Radiator, electrical connection module and vehicle

Abstract

The utility model discloses a radiator, electric connection module and vehicle, the radiator is used for connecting the electrically conductive row to the electrically conductive row is carried out heat dissipation, the radiator includes bottom plate and a plurality of radiating fins, in the first direction, the bottom plate has first surface and second surface who set up in the opposite direction, a plurality of radiating fins all are connected to first surface, second surface is equipped with connecting hole, and the connecting hole is used for cooperation connecting piece to connect bottom plate and electrically conductive row through connecting piece, in the utility model, the radiator can be connected to the electrically conductive row to the electrically conductive row is carried out heat dissipation, like this can avoid the electrically conductive row on the gathering too much heat, thereby avoid the electrically conductive row appears over heating phenomenon, improve the service life and use safety of electrically conductive row. Moreover through the corresponding setting of radiating fin and connecting hole, still can be convenient radiator and electrically conductive row connection to can improve the cooling effect of electrically conductive row.

Description

Technical Field

[0001] This utility model relates to the field of automotive parts technology, and in particular to a radiator, an electrical connection module, and a vehicle. Background Technology

[0002] Conductive busbars, such as copper busbars, are typically used to electrically connect corresponding conductive components to enable current transmission. For example, in new energy vehicles, a conductive busbar can electrically connect the positive (or negative) terminals of several battery cell modules to achieve the convergence of current from the positive (or negative) terminals of these battery cells.

[0003] However, in actual use, the busbar is prone to overheating, which can lead to a reduced lifespan and even safety risks. Utility Model Content

[0004] This utility model provides a radiator, an electrical connection module, and a vehicle, aiming to solve the problem of overheating in existing conductive busbars.

[0005] This utility model provides a heat sink for connecting a conductive busbar to dissipate heat from the conductive busbar. The heat sink includes a base plate and multiple heat dissipation fins. In a first direction, the base plate has a first surface and a second surface disposed opposite to each other. The multiple heat dissipation fins are all connected to the first surface. The second surface is provided with a connection hole for engaging a connector to connect the base plate and the conductive busbar.

[0006] Optionally, in the first direction, the connection hole is opposite to at least one of the heat dissipation fins.

[0007] Optionally, in the first direction, the connecting hole penetrates the base plate and the connecting hole also penetrates the heat dissipation fin opposite to it; and / or, in the second direction, a plurality of heat dissipation fins are arranged at intervals in sequence; in the second direction, the connecting hole penetrates at least one side of the heat dissipation fin opposite to it; the first direction is perpendicular to the second direction.

[0008] Optionally, the connecting hole is a stepped hole; in the first direction, the connecting hole includes a first hole and a second hole; the first hole is disposed on the base plate, and the second hole is disposed on the heat dissipation fin; the first hole and the second hole communicate with each other, and the base plate is opposite to the second hole.

[0009] Optionally, the number of connecting holes is three; the centers of the three connecting holes are located at the three vertices of the triangle, respectively.

[0010] Optionally, the heat dissipation fins are heat dissipation plates, and in the second direction, the heat dissipation fins are arranged sequentially at intervals, with the first direction perpendicular to the second direction; wherein, in the second direction, the two outermost heat dissipation fins are the first plate and the second plate, respectively; the surfaces of the first plate and the second plate facing away from the first plate are both flush with the base plate; and / or, in the second direction, the heat dissipation fins are arranged at equal intervals; and / or, in the third direction, the two end faces of the heat dissipation fins are both flush with the base plate; both the first direction and the second direction are perpendicular to the third direction.

[0011] This utility model embodiment also provides an electrical connection module, including a conductive busbar, a connector, and a heat sink as described in any one of the above; the connector mates with the connection hole and connects the conductive busbar and the base plate; the heat dissipation fins are located on the side of the base plate away from the conductive busbar.

[0012] Optionally, the second surface is in contact with the conductive busbar; and / or, the conductive busbar is provided with a mounting hole, the mounting hole penetrating the conductive busbar along the first direction; the connector is disposed in the mounting hole, the connector is a rivet, and the conductive busbar is riveted to the base plate.

[0013] Optionally, the conductive busbar includes a main board and multiple support plates; the multiple support plates are sequentially spaced apart from the main board along a fourth direction; the heat sink is connected to the support plate, and the support plate is used to connect conductive elements; wherein the angle between the support plate and the main board is greater than zero; and / or, in the first direction, the opposite sides of the support plate are respectively connected to the heat sink and the conductive elements.

[0014] This utility model embodiment also provides a vehicle, including the electrical connection module described in any one of the above claims.

[0015] In the radiator, electrical connection module, and vehicle provided in this embodiment of the utility model, the radiator can be connected to the conductive busbar to dissipate heat from the conductive busbar. This can prevent excessive heat accumulation on the conductive busbar, thereby avoiding overheating and improving the service life and safety of the conductive busbar.

[0016] In addition, the heat dissipation effect of the radiator can be improved by setting multiple heat dissipation fins. At the same time, the bottom plate has connection holes on the surface away from the heat dissipation fins to connect to the conductive busbar. This not only facilitates the connection of the conductive busbar, but also helps to improve the heat transfer effect between the radiator and the conductive busbar, and helps to diffuse the heat of the radiator outward, thereby improving the cooling effect on the conductive busbar. Attached Figure Description

[0017] To more clearly illustrate the technical solutions of the embodiments of this utility model, the drawings used in the description of the embodiments of this utility model will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this utility model. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0018] Figure 1 This is a schematic diagram of the structure of a heat sink provided in one embodiment of the present invention. Figure 1 ; Figure 2 This is a schematic diagram of the structure of a heat sink provided in one embodiment of the present invention. Figure 2 ; Figure 3 This is a schematic diagram of the structure of a heat sink provided in one embodiment of the present invention. Figure 3 ; Figure 4 This is a schematic diagram of the structure of an electrical connection module provided in an embodiment of the present invention; Figure 5 This is a schematic diagram of the structure of a conductive bus provided in one embodiment of the present invention. Figure 1 ; Figure 6 This is a schematic diagram of the structure of a conductive bus provided in one embodiment of the present invention. Figure 2 ; Figure 7 This is a schematic diagram of the structure of a conductive bus provided in one embodiment of the present invention. Figure 3 .

[0019] Instruction manual drawing reference numerals: 100. Electrical connection module; 200. Conductive element; 10. Radiator; 20. Busbar; 30. Connector; 1. Base plate; 11. First surface; 12. Second surface; 13. Connecting hole; 131. First hole; 132. Second hole; 2. Heat dissipation fins; 3. Mounting holes; 4. Motherboard; 5. Support plate; 6. Insulation layer. Detailed Implementation

[0020] To make the technical problems solved, technical solutions, and beneficial effects of this utility model clearer, the present utility model will be further described in detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative of the present utility model and are not intended to limit the present utility model.

[0021] In the description of this utility model, it should be understood that the terms "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "bottom", "inner", "outer", etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are only for the convenience of describing this utility model and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this utility model.

[0022] In the description of this utility model, it should be noted that, unless otherwise explicitly specified and limited, the terms "installation," "connection," and "joining" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; and they can refer to the internal connection of two components. Those skilled in the art can understand the specific meaning of the above terms in this utility model based on the specific circumstances.

[0023] like Figures 1 to 4 As shown, in one embodiment of this utility model, a heat sink 10 is used to connect a conductive busbar 20 to dissipate heat from the conductive busbar 20; wherein, the heat sink 10 includes a base plate 1 and a plurality of heat dissipation fins 2; in a first direction, the base plate 1 has a first surface 11 and a second surface 12 disposed opposite to each other; the plurality of heat dissipation fins 2 are all connected to the first surface 11; the second surface 12 is provided with a connecting hole 13, which is used to cooperate with a connector 30 so as to connect the base plate 1 and the conductive busbar 20 through the connector 30. Figures 1 to 3 Of the directions shown, the first direction is parallel to the Z-axis.

[0024] In this context, "multiple" refers to two or more. The meaning of the word "multiple" is the same in all embodiments and will not be repeated hereafter.

[0025] In this embodiment, the heat sink 10 can be connected to the conductive busbar 20 to dissipate heat from the conductive busbar 20. This can prevent excessive heat accumulation on the conductive busbar 20, thereby avoiding overheating and improving the service life and safety of the conductive busbar 20.

[0026] In addition, the heat dissipation effect of the radiator 10 can be improved by setting multiple heat dissipation fins 2. At the same time, the conductive busbar 20 is connected to the surface of the base plate 1 away from the heat dissipation fins 2, which can improve the heat transfer effect between the radiator 10 and the conductive busbar 20 and facilitate the heat of the radiator 10 to diffuse outward, thereby improving the cooling effect on the conductive busbar 20.

[0027] In addition, a connection hole 13 is provided on the second surface 12, which can be easily connected to the conductive bus 20.

[0028] In one application scenario, the first direction can be the up and down direction.

[0029] In one embodiment, the base plate 1 can be a flat plate structure, in which case the first surface 11 and the second surface 12 are both planes and are parallel to each other. Alternatively, the base plate 1 can be a cuboid structure.

[0030] In one embodiment, in a first direction, the connection hole 13 is opposite to at least one heat dissipation fin 2.

[0031] The phrase "in the first direction, the connecting hole 13 is opposite to at least one heat dissipation fin 2" can mean that in an orthographic projection on a plane perpendicular to the first direction, the projection of the connecting hole 13 overlaps with the projection of at least one heat dissipation fin 2.

[0032] Compared to the method where the connecting hole 13 is not opposite to the heat dissipation fin 2, the arrangement in this embodiment can make the heat dissipation fin 2 more concentrated and more numerous when the area of ​​the base plate 1 (such as the area of ​​the first surface 11) is fixed, thereby improving the heat dissipation effect of the heat sink 10.

[0033] like Figure 1 and Figure 3 As shown, in one embodiment, in the first direction, the connecting hole 13 penetrates the base plate 1, and the connecting hole 13 also penetrates at least one heat dissipation fin 2 opposite to it. This facilitates the setting of the connecting hole 13 and also facilitates its cooperation with the connector 30 to connect to the conductive busbar 20.

[0034] At this time, in the first direction, the connecting hole 13 includes a first hole 131 and a second hole 132, with the first hole 131 communicating with the second hole 132. The first hole 131 is located on the base plate 1, and the second hole 132 is located on the heat dissipation fin 2. Furthermore, in the first direction, the first hole 131 penetrates the base plate 1, and the second hole 132 penetrates the heat dissipation fin 2.

[0035] In one embodiment, the connecting hole 13 may be a stepped hole. In the first direction, the base plate 1 is opposite to the second hole 132.

[0036] Furthermore, "in the first direction, the base plate 1 is opposite to the second hole 132" can mean that in an orthographic projection on a plane perpendicular to the first direction, the projection of the second hole 132 overlaps with the projection of the base plate 1. That is, the first hole 131 and the second hole 132 are connected to form a stepped hole, and the diameter of the second hole 132 is larger than the diameter of the first hole 131.

[0037] When assembled with the busbar 20, the second hole 132 can accommodate the corresponding structure of the connector 30. At the same time, by setting the diameter of the second hole 132 to be larger, the structure of the connector 30 can be made to abut against the base plate 1.

[0038] In one embodiment, a portion of the first surface 11 (defined as the first region) may form a stepped surface of the connecting hole 13, in which case the first region may serve as the bottom surface of the second hole 132.

[0039] Additionally, the first region may also have a countersunk hole, which can accommodate the corresponding structure of the connector 30. For example, when the connector 30 is a rivet, the countersunk hole can accommodate the rivet to abut against the rivet cap of the base plate 1. This arrangement can prevent the connector 30 from protruding from the first surface 11 along the direction from the second surface 12 to the first surface 11, or reduce the size of the portion of the connector 30 that protrudes from the first surface 11 along the direction from the second surface 12 to the first surface 11. The countersunk hole can be a tapered hole, with the cross-sectional radius gradually decreasing along the direction from the first surface to the second surface. Moreover, the minimum radius of the tapered hole's cross-section can be equal to the radius of the first hole 131, and the tapered hole and the first hole can be coaxially arranged.

[0040] In one embodiment, the connecting hole 13 extends along a straight line. Both the first hole 131 and the second hole 132 are straight holes, meaning their axes are both straight lines, and both lines can be parallel to the first direction. Alternatively, both the first hole 131 and the second hole 132 can be circular holes. Furthermore, the first hole 131 and the second hole 132 can be coaxially arranged. Of course, in other embodiments, the cross-section of either the first hole 131 or the second hole 132 can also be a regular or irregular shape, such as a square or hexagon.

[0041] like Figure 1 As shown, in one embodiment, in the second direction, the connecting hole 13 penetrates at least one side of the heat dissipation fin 2 opposite to it; the first direction intersects the second direction. This allows the gap between adjacent heat dissipation fins 2 to accommodate the corresponding structure of the connector 30, improving space utilization and facilitating the provision of more heat dissipation fins 2 on the base plate 1.

[0042] exist Figure 1 In the example shown, in the second direction, the connecting hole 13 extends through both sides of the heat dissipation fin 2 opposite to it, thus dividing the heat dissipation fin 2 into two spaced-apart parts by the connecting hole 13. Moreover, in this example, the second hole 132 is equivalent to a notch provided on the heat dissipation fin 2.

[0043] In one embodiment, the first direction is perpendicular to the second direction. Wherein, in Figure 1 Of the directions shown, the second direction is parallel to the X-axis. In one application scenario, the second direction could be a left-right direction.

[0044] like Figure 1As shown, in one embodiment, there are multiple connection holes 13, which are spaced apart. When assembled with the conductive busbar 20, each connection hole 13 can mate with a connector 30, which makes the connection between the heat sink 10 and the conductive busbar 20 more secure.

[0045] In one embodiment, there are three connecting holes 13, and the centers of the three connecting holes 13 are located at the three vertices of a triangle. That is, the three connecting holes 13 are arranged in a triangle, which can make the connection between the heat sink 10 and the conductive busbar 20 more secure after connecting with the connector 30.

[0046] Specifically, the axes of the three connecting holes 13 pass through the three vertices of a triangle.

[0047] In one embodiment, the heat dissipation fins 2 can be plate-like structures, i.e., the heat dissipation fins 2 are heat dissipation plates. Furthermore, in the second direction, the heat dissipation fins 2 are arranged sequentially at intervals. This facilitates the arrangement of the heat dissipation fins 2 and also simplifies the production and fabrication of the heat sink 10.

[0048] In one embodiment, the heat dissipation fins 2 and the base plate 1 can be an integral structure, for example, they can be integrally formed by casting. (Refer to...) Figure 2 Along the direction from the second surface 12 to the first surface 11, the thickness of the heat dissipation fin 2 can gradually decrease, and in this case, the heat dissipation fin 2 can be an isosceles trapezoidal structure. The thickness of the heat dissipation fin 2 refers to its dimension in the second direction, which facilitates the production of the heat sink 10, such as facilitating demolding of the heat sink 10. Moreover, this arrangement allows the distance between two adjacent heat dissipation fins 2 to gradually increase in the direction away from the base plate 1 (i.e., from the second surface 12 to the first surface 11), thereby promoting the outward dissipation of heat from the heat sink 10.

[0049] like Figure 2 As shown, in one embodiment, when the heat dissipation fins 2 are heat dissipation plates, and the heat dissipation fins 2 are arranged sequentially at intervals in the second direction, the two outermost heat dissipation fins 2 in the second direction are the first plate and the second plate, respectively; the surfaces of the first plate and the second plate that face away from the second plate are both flush with the base plate 1. This is beneficial for improving the utilization rate of the space on the base plate 1 and allows more heat dissipation fins 2 to be installed on the base plate 1.

[0050] The two opposing surfaces of the base plate 1 in the second direction are defined as the third surface and the fourth surface, respectively, where the direction from the third surface to the fourth surface is the same as the direction from the first plate to the second plate. Furthermore, the surface of the first plate facing away from the second plate is defined as the first plate surface, and the surface of the second plate facing away from the first plate is defined as the second plate surface. The first plate surface, the second plate surface, the third surface, and the fourth surface are all planes.

[0051] The above-mentioned "the surface of the first plate away from the second plate and the surface of the second plate away from the first plate are both flush with the base plate 1" means that the surface of the first plate and the third surface are in the same plane, and the surface of the second plate and the fourth surface are in the same plane.

[0052] Multiple heat dissipation fins 2 of the radiator 10 are defined as a fin group. At this time, in the second direction, the total length of the fin group (i.e. the distance between the first plate and the second plate) is equal to the length of the base plate 1 (i.e. the distance between the third surface and the fourth surface). By setting the first plate and the second plate to be flush with the base plate 1, more heat dissipation fins 2 can be set on the base plate 1 when the total length of the radiator 10 is inconvenient, thereby improving the heat dissipation effect.

[0053] In one embodiment, the first plate surface may be parallel to the second plate surface; or, the first plate surface and the second plate surface may not be parallel, in which case the distance between them may refer to the maximum distance, minimum distance or average distance between them.

[0054] In one embodiment, in the third direction, both end faces of the heat dissipation fins 2 are flush with the base plate 1; the first direction and the second direction are both perpendicular to the third direction. Figure 1 and Figure 3 In the directions shown, the third direction is parallel to the Y-axis. In one application scenario, the third direction can be the forward or backward direction.

[0055] In this context, the two opposing surfaces of the heat dissipation fins 2 in the third direction are defined as the third plate surface and the fourth plate surface, respectively, and the two opposing surfaces of the base plate 1 in the third direction are defined as the fifth surface and the sixth surface, respectively. The third plate surface, the fourth plate surface, the fifth surface and the sixth surface are all planar.

[0056] "On the third side, both ends of the heat dissipation fin 2 are flush with the base plate 1" means that the third plate surface and the fifth plate surface are in the same plane, and the fourth plate surface and the sixth plate surface are in the same plane.

[0057] That is, in the third direction, the width of the fin group (i.e., the distance between the third and fourth plates) is equal to the width of the base plate 1 (i.e., the distance between the fifth and sixth surfaces), and the third and fourth plates are set to be flush with the base plate 1. This allows for a larger size of the heat dissipation fins 2 when the total width of the heat sink 10 is limited, thereby improving the heat dissipation effect.

[0058] It should be understood that when the base plate 1 is a cuboid structure, the first surface 11, the second surface 12, the third surface, the fourth surface, the fifth surface, and the sixth surface are its six end faces. Furthermore, in actual products, the corners of the cuboid structure are often chamfered or rounded.

[0059] In one embodiment, in the second direction, the heat dissipation fins 2 are arranged at equal intervals, which facilitates the heat sink 10 to dissipate heat more evenly to the conductive busbar 20.

[0060] like Figure 4 and Figure 5 As shown, this utility model embodiment also provides an electrical connection module 100, including a conductive bus 20, a connector 30, and a heat sink 10 as described in any of the above embodiments; wherein, the connector 30 cooperates with the connection hole 13 and connects the conductive bus 20 and the base plate 1; the heat dissipation fins 2 are located on the side of the base plate 1 away from the conductive bus 20.

[0061] In one embodiment, the second surface 12 is abutted against the conductive busbar 20. This allows for closer contact between the base plate 1 and the conductive busbar 20, thereby improving the heat transfer effect between them.

[0062] The area where the conductive busbar 20 contacts the second surface 12 and the area where the second surface 12 contacts the conductive busbar 20 can both be planar areas.

[0063] like Figure 6 As shown, in one embodiment, the conductive busbar 20 is provided with a mounting hole 3, which extends through the conductive busbar 20 along a first direction; a connector 30 passes through the mounting hole 3, and the connector 30 is a rivet, which is used to rivet the conductive busbar 20 and the base plate 1. This not only facilitates the assembly of the heat sink 10 and the conductive busbar 20, but also makes the connection between the two more secure.

[0064] like Figure 6 As shown, in one embodiment, the conductive bus 20 includes a main board 4 and multiple support plates 5; the multiple support plates 5 are sequentially spaced along a fourth direction on the main board 4; a heat sink 10 is connected to the support plates 5, and the support plates 5 are used to connect conductive components 200. In use, the main board 4 can collect a portion of the current on the support plates 5, and the collected current can be output externally through another portion of the support plates 5. Placing the heat sink 10 on the support plates 5 allows it to be closer to the heat source, thereby dissipating the heat from the conductive bus 20 more quickly.

[0065] Among them, the conductive element 200 can be the electrode tab of the battery cell, etc.

[0066] In addition, both the motherboard 4 and the support board 5 can be flat panels, and both can be cuboid structures.

[0067] In addition, the motherboard 4 and the support board 5 can be a single integrated structure.

[0068] In one embodiment, the fourth direction may be parallel to the second direction. Of course, in other embodiments, the fourth direction may also intersect with the second direction.

[0069] In one embodiment, the conductive busbar 20 is a copper busbar, and in this case, both the main board 4 and the support board 5 are copper plates.

[0070] In one embodiment, the angle between the support plate 5 and the main plate 4 is greater than zero. This reduces the space occupied by the conductive busbar 20, facilitating its installation and use.

[0071] In one embodiment, the support plate 5 and the main plate 4 can be perpendicular. During production, the support plate 5 can be formed at a corresponding angle with the main plate 4 through a bending process or the like.

[0072] like Figure 4 As shown, in one embodiment, in the first direction, the opposite sides of the support plate 5 are respectively connected to the heat sink 10 and the conductive element 200. This avoids interference between the arrangement of the heat sink 10 and the connection between the conductive busbar 20 and the conductive element 200. At the same time, this also allows the heat sink 10 to be closer to the conductive element 200, for example, the two can overlap in the first direction, so that the heat generated by the conductive element 200 can be dissipated quickly.

[0073] like Figure 7 As shown, in one embodiment, the conductive bus 20 further includes an insulating layer 6, which covers the motherboard 4 to prevent the motherboard 4 from making electrical contact with components outside the conductive bus 20, thereby improving the safety of the conductive bus 20.

[0074] Except for the area used to connect the support plate 5, the other areas on the motherboard 4 can be covered by the insulating layer 6.

[0075] Alternatively, the insulating layer 6 can be a rubber layer.

[0076] This utility model embodiment also provides a vehicle, which includes the electrical connection module 100 described in any of the above embodiments.

[0077] It should be understood that the above-mentioned settings can also be replaced in other ways, such as: In other embodiments, the heat dissipation fin 2 may also be a flat plate structure, or it may be a columnar structure, etc.

[0078] In other embodiments, the connector 30 may also include bolts and nuts. During assembly, the bolts pass through the mounting hole 3 and the connecting hole 13 and engage with the bolts, thereby locking the conductive busbar 20 and the base plate 1 together.

[0079] In other embodiments, the connecting hole 13 may also be a threaded hole. In this case, the connector 30 may include a bolt. The bolt passes through the mounting hole 3 through the conductive busbar 20 and engages with the connecting hole 13 by thread, thereby locking the conductive busbar 20 and the base plate 1 together.

[0080] The technical features of the above embodiments can be combined in any way. For the sake of brevity, not all possible combinations of the technical features in the above embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

[0081] The above-described embodiments are only used to illustrate the technical solutions of this utility model, and are not intended to limit it. Although this utility model has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that modifications can still be made to the technical solutions described in the foregoing embodiments, or equivalent substitutions can be made to some of the technical features. Such modifications or substitutions do not cause the essence of the corresponding technical solutions to deviate from the spirit and scope of the technical solutions of the embodiments of this utility model, and should all be included within the protection scope of this utility model.

Claims

1. A radiator, characterized in that, The heat sink is used to connect to the conductive busbar to dissipate heat from the conductive busbar; The radiator includes a base plate and multiple heat dissipation fins; In a first direction, the base plate has a first surface and a second surface disposed opposite to each other; All of the aforementioned heat dissipation fins are connected to the first surface; The second surface is provided with a connection hole, which is used to mate with a connector so as to connect the base plate and the conductive bar through the connector.

2. The radiator according to claim 1, characterized in that, In the first direction, the connection hole is opposite to at least one of the heat dissipation fins.

3. The radiator according to claim 2, characterized in that, In the first direction, the connecting hole penetrates the base plate, and the connecting hole also penetrates the heat dissipation fin opposite to it; and / or, In the second direction, a plurality of the heat dissipation fins are arranged sequentially at intervals; in the second direction, the connecting hole penetrates at least one side of the heat dissipation fin opposite to it; the first direction is perpendicular to the second direction.

4. The radiator according to claim 3, characterized in that, The connecting hole is a stepped hole; In the first direction, the connecting hole includes a first hole and a second hole; The first hole is located in the base plate, and the second hole is located in the heat dissipation fin; The first hole is connected to the second hole, and the base plate is opposite to the second hole.

5. The radiator according to claim 1, characterized in that, The number of connection holes is three; The centers of the three connecting holes are located at the three vertices of the triangle, respectively.

6. The radiator according to claim 1, characterized in that, The heat dissipation fins are heat dissipation plates. In the second direction, the heat dissipation fins are arranged at intervals in sequence. The first direction is perpendicular to the second direction. In the second direction, the two outermost heat dissipation fins are the first plate and the second plate, respectively; the surface of the first plate facing away from the second plate and the surface of the second plate facing away from the first plate are both flush with the base plate; and / or, in the second direction, the heat dissipation fins are arranged at equal intervals; and / or, in the third direction, the two end faces of the heat dissipation fins are both flush with the base plate; the first direction and the second direction are both perpendicular to the third direction.

7. An electrical connection module, characterized in that, Includes a conductive bus, a connector, and a heat sink as described in any one of claims 1 to 6; The connector mates with the connecting hole and connects the conductive busbar and the base plate; The heat dissipation fins are located on the side of the base plate opposite to the conductive bar.

8. The electrical connection module according to claim 7, characterized in that, The second surface is bonded to the conductive busbar; and / or, The conductive busbar is provided with mounting holes, which penetrate the conductive busbar along the first direction; the connector is provided through the mounting holes, and the connector is a rivet, and the conductive busbar and the base plate are riveted together.

9. The electrical connection module according to claim 7, characterized in that, The conductive bus includes a main board and multiple support boards; Multiple support plates are sequentially spaced apart on the main board along the fourth direction; The heat sink is connected to the support plate, and the support plate is used to connect conductive components. Wherein, the angle between the support plate and the main plate is greater than zero; and / or, in the first direction, the opposite sides of the support plate are respectively connected to the heat sink and the conductive element.

10. A vehicle, characterized in that, Includes the electrical connection module as described in any one of claims 7 to 9.

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