Display panel, display module and display device

Abstract

The application discloses a display panel, a display module and a display device, and belongs to the technical field of display. The display panel comprises a flexible substrate, a plurality of pixel driving circuits and a plurality of light emitting devices. The application sets an enhancement layer between the first organic substrate layer and the second organic substrate layer. The enhancement layer can be located between the first organic substrate layer and the first inorganic layer, and the enhancement layer can also be located between the first inorganic layer and the second organic substrate layer. In this way, the enhancement layer and the second organic substrate layer can be matched in concave-convex mode, and the first inorganic layer and the second organic substrate layer can also be matched in concave-convex mode, so that the interlayer bonding force between the structural layers of the flexible substrate is improved. Furthermore, the problems of delamination or cracks between the organic layer and the inorganic layer of the flexible substrate can be improved, the reliability of the flexible substrate is improved, and finally the function of the display panel is ensured to be normal.

Description

Technical Field

[0001] This application relates to the field of display technology, and in particular to a display panel, display module, and display device. Background Technology

[0002] Against the backdrop of the rapid development of organic light-emitting diode (OLED) display technology, OLED display devices based on flexible substrates are widely used.

[0003] Some flexible substrates are formed by stacking organic and inorganic layers. In some high temperature and high humidity environments, delamination or cracks may occur between the organic and inorganic layers of the flexible substrate, resulting in insufficient reliability and abnormal display panel function. Utility Model Content

[0004] This application provides a display panel, a display module, and a display device. It addresses the reliability issues of flexible substrates in existing display panels. The technical solution is as follows:

[0005] On one hand, a display panel is provided, the display panel having a display area and a non-display area surrounding the display area; the display panel includes: a flexible substrate, a plurality of pixel driving circuits and a plurality of light-emitting devices;

[0006] The plurality of pixel driving circuits are located on one side of the flexible substrate and are distributed at least within the display area;

[0007] The plurality of light-emitting devices correspond to the plurality of pixel driving circuits. The light-emitting devices are located on the side of the corresponding pixel driving circuit that is away from the flexible substrate and are electrically connected to the corresponding pixel driving circuit.

[0008] The flexible substrate includes: a first organic substrate layer, a first inorganic layer and a second organic substrate layer stacked together, and a reinforcement layer located between the first organic substrate layer and the second organic substrate layer; the second organic substrate layer is closer to the pixel driving circuit than the first organic substrate layer, and the reinforcement layer and the second organic substrate layer are in a concave-convex fit; the reinforcement layer is distributed at least in the non-display area.

[0009] Optionally, the reinforcement layer includes: a plurality of first reinforcement lines arranged along a first direction, and a plurality of second reinforcement lines arranged along a second direction; the first direction and the second direction intersect.

[0010] The first reinforcing line and the second reinforcing line are connected at their intersection.

[0011] Optionally, the enhancement layer is also distributed within the display area;

[0012] Wherein, in the first direction, the arrangement density of the first enhancement line located in the non-display area is greater than or equal to the arrangement density of the first enhancement line located in the display area;

[0013] And / or, in the second direction, the arrangement density of the second enhancement line located in the non-display area is greater than or equal to the arrangement density of the second enhancement line located in the display area.

[0014] Optionally, the center distance between two adjacent first enhancement lines arranged in the non-display area is less than or equal to the center distance between two adjacent first enhancement lines arranged in the display area.

[0015] And / or, the center distance between two adjacent second enhancement lines arranged in the non-display area is less than or equal to the center distance between two adjacent second enhancement lines arranged in the display area.

[0016] Optionally, the line width of the first enhancement line in the non-display area is smaller than the line width of the first enhancement line in the display area;

[0017] And / or, the line width of the second enhancement line in the non-display area is smaller than the line width of the second enhancement line in the display area.

[0018] Optionally, the display panel is a foldable display panel; the display area includes: a foldable display area, and two planar display areas located on both sides of the foldable display area; the foldable display area is distributed between the two planar display areas in the second direction, and the bending axis of the foldable display area is parallel to the first direction;

[0019] In the second direction, the arrangement density of the second reinforcement line located in the folded display area is less than that of the second reinforcement line located in the flat display area.

[0020] Optionally, the display area further includes: a transition display area located between the folded display area and the flat display area in the second direction;

[0021] In the second direction, the arrangement density of the second enhancement line located in the transition display area is greater than that of the second enhancement line located in the planar display area.

[0022] Optionally, the display panel is a rollable display panel, the display panel having a first end and a second end disposed opposite to each other in the second direction, the first end being used to connect with a fixed housing in the display device, and the second end being used to connect with a sliding housing in the display device;

[0023] In the direction from the first end to the second end, the center distance between two adjacent second reinforcing lines gradually increases.

[0024] Optionally, the material of the reinforcing layer includes: a polymer material.

[0025] Optionally, the molecular arrangement direction of the first reinforcing line is parallel to the extension direction of the first reinforcing line, and the molecular arrangement direction of the second reinforcing line is parallel to the extension direction of the second reinforcing line.

[0026] Optionally, the flexible substrate further includes an amorphous silicon layer located between the second organic substrate layer and the first inorganic layer;

[0027] The reinforcement layer is located between the first organic substrate layer and the amorphous silicon layer, or the reinforcement layer is located between the amorphous silicon layer and the second organic substrate layer.

[0028] Optionally, if the reinforcing layer is located between the first organic substrate layer and the amorphous silicon layer, the reinforcing layer is located between the first inorganic layer and the amorphous silicon layer, or the reinforcing layer is located between the first inorganic layer and the first organic substrate layer.

[0029] Optionally, the display panel further includes: an encapsulation layer and a sacrificial structure;

[0030] The encapsulation layer is located on the side of the plurality of light-emitting devices away from the flexible substrate, and the encapsulation layer has inorganic contact portions distributed in the non-display area, the inorganic contact portions being distributed around the display area;

[0031] The sacrificial structures are distributed within the non-display area and around at least a portion of the edge of the inorganic contact portion;

[0032] Wherein, at least a portion of the sacrificial structure in the orthographic projection of the flexible substrate is located outside the orthographic projection of the inorganic contact portion in the flexible substrate.

[0033] Optionally, the sacrificial structure includes: a first protective layer, a sacrificial metal layer, and a second protective layer stacked together; the first protective layer is closer to the flexible substrate than the second protective layer, and the orthographic projection of the second protective layer onto the flexible substrate is located within the orthographic projection of the sacrificial metal layer onto the flexible substrate;

[0034] The reactivity of the sacrificial metal layer is greater than that of the first protective layer and also greater than that of the second protective layer.

[0035] Optionally, the conductive layer containing some of the conductive structures in the pixel driving circuit is a source / drain metal layer, and the light-emitting device includes a first electrode electrically connected to the pixel driving circuit;

[0036] Wherein, the sacrificial structure is disposed in the same layer as the source / drain metal layer and is made of the same material; or, the sacrificial structure is disposed in the same layer as the first electrode and is made of the same material.

[0037] Optionally, the display panel further includes an inorganic insulating layer located between the sacrificial structure and the flexible substrate;

[0038] The inorganic insulating layer has a first groove on the side facing away from the flexible substrate, and at least a portion of the sacrificial structure is embedded in the first groove.

[0039] Optionally, the display panel further includes: an auxiliary sacrificial structure distributed in the non-display area, the auxiliary sacrificial structure being located on the side of the inorganic insulating layer away from the flexible substrate and closer to the display area than the sacrificial structure;

[0040] Wherein, the orthographic projection of the auxiliary sacrificial structure onto the flexible substrate is located within the orthographic projection of the inorganic contact portion onto the flexible substrate.

[0041] Optionally, the inorganic insulating layer has a second groove located in the non-display area on the side opposite to the flexible substrate, at least a portion of the auxiliary sacrificial structure is embedded in the second groove, and the second groove is closer to the display area than the first groove.

[0042] Optionally, the auxiliary sacrificial structure is disposed in the same layer as the sacrificial structure and is made of the same material.

[0043] Optionally, the first groove penetrates the inorganic insulating layer, and the flexible substrate has a third groove communicating with the first groove, the third groove penetrating at least the second organic substrate layer;

[0044] The sacrificial structure is also embedded in the third groove.

[0045] Optionally, the third groove extends through to the surface of the first organic substrate layer on the side facing the second organic substrate layer.

[0046] Optionally, the non-display area includes: two first border areas disposed opposite to each other in a first direction, and a second border area and a third border area disposed opposite to each other in a second direction; the third border area has a binding area inside;

[0047] The sacrificial structure is distributed at least within the two first border regions and the second border region, and the first direction intersects the second direction.

[0048] Optionally, the encapsulation layer includes: a first inorganic encapsulation layer, an organic encapsulation layer, and a second inorganic encapsulation layer stacked together, wherein the first inorganic encapsulation layer is closer to the flexible substrate than the second inorganic encapsulation layer;

[0049] The first inorganic encapsulation layer is in direct contact with the portion of the second inorganic encapsulation layer located in the non-display area, and is used to form the inorganic contact portion. The orthographic projection of the inorganic contact portion on the flexible substrate is distributed around the orthographic projection of the organic encapsulation layer on the flexible substrate.

[0050] On the other hand, a display module is provided, including a driver chip and a display panel electrically connected to the driver chip, wherein the display panel is any of the display panels described above.

[0051] On the other hand, a display device is provided, comprising: a housing, and a display module connected to the housing, wherein the display module is the display module described above.

[0052] The beneficial effects of the technical solutions provided in this application are:

[0053] By providing a reinforcement layer between the first organic substrate layer and the second organic substrate layer, the reinforcement layer can be located between the first organic substrate layer and the first inorganic layer or between the first inorganic layer and the second organic substrate layer. This allows for a concave-convex fit between the reinforcement layer and the second organic substrate layer, and also between the first inorganic layer and the second organic substrate layer, thereby improving the interlayer bonding strength between the structural layers of the flexible substrate. Furthermore, this can mitigate problems such as delamination or cracks between the organic and inorganic layers of the flexible substrate, improving the reliability of the flexible substrate and ultimately ensuring the normal functioning of the display panel. Attached Figure Description

[0054] To more clearly illustrate the technical solutions in the embodiments of this application, the accompanying drawings used in the description of the embodiments will be briefly introduced below. Obviously, the accompanying drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0055] Figure 1A top view of the display panel provided in an embodiment of this application;

[0056] Figure 2 for Figure 1 A schematic diagram of the film layer of the display panel at point AA is shown;

[0057] Figure 3 for Figure 1 A schematic diagram of the film layer at BB of the display panel is shown;

[0058] Figure 4 This is a schematic diagram of the structure of the flexible substrate provided in the embodiments of this application;

[0059] Figure 5 A top view of the enhancement layer provided in an embodiment of this application;

[0060] Figure 6 Another top view of the enhancement layer provided in the embodiments of this application;

[0061] Figure 7 for Figure 1 A schematic diagram of another film layer at the BB point of the display panel is shown;

[0062] Figure 8 This is a top view of the foldable display panel provided in an embodiment of this application;

[0063] Figure 9 Another top view of the enhancement layer provided in the embodiments of this application;

[0064] Figure 10 Another top view of the folding display panel provided in the embodiments of this application;

[0065] Figure 11 A top view of a rollable display panel provided in an embodiment of this application;

[0066] Figure 12 This is a schematic diagram of the structure of a flexible substrate provided in another embodiment of this application;

[0067] Figure 13 Another schematic diagram of a flexible substrate provided in another embodiment of this application;

[0068] Figure 14 for Figure 1 The diagram shows another type of film layer on the display panel at BB.

[0069] Figure 15 A schematic diagram of the sacrificial structure provided in the embodiments of this application;

[0070] Figure 16 for Figure 1 The diagram shows another type of film layer on the display panel at the BB point;

[0071] Figure 17 for Figure 1 A schematic diagram of the film layer of another embodiment of the display panel at BB is shown;

[0072] Figure 18 This is a top view of a display panel provided in another embodiment of this application. Detailed Implementation

[0073] To make the objectives, technical solutions, and advantages of this application clearer, the embodiments of this application will be described in further detail below with reference to the accompanying drawings.

[0074] This application provides a display panel; please refer to... Figures 1 to 3 , Figure 1 This is a top view of the display panel provided in an embodiment of this application. Figure 2 for Figure 1 The diagram shown illustrates the film layer of the display panel at point AA. Figure 3 for Figure 1 The schematic diagram of the film layer at BB of the display panel is shown. The display panel 000 has a display area 001 and a non-display area 002 surrounding the display area 001. The display panel 000 may include: a flexible substrate 100, multiple pixel driving circuits P and multiple light-emitting devices 500.

[0075] Multiple pixel driving circuits P are located on one side of the flexible substrate 100 and are distributed at least within the display area 001.

[0076] Multiple light-emitting devices 500 correspond to multiple pixel driving circuits P. The light-emitting devices 500 are located on the side of the corresponding pixel driving circuit P away from the flexible substrate 100 and are electrically connected to the corresponding pixel driving circuit P.

[0077] Please refer to Figures 2 to 4 , Figure 4 The present invention provides a schematic diagram of the structure of a flexible substrate. The flexible substrate 100 may include: a first organic substrate layer 101, a first inorganic layer 102 and a second organic substrate layer 103 stacked together, and a reinforcement layer 104 located between the first organic substrate layer 101 and the second organic substrate layer 103; the second organic substrate layer 103 is closer to the pixel driving circuit P than the first organic substrate layer 101, and the reinforcement layer 104 and the second organic substrate layer are in a concave-convex fit; the reinforcement layer 104 is at least distributed in the non-display area 002.

[0078] For example, such as Figure 2 As shown, the light-emitting device 500 may include a first electrode 501, a light-emitting layer 502, and a second electrode 503 stacked together, wherein the first electrode 501 is electrically connected to the pixel driving circuit P.

[0079] The display panel 000 may also include: a first planarization layer 300, a pixel definition layer 400, and an encapsulation layer 600.

[0080] The first planarization layer 300 is located on the side of the pixel driving circuit P away from the flexible circuit, and the first electrode 501 of the light-emitting device 500 is located on the side of the first planarization layer 300 away from the flexible substrate 100.

[0081] The pixel definition layer 400 is located on the side of the first electrode 501 layer away from the flexible substrate 100, and the pixel definition layer 400 has multiple pixel openings corresponding to the first electrodes 501 of the multiple light-emitting devices 500. The orthogonal projection of the pixel opening on the flexible substrate 100 is located within the orthogonal projection of the corresponding first electrode 501 on the flexible substrate 100.

[0082] The encapsulation layer 600 is located on the side of the multiple light-emitting devices 500 that is away from the flexible substrate 100.

[0083] For example, such as Figure 2 and Figure 3 As shown, the reinforcement layer 104 may be distributed only within the non-display area 002, and the display panel 000 may have peripheral circuit structures such as a gate driving circuit 0021 and a power signal line 0022 within the non-display area 002. For example, the non-display area 002 may include a central region 002a and an edge region 002b, with the central region 002a being closer to the display area 001 than the edge region 002b. The aforementioned gate driving circuit 0021 and power signal line 0022 may be located within the central region 002a. Since the flexible substrate 100 may experience cracks or delamination, the portion of the flexible substrate 100 in the edge region 002b of the non-display area 002 is more likely to be affected. Therefore, the reinforcement layer 104 is at least distributed within the edge region 002b of the non-display area 002.

[0084] In this embodiment of the application, a reinforcement layer 104 is provided between the first organic substrate layer 101 and the second organic substrate layer 103, such as... Figure 4 As shown, the reinforcing layer 104 can be located between the first organic substrate layer 101 and the first inorganic layer 102, and can also be located between the first inorganic layer 102 and the second organic substrate layer 103. This allows for a concave-convex fit between the reinforcing layer 104 and the second organic substrate layer 103, and also between the first inorganic layer 102 and the second organic substrate layer 103, thereby improving the interlayer bonding strength between the multiple structural layers of the flexible substrate 100. Furthermore, this can mitigate problems such as delamination or cracks between the organic and inorganic layers of the flexible substrate 100, improving the reliability of the flexible substrate 100 and ultimately ensuring the normal functioning of the display panel 000.

[0085] The embodiments of this application can improve the delamination problem of flexible substrates, enhance the structural stability of flexible display panels, and the reinforcement layer can also improve the strength of non-display areas. Specifically, by adding the reinforcement layer, the original planar bonding of the flexible substrate can be changed to a concave-convex bonding, improving the interfacial bonding force between the two organic substrate layers, especially in the non-display areas, ultimately improving the stability of the display panel under high temperature and high humidity environments.

[0086] For some possible implementation methods, please refer to Figure 5 and Figure 6 , Figure 5 This is a top view of the enhancement layer provided in an embodiment of this application. Figure 6 This is another top view of the reinforcement layer provided in the embodiment of this application. The reinforcement layer 104 may include: a plurality of first reinforcement lines 104a arranged along the first direction X, and a plurality of second reinforcement lines 104b arranged along the second direction Y; the first direction X intersects the second direction Y, for example, the first direction X is perpendicular to the second direction Y.

[0087] The first reinforcing line 104a and the second reinforcing line 104b are connected at their intersection.

[0088] For example, the overall extension direction of the first reinforcing line 104a can be parallel to the second direction Y, and the overall extension direction of the second reinforcing line 104b can be parallel to the first direction X. In this way, through the interlaced grid of reinforcing lines (the first reinforcing line 104a and the second reinforcing line 104b), a concave-convex fit can be achieved between the first organic substrate layer 101 and the second organic substrate layer 103. Furthermore, the grid of reinforcing lines can be selectively distributed within the non-display area 002, or distributed within both the display area 001 and the non-display area 002, depending on actual needs. Figure 5 As shown, the enhancement layer 104 can be distributed only within the non-display area 002, such as... Figure 6 As shown, the enhancement layer 104 can also be distributed within the display area 001. In this way, the enhancement layer 104 can be used to enhance the areas where the interface bonding needs to be strengthened.

[0089] For example, the mesh-like reinforcing lines can be formed using inkjet printing, screen printing, or dispensing, or they can be patterned using photolithography and etching.

[0090] Among some possible implementations, such as Figure 6 As shown, the enhancement layer 104 is also distributed within the display area 001.

[0091] Specifically, in the first direction X, the arrangement density of the first enhancement line 104a located in the non-display area 002 is greater than or equal to the arrangement density of the first enhancement line 104a located in the display area 001. And / or, in the second direction Y, the arrangement density of the second enhancement line 104b located in the non-display area 002 is greater than or equal to the arrangement density of the second enhancement line 104b located in the display area 001.

[0092] like Figure 6 As shown, since the flexible substrate 100 is more prone to cracking or delamination in the non-display area 002, the reinforcement layer 104 improves the interfacial bonding strength of the structural layer in the non-display area 002 by providing reinforcement lines with a higher density in the non-display area 002. In this embodiment, the interfacial bonding strength of the structural layer in the non-display area 002 can be improved by increasing the density of at least one of the first reinforcement line 104a and the second reinforcement line 104b in the non-display area 002.

[0093] Among some possible implementations, such as Figure 6 As shown, the center distance between two adjacent first enhancement lines 104a in the non-display area 002 is less than or equal to the center distance between two adjacent first enhancement lines 104a in the display area 001. And / or, the center distance between two adjacent second enhancement lines 104b in the non-display area 002 is less than or equal to the center distance between two adjacent second enhancement lines 104b in the display area 001.

[0094] In this embodiment, the arrangement density of the enhancement lines in the display area 001 and the non-display area 002 can be adjusted by adjusting the center distance between two adjacent first enhancement lines 104a and / or the center distance between two adjacent second enhancement lines 104b. Furthermore, the arrangement density of the enhancement lines in the non-display area 002 can be further increased by adjusting the linewidths of the first enhancement lines 104a and the second enhancement lines 104b.

[0095] For example, the linewidth of the first enhancement line 104a in the non-display area 002 is smaller than the linewidth of the first enhancement line 104a in the display area 001. And / or, the linewidth of the second enhancement line 104b in the non-display area 002 is smaller than the linewidth of the second enhancement line 104b in the display area 001.

[0096] For example, when the linewidth of the first enhancement line 104a is reduced, the center-to-center spacing between two adjacent first enhancement lines 104a can be further reduced, thus achieving a higher density of enhancement lines. Therefore, by arranging the first enhancement lines 104a / second enhancement lines 104b with smaller linewidths in the non-display area 002, the density of the first enhancement lines 104a / second enhancement lines 104b in the non-display area 002 can be further increased.

[0097] For example, please refer to Figure 7 , Figure 7 for Figure 1 The diagram shows another film layer of the display panel at BB. In the non-display area 002 or display area 001, the reinforcement lines can also be non-uniformly distributed. The arrangement density described in the above embodiment can be regarded as the average arrangement density of reinforcement lines in a region.

[0098] For example, within the non-display area 002, the density of the enhancement lines in the edge region 002b is greater than the density of the enhancement lines in the central region 002a. Figure 7 As shown, the line width of the reinforcement line located in the edge region 002b is smaller than that in the center region 002a, and the center-to-center distance between the two reinforcement lines is also smaller.

[0099] Similarly, the line width and center distance of the enhancement lines located in display area 001 can also be set in different ways for different areas according to actual needs.

[0100] For some possible implementation methods, please refer to Figures 8-9 , Figure 8 This is a top view of the foldable display panel provided in the embodiment of this application. Figure 9 Another top view of the enhancement layer provided in the embodiments of this application, as shown below. Figure 8 As shown, the display panel 000 can be a foldable display panel; the display area 001 can include: a foldable display area 001a, and two planar display areas 001b located on both sides of the foldable display area 001a; the foldable display area 001a is distributed between the two planar display areas 001b in the second direction Y, and the bending axis O of the foldable display area 001a is parallel to the first direction X.

[0101] Among them, such as Figure 9 As shown, in the second direction Y, the arrangement density of the second reinforcement line 104b located in the folded display area 001a is less than the arrangement density of the second reinforcement line 104b located in the flat display area 001b.

[0102] Because the folded display panel 000 experiences less stress in the folded display area 001a compared to the flat display area 001b, a lower density of second reinforcing lines 104b can be arranged within the folded display area 001a, meaning the arrangement density of the second reinforcing lines 104b in the flat display area 001b is higher. This improves the flexibility of the substrate 100's resistance to delamination and pitting cracks in the flat display area 001b.

[0103] It should be noted that, as Figure 9 As shown, the average arrangement density of the reinforcement lines of the reinforcement layer 104 provided in this embodiment is greater than the average arrangement density in the display area 001 than in the display area 002. This does not exclude the possibility that the local arrangement density in the display area 001 may be greater than the local arrangement density in the non-display area 002. However, for two regions arranged in the same direction (first direction X or second direction Y), the arrangement density of the region located in the non-display area 002 is greater than or equal to the arrangement density of the region located in the display area 001.

[0104] In some possible implementations, the display area 001 may also include a transition display area 001c located in the second direction Y between the folded display area 001a and the flat display area 001b.

[0105] In the second direction Y, the arrangement density of the second enhancement line 104b located in the transition display area 001c is greater than that of the second enhancement line 104b located in the planar display area 001b.

[0106] In this embodiment, a transition display area 001c is also distributed between the folded display area 001a and the flat display area 001b. The transition display area 001c experiences the greatest stress during the bending process of the display panel 000. Therefore, a higher density of second reinforcing lines 104b can be arranged in the transition display area 001c to improve the bending resistance of the display panel 000 in the folded display area 000a.

[0107] For example, the corresponding display area 001 can be divided into a flat display area 001b, a transition display area 001c, and a folded display area 001a. The display panel 000 can be correspondingly divided into a flat area 000b, a transition area 000c, and a folded area 000a. The flat area 000b includes the flat display area 001b, the transition area 000c includes the transition display area 001c, and the folded area 000a includes the folded display area 001a.

[0108] Please refer to Figure 9 and Figure 10 , Figure 10In another top view of the foldable display panel provided in this application embodiment, in the second direction Y, the arrangement density of the second reinforcing line 104b located in the folding region 000a is less than the arrangement density of the second reinforcing line 104b located in the planar region 000b; the arrangement density of the second reinforcing line 104b located in the transition region 000c is greater than the arrangement density of the second reinforcing line 104b located in the planar region 000b.

[0109] Thus, the density of the second reinforcing line 104b in the portion of the non-display area 002 corresponding to the transition area 000c is greater than or equal to the density of the second reinforcing line 104b in the portion of the non-display area 002 corresponding to the planar area 000b, and the density of the second reinforcing line 104b in the portion of the non-display area 002 corresponding to the folded area 000a is greater than or equal to the density of the second reinforcing line 104b in the portion of the non-display area 002 corresponding to the folded area 000a. Furthermore, the density of the second reinforcing line 104b in the non-display area 002 and the transition area 000c of the flexible substrate 100 can be maximized, avoiding the problem of cracks or delamination in the transition area 000c of the flexible substrate 100 due to bending. Of course, the reinforcing layer 104 may not be provided in the display area 001, but this does not affect the magnitude relationship of the arrangement density of the second reinforcing line 104b in the non-display area 002.

[0110] like Figure 9 and Figure 10 As shown, the center spacing between the two second enhancement lines 104b can be different in the display area 001 and the non-display area 002, or it can be the same. By setting different spacing, the arrangement density can be differentiated between the display area 001 and the non-display area 002.

[0111] For some possible implementation methods, please refer to Figure 1 and Figure 11 , Figure 11 This is a top view of a rollable display panel provided in an embodiment of this application. The display panel 000 can be a rollable display panel. The display panel 000 has a first end 0001 and a second end 0002 disposed opposite to each other in the second direction Y. The first end 0001 is used to connect with a fixed housing in a display device, and the second end 0002 is used to connect with a sliding housing in a display device.

[0112] In particular, along the direction from the first end 0001 to the second end 0002, the center distance between two adjacent second reinforcing lines 104b gradually increases.

[0113] Since the first end 0001 of the display panel 000 serves as the fixed end of the display panel 000, and the second end 0002 serves as the rollable end of the display panel 000, the stress on the first end 0001 is greater than the stress on the second end 0002 during the rolling process. Therefore, by providing a second reinforcing line 104b with a higher density near the first end 0001, the anti-rolling ability of the display panel 000 can be improved, and the probability of cracks or delamination appearing on the flexible substrate 100 of the display panel 000 near the first end 0001 can also be reduced.

[0114] For example, such as Figure 11 As shown, the arrangement density of the first enhancement line 104a in the non-display area 002 is greater than that in the display area 001.

[0115] In some possible implementations, the material of the reinforcing layer 104 may include a polymer material.

[0116] For example, the material of the reinforcing layer 104 can be a polymer material suitable for display panel 000, such as polyimide (PI), polyethylene terephthalate (PET), and polyethylene naphthalate (PEN). This polymer material can be used as an organic thin-film functional layer of the display panel 000, such as a substrate layer, a first planarization layer 300, or a pixel definition layer 400. Therefore, the aforementioned polymer materials can also be used to form the reinforcing layer 104, eliminating the need for materials other than those commonly used in display panel 000 and their corresponding production equipment, thus reducing production costs.

[0117] In some possible implementations, the molecular alignment direction of the first reinforcing line 104a is parallel to the extension direction of the first reinforcing line 104a, and the molecular alignment direction of the second reinforcing line 104b is parallel to the extension direction of the second reinforcing line 104b.

[0118] In this embodiment, the first reinforcing line 104a and the second reinforcing line 104b can be prepared by inkjet printing, screen printing, or dispensing, so that the extension direction of the first reinforcing line 104a is parallel to the second direction Y, and the extension direction of the second reinforcing line 104b is parallel to the first direction X. Furthermore, before the multiple first reinforcing lines 104a are formed and cured, the molecular arrangement direction of the first reinforcing lines 104a can be adjusted by various controllable direction polymerization methods such as electrospinning and electric field-directed polymerization, so that the molecular arrangement direction of the first reinforcing lines 104a is parallel to their extension direction. Similarly, the molecular arrangement direction of the second reinforcing line 104b can also be made parallel to its extension direction. This is beneficial for improving the bending resistance of the first reinforcing lines 104a and the second reinforcing lines 104b.

[0119] For example, the reinforcing layer can also be a material film layer with an entire layer of reinforcement. Before curing, the molecular arrangement direction of the reinforcing layer 104 film layer can be adjusted by various controllable direction polymerization methods such as electrospinning and electric field directional polymerization. Then, the oriented first reinforcing line 104a can be obtained through patterning. Similarly, the oriented second reinforcing line 104b can be obtained using the same method.

[0120] In some possible implementations, the flexible substrate 100 may further include an amorphous silicon layer 105 located between the second organic substrate layer 103 and the first inorganic layer 102.

[0121] The reinforcement layer 104 is located between the first organic substrate layer 101 and the amorphous silicon layer 105, or the reinforcement layer 104 is located between the amorphous silicon layer 105 and the second organic substrate layer 103.

[0122] In this embodiment of the application, taking the first organic substrate layer 101, the second organic substrate layer 103 and the reinforcing layer 104 as examples, all of which are made of polyimide, the silanol (Si-OH) and other groups on the surface of the amorphous silicon layer 105 can form hydrogen bonds with the polar groups in the polyimide molecules of the organic substrate layer. Although the bond energy of the hydrogen bonds is relatively weak, the presence of a large number of hydrogen bonds can enhance the bonding force between the two polyimide layers as a whole.

[0123] For example, the stability of the amorphous silicon layer 105 under high temperature and high humidity conditions is relatively lower than that of the first inorganic layer 102. Water vapor molecules may invade and damage the structure of the amorphous silicon layer 105. Therefore, in this embodiment of the application, the amorphous silicon layer 105 is disposed on the side of the first inorganic layer 102 away from the first organic substrate layer 101. In this way, the amorphous silicon layer 105 can be protected by the first inorganic layer 102.

[0124] For some possible implementation methods, please refer to Figures 12-13 , Figure 12 This is a schematic diagram of the structure of a flexible substrate provided in another embodiment of this application. Figure 13 This is another schematic diagram of a flexible substrate provided in another embodiment of this application. In the case where the reinforcing layer 104 is located between the first organic substrate layer 101 and the amorphous silicon layer 105, as shown... Figure 12 As shown, the reinforcement layer 104 is located between the first inorganic layer 102 and the amorphous silicon layer 105, or, as... Figure 13 As shown, the reinforcement layer 104 is located between the first inorganic layer 102 and the first organic substrate layer 101.

[0125] When the flexible substrate 100 has an amorphous silicon layer 105, the amorphous silicon layer 105 can be disposed on the side of the first inorganic layer 102 facing away from the first organic substrate layer 101. In this case, the reinforcement layer 104 can be located on the first inorganic layer 102 or on the layer of the reinforcement layer 104 facing the first organic substrate layer 101. In this way, at least the amorphous silicon layer 105 can be made uneven, and the amorphous silicon layer 105 can have a concave-convex fit with the second organic substrate layer 103, thereby enhancing the interfacial bonding force between the amorphous silicon layer 105 and the second organic substrate layer 103.

[0126] For example, such as Figure 13 As shown, when the reinforcing layer 104 is in direct contact with the first organic substrate layer 101, the reinforcing layer 104 can be made of the same material as the first organic substrate layer 101, such as PI. In this way, the reinforcing layer 104 can be formed simultaneously during the preparation of the first organic substrate layer 101, so that the first organic substrate layer 101 and the reinforcing layer 104 are an integrally formed structure with high connection strength.

[0127] Among some possible implementations, such as Figure 12 and Figure 13 As shown, the flexible substrate 100 may further include a second inorganic layer 106 located on the side of the second organic substrate layer 103 opposite to the first organic substrate layer 101.

[0128] In this embodiment of the application, a multilayer substrate structure can be formed by setting overlapping organic and inorganic substrate layers. The first inorganic layer 102 and the second inorganic layer 106 can serve as barrier layers to block water vapor.

[0129] For some possible implementation methods, please refer to Figure 2 and Figure 14 , Figure 14 for Figure 1 The diagram shows another film layer of the display panel at BB. The display panel 000 may also include: an encapsulation layer 600 and a sacrificial structure 700.

[0130] The encapsulation layer 600 is located on the side of the plurality of light-emitting devices 500 away from the flexible substrate 100. The encapsulation layer 600 has inorganic contact portions 600a distributed in the non-display area 002, and the inorganic contact portions 600a are distributed around the display area 001.

[0131] The sacrificial structure 700 is distributed within the non-display area 002 and is distributed around at least a portion of the edge of the inorganic contact portion 600a.

[0132] In this case, at least a portion of the sacrificial structure 700 in the orthographic projection of the flexible substrate 100 is located outside the orthographic projection of the inorganic contact portion 600a in the flexible substrate 100.

[0133] In this embodiment, the sacrificial structure 700 can react with water vapor or oxygen, thereby preventing corrosive gases or liquids such as water vapor or oxygen from eroding the central region 002a of the non-display area 002 and the display area 001 along the inorganic contact portion 600a of the encapsulation layer 600, thus protecting the circuit and the light-emitting device 500. This embodiment primarily uses protection against water vapor as an example and does not limit the sacrificial structure 700 to reacting with other corrosive substances.

[0134] For example, the sacrificial structure 700 may be partially covered by the inorganic contact portion 600a of the encapsulation layer 600, or it may be entirely located outside the inorganic contact portion 600a. In this way, at least a portion of the sacrificial structure 700 is exposed outside the encapsulation layer 600, allowing it to preferentially react with the inorganic contact portion 600a and substances such as moisture that can corrode or erode the light-emitting device 500. Furthermore, since the inorganic contact portion 600a can be moved outward toward the outer edge of the display panel 000, the size of the edge region 002b of the non-display area 002 of the display panel 000 can be compressed, ultimately reducing the bezel size of the display panel 000.

[0135] For example, when the entire portion of the sacrificial structure 700 in the orthographic projection of the flexible substrate 100 is outside the orthographic projection of the inorganic contact portion 600a in the flexible substrate 100, the distance between the sacrificial structure 700 and the inorganic contact portion 600a in the direction parallel to the flexible substrate 100 is less than the thickness of the sacrificial structure 700 in the direction perpendicular to the flexible substrate 100. In other words, the sacrificial structure 700 is as close as possible to the inorganic contact portion 600a to prevent moisture from directly intruding into the inorganic contact portion 600a without being effectively absorbed by the sacrificial structure 700.

[0136] For some possible implementation methods, please refer to Figure 15 , Figure 15 The present invention provides a schematic diagram of the sacrificial structure 700. The sacrificial structure 700 may include: a first protective layer 701, a sacrificial metal layer 702 and a second protective layer 703 stacked together; the first protective layer 701 is closer to the flexible substrate 100 than the second protective layer 703, and the orthographic projection of the second protective layer 703 onto the flexible substrate 100 is located within the orthographic projection of the sacrificial metal layer 702 onto the flexible substrate 100.

[0137] The reactivity of the sacrificial metal layer 702 is greater than that of the first protective layer 701 and also greater than that of the second protective layer 703.

[0138] In this embodiment, the sacrificial metal layer 702 is exposed at least on its sides to the second protective layer 703, allowing it to react with and absorb moisture. Furthermore, the first protective layer 701 and the second protective layer 703 are less reactive than the sacrificial metal layer 702, ensuring that the sacrificial metal layer 702 is not completely exposed to the moisture environment and extending its effective operating time. This prevents premature oxidation and failure of the sacrificial metal layer 702 during the manufacturing process of the display panel 000 due to moisture or oxygen.

[0139] Among some possible implementations, such as Figure 2 As shown, the conductive layer where some conductive structures in the pixel driving circuit P are located is the source / drain metal layer SD, and the light-emitting device 500 may include a first electrode 501 electrically connected to the pixel driving circuit P.

[0140] In this configuration, the sacrificial structure 700 is disposed in the same layer as the source / drain metal layer SD and is made of the same material; or, the sacrificial structure 700 is disposed in the same layer as the first electrode 501 and is made of the same material.

[0141] In this embodiment, the sacrificial structure 700 can be formed simultaneously using a structure with stacked film layers, such as the source / drain metal layer SD or the first electrode 501, thus eliminating the need for additional processing costs. The source / drain metal layer SD can include: titanium, aluminum, and a stacked structure of titanium, with aluminum serving as the sacrificial metal layer 702. Titanium can serve as both the first protective layer 701 and the second protective layer 703. The first electrode 501 can include: ITO (indium tin oxide), silver, and a stacked structure of ITO, with silver serving as the sacrificial metal layer 702, and ITO serving as both the first and second protective layers 701 and 703.

[0142] For some possible implementation methods, please refer to Figure 2 , Figure 15 and Figure 16 , Figure 16 for Figure 1 The diagram shows another type of film layer at BB of the display panel. The display panel 000 may also include an inorganic insulating layer 200 located between the sacrificial structure 700 and the flexible substrate 100.

[0143] The inorganic insulating layer 200 has a first groove on the side facing away from the flexible substrate 100, and at least a portion of the sacrificial structure 700 is embedded in the first groove.

[0144] For example, the inorganic insulating layer 200 may include multiple inorganic layers, such as a first gate insulating layer 201, a second gate insulating layer 202, and an interlayer dielectric layer 203. The sacrificial structure 700 is embedded in a portion of the aforementioned multiple inorganic layers, thereby allowing the absorption of moisture at the interfaces of these inorganic layers.

[0145] For example, the sacrificial structure 700 can completely penetrate the inorganic insulating layer 200 and part of the flexible substrate 100, and the sacrificial structure 700 can also absorb moisture between the structural layers in the flexible substrate 100. In addition, the sacrificial structure 700 is embedded in the flexible substrate 100, so that even if delamination or cracks occur at the edge of the flexible substrate 100, they will be isolated by the sacrificial structure 700.

[0146] For example, such as Figure 7 As shown, the portion of the display panel 000 within the non-display area 002 may have a first dam structure 900, a second dam structure 1000a, and a third dam structure 1000b. These three dam structures can be formed using organic layers, such as at least one of a first planarization layer 300, a pixel definition layer 400, and a support layer. Specifically, the first dam structure 900 may be formed using the first planarization layer 300, the second dam structure 1000a may be formed by stacking the first planarization layer 300, the pixel definition layer 400, and the support layer, and the third dam structure 1000b may be formed by stacking the first planarization layer 300 and the pixel definition layer 400.

[0147] The first dam structure 900 is further away from the display area 001 than the second dam structure 1000a and the third dam structure 1000b, while the third dam structure 1000b is closer to the display area 001 than the second dam structure 1000a. For example, the first dam structure 900, the second dam structure 1000a, and the third dam structure 1000b can be distributed around the gate drive circuit 0021. The first dam structure 900 can be embedded in the inorganic insulating layer 200, which can prevent crack propagation in the inorganic insulating layer 200. Since the sacrificial structure 700 can also have a similar technical effect, the sacrificial structure 700 can be further away from the display area 001 than the first dam structure 900, or, as... Figure 7 As shown, the sacrificial structure 700 is located between the first dam structure 900 and the second dam structure 1000a.

[0148] Both the second dam structure 1000a and the third dam structure 1000b can be used to enclose the organic encapsulation layer 602. This enclosure function can be achieved by using at least one of the two structures. The second dam structure 1000a and the third dam structure 1000b prevent the organic encapsulation layer 602 from being distributed within the edge region 002b. This allows the first inorganic encapsulation layer 601 and the second inorganic encapsulation layer 603 to form inorganic contact portions 600a within the edge region 002b, thereby effectively blocking moisture. Furthermore, the second dam structure 1000a and the third dam structure 1000b ensure that the organic encapsulation layer 602 forms a flat film with clear boundaries, resulting in a smooth surface on the side of the organic encapsulation layer 602 facing away from the flexible substrate 100. This allows for the high-quality formation of subsequent functional layers such as the touch layer, light-shielding layer, and color filter layer.

[0149] For some possible implementation methods, please refer to Figure 17 , Figure 17 for Figure 1 The schematic diagram of the film layer of another embodiment of the display panel at BB is shown. The display panel 000 may further include: an auxiliary sacrificial structure 800 distributed in the non-display area 002. The auxiliary sacrificial structure 800 is located on the side of the inorganic insulating layer 200 away from the flexible substrate 100 and is closer to the display area 001 than the sacrificial structure 700.

[0150] In this case, the orthographic projection of the auxiliary sacrificial structure 800 onto the flexible substrate 100 is located within the orthographic projection of the inorganic contact portion 600a onto the flexible substrate 100.

[0151] In this embodiment, the sacrificial structure 700 can initially absorb moisture. Moisture not absorbed by the sacrificial structure 700 can be reabsorbed by the auxiliary sacrificial structure 800, further protecting against moisture erosion. Furthermore, the orthographic projection of the auxiliary sacrificial structure 800 onto the flexible substrate 100 is located within the orthographic projection of the inorganic contact portion 600a onto the flexible substrate 100. The auxiliary sacrificial structure 800, covered by the inorganic insulating portion 600a, can prevent premature oxidation by environmental moisture and will not fail prematurely.

[0152] In some possible implementations, the inorganic insulating layer 200 on the side opposite to the flexible substrate 100 also has a second groove located in the non-display area 002, at least a portion of the auxiliary sacrificial structure 800 is embedded in the second groove, and the second groove is closer to the display area 001 than the first groove.

[0153] For example, the auxiliary sacrificial structure 800 is embedded in a portion of the inorganic insulating layer 200, so that moisture in the interface of these inorganic layers can also be absorbed.

[0154] like Figure 17 As shown, in the direction perpendicular to the flexible substrate 100, the depths of the sacrificial structure 700 and the auxiliary sacrificial structure 800 can be different. For example, the sacrificial structure 700 is embedded not only in the inorganic insulating layer 200 but also in the flexible substrate 100, while the auxiliary sacrificial structure 800 is embedded only in the inorganic insulating layer 200. As another example, the auxiliary sacrificial structure 800 is embedded not only in the inorganic insulating layer 200 but also in the flexible substrate 100, while the sacrificial structure 700 is embedded only in the inorganic insulating layer 200.

[0155] In some possible implementations, the auxiliary sacrificial structure 800 is placed in the same layer as the sacrificial structure 700 and is made of the same material.

[0156] In the embodiments of this application, the auxiliary sacrificial structure 800 and the sacrificial structure 700 may be formed using the same process steps; or, one of the auxiliary sacrificial structure 800 and the sacrificial structure 700 may be disposed in the same layer as the source / drain metal layer SD and made of the same material, while the other may be disposed in the same layer as the first electrode 501 and made of the same material.

[0157] For example, since the orthographic projection of the auxiliary sacrificial structure 800 onto the flexible substrate 100 is located within the orthographic projection of the inorganic contact portion 600a onto the flexible substrate 100, that is, the auxiliary sacrificial structure 800 is covered by the inorganic contact portion 600a, the auxiliary sacrificial structure 800 can be made of only aluminum metal of the source / drain metal layer SD or silver metal of the first electrode 501.

[0158] In some possible implementations, the first groove penetrates the inorganic insulating layer 200, and the flexible substrate 100 has a third groove communicating with the first groove, the third groove penetrating at least the second organic substrate layer 103.

[0159] The sacrificial structure 700 is also embedded in the third groove.

[0160] In this embodiment, the depth of the sacrificial structure 700 is greater than the depth of the auxiliary sacrificial structure 800 in the direction perpendicular to the flexible substrate 100, and the sacrificial structure 700 is also embedded in the flexible substrate 100. To avoid cracks or delamination in the flexible substrate 100, it is generally necessary to limit the minimum distance between the inorganic contact portion 600a and the outer edge of the display panel 000, reserving space for crack or delamination propagation; that is, the size of the edge region 002b cannot be too small. Since the sacrificial structure 700 can be embedded in the flexible substrate 100, it can block crack or delamination propagation, thus reducing the distance between the inorganic contact portion 600a and the outer edge of the display panel 000.

[0161] For example, the third groove extends through the surface of the first organic substrate 101 toward the side of the second organic substrate 103.

[0162] In this embodiment, the portion of the sacrificial structure 700 embedded in the third groove can directly contact the first organic substrate layer 101. Thus, even if cracks or delamination occur at the edge of the flexible substrate 100, they can be isolated by the sacrificial structure 700. The sacrificial structure 700 can also enhance the interfacial bonding between the various structural layers of the flexible substrate 100.

[0163] For some possible implementation methods, please refer to Figure 18 , Figure 18 The top view of the display panel provided in another embodiment of this application shows that the non-display area 002 may include: two first border areas 002A disposed opposite to each other in the first direction X, and a second border area 002B and a third border area 002C disposed opposite to each other in the second direction Y; the third border area 002C has a binding area 003 inside.

[0164] The sacrificial structure 700 is distributed at least in two first border regions 002A and second border regions 002B, with the first direction X intersecting the second direction Y.

[0165] When the display panel 000 has an auxiliary sacrificial structure 800, the auxiliary sacrificial structure 800 may also be distributed in at least two first border areas 002A and second border areas 002B.

[0166] In this embodiment, the bonding area 003 can be used for bonding and connecting flexible circuit boards or driver chips. Various signal lines can also be distributed in the portion of the display panel 000 between the bonding area 003 and the display area 001. Therefore, the sacrificial structure 700 is not distributed between the bonding area 003 and the display panel 000. The ring-shaped sacrificial structure 700 can adequately protect the display panel 000 from moisture erosion.

[0167] Among some possible implementations, such as Figures 2-3 , Figure 14 , Figures 16-17 The encapsulation layer 600 may include a first inorganic encapsulation layer 601, an organic encapsulation layer 602, and a second inorganic encapsulation layer 603 stacked together, wherein the first inorganic encapsulation layer 601 is closer to the flexible substrate 100 than the second inorganic encapsulation layer 603.

[0168] The first inorganic encapsulation layer 601 and the portion of the second inorganic encapsulation layer 603 located in the non-display area 002 are in direct contact and are used to form an inorganic contact portion 600a. The orthographic projection of the inorganic contact portion 600a on the flexible substrate 100 is distributed around the orthographic projection of the organic encapsulation layer 602 on the flexible substrate 100.

[0169] In this embodiment, the encapsulation layer 600 may include stacked organic and inorganic layers. The organic encapsulation layer 602 expands after absorbing moisture, and the second electrode 503 and the light-emitting layer 502 located on the side of the first inorganic encapsulation layer 601 facing the flexible substrate 100 are also easily damaged by moisture. Moisture can penetrate along the interfaces of the film layers. Therefore, in the non-display area 002, the interfaces between the first inorganic encapsulation layer 601 and the second inorganic encapsulation layer 603, and the interfaces between the first encapsulation layer 600 and the inorganic insulating layer 200, need to be protected. This embodiment provides a sacrificial structure 700 on the outer side of the inorganic contact portion 600a, which protects the aforementioned interfaces and absorbs moisture flowing towards them.

[0170] For example, in the thin film deposition process, the film thickness uniformity of the non-display area 002 located at the edge is lower than that of the display area 001 in the middle during the first inorganic encapsulation layer 601 and the second inorganic encapsulation layer 603. Therefore, the film thickness of the first inorganic encapsulation layer 601 and the second inorganic encapsulation layer 603 in the inorganic contact portion 600a is relatively thin compared to the display area 001, and the film quality is also poor. Moisture is more likely to penetrate from the edge of the inorganic contact portion 600a, meaning that the encapsulation at this location is prone to failure. Therefore, this application embodiment provides a sacrificial structure 700 on the outside of the inorganic contact portion 600a to protect this easily failed location. The materials of the first inorganic encapsulation layer 601 and the second inorganic encapsulation layer 603 can be the same or different, for example, silicon nitride, silicon oxide, silicon oxynitride, aluminum oxide, titanium oxide, etc., which have water and oxygen barrier properties.

[0171] In summary, the display panel provided in this application includes a flexible substrate, multiple pixel driving circuits, and multiple light-emitting devices. By providing a reinforcement layer between the first organic substrate layer and the second organic substrate layer, the reinforcement layer can be located between the first organic substrate layer and the first inorganic layer, or between the first inorganic layer and the second organic substrate layer. This allows for a concave-convex fit between the reinforcement layer and the second organic substrate layer, and also between the first inorganic layer and the second organic substrate layer, thereby improving the interlayer bonding strength between the structural layers of the flexible substrate. Furthermore, it can mitigate problems such as delamination or cracks between the organic and inorganic layers of the flexible substrate, improve the reliability of the flexible substrate, and ultimately ensure the normal functioning of the display panel.

[0172] This application also provides a display module, which may include a driver chip and a display panel electrically connected to the driver chip, which is the display panel 000 described in any of the above embodiments.

[0173] The display module provided in this application embodiment can have the technical effects of the display panel 000 described above, which will not be repeated here.

[0174] This application also provides a display device, which may include: a housing, and a display module connected to the housing, wherein the display module is the display module described in the above embodiments.

[0175] Display devices can be displays in devices such as mobile phones, tablets, laptops, monitors, and smart TVs. Display devices can also possess the technical effects of the aforementioned display modules, which will not be repeated here.

[0176] It should be noted that the dimensions of layers and regions may be exaggerated in the accompanying drawings for clarity. Furthermore, it is understood that when an element or layer is referred to as being "on" another element or layer, it can be directly on the other element, or there may be intermediate layers. Additionally, it is understood that when an element or layer is referred to as being "below" another element or layer, it can be directly below the other element, or there may be more than one intermediate layer or element. Furthermore, it is also understood that when a layer or element is referred to as being "between" two layers or two elements, it can be the only layer between the two layers or two elements, or there may be more than one intermediate layer or element. Similar reference numerals throughout indicate similar elements.

[0177] In this application, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance. The term "multiple" refers to two or more unless otherwise expressly defined.

[0178] The above description is merely an optional embodiment of this application and is not intended to limit this application. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of this application should be included within the protection scope of this application.

Claims

1. A display panel, characterized in that, The display panel has a display area and a non-display area surrounding the display area; The display panel includes: a flexible substrate, multiple pixel driving circuits, and multiple light-emitting devices; The plurality of pixel driving circuits are located on one side of the flexible substrate and are distributed at least within the display area; The plurality of light-emitting devices correspond to the plurality of pixel driving circuits. The light-emitting devices are located on the side of the corresponding pixel driving circuit that is away from the flexible substrate and are electrically connected to the corresponding pixel driving circuit. The flexible substrate includes: a first organic substrate layer, a first inorganic layer and a second organic substrate layer stacked together, and a reinforcement layer located between the first organic substrate layer and the second organic substrate layer; the second organic substrate layer is closer to the pixel driving circuit than the first organic substrate layer, and the reinforcement layer and the second organic substrate layer are in a concave-convex fit; the reinforcement layer is distributed at least in the non-display area.

2. The display panel according to claim 1, characterized in that, The reinforcement layer includes: a plurality of first reinforcement lines arranged along a first direction, and a plurality of second reinforcement lines arranged along a second direction; the first direction and the second direction intersect. The first reinforcing line and the second reinforcing line are connected at their intersection.

3. The display panel according to claim 2, characterized in that, The enhancement layer is also distributed within the display area; Wherein, in the first direction, the arrangement density of the first enhancement line located in the non-display area is greater than or equal to the arrangement density of the first enhancement line located in the display area; And / or, in the second direction, the arrangement density of the second enhancement line located in the non-display area is greater than or equal to the arrangement density of the second enhancement line located in the display area.

4. The display panel according to claim 3, characterized in that, The center distance between two adjacent first enhancement lines in the non-display area is less than or equal to the center distance between two adjacent first enhancement lines in the display area. And / or, the center distance between two adjacent second enhancement lines arranged in the non-display area is less than or equal to the center distance between two adjacent second enhancement lines arranged in the display area.

5. The display panel according to claim 4, characterized in that, The line width of the first enhancement line in the non-display area is smaller than the line width of the first enhancement line in the display area; And / or, the line width of the second enhancement line in the non-display area is smaller than the line width of the second enhancement line in the display area.

6. The display panel according to claim 3, characterized in that, The display panel is a foldable display panel; the display area includes: a foldable display area, and two planar display areas located on both sides of the foldable display area; the foldable display area is distributed between the two planar display areas in the second direction, and the bending axis of the foldable display area is parallel to the first direction; In the second direction, the arrangement density of the second reinforcement line located in the folded display area is less than that of the second reinforcement line located in the flat display area.

7. The display panel according to claim 6, characterized in that, The display area further includes: a transition display area located between the folded display area and the flat display area in the second direction; In the second direction, the arrangement density of the second enhancement line located in the transition display area is greater than that of the second enhancement line located in the planar display area.

8. The display panel according to claim 3, characterized in that, The display panel is a rollable display panel, and the display panel has a first end and a second end disposed opposite to each other in the second direction. The first end is used to connect with a fixed housing in the display device, and the second end is used to connect with a sliding housing in the display device. In the direction from the first end to the second end, the center distance between two adjacent second reinforcing lines gradually increases.

9. The display panel according to any one of claims 2-8, characterized in that, The reinforcing layer is made of a high molecular polymer material.

10. The display panel according to claim 8, characterized in that, The molecular arrangement direction of the first reinforcing line is parallel to the extension direction of the first reinforcing line, and the molecular arrangement direction of the second reinforcing line is parallel to the extension direction of the second reinforcing line.

11. The display panel according to any one of claims 1-8 and 10, characterized in that, The flexible substrate further includes: an amorphous silicon layer located between the second organic substrate layer and the first inorganic layer; The reinforcement layer is located between the first organic substrate layer and the amorphous silicon layer, or the reinforcement layer is located between the amorphous silicon layer and the second organic substrate layer.

12. The display panel according to claim 11, characterized in that, When the reinforcing layer is located between the first organic substrate layer and the amorphous silicon layer, the reinforcing layer is located between the first inorganic layer and the amorphous silicon layer, or the reinforcing layer is located between the first inorganic layer and the first organic substrate layer.

13. The display panel according to any one of claims 1-8, 10, and 12, characterized in that, The display panel further includes: an encapsulation layer and a sacrificial structure; The encapsulation layer is located on the side of the plurality of light-emitting devices away from the flexible substrate, and the encapsulation layer has inorganic contact portions distributed in the non-display area, the inorganic contact portions being distributed around the display area; The sacrificial structures are distributed within the non-display area and around at least a portion of the edge of the inorganic contact portion; Wherein, at least a portion of the sacrificial structure in the orthographic projection of the flexible substrate is located outside the orthographic projection of the inorganic contact portion in the flexible substrate.

14. The display panel according to claim 13, characterized in that, The sacrificial structure includes: a first protective layer, a sacrificial metal layer, and a second protective layer stacked together; the first protective layer is closer to the flexible substrate than the second protective layer, and the orthographic projection of the second protective layer onto the flexible substrate is located within the orthographic projection of the sacrificial metal layer onto the flexible substrate; The reactivity of the sacrificial metal layer is greater than that of the first protective layer and also greater than that of the second protective layer.

15. The display panel according to claim 14, characterized in that, The conductive layer in which some conductive structures in the pixel driving circuit are located is a source / drain metal layer, and the light-emitting device includes a first electrode electrically connected to the pixel driving circuit. Wherein, the sacrificial structure is disposed in the same layer as the source / drain metal layer and is made of the same material; or, the sacrificial structure is disposed in the same layer as the first electrode and is made of the same material.

16. The display panel according to claim 13, characterized in that, The display panel further includes: an inorganic insulating layer located between the sacrificial structure and the flexible substrate; The inorganic insulating layer has a first groove on the side facing away from the flexible substrate, and at least a portion of the sacrificial structure is embedded in the first groove.

17. The display panel according to claim 16, characterized in that, The display panel further includes: an auxiliary sacrificial structure distributed in the non-display area, the auxiliary sacrificial structure being located on the side of the inorganic insulating layer away from the flexible substrate and being closer to the display area than the sacrificial structure; Wherein, the orthographic projection of the auxiliary sacrificial structure onto the flexible substrate is located within the orthographic projection of the inorganic contact portion onto the flexible substrate.

18. The display panel according to claim 17, characterized in that, The inorganic insulating layer also has a second groove located in the non-display area on the side opposite to the flexible substrate, and at least a portion of the auxiliary sacrificial structure is embedded in the second groove, which is closer to the display area than the first groove.

19. The display panel according to claim 18, characterized in that, The auxiliary sacrificial structure is disposed in the same layer as the sacrificial structure and is made of the same material.

20. The display panel according to any one of claims 17-19, characterized in that, The first groove penetrates the inorganic insulating layer, and the flexible substrate has a third groove communicating with the first groove, the third groove penetrating at least the second organic substrate layer; The sacrificial structure is also embedded in the third groove.

21. The display panel according to claim 20, characterized in that, The third groove extends through the surface of the first organic substrate layer on the side facing the second organic substrate layer.

22. The display panel according to any one of claims 15-19 and 21, characterized in that, The non-display area includes: two first border areas arranged opposite each other in a first direction, and a second border area and a third border area arranged opposite each other in a second direction; the third border area has a binding area inside. The sacrificial structure is distributed at least within the two first border regions and the second border region, and the first direction intersects the second direction.

23. The display panel according to any one of claims 15-19 and 21, characterized in that, The encapsulation layer includes: a first inorganic encapsulation layer, an organic encapsulation layer, and a second inorganic encapsulation layer stacked together, wherein the first inorganic encapsulation layer is closer to the flexible substrate than the second inorganic encapsulation layer; The first inorganic encapsulation layer is in direct contact with the portion of the second inorganic encapsulation layer located in the non-display area, and is used to form the inorganic contact portion. The orthographic projection of the inorganic contact portion on the flexible substrate is distributed around the orthographic projection of the organic encapsulation layer on the flexible substrate.

24. A display module, characterized in that, It includes a driver chip and a display panel electrically connected to the driver chip, wherein the display panel is the display panel according to any one of claims 1-23.

25. A display device, characterized in that, It includes: a housing, and a display module connected to the housing, the display module being the display module of claim 24.

Images