Electroplating film-attached circuit board production apparatus and circuit board production system

Abstract

The present disclosure provides a circuit board production equipment and system capable of reducing the plating film clamping, which comprises a plating device and a dry film stripping device. The plating device comprises a first plate feeding mechanism, a plating tank and a pulse plating controller. The dry film stripping device comprises a second plate feeding mechanism, a stripping tank, a film residue filtering mechanism, a stripping liquid circulation control mechanism, a stripping monitoring sensor group, a stripping control box and a plate discharging mechanism. The pulse plating controller is used to switch the current between the on and off, and the plating parameters are controllable by setting the plating parameters. The temperature controller and the conveying rate controller are used to set the stripping temperature and the conveying rate of the stripping section, so as to fully strip the circuit board, reduce the surface tension of the dry film, quickly penetrate into the film clamping layer, soften and dissolve part of the dry film residue, and make the adhesion between the dry film and the copper layer disappear, thereby achieving the purpose of effectively removing the film clamping.

Description

Technical Field

[0001] This disclosure relates to the field of circuit board manufacturing technology, and in particular to a circuit board manufacturing equipment and system that can reduce the need for electroplating film. Background Technology

[0002] In the process of circuit board production, electroplating film is often involved. Electroplating film is a common phenomenon, but it is quite difficult to deal with. As electronic devices continue to develop towards high-density integration that is light, thin, short, and small, the requirements for electroplating precision and quality are becoming higher and higher, and the problem of electroplating film is becoming more and more prominent.

[0003] When the surface of a circuit board with a dry film is over-plated, the contact area between the stripping solution and the dry film decreases during the stripping process, resulting in some dry film residue remaining on the circuit board after stripping. Furthermore, the presence of plating film trapping leads to uneven etching in subsequent processes, causing burrs, jagged edges, or copper residue on the circuit edges, affecting signal transmission and electrical performance. More seriously, film trapping can cause batch defects, increasing rework or scrap rates and directly impacting production efficiency and costs. Therefore, it is necessary to control the surface plating speed of the circuit board.

[0004] In addition, when stripping the film from the circuit board, the interaction between the stripping solution and the dry film will generate a certain amount of film residue. When the film residue accumulates too much, it will interfere with the stripping process of the circuit board and needs to be removed. However, removing the film residue will also take away some of the stripping solution, which means that new stripping solution needs to be added continuously, which will lead to a waste of resources.

[0005] Therefore, it is necessary to design an effective device for removing electroplated film by combining the electroplating and film removal steps. Utility Model Content

[0006] The purpose of this disclosure is to overcome the shortcomings of the prior art and provide a circuit board production equipment and system that can effectively control the electroplating rate, stripping temperature and conveying rate to reduce the probability of electroplating film entrapment on the circuit board surface.

[0007] The purpose of this disclosure is achieved through the following technical solution:

[0008] A circuit board manufacturing equipment that reduces the amount of film sandwiched in electroplating includes an electroplating device and a dry film stripping device. The electroplating device includes a first board feeding mechanism, an electroplating tank, and a pulse electroplating controller. The first board feeding mechanism is connected to the inlet end of the electroplating tank. The control end of the pulse electroplating controller is electrically connected to the electroplating controlled end of the electroplating tank. The pulse electroplating controller is used to set electroplating parameters. The dry film stripping device includes a second board feeding mechanism, a stripping tank, a film residue filtration mechanism, a stripping solution circulation control mechanism, a stripping monitoring sensor group, a stripping control box, and a board exit mechanism. The second board feeding mechanism is connected to both the outlet end of the electroplating tank and the inlet end of the stripping tank. The board exit mechanism is connected to the outlet end of the stripping tank.

[0009] The membrane sludge filtration mechanism includes a membrane sludge filter cylinder and a membrane sludge filter screen. The membrane removal tank is provided with a drainage channel, which is connected to the membrane sludge filter cylinder. The membrane sludge filter screen is connected to the inner wall of the membrane sludge filter cylinder.

[0010] The membrane stripping solution circulation control mechanism includes a circulation pipe, a control pump, and a nozzle. One end of the circulation pipe is connected to the side of the membrane sludge filter cylinder that is sequentially away from the drainage channel and the membrane sludge filter screen. The other end of the circulation pipe is connected to the nozzle. The control pump is mounted on the circulation pipe.

[0011] The film removal monitoring sensor group includes a temperature control sensor and a flow control sensor, and the nozzle, the temperature control sensor and the flow control sensor are all installed in the film removal tank;

[0012] The film removal control box includes a box body, a temperature controller, and a conveying rate controller. The control terminal of the temperature controller is electrically connected to the temperature control sensor, and the control terminal of the conveying rate controller is electrically connected to the conveying control sensor.

[0013] In one embodiment, the first plate feeding mechanism includes a first plate feeding roller array and a first plate feeding bracket, the first plate feeding roller array being installed inside the first plate feeding bracket, and the first plate feeding bracket being connected to the inlet end of the electroplating tank.

[0014] In one embodiment, the first feed roller row includes a plurality of first feed roller units, which are mounted on the inner side of the first feed roller bracket.

[0015] In one embodiment, the number of the electroplating tank and the pulse electroplating controller are both multiple and equal.

[0016] In one embodiment, the second infeed mechanism includes a second infeed roller array and a second infeed bracket, the second infeed roller array being installed inside the second infeed bracket, and the second infeed bracket being connected to the inlet end of the film removal tank.

[0017] In one embodiment, the second feed roller row includes a plurality of second feed roller units, which are mounted on the inner side of the second feed roller bracket.

[0018] In one embodiment, the number of the membrane stripping tank, the membrane sludge filtration mechanism, the membrane stripping liquid circulation control mechanism, and the membrane stripping monitoring sensor group are all multiple and equal.

[0019] In one embodiment, the circuit board production equipment that reduces electroplating film overlap further includes a washing device, the inlet of which is connected to the outlet of the film removal tank, and the outlet of which is connected to the board unloading mechanism.

[0020] In one embodiment, the washing device includes a washing tank and a washing controller. The washing controller is disposed on the washing tank. The inlet end of the washing tank is connected to the outlet end of the film removal tank, and the outlet end of the washing tank is connected to the plate dispensing mechanism.

[0021] A circuit board production system includes the circuit board production equipment described in any of the above embodiments that can reduce the amount of film sandwiched in the electroplating process.

[0022] Compared with the prior art, this disclosure has at least the following advantages:

[0023] 1. When electroplating circuit boards with dry film, the current switches between on and off due to the use of a pulse electroplating controller. By setting the electroplating parameters, the electroplating parameters of the circuit board can be controlled, reducing the problem of film trapping caused by the large differences in the distribution of independent hole rings and circuit patterns between independent lines / independent holes.

[0024] 2. When performing the stripping process on the circuit board, since a temperature controller and a conveying speed controller are set, the stripping temperature and the conveying speed of the stripping section can be set to fully strip the circuit board at a suitable temperature, reduce the surface tension of the dry film, quickly penetrate into the interlayer film, soften and dissolve some of the dry film residue, and make the adhesion between the dry film and the copper layer disappear, thereby achieving the purpose of effectively removing the interlayer film.

[0025] 3. Since the dry film stripping device is equipped with a membrane sludge filter cylinder and a membrane sludge filter screen, if the stripping solution is recycled, the generated membrane sludge will be filtered out through the membrane sludge filter screen and then returned to the stripping tank through the circulation pipe and nozzle. This can realize the recycling of the stripping solution, ensure the stripping efficiency of the circuit board, and prevent the membrane sludge from clogging the circulation pipe or nozzle. Attached Figure Description

[0026] To more clearly illustrate the technical solutions of the embodiments of this disclosure, the accompanying drawings used in the embodiments will be briefly described below. It should be understood that the following drawings only show some embodiments of this disclosure and should not be regarded as a limitation of the scope. For those skilled in the art, other related drawings can be obtained based on these drawings without creative effort.

[0027] Figure 1 This is a schematic diagram of a circuit board manufacturing equipment that can reduce the amount of electroplating film in one embodiment;

[0028] Figure 2 for Figure 1 The diagram shows the structure of the electroplating unit in the circuit board manufacturing equipment.

[0029] Figure 3 for Figure 1 The diagram shows the structure of the dry film stripping device in the circuit board production equipment.

[0030] Figure 4 for Figure 3 A partial structural schematic diagram of the dry film stripping device is shown;

[0031] Figure 5 This is a schematic diagram of a circuit board manufacturing equipment that can reduce the amount of electroplating film in another embodiment.

[0032] Reference numerals: 10, Circuit board production equipment; 100, Electroplating device; 110, First board feeding mechanism; 111, First board feeding roller row; 112, First board feeding support; 120, Electroplating tank; 130, Pulse electroplating controller; 200, Dry film stripping device; 210, Second board feeding mechanism; 211, Second board feeding roller row; 212, Second board feeding support; 220, Stripping tank; 221, Drainage channel; 230, Membrane residue filtration mechanism; 231, Membrane. 232. Membrane residue filter cylinder; 240. Membrane stripping liquid circulation control mechanism; 241. Circulation pipe; 242. Control pump; 243. Nozzle; 250. Membrane stripping monitoring sensor group; 251. Temperature control sensor; 252. Transport control sensor; 260. Membrane stripping control box; 261. Box body; 262. Temperature controller; 263. Conveying rate controller; 270. Plate discharge mechanism; 300. Washing device; 310. Washing tank; 320. Washing controller. Detailed Implementation

[0033] To facilitate understanding of this disclosure, a more complete description will be given below with reference to the accompanying drawings, which illustrate preferred embodiments of the present disclosure. However, this disclosure can be implemented in many different forms and is not limited to the embodiments described herein. Rather, these embodiments are provided to provide a more thorough and complete understanding of the disclosure.

[0034] It should be noted that when an element is referred to as being "fixed to" another element, it can be directly attached to the other element or there may be an intervening element. When an element is referred to as being "connected to" another element, it can be directly connected to the other element or there may be an intervening element. The terms "vertical," "horizontal," "left," "right," and similar expressions used herein are for illustrative purposes only and do not represent the only possible implementation.

[0035] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this disclosure belongs. The terminology used herein is for the purpose of describing particular embodiments only and is not intended to be limiting of this disclosure. The term "and / or" as used herein includes any and all combinations of one or more of the associated listed items.

[0036] To better understand the technical solutions and beneficial effects of this disclosure, the following detailed description is provided in conjunction with specific embodiments:

[0037] Please see Figure 1 and Figure 2 This invention relates to a circuit board production equipment 10 that reduces the amount of film sandwiched in electroplating, comprising an electroplating device 100 and a dry film stripping device 200. The electroplating device 100 includes a first board loading mechanism 110, an electroplating tank 120, and a pulse electroplating controller 130. The first board loading mechanism 110 is connected to the inlet end of the electroplating tank 120, and the control end of the pulse electroplating controller 130 is electrically connected to the electroplating controlled end of the electroplating tank 120. Specifically, the control end of the pulse electroplating controller 130 is used to output an electroplating signal for electroplating the circuit board. The first board loading mechanism 110 is used to place the circuit board so that the circuit board is driven into the electroplating tank 120. The pulse electroplating controller 130 is used to set electroplating parameters to control the electroplating speed of the circuit board.

[0038] Combination Figure 3 and Figure 4 As shown, the dry film stripping device 200 includes a second board inlet mechanism 210, a stripping tank 220, a membrane residue filtration mechanism 230, a stripping liquid circulation control mechanism 240, a stripping monitoring sensor group 250, a stripping control box 260, and a board outlet mechanism 270. The second board inlet mechanism 210 is connected to the outlet end of the electroplating tank 120 and the inlet end of the stripping tank 220, respectively. The board outlet mechanism 270 is connected to the outlet end of the stripping tank 220. The second board inlet mechanism 210 is used to place the circuit board so that the electroplated circuit board is driven into the stripping tank 220.

[0039] Combination Figure 3 and Figure 4As shown, the membrane sludge filtration mechanism 230 includes a membrane sludge filter cylinder 231 and a membrane sludge filter screen 232. The membrane removal tank 220 is provided with a drainage channel 221, which is connected to the membrane sludge filter cylinder 231. The membrane sludge filter screen 232 is connected to the inner wall of the membrane sludge filter cylinder 231. Specifically, the membrane sludge filter screen 232 can be detachably installed on the inner wall of the membrane sludge filter cylinder 231.

[0040] Combination Figure 3 and Figure 4 As shown, the stripping solution circulation control mechanism 240 includes a circulation pipe 241, a control pump 242, and a nozzle 243. One end of the circulation pipe 241 is connected to the side of the membrane sludge filter cylinder 231 that is sequentially away from the drainage channel 221 and the membrane sludge filter screen 232 (not shown in the figure). The other end of the circulation pipe 241 is connected to the nozzle 243. The control pump 242 is installed on the circulation pipe 241 so that the stripping solution is filtered through the membrane sludge filter screen 232 from the drainage channel 221 and then returned to the stripping tank 220 through the circulation pipe 241 and the nozzle 243, so as to realize the recycling of the stripping solution.

[0041] Combination Figure 3 and Figure 4 As shown, the film removal monitoring sensor group 250 includes a temperature control sensor 251 and a supply control sensor 252. The nozzle 243, the temperature control sensor 251 and the supply control sensor 252 are all installed in the film removal tank 220.

[0042] Combination Figure 3 and Figure 4 As shown, the stripping control box 260 includes a box body 261, a temperature controller 262, and a conveying rate controller 263. The control terminal of the temperature controller 262 is electrically connected to the temperature sensor 251, and the control terminal of the conveying rate controller 263 is electrically connected to the conveying rate sensor 252. The temperature controller 262 is used to set the temperature within the stripping tank 220 to ensure that the stripping of the circuit board occurs at a suitable temperature. The temperature sensor 251 acquires the current temperature and displays the corresponding value in the display area of ​​the temperature controller 262. The conveying rate controller 263 is used to set the speed at which the circuit board is conveyed within the stripping tank 220, ensuring that the stripping solution reacts sufficiently with the dry film on the circuit board at a suitable speed. The conveying rate sensor 252 acquires the conveying rate of the circuit board during stripping and displays the corresponding value in the display area of ​​the conveying rate controller 263 for operator observation.

[0043] In the above embodiments, when electroplating a circuit board with a dry film, the pulse electroplating controller 130 switches the current between on and off. Furthermore, by setting the electroplating parameters, the electroplating parameters of the circuit board are controllable, reducing the problem of film trapping defects caused by large differences in the distribution of independent via rings and circuit patterns between independent lines / vias. In addition, during the film removal step of the circuit board, the presence of a temperature controller 262 and a conveyor speed controller 263 allows for setting the film removal temperature and the conveyor speed of the film removal section, ensuring sufficient film removal of the circuit board at a suitable temperature. The process involves reducing the surface tension of the dry film, allowing it to quickly penetrate the interlayer, soften and dissolve some of the dry film residue, thus eliminating the adhesion between the dry film and the copper layer and effectively removing the interlayer residue. Furthermore, since the dry film stripping device 200 is equipped with a membrane residue filter cylinder 231 and a membrane residue filter screen 232, if the stripping solution is recycled, the generated membrane residue will be filtered out through the membrane residue filter screen 232 and then returned to the stripping tank 220 through the circulation pipe 241 and nozzle 243. This allows for the recycling of the stripping solution, ensures the stripping efficiency of the circuit board, and prevents membrane residue from clogging the circulation pipe 241 or nozzle 243.

[0044] It is understandable that, during the electroplating process, to prevent film trapping caused by over-plating, specific electroplating parameters are set by controlling the pulse electroplating controller 130 according to the specific requirements of the circuit board. For example, 8 ASF × 500 seconds can be used to prevent film trapping caused by excessively thick plating due to excessively fast plating. For outer layer circuits with a line spacing ≤ 0.08 mm, pulse electroplating is used during tin plating, which can effectively reduce the plating thickness and decrease defects caused by film trapping between independent lines / or holes due to large differences in the distribution of independent via rings and circuit patterns. In the stripping process, the stripping temperature and stripping time can be appropriately set. The circuit board conveying rate, for example, setting the stripping temperature to 45-50℃ and the circuit board conveying rate to 3-4 m / min during stripping, ensures sufficient reaction between the stripping solution and the dry film at a suitable temperature. This allows the dry film to detach completely from the circuit board, further reducing the chance of electroplating film bridging. Simultaneously, the generated film sludge will enter the film sludge filter tank 231 through the drainage channel 221 along with some of the stripping solution. The film sludge filter screen 232 will filter out the dry film sludge, preventing it from passing through the circulation pipe 241 and nozzle 243. This prevents the dry film sludge from clogging the circulation pipe 241 and nozzle 243, ensuring efficient circuit board stripping. Furthermore, when the accumulated film sludge reaches a certain level, the film sludge filter screen 232 can be replaced for subsequent sludge removal. It should be noted that the methods used in the electroplating and stripping steps are not the subject of this disclosure; this disclosure only protects the overall equipment.

[0045] like Figure 2As shown, in one embodiment, the first board loading mechanism 110 includes a first board loading roller array 111 and a first board loading bracket 112. The first board loading roller array 111 is installed inside the first board loading bracket 112. Specifically, the first board loading roller array 111 is rotatably connected to the inside of the first board loading bracket 112, and the first board loading bracket 112 is connected to the inlet end of the electroplating tank 120. Thus, when the first board loading roller array 111 is working, it can drive the placed circuit board into the electroplating tank 120, preparing it for the next electroplating step. Further, the first board loading roller array 111 includes multiple first board loading roller units, which are installed inside the first board loading bracket 112.

[0046] like Figure 2 As shown, in one embodiment, there are multiple and equal numbers of electroplating tanks 120 and pulse electroplating controllers 130. Thus, while ensuring a reduced probability of plating film jamming, the circuit board can gradually optimize the uniformity, density, and adhesion of the plating layer through multiple pulse electroplating processes.

[0047] like Figure 3 As shown, in one embodiment, the second board feeding mechanism 210 includes a second board feeding roller array 211 and a second board feeding bracket 212. The second board feeding roller array 211 is installed inside the second board feeding bracket 212, and the second board feeding bracket 212 is connected to the inlet end of the stripping tank 220. Thus, when the second board feeding roller array 211 is working, it can drive the placed circuit board into the stripping tank 220, preparing it for the next two electroplating steps. Further, the second board feeding roller array 211 includes multiple second board feeding roller units, which are installed inside the second board feeding bracket 212.

[0048] Combination Figure 3 and Figure 4 As shown, in one embodiment, the number of stripping tanks 220, membrane sludge filtration mechanisms 230, stripping liquid circulation control mechanisms 240, and stripping monitoring sensor groups 250 are all multiple and equal. Thus, the stripping temperature and circuit board conveying speed set in each stripping tank are equal. Under constant stripping temperature and circuit board conveying speed, the circuit board can pass through multiple stripping tanks 220, allowing the stripping liquid in the stripping tanks 220 to fully react with the dry film on the circuit board under constant stripping temperature and circuit board conveying speed. Furthermore, a portion of the stripping liquid in each stripping tank carries the generated membrane sludge into the corresponding membrane sludge filter tank 231, where it is filtered out by the corresponding membrane sludge filter screen 232. This ensures that the stripping liquid can be recycled, thus guaranteeing the efficiency of circuit board stripping.

[0049] like Figure 5As shown, in one embodiment, the circuit board production equipment 10, which reduces the need for electroplating film, further includes a washing device 300. The inlet of the washing device 300 is connected to the outlet of the stripping tank 220, and the outlet of the washing device 300 is connected to the board ejection mechanism 270. It is understood that after the stripping step is completed, a washing operation is required to remove residual stripping solution and other contaminants from the circuit board surface, preventing residual chemicals from corroding the circuit board. Further, the washing device 300 includes a washing tank 310 and a washing controller 320. The washing controller 320 is mounted on the washing tank 310. The inlet of the washing tank 310 is connected to the outlet of the stripping tank 220, and the outlet of the washing tank 310 is connected to the board ejection mechanism 270. Specifically, the washing tank 310 is used to accommodate the stripped circuit board, and the washing controller 320 is used to control the circuit board to undergo spray washing, overflow washing, or high-pressure deionization washing.

[0050] This disclosure also provides a circuit board manufacturing system, including the circuit board manufacturing equipment 10 of any of the above embodiments that can reduce the amount of electroplating film.

[0051] Compared with the prior art, this disclosure has at least the following advantages:

[0052] 1. When electroplating a circuit board with a dry film, the pulse electroplating controller 130 is used to switch the current between on and off. By setting the electroplating parameters, the electroplating parameters of the circuit board can be controlled, reducing the problem of film trapping caused by the large differences in the distribution of independent hole rings and circuit patterns between independent lines / independent holes.

[0053] 2. When performing the stripping process on the circuit board, since a temperature controller 262 and a conveying speed controller 263 are provided, the stripping temperature and the conveying speed of the stripping section can be set to fully strip the circuit board at a suitable temperature, reduce the surface tension of the dry film, quickly penetrate into the interlayer film, soften and dissolve some of the dry film residue, and make the adhesion between the dry film and the copper layer disappear, thereby achieving the purpose of effectively removing the interlayer film.

[0054] 3. Since the dry film stripping device 200 is equipped with a membrane residue filter cylinder 231 and a membrane residue filter screen 232, if the stripping liquid is recycled, the generated membrane residue will be filtered out through the membrane residue filter screen 232 and then returned to the stripping tank 220 through the circulation pipe 241 and the nozzle 243. This can realize the recycling of the stripping liquid, ensure the stripping efficiency of the circuit board, and prevent the membrane residue from clogging the circulation pipe 241 or the nozzle 243.

[0055] The embodiments described above are merely illustrative of several implementations of this disclosure, and while the descriptions are specific and detailed, they should not be construed as limiting the scope of the disclosed patent. It should be noted that those skilled in the art can make various modifications and improvements without departing from the concept of this disclosure, and these all fall within the protection scope of this disclosure. Therefore, the protection scope of this patent should be determined by the appended claims.

Claims

1. A circuit board manufacturing equipment that reduces the need for electroplating film, characterized in that, include: An electroplating apparatus includes a first plate feeding mechanism, an electroplating tank, and a pulse electroplating controller. The first plate feeding mechanism is connected to the inlet end of the electroplating tank, and the control end of the pulse electroplating controller is electrically connected to the electroplating controlled end of the electroplating tank. The pulse electroplating controller is used to set electroplating parameters. The dry film stripping device includes a second plate inlet mechanism, a stripping tank, a membrane residue filtration mechanism, a stripping liquid circulation control mechanism, a stripping monitoring sensor group, a stripping control box, and a plate outlet mechanism. The second plate inlet mechanism is connected to the outlet end of the electroplating tank and the inlet end of the stripping tank, respectively, and the plate outlet mechanism is connected to the outlet end of the stripping tank. The membrane sludge filtration mechanism includes a membrane sludge filter cylinder and a membrane sludge filter screen. The membrane removal tank is provided with a drainage channel, which is connected to the membrane sludge filter cylinder. The membrane sludge filter screen is connected to the inner wall of the membrane sludge filter cylinder. The membrane stripping solution circulation control mechanism includes a circulation pipe, a control pump, and a nozzle. One end of the circulation pipe is connected to the side of the membrane sludge filter cylinder that is sequentially away from the drainage channel and the membrane sludge filter screen. The other end of the circulation pipe is connected to the nozzle. The control pump is mounted on the circulation pipe. The film removal monitoring sensor group includes a temperature control sensor and a flow control sensor, and the nozzle, the temperature control sensor and the flow control sensor are all installed in the film removal tank; The film removal control box includes a box body, a temperature controller, and a conveying rate controller. The control terminal of the temperature controller is electrically connected to the temperature control sensor, and the control terminal of the conveying rate controller is electrically connected to the conveying control sensor.

2. The circuit board production equipment according to claim 1 that reduces the need for electroplating film, characterized in that, The first plate feeding mechanism includes a first plate feeding roller row and a first plate feeding bracket. The first plate feeding roller row is installed on the inner side of the first plate feeding bracket, and the first plate feeding bracket is connected to the inlet end of the electroplating tank.

3. The circuit board production equipment according to claim 2 that reduces the need for electroplating film, characterized in that, The first feed roller row includes a plurality of first feed roller units, which are installed on the inner side of the first feed roller bracket.

4. The circuit board production equipment according to claim 1 that reduces the need for electroplating film, characterized in that, The number of electroplating tanks and pulse electroplating controllers are both multiple and equal.

5. The circuit board production equipment according to claim 1 that reduces the need for electroplating film, characterized in that, The second feeding mechanism includes a second feeding roller row and a second feeding bracket. The second feeding roller row is installed on the inner side of the second feeding bracket, and the second feeding bracket is connected to the inlet end of the film removal tank.

6. The circuit board production equipment according to claim 5 that reduces the need for electroplating film, characterized in that, The second feed roller row includes a plurality of second feed roller units, which are mounted on the inner side of the second feed roller bracket.

7. The circuit board production equipment according to claim 1 that reduces the need for electroplating film, characterized in that, The number of each of the membrane stripping tank, the membrane sludge filtration mechanism, the membrane stripping liquid circulation control mechanism, and the membrane stripping monitoring sensor group is multiple and equal.

8. The circuit board production equipment according to claim 1 that reduces the need for electroplating film, characterized in that, The circuit board production equipment that can reduce electroplating film also includes a water washing device, the inlet end of which is connected to the outlet end of the film removal tank, and the outlet end of which is connected to the board unloading mechanism.

9. The circuit board production equipment according to claim 8 that reduces the need for electroplating film, characterized in that, The washing device includes a washing tank and a washing controller. The washing controller is installed on the washing tank. The inlet end of the washing tank is connected to the outlet end of the film removal tank, and the outlet end of the washing tank is connected to the plate dispensing mechanism.

10. A circuit board manufacturing system, characterized in that, The circuit board production equipment that reduces the amount of electroplating film as described in any one of claims 1-9.

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