A pressure-sensitive touch device and electronic equipment

Abstract

The application relates to the technical field of terminal equipment, and provides a pressure-sensitive touch device and electronic equipment. The pressure-sensitive touch device comprises a touch assembly, the touch assembly comprising a substrate and a package; a touch chip and a plurality of capacitive sensors, the touch chip and the plurality of capacitive sensors being arranged on a first surface of the substrate; the package covering the touch chip and the plurality of capacitive sensors; a support assembly; the support assembly being arranged on a second surface of the substrate; and a pressure sensor, the pressure sensor being arranged on a side of the support assembly opposite to the substrate. The pressure-sensitive touch device can effectively increase the signal amount of the capacitance value, improve the anti-interference ability of the capacitive signal, and ensure the touch precision by packaging the plurality of capacitive sensors in the substrate. The touch assembly and the pressure sensor are arranged on opposite sides of the support assembly, the structure is simple, the pressure transmission process is simple, the transmission path is short, the pressure recognition time can be shortened, and the pressing precision of the pressing operation can be ensured.

Description

Technical Field

[0001] This application relates to the field of terminal equipment technology, and in particular to a pressure-sensitive touch device and an electronic device. Background Technology

[0002] Pressure-sensitive touch solutions, as a special input method, have replaced traditional buttons due to their ease of operation and are widely used. Pressure-sensitive touch solutions include two operating modes: touch operation, where the user touches the touch surface, causing a change in the capacitance value of the capacitive sensor, thus recognizing the user's touch-swipe operation; and press operation, where the user presses the touch surface, causing the pressure sensor to deform and resulting in a change in the electrical signal, thus recognizing the pressure value of the press operation.

[0003] Currently, in pressure-sensitive touch devices, the distance between the capacitive sensor and the touch surface is relatively large, resulting in a small signal value for the capacitance, which affects the recognition accuracy of touch operations. Furthermore, to meet the installation requirements of both capacitive and pressure sensors, pressure-sensitive touch devices involve numerous connections, resulting in a complex structure and difficult manufacturing.

[0004] Therefore, there is an urgent need for a touch device that can effectively guarantee recognition accuracy, has a simple structure, and is easy to manufacture. Utility Model Content

[0005] This application provides a pressure-sensitive touch device and an electronic device, which simplifies the structure and reduces production costs while effectively ensuring touch accuracy and pressing accuracy.

[0006] In a first aspect, this application provides a pressure-sensitive touch device, comprising: a touch component, the touch component including a substrate and a package; a touch chip and a plurality of capacitive sensors, the touch chip and the plurality of capacitive sensors being disposed on a first surface of the substrate; the package covering the touch chip and the plurality of capacitive sensors; a support assembly; disposed on a second surface of the substrate, the first surface and the second surface being two opposite surfaces of the substrate; and a pressure sensor disposed on the side of the support assembly opposite to the substrate.

[0007] The pressure-sensitive touch device provided in this application encapsulates multiple capacitive sensors within the touch component. These capacitive sensors can be configured with relatively large areas, which not only shortens the distance between the capacitive sensors and the surface of the touch component but also increases the total area of ​​the multiple capacitive sensors. This improves the capacitance signal of the capacitive sensors, ensuring the touch accuracy of the pressure sensor. Assembling the touch component and pressure sensor using a bracket assembly effectively simplifies the structure of the pressure sensor, simplifying the structure and reducing production costs while effectively ensuring touch and pressure accuracy.

[0008] In some implementations, multiple capacitive sensors are arranged sequentially along the length of the substrate. This increases the area of ​​the multiple capacitive sensors and improves the signal strength of the capacitance value.

[0009] In some implementations, the support assembly includes a support, which includes a pressing cavity and a limiting portion. The limiting portion is located within the pressing cavity and protrudes from the third surface of the support towards the substrate. The distance between the limiting portion and the fourth surface of the support is less than the height of the pressing cavity, and the third and fourth surfaces are two opposing inner surfaces of the support. Thus, by providing the pressing cavity, the structure of the support can be simplified, which helps to reduce the weight of the support. By providing the limiting portion, the downward pressing distance of the touch component can be limited, ensuring the structural stability of the pressure-sensitive touch device.

[0010] In some implementations, the support includes a mouth-shaped support; the pressing chamber is connected to the external environment. In this way, during the process of the support being deformed under pressure, the pressing chamber inside the support will not experience pressure changes due to pressure, effectively ensuring pressure transmission and also achieving heat dissipation.

[0011] In some implementations, the limiting part includes a boss located in the central region of the pressing cavity. This results in a simple boss structure that is easy to manufacture.

[0012] In some implementations, the pressure sensor and the limiting part are misaligned. This ensures the accuracy of the pressure value detected by the pressure sensor.

[0013] In some implementations, the support assembly also includes a flexible circuit board; the flexible circuit board includes a bending area, the support is located in the bending area, and the flexible circuit board is welded to both the support and the pressure sensor. In this way, both the upper and lower surfaces of the support are covered by the flexible circuit board.

[0014] In some implementations, the pressure sensor includes a resistive bridge. This ensures connection strength, and the welded connection eliminates the need for connectors and saves space.

[0015] In some implementations, the pressure-sensitive touch device also includes an adhesive layer disposed at the soldering point between the flexible circuit board and the touch component. This further ensures the connection strength between the flexible circuit board and the touch component and improves pull-out force.

[0016] In some implementations, the pressure-sensitive touch device further includes: a base, which is disposed on the side of the support assembly away from the touch assembly, and is positioned opposite to the limiting part; and multiple pressure sensors, which are located on opposite sides of the base. This ensures that the multiple pressure sensors are subjected to uniform force.

[0017] In some implementations, the touch component also includes a protective layer disposed on the side of the package facing away from the substrate. This protects the package and also improves the aesthetics of the touch component.

[0018] Secondly, this application provides an electronic device, including a mid-frame and the pressure-sensitive touch device provided in the first aspect. This allows different functions of the electronic device to be realized through the pressure-sensitive touch device.

[0019] In some implementations, the electronic device further includes a limiting member that passes through the pressing cavity of the pressure-sensitive touch device and avoids the limiting portion of the bracket assembly. The limiting member is located in the mid-frame and is configured to restrict relative displacement between the pressure-sensitive touch device and the mid-frame. Thus, by setting the limiting member, the pressure-sensitive touch device is limited, ensuring its stability. Attached Figure Description

[0020] To more clearly illustrate the technical solution of this application, the drawings used in the embodiments will be briefly introduced below. Obviously, for those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0021] Figure 1 This is a structural diagram of a pressure-sensitive touch button;

[0022] Figure 2 This is a schematic diagram of another type of pressure-sensitive touch button;

[0023] Figure 3 This is a three-dimensional schematic diagram of a pressure-sensitive touch device provided in an embodiment of this application;

[0024] Figure 4 yes Figure 3 Sectional view at AA;

[0025] Figure 5 This is an exploded view of a pressure-sensitive touch device provided in an embodiment of this application;

[0026] Figure 6A This is a schematic diagram of the arrangement of a capacitive sensor provided in an embodiment of this application;

[0027] Figure 6B This is a schematic diagram of another arrangement of capacitive sensors provided in an embodiment of this application;

[0028] Figure 6C This is a schematic diagram of the arrangement of another capacitive sensor provided in the embodiments of this application;

[0029] Figure 6D This is a schematic diagram of another arrangement of capacitive sensors provided in an embodiment of this application;

[0030] Figure 7 This is an application diagram of a pressure-sensitive touch device provided in an embodiment of this application;

[0031] Figure 8A This is a schematic diagram of the structure of a limiting part provided in an embodiment of this application;

[0032] Figure 8B This is a schematic diagram of another limiting part provided in an embodiment of this application;

[0033] Figure 8C This is a schematic diagram of another limiting part provided in the embodiments of this application;

[0034] Figure 9 This is a schematic diagram of a support and flexible circuit board provided in an embodiment of this application;

[0035] Figure 10 This is a schematic diagram of another pressure-sensitive touch device provided in the embodiments of this application;

[0036] Figure 11 This is a schematic diagram of the structure of another pressure-sensitive touch device provided in the embodiments of this application;

[0037] Figure 12 This is a schematic diagram of the structure of another pressure-sensitive touch device provided in the embodiments of this application;

[0038] Figure 13A This is a schematic diagram of the structure of an electronic device provided in an embodiment of this application;

[0039] Figure 13B This is a schematic diagram of the structure of another electronic device provided in an embodiment of this application.

[0040] Illustration markings:

[0041] 1-Cover plate; 2-Metal base plate; 3-Capacitor; 4-Touch chip; 5-Keycap support structure; 5a-Support part; 6-Spring; 7-Pressure-sensitive steel sheet; 8-Pressure-sensitive ink; 9-Screw;

[0042] 01-Keycap; 02-Circuit board; 03-Steel sheet; 04-Capacitor structure; 05-Pressure sensor; 06-Supporting component;

[0043] 100-Pressure-sensitive touch device;

[0044] 10-Touch component; 101-Substrate; 1011-First surface; 1012-Second surface; 102-Package; 103-Protective layer; 103a-Thinning portion;

[0045] 20 - Touch chip; 30 - Capacitive sensor;

[0046] 40-Bracket assembly; 401-First mounting surface; 402-Second mounting surface; 403-Bracket; 4031-Pressing cavity; 4032-Limiting part; 4033-Top plate; 4034-Bottom plate; 4035-First side plate; 4036-Second side plate; 4037-Protrusion; 403a-Koilout; 404-Third surface; 405-Fourth surface; 406-Flexible circuit board; 4061-Bending area; 4062-Through hole;

[0047] 50-Pressure sensor;

[0048] 60 - Adhesive layer;

[0049] 70 - Base;

[0050] 200 - Electronic device; 201 - Mid-frame; 202 - Display screen; 203 - Limiting component. Detailed Implementation

[0051] The technical solutions of the embodiments of this application will be clearly described below with reference to the accompanying drawings. Obviously, the described embodiments are only some, not all, of the embodiments of this application. Other embodiments obtained by those skilled in the art based on the embodiments of this application without creative effort are all within the protection scope of this application.

[0052] In the following description, the terms "first," "second," etc., are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Therefore, a feature defined with "first," "second," etc., may explicitly or implicitly include one or more of that feature. In the description of this application, unless otherwise stated, "a plurality of" means two or more.

[0053] Furthermore, in this application, directional terms such as "upper," "lower," "inner," and "outer" are defined relative to the indicated placement of the components in the accompanying drawings. It should be understood that these directional terms are relative concepts, used for relative description and clarification, and can change accordingly depending on the placement of the components in the accompanying drawings.

[0054] Pressure-sensitive touch is a special type of touch input that can detect not only the "touch" action (a finger or object touching a surface) but also the amount of pressure applied by the user. This allows for richer and more precise interactive functions.

[0055] Figure 1 This is a schematic diagram of the structure of a pressure-sensitive touch button.

[0056] See Figure 1As shown, the pressure-sensitive touch button may include a cover plate 1, a metal base plate 2, multiple capacitors 3, a touch chip 4, a keycap support structure 5, a spring 6, a pressure-sensitive steel sheet 7, pressure-sensitive ink 8, and a screw 9.

[0057] Multiple capacitors 3 are mounted on a metal base plate 2, and a cover plate 1 is placed over the capacitors 3. At intervals from the capacitors 3, a touch-sensitive chip 4 is located inside the metal base plate 2 for signal transmission with the capacitors 3. Corresponding to the touch-sensitive chip 4, a keycap support structure 5 is connected to the bottom of the metal base plate 2. The keycap support structure 5 is connected to the metal base plate 2 via three support parts 5a. The central area of ​​the keycap support structure 5 is connected to a pressure-sensitive steel sheet 7 via a spring 6. Both ends of the keycap support structure 5 and the pressure-sensitive steel sheet 7 can be fixed to the mid-frame of the electronic device using screws 9. The side of the pressure-sensitive steel sheet 7 facing away from the spring 6 is printed with pressure-sensitive ink 8.

[0058] The pressure-sensitive touch buttons perform two operations: touch and press. During a touch operation, when a user's finger touches the surface of the cover plate 1, the capacitance value of one or more capacitors 3 at the corresponding location changes, and the touch chip 4 uses this change to determine the user's touch operation. During a press operation, when a user's finger presses the surface of the cover plate 1, the cover plate 1 and the metal base plate 2 together move the keycap support structure 5 towards the pressure-sensitive steel sheet 7, causing deformation of the pressure-sensitive steel sheet 7 and the pressure-sensitive ink 8. The pressure-sensitive ink 8 converts the pressure into an electrical signal, and the touch chip 4 uses this electrical signal to determine the pressure intensity, thereby recognizing the user's press operation.

[0059] However, the pressure-sensitive touch button has many connections between its components, making its structure too complex and costly.

[0060] Figure 2 This is a schematic diagram of another type of pressure-sensitive touch button.

[0061] See Figure 2 As shown, the pressure-sensitive touch button may include a keycap 01, a circuit board 02, a steel sheet 03, a capacitor structure 04, a pressure sensor 05, and a support 06.

[0062] Circuit board 02 is welded to steel sheet 03. Multiple capacitor structures 04 are welded onto circuit board 02. Keycap 01 covers steel sheet 03 and also covers the multiple capacitor structures 04. Pressure sensor 05 is located at the bottom of steel sheet 03. Support members 06 are used to mount the steel sheet 03 on both sides of the electronic device.

[0063] In this pressure-sensitive touch button, multiple capacitor structures 04 are located at the bottom of the keycap 01, which are far from the touch surface of the keycap 01. The signal of the capacitance value is small, resulting in low touch recognition accuracy and poor touch effect of the pressure-sensitive touch button.

[0064] Based on the above Figure 1 and Figure 2 The pressure-sensitive touch buttons shown cannot achieve a balance between accurate recognition and simple structure. To address this technical problem, this application provides a pressure-sensitive touch device.

[0065] It should be emphasized that the pressure-sensitive touch device provided in this application embodiment can be used as a pressure-sensitive touch button, and can also be applied to other electronic devices with pressure sensitivity and touch requirements. The electronic devices described in this application embodiment include, but are not limited to, mobile phones, laptops, tablets, personal digital assistants, or wearable devices.

[0066] Figure 3 This is a three-dimensional schematic diagram of a pressure-sensitive touch device provided in an embodiment of this application; Figure 4 yes Figure 3 Sectional view at AA; Figure 5 This is an exploded schematic diagram of a pressure-sensitive touch device provided in an embodiment of this application.

[0067] See Figure 3 , Figure 4 and Figure 5 As shown, the pressure-sensitive touch device 100 may include a touch component 10, a touch chip 20, multiple capacitive sensors 30, a support assembly 40, and a pressure sensor 50.

[0068] The touch component 10 may include a substrate 101 and a package 102. The touch component 10 can provide an operating surface for pressing operations.

[0069] A capacitive sensor 30 is disposed on the first surface 1011 of the substrate 101. During the touch operation of the pressure-sensitive touch device 100, the capacitance value of the capacitive sensor 30 changes.

[0070] The touch chip 20 is also disposed on the first surface 1011 of the substrate 101, and the position of the touch chip 20 avoids the position of the capacitive sensor 30. In other words, the touch chip 20 and the capacitive sensor 30 are independently disposed.

[0071] In some feasible implementations, the capacitive sensor 30 and the touch chip 20 are soldered onto the substrate 101, thereby ensuring mechanical stability and stress buffering between the capacitive sensor 30 and the touch chip 20 and the substrate 101.

[0072] The package 102 covers the touch chip 20 and multiple capacitive sensors 30. This achieves sealing of the touch chip 20 and the multiple capacitive sensors 30. The package 102 can be used to encapsulate the touch chip 20 and the multiple capacitive sensors 30 using a Land Grid Array (LGA) package. By placing the package 102 on the capacitive sensors 30 and the touch chip 20, the package 102 possesses a certain structural strength and plasticity, ensuring uniform surface dielectric of the capacitive sensors 30. Furthermore, since the capacitive sensors 30 are located inside the touch assembly 10, the distance between the capacitive sensors 30 and the touch surface of the touch assembly 10 can be reduced, which helps increase the signal strength of the capacitance value, resulting in a better signal-to-noise ratio and consistency of the capacitance value, thus improving touch accuracy.

[0073] In some feasible implementations, the substrate 101 can be made of a material with micro-conductivity, such as a ceramic substrate, a metal substrate, or a resin substrate. The specific conductivity can be adapted to different types of substrate 101 materials.

[0074] In some feasible implementations, the package 102 can be made of epoxy molding compound (EMC). EMC can block moisture, contaminants and dust, prevent the touch chip 20 and capacitive sensor 30 from being corroded, and can also resist physical shock and vibration, improve dielectric strength, and ensure circuit signal integrity.

[0075] The support assembly 40 is disposed on the second surface 1012 of the substrate 101, and the first surface 1011 and the second surface 1012 are two opposing surfaces of the substrate 101.

[0076] The second surface 1012 of the substrate 101 may be disposed on the first mounting surface 401 of the support assembly 40.

[0077] In some feasible implementations, when soldering the capacitive sensor 30, the second surface 101 of the substrate 101 can be first connected to the first mounting surface 401 of the support assembly 40. This allows the support assembly 40 to provide support for the soldering operation of the capacitive sensor 30. After the soldering of the capacitive sensor 30 and the touch chip 20 is completed, the capacitive sensor 30 and the touch chip 20 are packaged. This completes the fabrication and installation of the touch component 10.

[0078] The pressure sensor 50 is disposed on one side of the bracket assembly 40 opposite to the substrate 101. Specifically, the pressure sensor 50 is mounted on the second mounting surface 402 of the bracket assembly 40, where the first mounting surface 401 and the second mounting surface 402 are two opposing outer surfaces of the bracket assembly 40. It can be understood that the first mounting surface 401 can be the upper surface of the bracket assembly 40, and the second mounting surface 402 can be the lower surface of the bracket assembly 40. This simplifies the connection between the bracket assembly 40, the pressure sensor 50, and the touch component 10.

[0079] When a press operation is performed on the pressure-sensitive touch device 100, the touch component 10 can transmit pressure to the support component 40, the support component 40 deforms, thereby causing the pressure sensor 50 to deform, and the pressure value of the press operation is determined by the deformation of the pressure sensor 50, making the pressure transmission process simple.

[0080] It should be emphasized that the touch component 10 in this embodiment is mounted on the support assembly 40. This allows the touch component 10 to be relatively large while ensuring the stability of the support assembly 40 in supporting the touch component 10. It should be understood that the capacitive sensor 30 is located inside the touch component 10, and the overall size of the capacitive sensor 30 is related to the size of the touch component 10. When the size of the touch component 10 can be set relatively large, the size of the capacitive sensor 30 can also be increased accordingly, further increasing the signal strength of the capacitance value and ensuring touch accuracy.

[0081] The pressure-sensitive touch device 100 provided in this application can identify the user's operation type through multiple capacitive sensors 30 during touch operation. Furthermore, the signal strength of the capacitance value can be increased by increasing the total area of ​​the multiple capacitive sensors 30, thereby ensuring the touch accuracy of the pressure-sensitive touch device 100. During pressing operation, pressure can be transmitted from the touch component 10 to the pressure sensor 50 through the support assembly 40, and the pressure value is determined based on the deformation value of the pressure sensor 50, thus identifying the user's pressing operation. The pressure-sensitive touch device 100 can have the touch component 10 and the pressure sensor 50 mounted on opposite surfaces of the support assembly 40, resulting in a simple structure, a simple pressure transmission process, and a short transmission path, which shortens the pressure recognition time and ensures the pressing accuracy of the pressing operation. Thus, the pressure-sensitive touch device 100 provided in this application embodiment achieves compatibility between structural simplicity and guaranteed recognition accuracy, ensuring touch and pressing accuracy while effectively simplifying the structure and reducing production costs.

[0082] In some feasible implementations, multiple capacitive sensors 30 are arranged sequentially along the length of the substrate 101. For example, the multiple capacitive sensors 30 can be arranged at equal intervals along the length of the substrate 101, or they can be arranged at unequal intervals along the length of the substrate 101. This increases the number of capacitive sensors 30, thereby increasing the arrangement area of ​​the multiple capacitive sensors 30 and improving the capacitance signal of the capacitive sensors 30.

[0083] Figure 6A This is a schematic diagram of the arrangement of a capacitive sensor provided in an embodiment of this application; Figure 6B This is a schematic diagram of another arrangement of capacitive sensors provided in an embodiment of this application; Figure 6C This is a schematic diagram of the arrangement of another capacitive sensor provided in the embodiments of this application; Figure 6D This is a schematic diagram of another arrangement of capacitive sensors provided in an embodiment of this application;

[0084] For some specific implementation methods, see Figures 6A to 6D As shown, the capacitive sensors 30 can be arranged in different arrays. On one side of the capacitive sensors 30, a touch chip 20 is also disposed on the substrate 101. The touch chip 20 is electrically connected to the multiple capacitive sensors 30, so that the capacitive sensors 30 can transmit the capacitance value to the touch chip 20.

[0085] See Figure 6A As shown, in this implementation, the capacitive sensor 30 is rectangular in shape, and multiple capacitive sensors 30 can be arranged in a row of three columns.

[0086] See Figure 6B As shown, in this implementation, the capacitive sensor 30 is square in shape, and multiple capacitive sensors 30 can be arranged in a two-row, four-column configuration.

[0087] See Figure 6C As shown, in this implementation, the capacitive sensor 30 is square in shape, and multiple capacitive sensors 30 can be arranged in a two-row, eight-column configuration.

[0088] See Figure 6D As shown, in this implementation, the capacitive sensor 30 is elliptical in shape, and multiple capacitive sensors 30 can be arranged in a two-row, nine-column configuration.

[0089] In the above implementation, the shape, number, and arrangement of the capacitive sensors 30 can be flexibly set and combined.

[0090] It is worth noting that, in the above arrangement, while meeting the routing requirements between the multiple capacitive sensors 30 and the touch chip 20, it is preferable to arrange the capacitive sensors 30 densely to increase the total area of ​​the multiple capacitive sensors 30. This increases the signal strength of the capacitance value by increasing the total area of ​​the capacitive sensors 30, thus ensuring touch accuracy.

[0091] For example, with the area of ​​a single capacitive sensor 30 remaining constant, the more capacitive sensors 30 there are, the larger the total area of ​​the multiple capacitive sensors 30, and the relatively larger the signal of the capacitance value; the fewer capacitive sensors 30 there are, the smaller the total area of ​​the multiple capacitive sensors 30, and the relatively smaller the signal of the capacitance value.

[0092] For example, with the number of capacitive sensors 30 remaining constant, the larger the area of ​​a single capacitive sensor 30, the larger the area of ​​multiple capacitive sensors 30, and the relatively larger the signal of the capacitance value; the smaller the area of ​​a single capacitive sensor 30, the smaller the area of ​​multiple capacitive sensors 30, and the relatively smaller the signal of the capacitance value.

[0093] It should be emphasized that, in the above implementation, the shape of the capacitive sensor 30 may also include other shapes such as circles, triangles, and pentagons. The embodiments of this application do not specifically limit the shape, arrangement and number of the capacitive sensor 30.

[0094] It is worth noting that the touch chip 20 and the capacitive sensor 30 provided in this embodiment are integrated together inside the touch component 10. In this way, the external wiring of the touch chip 20 transmits digital signals, which can effectively improve the interference problem caused by the transmission of analog signals when the touch chip 20 is located in other locations (outside the touch component 10, such as on the motherboard), ensure the integrity and authenticity of signal transmission, and thus ensure the touch accuracy of the pressure-sensitive touch device 100.

[0095] The touch chip 20 can be located on the side of the substrate 101, which facilitates the distribution of multiple capacitive sensors 30 and is also beneficial for signal transmission.

[0096] To facilitate a better understanding of the pressure-sensitive touch device 100 provided in the embodiments of this application, the following uses the application of the pressure-sensitive touch device 100 in a mobile phone as an example to briefly introduce the touch operation of the pressure-sensitive touch device 100 provided in the embodiments of this application.

[0097] Figure 7 This is a schematic diagram illustrating the application of a pressure-sensitive touch device provided in an embodiment of this application.

[0098] See Figure 7As shown, the electronic device 200 may include a mid-frame 201 and a display screen 202. In this implementation, the pressure-sensitive touch device 100 may be disposed in the mid-frame 201 in the form of a pressure-sensitive touch button. To facilitate the explanation of the positions of the various components in the electronic device 200, this embodiment of the application establishes a three-dimensional coordinate system based on the electronic device 200, wherein the x-axis direction is the width direction of the electronic device 200, the y-axis direction is the length direction of the electronic device 200, and the z-axis direction is the thickness direction of the electronic device 200. The length direction of the pressure-sensitive touch device 100 may be the same as the length direction of the electronic device 200.

[0099] It should be emphasized that the electronic device 200 may include a single-screen electronic device, or it may include a foldable screen electronic device (other foldable screen parts are not shown). When the electronic device 200 includes a foldable screen electronic device, the electronic device 200 may include a double-folding electronic device or a triple-folding electronic device. The specific structure of the electronic device is not limited here.

[0100] In some feasible implementation methods, combined Figure 4 , Figures 6A to 6B As shown, when the user's touch operation is a swipe operation, the swipe direction can include swiping up and down (swiping along the y1 direction or along the y2 direction) and swiping forward and backward (swiping along the z1 direction or along the z2 direction).

[0101] For example, with Figure 6A As shown, when the user's touch operation includes an upward swipe, the user's finger slides along the y1 direction, and the capacitance value of the corresponding capacitive sensor 30 increases sequentially. The capacitive sensors 30 with sequentially increasing capacitance values ​​can be capacitive sensor 30-a1, capacitive sensor 30-a2, and capacitive sensor 30-a3, respectively. Alternatively, when the user's touch operation includes a downward swipe, the user's finger slides along the y2 direction, and the capacitance value of the corresponding capacitive sensor 30 increases sequentially. The capacitive sensors 30 with sequentially increasing capacitance values ​​can be capacitive sensor 30-a3, capacitive sensor 30-a2, and capacitive sensor 30-a1, respectively. In this way, the direction of the user's finger swipe can be determined by the pattern of capacitance value changes.

[0102] For example, with Figure 6BAs shown, when the user's touch operation includes a forward swipe, the user's finger slides along the z1 direction, and the capacitance value of the corresponding capacitive sensor 30 increases sequentially. The capacitive sensors 30 with sequentially increasing capacitance values ​​can be capacitive sensor 30-b1 and capacitive sensor 30-b2, respectively. Alternatively, when the user's touch operation includes a backward swipe, the user's finger slides along the z2 direction, and the capacitance value of the corresponding capacitive sensor 30 increases sequentially. The capacitive sensors 30 with sequentially increasing capacitance values ​​can be capacitive sensor 30-b2 and capacitive sensor 30-b1, respectively. In this way, the swipe direction of the user's finger can be determined by the pattern of capacitance value changes.

[0103] Different swipe directions of a user's finger can control the electronic device 200 to perform different operations. For example, swiping up or down can switch pages on the display screen 202. While browsing a webpage or watching a short video, a user can swipe up on the surface of the pressure-sensitive touch device 100 to switch to a new page or video. Swiping down controls switching to the previous page or video. Alternatively, swiping forward or backward can perform different operations on the current application. For example, to open all background applications, a user can swipe forward on the surface of the pressure-sensitive touch device 100 to switch the current application to background applications. To close the current application, a user can swipe backward on the surface of the pressure-sensitive touch device 100 to close the current application and return to the home screen.

[0104] The following example uses the pressure-sensitive touch device 100 in a mobile phone to briefly introduce the pressure-sensitive operation of the pressure-sensitive touch device 100 provided in the embodiments of this application.

[0105] For example, the pressure value applied to the touch component 10 may include a first pressure threshold y1 and a second pressure threshold y2, where the first pressure threshold y1 is less than the second pressure threshold y2. When the detected real-time pressure value is within the range of (0, y1), the user's pressure-sensitive operation is determined to be a first operation, which may include a normal pressing operation, understood as the user's finger gently pressing on the surface of the touch component 10. Correspondingly, under this operation, the user can control the phone screen to open a certain software (such as the camera). When the detected real-time pressure is within the range of [y1, y2), the user's operation is determined to be a second type, which may include a click operation, understood as the user's finger gently clicking on the surface of the touch component 10. Correspondingly, under this operation, the camera can be controlled to focus to capture the best shooting state. When the detected real-time pressure value is greater than y2, the user's operation is determined to be a third type, which may include a long press operation or a forceful pressing operation, understood as the user's finger forcefully clicking on the surface of the touch component 10. Correspondingly, under this operation, the user can control the camera to perform a shooting operation.

[0106] In a specific implementation, continue to combine Figure 4 and Figure 5 As shown, the support assembly 40 may include a support 403. The support 403 may include a pressing cavity 4031 and a limiting part 4032.

[0107] By setting the bracket 403 to have an internal cavity structure, the weight can be effectively reduced while ensuring the structural strength of the bracket 403 itself. Moreover, during the pressing process of the pressure-sensitive touch device 100, the pressing cavity 4031 can deform to provide a pressing feel for the pressing operation.

[0108] A limiting part 4032 is disposed within the pressing cavity 4031, and the limiting part 4032 protrudes from the third surface 404 of the bracket 403 toward the substrate 101. The distance between the limiting part 4032 and the fourth surface 405 of the bracket 403 is less than the height of the pressing cavity 4031, wherein the third surface 404 and the fourth surface 405 can be two opposing inner surfaces of the bracket 403.

[0109] Specifically, the third surface 404 can be understood as the upper surface in the inner surface of the bracket 403, and the fourth surface 405 can be understood as the lower surface in the inner surface of the bracket 403. Thus, the height of the pressing cavity 4031 is the distance between the third surface 404 and the fourth surface 405 of the bracket 403, which is H. The height of the limiting portion 4032 provided inside the pressing cavity 4031 is h. Thus, the distance that the pressing cavity 4031 can be pressed is the difference between the height of the pressing cavity 4031 and the height of the limiting portion 4032, that is, h1 = H - h. By providing the limiting portion 4032, the pressing distance of the pressure-sensitive touch control device 100 can be limited within a reasonable range, and it can effectively avoid the deformation of the pressure-sensitive touch control device 100 during long-term pressing. In this way, the stability of the bracket 403 can be ensured, and further the overall stability of the pressure-sensitive touch control device 100 can be ensured.

[0110] In a specific implementation manner, continue to combine Figure 4 and Figure 5 As shown, the bracket 403 can include a mouth-shaped bracket. The cross-sectional shape of the mouth-shaped bracket can be a "mouth" shape. The mouth-shaped bracket can include a top plate 4033 and a bottom plate 4034 arranged oppositely, and a first side plate 4035 and a second side plate 4036 connected between the top plate 4033 and the bottom plate 4034.

[0111] Hollow portions 403a can be formed on both sides of the mouth-shaped bracket. The pressing cavity 4031 can communicate with the external environment through the hollow portions 403a on both sides. In this way, during the pressing process of the pressure-sensitive touch control device 100, since the pressing cavity 4031 communicates with the external environment, no pressure change will occur inside the pressing cavity 4031 during the deformation of the mouth-shaped bracket. Further, the stability of the pressure during transmission can be ensured, and further the stability of the pressure value detected by the pressure sensor 50 can be ensured to ensure the pressing accuracy of the pressure-sensitive touch control device 100. Moreover, the hollow portions 403a can also prevent heat accumulation inside the bracket 403, which is beneficial to the heat dissipation operation of the pressure-sensitive touch control device 100.

[0112] In a specific implementation manner, continue to combine Figure 5 and Figure 4 As shown, the limiting portion 4032 can include a boss. The boss is located in the central area of the pressing cavity 4031. Specifically, the boss can be provided on the bottom plate 4034 and protrude towards the direction of the top plate 4033. Among them, the boss structure is simple, the process is simple, and it is convenient to manufacture.

[0113] During the pressing operation of the pressure-sensitive touch device 100, as the pressing force increases, the downward pressing distance of the touch component 10 toward the pressure sensor 50 also increases, causing deformation of the pressing cavity 4031. During the deformation of the pressing cavity 4031, the distance between the top plate 4033 of the mouth-shaped bracket and the surface of the boss gradually decreases until the top plate 4033 of the mouth-shaped bracket is in contact with the surface of the boss, at which point the downward pressing distance of the touch component 10 reaches its maximum value and can no longer move toward the pressure sensor 50. Thus, by setting the boss, the downward pressing distance of the touch component 10 is controllable, and the stability of the bracket 403 during long-term pressing is ensured, preventing deformation of the bracket 403 and effectively guaranteeing its service life, thereby ensuring the operability of the pressure-sensitive touch device 100.

[0114] In some feasible implementations, the bracket 403 can be integrally molded. This ensures the structural strength of the boss connection and the overall structural strength, thereby guaranteeing the service life of the bracket 403. The material of the bracket 403 can include metal or metal alloys, allowing for adaptive adjustments to the material.

[0115] When the material of the bracket 403 can be metal, the bracket 403 can be made of a single metal material or a composite metal material.

[0116] For example, the bracket 403 can be made of copper. The copper bracket 403 can withstand large acute strain and is suitable for flexible circuits.

[0117] Alternatively, the bracket 403 can be made of steel, which has the advantages of high yield strength and strong corrosion resistance. In other words, the bracket 403 can be a steel sheet. When the bracket 403 is a steel sheet, a 3D steel sheet can be used. A 3D steel sheet is a steel sheet manufactured using 3D printing technology. Compared with traditional steel sheets, 3D steel sheets have the advantages of high tensile strength and rapid prototyping. Furthermore, 3D steel sheets can achieve lightweight design, effectively reducing the weight of the pressure-sensitive touch device 100, thus meeting the miniaturization and lightweight requirements of the electronic device 200.

[0118] In some feasible implementations, the shape of the bracket 403 can also be other shapes, such as circles, triangles, ellipses, etc.

[0119] Figure 8A This is a schematic diagram of the structure of a limiting part provided in an embodiment of this application; Figure 8B This is a schematic diagram of another limiting part provided in an embodiment of this application; Figure 8C This is a schematic diagram of another limiting part 4032 provided in an embodiment of this application. Wherein, Figure 8AThe limiting part 4032 is shown as being installed on the base plate 4034 of the bracket 403; Figure 8B The limiting part 4032 is shown to be installed on the top plate 4033 of the bracket 403. Figure 8C The limiting part 4032 is shown to be respectively installed on the top plate 4033 and the bottom plate 4034.

[0120] Among some feasible implementation methods, see Figure 8A As shown, unlike the above embodiment, the number of limiting parts 4032 can also be three, with the three limiting parts 4032 evenly distributed on the base plate 4034 of the bracket 403. In this implementation, the three limiting parts 4032 can be arranged in an array. The number of limiting parts 4032 can be related to the size of the pressure-sensitive touch device 100.

[0121] For example, when the size of the pressure-sensitive touch device 100 is relatively large, a relatively large number of limit portions 4032 can be provided; or, when the size of the pressure-sensitive touch device 100 is relatively small, a relatively small number of limit portions 4032 can be provided.

[0122] The number of limiting parts 4032 can also be related to the size of the limiting parts 4032.

[0123] For example, if the size of the pressure-sensitive touch device 100 remains unchanged, and the size of the limiting part 4032 is relatively large, one limiting part 4032 can be provided accordingly; or, if the size of the limiting part 4032 is small, multiple limiting parts 4032 can be provided accordingly, such as two, three or five.

[0124] See Figure 8B As shown, the limiting part 4032 can also be disposed on the top plate 4033 of the bracket 403, and the distance between the limiting part 4032 and the top plate 4033 is h1. Thus, during the pressing process of the pressure-sensitive touch device 100, the limiting part 4032 is moved by the top plate 4033 towards the bottom plate 4034 of the bracket 403. The position of the limiting part 4032 can be flexibly set while ensuring that the pressing distance remains constant.

[0125] See Figure 8C As shown, multiple limiting parts 4032 can be respectively provided on the top plate 4033 and the bottom plate 4034 of the bracket 403. And along the height direction, the distance between two opposite limiting parts 4032 is h1.

[0126] It is worth noting that the setting of the limiting part 4032 can be adaptively adjusted according to the size of the pressure-sensitive touch device 100. For example, when the size of the pressure-sensitive touch device 100 is relatively small, the limiting part 4032 can be set on the top plate 4033 or the bottom plate 4034 of the bracket 403. When the size of the pressure-sensitive touch device 100 is relatively large, the size of the bracket 403 is also adaptively adjusted. In order to ensure the stability of the hollow structure of the bracket 403, the limiting part 4032 can be set on both the top plate 4033 and the bottom plate 4034 to ensure the structural strength of the bracket 403.

[0127] The cross-sectional shape of the limiting part 4032 can be square, including square and rectangular. The cross-sectional shape of the limiting part 4032 can also be circular or elliptical. The cross-sectional shape, size and number of the limiting parts 4032 can be adaptively adjusted according to the parameters of the pressure-sensitive touch device 100.

[0128] See also the following for some feasible implementation methods. Figure 4 As shown, the pressure sensor 50 and the limiting part 4032 are misaligned. During the pressing process of the pressure-sensitive touch device 100, due to the presence of the limiting part 4032, the bottom position corresponding to the limiting part 4032 may not deform, or the deformation may be small, not matching the pressure value. Therefore, the pressure-sensitive touch device 100 is positioned to avoid the limiting part 4032 to ensure accurate pressure transmission to the pressure sensor 50, thereby ensuring the accuracy of the pressure value detected by the pressure sensor 50.

[0129] In one specific implementation, the pressure sensor 50 may include a resistor bridge. The core principle of a resistor bridge is to convert changes in resistance into a measurable voltage signal. Resistor bridges have the advantages of high sensitivity and accuracy, strong anti-interference ability, and are easy to manufacture and inexpensive, which can effectively reduce the cost of the pressure-sensitive touch device 100.

[0130] See also Figure 4 and Figure 5 As shown, the bracket assembly 40 may also include a flexible circuit board 406, which includes a first mounting surface 401 and a second mounting surface 402, and the first mounting surface 401 and the second mounting surface 402 are disposed opposite to each other.

[0131] The flexible circuit board 406 includes a bending area 4061, and the support 403 is located within the bending area 4061. The flexible circuit board 406 has good bendability, which can meet the requirements of space constraints, movable structures, and lightweight design. It is understood that in this embodiment, the flexible circuit board 406 can be bent into a "U" shape to form the bending area 4061, and the support 403 can be installed within the bending area 4061, so that both the upper and lower surfaces of the support 403 are covered by the flexible circuit board 406.

[0132] The flexible circuit board 406 and the upper and lower surfaces of the bracket 403, as well as the pressure sensors 50, can be welded together. This makes the bracket assembly 40 a single, integrated structure. During the pressing operation of the pressure-sensitive touch device 100, the bracket 403 and the flexible circuit board 406 deform synchronously to ensure stable pressure transmission. Furthermore, the welded connection allows for connections between different structural components without requiring other connecting parts, saving space and effectively improving space utilization.

[0133] Figure 9 This is a schematic diagram of a support and flexible circuit board provided in an embodiment of this application.

[0134] Among some feasible implementation methods, see Figure 9 As shown, the bracket 403 may further include a protrusion 4037, and the flexible circuit board 406 may further include a through hole 4062, with the cross-sectional dimensions of the protrusion 4037 and the through hole 4062 being adapted. When installing the bracket 403 and the flexible circuit board 406, the protrusion 4037 of the bracket 403 can be positioned opposite the through hole 4062 of the flexible circuit board 406. After inserting the protrusion 4037 into the through hole 4062, the flexible circuit board 406 is bent to form a bending area 4061, so that the flexible circuit board 406 and the bracket 403 fit tightly together.

[0135] In this implementation, during the fitting process between the protrusion 4037 and the through hole 4062, an adhesive layer can be applied between the bottom of the bracket 403 and the flexible circuit board 406 to further ensure the connection strength between the bracket 403 and the flexible circuit board 406. The number of protrusions 4037 can be set to two, with the two protrusions 4037 respectively positioned on both sides of the limiting part 4032 to ensure the symmetry of the connection force.

[0136] The protrusion 4037 facilitates the overall installation of the bracket assembly 40 and the touch assembly 10. During the subsequent installation of the pressure-sensitive touch device 100, a hole structure can be set in the installation area of ​​the electronic device 200, and the protrusion 4037 can be installed in the hole structure to fix the pressure-sensitive touch device 100.

[0137] It should be emphasized that in this implementation, the adhesive layer is placed at a location where the bracket 403 and the flexible circuit board 406 do not need to be welded together. Alternatively, similar to the above implementation, the bracket 403 uses a protrusion 4037 to fit the through hole 4062, and the upper and lower surfaces of the flexible circuit board 406 and the bracket 403 are welded together before the adhesive layer is applied to further ensure the connection strength.

[0138] The connection between the bracket 403 and the flexible circuit board 406, the protrusion 4037 of the bracket 403 is adapted to the through hole 4062 of the flexible circuit board 406, and the adhesive layer can be adapted and used in combination according to the size of the bracket 403 and the flexible circuit board 406 and the usage scenario of the electronic device 200.

[0139] Figure 10 This is a schematic diagram of another pressure-sensitive touch device provided in the embodiments of this application.

[0140] In a specific implementation, see Figure 10 As shown, the pressure-sensitive touch device 100 may further include an adhesive layer 60. The adhesive layer 60 is disposed at the soldering point between the flexible circuit board 406 and the touch component 10. Thus, by providing the adhesive layer 60 at the soldering point between the flexible circuit board 406 and the touch component 10, the soldering point between the flexible circuit board 406 and the touch component 10 can be sealed, preventing long-term exposure and corrosion, and further ensuring the connection strength between the flexible circuit board 406 and the touch component 10. This ensures the pull-out force between the touch component 10 and the support assembly 40 during repeated pressing and rebounding of the pressure-sensitive touch device 100.

[0141] The adhesive layer 60 can be formed using a dispensing process. The dispensing process allows for precise control of the amount, position, and shape of the adhesive, enabling localized bonding, sealing, or filling. It offers advantages in terms of high precision and flexibility. The adhesive layer 60 can be made of epoxy resin, silicone, or AB adhesive.

[0142] Figure 11 This is a schematic diagram of the structure of another pressure-sensitive touch device provided in the embodiments of this application.

[0143] In a specific implementation, see Figure 11 As shown, the pressure-sensitive touch device 100 may also include a base 70. The base 70 is disposed on the side of the support assembly 40 opposite to the touch hole assembly 10.

[0144] In other words, the base 70 is located at the bottom of the bracket assembly 40, and the second mounting surface 402 of the bracket assembly 40 is connected to the base 70. Specifically, the second mounting surface 402 of the bracket assembly 40 can be welded to the base 70, which can improve the overall stability of the base 70 and the bracket assembly 40. Of course, the base 70 and the bracket assembly 40 can also be connected in other ways.

[0145] The base 70 is positioned opposite to the limiting part 4032. This ensures the stability of the pressure-sensitive touch device 100 when it is under pressure. Specifically, when the pressure-sensitive touch device 100 is under pressure, the pressure on the limiting part 4032 can be directly transmitted to the base 70 in the vertical direction, reducing the pressure transmission path of the limiting part 4032 and ensuring the stability of the pressure-sensitive touch device 100.

[0146] In this implementation, there are multiple pressure sensors 50, which are located on both sides of the base 70. This symmetrical arrangement of the pressure sensors 50 ensures that the pressure is applied evenly to each sensor.

[0147] It should be emphasized that, please continue to refer to Figure 11 As shown, there are two pressure sensors 50. In other implementations, the number of pressure sensors 50 can be three or four, arranged symmetrically about the center of the base 70. Alternatively, there can be only one pressure sensor 50, which can be a ring structure, a circular ring structure, or a U-shaped structure. The ring-shaped pressure sensor 50 is arranged around the base 70, thus increasing the area of ​​the pressure sensor 50 for better pressure detection.

[0148] The number of pressure sensors 50 can be adapted to the size of the actual pressure-sensitive touch device 100.

[0149] In some feasible implementations, the base 70 may include a metal spring or a dome switch, in which the base 70 can be used as a DOME key to achieve functions such as circuit conduction and tactile feedback.

[0150] Figure 12 This is a schematic diagram of the structure of another pressure-sensitive touch device provided in the embodiments of this application.

[0151] In a specific implementation, see Figure 12 As shown, the touch component 10 may also include a protective layer 103. The protective layer 103 is disposed on the side of the package 102 away from the substrate 101, that is, the protective layer 103 is disposed on the surface of the package 102.

[0152] Specifically, the protective layer 103 can be applied to the surface of the package 102 by spraying. This protects the surface of the package 102 and also enhances the appearance of the touch component 10. The material of the protective layer 103 can have advantages such as ultra-high hardness, good wear resistance, and a delicate touch.

[0153] See also Figure 12As shown, the protective layer 103 may include a thinning portion 103a.

[0154] Specifically, the thinned portion 103a is arranged around the protective layer 103. In this way, when the user's finger touches the pressure-sensitive touch device 100, the thinned portion 103a can sense the specific position of the touch component 10, thereby improving the touch feel.

[0155] Thus, the touch component 10 provided in this application embodiment can be used as a keycap. By welding the touch component 10 to the bracket assembly, the keycap can be effectively prevented from falling off, ensuring the stability of the keycap.

[0156] Corresponding to the aforementioned embodiment of the pressure-sensitive touch device 100, this application also provides an embodiment of an electronic device.

[0157] Figure 13A This is a schematic diagram of the structure of an electronic device provided in an embodiment of this application; Figure 13B This is a schematic diagram of the structure of another electronic device provided in an embodiment of this application. Figure 13A The diagram shows a structural schematic of a pressure-sensitive touch device 100 used in a single-screen electronic device. Figure 13B The diagram shows a structural schematic of a pressure-sensitive touch device 100 applied in a three-fold electronic device 200.

[0158] Combination Figure 12 and Figure 13A As shown, the electronic device 200 may include a pressure-sensitive touch device 100 and a mid-frame 201. The pressure-sensitive touch device 100 includes the structure described in any of the above implementations. The pressure-sensitive touch device 100 is disposed on the mid-frame 201. Wherein, Figure 13A It can be compared with the aforementioned implementation methods. Figure 7 correspond.

[0159] See Figure 13B As shown, the middle frame 201 of the electronic device 200 may include a first outer middle frame 201-1, a second outer middle frame 201-2 and an inner middle frame 201-3, and the pressure-sensitive touch device 100 is disposed on the inner middle frame 201-3.

[0160] It is worth noting that when the electronic device 200 is a mobile phone, the size of the pressure-sensitive touch device 100 can be set to be relatively small; when the electronic device 200 is a tablet or PDA, the size of the pressure-sensitive touch device 100 can be set to be relatively large.

[0161] In some feasible ways, the pressure-sensitive touch device 100 can be sized to be the same as or slightly smaller than the side dimensions of the mid-frame 201, allowing users to experience the game. For example, the movement of the game character can be controlled by sliding the user's finger. For instance, the left and right movement of the game character can be controlled by sliding the user's right hand left and right, the forward and backward movement of the game character can be controlled by sliding the user's left hand up and down, or the user can press to control actions such as jumping and crouching of the game character.

[0162] See also the following for some feasible implementation methods. Figure 13A and Figure 13B As shown, the electronic device 200 may further include a limiting member 203, which passes through the pressing cavity 4031 of the pressure-sensitive touch device 100 and avoids the limiting part 4032. The two ends of the limiting member 203 are disposed on the middle frame 201, and the limiting member 203 is used to limit the relative displacement between the pressure-sensitive touch device 100 and the middle frame 201.

[0163] To improve the connection stability between the pressure-sensitive touch device 100 and the middle frame 201, a limiting member 203 can be provided that traverses the pressing cavity 4031. This can limit the pressure sensor 50 with the limiting member 203, preventing the pressure sensor 50 from falling off.

[0164] The extension direction of the limiting member 203 is different from that of the touch component 10. For example, there are two limiting members 203 and one limiting part 4032, with the two limiting members 203 respectively disposed on both sides of the limiting part 4032.

[0165] It should be noted that, upon considering the specification and practicing the application disclosed herein, those skilled in the art will readily conceive of other embodiments of this application. This application is intended to cover any variations, uses, or adaptations of this application that follow the general principles of this application and include common knowledge or customary techniques in the art not disclosed herein.

[0166] It should be understood that this application is not limited to the precise structure described above and shown in the accompanying drawings, and various modifications and changes can be made without departing from its scope. The true scope is indicated by this application.

Claims

1. A pressure-sensitive touch device, characterized in that, include: A touch component (10), the touch component (10) including a substrate (101) and a package (102); A touch chip (20) and a plurality of capacitive sensors (30) are disposed on a first surface (1011) of the substrate (101); the package (102) covers the touch chip (20) and the plurality of capacitive sensors (30); A support assembly (40) is disposed on the second surface (1012) of the substrate (101); the first surface (1011) and the second surface (1012) are two opposing surfaces of the substrate (101); A pressure sensor (50) is disposed on the side of the support assembly (40) opposite to the substrate (101).

2. The pressure-sensitive touch device according to claim 1, characterized in that, The plurality of capacitive sensors (30) are arranged sequentially along the length of the substrate (101).

3. The pressure-sensitive touch device according to claim 1, characterized in that, The bracket assembly (40) includes a bracket (403), the bracket (403) including a pressing cavity (4031) and a limiting part (4032); The limiting part (4032) is located inside the pressing cavity (4031), and the limiting part (4032) protrudes from the third surface (404) of the bracket toward the substrate (101); The distance between the limiting part (4032) and the fourth surface (405) of the bracket (403) is less than the height of the pressing cavity (4031), and the third surface (404) and the fourth surface (405) are two opposing inner surfaces of the bracket (403).

4. The pressure-sensitive touch device according to claim 3, characterized in that, The bracket (403) includes a mouth-shaped bracket; the pressing cavity (4031) is in communication with the external environment.

5. The pressure-sensitive touch device according to claim 3, characterized in that, The limiting part (4032) includes a boss located in the central region of the pressing cavity (4031).

6. The pressure-sensitive touch device according to claim 3, characterized in that, The pressure sensor (50) is offset from the limiting part (4032).

7. The pressure-sensitive touch device according to claim 3, characterized in that, The support assembly (40) also includes a flexible circuit board (406); The flexible circuit board (406) includes a bending area (4061), the bracket is located in the bending area (4061), and the flexible circuit board (406), the bracket (403), and the pressure sensor (50) are all welded together.

8. The pressure-sensitive touch device according to claim 1, characterized in that, The pressure sensor (50) includes a resistor bridge.

9. The pressure-sensitive touch device according to claim 7, characterized in that, Also includes: An adhesive layer (60) is disposed at the welding position between the flexible circuit board (406) and the touch component (10).

10. The pressure-sensitive touch device according to claim 3, characterized in that, Also includes: A base (70) is disposed on the side of the support assembly (40) away from the touch assembly (10), and the base (70) is disposed opposite to the limiting part (4032); The number of pressure sensors (50) is multiple, and the multiple pressure sensors (50) are respectively located on opposite sides of the base (70).

11. The pressure-sensitive touch device according to claim 1, characterized in that, The touch component (10) also includes: A protective layer (103) is disposed on the side of the package (102) facing away from the substrate (101).

12. An electronic device, characterized in that, Includes a mid-frame (201) and a pressure-sensitive touch device (100) as described in any one of claims 1-11; The pressure-sensitive touch device (100) is disposed on the middle frame (201).

13. The electronic device according to claim 12, characterized in that, Also includes: A limiting member (203) is provided through the pressing cavity (4031) of the pressure-sensitive touch device (100) and avoids the limiting part (4032) of the bracket assembly (40); wherein the limiting member (203) is disposed on the middle frame (201) and the limiting member (203) is configured to limit the relative displacement between the pressure-sensitive touch device and the middle frame (201).

Images