Power module and variable frequency device

Abstract

The utility model is suitable for electric power equipment technical field provides a kind of power module and frequency conversion equipment. The above-mentioned power module includes first busbar, second busbar, connecting busbar, multiple bus capacitors and multiple IGBT units, multiple IGBT units are parallelly connected in second busbar, multiple bus capacitors are connected on first busbar, second busbar is opposite and interval arrangement with first busbar, second busbar is connected with first busbar by connecting busbar. By second busbar and first busbar opposite and interval arrangement, make second busbar and first busbar can form laminated structure, increase the area of alignment between second busbar and first busbar, can well offset the miscellaneous sense generated by positive and negative loop, guarantee the low miscellaneous sense of main loop, avoid the voltage peak generated by IGBT unit due to high miscellaneous sense and damage, make the use of IGBT unit more safe and reliable. Meanwhile, the volume occupied by the power module as a whole can also be reduced, making the power module structure more compact.

Description

Technical Field

[0001] This utility model belongs to the field of power equipment technology, and in particular relates to a power module and frequency converter. Background Technology

[0002] A frequency converter is a power regulation device composed of semiconductor devices, widely used in mining, metallurgy, petrochemicals, and the power industry. The working principle of a frequency converter is to convert fixed-frequency alternating current (AC) into AC with adjustable frequency and voltage, thereby controlling the speed of an AC motor. Currently, to adapt to high-voltage, high-current operating environments, most frequency converters are developed towards higher voltage and higher current capabilities. High-current frequency converters often require multiple IGBT (Insulated Gate Bipolar Transistor) units connected in parallel for output. However, most existing high-power frequency converters suffer from large stray inductance in the main circuit, which makes the IGBT units susceptible to overvoltage damage. Utility Model Content

[0003] The purpose of this utility model is to provide a power module and frequency converter, which aims to solve the technical problem of large stray inductance in the main circuit of the frequency converter and easy damage to the IGBT unit.

[0004] This utility model is implemented as follows: Firstly, a power module is provided, which includes a first busbar, a second busbar, a connecting busbar, multiple bus capacitors, and multiple IGBT units. The multiple IGBT units are all connected in parallel to the second busbar, and the multiple bus capacitors are connected to the first busbar. The second busbar is opposite to and spaced apart from the first busbar, and the second busbar and the first busbar are connected through the connecting busbar.

[0005] In one optional embodiment, the first busbar includes a first sub-busbar and a second sub-busbar. A first group of bus capacitors is connected to the first sub-busbar, and a second group of bus capacitors is connected to the second sub-busbar. The connecting busbar includes a first connecting busbar and a second connecting busbar. The second busbar is connected to the first sub-busbar through the first connecting busbar, and the second busbar is connected to the second sub-busbar through the second connecting busbar.

[0006] In an optional embodiment, a heat sink is provided between the second busbar and the first busbar. The heat sink includes a main board body and cooling channels. The cooling channels are distributed inside the main board body, and the plurality of IGBT units are thermally connected to the heat sink.

[0007] In an optional embodiment, the motherboard body has a clearance structure for avoiding the connecting busbar, so that at least a portion of the connecting busbar passes through the clearance structure on the motherboard body and is connected between the second busbar and the first busbar.

[0008] In an optional embodiment, the power module further includes an input terminal, an output terminal, and a rectifier module. The rectifier module is connected to the second busbar. One end of the input terminal is connected to the rectifier module, and the other end of the input terminal is used to connect to an external power grid. The output terminal has a first connection terminal and a plurality of second connection terminals. The first connection terminal is used to connect to an external power grid, and each of the second connection terminals is connected to one of the IGBT units.

[0009] In an optional embodiment, the connecting busbar is a flexible copper busbar, which is used to undergo plastic deformation after being impacted to absorb the impact force.

[0010] In a second aspect, a frequency converter is provided, including a cabinet body and at least one power module as described in any of the above claims, wherein the power module is disposed within the cabinet body.

[0011] In one optional embodiment, the cabinet body has an internal mounting position for installing the power module. The cabinet body also has a slide rail structure for transporting the bus capacitor. The bus capacitor can slide to the mounting position via the slide rail structure. After the bus capacitor slides to the mounting position, the first busbar and the second busbar are connected via the connecting busbar.

[0012] In one optional embodiment, the slide rail structure includes a main body, guide ribs, and multiple guide wheels. The main body is fixedly disposed within the cabinet body, the guide ribs protrude from the main body, and the guide wheels are rotatably disposed on the main body. The multiple guide wheels are arranged at intervals along a first direction, which is a direction parallel to the guide ribs.

[0013] In an optional embodiment, the power module further includes a support assembly that can slide along the slide rail structure, and the bus capacitors are all mounted on the support assembly.

[0014] In an optional embodiment, a mounting base is also fixedly provided at the mounting position, and the support component is detachably connected to the mounting base.

[0015] The first aspect of this invention provides the following technical advantages: By connecting multiple IGBT units in parallel to a second busbar and connecting the bus capacitor to a first busbar, and further connecting the second and first busbars via a connecting busbar, a power module is formed. Compared to existing power modules, by arranging the second and first busbars opposite each other and spaced apart, a stacked structure can be created. This increases the facing area between the second and first busbars, effectively offsetting the stray inductance generated by the positive and negative circuits, ensuring low stray inductance in the main circuit, and preventing IGBT units from being damaged due to overvoltage, thus making the use of IGBT units safer and more reliable. Simultaneously, it reduces the overall volume occupied by the power module, making the power module structure more compact.

[0016] It is understandable that the beneficial effects of the second aspect mentioned above can be found in the relevant descriptions in the first aspect mentioned above, and will not be repeated here. Attached Figure Description

[0017] To more clearly illustrate the technical solutions of the embodiments of this utility model, the drawings used in the description of the embodiments of this utility model or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this utility model. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0018] Figure 1 This is a schematic diagram of the power module provided in an embodiment of the present invention;

[0019] Figure 2 This is a side view of the power module provided in an embodiment of the present invention.

[0020] Figure 3 This is a schematic diagram of the structure of the second busbar and the first busbar used in this embodiment of the utility model;

[0021] Figure 4 This is a schematic diagram of the bus capacitor and the first busbar used in this embodiment of the utility model;

[0022] Figure 5 This is a schematic diagram of the structure of the first busbar used in this embodiment of the utility model;

[0023] Figure 6 This is a schematic diagram of the IGBT unit and the second busbar used in this embodiment of the utility model;

[0024] Figure 7 This is a schematic diagram of the IGBT unit and heat sink used in the embodiment of this utility model;

[0025] Figure 8This is a schematic diagram of the structure of the frequency converter provided in this embodiment of the utility model. Figure 1 ;

[0026] Figure 9 This is a schematic diagram of the structure of the frequency converter provided in this embodiment of the utility model. Figure 2 ;

[0027] Figure 10 yes Figure 9 A magnified structural diagram of point A in the middle.

[0028] Explanation of reference numerals in the attached figures:

[0029] 10. Power module; 20. Cabinet body;

[0030] 30. Slide rail structure; 40. Support assembly; 50. Mounting base;

[0031] 11. First busbar; 111. First daughter busbar; 112. Second daughter busbar; 12. Second busbar; 13. Connecting busbar; 131. First connecting busbar; 132. Second connecting busbar; 14. Bus capacitor; 141. First group of bus capacitors; 142. Second group of bus capacitors; 15. IGBT unit; 16. Heat sink; 161. Main board body; 162. Cooling channel; 163. Clearance structure; 17. Input terminal; 18. Rectifier module; 19. Output terminal; 191. First connection terminal; 192. Second connection terminal;

[0032] 31. Main body; 32. Guide rib; 33. Guide wheel. Detailed Implementation

[0033] The embodiments of this utility model are described in detail below. Examples of these embodiments are shown in the accompanying drawings, wherein the same or similar reference numerals denote the same or similar elements or elements having the same or similar functions throughout. The embodiments described below with reference to the accompanying drawings are exemplary and intended to explain this utility model, and should not be construed as limiting this utility model.

[0034] In the description of this utility model, it should be understood that the terms "length", "width", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are only for the convenience of describing this utility model and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this utility model.

[0035] Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of this utility model, "a plurality of" means two or more, unless otherwise explicitly specified.

[0036] In this utility model, unless otherwise explicitly specified and limited, the terms "installation," "connection," "joining," and "fixing," etc., should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral part; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components. Those skilled in the art can understand the specific meaning of the above terms in this utility model according to the specific circumstances.

[0037] To make the objectives, technical solutions, and advantages of this utility model clearer, the present utility model will be further described in detail below with reference to the accompanying drawings and embodiments.

[0038] Please refer to Figures 1 to 4 As shown in the present invention, a power module is provided, including a first busbar 11, a second busbar 12, a connecting busbar 13, multiple bus capacitors 14, and multiple IGBT units 15. The multiple IGBT units 15 are all connected in parallel to the second busbar 12, and the multiple bus capacitors 14 are connected to the first busbar 11. The second busbar 12 is opposite to the first busbar 11 and is spaced apart. The second busbar 12 and the first busbar 11 are connected through the connecting busbar 13.

[0039] Specifically, IGBT unit 15 refers to a composite power semiconductor actuator, whose function is to realize power conversion and control. Bus capacitor 14 refers to an energy storage element connecting the rectifier circuit and the inverter circuit. The function of bus capacitor 14 is to stabilize the DC bus voltage, buffer energy fluctuations, and ensure the stable operation of the entire power conversion system. The second busbar 12 and the connecting busbar 13 both refer to conductive components that can connect devices. The shape of the second busbar 12 can be a plate-like structure with a certain area. The first busbar 11 refers to a conductive component that can connect devices. The shape of the first busbar 11 can also be a plate-like structure with a certain area. The first busbar 11 can be a laminated busbar composed of two metal layers and an insulating material. The insulating material is placed between the two metal layers to keep them insulated. The insulating material can be PET (Polyethylene Eerephedrine Thalate). One metal layer of the laminated busbar can be connected to one connection terminal of the bus capacitor 14, and the other metal layer can be connected to the other connection terminal of the bus capacitor 14. At the same time, connecting busbar 13 can connect one metal layer of the stacked busbar to the second busbar 12.

[0040] The power module provided in this embodiment of the invention consists of multiple IGBT units 15 connected in parallel to a second busbar 12, and a bus capacitor 14 connected to a first busbar 11. The second busbar 12 and the first busbar 11 are also connected via a connecting busbar 13. When the power module is operating, current can be input through the second busbar 12, transmitted to the first busbar 11 via the connecting busbar 13, charged by the first busbar 11, and buffered by the bus capacitor 14 to make the current smoother. The current then returns to the second busbar 12 via the connecting busbar 13, reaches the multiple IGBT units 15, and is finally output after inversion by the multiple IGBT units 15, thus forming a complete circuit for the power module. Compared to existing power modules, by arranging the second busbar 12 opposite and spaced apart from the first busbar 11, a stacked structure can be formed between them. This increases the facing area between the second busbar 12 and the first busbar 11, effectively offsetting the stray inductance generated by the positive and negative circuits, ensuring low stray inductance in the main circuit, and preventing damage to the IGBT unit 15 due to overvoltage, making the IGBT unit 15 safer and more reliable. Simultaneously, it reduces the overall volume occupied by the power module, making the power module structure more compact.

[0041] In addition, by forming a stacked structure with the second busbar 12 opposite to and spaced apart from the capacitor busbar, the problem of large differences in the distributed impedance of different IGBT converter circuits caused by the planar arrangement of the two can be avoided, so that the distributed impedance of different IGBT converter circuits is similar, and the current sharing effect of IGBT output is better.

[0042] In an optional embodiment, please refer to Figure 2 The second busbar 12 and the first busbar 11 can be parallel to each other. By setting the second busbar 12 and the first busbar 11 in parallel, the stray inductance generated by the positive and negative circuits can be better canceled, thereby further reducing the stray inductance in the main circuit.

[0043] In one embodiment, see Figures 3 to 5 The first busbar 11 includes a first sub-busbar 111 and a second sub-busbar 112, which are arranged side by side. The first sub-busbar 111 is connected to a first group of bus capacitors 141, and the second sub-busbar 112 is connected to a second group of bus capacitors 142. The connecting busbar 13 includes a first connecting busbar 131 and a second connecting busbar 132. The second busbar 12 is connected to the first sub-busbar 111 via the first connecting busbar 131, and the second busbar 12 is connected to the second sub-busbar 112 via the second connecting busbar 132. By dividing the first busbar 11 into two parts, two groups of bus capacitors 14 can be installed in each part. The two first busbars can be configured with only the minimum area for connecting the bus capacitors. Compared to using a single board, the area of ​​the laminated copper busbar is reduced. Furthermore, by grouping the bus capacitors, each group of bus capacitors can be maintained independently. This reduces the area of ​​the laminated copper busbar used in the first busbar 11, thereby reducing costs and making maintenance more convenient. Two first busbars 11 are connected to the second busbar 12 via a connecting busbar 13 made of soft copper. The two first busbars 11 and the second busbar 12 are connected by multiple soft copper plates, making the connection more stable. The soft copper plates can absorb the impact force by undergoing plastic deformation after being impacted, which can prevent the device from being damaged.

[0044] In one embodiment, see Figure 2 and Figure 6 A heat sink 16 is provided between the second busbar 12 and the first busbar 11. The heat sink 16 includes a main board body 161 and a cooling channel 162. The cooling channel 162 is distributed inside the main board body 161. Multiple IGBT units 15 are thermally connected to the heat sink 16.

[0045] Specifically, the heat sink 16 refers to a component or assembly that dissipates excess heat to reduce the device temperature. The heat sink 16 can be a fan, heat sink fins, or heat sink plate. The IGBT unit 15 can be directly connected to the heat sink for thermal conductivity, or a thermal pad can be placed between the IGBT unit 15 and the heat sink 16 to achieve a thermal connection. The motherboard body 161 refers to a plate-like structure with a certain thickness. The motherboard body 161 is usually made of a material with high thermal conductivity, such as metal. The cooling channel 162 refers to a channel structure with a certain length. The cooling channel 162 allows for the flow of cooling water or coolant. The cooling channel 162 can be arranged in a tortuous manner inside the motherboard body 161 to extend its overall length.

[0046] In this embodiment, by setting up a heat sink 16 and thermally connecting multiple IGBT units 15 to the heat sink 16, the heat dissipation efficiency of the IGBT units 15 can be improved, preventing the IGBT units 15 from having their lifespan affected by excessive temperature. Simultaneously, placing the heat sink 16 between the second busbar 12 and the first busbar 11 allows for a more compact overall structure of the power module. Connecting the cooling channel 162 to external cooling pipes and placing multiple IGBT units 15 or other components requiring heat dissipation against the side of the mainboard body 161 allows heat to be transferred from the mainboard body 161 to the coolant within the cooling channel 162. The flow of the coolant then carries the heat away from the mainboard body 161, making heat dissipation more convenient.

[0047] In one embodiment, see Figure 7The main board body 161 has a clearance structure 163, which is used to avoid the connecting busbar 13, so that at least part of the connecting busbar 13 passes through the clearance structure 163 on the main board body 161 and is connected between the second busbar 12 and the first busbar 11. Specifically, the clearance structure 163 refers to a structure that can avoid other objects, and the clearance structure 163 can be a clearance hole, a clearance groove, or a clearance opening, etc. In this embodiment, by providing a clearance structure 163 on the motherboard body 161, the clearance structure 163 being a clearance hole, when connecting the second busbar 12 and the first busbar 11 via the first busbar connecting busbar 13, the connecting busbar 13 can directly pass through the motherboard body 161 via the clearance structure 163 without changing its shape to bypass the motherboard body 161, making the connection between the second busbar 12 and the first busbar 11 more convenient. Furthermore, when setting the first sub-busbar 111 and the second sub-busbar 112, the first connecting busbar 131 can include two connecting busbars, and the second connecting busbar 132 also includes two connecting busbars. Thus, a portion of the connecting busbars connects to the first and second busbars from the side of the motherboard body 161, while the other portion of the connecting busbars passes through the clearance structure 163 to connect to the first and second busbars. This minimizes the connection distance of the connecting busbars, reduces the connection length of the connecting busbars, and simultaneously improves the connection stability and impact resistance of the connecting busbars.

[0048] In one embodiment, see Figure 2 The power module also includes an input terminal 17, an output terminal 19, and a rectifier module 18. The rectifier module 18 is connected to the second busbar 12. One end of the input terminal 17 is connected to the rectifier module 18, and the other end of the input terminal 17 is used to connect to the external power grid. The output terminal 19 has a first connection terminal 191 and multiple second connection terminals 192. The first connection terminal 191 is used to connect to the external power grid, and each second connection terminal 192 is connected to an IGBT unit 15. The current input from the input terminal 17 is first rectified by the rectifier module 18, then transmitted through the second busbar 12 to the bus capacitor 14 on the first busbar 11. After passing through the bus capacitor 14, the current is transmitted through the first busbar 11 to the IGBT unit 15 on the second busbar. After inversion by the IGBT unit, the current is output through the output terminal 19.

[0049] Specifically, input terminal 17 refers to a conductive component of a certain length. Input terminal 17 can be made of conductive materials such as copper, and its shape can be plate-shaped, strip-shaped, or column-shaped. Rectifier module 18 can regulate the current and perform preliminary filtering; rectifier module 18 can be a rectifier bridge. Output terminal 19 refers to a conductive component of a certain length. Output terminal 19 can be made of conductive materials such as copper, and the connection terminal refers to the structure used to connect output terminal 19 to other components.

[0050] In this embodiment, the second busbar 12 can be connected to the external power grid via the input terminal 17. A rectifier module 18 is provided between the input terminal 17 and the second busbar 12. The rectifier module 18 can regulate the current and perform preliminary filtering, making the entire power module safer and more convenient to use. Simultaneously, multiple second connection terminals 192 of the output terminal 19 are connected to multiple IGBT units 15, and the first connection terminal 191 is connected to the external power grid. When there are two output terminals 19, they can be symmetrically arranged to ensure that the main circuit distributed impedance is basically the same, thereby achieving a parallel current-sharing effect for the multiple IGBT units 15 and making the entire power module safer to use.

[0051] In one embodiment, see Figure 5 The connecting busbar 13 is a flexible copper busbar, which is used to absorb impact force through plastic deformation after being subjected to impact. Specifically, the flexible copper busbar refers to a component made of metallic copper or its alloy. In this embodiment, although the flexible copper busbar has a certain rigidity, due to the inherent properties of metallic copper, it is very easy to undergo plastic deformation when subjected to external impact. By connecting the two components with the flexible copper busbar, reliable stability between them is ensured, and under certain extreme conditions of high stress, the plastic deformation of the flexible copper busbar can absorb impact force, preventing deformation or breakage of the connecting busbar 13, the second busbar 12, or the first busbar 11.

[0052] Secondly, please refer to Figure 8 The present invention provides a frequency converter, including a cabinet body 20 and at least one power module 10 as described above. The power module 10 is disposed within the cabinet body 20. Multiple power modules can be disposed within the cabinet body 20, and the specific number is not limited. The beneficial effects of the second aspect described above can be found in the relevant description of the first aspect, and will not be repeated here.

[0053] In one embodiment, see Figure 8 and Figure 9The cabinet body 20 has mounting positions inside, which are used to install power modules 10. Each mounting position corresponds to one power module. The cabinet body 20 is also equipped with a slide rail structure 30, which is used to transport bus capacitors 14. The bus capacitors 14 can slide to the mounting position through the slide rail structure 30. After the bus capacitors 14 slide to the mounting position, the first busbar 11 and the second busbar 12 are connected through the connecting busbar 13, thereby completing the installation of the power module 10. Generally, the first busbar 11 and the bus capacitors 14 are installed and fixed first, then the bus capacitors 14 with the first busbar 11 installed are placed on the slide rail structure 30, and then the bus capacitors 14 are slidably transported to the mounting position through the slide rail structure 30, thereby completing the sliding transport of the bus capacitors 14.

[0054] Specifically, the mounting position refers to a virtual location for installing the power module 10. The slide rail structure 30 refers to a track structure of a certain length, which can extend from the direction away from the mounting position to the direction closer to the mounting position. The slide rail structure 30 can be directly fixed inside the cabinet body 20, or it can be detached and installed inside the cabinet body 20, and is only installed when it is necessary to transport the bus capacitor 14.

[0055] When installing the power module, the second busbar 12, IGBT unit 15, and heat sink 16, excluding the first busbar 11 and bus capacitor 14, can be fixed into a single module. This single module is then hoisted into the mounting position inside the cabinet body 20 and fixed in place with screws. Next, the bus capacitor 14, which is equipped with the first busbar 11, is hoisted onto the slide rail structure 30, allowing the bus capacitor 14 to slide along the slide rail structure 30 to the mounting position. Then, the first busbar 11 is connected to the second busbar via the connecting busbar 13, which passes through the heat sink 16. Finally, the bus capacitor 14 is fixed with fasteners. The connecting busbar 13 can be pre-connected to the second busbar 12 and fixed into a single module with the IGBT unit and heat sink 16, or the connecting busbar 13 can be pre-connected to the first busbar 11 and hoisted into a single unit with the bus capacitor 14. In this embodiment, by providing a slide rail structure 30 inside the cabinet body 20 and placing at least a portion of the slide rail structure 30 in an area that is convenient for hoisting and placement, the bus capacitor 14 can be hoisted to an area that is convenient for placement before installation, and then transported to the installation position via the slide rail structure 30, thus avoiding the inconvenience of installation caused by the excessive weight of the bus capacitor 14.

[0056] It should be noted that during the installation of the second busbar 12, IGBT unit 15 and heat sink 16, the second busbar 12 and IGBT unit 15 can be fixed to the heat sink 16 first, and then the entire module of the heat sink 16 can be fixed to the mounting position of the cabinet body 20, thereby achieving the overall fixation of the second busbar 12, IGBT unit 15 and heat sink 16, which makes the overall installation of the power module more convenient and quick.

[0057] In one embodiment, see Figure 8 and Figure 9 The power module also includes a support assembly 40 that can slide along the slide rail structure 30, and all bus capacitors 14 are mounted on the support assembly 40. Specifically, the support assembly 40 refers to a component or assembly that can support an object, such as a support frame. In this embodiment, the bus capacitors 14 can be mounted and fixed on the support assembly 40, and the bus capacitors 14 are fixed by the support assembly 40. In particular, when there are multiple bus capacitors 14, multiple bus capacitors 14 can be connected into an integral structure by the support assembly 40, making the installation of the bus capacitors 14 more convenient and secure, and also making it easier for the support assembly 40 and the bus capacitors 14 to slide along the slide rail structure 30.

[0058] In an optional embodiment, please refer to Figure 9 The support component 40 includes a support frame, and the support frame has a receiving space for accommodating the bus capacitor 14. Multiple bus capacitors 14 can be stacked in the receiving space. The bus capacitors 14 can also be connected to the support frame by means of screws or other methods, so that the bus capacitors 14 and the support frame form an integral whole, making the installation of the bus capacitors 14 more stable.

[0059] In one embodiment, see Figure 10 The slide rail structure 30 includes a main body 31, a guide rib 32 and a plurality of guide wheels 33. The main body 31 is fixed inside the cabinet body 20, the guide rib 32 protrudes from the main body 31, and the guide wheels 33 are all rotatably mounted on the main body 31. The plurality of guide wheels 33 are arranged sequentially at intervals along a first direction, which is a direction parallel to the guide rib 32.

[0060] Specifically, the main body 31 refers to a supporting component of a certain length, which can be plate-shaped, block-shaped, or strip-shaped. The guide rib 32 refers to a component of a certain length, which can be integral with the main body 31. The guide rib 32 can also be a separate component, connected to the main body 31 by snap-fit, welding, or fasteners. The guide wheel 33 refers to a wheel-shaped component of a certain diameter, which can be rotatably connected to the main body 31 via a pivot.

[0061] In this embodiment, a guide rib 32 is provided on the main body 31, and a limiting groove for cooperating with the guide rib 32 is provided on the support component 40. When the support component 40 and the bus capacitor 14 slide along the slide rail structure 30, the guide rib 32 can be engaged into the limiting groove on the support component 40, thereby allowing the support component 40 and the bus capacitor 14 to slide along the length direction of the guide rib 32. This makes the sliding of the bus capacitor 14 more stable and the installation of the bus capacitor 14 more convenient and quick.

[0062] In one embodiment, see Figure 8 A mounting base 50 is also fixedly installed at the installation position. The support component 40 is detachably connected to the mounting base 50, which facilitates the disassembly and maintenance of the bus capacitor 14. Specifically, the mounting base 50 refers to a support component with a certain area. The mounting base 50 can be plate-shaped, block-shaped, or a combination of various shapes. The mounting base 50 can be installed inside the cabinet body 20 by means of snap-fit ​​or fastener connection. In this embodiment, a mounting base 50 is provided inside the cabinet body 20. The power module can be installed through the mounting base 50. When installing the power module, the second busbar 12 and IGBT unit 15 and other devices are first fixed on the heat sink 16. Then, the entire heat sink 16 module is fixed on the mounting base 50 at the mounting position with fasteners. Then, the support component 40, which is equipped with bus capacitor 14 and first busbar 11, slides along the slide rail structure 30 to the mounting base 50 at the mounting position. After connecting the first busbar 11 and the second busbar 12, the support component 40 and the mounting base 50 are installed and fixed with fasteners, thus completing the installation of the power module.

[0063] Since the bus capacitor requires maintenance relatively frequently, when the bus capacitor 14 needs maintenance, the fasteners are removed, the first busbar 11 and the second busbar are disassembled, and then the support assembly 40 slides out of the side of the cabinet or outside the cabinet along the slide rail structure 30 before the bus capacitor 14 is maintained.

[0064] The above are merely preferred embodiments of the present utility model, and only specifically describe the technical principles of the present utility model. These descriptions are only for explaining the principles of the present utility model and should not be construed as limiting the scope of protection of the present utility model in any way. Based on this explanation, any modifications, equivalent substitutions, and improvements made within the spirit and principles of the present utility model, as well as other specific embodiments of the present utility model that can be conceived by those skilled in the art without creative effort, should be included within the scope of protection of the present utility model.

Claims

1. A power module, characterized in that, It includes a first busbar, a second busbar, a connecting busbar, multiple bus capacitors, and multiple IGBT units. The multiple IGBT units are all connected in parallel to the second busbar, and the multiple bus capacitors are connected to the first busbar. The second busbar is opposite to the first busbar and is spaced apart. The second busbar and the first busbar are connected through the connecting busbar.

2. The power module as described in claim 1, characterized in that, The first busbar includes a first sub-busbar and a second sub-busbar. A first group of bus capacitors is connected to the first sub-busbar, and a second group of bus capacitors is connected to the second sub-busbar. The connecting busbar includes a first connecting busbar and a second connecting busbar. The second busbar is connected to the first sub-busbar through the first connecting busbar, and the second busbar is connected to the second sub-busbar through the second connecting busbar.

3. The power module as described in claim 1 or 2, characterized in that, A heat sink is provided between the second busbar and the first busbar. The heat sink includes a main board body and cooling channels. The cooling channels are distributed inside the main board body. Multiple IGBT units are thermally connected to the heat sink.

4. The power module as described in claim 3, characterized in that, The motherboard has a clearance structure for avoiding the connecting busbar, so that at least part of the connecting busbar passes through the clearance structure on the motherboard and is connected between the second busbar and the first busbar.

5. The power module as described in claim 1 or 2, characterized in that, The power module further includes an input terminal, an output terminal, and a rectifier module. The rectifier module is connected to the second busbar. One end of the input terminal is connected to the rectifier module, and the other end of the input terminal is used to connect to an external power grid. The output terminal has a first connection terminal and multiple second connection terminals. The first connection terminal is used to connect to an external power grid, and each of the second connection terminals is connected to one of the IGBT units.

6. The power module as described in claim 1, characterized in that, The connecting busbar is a soft copper busbar, which is used to undergo plastic deformation after being impacted in order to absorb the impact force.

7. A frequency converter, characterized in that, It includes a cabinet body and at least one power module as described in any one of claims 1 to 6, wherein the power module is disposed within the cabinet body.

8. The frequency converter as described in claim 7, characterized in that, The cabinet body has an internal mounting position for installing the power module. The cabinet body also has a slide rail structure for transporting the bus capacitor. The bus capacitor can slide to the mounting position via the slide rail structure. After the bus capacitor slides to the mounting position, the first busbar and the second busbar are connected via the connecting busbar.

9. The frequency converter as described in claim 8, characterized in that, The slide rail structure includes a main body, guide ribs, and multiple guide wheels. The main body is fixed in the cabinet body, the guide ribs protrude from the main body, and the guide wheels are all rotatably mounted on the main body. The multiple guide wheels are arranged at intervals along a first direction, which is parallel to the guide ribs.

10. The frequency converter as described in claim 8, characterized in that, The power module also includes a support component that can slide along the slide rail structure, and the bus capacitors are all mounted on the support component.

11. The frequency converter as described in claim 10, characterized in that, A mounting base is also fixedly installed at the mounting position, and the support component is detachably connected to the mounting base.

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