Display substrate and display device

Abstract

A display substrate is provided, comprising a display area and a peripheral area, the peripheral area comprising a main peripheral area and a bending area located on one side of the main peripheral area along a second direction, the display substrate comprising: a substrate substrate; a barrier wall located in the main peripheral area and arranged around the display area; a first conductive layer comprising a first power supply lead located in the peripheral area; a plurality of bonding pads located on one side of the bending area away from the display area; at least one first organic insulating layer located on one side of the first conductive layer away from the substrate substrate; the at least one first organic insulating layer comprises a first slot located in the main peripheral area, the first slot is located on one side of the barrier wall close to the bending area, the at least one first organic insulating layer is disconnected at the first slot along the second direction, and the orthographic projection of the first slot on the substrate substrate partially overlaps with the orthographic projection of a part of the first power supply lead on the substrate substrate.

Description

Technical Field

[0001] This utility model relates to the field of display technology, and in particular to a display substrate and a display device. Background Technology

[0002] Organic light-emitting diode (OLED) displays have become a crucial display technology due to their advantages such as thinness, light weight, wide viewing angle, active emission, continuously adjustable emission color, low cost, fast response speed, low power consumption, wide operating temperature range, simple manufacturing process, high luminous efficiency, and flexible display capabilities. However, the presence of moisture and oxygen in the environment significantly impacts the lifespan of OLED devices. Therefore, preventing OLED device failure due to moisture and oxygen intrusion is a key focus for display product developers.

[0003] The information disclosed in this section is only for understanding the background of the inventive concept of this utility model. Therefore, the above information may include information that does not constitute prior art. Utility Model Content

[0004] In one aspect, a display substrate is provided, the display substrate including a display area and a peripheral area surrounding the display area, the peripheral area including a main peripheral area surrounding the display area and a bent area located on one side of the main peripheral area along a second direction, the display substrate comprising:

[0005] Substrate;

[0006] A barrier wall is located on the substrate, and the barrier wall is located in the main peripheral area and surrounds the display area;

[0007] A first conductive layer is located on the substrate, including a first power lead located in the peripheral region;

[0008] Multiple bonding pads are located on the substrate and on the side of the bending region away from the display area. The end of the first power lead away from the display area is electrically connected to at least one of the bonding pads.

[0009] At least one first organic insulating layer is located on the side of the first conductive layer away from the substrate.

[0010] Wherein, at least one of the first organic insulating layers includes a first groove located in the main peripheral region, the first groove being located on the side of the retaining wall near the bending region, at least one of the first organic insulating layers being broken at the first groove along a second direction, and the orthographic projection of the first groove on the substrate partially overlapping the orthographic projection of a portion of the first power lead on the substrate.

[0011] According to some exemplary embodiments, the orthographic projection of the first groove on the substrate is a strip extending along the first direction;

[0012] The display area includes a first edge and a second edge located on both sides of a first direction; and

[0013] Along the first direction, the boundary of the first slot near the first edge is closer to the first edge than the side of the first power lead closest to the first edge, and / or, the boundary of the first slot near the second edge is closer to the second edge than the side of the first power lead closest to the second edge.

[0014] According to some exemplary embodiments, the first power lead includes a first side surface that intersects with a surface of the first power lead remote from the substrate; and

[0015] The first groove includes at least one discontinuity, and at least one first organic insulating layer includes a cover portion at the discontinuity, the cover portion covering at least a portion of a first side of the first power lead.

[0016] According to some exemplary embodiments, at least one of the covering portions divides the first slot into at least two sub-slots spaced apart along the first direction.

[0017] According to some exemplary embodiments, the first slot includes at least two sub-slots located on both sides of at least one of the covering portions along the first direction, and the at least two of the sub-slots are connected on the side of the covering portion away from the display area.

[0018] According to some exemplary embodiments, the display substrate further includes an inorganic insulating layer located on the side of at least one first organic insulating layer away from the substrate, the inorganic insulating layer covering at least a portion of the display area and extending to the peripheral area; and

[0019] The inorganic insulating layer extends into the first groove from the side near the plurality of bonding pads and contacts the first power lead.

[0020] According to some exemplary embodiments, the inorganic insulating layer includes a second side surface near one side of the plurality of bonding pads, at least a portion of the orthographic projection of the second side surface onto the substrate lies within the orthographic projection of the first trench onto the substrate.

[0021] According to some exemplary embodiments, the display substrate includes a touch functional layer located on the side of at least one first organic insulating layer away from the substrate, the touch functional layer including a touch buffer layer and a touch insulating layer located on the side of the touch buffer layer away from the substrate; and

[0022] The inorganic insulating layer includes the touch buffer layer and the touch insulating layer.

[0023] According to some exemplary embodiments, the display substrate further includes a polarizing layer and a bending region covering layer located on the side of the inorganic insulating layer away from the substrate, the polarizing layer covering the display area, and the bending region covering layer covering the bending region and having a gap between it and the polarizing layer; and

[0024] The orthographic projection of the first groove on the substrate is located on the side of the orthographic projection of the gap on the substrate that is away from the display area.

[0025] According to some exemplary embodiments, the display substrate further includes a protective layer located on the side of the inorganic insulating layer away from the substrate, the protective layer covering at least a portion of the inorganic insulating layer; and

[0026] The orthographic projection of the protective layer on the substrate covers the orthographic projection of the first groove on the substrate.

[0027] According to some exemplary embodiments, the protective layer includes a second groove, the orthographic projection of the second groove on the substrate being located on the side of the orthographic projection of the first groove on the substrate closer to the display area.

[0028] According to some exemplary embodiments, the display substrate further includes a polarizing layer and a bending region cover layer located on the side of the protective layer away from the substrate, the polarizing layer covering the display area, and the bending region cover layer covering the bending region and having a gap between it and the polarizing layer; and

[0029] The orthographic projection of the second groove on the substrate is located on the side of the orthographic projection of the gap on the substrate that is away from the display area.

[0030] According to some exemplary embodiments, the display substrate further includes an encapsulation layer located on the side of the inorganic insulating layer near the substrate. The encapsulation layer includes a first inorganic encapsulation layer, an organic encapsulation layer located on the side of the first inorganic encapsulation layer away from the substrate, and a second inorganic encapsulation layer located on the side of the organic encapsulation layer away from the substrate.

[0031] The side of the first inorganic encapsulation layer near the bending region is located on the side of the first groove near the display area, and / or, the side of the second inorganic encapsulation layer near the bending region is located on the side of the first groove near the display area.

[0032] According to some exemplary embodiments, the first conductive layer further includes a second power signal line located in the display area and a second power lead located in the peripheral area, the second power lead and the second power signal line being electrically connected, and one end of the second power lead away from the display area being electrically connected to at least one of the bonding pads; and

[0033] The orthographic projection of the first groove on the substrate is spaced apart from the orthographic projection of the second power lead on the substrate.

[0034] According to some exemplary embodiments, at least one layer of the first organic insulating layer includes a third groove, the third groove being disposed around the display area and located on the side of the barrier closer to the display area;

[0035] The third slot includes a first portion located on the side of the display area closer to the bent area.

[0036] The first conductive layer further includes a second power lead located in the peripheral region, the end of the second power lead away from the display area being electrically connected to at least one of the bonding pads; and

[0037] The boundary of the first sub-slot near the display area is farther away from the display area than the boundary of the second sub-slot near the display area.

[0038] According to some exemplary embodiments, the first power lead and the second power lead are arranged at intervals along the first direction, and the connection between the first sub-slot and the second sub-slot is located in the interval region between the first power lead and the second power lead.

[0039] According to some exemplary embodiments, the display substrate further includes at least one second organic insulating layer, wherein the at least one second organic insulating layer is located on the side of the first conductive layer near the substrate; and

[0040] At least one layer of the second organic insulating layer has a fourth trench, the orthographic projection of the fourth trench on the substrate at least partially overlapping the orthographic projection of the first trench on the substrate.

[0041] According to some exemplary embodiments, the two boundaries of the orthographic projection of the fourth trench on the substrate along the second direction are located between the two boundaries of the orthographic projection of the first trench on the substrate along the second direction.

[0042] In another aspect, a display device is provided, the display device comprising the display substrate described in any of the preceding claims. Attached Figure Description

[0043] Other objects and advantages of the present invention will become apparent from the following description of the invention with reference to the accompanying drawings, and will help to provide a comprehensive understanding of the invention.

[0044] Figure 1 A schematic plan view of a display substrate according to some embodiments of the present invention is shown.

[0045] Figure 2 schematically showing along Figure 1 A cross-sectional view taken from the centerline BB'.

[0046] Figure 3 A schematic plan view of a display substrate according to some embodiments of the present invention is shown.

[0047] Figure 4 Schematic illustration Figure 3 An enlarged view of region C in the middle.

[0048] Figure 5 schematically showing along Figure 4 A cross-sectional view taken from the centerline DD'.

[0049] Figure 6 schematically showing along Figure 4 A cross-sectional view taken from the centerline EE'.

[0050] Figure 7 schematically showing along Figure 4 A cross-sectional view taken from the centerline FF'.

[0051] Figures 8A-8F Schematic illustration Figure 4 The hierarchical structure diagram of region G in the middle, where, Figure 8A The first conductive layer is shown. Figure 8B This illustrates the first planarization layer. Figure 8C This illustrates the second planarization layer. Figure 8D The pixel boundary layer is shown. Figure 8EThe touch insulation layer is shown. Figure 8F The diagram illustrates a combination of a first conductive layer, a first planarization layer, a second planarization layer, a pixel defining layer, and a touch insulating layer.

[0052] Figure 9 Schematic illustration Figure 3 Another magnified view of region C in the middle.

[0053] Figure 10 Schematic illustration Figure 3 Another magnified view of region C in the middle.

[0054] Figure 11 Schematic illustration Figure 10 A magnified view of region J in the middle.

[0055] Figure 12 schematically showing along Figure 11 A cross-sectional view taken from the center line GG'.

[0056] Figure 13 Schematic illustration Figure 3 Another magnified view of region C in the middle.

[0057] Figure 14 schematically showing along Figure 13 A cross-sectional view taken from the centerline II'.

[0058] It should be noted that, for clarity, the dimensions of layers, structures, or regions in the drawings used to describe embodiments of the present invention may be enlarged or reduced, i.e., these drawings are not drawn to actual scale. Detailed Implementation

[0059] In the following description, numerous specific details are set forth for illustrative purposes to provide a comprehensive understanding of various exemplary embodiments. However, it will be apparent that various exemplary embodiments may be implemented without these specific details or with one or more equivalent arrangements. In other instances, well-known structures and apparatuses are shown in block diagram form to avoid unnecessarily obscuring the various exemplary embodiments. Furthermore, the various exemplary embodiments may be different, but not necessarily exclusive. For example, specific shapes, configurations, and characteristics of exemplary embodiments may be used or implemented in another exemplary embodiment without departing from the inventive concept.

[0060] In the accompanying drawings, the dimensions and relative dimensions of the elements may be enlarged for clarity and / or descriptive purposes. Thus, the dimensions and relative dimensions of the individual elements are not necessarily limited to those shown in the drawings. When exemplary embodiments can be implemented differently, the specific process sequence may be performed differently than the order described. For example, two consecutively described processes may be performed substantially simultaneously or in the reverse order of description. Furthermore, the same reference numerals denote the same elements.

[0061] When an element is described as being "on" another element, "connected to" another element, or "attached to" another element, the element may be directly on, directly connected to, or directly attached to the other element, or there may be intermediate elements present. However, when an element is described as being "directly on" another element, "directly connected to" another element, or "directly attached to" another element, there are no intermediate elements. Other terms and / or expressions used to describe relationships between elements should be interpreted in a similar manner, such as "between" versus "directly between," "adjacent" versus "directly adjacent," or "on" versus "directly on," etc. Furthermore, the term "connection" can refer to a physical connection, an electrical connection, a communication connection, and / or a fluid connection. Additionally, the X-axis, Y-axis, and Z-axis are not limited to the three axes of a Cartesian coordinate system and can be interpreted in a broader sense. For example, the X-axis, Y-axis, and Z-axis may be perpendicular to each other, or may represent different directions that are not perpendicular to each other. For the purposes of this invention, "at least one of X, Y, and Z" and "at least one selected from the group consisting of X, Y, and Z" can be interpreted as only X, only Y, only Z, or any combination of two or more of X, Y, and Z such as XYZ, XY, YZ, and XZ. As used herein, the term "and / or" includes any and all combinations of one or more of the listed related items.

[0062] It should be understood that although the terms first, second, etc., may be used herein to describe different elements, these elements should not be limited by these terms. These terms are merely used to distinguish one element from another. For example, without departing from the scope of the exemplary embodiments, a first element may be named a second element, and similarly, a second element may be named a first element.

[0063] Figure 1 A schematic plan view of a display substrate according to some embodiments of the present invention is shown. Figure 2 schematically showing along Figure 1 A cross-sectional view taken from the centerline BB'.

[0064] Reference Figure 1On the lower side of the display area AA near the bonding pad BP, a first power lead L1 for transmitting a first power supply voltage to the display area AA and a second power lead L2 for transmitting a second power supply voltage to the display area AA are provided. For example, the first power supply voltage is a voltage signal VDD connected to the pixel driving circuit, and the first power supply signal can be a positive voltage signal. The second power supply signal is a voltage signal VSS connected to the cathode of each display device, and the second power supply voltage can be a negative voltage signal.

[0065] The inventors discovered that the display substrate exhibits growing dark spots (GDS) that develop over time. These GDS typically appear on the side of the display area AA near the bonding pad BP, and are concentrated at the junction of the first power lead L1 and the display area AA.

[0066] The inventors discovered through research that the problem arises because, in order to meet the display requirements of narrow bezels and high screen-to-body ratio, the spacing between the display area AA and the bending area BA is set very narrow. This results in the boundary of the encapsulation layer being close to the display area AA, making it easier for external moisture to penetrate into the display area AA and cause the display device to fail. Furthermore, the voltage applied to the first power lead L1 causes electrochemical corrosion, making it easier for moisture to travel along the first power lead L1 into the display area AA, thus forming display black spots (GDS) that accumulate at the junction of the first power lead L1 and the display area AA.

[0067] To avoid this problem, refer to Figure 2 An additional inorganic insulating layer, ISL, can be added to cover the first power lead L1, but this method will increase the manufacturing cost of the display substrate.

[0068] Figure 3 A schematic plan view of a display substrate according to some embodiments of the present invention is shown. Figure 4 Schematic illustration Figure 3 An enlarged view of region C in the middle. Figure 5 schematically showing along Figure 4 A cross-sectional view taken from the centerline DD'. Figure 6 schematically showing along Figure 4 A cross-sectional view taken from the centerline EE'. Figure 7 schematically showing along Figure 4 A cross-sectional view taken from the centerline FF'.

[0069] Combined with reference Figure 3 , Figure 4 and Figure 5The display substrate includes a display area AA and a peripheral area NA surrounding the display area AA. The peripheral area NA includes a main peripheral area NA1 surrounding the display area AA and a bent area BA located in the main peripheral area NA1 along a second direction Y away from the display area AA. The portion of the display substrate located in the bent area BA bends towards the side of the display substrate away from the light-emitting surface, and a portion of the display substrate located in the bent area BA away from the display area AA bends to the back side of the portion of the display substrate located in the display area AA. In the accompanying drawings and text descriptions, to more clearly illustrate the arrangement of the relevant structures in the display substrate, the bent area BA and the display area AA are shown as being on the same plane.

[0070] The display substrate includes a substrate 100 and a plurality of sub-pixels SP located on the substrate 100. The plurality of sub-pixels SP are located within a display area AA and are arranged at intervals along a first direction X and a second direction Y. Each sub-pixel SP includes a pixel driving circuit and a light-emitting device electrically connected to the pixel driving circuit. For example, the light-emitting device may include an organic light-emitting diode (OLED).

[0071] To prevent the light-emitting devices from malfunctioning, an encapsulation layer 300 and a barrier wall Dam, which cooperates with the encapsulation layer 300, are provided on the side of the multiple sub-pixels SP away from the substrate 100. The encapsulation layer 300 may include a first inorganic encapsulation layer 310, an organic encapsulation layer 330 located on the side of the first inorganic encapsulation layer 310 away from the substrate 100, and a second inorganic encapsulation layer 320 located on the side of the organic encapsulation layer 330 away from the substrate 100. The barrier wall Dam is located in the main peripheral region NA1 and may include a first barrier wall Dam1 and a second barrier wall Dam2 surrounding the first barrier wall Dam1. The encapsulation layer 300 covers the multiple sub-pixels SP within the display region AA. The boundary of the organic encapsulation layer 330 ends at the inner side of the first barrier wall Dam1 or the second barrier wall Dam2 near the display region AA, and the boundary of the first inorganic encapsulation layer 310 and the second inorganic encapsulation layer 320 is located on the outer side of the second barrier wall Dam2 away from the display region AA.

[0072] The display substrate includes a driving circuit layer, in which the pixel driving circuit of the sub-pixel SP is located. The driving circuit layer is located on the side of the encapsulation layer 300 near the display area AA. The driving circuit layer includes multiple conductive layers and multiple inorganic insulating layers. The multiple conductive layers include a first conductive layer M1. The display substrate also includes multiple organic insulating layers located within the driving circuit layer and on the side of the driving circuit layer away from the substrate 100. The multiple organic insulating layers include at least one first organic insulating layer 210, which is located on the side of the first conductive layer M1 away from the substrate 100.

[0073] The first conductive layer M1 includes a first power signal line located in the display area AA and a first power lead L1 located in the peripheral area NA. The driving circuit layer also includes multiple bonding pads BP located in the bending area BA away from the display area AA. The multiple bonding pads BP are used for electrical connection with the pins of the driving chip. The end of the first power lead L1 near the display area AA is electrically connected to the first power signal line, and the other end of the first power lead L1 away from the display area AA extends to be electrically connected to at least one bonding pad BP. The first power lead L1 transmits the first power signal from the bonding pad BP to the first power signal line in the display area AA, and then writes the first power signal line to the pixel driving circuit of each sub-pixel SP through the first power signal line.

[0074] At least one first organic insulating layer 210 includes a first groove G1 located in the main peripheral region NA1. The first groove G1 is located on the side of the second barrier Dam2 near the bending region BA. The at least one first organic insulating layer 210 is interrupted at the first groove G1 along the second direction Y. The orthographic projection of the first groove G1 on the substrate 100 partially overlaps with the orthographic projection of a portion of the first power lead L1 on the substrate 100. By providing the first groove G1 located inside the bending region BA on the first organic insulating layer 210, and by having the first groove G1 overlap with the first power lead L1, the influence of water and oxygen transported from the bending region BA to the display region AA within the first organic insulating layer 210 on the first power lead L1 can be effectively reduced. Figure 5 As shown by the middle arrow, when the portion of the first organic insulating layer 210 located in the bending area is transmitted toward the display area, it will be cut off at the first slot G1, thereby effectively avoiding the problem of display black spots caused by electrochemical corrosion of the first power lead L1.

[0075] According to some exemplary embodiments, refer to Figure 5 The first organic insulating layer 210 located on the side of the first conductive layer M1 away from the substrate 100 may include a second planarization layer PLN2 and a pixel defining layer PDL located on the side of the second planarization layer PLN2 away from the substrate 100. The first trench G1 may penetrate the pixel defining layer PDL and the second planarization layer PLN2.

[0076] According to some exemplary embodiments, in conjunction with reference to Figure 3 and Figure 4The first groove G1, projected onto the substrate 100, is a strip extending along the first direction X. Both ends of the first groove G1 along the first direction X are located on the side of the display area AA near the bending area BA. The display area AA includes a first edge AA1 and a second edge AA2 located on both sides of the first direction X. Along the first direction X, the boundary of the first groove G1 near the first edge AA1 is closer to the first edge AA1 than the side of the first power lead L1 closest to the first edge AA1, and / or, the boundary of the first groove G1 near the second edge AA2 is closer to the second edge AA2 than the side of the first power lead L1 closest to the second edge AA2. With this configuration, the extension range of the first groove G1 along the first direction X is wider than the distribution range of the first power lead L1 along the first direction X, which can more effectively prevent water and oxygen transported within the first organic insulating layer 210 from affecting the first power lead L1.

[0077] It should be noted that, Figure 4 The structure of the first slot G1 and the first power lead L1 near the first edge AA1 is only schematically shown. The structure of the first slot G1 and the first power lead L1 near the second edge AA2 can be kept the same.

[0078] According to some exemplary embodiments, in conjunction with reference to Figure 4 , Figure 6 and Figure 7 The first power lead L1 includes a first side surface L1a, which intersects with the surface of the first power lead L1 away from the substrate 100. The first trench G1 includes at least one discontinuity G1x. At least one first organic insulating layer 210 includes a covering portion 210a at the discontinuity G1x, which covers at least a portion of the first side surface L1a of the first power lead L1.

[0079] The first conductive layer M1 has a three-layer stacked structure, comprising a first sublayer, a second sublayer located on the side of the first sublayer away from the substrate 100, and a third sublayer located on the side of the second sublayer away from the substrate 100. For example, the materials of the first and third sublayers include titanium, and the material of the second sublayer includes aluminum. To prevent the first side surface L1a of the first power lead L1 from reacting with chemical reagents such as developer or etchant during other processes after the formation of the first conductive layer M1, thus forming an undercut structure and causing other display defects, the first trench G1, when crossing the first side surface L1a of the first power lead L1, retains a portion of the first organic insulating layer 210, i.e., forming a cover portion 210a covering the first side surface L1a.

[0080] According to some exemplary embodiments, in conjunction with reference to Figure 4 , Figure 6 and Figure 7The cover portion 210a is located only on a first organic insulating layer 210, and the first groove G1 of at least another organic insulating layer remains continuous at the discontinuity G1x. For example, the cover portion 210a is located on the second planarization layer PLN2, and the pixel defining layer PDL film layer at the discontinuity G1x is still removed to form a part of the first groove G1. In this way, the thickness of the cover portion 210a is relatively thin, so as to reduce the content of water and oxygen transported along the cover portion 210a in the direction towards the display area AA.

[0081] According to some exemplary embodiments, refer to Figure 7 The first organic insulating layer 210, where the cover portion 210a is located, can be fabricated using a halftone mask, making the thickness of the cover portion 210a less than the thickness of the first organic insulating layer 210 in other areas, thereby further reducing the thickness of the cover portion 210a. Simultaneously, it allows for a gentler slope angle in the cover portion 210a, enabling better coverage by the upper inorganic insulating layer 400 and preventing cracks in the upper inorganic insulating layer 400 from extending into the display area and causing encapsulation failure.

[0082] According to some exemplary embodiments, in conjunction with reference to Figure 3 and Figure 4 The first conductive layer M1 also includes a second power signal line located in the display area AA and a second power lead L2 located in the peripheral area NA. The second power lead L2 is electrically connected to the second power signal line, and the end of the second power lead L2 away from the display area AA is electrically connected to at least one bonding pad BP. The second power lead L2 transmits the second power signal from the bonding pad BP to the second power signal line in the display area AA, and then connects the second power signal line to the cathode of the light-emitting device of each sub-pixel SP. The orthographic projection of the first trench G1 on the substrate 100 is spaced apart from the orthographic projection of the second power lead L2 on the substrate 100. For example, the first trench G1 may extend along the first direction X to the vicinity of the second power lead L2 and then stop.

[0083] The inventors discovered that the second power lead L2 is less prone to electrochemical corrosion because the second power signal it transmits is less likely to be corroded. Therefore, the first groove G1 does not need to extend above the second power lead L2, thus avoiding the problem of undercut structure caused by the first groove G1 exposing the side of the second power lead L2.

[0084] According to some exemplary embodiments, refer to Figure 5The display substrate further includes at least one second organic insulating layer 220, which is located on the side of the first conductive layer M1 near the substrate 100. The at least one second organic insulating layer 220 has a fourth trench G4, the orthographic projection of the fourth trench G4 onto the substrate 100 at least partially overlapping the orthographic projection of the first trench G1 onto the substrate 100. Along the second direction Y, the second organic insulating layer 220 is interrupted at the fourth trench G4, thereby effectively reducing the adverse effects of water and oxygen transported from the bending region to the display region within the second organic insulating layer 220 on the first power lead L1.

[0085] For example, at least one second organic insulating layer 220 includes a first planarization layer PLN1, and a fourth trench G4 is located in the first planarization layer PLN1.

[0086] Figures 8A-8F Schematic illustration Figure 4 The hierarchical structure diagram of region G in the middle, where, Figure 8A The first conductive layer is shown. Figure 8B This illustrates the first planarization layer. Figure 8C This illustrates the second planarization layer. Figure 8D The pixel boundary layer is shown. Figure 8E The touch insulation layer is shown. Figure 8F The diagram illustrates a combination of a first conductive layer, a first planarization layer, a second planarization layer, a pixel defining layer, and a touch insulating layer.

[0087] It should be noted that, Figure 8A The schematic diagram shows the actual structure of the first conductive layer M1. To more clearly illustrate the relative positions of the first conductive layer M1 and the first trench G1, further details are provided. Figure 8A The diagram shows the positions of the first retaining wall Dam1 and the second retaining wall Dam2. Figure 8B The schematic diagram shows the shape of the patterned portion removed in the first planarization layer PLN1, i.e. Figure 8B The schematic structure is a complementary structure to the actual structure of the first planarization layer PLN1. Similarly, Figures 8C-8E The structures shown are complementary to the actual structures of the corresponding membrane layers.

[0088] According to some exemplary embodiments, in conjunction with reference to Figure 5 , Figure 8A , Figure 8B , Figure 8C , Figure 8D and Figure 8FThe first trench G1 includes a lower sub-trench G1a located in the second planarization layer PLN2 and an upper sub-trench G1b located in the pixel defining layer PDL. The fourth trench G4 is located in the first planarization layer PLN1. The width of the fourth trench G4 along the second direction Y is smaller than the width of the lower sub-trench G1a along the second direction Y. The two boundaries of the orthographic projection of the fourth trench G4 on the substrate 100 along the second direction Y are located between the two boundaries of the orthographic projection of the lower sub-trench G1a on the substrate 100 along the second direction Y. The width of the lower sub-trench G1a along the second direction Y is smaller than the width of the upper sub-trench G1b along the second direction Y. The two boundaries of the orthographic projection of the lower sub-trench G1a on the substrate 100 along the second direction Y are located between the two boundaries of the orthographic projection of the upper sub-trench G1b on the substrate 100 along the second direction Y. Along the direction away from the substrate 100, at the first trench G1 and the fourth trench G4, the first planarization layer PLN1, the second planarization layer PLN2 and the pixel defining layer PDL form a gentle step structure, so that the upper film layer can have good coverage at this point.

[0089] According to some exemplary embodiments, in conjunction with reference to Figure 8A , Figure 8B , Figure 8C , Figure 8D and Figure 8F The lower sub-slot G1a is disconnected at the junction with the first power lead L1, forming a discontinuity G1x. The fourth slot G4 and the upper sub-slot G1b are continuous at the junction with the first power lead L1.

[0090] According to some exemplary embodiments, in conjunction with reference to Figure 3 , Figure 5 , Figure 8A , Figure 8B , Figure 8C , Figure 8D and Figure 8F The first barrier Dam1 includes a first sub-barrier Dam11 located in the second planarization layer PLN2 and a second sub-barrier Dam12 located in the pixel boundary layer PDL. The second barrier Dam2 includes a third sub-barrier Dam21 located in the first planarization layer PLN1, a fourth sub-barrier Dam22 located in the second planarization layer PLN2, and a fifth sub-barrier Dam23 located in the pixel boundary layer PDL.

[0091] According to some exemplary embodiments, in conjunction with reference to Figure 3 , Figure 4 , Figure 5 , Figure 8A , Figure 8B , Figure 8C , Figure 8D and Figure 8FAt least one first organic insulating layer 210 further includes a third trench G3, a fifth trench G5, and a sixth trench G6. For example, the second planarization layer PLN2 and the pixel defining layer PDL include the third trench G3, the fifth trench G5, and the sixth trench G6. The third trench G3 is located on the side of the first barrier wall Dam1 near the display area AA, and the third trench G3 is arranged around the display area AA. The fifth trench G5 is located between the first barrier wall Dam1 and the second barrier wall Dam2, and the fifth trench G5 is arranged around the first barrier wall Dam1. The sixth trench G6 is located on the side of the second barrier wall Dam2 away from the display area AA, and the sixth trench G6 is arranged around the second barrier wall Dam2. The first trench G1 and the sixth trench G6 are spaced apart, and the first trench G1 is located on the side of the sixth trench G6 near the bending area BA.

[0092] Figure 9 Schematic illustration Figure 3 Another magnified view of region C in the middle.

[0093] According to some exemplary embodiments, in conjunction with reference to Figure 3 and Figure 9 The third slot G3 includes a first portion located on the side of the display area AA near the bending area BA. A first power lead L1 and a second power lead L2 are spaced apart along a first direction X. The first portion includes a first sub-slot G31 and a second sub-slot G32 connected along the first direction X. The orthographic projection of the first sub-slot G31 on the substrate 100 overlaps with the orthographic projection of the first power lead L1 on the substrate 100. The orthographic projection of the second sub-slot G32 on the substrate 100 overlaps with the orthographic projection of the second power lead L2 on the substrate 100. The boundary of the first sub-slot G31 near the display area AA is farther away from the display area AA than the boundary of the second sub-slot G32 near the display area AA. This arrangement ensures that the portion of the first power lead L1 exposed by the first sub-slot G31 is farther away from the display area AA than the portion of the second power lead L2 exposed by the second sub-slot G32, thereby preventing a short circuit between the cathode layer and the second power lead L2 that could lead to display defects.

[0094] It should be noted that the cathode layer in the display substrate is formed by evaporation using an open mask. The shadowing effect of the mask will cause the edge of the actual formed cathode layer to extend beyond the edge of the display area AA by a certain distance. In the case of narrowing the bezel, there is a risk that the cathode layer will be short-circuited with the first power lead L1. This problem can be effectively avoided by moving the first sub-slot G31 down a certain distance away from the boundary of the display area AA.

[0095] According to some exemplary embodiments, refer to Figure 9The connection between the first sub-slot G31 and the second sub-slot G32 is located in the interval area between the first power lead L1 and the second power lead L2. The first side L1a of the first power lead L1 is exposed by the narrower first sub-slot G31, thereby reducing the area exposed by the third slot G3 on the first side L1a of the first power lead L1, and reducing the area of ​​the undercut structure that may appear in the first side L1a of the first power lead L1.

[0096] According to some exemplary embodiments, refer to Figure 9 The boundary of the first sub-slot G31 away from the display area AA is flush with the boundary of the second sub-slot G32 away from the display area AA. The width of the first sub-slot G31 along the second direction Y is smaller than the width of the second sub-slot G32 along the second direction Y.

[0097] According to some exemplary embodiments, in conjunction with reference to Figure 3 , Figure 4 and Figure 5 The display substrate also includes an inorganic insulating layer 400 located on the side of at least one first organic insulating layer 210 away from the substrate 100. The inorganic insulating layer 400 covers at least a portion of the display area AA and extends to the peripheral area NA. The side of the inorganic insulating layer 400 near the plurality of bonding pads BP extends into the first trench G1 and contacts the first power lead L1. The inorganic insulating layer 400 and the first power lead L1 enclose the portion of the first organic insulating layer 210 located in the first trench G1 near the display area AA, thereby preventing external water and oxygen from intruding into the first organic insulating layer 210 and being transported along the first organic insulating layer 210 into the display area AA.

[0098] According to some exemplary embodiments, in conjunction with reference to Figure 3 , Figure 4 and Figure 5 The inorganic insulating layer 400 includes a second side surface 410 near the plurality of bonding pads BP. At least a portion of the orthographic projection of the second side surface 410 onto the substrate 100 lies within the orthographic projection of the first groove G1 onto the substrate 100. By ensuring that the second side surface 410 of the inorganic insulating layer 400 near the plurality of bonding pads BP falls precisely into the first groove G1, it is guaranteed that the inorganic insulating layer 400 covers the portion of the first organic insulating layer 210 located in the first groove G1 near the display area AA. At the same time, it avoids the risk of water and oxygen being transported inward through the inorganic insulating layer 400 by extending the inorganic insulating layer 400 further into the bending area BA.

[0099] According to some exemplary embodiments, in conjunction with reference to Figure 3 , Figure 4 and Figure 5The display substrate includes a touch functional layer located on the side of at least one first organic insulating layer 210 away from the substrate 100. The touch functional layer includes a touch buffer layer 510, a first touch metal layer located on the side of the touch buffer layer 510 away from the substrate 100, a touch insulating layer 520 located on the side of the first touch metal layer away from the substrate 100, and a second touch metal layer located on the side of the touch insulating layer 520 away from the substrate 100. The inorganic insulating layer 400 includes the touch buffer layer 510 and the touch insulating layer 520.

[0100] It should be noted that the first and second touch metal layers only include the touch electrode structure located within the display area AA. Figure 3 The specific structure of the touch electrode is not shown in the illustration, and the present invention does not limit the specific structure of the touch electrode.

[0101] According to some exemplary embodiments, in conjunction with reference to Figure 6 , Figure 8E and Figure 8F In the orthographic projection of the touch insulating layer 520 onto the substrate 100, the boundary of the multiple bonding pads BP is located within the orthographic projection of the first trench G1 onto the substrate 100. Furthermore, the edges of the touch buffer layer 510 and the touch insulating layer 520 are formed by etching a single mask in a patterning process; therefore, the boundary of the touch buffer layer 510 near the multiple bonding pads BP coincides with the boundary of the touch insulating layer 520 near the multiple bonding pads BP.

[0102] According to some exemplary embodiments, in conjunction with reference to Figure 4 , Figure 6 and Figure 7 At least one cover portion 210a divides the first slot G1 into at least two sub-slots G11 spaced apart along the first direction X. The dimension of the cover portion 210a along the second direction Y is equal to the dimension of the first slot G1 along the second direction Y, and the cover portion 210a completely divides the first slot G1. The first side L1a of the first power lead L1 is completely covered by the cover portion 210a, and the first side L1a does not have an undercut structure.

[0103] Figure 10 Schematic illustration Figure 3 Another magnified view of region C in the middle. Figure 11 Schematic illustration Figure 10 A magnified view of region J in the middle. Figure 12 schematically showing along Figure 11 A cross-sectional view taken along the centerline GG'. Additionally, along... Figure 11 The cross-sectional view taken from the midline HH' can be referenced. Figure 7 .

[0104] According to some exemplary embodiments, in conjunction with reference to Figure 3 , Figure 7 , Figure 10 and Figure 12 The first slot G1 includes at least two sub-slots G11 located on both sides of at least one discontinuity G1x along the first direction X. The at least two sub-slots G11 are connected by a connecting portion G12 on the side of the cover portion 210a away from the display area AA. Furthermore, the second side 410 of the inorganic insulating layer 400 near the bonding pad BP is located on the side of the connecting portion G12 near the display area AA, and the orthographic projection of the inorganic insulating layer 400 on the substrate 100 does not overlap with the orthographic projection of the connecting portion G12 on the substrate 100. At the discontinuity G1x, the first side L1a of the first power lead L1 is covered by the cover portion 210a, and the side of the cover portion 210a away from the substrate 100 has the inorganic insulating layer 400. At the connecting portion G12, the first side L1a of the first power lead L1 does not have the cover portion 210a or the inorganic insulating layer 400. This configuration allows the first groove G1 to be continuous along the first direction X. At the same time, no inorganic insulating layer 400 is provided above the first side L1a, which is not covered by the covering part 210a, at the connection point G12. This avoids the inorganic insulating layer 400 from contacting the undercut structure that may appear at the first side L1a, which could cause cracks and lead to other defects.

[0105] According to some exemplary embodiments, in conjunction with reference to Figure 3 and Figure 5 The display substrate also includes a polarizing layer POL and a bending region cover layer MCL located on the side of the inorganic insulating layer 400 away from the substrate 100. The polarizing layer POL covers the display area AA, and the bending region cover layer MCL covers the bending area BA and has a gap W between it and the polarizing layer POL. The orthographic projection of the first groove G1 on the substrate 100 is located on the side of the orthographic projection of the gap W on the substrate 100 away from the display area AA. The gap W between the bending region cover layer MCL and the polarizing layer POL is a possible path for water and oxygen to invade, but the water and oxygen transported inward from the gap W will be blocked by the inorganic insulating layer 400 at the first groove G1, such as... Figure 5 As indicated by the middle arrow, it is difficult to transmit further inward into the first organic insulating layer 210.

[0106] According to some exemplary embodiments, in conjunction with reference to Figure 5The display substrate also includes a protective layer OC located on the side of the inorganic insulating layer 400 away from the substrate 100. The protective layer OC is located on the side of the polarizing layer POL and the bending region cover layer MCL near the display area AA. The protective layer OC covers at least a portion of the inorganic insulating layer 400, and the orthographic projection of the protective layer OC on the substrate 100 covers the orthographic projection of the first groove G1 on the substrate 100. The protective layer OC completely covers the inorganic insulating layer 400 at the first groove G1, thereby protecting the inorganic insulating layer 400 and ensuring the water and oxygen barrier effect at this location.

[0107] Figure 13 Schematic illustration Figure 3 Another magnified view of region C in the middle. Figure 14 schematically showing along Figure 13 A cross-sectional view taken from the centerline II'.

[0108] According to some exemplary embodiments, in conjunction with reference to Figure 3 , Figure 13 and Figure 14 The protective layer OC includes a second trench G2. The orthographic projection of the second trench G2 onto the substrate 100 is located on the side of the orthographic projection of the first trench G1 onto the substrate 100 closer to the display area AA. The orthographic projection of the second trench G2 onto the substrate 100 is located on the side of the orthographic projection of the gap W onto the substrate 100 farther from the display area AA. With this configuration, moisture transported to the protective layer OC along the gap W between the polarizing layer POL and the bending region cover layer MCL is stopped at the second trench G2. Figure 14 As shown by the middle arrow, this effectively reduces the amount of water and oxygen transported inward through the protective OC layer.

[0109] According to some exemplary embodiments, in conjunction with reference to Figure 3 , Figure 13 and Figure 14 The second groove G2 is located on the side of the discontinuity G1x along the second direction Y near the display area AA. The orthographic projection of the second groove G2 on the substrate 100 overlaps with the orthographic projection of the first side surface L1a of the first power lead L1 on the substrate 100. Since there is a covering portion 210a of the first organic insulating layer 210 at the discontinuity G1x, the protective layer OC will contact the covering portion 210a at the first groove G1. The water and oxygen transported inward by the protective layer OC will continue to be transported into the display area AA along the covering portion 210a. By setting the second groove G2 on the side of the discontinuity G1x along the second direction Y near the display area AA, the water and oxygen transport path can be effectively cut off.

[0110] Of course, depending on actual needs, the second groove G2 can also be a strip groove extending along the first direction X. The orthographic projection of the second groove G2 on the substrate 100 can overlap with the orthographic projections of the first power lead L1 and the second power lead L2 on the substrate 100.

[0111] According to some exemplary embodiments, in conjunction with reference to Figure 3 and Figure 5 The side of the first inorganic encapsulation layer 310 near the bending area BA is located on the side of the first groove G1 near the display area AA, and the side of the second inorganic encapsulation layer 320 near the bending area BA is located on the side of the first groove G1 near the display area AA. This arrangement can further improve the encapsulation reliability of the encapsulation layer 300.

[0112] It should be noted that when the first inorganic encapsulation layer 310 and the second inorganic encapsulation layer 320 are deposited, their boundaries near the bonding pads may be located on the side of the first trench G1 near the bonding pads. In order to ensure the encapsulation effect of the encapsulation layer 300, the first inorganic encapsulation layer 310 and the second inorganic encapsulation layer 320 can be etched together when the touch insulating layer 520 is etched, so that the side of the first inorganic encapsulation layer 310 near the bending area BA and the side of the second inorganic encapsulation layer 320 near the bending area BA are located in the first trench G1.

[0113] At least some embodiments of this utility model also provide a display device, which includes the display substrate described above. The display device can include any device or product with display functionality. For example, the display device can be a smartphone, mobile phone, e-book reader, desktop computer (PC), laptop PC, netbook PC, personal digital assistant (PDA), portable multimedia player (PMP), digital audio player, mobile medical device, camera, wearable device (e.g., head-mounted device, electronic clothing, electronic bracelet, electronic necklace, electronic accessory, electronic tattoo, or smartwatch), television set, etc.

[0114] It should be understood that the display device according to some exemplary embodiments of the present invention has all the features and advantages of the above-described display substrate, which can be referred to the above description of the display substrate and will not be repeated here.

[0115] As used herein, the terms “substantially,” “approximately,” “about,” and other similar terms are used as terms of approximation rather than as terms of degree, and they are intended to account for inherent deviations in measured or calculated values ​​that would be recognized by one of ordinary skill in the art. Taking into account factors such as process variations, measurement problems, and errors associated with the measurement of a particular quantity (i.e., limitations of the measurement system), “approximately” or “about” as used herein includes the stated value and indicates that the particular value is within an acceptable range of deviation for one of ordinary skill in the art. For example, “approximately” may mean within one or more standard deviations, or within ±10% or ±5% of the stated value.

[0116] While some embodiments of the general inventive concept of this utility model have been illustrated and described, those skilled in the art will understand that changes may be made to these embodiments without departing from the principles and spirit of the general inventive concept of this utility model, the scope of which is defined by the claims and their equivalents.

Claims

1. A display substrate, wherein, The display substrate includes a display area and a peripheral area surrounding the display area. The peripheral area includes a main peripheral area surrounding the display area and a bent area along a second direction located in the main peripheral area. The display substrate includes: Substrate; A barrier wall is located on the substrate, and the barrier wall is located in the main peripheral area and surrounds the display area; A first conductive layer is located on the substrate, including a first power lead located in the peripheral region; Multiple bonding pads are located on the substrate and on the side of the bending region away from the display area. The end of the first power lead away from the display area is electrically connected to at least one of the bonding pads. At least one first organic insulating layer is located on the side of the first conductive layer away from the substrate. Wherein, at least one of the first organic insulating layers includes a first groove located in the main peripheral region, the first groove being located on the side of the retaining wall near the bending region, at least one of the first organic insulating layers being broken at the first groove along a second direction, and the orthographic projection of the first groove on the substrate partially overlapping the orthographic projection of the first power lead on the substrate.

2. The display substrate according to claim 1, wherein, The orthographic projection of the first groove onto the substrate is a strip extending along a first direction; The display area includes a first edge and a second edge located on both sides of a first direction; as well as Along the first direction, the boundary of the first slot near the first edge is closer to the first edge than the side of the first power lead closest to the first edge, and / or, the boundary of the first slot near the second edge is closer to the second edge than the side of the first power lead closest to the second edge.

3. The display substrate according to claim 2, wherein, The first power lead includes a first side surface, which intersects with the surface of the first power lead away from the substrate; and The first groove includes at least one discontinuity, and at least one first organic insulating layer includes a cover portion at the discontinuity, the cover portion covering at least a portion of a first side of the first power lead.

4. The display substrate according to claim 3, wherein, At least one of the covering portions divides the first slot into at least two sub-slots spaced apart along the first direction.

5. The display substrate according to claim 3, wherein, The first slot includes at least two sub-slots located on both sides of at least one of the covering portions along the first direction, and the at least two of the sub-slots are connected on the side of the covering portion away from the display area.

6. The display substrate according to any one of claims 1-5, wherein, The display substrate further includes an inorganic insulating layer located on the side of at least one first organic insulating layer away from the substrate, the inorganic insulating layer covering at least a portion of the display area and extending to the peripheral area; and The inorganic insulating layer extends into the first groove from the side near the plurality of bonding pads and contacts the first power lead.

7. The display substrate according to claim 6, wherein, The inorganic insulating layer includes a second side surface near one side of the plurality of bonding pads, at least a portion of the orthographic projection of the second side surface onto the substrate lies within the orthographic projection of the first trench onto the substrate.

8. The display substrate according to claim 6, wherein, The display substrate includes a touch functional layer located on the side of at least one first organic insulating layer away from the substrate. The touch functional layer includes a touch buffer layer, a first touch metal layer located on the side of the touch buffer layer away from the substrate, a touch insulating layer located on the side of the first touch metal layer away from the substrate, and a second touch metal layer located on the side of the touch insulating layer away from the substrate. The inorganic insulating layer includes the touch buffer layer and the touch insulating layer.

9. The display substrate according to claim 6, wherein, The display substrate further includes a polarizing layer and a bending region covering layer located on the side of the inorganic insulating layer away from the substrate. The polarizing layer covers the display area, and the bending region covering layer covers the bending region and has a gap between it and the polarizing layer. as well as The orthographic projection of the first groove on the substrate is located on the side of the orthographic projection of the gap on the substrate that is away from the display area.

10. The display substrate according to claim 6, wherein, The display substrate further includes a protective layer located on the side of the inorganic insulating layer away from the substrate, the protective layer covering at least a portion of the inorganic insulating layer; and The orthographic projection of the protective layer on the substrate covers the orthographic projection of the first groove on the substrate.

11. The display substrate according to claim 10, wherein, The protective layer includes a second groove, the orthographic projection of which on the substrate is located on the side of the orthographic projection of the first groove on the substrate closer to the display area.

12. The display substrate according to claim 11, wherein, The display substrate further includes a polarizing layer and a bending region covering layer located on the side of the protective layer away from the substrate. The polarizing layer covers the display area, and the bending region covering layer covers the bending region and has a gap between it and the polarizing layer. The orthographic projection of the second groove on the substrate is located on the side of the orthographic projection of the gap on the substrate that is away from the display area.

13. The display substrate according to claim 6, wherein, The display substrate further includes an encapsulation layer located on the side of the inorganic insulating layer closer to the substrate. The encapsulation layer includes a first inorganic encapsulation layer, an organic encapsulation layer located on the side of the first inorganic encapsulation layer away from the substrate, and a second inorganic encapsulation layer located on the side of the organic encapsulation layer away from the substrate. The side of the first inorganic encapsulation layer near the bending region is located on the side of the first groove near the display area, and / or, the side of the second inorganic encapsulation layer near the bending region is located on the side of the first groove near the display area.

14. The display substrate according to any one of claims 2-5, wherein, The first conductive layer further includes a second power lead located in the peripheral region, the end of the second power lead away from the display area being electrically connected to at least one of the bonding pads; and The orthographic projection of the first groove on the substrate is spaced apart from the orthographic projection of the second power lead on the substrate.

15. The display substrate according to claim 14, wherein, At least one layer of the first organic insulating layer includes a third groove, the third groove being disposed around the display area and located on the side of the barrier closer to the display area; The third slot includes a first portion located on the side of the display area near the bending area. The first portion includes a first sub-slot and a second sub-slot that communicate along the first direction. The orthographic projection of the first sub-slot on the substrate overlaps with the orthographic projection of the first power lead on the substrate. The orthographic projection of the second sub-slot on the substrate overlaps with the orthographic projection of the second power lead on the substrate. The boundary of the first sub-slot near the display area is farther away from the display area than the boundary of the second sub-slot near the display area.

16. The display substrate according to claim 15, wherein, The first power lead and the second power lead are arranged at intervals along the first direction, and the connection between the first sub-slot and the second sub-slot is located in the interval area between the first power lead and the second power lead.

17. The display substrate according to any one of claims 1-5, 7-13, and 15-16, wherein, The display substrate further includes at least one second organic insulating layer, wherein the at least one second organic insulating layer is located on the side of the first conductive layer close to the substrate. as well as At least one layer of the second organic insulating layer has a fourth trench, the orthographic projection of the fourth trench on the substrate at least partially overlapping the orthographic projection of the first trench on the substrate.

18. The display substrate according to claim 17, wherein, The two boundaries of the orthographic projection of the fourth trench on the substrate along the second direction are located between the two boundaries of the orthographic projection of the first trench on the substrate along the second direction.

19. A display device, wherein, The display device includes a display substrate according to any one of claims 1-18.

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