Chip package dustproof integrated structure

Abstract

The utility model provides a kind of chip packaging dustless protection integrated structure, including workbench, sealing dust removal assembly is arranged on the workbench, the sealing dust removal assembly includes sealing cover, sealing base, circulation pipe, dust removal box, dust removal pipe, limit frame, filter core and two axial flow fans;The sealing base is fixedly connected on the upper surface of the workbench.The utility model is under the action of axial flow fan, sealing cover inside forms a closed air circulation system, in the circulation process, filter core effectively filters dust and impurity in air, ensures the cleanliness of packaging environment;Relative to prior art, the utility model is sealed by being equipped with sealing dust removal assembly, successfully realizes the sealing treatment of packaging environment, in addition, before packaging operation, with the fine filtration effect of filter core, fine dust in packaging environment can be effectively filtered out, to build dustless packaging environment, ensure the reliability of chip packaging.

Description

Technical Field

[0001] This utility model relates to a protective integrated structure, specifically a dust-free protective integrated structure for chip packaging, belonging to the field of chip packaging technology. Background Technology

[0002] Chip molding is a process that uses transfer molding and other processes to encapsulate a chip in epoxy molding compound to form a protective shell. During molding, the chip to be packaged and the lead frame are first placed into the mold cavity. When the mold temperature reaches a preset value, the upper and lower parts of the mold close quickly and accurately, and liquid epoxy resin is injected into the mold. The epoxy resin then cures under continuous high temperature, forming a protective shell for the chip. After demolding, the chip encapsulation is complete.

[0003] During the packaging process, if micro-dust adheres to the chip surface or embeds into the packaging material, it will lead to a decline in the chip's electrical performance, reduced reliability, or even failure. Therefore, the above operations must be carried out in a cleanroom. However, even when packaging chips in a cleanroom, a small amount of fine dust is still unavoidable. For example, the slight shedding of clothing fibers during personnel operation and the tiny wear debris from mechanical parts during equipment operation can all result in imperceptible fine dust in the workshop, thus affecting the chip packaging effect. To address this, a cleanroom protection integrated structure for chip packaging is proposed. Utility Model Content

[0004] In view of this, the present invention provides a chip packaging dust-free protective integrated structure to solve or alleviate the technical problems existing in the prior art, and at least provides a beneficial option.

[0005] The technical solution of this utility model embodiment is implemented as follows: a chip packaging dust-free protective integrated structure includes a workbench, on which a sealing dust removal component is provided. The sealing dust removal component includes a sealing cover, a sealing base, a circulation pipe, a dust removal box, a dust removal pipe, a limiting frame, a filter element, and two axial flow fans. The sealing base is fixedly connected to the upper surface of the workbench. A sealing groove is provided on the upper surface of the sealing base. A sealing ring is embedded in the bottom of the inner side wall of the sealing cover. A sealing gasket is adhered to the lower surface of the sealing cover. One end of the circulation pipe and the dust removal pipe are symmetrically fixedly connected to the outer side wall of the sealing cover and are both in communication with the sealing cover. Two axial flow fans are respectively installed on the inner side wall of the circulation pipe and the dust removal pipe. The limiting frame is fixedly connected to the inner side wall of the dust removal box at equal intervals. The filter element is installed inside the dust removal box through the limiting frame.

[0006] More preferably, the other ends of the circulation pipe and the dust removal pipe are symmetrically fixedly connected to the outer wall of the dust removal box and are both in communication with the dust removal box.

[0007] More preferably, the sealing cover is slidably connected to the inner wall of the sealing groove, and the sealing ring is fitted to the inner wall of the sealing groove.

[0008] More preferably, the sealing gasket is fitted to the inner bottom wall of the sealing groove.

[0009] More preferably, the upper surface of the dust collection box is fitted with a sealing cover.

[0010] More preferably, a packaging mold is mounted on the upper surface of the workbench, and a packaging machine is disposed above the packaging mold.

[0011] More preferably, the sealing cover is mounted on the packaging machine, and the packaging machine is equipped with an upper mold adapted to the packaging mold.

[0012] More preferably, the packaging mold is located inside the sealing base and sealed by the sealing cover.

[0013] The present invention has the following advantages due to the adoption of the above technical solution: This invention uses a packaging machine to move the upper mold above the packaging mold, inserting a sealing cover into the sealing groove to seal the packaging environment. Then, under the action of an axial flow fan, a closed air circulation system is formed inside the sealing cover. During the circulation process, the filter element effectively removes dust and impurities from the air, ensuring the cleanliness of the packaging environment. Compared with the prior art, this invention successfully achieves the sealing treatment of the packaging environment by configuring a sealing and dust removal component. In addition, before the packaging operation, the fine filtration effect of the filter element effectively removes fine dust in the packaging environment, thereby creating a dust-free packaging environment and ensuring the reliability of chip packaging.

[0014] The above overview is for illustrative purposes only and is not intended to be limiting in any way. In addition to the illustrative aspects, embodiments, and features described above, further aspects, embodiments, and features of the present invention will become readily apparent from the accompanying drawings and the following detailed description. Attached Figure Description

[0015] To more clearly illustrate the technical solutions in the embodiments of this application or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0016] Figure 1 This is an overall structural diagram of the present invention; Figure 2 This is an exploded view of the structure of this utility model; Figure 3 This is a structural diagram of the sealing and dust removal component of this utility model; Figure 4 This is a structural diagram of the limiting frame of this utility model.

[0017] Reference numerals: 101, Sealing dust removal assembly; 11, Sealing cover; 12, Sealing ring; 13, Sealing gasket; 14, Sealing groove; 15, Sealing base; 16, Circulation pipe; 17, Dust collection box; 18, Dust collection pipe; 19, Limiting frame; 20, Filter element; 21, Sealing cover; 22, Axial flow fan; 31, Workbench; 32, Packaging mold; 33, Packaging machine. Detailed Implementation

[0018] In the following description, only certain exemplary embodiments are briefly described. As those skilled in the art will recognize, the described embodiments can be modified in various ways without departing from the spirit or scope of this invention. Therefore, the drawings and description are considered exemplary in nature and not restrictive.

[0019] The embodiments of this utility model will now be described in detail with reference to the accompanying drawings.

[0020] like Figures 1-4 As shown, this utility model embodiment provides a chip packaging dust-free protection integrated structure, including a workbench 31, on which a sealing dust removal component 101 is provided. The sealing dust removal component 101 includes a sealing cover 11, a sealing base 15, a circulation pipe 16, a dust removal box 17, a dust removal pipe 18, a limiting frame 19, a filter element 20, and two axial flow fans 22. The sealing base 15 is fixedly connected to the upper surface of the workbench 31. A sealing groove 14 is provided on the upper surface of the sealing base 15. A sealing ring 12 is embedded in the bottom of the inner wall of the sealing cover 11. A sealing gasket 13 is adhered to the lower surface of the sealing cover 11. The sealing cover 11 is slidably connected to the inner wall of the sealing groove 14. The sealing ring 12 is attached to the inner wall of the sealing groove 14, and the sealing gasket 13 is attached to the inner bottom wall of the sealing groove 14. Thus, when the sealing cover 11 is inserted into the sealing groove 14, the gap between the sealing cover 11 and the sealing base 15 can be effectively sealed by the tight fit of the sealing ring 12 and the sealing gasket 13, thereby achieving efficient sealing of the chip packaging process and preventing dust in the external air from adhering to the chip surface. The sealing gasket 13 is a hollow foam sealing strip, which can effectively seal the sealing groove 14 and has excellent deformation ability. Before the mold is closed, the sealing gasket 13 fills the sealing groove 14 but does not contact the inner bottom wall of the sealing groove 14; while after the mold is closed, the sealing gasket 13 is in close contact with the inner bottom wall of the sealing groove 14. One end of the circulation pipe 16 and the dust removal pipe 18 are symmetrically fixed to the outer wall of the sealing cover 11 and are both connected to the sealing cover 11. Two axial flow fans 22 are respectively installed on the inner wall of the circulation pipe 16 and the dust removal pipe 18. The other end of the circulation pipe 16 and the dust removal pipe 18 are symmetrically fixed to the outer wall of the dust collection box 17 and are both connected to the dust collection box 17. When the two axial flow fans 22 are running at the same time, the air inside the sealing cover 11 is guided into the dust collection box 17 through the dust removal pipe 18. After the dust removal is completed in the dust collection box 17, the air is returned to the inside of the sealing cover 11 through the circulation pipe 16, thus forming a closed air circulation system. During this circulation process, the filter element 20 effectively filters out dust and impurities in the air, ensuring the cleanliness of the packaging environment. The limiting frame 19 is fixedly connected to the inner wall of the dust collection box 17 at equal intervals. The filter element 20 is installed inside the dust collection box 17 through the limiting frame 19. The setting of the limiting frame 19 can accurately limit the position of the filter element 20. By configuring multiple filter elements 20, dust particles in the air can be efficiently filtered out during the circulation process, thereby ensuring the cleanliness inside the sealing cover 11 and realizing dust-free protection during the chip packaging process.

[0021] In one embodiment, a sealing cover 21 is installed on the upper surface of the dust collection box 17. The dust collection box 17 can be effectively sealed by the sealing cover 21, while opening the sealing cover 21 makes it easy to take out the filter element 20 inside the dust collection box 17, thereby facilitating the cleaning or replacement of the filter element 20.

[0022] In one embodiment, a packaging mold 32 is mounted on the upper surface of the workbench 31, and a packaging machine 33 is provided above the packaging mold 32. The packaging machine 33 is an injection molding machine, and the mold cavity inside the packaging mold 32 is used to limit the chip. The sealing cover 11 is installed on the packaging machine 33. The packaging machine 33 is equipped with an upper mold that is compatible with the packaging mold 32. The packaging mold 32 is located inside the sealing base 15 and is sealed by the sealing cover 11. During the chip packaging process, the packaging machine 33 drives the upper mold to move above the packaging mold 32. At this time, the sealing cover 11 is inserted into the sealing groove 14, thereby achieving the sealing of the packaging environment. After the dust removal work is completed, the packaging machine 33 continues to drive the upper mold to close with the packaging mold 32. At this time, the dust-free packaging operation can be carried out.

[0023] In operation, the chip is placed in the cavity of the packaging mold 32. The packaging machine 33 drives the upper mold to move above the packaging mold 32. The sealing cover 11 is inserted into the sealing groove 14, and the sealing ring 12 contacts the inner wall of the sealing groove 14 to seal the packaging environment. The axial flow fan 22 is started, and the air inside the sealing cover 11 is guided into the dust collection box 17 through the dust removal pipe 18. Then the air flows back to the inside of the sealing cover 11 through the circulation pipe 16, thus forming a closed air circulation system. During this circulation process, the filter element 20 effectively filters out dust and impurities in the air to ensure the cleanliness of the packaging environment. After the dust removal operation is completed, the packaging machine 33 drives the upper mold to close with the packaging mold 32, and the dust-free packaging operation can then be carried out. Compared with the prior art, this utility model achieves the sealing treatment of the packaging environment by configuring the sealing dust removal component 101. In addition, before the packaging operation, the fine dust in the packaging environment is effectively filtered out by the fine filtration effect of the filter element 20, thereby creating a dust-free packaging environment and ensuring the reliability of chip packaging.

[0024] The above description is merely a specific embodiment of this utility model, but the protection scope of this utility model is not limited thereto. Any person skilled in the art can easily conceive of various variations or substitutions within the technical scope disclosed in this utility model, and these should all be included within the protection scope of this utility model. Therefore, the protection scope of this utility model should be determined by the protection scope of the claims.

Claims

1. A chip packaging dust-free protective integrated structure, comprising a workbench (31), characterized in that: The workbench (31) is provided with a sealing dust removal assembly (101), which includes a sealing cover (11), a sealing base (15), a circulation pipe (16), a dust removal box (17), a dust removal pipe (18), a limiting frame (19), a filter element (20), and two axial flow fans (22). The sealing base (15) is fixedly connected to the upper surface of the workbench (31). A sealing groove (14) is provided on the upper surface of the sealing base (15). A sealing ring (12) is embedded in the bottom of the inner side wall of the sealing cover (11). A sealing gasket (13) is adhered to the lower surface of the sealing cover (11). One end of the circulation pipe (16) and the dust removal pipe (18) are symmetrically fixedly connected to the outer side wall of the sealing cover (11) and are both connected to the sealing cover (11). Two axial flow fans (22) are respectively installed on the inner side walls of the circulation pipe (16) and the dust removal pipe (18). The limiting frame (19) is fixedly connected at equal intervals to the inner side wall of the dust removal box (17). The filter element (20) is installed inside the dust removal box (17) through the limiting frame (19).

2. The chip packaging dust-free protective integrated structure according to claim 1, characterized in that: The other ends of the circulation pipe (16) and the dust removal pipe (18) are symmetrically fixed to the outer side wall of the dust removal box (17) and are both connected to the dust removal box (17).

3. The chip packaging dust-free protective integrated structure according to claim 2, characterized in that: The sealing cover (11) is slidably connected to the inner wall of the sealing groove (14), and the sealing ring (12) is attached to the inner wall of the sealing groove (14).

4. The chip packaging dust-free protective integrated structure according to claim 3, characterized in that: The sealing gasket (13) is attached to the inner bottom wall of the sealing groove (14).

5. The chip packaging dust-free protective integrated structure according to claim 4, characterized in that: The upper surface of the dust collection box (17) is fitted with a sealing cover (21).

6. The chip packaging dust-free protective integrated structure according to claim 1, characterized in that: A packaging mold (32) is installed on the upper surface of the workbench (31), and a packaging machine (33) is provided above the packaging mold (32).

7. The chip packaging dust-free protective integrated structure according to claim 6, characterized in that: The sealing cover (11) is installed on the packaging machine (33), and the packaging machine (33) is equipped with an upper mold that is compatible with the packaging mold (32).

8. The chip packaging dust-free protective integrated structure according to claim 7, characterized in that: The encapsulation mold (32) is located inside the sealing base (15) and sealed by the sealing cover (11).

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