Organic-inorganic high-temperature composite dielectric electrode connecting structure

CN224554841UActive Publication Date: 2026-07-24HARBIN UNIV OF SCI & TECH
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Patent Information

Authority / Receiving Office
CN · China
Patent Type
Utility models(China)
Current Assignee / Owner
HARBIN UNIV OF SCI & TECH
Filing Date
2025-07-29
Publication Date
2026-07-24

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Abstract

The utility model discloses an organic inorganic high temperature composite medium electrode connecting structure belongs to the field of electronic material and device, an organic inorganic high temperature composite medium electrode connecting structure, including shell mechanism, the inner end middle part fixed mounting of shell mechanism has limit mechanism, the inner end side fixed mounting of limit mechanism has fixed establishment, the shell mechanism includes base, the upper end fixed connection of base has the top seat, the inner end middle part of base and top seat all is provided with buffer layer, and the inner end inboard of base is provided with the installation slot, this organic inorganic high temperature composite medium electrode connecting structure, through setting up organic inorganic composite material's buffer layer, makes the whole device when being high temperature expansion can pass through the buffering of buffer layer, reduces the damage, prolongs the service life of device, through setting up the clamping groove and limiting the electrode, makes the electrode not easy to shift and cause the device function loss when using, improved the stability when using the device.
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