patch panel

Abstract

The utility model embodiment provides a kind of adapter circuit board. Among them, the adapter circuit board includes: first group interface, each interface in first group interface is set to be connected with the radio frequency connector of first type;Second group interface, each interface in second group interface is set to be connected with the radio frequency connector of second type;Printed circuit board, printed circuit board includes one or more layers of board;A group of microstrip lines;Wherein, in the case that there are multiple microstrip lines in a group of microstrip lines on the same layer of board in printed circuit board, the distance between two adjacent microstrip lines transmitting radio frequency signals of the same frequency in multiple microstrip lines is greater than the distance between two adjacent microstrip lines transmitting radio frequency signals of different frequencies. Through the utility model, in the case of multiple signal paths, at least the technical problem that the transmitted signal is severely interfered in the related art is solved.

Description

Technical Field

[0001] This utility model relates to the field of communications, and more specifically, to a converter circuit board. Background Technology

[0002] In recent years, with the rapid development of satellite positioning technology, classic positioning equipment often simultaneously receives satellite signals from different frequency bands of navigation systems such as BeiDou Navigation Satellite System (BDS), Global Positioning System (GPS), and Global Navigation Satellite System (GLONASS), employing a multi-system combined positioning approach and improving positioning accuracy and efficiency through real-time differential technology. With the development of further anti-interference positioning technologies and the increasing trend of module integration, the demand for signal switching between multi-band, multi-channel modules is becoming increasingly urgent.

[0003] In the development of signal transmission technology between different integrated modules, coaxial adapter cables have emerged as a connection method. However, this method suffers from the problems of a large number of adapter cables and complex interlacing. In such cases, adjacent adapter cables can cause severe coupling crosstalk when transmitting signals, meaning the transmitted signal can be severely interfered with, significantly affecting the accuracy of signal transmission. Utility Model Content

[0004] This utility model provides an adapter circuit board that, in cases with multiple signal paths, at least solves the technical problem of severe interference with transmitted signals in related technologies.

[0005] According to one embodiment of the present invention, an adapter circuit board is provided, comprising: a first set of interfaces, each interface in the first set of interfaces being configured to connect to a first type of RF connector; a second set of interfaces, each interface in the second set of interfaces being configured to connect to a second type of RF connector; a printed circuit board, the printed circuit board comprising one or more layers; and a set of microstrip lines, wherein each microstrip line in the set of microstrip lines is located on a layer of the printed circuit board and is connected to one interface in the first set of interfaces and one interface in the second set of interfaces, and is configured to transmit RF signals between the one interface in the first set of interfaces and the one interface in the second set of interfaces; wherein, in the case where multiple microstrip lines in the set of microstrip lines are present on the same layer of the printed circuit board, the distance between two adjacent microstrip lines transmitting RF signals of the same frequency is greater than the distance between two adjacent microstrip lines transmitting RF signals of different frequencies.

[0006] In one embodiment of this invention, an adapter circuit board is employed. This board includes a first set of interfaces and a second set of interfaces, which are respectively connected to different types of RF connectors, as well as a set of microstrip lines on a printed circuit board. These microstrip lines connect the first set of interfaces and the second set of interfaces, transmitting RF signals between them. Specifically, when there are multiple microstrip lines on the same layer of the printed circuit board, the distance between adjacent microstrip lines transmitting signals of the same frequency is greater than the distance between microstrip lines transmitting signals of different frequencies. This design effectively reduces coupling crosstalk between microstrip lines, thereby mitigating the impact of crosstalk, solving the technical problem of severe signal interference in related technologies, and improving the accuracy of signal transmission. Attached Figure Description

[0007] The accompanying drawings, which are included to provide a further understanding of the present invention and form part of this application, illustrate exemplary embodiments of the present invention and, together with the description thereof, serve to explain the present invention and do not constitute an undue limitation thereof. In the drawings:

[0008] Figure 1 This is a schematic diagram of the adapter circuit board according to an embodiment of the present invention from a first-view perspective;

[0009] Figure 2 This is a schematic diagram of the adapter circuit board of this utility model embodiment from a second perspective;

[0010] Figure 3 This is a schematic diagram illustrating the calculation of the distance between line L1 and microstrip line L2, and the distance between microstrip line L1 and microstrip line L3, respectively, when microstrip lines L1, L2, and L3 are curves, according to an embodiment of this utility model.

[0011] Figure 4 This is another schematic diagram illustrating how, in the case where microstrip lines L1, L2, and L3 are curves, the distances between line L1 and microstrip line L2, and between microstrip lines L1 and L3 are calculated respectively.

[0012] Figure 5 This is an exploded view of a printed circuit board with a two-layer structure according to an embodiment of the present invention;

[0013] Figure 6 This is an exploded view of a three-layer printed circuit board according to an embodiment of the present invention;

[0014] Figure 7 This is a schematic diagram of the structure of a first set of isolation modules provided between microstrip line L1 and microstrip line L3 according to an embodiment of the present invention;

[0015] Figure 8 This is a schematic diagram of the structure of the present invention, in which a first metal isolation strip is provided between microstrip line L1 and microstrip line L3;

[0016] Figure 9 This is a schematic diagram of a structure of the present invention in which a second metal isolation strip and a third metal isolation strip are provided between microstrip line L1 and microstrip line L3;

[0017] Figure 10 This is a schematic diagram of the structure of the third metal isolation strip located on the cover plate according to an embodiment of the present invention;

[0018] Figure 11 This is a schematic diagram of the structure of a plurality of randomly arranged grounding holes between microstrip line L1 and microstrip line L3 according to an embodiment of the present invention.

[0019] Figure 12 This is a schematic diagram of the structure of an embodiment of the present invention in which multiple grounding holes are provided on one side of one of the microstrip lines L1 and L3.

[0020] Figure 13 This is a schematic diagram of the structure of an embodiment of the present invention in which multiple grounding holes are also provided on the other side of one of the microstrip lines L1 and L3.

[0021] Figure 14 This is a structural schematic diagram of an embodiment of the present invention, including a second set of isolation module adapter circuit boards;

[0022] Figure 15 This is a schematic diagram of one structure of a converter circuit board including a first set of isolation modules and a second set of isolation modules according to an embodiment of the present utility model;

[0023] Figure 16This is a structural schematic diagram of an embodiment of the present invention, including a second set of isolation module adapter circuit boards;

[0024] Figure 17 This is a schematic diagram of another structure of the adapter circuit board including the first group of isolation modules and the second group of isolation modules according to an embodiment of the present utility model;

[0025] Figure 18 This is a schematic diagram of a structure of the present invention in which a fifth metal isolation strip and a sixth metal isolation strip are provided between microstrip line L1 and microstrip line L2;

[0026] Figure 19 This is a schematic diagram of one of the structures of the present invention, wherein a second metal isolation strip and a third metal isolation strip are provided between microstrip line L1 and microstrip line L3, and a fifth metal isolation strip and a sixth metal isolation strip are provided between microstrip line L1 and microstrip line L2;

[0027] Figure 20 This is a schematic diagram of the sixth metal isolation strip located on the cover plate according to an embodiment of the present invention;

[0028] Figure 21 This is another schematic diagram of the present invention, in which a second metal isolation strip and a third metal isolation strip are provided between microstrip line L1 and microstrip line L3, and a fifth metal isolation strip and a sixth metal isolation strip are provided between microstrip line L1 and microstrip line L2.

[0029] Figure 22 This is a schematic diagram of the structure of a plurality of randomly arranged grounding holes between microstrip line L1 and microstrip line L2 according to an embodiment of the present invention.

[0030] Figure 23 This is a schematic diagram of the structure of an embodiment of the present invention in which multiple grounding holes are provided on one side of one of the microstrip lines L1 and L2.

[0031] Figure 24 This is a schematic diagram of the structure of an embodiment of the present invention in which multiple grounding holes are also provided on the other side of one of the microstrip lines L1 and L2.

[0032] Figure 25 This is a schematic diagram of the structure of this utility model in which microstrip lines L1, L2, and L3 are located on the same layer of a board and a grounding hole is provided;

[0033] Figure 26 This is a schematic diagram of the structure of the present invention, in which the second metal isolation strip is located on a layer of the printed circuit board, the third metal isolation strip is located on the cover plate E, the fifth metal isolation strip is located on a layer of the printed circuit board, and the sixth metal isolation strip is located on the cover plate E.

[0034] Figure 27 This is a schematic diagram of the structure on the first layer of the printed circuit board in the case of a multilayer board according to an embodiment of the present invention;

[0035] Figure 28 This is a schematic diagram of the structure on the middle layer of the printed circuit board in the case of a multilayer board according to an embodiment of the present invention;

[0036] Figure 29 This is a schematic diagram of the structure on the last layer of the printed circuit board in the case of a multilayer board according to an embodiment of the present invention;

[0037] Figure 30 A schematic diagram of the adapter module according to an embodiment of the present utility model;

[0038] Figure 31 A schematic diagram of one structure of the adapter module according to an embodiment of the present utility model;

[0039] Figure 32 Another structural schematic diagram of the adapter module according to an embodiment of the present utility model;

[0040] Figure 33 A schematic diagram of one structure of the adapter according to an embodiment of the present utility model;

[0041] Figure 34 Another structural schematic diagram of the adapter according to an embodiment of the present utility model;

[0042] Figure 35 A schematic diagram of one structure of the adapter according to an embodiment of the present utility model;

[0043] Figure 36 Another structural schematic diagram of the adapter according to an embodiment of the present utility model;

[0044] Figure 37 A schematic diagram of one structure of the adapter according to an embodiment of the present utility model;

[0045] Figure 38 Another structural schematic diagram of the adapter device according to an embodiment of the present utility model. Detailed Implementation

[0046] The present invention will be described in detail below with reference to the accompanying drawings and embodiments. It should be noted that, unless otherwise specified, the embodiments and features described in the present application can be combined with each other.

[0047] It should be noted that the terms "first," "second," etc., in the specification, claims, and drawings of this utility model are used to distinguish similar objects and are not necessarily used to describe a specific order or sequence.

[0048] This embodiment provides an adapter circuit board, which includes:

[0049] The first set of interfaces, each of which is configured to connect to a first type of RF connector;

[0050] The second set of interfaces, each of which is configured to connect to a second type of RF connector;

[0051] Printed circuit boards, which include one or more layers of boards;

[0052] A set of microstrip lines, wherein each microstrip line in the set of microstrip lines is located on a layer of a printed circuit board and is connected to an interface in a first set of interfaces and an interface in a second set of interfaces, and is configured to transmit radio frequency signals between an interface in the first set of interfaces and an interface in the second set of interfaces.

[0053] In the case of multiple microstrip lines in a set of microstrip lines on the same layer of a printed circuit board, the distance between two adjacent microstrip lines that transmit radio frequency signals of the same frequency is greater than the distance between two adjacent microstrip lines that transmit radio frequency signals of different frequencies.

[0054] Figure 1 This is a schematic diagram of the adapter circuit board according to an embodiment of the present invention from a first-view perspective, as shown below. Figure 1 As shown, in one exemplary embodiment, a first type of RF connector can be configured to connect to an antenna module, and can be used to introduce signals from the antenna module into the adapter circuit board, or to send signals from the adapter circuit board to the antenna module. A second type of RF connector can be configured to connect to a vehicle's positioning module, and can be used to introduce signals from the antenna module into the vehicle's positioning module, or to introduce signals from the vehicle's positioning module into the adapter circuit board.

[0055] A microstrip line L1 connects interface A1 in the first group of interfaces to interface B1 in the second group of interfaces; a microstrip line L2 connects interface A2 in the first group of interfaces to interface B2 in the second group of interfaces; and a microstrip line L3 connects interface A3 in the first group of interfaces to interface B3 in the second group of interfaces. Microstrip lines L1 and L3 are two adjacent microstrip lines transmitting radio frequency (RF) signals of the same frequency, while microstrip lines L1 and L2 are two adjacent microstrip lines transmitting RF signals of different frequencies. The distance between microstrip lines L1 and L3 is greater than the distance between microstrip lines L1 and L2. The following description uses the examples of microstrip lines L1 and L3 being two adjacent microstrip lines transmitting the same frequency, and microstrip lines L1 and L2 being two adjacent microstrip lines transmitting RF signals of different frequencies.

[0056] Figure 2 This is a schematic diagram of the adapter circuit board according to an embodiment of the present invention from a second perspective, as shown below. Figure 2 As shown, in one exemplary embodiment, for example, the routing paths of microstrip lines L1, L2, and L3 can be straight lines. Then, the distance H1 between two straight lines is the distance between microstrip line L1 and microstrip line L2, and the distance H2 between two straight lines is the distance between microstrip line L1 and microstrip line L3.

[0057] Figure 3 This is a schematic diagram illustrating the calculation of the distances between line L1 and microstrip line L2, and the distances between microstrip line L1 and microstrip line L3, respectively, when microstrip lines L1, L2, and L3 are curves, according to an embodiment of this utility model. Figure 3 As shown, in one exemplary embodiment, the routing paths of microstrip lines L1, L2, and L3 can be curved. For example, the path can be based on the average distance between microstrip lines L1 and L2. The distance between microstrip line L1 and strip line L2 can be based on the average distance between microstrip lines L1 and L3. This represents the distance between microstrip line L1 and strip line L3.

[0058] Among them, the average distance between microstrip line L1 and microstrip line L2 The calculation formula can be:

[0059]

[0060] Where, n 1 The number of points on microstrip line L1 used when calculating the distance between microstrip lines L1 and L2. m 1The number of points on microstrip line L2 used when calculating the distance between microstrip lines L1 and L2. H(i2-j) is a function for calculating the distance between the i-th point on microstrip line L1 and the j-th point on microstrip line L2.

[0061] Among them, the average distance between microstrip line L1 and microstrip line L3 The calculation formula can be:

[0062]

[0063] Where n2 is the number of points on microstrip line L1 used in calculating the distance between microstrip line L1 and microstrip line L3. m2 is the number of points on microstrip line L3 used in calculating the distance between microstrip line L1 and microstrip line L3. H(i3-j) is a function for calculating the distance between the i-th point on microstrip line L1 and the j-th point on microstrip line L3.

[0064] Figure 4 This is another schematic diagram illustrating the calculation of the distances between line L1 and microstrip line L2, and between microstrip line L1 and microstrip line L3, respectively, when microstrip lines L1, L2, and L3 are curves, according to an embodiment of this utility model. Figure 4 As shown, in an exemplary embodiment, for example, the routing paths of microstrip lines L1, L2, and L3 can be curved. Then, the minimum distance H1 between microstrip lines L1 and L2 can be selected as the distance between microstrip lines L1 and L2, and the minimum distance H2 between microstrip lines L1 and L3 can be selected as the distance between microstrip lines L1 and L3. Therefore, it can be selected that the minimum distance H2 between microstrip lines L1 and L3 is greater than the minimum distance H1 between microstrip lines L1 and L2, and that the distance between microstrip lines L1 and L3 is greater than the distance between microstrip lines L1 and L2.

[0065] The formula for calculating the minimum distance H1 between microstrip lines L1 and L2 can be:

[0066] H1 = min(H(i2-j)).

[0067] Where i∈[1, n1], j∈[1, m1], n1 is the number of points on microstrip line L1 used when calculating the distance between microstrip line L1 and microstrip line L2. m1 is the number of points on microstrip line L2 used when calculating the distance between microstrip line L1 and microstrip line L2. H(i2-j) is a function for calculating the distance between the i-th point on microstrip line L1 and the j-th point on microstrip line L2.

[0068] The formula for calculating the minimum distance H2 between microstrip lines L1 and L3 can be:

[0069] H2 = min(H(i3-j)).

[0070] Where i∈[1, n2], j∈[1, m2], n2 is the number of points on microstrip line L1 used when calculating the distance between microstrip line L1 and microstrip line L3. m2 is the number of points on microstrip line L3 used when calculating the distance between microstrip line L1 and microstrip line L3. H(i3-j) is a function for calculating the distance between the i-th point on microstrip line L1 and the j-th point on microstrip line L3.

[0071] It should be noted that the values ​​of n1 and n2 mentioned above can be equal or unequal, and the values ​​of m1 and m2 can be equal or unequal, and can be set based on the actual situation.

[0072] Of course, the above methods for calculating the distance between microstrip lines L1 and L2, and for calculating the distance between microstrip lines L1 and L3, are merely examples, and this utility model embodiment is not limited to this method.

[0073] In summary, this embodiment of the invention employs an adapter circuit board, which includes a first set of interfaces and a second set of interfaces, respectively connected to different types of RF connectors, as well as a set of microstrip lines on a printed circuit board. These microstrip lines connect the first set of interfaces and the second set of interfaces, transmitting RF signals between them. Specifically, when there are multiple microstrip lines on the same layer of the printed circuit board, the distance between adjacent microstrip lines transmitting signals of the same frequency is greater than the distance between microstrip lines transmitting signals of different frequencies. This design effectively reduces coupling crosstalk between microstrip lines, thereby reducing the impact of crosstalk, solving the technical problem of severe interference with transmitted signals in related technologies, and improving the accuracy of signal transmission.

[0074] In one embodiment, a set of microstrip lines includes a first portion of microstrip lines, wherein the two ends of each microstrip line in the first portion of microstrip lines are respectively connected to an interface in a first set of interfaces and an interface in a second set of interfaces; and / or,

[0075] A set of microstrip lines includes a second part of microstrip lines. Multiple microstrip lines in the second part of microstrip lines are connected end to end in sequence to form a series microstrip line. The two ends of the series microstrip line are respectively connected to one interface in the first group of interfaces and one interface in the second group of interfaces. The multiple microstrip lines in the second part of microstrip lines are located on at least two layers of the printed circuit board.

[0076] Figure 5 This is an exploded view of a printed circuit board with a two-layer structure according to an embodiment of the present invention, as shown below. Figure 5As shown in the illustration, in an exemplary embodiment where the printed circuit board has a multilayer structure, the illustration uses a two-layer example for explanation. In the first layer, one end of a microstrip line L1 in the second part of the microstrip lines is connected to interface A1 in the first group of interfaces, and the other end is connected to interface A of the same layer. 11 In the second layer, one end of the microstrip line L1 is connected to an interface A. 12 The other end connects to interface B1 in the second set of interfaces. Interface A... 11 and Interface A 12 Connection, or interface A 11 and Interface A 12 For the same interface, or interface A 11 and Interface A 12 A via can be used to connect the end of the first layer microstrip line L1 to the beginning of the second layer microstrip line L1.

[0077] In the first layer, one end of microstrip line L2 in the second part of the microstrip line is connected to interface A2 in the first group of interfaces, and the other end is connected to interface A in this layer. 21 In the second layer, one end of the microstrip line L2 is connected to an interface A. 22 The other end connects to interface B2 in the second set of interfaces. Interface A... 21 and Interface A 22 Connection, or interface A 21 and Interface A 22 For the same interface, or interface A 21 and Interface A 22 A via can be used to connect the end of the first layer microstrip line L2 to the beginning of the second layer microstrip line L2.

[0078] In the first layer, one end of microstrip line L3 in the second part of the microstrip line is connected to interface A3 in the first group of interfaces, and the other end is connected to interface A in this layer. 31 In the second layer, one end of the microstrip line L3 is connected to an interface A. 32 The other end connects to interface B3 in the second set of interfaces. Interface A... 31 and Interface A 32 Connection, or interface A 31 and Interface A 32 For the same interface, or interface A 31 and Interface A 32 A via can be used to connect the end of the first-layer microstrip line L3 to the beginning of the second-layer microstrip line L3.

[0079] Figure 6 This is an exploded view of a three-layer printed circuit board according to an embodiment of the present invention, as shown below. Figure 6 As shown in the illustration, in an exemplary embodiment where the printed circuit board has a multilayer structure, a three-layer example is used for explanation. In the first layer, one end of a microstrip line L1 in the second part of the microstrip lines is connected to interface A1 in the first group of interfaces, and the other end is connected to interface A of the same layer. 11 In the second layer, one end of the microstrip line L1 is connected to an interface A. 12 The other end connects to an interface A of this layer. 13 Among them, interface A 11 and Interface A 12 Connection, or interface A 11 and Interface A 12 For the same interface, or interface A 11 and Interface A 12 A via can be used to connect the end of the first-layer microstrip line L1 to the beginning of the second-layer microstrip line L1. In the third layer, one end of the microstrip line L1 is connected to an interface A. 14 The other end connects to interface B1 in the second set of interfaces. Interface A... 13 and Interface A 14 Connection, or interface A 13 and Interface A 14 For the same interface, or interface A 13 and Interface A 14 A via can be used to connect the end of the second-layer microstrip line L1 to the beginning of the third-layer microstrip line L1. Therefore, the first-layer microstrip line L1 can be connected to the third-layer microstrip line L1 through the second-layer microstrip line L1.

[0080] In the first layer, one end of microstrip line L2 in the second part of the microstrip line is connected to interface A2 in the first group of interfaces, and the other end is connected to interface A in this layer. 21 In the second layer, one end of the microstrip line L2 is connected to an interface A. 22 The other end connects to an interface A of this layer. 23 Among them, interface A 21 and Interface A 22 Connection, or interface A 21 and Interface A 22 For the same interface, or interface A 21 and Interface A 22 A via can be used to connect the end of the first-layer microstrip line L2 to the beginning of the second-layer microstrip line L2. In the third layer, one of the second set of interfaces, interface B2, can be configured. Interface B2 and interface A... 23 Connection, or interface B2 and interface A 23 For the same interface, or interface B2 and interface A23 A via can be used to connect the end of the second-layer microstrip line L2 to the beginning of the third-layer microstrip line L2. Therefore, the first-layer microstrip line L2 can be connected to the third-layer microstrip line L2 via the second-layer microstrip line L2.

[0081] In the first layer, one end of microstrip line L3 in the second part of the microstrip line is connected to interface A3 in the first group of interfaces, and the other end is connected to interface A in this layer. 31 In the second layer, one end of the microstrip line L3 is connected to an interface A. 32 The other end connects to an interface A of this layer. 33 Among them, interface A 31 and Interface A 32 Connection, or interface A 31 and Interface A 32 For the same interface, or interface A 31 and Interface A 32 A via can be used to connect the end of the first-layer microstrip line L3 to the beginning of the second-layer microstrip line L3. In the third layer, one end of the microstrip line L3 is connected to an interface A. 34 The other end connects to interface B3 in the second set of interfaces. Interface A... 33 and Interface A 34 Connection, or interface A 33 and Interface A 34 For the same interface, or interface A 33 and Interface A 34 A via can be used to connect the end of the second-layer microstrip line L3 to the beginning of the third-layer microstrip line L3. Therefore, the first-layer microstrip line L3 can be connected to the third-layer microstrip line L3 through the second-layer microstrip line L3.

[0082] Of course, the same applies to other multilayer structures of the printed circuit board, and will not be described in detail in this utility model embodiment.

[0083] It should be noted that the above-mentioned interfaces A1 and A... 11 Interface A 12 Interface A 13 Interface A 14 Interface A2, Interface A 21 Interface A 22 Interface A 23 Interface A3, Interface A 31 Interface A 32 Interface A 33 Interface A 34Interfaces B1, B2, B3, etc., can all extend from the first layer to the last layer. Therefore, any microstrip line can be used as an input terminal for radio frequency signals, an intermediate segment for radio frequency signals, and an output terminal for radio frequency signals.

[0084] In one embodiment, the adapter board further includes: a first set of isolation modules, the first set of isolation modules including one or more isolation modules, each isolation module in the first set of isolation modules being located between two adjacent microstrip lines transmitting radio frequency signals of the same frequency, and being configured to isolate the magnetic field generated by the two adjacent microstrip lines transmitting radio frequency signals of the same frequency.

[0085] Figure 7 This is a schematic diagram of the structure of the present invention, showing a first set of isolation modules disposed between microstrip line L1 and microstrip line L3, as shown in the embodiment. Figure 7 As shown, in one exemplary embodiment, the isolation module of the first group of isolation modules C can be disposed between microstrip line L1 and microstrip line L3, wherein microstrip line L1 and microstrip line L3 are two adjacent microstrip lines that transmit radio frequency signals of the same frequency. The isolation module of the first group of isolation modules C is used to isolate the magnetic field generated by the two adjacent microstrip lines that transmit radio frequency signals of the same frequency.

[0086] In one embodiment, each isolation module in at least a portion of the first group of isolation modules includes:

[0087] A first metal isolating strip is located between adjacent first and second microstrip lines in a group of microstrip lines. The first and second microstrip lines are configured to transmit radio frequency signals of the same frequency. The first metal isolating strip, the first microstrip lines, and the second microstrip lines are located on the same layer of a printed circuit board; or...

[0088] A second metal isolation strip and a third metal isolation strip, the second metal isolation strip being located between adjacent first and second microstrip lines in a set of microstrip lines, the first and second microstrip lines being configured to transmit radio frequency signals of the same frequency, the first metal isolation strip, the first microstrip line and the second microstrip line being located on the same layer of a printed circuit board, the third metal isolation strip being in contact with the second metal isolation strip, the third metal isolation strip being located on a layer of a printed circuit board adjacent to the same layer, or on a cover plate, wherein the adapter circuit board also includes a cover plate.

[0089] Figure 8 This is a schematic diagram of the structure of this utility model, showing a first metal isolation strip disposed between microstrip line L1 and microstrip line L3, as shown. Figure 8As shown, in an exemplary embodiment, the first microstrip line can be microstrip line L1, and the second microstrip line can be microstrip line L3. A first metal isolation strip C1 can be disposed between microstrip line L1 and microstrip line L3, wherein microstrip line L1 and microstrip line L3 are two adjacent microstrip lines transmitting radio frequency signals of the same frequency. The first metal isolation strip C1 is grounded, and is used to isolate the magnetic field generated by the two adjacent microstrip lines transmitting radio frequency signals of the same frequency. The first metal isolation strip C1 can be obtained from a copper plating layer on a layer of a printed circuit board.

[0090] Figure 9 This is a schematic diagram of a structure of the present invention, in which a second metal isolation strip and a third metal isolation strip are provided between microstrip line L1 and microstrip line L3, as shown in the figure. Figure 9 As shown, in an exemplary embodiment, for example, in the first layer, a second metal isolation strip C2 is disposed between microstrip line L1 and microstrip line L3. In the second layer, a third metal isolation strip C3 is disposed between microstrip line L1 and microstrip line L3. The second metal isolation strip C2 and the third metal isolation strip C3 can be connected and grounded through vias. The second metal isolation strip C2 and the third metal isolation strip C3 can be obtained from copper plating layers on corresponding layers of the printed circuit board. Alternatively, the second metal isolation strip C2 and the third metal isolation strip C3 can be metal patches laid on corresponding layers of the printed circuit board. For example, the second metal isolation strip C2 is disposed on the first layer, and a mounting groove is formed on the surface of the first layer so that the second metal isolation strip C2 is disposed within the mounting groove, making the surface of the second metal isolation strip C2 flush with the surface of the first layer. The third metal isolation strip C3 is disposed on the second layer, and a mounting groove is formed on the surface of the second layer so that the third metal isolation strip C3 is disposed within the mounting groove, making the surface of the third metal isolation strip C3 flush with the surface of the second layer. Alternatively, a clearance groove can be provided on the surface of the first layer plate facing the second layer plate. When the first layer plate and the second layer plate are pressed together, the portion of the third metal spacer strip C3 that is higher than the surface of the second layer plate can be located in the clearance groove.

[0091] Figure 10 This is a schematic diagram of the structure of the third metal partition strip located on the cover plate according to an embodiment of the present invention, as shown below. Figure 10As shown, in one exemplary embodiment, a second metal isolation strip C2 is disposed between microstrip line L1 and microstrip line L3 on a layer of a printed circuit board. An opening is provided on the side of a cover plate E closest to the printed circuit board to accommodate it. The cover plate E is made of a metallic material and is conductive. A third metal isolation strip C3 is disposed within the opening of the cover plate E. The third metal isolation strip C3 can be detachably connected to the cover plate E or integrally formed. When the printed circuit board is located within the opening of the cover plate E, the second metal isolation strip C2 and the third metal isolation strip C3 contact each other to form a "metal isolation wall" between microstrip line L1 and microstrip line L3. The metallic material has a shielding effect on radio frequency signals, effectively shielding part of the radio frequency signal leakage spatially. From the perspective of signal transmission path, this increases the transmission path, resulting in greater energy loss. For example, the radio frequency signal transmitted on microstrip line L1 loses most of its energy when coupled to microstrip line L3, thus reducing mutual coupling crosstalk and improving isolation.

[0092] In one embodiment, each isolation module in at least a portion of the first group of isolation modules includes:

[0093] The first group of grounding holes includes one or more grounding holes, and the first group of grounding holes is set to ground.

[0094] In one exemplary embodiment, the first set of grounding vias in the printed circuit board serves as another form of isolation module. Its grounding function allows the metal portion acting as "ground" to function as an isolation module, utilizing the shielding effect of the metal material on radio frequency signals to achieve isolation of radio frequency signals in the microstrip line. For example, the first set of grounding vias can be used to isolate crosstalk between radio frequency signals of the same frequency between microstrip line L1 and microstrip line L3.

[0095] In one embodiment, the first set of grounding vias includes multiple grounding vias located between adjacent first and second microstrip lines in a set of microstrip lines. The first and second microstrip lines are configured to transmit radio frequency signals of the same frequency. The multiple grounding vias, the first microstrip lines, and the second microstrip lines are located on the same layer of a printed circuit board. The multiple grounding vias are randomly arranged between the first and second microstrip lines.

[0096] Figure 11 This is a schematic diagram of the structure of a randomized grounding hole between microstrip line L1 and microstrip line L3 according to an embodiment of the present invention. Figure 11As shown, in one exemplary embodiment, multiple grounding vias C4 are located between microstrip line L1 and microstrip line L3 on a single layer, and are randomly arranged between microstrip lines L1 and L3. In three-dimensional space, the multiple randomly arranged grounding vias C4 are similar to multiple randomly arranged "metal pillars" to reduce the energy loss of the radio frequency signal transmitted on microstrip line L1 when coupled to microstrip line L3. Therefore, mutual coupling crosstalk is reduced, and isolation is improved.

[0097] In one embodiment, the first set of grounding vias includes a plurality of grounding vias located between adjacent first and second microstrip lines in a set of microstrip lines. The first and second microstrip lines are configured to transmit radio frequency signals of the same frequency. The plurality of grounding vias, the first microstrip lines, and the second microstrip lines are located on the same layer of a printed circuit board. The plurality of grounding vias are located on one side of one of the first and second microstrip lines and are spaced apart along the extension direction of the microstrip line.

[0098] Figure 12 This is a schematic diagram of a structure in which multiple grounding holes are provided on one side of one of the microstrip lines L1 and L3, according to an embodiment of the present invention. Figure 12 As shown, in one exemplary embodiment, for example, multiple grounding vias C4 are provided on the side of microstrip line L1 near microstrip line L3. These vias C4 are spaced apart along the extension direction of microstrip line L1, forming a row of "metal pillars" on the side of microstrip line L1 near microstrip line L3. This improves the energy loss of the radio frequency signal transmitted on microstrip line L1 when coupled to microstrip line L3. Therefore, it reduces crosstalk between radio frequency signals of the same frequency and improves isolation.

[0099] In one embodiment, the adapter circuit board further includes: a second set of grounding holes, the second set of grounding holes including a plurality of grounding holes, the first set of grounding holes, the second set of grounding holes, the first microstrip line and the second microstrip line being located on the same layer of the printed circuit board, the second set of grounding holes being located on the other side of one of the first microstrip lines and the second microstrip line and being spaced apart along the extension direction of the microstrip line.

[0100] Figure 13 This is a schematic diagram of a structure in which multiple grounding holes are also provided on the other side of one of the microstrip lines L1 and L3, according to an embodiment of the present invention. Figure 13As shown, in an exemplary embodiment, for example, multiple grounding holes C4 are provided on the side of microstrip line L1 near microstrip line L3, and the multiple grounding holes C4 are arranged at intervals along the extension direction of microstrip line L1. Multiple grounding holes C4 are also provided on the side of microstrip line L1 away from microstrip line L3, and the multiple grounding holes are arranged at intervals along the extension direction of microstrip line L1. Therefore, two rows of grounding holes C4 are provided on both sides of microstrip line L1, that is, two rows of "metal pillars" are provided on both sides of microstrip line L1. By utilizing the shielding effect of metal material on radio frequency signals, a dedicated isolation space is created for microstrip line L1, and the effect of isolating microstrip line L1 separately is achieved.

[0101] In one embodiment, the adapter board further includes a second set of isolation modules, which includes one or more isolation modules. Each isolation module in the second set of isolation modules is located between two adjacent microstrip lines that transmit radio frequency signals of different frequencies and is configured to isolate the magnetic field generated by the two adjacent microstrip lines that transmit radio frequency signals of different frequencies.

[0102] Figure 14 This is a structural schematic diagram of an embodiment of the present invention, including the second set of isolation module adapter circuit boards, as shown below. Figure 14 As shown, in one exemplary embodiment, a second set of isolation modules D can be provided between microstrip line L1 and microstrip line L2. This is used to isolate the magnetic fields generated by two adjacent microstrip lines transmitting radio frequency signals of different frequencies.

[0103] Figure 15 This is a schematic diagram of one possible structure of the adapter circuit board including the first group of isolation modules and the second group of isolation modules according to an embodiment of the present invention, as shown below. Figure 15 As shown, in one exemplary embodiment, for example, a layer on a printed circuit board may contain microstrip lines (microstrip line L1 and microstrip line L3) transmitting radio frequency signals of the same frequency and microstrip lines (microstrip line L2) transmitting radio frequency signals of different frequencies. Therefore, a first set of isolation modules C can be provided between microstrip line L1 and microstrip line L3 to isolate crosstalk between radio frequency signals of the same frequency. A second set of isolation modules D can be provided between microstrip line L1 and microstrip line L2 to isolate crosstalk between radio frequency signals of different frequencies.

[0104] In one embodiment, each isolation module in at least a portion of the second set of isolation modules includes:

[0105] A fourth metal isolator is located between adjacent first and third microstrip lines in a group of microstrip lines. The first and third microstrip lines are configured to transmit radio frequency signals of different frequencies. The fourth metal isolator, the first microstrip line, and the third microstrip line are located on the same layer of a printed circuit board; or,

[0106] A fifth metal isolation strip and a sixth metal isolation strip, the fifth metal isolation strip being located between adjacent first and third microstrip lines in a set of microstrip lines, the first and third microstrip lines being configured to transmit radio frequency signals of different frequencies, a fourth metal isolation strip, the first microstrip line and the third microstrip line being located on the same layer of the printed circuit board, the sixth metal isolation strip being in contact with the fifth metal isolation strip, the sixth metal isolation strip being located on an adjacent layer of the same layer of the printed circuit board, or, located on a cover plate, wherein the transition circuit board also includes a cover plate.

[0107] Figure 16 This is a structural schematic diagram of an embodiment of the present invention, including the second set of isolation module adapter circuit boards, as shown below. Figure 16 As shown, in an exemplary embodiment, the first microstrip line can be microstrip line L1, and the third microstrip line can be microstrip line L2. A fourth metal isolation strip D1 can be disposed between microstrip line L1 and microstrip line L3, wherein microstrip line L1 and microstrip line L2 are two adjacent microstrip lines transmitting radio frequency signals of different frequencies. The fourth metal isolation strip D1 is set to ground, and is used to isolate the magnetic field generated by the two adjacent microstrip lines transmitting radio frequency signals of different frequencies. The fourth metal isolation strip D1 can be obtained from a copper plating layer on a layer of a printed circuit board.

[0108] Figure 17 This is a schematic diagram of another structure of the adapter circuit board including the first group of isolation modules and the second group of isolation modules according to an embodiment of the present invention, as shown below. Figure 17 As shown, in one exemplary embodiment, a single layer of a printed circuit board may contain microstrip lines (microstrip line L1 and microstrip line L3) transmitting radio frequency signals of the same frequency and microstrip lines (microstrip line L2) transmitting radio frequency signals of different frequencies. Therefore, a first metal isolation strip C1 is provided between microstrip line L1 and microstrip line L3 to isolate crosstalk between radio frequency signals of the same frequency. A fourth metal isolation strip D1 can be provided between microstrip line L1 and microstrip line L2 to isolate crosstalk between radio frequency signals of different frequencies.

[0109] Figure 18 This is a schematic diagram of a structure of the present invention, in which a fifth metal isolation strip and a sixth metal isolation strip are provided between microstrip line L1 and microstrip line L2, as shown in the figure. Figure 18As shown, in an exemplary embodiment, for example, in the first layer, a fifth metal isolation strip D2 is disposed between microstrip line L1 and microstrip line L2. In the second layer, a sixth metal isolation strip D3 is disposed between microstrip line L1 and microstrip line L2. The fifth metal isolation strip D2 and the sixth metal isolation strip D3 can be connected and grounded through vias. The fifth metal isolation strip D2 and the sixth metal isolation strip D3 can be obtained from copper plating layers on corresponding layers of the printed circuit board, respectively. Alternatively, the fifth metal isolation strip D2 and the sixth metal isolation strip D3 can be metal patches laid on corresponding layers of the printed circuit board. For example, the fifth metal isolation strip D2 is disposed on the first layer, and a mounting groove is formed on the surface of the first layer so that the fifth metal isolation strip D2 is disposed within the mounting groove, making the surface of the fifth metal isolation strip D2 flush with the surface of the first layer. The sixth metal isolation strip D3 is disposed on the second layer, and a mounting groove is formed on the surface of the second layer so that the sixth metal isolation strip D3 is disposed within the mounting groove, making the surface of the sixth metal isolation strip D3 flush with the surface of the second layer. Alternatively, a clearance groove can be provided on the surface of the first layer plate facing the second layer plate. When the first layer plate and the second layer plate are pressed together, the portion of the sixth metal spacer strip D3 that is higher than the surface of the second layer plate can be located in the clearance groove.

[0110] Figure 19 This is a schematic diagram of one embodiment of the present invention, in which a second and a third metal isolation strip are provided between microstrip lines L1 and L3, and a fifth and a sixth metal isolation strip are provided between microstrip lines L1 and L2. Figure 19As shown, in one exemplary embodiment, for example, a layer in a printed circuit board may contain microstrip lines (microstrip line L1 and microstrip line L3) transmitting radio frequency signals of the same frequency and microstrip lines (microstrip line L2) transmitting radio frequency signals of different frequencies. For example, in the first layer, a second metal isolation strip C2 is disposed between microstrip line L1 and microstrip line L3. In the second layer, a third metal isolation strip C3 is disposed between microstrip line L1 and microstrip line L3. The second metal isolation strip C2 and the third metal isolation strip C3 can be connected and grounded through vias. The second metal isolation strip C2 and the third metal isolation strip C3 can be obtained from copper plating layers on corresponding layers of the printed circuit board, respectively. Alternatively, the second metal isolation strip C2 and the third metal isolation strip C3 can be metal patches laid on corresponding layers of the printed circuit board. For example, a second metal spacer C2 is disposed on the first layer plate, and a mounting groove is formed on the surface of the first layer plate so that the second metal spacer C2 is disposed within the mounting groove, making the surface of the second metal spacer C2 flush with the surface of the first layer plate. A third metal spacer C3 is disposed on the second layer plate, and a mounting groove is formed on the surface of the second layer plate so that the third metal spacer C3 is disposed within the mounting groove, making the surface of the third metal spacer C3 flush with the surface of the second layer plate. Alternatively, a clearance groove is provided on the surface of the first layer plate facing the second layer plate, so that when the first and second layers plates are pressed together, the portion of the third metal spacer C3 that is above the surface of the second layer plate is located within the clearance groove.

[0111] Furthermore, in the first layer, a fifth metal isolation strip D2 is disposed between microstrip line L1 and microstrip line L2. In the second layer, a sixth metal isolation strip D3 is disposed between microstrip line L1 and microstrip line L2. The fifth metal isolation strip D2 and the sixth metal isolation strip D3 can be connected and grounded via vias. The fifth metal isolation strip D2 and the sixth metal isolation strip D3 can be obtained from copper plating layers on corresponding layers of the printed circuit board. Alternatively, the fifth metal isolation strip D2 and the sixth metal isolation strip D3 can be metal patches laid on corresponding layers of the printed circuit board. For example, the fifth metal isolation strip D2 is disposed on the first layer, and a mounting groove is formed on the surface of the first layer so that the fifth metal isolation strip D2 is disposed within the mounting groove, making its surface flush with the surface of the first layer. The sixth metal isolation strip D3 is disposed on the second layer, and a mounting groove is formed on the surface of the second layer so that the sixth metal isolation strip D3 is disposed within the mounting groove, making its surface flush with the surface of the second layer. Alternatively, a clearance groove can be provided on the surface of the first layer plate facing the second layer plate. When the first layer plate and the second layer plate are pressed together, the portion of the sixth metal spacer strip D3 that is higher than the surface of the second layer plate can be located in the clearance groove.

[0112] Therefore, the second metal isolation strip C2 and the third metal isolation strip C3 can be used to isolate crosstalk between microstrip lines L1 and L3 for radio frequency signals of the same frequency. The fifth metal isolation strip D2 and the sixth metal isolation strip D3 can be used to isolate crosstalk between microstrip lines L1 and L2 for radio frequency signals of different frequencies.

[0113] Figure 20 This is a schematic diagram of the sixth metal partition strip located on the cover plate according to an embodiment of the present invention, as shown below. Figure 20 As shown, in one exemplary embodiment, a fifth metal isolation strip D2 is disposed between microstrip line L1 and microstrip line L2 on a layer of a printed circuit board. An opening is provided on the side of a cover plate E closest to the printed circuit board to accommodate it. The cover plate E is made of a metallic material and is conductive. A sixth metal isolation strip D3 is disposed within the opening of the cover plate E. The sixth metal isolation strip D3 can be detachably connected to the cover plate E or integrally formed. When the printed circuit board is located within the opening of the cover plate E, the fifth metal isolation strip D2 and the sixth metal isolation strip D3 are in contact to form a "metal isolation wall" between microstrip line L1 and microstrip line L2. The metallic material has a shielding effect on radio frequency signals, effectively shielding part of the radio frequency signal leakage spatially. From the perspective of signal transmission path, this increases the transmission path, resulting in greater energy loss. For example, the radio frequency signal transmitted on microstrip line L1 loses most of its energy when coupled to microstrip line L2, thus reducing mutual coupling crosstalk and improving isolation.

[0114] Figure 21 This is another schematic diagram of an embodiment of the present invention, in which a second metal isolation strip and a third metal isolation strip are provided between microstrip line L1 and microstrip line L3, and a fifth metal isolation strip and a sixth metal isolation strip are provided between microstrip line L1 and microstrip line L2, as shown in the diagram. Figure 21As shown, in one exemplary embodiment, a layer on a printed circuit board may contain microstrip lines (microstrip lines L1 and L3) transmitting radio frequency signals of the same frequency and microstrip lines (microstrip lines L2 and L1) transmitting radio frequency signals of different frequencies. For example, on a layer on the printed circuit board, a second metal isolation strip C2 is disposed between microstrip lines L1 and L3. Inside a cover plate E, the side of the cover plate E closest to the printed circuit board has an opening to accommodate the printed circuit board. The cover plate E is made of a metallic material and is conductive. A third metal isolation strip C3 is disposed within the opening of the cover plate E. The third metal isolation strip C3 can be detachably connected to the cover plate E or integrally formed. When the printed circuit board is located within the opening of the cover plate E, the second metal isolation strip C2 and the third metal isolation strip C3 contact each other to form a "metal isolation wall" between microstrip lines L1 and L3. The metallic material has a shielding effect on radio frequency signals, effectively shielding part of the radio frequency signal leakage spatially. From the perspective of signal transmission paths, the increased transmission paths result in greater energy loss. For example, the RF signal transmitted on microstrip line L1 loses most of its energy when coupled to microstrip line L3, thus reducing mutual coupling crosstalk and improving isolation.

[0115] Furthermore, on one layer of the printed circuit board, a fifth metal isolation strip D2 is disposed between microstrip line L1 and microstrip line L2. Inside the cover plate E, the side of the cover plate E closest to the printed circuit board has an opening to accommodate the printed circuit board. The cover plate E is made of metal and is conductive. A sixth metal isolation strip D3 is disposed within the opening of the cover plate E. The sixth metal isolation strip D3 can be detachably connected to the cover plate E or integrally formed. When the printed circuit board is located within the opening of the cover plate E, the fifth metal isolation strip D2 and the sixth metal isolation strip D3 are in contact, forming a "metal isolation wall" between microstrip line L1 and microstrip line L2. The metal material has a shielding effect on radio frequency signals, effectively shielding part of the radio frequency signal leakage spatially. From the perspective of signal transmission path, this increases the transmission path, resulting in greater energy loss. For example, the radio frequency signal transmitted on microstrip line L1 loses most of its energy when coupled to microstrip line L2, thus reducing mutual coupling crosstalk and improving isolation.

[0116] Therefore, the second metal isolation strip C2 and the third metal isolation strip C3 can be used to isolate crosstalk between microstrip lines L1 and L3 for radio frequency signals of the same frequency. The fifth metal isolation strip D2 and the sixth metal isolation strip D3 can be used to isolate crosstalk between microstrip lines L1 and L2 for radio frequency signals of different frequencies.

[0117] In one embodiment, each isolation module in at least a portion of the second set of isolation modules includes:

[0118] The fourth group of grounding holes includes one or more grounding holes, and the fourth group of grounding holes is set to ground.

[0119] In one exemplary embodiment, in a printed circuit board, a grounding via serves as another form of isolation module. Its grounding function allows the metal portion acting as "ground" to function as an isolation module, utilizing the shielding effect of the metal material on radio frequency signals to achieve isolation of radio frequency signals in the microstrip line. For example, a first set of grounding vias can be used to isolate crosstalk between radio frequency signals of different frequencies between microstrip lines L1 and L2.

[0120] In one embodiment, the fourth set of grounding vias includes multiple grounding vias located between adjacent first and third microstrip lines in a set of microstrip lines. The first and third microstrip lines are configured to transmit radio frequency signals of different frequencies. The multiple grounding vias, the first microstrip lines, and the third microstrip lines are located on the same layer of a printed circuit board, and the multiple grounding vias are randomly arranged between the first and third microstrip lines.

[0121] Figure 22 This is a schematic diagram of the structure of a randomized grounding hole between microstrip line L1 and microstrip line L2 according to an embodiment of the present invention. Figure 22 As shown, in one exemplary embodiment, multiple grounding vias C4 are located between microstrip line L1 and microstrip line L2 on a single layer, and are randomly arranged between microstrip lines L1 and L2. In three-dimensional space, the multiple randomly arranged grounding vias C4 are similar to multiple randomly arranged "metal pillars" to reduce the energy loss of the radio frequency signal transmitted on microstrip line L1 when coupled to microstrip line L2. Therefore, mutual coupling crosstalk is reduced, and isolation is improved.

[0122] In one embodiment, the fourth set of grounding vias includes multiple grounding vias located between adjacent first and third microstrip lines in a set of microstrip lines. The first and third microstrip lines are configured to transmit radio frequency signals of different frequencies. The multiple grounding vias, the first microstrip lines, and the third microstrip lines are located on the same layer of a printed circuit board. The multiple grounding vias are located on one side of one of the first and third microstrip lines and are spaced apart along the extension direction of the microstrip line.

[0123] Figure 23 This is a schematic diagram of a structure in which multiple grounding holes are provided on one side of one of the microstrip lines L1 and L2, according to an embodiment of the present invention. Figure 23As shown, in one exemplary embodiment, for example, multiple grounding vias C4 are provided on the side of microstrip line L1 near microstrip line L2. These vias are spaced apart along the extension direction of microstrip line L1, forming a row of "metal pillars" on the side of microstrip line L1 near microstrip line L2. This improves the energy loss of the radio frequency signal transmitted on microstrip line L1 when coupled to microstrip line L2. Therefore, it reduces crosstalk between radio frequency signals of different frequencies and improves isolation.

[0124] In one embodiment, the adapter circuit board further includes: a fifth set of grounding holes, the fifth set of grounding holes including multiple grounding holes, the fourth set of grounding holes, the fifth set of grounding holes, the first microstrip line and the third microstrip line are located on the same layer of the printed circuit board, and the fifth set of grounding holes are located on the other side of one of the first microstrip lines and the third microstrip line and are spaced apart along the extension direction of the microstrip line.

[0125] Figure 24 This is a schematic diagram of a structure in which multiple grounding holes are also provided on the other side of one of the microstrip lines L1 and L2, according to an embodiment of the present invention. Figure 24 As shown, in an exemplary embodiment, for example, multiple grounding holes C4 are provided on the side of microstrip line L1 near microstrip line L2, and the multiple grounding holes C4 are arranged at intervals along the extension direction of microstrip line L1. Multiple grounding holes C4 are also provided on the side of microstrip line L1 away from microstrip line L2, and the multiple grounding holes are arranged at intervals along the extension direction of microstrip line L1. Therefore, two rows of grounding holes C4 are provided on both sides of microstrip line L1, that is, two rows of "metal pillars" are provided on both sides of microstrip line L1. By utilizing the shielding effect of metal material on radio frequency signals, a dedicated isolation space is created for microstrip line L1, and the effect of isolating microstrip line L1 separately is achieved.

[0126] In one embodiment, the adapter board further includes:

[0127] The third group of grounding holes is located between two adjacent microstrip lines that transmit radio frequency signals of different frequencies. The number of grounding holes included in the second group of grounding holes is greater than the number of grounding holes included in the third group of grounding holes, or the density of grounding holes included in the second group of grounding holes is greater than the density of grounding holes included in the third group of grounding holes.

[0128] Figure 25 This is a schematic diagram of the structure of this utility model embodiment where microstrip lines L1, L2, and L3 are located on the same layer of a board, and a grounding hole is provided, as shown. Figure 25As shown, in one exemplary embodiment, for example, multiple grounding vias C4 are provided on the side of microstrip line L1 near microstrip line L3, and the multiple grounding vias C4 are arranged at intervals along the extension direction of microstrip line L1. These multiple grounding vias C4 can be a second set of grounding vias. Multiple grounding vias C4 are also provided on the side of microstrip line L1 near microstrip line L2, and the multiple grounding vias C4 are arranged at intervals along the extension direction of microstrip line L1. These multiple grounding vias C4 can be a third set of grounding vias. Since microstrip line L1 and microstrip line L2 transmit radio frequency signals of different frequencies, while microstrip line L1 and microstrip line L3 transmit radio frequency signals of the same frequency. Furthermore, if the number of grounding holes C4 included in the second group of grounding holes is greater than the number of grounding holes C4 included in the third group of grounding holes, or if the density of grounding holes C4 included in the second group of grounding holes is greater than the density of grounding holes C4 included in the third group of grounding holes, then the isolation of the microstrip line L1 near the microstrip line L3 from the radio frequency signal is greater than the isolation of the microstrip line L1 near the microstrip line L2 from the radio frequency signal. This ensures the isolation between microstrip lines used to transmit radio frequency signals of the same frequency, thereby reducing the crosstalk between radio frequency signals of the same frequency.

[0129] Figure 26 This is a schematic diagram of the structure of this utility model embodiment, showing the second metal isolation strip located on a layer of the printed circuit board, the third metal isolation strip located on the cover plate E, and the fifth metal isolation strip located on a layer of the printed circuit board and the sixth metal isolation strip located on the cover plate E. Figure 26 As shown, in an exemplary embodiment, for example, multiple microstrip lines L1 and L3 exist on a single layer of a printed circuit board, and the routing paths of microstrip lines L1 and L3 are curved. Therefore, there are multiple second metal isolation strips C2. Correspondingly, multiple third metal isolation strips C3 are provided inside the opening of the cover plate E. The multiple third metal isolation strips C3 combined with the cover plate E can enclose a relatively sealed space, so that the microstrip line L1 or microstrip line L3 is located within the sealed space, thereby achieving the effect of spatially shielding the microstrip line L1 or microstrip line L3 from partial radio frequency signal leakage.

[0130] Furthermore, in the case where multiple microstrip lines L1 and L2 exist on a single layer of the printed circuit board, and the routing paths of microstrip lines L1 and L2 are curved, multiple fifth metal isolation strips D2 are required. Correspondingly, multiple sixth metal isolation strips D3 are provided within the opening of the cover plate E. The multiple sixth metal isolation strips D3, combined with the cover plate E, can enclose a relatively sealed space, allowing microstrip lines L1 or L2 to be located within this sealed space. This achieves the effect of spatially shielding microstrip lines L1 or L2 from partial RF signal leakage.

[0131] Figure 27This is a schematic diagram of the structure on the first layer of the printed circuit board in the case of a multilayer board according to an embodiment of the present invention, as shown below. Figure 27 As shown, in one exemplary embodiment, on the first layer board, the routing paths of microstrip lines L1, L2, and L3 are all curved. A second metal isolation strip C2 is provided between microstrip lines L1 and L3, and a fifth metal isolation strip D2 is provided between microstrip lines L1 and L2. Grounding holes are provided on both sides of microstrip lines L1, L2, and L3. One end of microstrip line L1 is connected to interface A1, and the other end is connected to interface B1. One end of microstrip line L2 is connected to interface A2, and the other end is connected to interface B2. One end of microstrip line L3 is connected to interface A3, and the other end is connected to interface B3.

[0132] Figure 28 This is a schematic diagram of the structure on the middle layer of the printed circuit board in the case of a multilayer board according to an embodiment of this utility model, as shown below. Figure 28 As shown, in one exemplary embodiment, the routing paths of microstrip lines L1, L2, and L3 on the intermediate board are all curved. Grounding holes are provided on both sides of microstrip lines L1, L2, and L3. One end of microstrip line L1 is connected to interface A1, and the other end is connected to interface B1. One end of microstrip line L2 is connected to interface A2, and the other end is connected to interface B2. One end of microstrip line L3 is connected to interface A3, and the other end is connected to interface B3.

[0133] Alternatively, the beginning of microstrip line L1 on the intermediate layer is connected to the end of microstrip line L1 on the first layer. The beginning of microstrip line L2 on the intermediate layer is connected to the end of microstrip line L2 on the first layer. The beginning of microstrip line L3 on the intermediate layer is connected to the end of microstrip line L3 on the first layer. On the intermediate layer, the routing paths of microstrip lines L1, L2, and L3 are all curved. A third metal isolation strip is provided between microstrip lines L1 and L3, and a sixth metal isolation strip is provided between microstrip lines L1 and L2. Grounding holes are provided on both sides of microstrip lines L1, L2, and L3.

[0134] Figure 29 This is a schematic diagram of the structure on the last layer of the printed circuit board in the case of a multilayer board according to an embodiment of this utility model, as shown below. Figure 29As shown, in one exemplary embodiment, the routing paths of microstrip lines L1, L2, and L3 on the last layer are all curved. Grounding vias are provided on both sides of microstrip lines L1, L2, and L3. One end of microstrip line L1 is connected to interface A1, and the other end is connected to interface B1. One end of microstrip line L2 is connected to interface A2, and the other end is connected to interface B2. One end of microstrip line L3 is connected to interface A3, and the other end is connected to interface B3.

[0135] Alternatively, the beginning of microstrip line L1 on the last layer is connected to the end of microstrip line L1 on the middle layer. The beginning of microstrip line L2 on the last layer is connected to the end of microstrip line L2 on the middle layer. The beginning of microstrip line L3 on the last layer is connected to the end of microstrip line L3 on the middle layer. On the last layer, the routing paths of microstrip lines L1, L2, and L3 are all curved. A third metal isolation strip is provided between microstrip lines L1 and L3, and a sixth metal isolation strip is provided between microstrip lines L1 and L2. Grounding holes are provided on both sides of microstrip lines L1, L2, and L3. The ends of microstrip lines L1, L2, and L3 are provided for connection to a second type of RF connector.

[0136] This embodiment also provides an adapter module, which includes:

[0137] Such as the adapter board mentioned above;

[0138] The first group of RF connectors, each of which is a first type of RF connector and is connected to one of the interfaces in the first group of interfaces, is configured to be connected to an antenna module.

[0139] The second group of RF connectors, each of which is a second type of RF connector and is connected to one of the interfaces in the second group of interfaces, is configured to be connected to a positioning module.

[0140] Each microstrip line in a set of microstrip lines is connected to an RF connector in the first set of RF connectors through one of the interfaces in the first set of interfaces, and to an RF connector in the second set of RF connectors through one of the interfaces in the second set of interfaces. The RF signal transmitted by each microstrip line in the set of microstrip lines is the RF signal transmitted between the antenna module connected to the RF connector in the first set of RF connectors and the positioning module connected to the RF connector in the second set of RF connectors.

[0141] Figure 30According to the structural schematic diagram of the adapter module in the embodiment of this utility model, as shown below Figure 30 As shown, in one exemplary embodiment, the first set of RF connectors may include RF connector R1, RF connector R2, and RF connector R3. RF connector R1 is connected to interface A1, RF connector R2 is connected to interface A2, and RF connector R3 is connected to interface A3. The second set of RF connectors may include RF connector T1, RF connector T2, and RF connector T3. RF connector T1 is connected to interface B1, RF connector T2 is connected to interface B2, and RF connector T3 is connected to interface B3. A microstrip line L1 connects interface A1 and interface B1, a microstrip line L2 connects interface A2 and interface B2, and a microstrip line L3 connects interface A3 and interface B3.

[0142] In one embodiment, each RF connector in the first group of RF connectors is configured to connect to a different antenna module, and each RF connector in the second group of RF connectors is configured to connect to a different positioning module.

[0143] Figure 31 According to one structural schematic diagram of the adapter module according to an embodiment of the present utility model, as shown below... Figure 31 As shown, in one exemplary embodiment, the antenna module may include antenna module P1, antenna module P2, and antenna module P3. Antenna module P1 is connected to RF connector R1, allowing RF signals to be transmitted between antenna module P1 and microstrip line L1 via RF connector R1. Antenna module P2 is connected to RF connector R2, allowing RF signals to be transmitted between antenna module P2 and microstrip line L2 via RF connector R2. Antenna module P3 is connected to RF connector R3, allowing RF signals to be transmitted between antenna module P3 and microstrip line L3 via RF connector R3.

[0144] The positioning module may include positioning module Q1, positioning module Q2, and positioning module Q3. Positioning module Q1 is connected to RF connector T1, enabling the transmission of RF signals between positioning module Q1 and microstrip line L1 via RF connector T1. Positioning module Q2 is connected to RF connector T2, enabling the transmission of RF signals between positioning module Q2 and microstrip line L2 via RF connector T2. Positioning module Q3 is connected to RF connector T3, enabling the transmission of RF signals between positioning module Q3 and microstrip line L3 via RF connector T3.

[0145] In one embodiment, each RF connector in the first group of RF connectors is configured to connect to an interface in the same antenna module, and each RF connector in the second group of RF connectors is configured to connect to an interface in the same positioning module.

[0146] In this group of microstrip lines, the radio frequency signal transmitted by each microstrip line is the radio frequency signal transmitted between an interface in the same antenna module and an interface in the same positioning module.

[0147] Figure 32 According to another structural schematic diagram of the adapter module according to an embodiment of the present utility model, as shown below: Figure 32 As shown, in one exemplary embodiment, for example, the antenna module may include antenna module P1, and antenna module P1 includes interface P 11 Interface P 12 Interface P 13 Among them, the RF connector R1 and the interface P 11 For connection, it can be achieved through RF connector R1 and interface P. 11 Radio frequency (RF) signals are transmitted between antenna module P1 and microstrip line L1. RF connector R2 connects to interface P. 12 For connection, it can be connected to interface P via RF connector R2. 12 Radio frequency (RF) signals are transmitted between antenna module P1 and microstrip line L2. RF connector R3 connects to interface P. 13 For connection, it can be connected to interface P via RF connector R3. 13 Radio frequency signals are transmitted between antenna module P1 and microstrip line L3.

[0148] The positioning module may include positioning module Q1, and positioning module Q1 includes interface Q. 11 Interface Q 12 Interface Q 13 Among them, the RF connector T1 and the interface Q 11 For connection, it can be connected to interface Q via RF connector T1. 11 Radio frequency (RF) signals are transmitted between positioning module Q1 and microstrip line L1. RF connector T2 connects to interface Q. 12 For connection, it can be connected to interface Q via RF connector T2. 12 Radio frequency (RF) signals are transmitted between positioning module Q1 and microstrip line L2. RF connector T3 connects to interface Q. 13 For connection, it can be connected to interface Q via RF connector T3. 13 Radio frequency signals are transmitted between positioning module Q1 and microstrip line L3.

[0149] This embodiment also provides an adapter, which includes:

[0150] Such as any of the above-mentioned adapter modules;

[0151] A set of antenna modules, comprising one or more antenna modules; in the case where a set of antenna modules comprises one antenna module, each RF connector in the first set of RF connectors is connected to an interface in one antenna module; in the case where a set of antenna modules comprises multiple antenna modules, each RF connector in the first set of RF connectors is connected to one antenna module in the multiple antenna modules.

[0152] Figure 33 According to one structural schematic diagram of the adapter device according to an embodiment of the present utility model, such as... Figure 33 As shown, in one exemplary embodiment, the antenna module may include antenna module P1, antenna module P2, and antenna module P3. Antenna module P1 is connected to RF connector R1, allowing RF signals to be transmitted between antenna module P1 and microstrip line L1 via RF connector R1. Antenna module P2 is connected to RF connector R2, allowing RF signals to be transmitted between antenna module P2 and microstrip line L2 via RF connector R2. Antenna module P3 is connected to RF connector R3, allowing RF signals to be transmitted between antenna module P3 and microstrip line L3 via RF connector R3.

[0153] Figure 34 According to another structural schematic diagram of the adapter device according to an embodiment of the present utility model, as shown below: Figure 34 As shown, in one exemplary embodiment, for example, the antenna module may include antenna module P1, and antenna module P1 includes interface P 11 Interface P 12 Interface P 13 Among them, the RF connector R1 and the interface P 11 For connection, it can be achieved through RF connector R1 and interface P. 11 Radio frequency (RF) signals are transmitted between antenna module P1 and microstrip line L1. RF connector R2 connects to interface P. 12 For connection, it can be connected to interface P via RF connector R2. 12 Radio frequency (RF) signals are transmitted between antenna module P1 and microstrip line L2. RF connector R3 connects to interface P. 13 For connection, it can be connected to interface P via RF connector R3. 13 Radio frequency signals are transmitted between antenna module P1 and microstrip line L3.

[0154] This embodiment also provides an adapter, which includes:

[0155] Such as any of the above-mentioned adapter modules;

[0156] A set of positioning modules, comprising one or more positioning modules; in the case where a set of positioning modules comprises one positioning module, each RF connector in the second set of RF connectors is connected to an interface in one positioning module; in the case where a set of positioning modules comprises multiple positioning modules, each RF connector in the second set of RF connectors is connected to one positioning module in the multiple positioning modules.

[0157] Figure 35 According to one structural schematic diagram of the adapter device according to an embodiment of the present utility model, such as... Figure 35 As shown, in one exemplary embodiment, the positioning module may include positioning module Q1, positioning module Q2, and positioning module Q3. Positioning module Q1 is connected to RF connector T1, enabling the transmission of RF signals between positioning module Q1 and microstrip line L1 via RF connector T1. Positioning module Q2 is connected to RF connector T2, enabling the transmission of RF signals between positioning module Q2 and microstrip line L2 via RF connector T2. Positioning module Q3 is connected to RF connector T3, enabling the transmission of RF signals between positioning module Q3 and microstrip line L3 via RF connector T3.

[0158] Figure 36 According to another structural schematic diagram of the adapter device according to an embodiment of the present utility model, as shown below: Figure 36 As shown, in one exemplary embodiment, for example, the positioning module may include positioning module Q1, which includes interface Q. 11 Interface Q 12 Interface Q 13 Among them, the RF connector T1 and the interface Q 11 For connection, it can be connected to interface Q via RF connector T1. 11 Radio frequency (RF) signals are transmitted between positioning module Q1 and microstrip line L1. RF connector T2 connects to interface Q. 12 For connection, it can be connected to interface Q via RF connector T2. 12 Radio frequency (RF) signals are transmitted between positioning module Q1 and microstrip line L2. RF connector T3 connects to interface Q. 13 For connection, it can be connected to interface Q via RF connector T3. 13 Radio frequency signals are transmitted between positioning module Q1 and microstrip line L3.

[0159] This embodiment also provides an adapter device, which includes:

[0160] Such as any of the above-mentioned adapter modules;

[0161] A set of antenna modules, comprising one or more antenna modules; in the case where a set of antenna modules comprises one antenna module, each RF connector in the first set of RF connectors is connected to an interface in one antenna module; in the case where a set of antenna modules comprises multiple antenna modules, each RF connector in the first set of RF connectors is connected to one antenna module in the multiple antenna modules.

[0162] A set of positioning modules, comprising one or more positioning modules; in the case where a set of positioning modules comprises one positioning module, each RF connector in the second set of RF connectors is connected to an interface in one positioning module; in the case where a set of positioning modules comprises multiple positioning modules, each RF connector in the second set of RF connectors is connected to one positioning module in the multiple positioning modules.

[0163] Figure 37 According to one structural schematic diagram of the adapter device according to an embodiment of the present utility model, such as... Figure 37 As shown, in one exemplary embodiment, the antenna module may include antenna module P1, antenna module P2, and antenna module P3. Antenna module P1 is connected to RF connector R1, allowing RF signals to be transmitted between antenna module P1 and microstrip line L1 via RF connector R1. Antenna module P2 is connected to RF connector R2, allowing RF signals to be transmitted between antenna module P2 and microstrip line L2 via RF connector R2. Antenna module P3 is connected to RF connector R3, allowing RF signals to be transmitted between antenna module P3 and microstrip line L3 via RF connector R3.

[0164] The positioning module may include positioning module Q1, positioning module Q2, and positioning module Q3. Positioning module Q1 is connected to RF connector T1, enabling the transmission of RF signals between positioning module Q1 and microstrip line L1 via RF connector T1. Positioning module Q2 is connected to RF connector T2, enabling the transmission of RF signals between positioning module Q2 and microstrip line L2 via RF connector T2. Positioning module Q3 is connected to RF connector T3, enabling the transmission of RF signals between positioning module Q3 and microstrip line L3 via RF connector T3.

[0165] Figure 38 According to another structural schematic diagram of the adapter device according to an embodiment of the present utility model, as shown below... Figure 38 As shown, for example, an antenna module may include an antenna module P1, and the antenna module P1 includes an interface P 11 Interface P 12 Interface P 13 Among them, the RF connector R1 and the interface P 11 For connection, it can be achieved through RF connector R1 and interface P.11 Radio frequency (RF) signals are transmitted between antenna module P1 and microstrip line L1. RF connector R2 connects to interface P. 12 For connection, it can be connected to interface P via RF connector R2. 12 Radio frequency (RF) signals are transmitted between antenna module P1 and microstrip line L2. RF connector R3 connects to interface P. 13 For connection, it can be connected to interface P via RF connector R3. 13 Radio frequency signals are transmitted between antenna module P1 and microstrip line L3.

[0166] The positioning module may include positioning module Q1, and positioning module Q1 includes interface Q. 11 Interface Q 12 Interface Q 13 Among them, the RF connector T1 and the interface Q 11 For connection, it can be connected to interface Q via RF connector T1. 11 Radio frequency (RF) signals are transmitted between positioning module Q1 and microstrip line L1. RF connector T2 connects to interface Q. 12 For connection, it can be connected to interface Q via RF connector T2. 12 Radio frequency (RF) signals are transmitted between positioning module Q1 and microstrip line L2. RF connector T3 connects to interface Q. 13 For connection, it can be connected to interface Q via RF connector T3. 13 Radio frequency signals are transmitted between positioning module Q1 and microstrip line L3.

[0167] The above description is merely a preferred embodiment of this utility model and is not intended to limit the scope of this utility model. Various modifications and variations can be made to this utility model by those skilled in the art. Any modifications, equivalent substitutions, or improvements made within the principles of this utility model should be included within the protection scope of this utility model.

Claims

1. A converter circuit board, characterized in that, include: The first set of interfaces, each of which is configured to connect to a first type of RF connector; The second set of interfaces, each of which is configured to connect to a second type of RF connector; A printed circuit board, the printed circuit board comprising one or more layers of board; A set of microstrip lines, wherein each microstrip line in the set of microstrip lines is located on a layer of the printed circuit board and is connected to an interface in the first set of interfaces and an interface in the second set of interfaces, and is configured to transmit radio frequency signals between the interface in the first set of interfaces and the interface in the second set of interfaces; In the case where multiple microstrip lines are present on the same layer of the printed circuit board, the distance between two adjacent microstrip lines that transmit radio frequency signals of the same frequency is greater than the distance between two adjacent microstrip lines that transmit radio frequency signals of different frequencies.

2. The adapter circuit board according to claim 1, characterized in that, The set of microstrip lines includes a first portion of microstrip lines, wherein each microstrip line in the first portion of microstrip lines is connected at both ends to an interface in the first group of interfaces and an interface in the second group of interfaces, respectively. and / or The set of microstrip lines includes a second part of microstrip lines, in which multiple microstrip lines are connected end to end in sequence to form a series microstrip line. The two ends of the series microstrip line are respectively connected to an interface in the first group of interfaces and an interface in the second group of interfaces. The multiple microstrip lines in the second part of microstrip lines are located on at least two layers of the printed circuit board.

3. The adapter circuit board according to claim 1, characterized in that, Also includes: The first group of isolation modules includes one or more isolation modules. Each isolation module in the first group of isolation modules is located between the two adjacent microstrip lines that transmit radio frequency signals of the same frequency, and is configured to isolate the magnetic field generated by the two adjacent microstrip lines that transmit radio frequency signals of the same frequency.

4. The adapter circuit board according to claim 3, characterized in that, Each isolation module in at least a portion of the first group of isolation modules includes: A first metal isolating strip is located between adjacent first and second microstrip lines in the group of microstrip lines. The first and second microstrip lines are configured to transmit radio frequency signals of the same frequency. The first metal isolating strip, the first microstrip line, and the second microstrip line are located on the same layer of the printed circuit board; or A second metal isolation strip and a third metal isolation strip, the second metal isolation strip being located between adjacent first and second microstrip lines in the group of microstrip lines, the first and second microstrip lines being configured to transmit radio frequency signals of the same frequency, the first metal isolation strip, the first microstrip line and the second microstrip line being located on the same layer of the printed circuit board, the third metal isolation strip being in contact with the second metal isolation strip, the third metal isolation strip being located on a layer of the printed circuit board adjacent to the same layer, or on a cover plate, wherein the adapter circuit board further includes the cover plate.

5. The adapter circuit board according to claim 3, characterized in that, Each isolation module in at least a portion of the first group of isolation modules includes: The first group of grounding holes includes one or more grounding holes, and the first group of grounding holes is configured to be grounded.

6. The adapter circuit board according to claim 5, characterized in that, The first group of grounding vias includes the plurality of grounding vias located between adjacent first and second microstrip lines in the group of microstrip lines. The first and second microstrip lines are configured to transmit radio frequency signals of the same frequency. The plurality of grounding vias, the first microstrip lines, and the second microstrip lines are located on the same layer of the printed circuit board. The plurality of grounding vias are randomly arranged between the first and second microstrip lines.

7. The adapter circuit board according to claim 5, characterized in that, The first group of grounding vias includes the plurality of grounding vias located between adjacent first and second microstrip lines in the group of microstrip lines. The first and second microstrip lines are configured to transmit radio frequency signals of the same frequency. The plurality of grounding vias, the first microstrip line, and the second microstrip line are located on the same layer of the printed circuit board. The plurality of grounding vias are located on one side of one of the first and second microstrip lines and are spaced apart along the extension direction of the microstrip line.

8. The adapter circuit board according to claim 7, characterized in that, Also includes: The second group of grounding holes includes multiple grounding holes. The first group of grounding holes, the second group of grounding holes, the first microstrip line, and the second microstrip line are located on the same layer of the printed circuit board. The second group of grounding holes is located on the other side of one of the first microstrip lines and the second microstrip line, and is spaced apart along the extension direction of the microstrip line.

9. The adapter circuit board according to claim 5, characterized in that, Also includes: The third set of grounding holes is located between the two adjacent microstrip lines that transmit radio frequency signals of different frequencies. The number of grounding holes included in the second set of grounding holes is greater than the number of grounding holes included in the third set of grounding holes, or the density of grounding holes included in the second set of grounding holes is greater than the density of grounding holes included in the third set of grounding holes.

10. The adapter circuit board according to claim 3, characterized in that, Also includes: The second group of isolation modules includes one or more isolation modules. Each isolation module in the second group of isolation modules is located between the two adjacent microstrip lines that transmit radio frequency signals of different frequencies, and is configured to isolate the magnetic field generated by the two adjacent microstrip lines that transmit radio frequency signals of different frequencies.

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