pipes connected to each main liquid inlet pipe. The total number of liquid inlet branch pipes is the same as the number of liquid cooling plates, and each liquid inlet branch pipe is connected to one liquid cooling plate.

[0030] The liquid outlet pipeline includes at least one main liquid outlet pipe and at least two parallel liquid outlet pipelines connected to each of the main liquid outlet pipes. The number of liquid outlet branch pipes is the same as the number of liquid cooling plates, and each liquid outlet branch pipe is connected to one liquid cooling plate.

[0031] In some possible implementations, at least a portion of the inlet branch pipes connected to the same inlet main pipe are connected to the inlet main pipe via a tee connector.

[0032] In at least two outlet branch pipes connected to the same outlet main pipe, at least a portion of the inlet branch pipes are connected to the outlet main pipe via a tee connector.

[0033] In some possible implementations, the inlet manifold is connected to the heat exchanger via a quick-connect connector, and the outlet manifold is connected to the heat exchanger via a quick-connect connector. Attached Figure Description

[0034] Figure 1 This is a schematic diagram of an overall structure of the liquid cooling heat dissipation system in an embodiment of this application;

[0035] Figure 2 This is a schematic diagram of one structure of the liquid cooling plate in an embodiment of this application;

[0036] Figure 3 This is a schematic diagram of the liquid cooling plate from another perspective in an embodiment of this application;

[0037] Figure 4 This is a schematic diagram of the structure of the cold plate body in one embodiment of this application;

[0038] Figure 5 This is a cross-sectional structural diagram of a liquid cooling heat dissipation system in an embodiment of this application;

[0039] Figure 6 This is an exploded structural diagram of the main body of the cold plate in an embodiment of this application;

[0040] Figure 7 This is a schematic cross-sectional view of the main body of the cold plate in an embodiment of this application;

[0041] Figure 8 for Figure 5 Another perspective of the exploded structure of the main body of the intercooler plate;

[0042] Figure 9 This is a top view of a structure within the second liquid cooling cavity in an embodiment of this application;

[0043] Figure 10 This is a top view of a structure within the first liquid cooling cavity in an embodiment of this application;

[0044] Figure 11 This is a schematic diagram of another structure of the cold plate body in the embodiments of this application;

[0045] Figure 12 for Figure 11 An exploded structural diagram of the main body of the intermediate cooling plate;

[0046] Figure 13 This is a top view schematic diagram of another structure within the second liquid cooling cavity in an embodiment of this application;

[0047] Figure 14 This is a schematic diagram of a structure in which the liquid inlet pipe is connected to the liquid cooling plate in an embodiment of this application;

[0048] Figure 15 This is a schematic diagram of a structure in which the liquid inlet pipe and the liquid outlet pipe are connected to the liquid cooling plate in an embodiment of this application.

[0049] Figure 16 for Figure 15 A schematic diagram of the structure and server assembly in the image;

[0050] Figure 17 This is a schematic diagram of another structure in which the liquid inlet pipe and liquid outlet pipe are connected to the liquid cooling plate in an embodiment of this application.

[0051] Figure 18 for Figure 17 The diagram shows a structural representation of the server assembly.

[0052] In the picture:

[0053] 100 - Server; 110 - Housing; 200 - Liquid cooling plate; 210 - Fixing frame; 220 - Main body of the cooling plate; 201 - Liquid inlet; 202 - Liquid outlet; 221 - Partition; 2211 - Connecting hole; 222 - First heat sink; 223 - First enclosed frame; 224 - Second enclosed frame; 225 - Second heat sink; 230 - Liquid inlet connector; 240 - Liquid outlet connector; 250, 250a, 250b - First heat sink fins; 2 60 - Second heat sink; 270 - Third heat sink; 300 - Heat exchanger; 400 - Circulation pump; 500 - Liquid inlet pipe; 510 - Main liquid inlet pipe; 520 - Branch liquid inlet pipe; 600 - Liquid outlet pipe; 610 - Main liquid outlet pipe; 620 - Branch liquid outlet pipe; 700 - Quick-connect connector; 710 - Quick-connect connector plug; 720 - Quick-connect connector female; 800 - T-connector; S - Liquid cooling chamber; S1 - First liquid cooling chamber; S2 - Second liquid cooling chamber. Detailed Implementation

[0054] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.

[0055] Current liquid cooling plates for chips primarily employ a structure of multiple parallel heat sinks. To improve the heat dissipation efficiency of a liquid cooling plate, the number of heat sinks is typically increased. However, increasing the number of heat sinks means reducing the spacing between adjacent heat sinks, which increases the likelihood of blockage. Alternatively, other more complex structures can be used to balance the spacing between heat sinks, the pore size of impurities in the cooling medium, and heat exchange efficiency. However, this approach involves complex manufacturing processes, and yield rates and costs cannot be guaranteed, limiting its large-scale application.

[0056] To address the aforementioned issues, embodiments of this application provide a liquid cooling plate and a liquid cooling heat dissipation system. This not only improves heat dissipation efficiency while preventing blockages caused by excessively small spacing between heat sinks, but also simplifies the structure, enabling better product implementation and operation. The following detailed description of the liquid cooling plate and liquid cooling heat dissipation system, in conjunction with specific embodiments, provides further details.

[0057] refer to Figure 1 The liquid cooling system in this embodiment may include a server 100, a liquid cooling plate 200, a heat exchanger 300, and a circulating pump 400.

[0058] Server 100 may include a housing 110 and multiple heat-generating elements (not shown in the figure) disposed inside the housing 110. The heat-generating elements may be chips or other electronic devices that generate a lot of heat. A liquid cooling plate 200 is disposed inside the housing 110. The liquid cooling plate 200 can be configured one-to-one with a heat-generating element, that is, one heat-generating element can be thermally connected to one liquid cooling plate 200 to dissipate heat from the heat-generating element through the liquid cooling plate 200, so as to prevent the heat-generating element from being damaged due to overheating.

[0059] The liquid cooling plate 200 is connected to the heat exchanger 300 via an inlet pipe 500 and an outlet pipe 600 passing through the housing 110. A circulation pump 400 is connected to either the inlet pipe 500 or the outlet pipe 600. The liquid cooling plate 200 is filled with cooling medium, and the heat exchanger 300 contains a cold source. When the circulation pump 400 is turned on, the cooling medium in the heat exchanger 300 flows to the liquid cooling plate 200 through the inlet pipe 500, while simultaneously, the cooling medium in the liquid cooling plate 200 flows back to the heat exchanger 300 through the outlet pipe 600. Thus, by circulating the cooling medium within the liquid cooling plate 200, heat exchange with the heating elements is achieved, thereby dissipating heat from the heating elements.

[0060] Continue to refer to Figure 1 The liquid inlet pipe 500 can be connected to the heat exchanger 300 via a quick-connect connector 700, and the liquid outlet pipe 600 can also be connected to the heat exchanger 300 via a quick-connect connector 700. Specifically, the quick-connect connector 700 may include a quick-connect connector plug 710 and a quick-connect connector female 720. The liquid inlet pipe 500 and the liquid outlet pipe 600 can be connected to the quick-connect connector plug 710, and the quick-connect connector female 720 can be connected to the heat exchanger 300. During use, the quick-connect connector plug 710 and the quick-connect connector female 720 can be quickly plugged in or disconnected to connect or disconnect the heat exchanger 300 and the liquid cooling plate 200, facilitating operation. Furthermore, due to the connection structure of the quick-connect connector 700, no leakage of the cooling medium will occur when the quick-connect connector plug 710 and the quick-connect connector female 720 are disconnected, ensuring the stability of the liquid cooling system.

[0061] refer to Figure 2 and Figure 3 The liquid cooling plate 200 in this embodiment may include a fixed frame 210, a cooling plate body 220, an inlet connector 230 and an outlet connector 240. The fixed frame 210 has an installation space in the middle. The cooling plate body 220 can be bolted to the installation space to fix the cooling plate body 220 to the fixed frame 210.

[0062] Please refer to the above. Figures 4 to 5The cold plate body 220 has an interior cavity, and at least one partition 221 is provided inside the cavity. The partition 221 can be used to divide the cavity into at least two liquid cooling cavities S, and each liquid cooling cavity S is provided with a plurality of parallel-arranged first heat sinks 250. Here, when the number of partitions 221 is greater than or equal to 2, the partitions 221 are arranged along the thickness direction of the cold plate body 220, so that the plurality of liquid cooling cavities S formed by the partition are arranged along the thickness direction of the cold plate body 220.

[0063] Each partition 221 is provided with multiple connecting holes 2211. The connecting holes 2211 can be used to connect two adjacent liquid cooling chambers S, so that the cooling medium can enter the other liquid cooling chamber S from one liquid cooling chamber S through the connecting holes 2211.

[0064] Along the thickness direction of the cold plate body 220, one side of the cold plate body 220 can be used for thermal connection with the heating element, and the liquid inlet connector 230 and the liquid outlet connector 240 are provided on the other side of the cold plate body 220. In addition, the cold plate body 220 is also provided with a liquid inlet 201 and a liquid outlet 202, which are respectively connected to two liquid cooling cavities S at both ends. The liquid inlet 201 is connected to the liquid inlet connector 230, and the liquid outlet 202 is connected to the liquid outlet connector 240. After the cooling medium enters the liquid cooling cavity S located at one end through the liquid inlet 201, it exchanges heat with the first heat sink 250, flows into the adjacent liquid cooling cavity S through the connecting hole, and then exchanges heat with the first heat sink 250 in each liquid cooling cavity S in sequence, and finally flows out through the liquid outlet 202 connected to the other end of the liquid cooling cavity S.

[0065] Assume the projection plane is parallel to the partition 221. The orthographic projections of the liquid inlet 201 and the connecting hole 2211 connected to the same liquid cooling cavity S do not overlap on the projection plane. Similarly, the orthographic projections of the liquid outlet 202 and the connecting hole 2211 connected to the same liquid cooling cavity S do not overlap on the projection plane. Furthermore, the orthographic projections of the connecting holes 2211 on two adjacent partitions 221 do not overlap on the projection plane. That is, the liquid inlet 201 and the liquid outlet 202 are staggered from the connecting hole 2211, and the connecting holes 2211 on two adjacent partitions 221 are staggered.

[0066] In this embodiment, the cavity inside the main body 220 of the cold plate is divided into at least two liquid cooling cavities S, one above the other. Each liquid cooling cavity S is provided with multiple first heat sinks 250, thereby increasing the number of first heat sinks 250 and thus increasing the heat exchange area between the first heat sinks 250 and the cooling medium, improving the heat dissipation efficiency of the liquid cooling plate 200. At the same time, by arranging at least two layers of first heat sinks 250 vertically, the spacing between the first heat sinks 250 in the same layer can be reasonably controlled. This not only avoids the increase in flow resistance and pressure drop caused by the small spacing between the heat sinks, but also prevents blockage within the liquid cooling plate 200. In addition, the connecting holes 2211 are staggered from the liquid inlet 201 and the liquid outlet 202, respectively. The connecting holes 2211 of two adjacent partitions 221 are staggered, which can prevent the cooling medium from flowing directly between the connecting holes 2211 and the liquid outlet 202, between the connecting holes 2211 and the liquid inlet 201, and between the connecting holes 2211 and the connecting holes 2211, ensuring that the cooling medium and the heat sink can exchange heat fully, and further improving the heat dissipation efficiency of the liquid cooling plate 200.

[0067] In practical applications, the interior of the cold plate body 220 can be provided with one partition 221, two partitions 221, three partitions 221, etc. To facilitate a clearer description of the liquid-cooled plate 200 in the embodiments of this application, the following embodiments will all be described with a scheme where one partition 221 is provided inside the cold plate body 220. It should be noted that the liquid-cooled plate 200 in the following embodiments can be considered as having two liquid-cooling cavities S, or multiple liquid-cooling cavities S, but the middle liquid-cooling cavity S is omitted, and only the liquid-cooling cavities S at both ends are retained.

[0068] refer to Figures 6 to 8 The partition 221 divides the cavity into a first liquid cooling cavity S1 and a second liquid cooling cavity S2. The cold plate body 220 is located on the side of the first liquid cooling cavity S1 away from the second liquid cooling cavity S2 and can be thermally connected to the heating element. The liquid inlet connector 230 and the liquid outlet connector 240 can be set on the side of the cold plate body 220 located in the second liquid cooling cavity S2 away from the first liquid cooling cavity S1.

[0069] In this case, if the liquid cooling plate 200 is provided with two or more partitions 221, the first liquid cooling cavity S1 can be regarded as the liquid cooling cavity near the heating element, and the second liquid cooling cavity S2 can be regarded as the liquid cooling cavity near the liquid outlet connector 240. If the liquid cooling plate 200 is provided with only one partition 221, then the partition 221 near the heating element and the partition 221 near the liquid outlet connector 240 are the same.

[0070] In specific implementation, refer to Figures 6 to 8The main body of the cold plate may further include a first closed frame 223, a second closed frame 224, a first heat dissipation plate 222, and a second heat dissipation plate 225, wherein the size of the second closed frame 224 is smaller than the size of the first closed frame 223. The first heat dissipation plate 222 and the partition plate 221 are the same size, and the first heat dissipation plate 222 and the partition plate 221 are connected to opposite sides of the first closed frame 223 so that the first heat dissipation plate 222, the first closed frame 223, and the partition plate 221 cooperate to form a relatively enclosed space.

[0071] The second enclosed frame 224 is connected to the side of the partition 221 away from the first heat sink 222, and the second heat sink 225 is connected to the side of the second enclosed frame 224 away from the partition 221, so that the partition 221, the second enclosed frame 224, and the second heat sink 225 cooperate to form another relatively enclosed space. At this time, the space enclosed by the second enclosed frame 224 can be regarded as the first liquid cooling cavity S1, and the space enclosed by the first enclosed frame 223 can be regarded as the second liquid cooling cavity S2. The heating element can be thermally connected to the side of the second heat sink 225 away from the partition 221, and the liquid inlet connector 230 and the liquid outlet connector 240 are provided on the first heat sink 222.

[0072] In this embodiment, the first heat sink 250a in the first liquid cooling cavity S1 can be connected between the second heat sink 225 and the partition 221, and the first heat sink 250b in the second liquid cooling cavity S2 can be connected between the partition 221 and the first heat sink 222. At this time, the height of the first heat sink 250a in the first liquid cooling cavity S1 is the same as the height of the first liquid cooling cavity S1, and the height of the first heat sink 250b in the second liquid cooling cavity S2 is the same as the height of the second liquid cooling cavity S2. This ensures that there is no cross-connection between adjacent flow channels, thereby guaranteeing that the cooling medium can flow along a preset path.

[0073] As an alternative implementation scheme, such as Figures 6 to 9 As shown, the liquid inlet 201 is connected to the first liquid cooling cavity S1, and the liquid outlet 202 is connected to the second liquid cooling cavity S2. Thus, when the cooling medium enters the body of the cold plate, it first enters the first liquid cooling cavity S1 to exchange heat with the first heat sink 250a, and then flows into the second liquid cooling cavity S2 through the connecting hole 2211 to exchange heat with the first heat sink 250b. Because the heating element is closer to the first liquid cooling cavity S1, the cooling medium entering the first liquid cooling cavity S1 first ensures a lower temperature for the cooling medium within the first liquid cooling cavity S1, resulting in better heat exchange with the first heat sink 250a. This ensures effective heat exchange between the first heat sink 250a and the heating element, thereby improving the heat dissipation effect of the heating element.

[0074] At this time, the liquid inlet 201 can be set on the partition 221, and a part of the liquid inlet connector 230 can pass through the first heat sink 222 and extend into the second liquid cooling chamber S2, thereby communicating with the liquid inlet 201 on the partition 221. The liquid outlet 202 is set on the first heat sink 222, and the liquid outlet connector 240 is fixed to the first heat sink 222 to maintain a sealed connection with the liquid outlet 202.

[0075] Understandably, by staggering the liquid inlet 201 and liquid outlet 202 from the connecting hole 2211, the cooling medium entering the first liquid cooling chamber S1 through the liquid inlet 201 is prevented from flowing directly into the second liquid cooling chamber S2 through the connecting hole 2211. This ensures that the cooling medium can flow through the first heat sink 250a and exchange heat effectively with it. Simultaneously, it also prevents the cooling medium from flowing directly out through the liquid outlet 202 after entering the second liquid cooling chamber S2 through the connecting hole 2211, thus ensuring that the cooling medium can flow through the first heat sink 250b and exchange heat effectively with it.

[0076] It should be noted that when at least two partitions 221 are installed, the following can be referenced. Figure 5 As shown, the connecting holes 2211 provided on the two adjacent partitions 221 can be located on both sides of the first heat sink 250 in the extending direction. This ensures that the cooling medium can flow along the flow channel between the two first heat sinks 250, so as to ensure sufficient contact between the cooling medium and the first heat sink 250.

[0077] In some embodiments, continue to refer to Figure 9 Multiple first heat sinks 250b can be arranged along a first direction, and each first heat sink 250b can extend along a second direction, forming a flow channel extending along the second direction between two adjacent first heat sinks 250b. A connecting hole 2211 can be provided on the first side of the multiple first heat sinks 250b along the second direction, and a liquid inlet 201 can be provided on the second side of the multiple first heat sinks 250b along the second direction.

[0078] refer to Figure 8 and Figure 10Multiple first heat sinks 250a can be arranged along a first direction, and each first heat sink 250a can extend along a second direction, forming a flow channel extending along the second direction between two adjacent first heat sinks 250a. When the cooling medium enters the first liquid cooling cavity S1 through the liquid inlet 201, the cooling medium first enters the cavity portion of the first liquid cooling cavity S1, then flows along the flow channel of the first heat sink 250a, and finally flows into the second liquid cooling cavity S2 through the connecting hole 2211. During this process, since the liquid inlet 201 and the connecting hole 2211 are located on both sides of the first heat sink 250a in the second direction, sufficient heat exchange between the cooling medium and the first heat sink 250a can be ensured, thereby enhancing the heat exchange effect of the first heat sink 250a.

[0079] Furthermore, refer again Figure 6 and Figure 8 The liquid outlet 202 can be located on the second side of the plurality of first heat sinks 250b along the second direction, that is, the liquid outlet 202 and the liquid inlet 201 are located on the same side of the first heat sink 250b. At this time, the liquid outlet 202 and the connecting hole 2211 are located on both sides of the first heat sink 250b. When the cooling medium flows into the second liquid cooling chamber S2 from the connecting hole 2211, it first flows through the first heat sink 250b and then flows out from the liquid outlet 202. During this process, the cooling medium can fully exchange heat with the first heat sink 250b, thereby enhancing the heat exchange effect of the first heat sink 250b.

[0080] In some embodiments, reference Figure 11 and Figure 12 The connecting hole 2211 and the liquid inlet 201 are respectively disposed on the first side and the second side of the first heat sink 250b along the second direction, and the liquid outlet 202 is disposed on the first side of the first heat sink 250b along the second direction. That is to say, the liquid outlet 202 and the connecting hole 2211 are disposed on the same side of the first heat sink 250b.

[0081] Based on this, such as Figure 12 and Figure 13 As shown, the second liquid cooling cavity S2 is further provided with a plurality of second heat sinks 260, which are arranged along a first direction and extend along a second direction. The second heat sinks 260 are disposed on the first side of the first heat sink 250b along the second direction. The dimensions of the plurality of second heat sinks 260 in the first direction are smaller than the dimensions of the plurality of first heat sinks 250b in the first direction, and the height of the second heat sinks 260 is smaller than the height of the first heat sinks 250b. A connecting hole 2211 is disposed on both sides of the second heat sinks 260 along the first direction. Furthermore, the orthographic projection of the liquid outlet 202 on the projection plane is located within the area occupied by the orthographic projections of the plurality of second heat sinks 260 on the projection plane; that is, the liquid outlet 202 is directly opposite the area where the second heat sinks 260 are located.

[0082] In this embodiment, since the height of the second heat sink 260 is less than the height of the first heat sink 250b, there is a certain gap between the second heat sink 260 and the first heat sink 222. When the cooling medium enters the second liquid cooling cavity S2 through the connecting hole 2211, it can first flow through the first heat sink 250b which is not directly opposite the area where the multiple second heat sinks 260 are located, and converge on the right side of the first heat sink 250b. Then the cooling medium turns back and flows through the first heat sink 250b and the second heat sink 260 which are directly opposite the area where the multiple second heat sinks 260 are located, and finally flows out from above the second heat sink 260.

[0083] Furthermore, to ensure that the cooling medium can flow through the first heat sink 250b before flowing out from above the second heat sink 260, two third heat sinks 270 can also be provided in the second liquid cooling cavity S2, with the two third heat sinks 270 located on both sides of the plurality of second heat sinks 260 along the first direction.

[0084] In this embodiment, the height of the second heat sink 260 is less than the height of the third heat sink 270, and the dimensions of the plurality of first heat sinks 250b in the first direction are greater than the spacing between the two third heat sinks 270, so that the two second heat sinks 260 that are furthest apart are located between the two first heat sinks 250b that are furthest apart in the first direction. At this time, the connecting holes 2211 can be disposed on both sides of the third heat sinks 270 that are away from the second heat sinks 260 in the first direction.

[0085] Combination Figure 12 and Figure 13 When the cooling medium enters the second liquid cooling chamber S2 through the left-side connecting hole 2211, because the height of the third heat sink 270 is greater than the height of the second heat sink 260, the cooling medium cannot flow directly into the space between the second heat sink 260 and the first heat sink 222. Instead, it first flows through the first heat sink 250b, which is not directly opposite the area where the multiple second heat sinks 260 are located, and converges on the right side of the first heat sink 250b. Then, the cooling medium flows back and sequentially through the first heat sink 250b and the second heat sink 260, which are directly opposite the area where the multiple second heat sinks 260 are located, and finally flows out from above the second heat sink 260. During this process, the cooling medium can fully contact and exchange heat with the first heat sink 250b and the second heat sink 260, thereby enhancing the heat exchange effect of the first heat sink 250b and the second heat sink 260. In addition, the addition of the second heat sink 260 can further improve the heat exchange efficiency of the liquid cooling plate 200.

[0086] In practice, the number of second heat sinks 260 is less than the number of first heat sinks 250b, and the spacing between two adjacent second heat sinks 260 can be the same as the spacing between two adjacent first heat sinks 250b, with each second heat sink 260 aligned with a first heat sink 250b. This allows the flow channels between two adjacent second heat sinks 260 to align with the flow channels between two adjacent first heat sinks 250b, which helps reduce the flow resistance of the cooling medium and better ensures the heat exchange efficiency of the liquid cooling plate 200.

[0087] Furthermore, the height of the third heat sink 270 is the same as the height of the first heat sink 250b, that is, the third heat sink 270 is connected between the partition 221 and the first heat sink 222, thereby ensuring that the cooling medium will not flow through the third heat sink 270 to the second heat sink 260, thus ensuring the blocking effect on the cooling medium.

[0088] As an optional implementation, the third heat sink 270 can be integrated with the first heat sink 250b, that is, the dimensions of two of the first heat sinks 250b along the second direction are larger than the dimensions of the other first heat sinks 250b along the second direction, so that the two first heat sinks 250b can extend to face the second heat sink 260, thereby achieving a barrier effect on the cooling medium.

[0089] To further ensure that the cooling medium can flow along the path from the first heat sink 250b to the second heat sink 260, the end of the third heat sink 270 that is away from the first heat sink 250b in the second direction can protrude from the end of the second heat sink 260 that is away from the first heat sink 250b in the second direction, thereby enhancing the blocking effect of the third heat sink 270 on the cooling medium.

[0090] Further reference Figure 13 The side of the connecting hole 2211 away from the first heat sink 250b in the second direction can be flush with the side of the third heat sink 270 away from the first heat sink 250b in the second direction to ensure the area of ​​the connecting hole 2211. Alternatively, the side of the third heat sink 270 away from the first heat sink 250b in the second direction can also protrude from the side of the connecting hole 2211 away from the first heat sink 250b in the second direction to achieve a better blocking effect.

[0091] In this embodiment, the ratio of the height of the second heat sink 260 to the height of the first heat sink 250b can be 1 / 2 to 2 / 3. It is understood that the smaller the height of the second heat sink 260, the larger the distance between the second heat sink 260 and the first heat sink 222, which can improve the flow performance of the cooling medium. However, at the same time, the contact area between the second heat sink 260 and the cooling medium decreases, which is not conducive to improving the heat dissipation performance of the liquid cooling plate 200. Therefore, controlling the ratio of the height of the second heat sink 260 to the height of the first heat sink 250b to 1 / 2 to 2 / 3 can both ensure the flow performance of the cooling medium and effectively improve the heat dissipation performance of the liquid cooling plate 200.

[0092] The ratio of the area occupied by the orthographic projection of the multiple second heat sinks 260 on the projection plane to the area of ​​the orthographic projection of the connecting hole 2211 on the projection plane can be 1.5 to 3. Understandably, when the area occupied by the multiple second heat sinks 260 is too large, the area occupied by the connecting hole 2211 will be too small, which is detrimental to improving the flow performance of the cooling medium from the first liquid cooling cavity S1 to the second liquid cooling cavity S2. Conversely, when the area occupied by the multiple second heat sinks 260 is too small, it will affect the accumulation of the cooling medium in the second liquid cooling cavity S2, adversely affecting the flow of the cooling medium in the second liquid cooling cavity S2. Therefore, controlling the ratio of the area occupied by the orthographic projection of the multiple second heat sinks 260 on the projection plane to the area of ​​the orthographic projection of the liquid outlet 202 on the projection plane to 1.5 to 3 not only allows the cooling medium in the first liquid cooling cavity S1 to flow quickly into the second liquid cooling cavity S2, but also avoids the accumulation of the cooling medium in the second liquid cooling cavity S2, thereby better improving the heat dissipation performance of the liquid cooling plate 200.

[0093] It is worth mentioning that, in this embodiment, when the liquid cooling plate 200 is provided with the inlet connector 230 and the outlet connector 240, the arrangement can be made according to the different structures of the main body 220 of the cooling plate, so that the inlet connector 230 and the outlet connector 240 are provided on the same side or both sides of the main body 220 of the cooling plate, which can adapt to more application scenarios and has wider applicability.

[0094] Looking back Figure 9 or Figure 13 In this embodiment, when a connecting hole 2211 is provided on the partition 221, the connecting hole 2211 as a whole may include multiple rows of connecting holes 2211 arranged along the first direction, and each row has multiple connecting holes 2211 arranged along the second direction, so as to control the aperture and number of the connecting holes 2211, so as to improve the flow performance of the cooling medium.

[0095] In the first direction, the edge of the connecting hole 2211 may be flush with the outermost first heat sink 250b, or the edge of the connecting hole 2211 may be recessed relative to the outermost first heat sink 250b. In this way, when the cooling medium flows into the second liquid cooling cavity S2 from the connecting hole 2211, it can quickly flow to the flow channel between the two adjacent first heat sinks 250b.

[0096] In some embodiments, when designing the parameters of the connecting holes 2211, the ratio of the total area of ​​each connecting hole 2211 to the area of ​​the liquid inlet 201 can be 2.5 to 4, and the ratio of the total area of ​​each connecting hole 2211 to the area of ​​the liquid outlet 202 can also be 2.5 to 4. It is understandable that, since the area of ​​the partition 221 is fixed, the larger the total area of ​​the connecting holes 2211, the smaller the dimensions of the first heat sink 250a and the first heat sink 250b in the second direction will be, resulting in a reduced contact area between the cooling medium and the heat sink, and less heat exchange between the heat sink and the cooling medium. Conversely, a smaller total area of ​​the connecting holes 2211 is detrimental to the flow of the cooling medium between the first liquid cooling cavity S1 and the second liquid cooling cavity S2. Therefore, by designing the area of ​​the connecting holes 2211, the heat dissipation performance of the liquid cooling plate 200 can be effectively improved.

[0097] It should be noted that when at least two partitions 221 are provided, the total area of ​​each connecting hole 2211 refers to the total area of ​​the connecting holes on each partition 221.

[0098] In some embodiments, reference Figure 14 and Figure 15 When multiple liquid cooling plates 200 inside the server 100 are connected to the heat exchanger 300 via inlet pipes 500 and outlet pipes 600, the inlet pipe 500 may include at least one main inlet pipe 510 and at least two parallel inlet branch pipes 520 connected to each main inlet pipe 510. The total number of inlet branch pipes 520 is the same as the number of liquid cooling plates 200, and each inlet branch pipe 520 may be connected to the inlet connector 230 of one liquid cooling plate 200. Similarly, the outlet pipe 600 may include at least one main outlet pipe 610 and at least two parallel outlet branch pipes 620 connected to each main outlet pipe 610. The total number of outlet branch pipes 620 is the same as the number of liquid cooling plates 200, and each outlet branch pipe 620 may be connected to the outlet connector 240 of one liquid cooling plate 200.

[0099] Each inlet manifold 510 is connected to the heat exchanger 300 via a quick-connect connector 700, and each outlet manifold 610 is connected to the heat exchanger 300 via a quick-connect connector 700.

[0100] Understandably, in this embodiment, the multiple liquid cooling plates 200 are divided into several groups, each group including at least two liquid cooling plates 200, and each group of liquid cooling plates 200 is connected to an inlet manifold 510 and an outlet manifold 610. This series-parallel arrangement effectively reduces the number of quick-connect connectors 700 compared to a scheme where each liquid cooling plate 200 is individually connected to the heat exchanger 300, thereby reducing the potential risk of leakage.

[0101] like Figure 14 As shown, specifically when connecting the liquid inlet main pipe 510 and liquid inlet branch pipes 520 to the liquid cooling plate 200, at least a portion of the at least two liquid inlet branch pipes 520 connected to the same liquid inlet main pipe 510 can be connected to the liquid inlet main pipe 510 via a tee connector 800. Similarly, when connecting the liquid outlet main pipe 610 and liquid outlet branch pipes 620 to the liquid cooling plate 200, at least a portion of the at least two liquid outlet branch pipes 620 connected to the same liquid outlet main pipe 610 can be connected to the liquid outlet main pipe 610 via a tee connector 800.

[0102] by Figure 15 and Figure 16 For example, server 100 is equipped with twelve liquid cooling plates 200, arranged in a 3*4 pattern within housing 110. That is, the twelve liquid cooling plates 200 are divided into four rows, with each row containing three liquid cooling plates 200. There are four main liquid inlet pipes 510, each connected to three branch pipes 520, corresponding to one row of liquid cooling plates 200. Two of the branch pipes 520 can be connected to the main liquid inlet pipe 510 via a T-junction 800. Similarly, there are four outlet branch pipes 620, each connected to a main outlet pipe 610, corresponding to one row of liquid cooling plates 200. Two of the outlet branch pipes 620 can be connected to the main outlet pipe 610 via a T-junction 800.

[0103] Thus, by using the connection method of the three-way interface 800 to realize the parallel connection of each liquid inlet branch pipe 520, it can be ensured that the temperature of the cooling medium entering each liquid cooling plate 200 is the same, thereby ensuring that each liquid cooling plate 200 has a sufficiently high heat dissipation efficiency.

[0104] Another alternative implementation scheme, see reference Figure 17 and Figure 18The server 100 is equipped with twelve liquid cooling plates 200, which are arranged in a 3*4 pattern within the housing 110. That is, the twelve liquid cooling plates 200 are divided into four rows, with each row containing three liquid cooling plates 200. There are two main liquid inlet pipes 510, each connected to six branch inlet pipes 520. Similarly, there are two main liquid outlet pipes 610, each connected to six branch outlet pipes 620.

[0105] In this embodiment, the inlet manifold 510 and the outlet manifold 610 are flexible hoses, forming a U-shape to facilitate simultaneous connection of both manifolds 510 and 610 to the two rows of liquid cooling plates 200. Furthermore, along the flow direction of the cooling medium in the inlet manifold 510, except for the inlet branch pipe 520 furthest from the quick-connect connector 700, all other inlet branch pipes 520 are connected to the inlet manifold 510 via a tee connector 800. Similarly, along the flow direction of the cooling medium in the outlet manifold 610, except for the outlet branch pipe 620 furthest from the quick-connect connector 700, all other outlet branch pipes 620 are connected to the outlet manifold 610 via a tee connector 800.

[0106] The liquid cooling plate and liquid cooling system in this embodiment divide the internal space of the cooling plate body into at least two layers, each layer of which is equipped with heat sinks. This increases the number of heat sinks, thereby increasing the heat exchange area between the heat sinks and the cooling medium, while maintaining the spacing between adjacent heat sinks. Thus, while improving the heat dissipation performance of the liquid cooling plate, it also reduces the flow resistance and pressure drop of the cooling medium and prevents blockage inside the liquid cooling plate. Furthermore, connecting the liquid cooling plates to the heat exchanger via series and parallel connections not only allows for quick and efficient installation but also reduces the number of quick-connect connectors, improving the operational stability of the liquid cooling system.

[0107] Obviously, those skilled in the art can make various modifications and variations to the embodiments of this utility model without departing from the spirit and scope of this utility model. Therefore, if these modifications and variations of this utility model fall within the scope of the claims of this utility model and their equivalents, this utility model also intends to include these modifications and variations.

Claims

1. A liquid-cooled plate, characterized in that, Includes the cold plate body, inlet connector, and outlet connector; The interior of the cold plate body has a cavity, and the cavity is provided with at least one partition. The at least one partition is used to divide the cavity into at least two liquid cooling cavities arranged along the thickness direction of the cold plate body. Each liquid cooling cavity is provided with a plurality of parallel first heat dissipation fins. The partition is provided with a plurality of connecting holes to connect two adjacent liquid cooling cavities. Along the thickness direction of the cold plate body, one side of the cold plate body is used for thermally conductive connection with the heating element, and the other side of the cold plate body is used for setting the liquid inlet connector and the liquid outlet connector; The main body of the cold plate is provided with a liquid inlet and a liquid outlet. The liquid inlet and the liquid outlet are respectively connected to two liquid cooling cavities located at both ends. The liquid inlet connector is connected to the liquid inlet, and the liquid outlet connector is connected to the liquid outlet. Let the projection plane be a plane parallel to the partition. The orthographic projections of the liquid inlet and the connecting hole connected to the same liquid cooling cavity on the projection plane do not overlap. The orthographic projections of the liquid outlet and the connecting hole connected to the same liquid cooling cavity on the projection plane do not overlap. Furthermore, the orthographic projections of the connecting holes on two adjacent partitions on the projection plane do not overlap.

2. The liquid cooling plate according to claim 1, characterized in that, The liquid inlet is connected to the liquid cooling cavity near the heating element, and the liquid outlet is connected to the liquid cooling cavity near the liquid outlet connector; The liquid inlet is located on the partition near the heating element, and a portion of the liquid inlet connector extends into the cavity and is connected to the liquid inlet.

3. The liquid cooling plate according to claim 2, characterized in that, The plurality of first heat sinks are arranged along a first direction, the first heat sinks extend along a second direction, and a flow channel extending along the second direction is formed between two adjacent first heat sinks; The connecting hole and the liquid inlet on the partition plate having the liquid inlet are located on both sides of the first heat sink along the second direction.

4. The liquid cooling plate according to claim 3, characterized in that, The connecting hole on the partition near the liquid outlet connector and the liquid outlet are located on both sides of the first heat sink along the second direction.

5. The liquid cooling plate according to claim 3, characterized in that, The communicating hole on the partition near the liquid outlet connector is located on the same side of the first heat sink along the second direction as the liquid outlet. The liquid cooling cavity near the liquid outlet connector is also provided with a plurality of second heat sinks. The plurality of second heat sinks are disposed on one side of the plurality of first heat sinks along the second direction. The plurality of second heat sinks are arranged along the first direction and extend along the second direction. The orthographic projection of the liquid outlet on the projection plane is located within the orthographic projection area of ​​the plurality of second heat sinks on the projection plane. The dimensions of the plurality of first heat sinks in the first direction are greater than the dimensions of the plurality of second heat sinks in the first direction, the height of the second heat sinks is less than the height of the first heat sinks, and the connecting holes are disposed on both sides of the plurality of second heat sinks along the first direction.

6. The liquid cooling plate according to claim 5, characterized in that, Two third heat sinks are also provided in the liquid cooling cavity near the liquid outlet connector. The two third heat sinks are respectively located on both sides of the plurality of second heat sinks along the first direction. The height of the second heat sinks is less than the height of the third heat sinks. The size of the plurality of first heat sinks in the first direction is greater than the distance between the two third heat sinks. The connecting hole is provided on the side of the third heat sink away from the second heat sink along the first direction.

7. The liquid-cooled plate according to claim 5, characterized in that, The ratio of the height of the second heat sink to the height of the first heat sink is 1 / 2 to 2 / 3.

8. The liquid cooling plate according to claim 5, characterized in that, The ratio of the area occupied by the orthographic projection of the plurality of second heat sinks on the projection plane to the area of ​​the orthographic projection of the connecting hole on the partition near the liquid outlet connector on the projection plane is 1.5 to 3.

9. The liquid cooling plate according to claim 3, characterized in that, The two sets of connecting holes on the two adjacent partitions are located on opposite sides of the first heat sink along the second direction.

10. The liquid cooling plate according to claim 1, characterized in that, The ratio of the total area of ​​the connecting holes on each of the partitions to the area of ​​the liquid inlet is 2.5 to 4, and the ratio of the total area of ​​the connecting holes on each of the partitions to the area of ​​the liquid outlet is 2.5 to 4.

11. A liquid cooling heat dissipation system, characterized in that, Includes servers, heat exchangers, circulating pumps, and liquid cooling plates as described in any one of claims 1 to 10; The server includes a housing and a heating element disposed inside the housing, the liquid cooling plate being disposed inside the housing, and the heating element being thermally connected to the liquid cooling plate; The liquid inlet connector is connected to the heat exchanger through a liquid inlet pipe passing through the housing, and the liquid outlet connector is connected to the heat exchanger through a liquid outlet pipe passing through the housing. The circulating pump is connected to the inlet pipe or the outlet pipe.

12. The liquid cooling heat dissipation system according to claim 11, characterized in that, The server is equipped with multiple heat-generating elements, and the liquid cooling plate is arranged in a one-to-one correspondence with each heat-generating element. The liquid inlet pipeline includes at least one main liquid inlet pipe and at least two parallel liquid inlet branch pipes connected to each main liquid inlet pipe. The total number of liquid inlet branch pipes is the same as the number of liquid cooling plates, and each liquid inlet branch pipe is connected to one liquid cooling plate. The liquid outlet pipeline includes at least one main liquid outlet pipe and at least two parallel liquid outlet pipelines connected to each of the main liquid outlet pipes. The number of liquid outlet branch pipes is the same as the number of liquid cooling plates, and each liquid outlet branch pipe is connected to one liquid cooling plate.

13. The liquid cooling heat dissipation system according to claim 12, characterized in that, In at least two of the inlet branch pipes connected to the same inlet main pipe, at least a portion of the inlet branch pipes are connected to the inlet main pipe via a tee connector; In at least two outlet branch pipes connected to the same outlet main pipe, at least a portion of the inlet branch pipes are connected to the outlet main pipe via a tee connector.

14. The liquid cooling heat dissipation system according to claim 12, characterized in that, The inlet manifold is connected to the heat exchanger via a quick-connect connector, and the outlet manifold is also connected to the heat exchanger via a quick-connect connector.

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