A type of guide mold assembly mold

Abstract

This utility model discloses a center conductor assembly molding mold, including an upper mold, a lower mold, upper mold core one, upper mold core two, upper mold core three and an upper mold adjustment block installed in the upper mold, and lower mold core one, lower mold core two, lower mold core three and a lower mold adjustment block installed in the lower mold. During mold closing, pressure is applied from the upper mold to the lower mold, with the upper and lower mold cores corresponding to each other. The mold structure of this utility model can adjust the pin height of the center conductor assembly and increase the forming angle, causing plastic deformation of the pin forming area under pressure. This reduces the springback at the bending point of the center conductor and the stress release during the manufacturing process. Simultaneously, by adjusting the pin forming height, the three pins maintain a consistent end face height after slight springback, preventing desoldering and cold solder joints during the mounting / use of the center conductor assembly.

Description

Technical Field

[0001] This utility model relates to the field of mold technology, and in particular to a central guide mold assembly mold. Background Technology

[0002] With the rapid development of the communications field, circulators / isolators are widely used in 5G mobile communications, mainly in the base station radio frequency circuits of communication systems, serving as both unidirectional transmission and full-duplex transceiver. As circulators / isolators move towards miniaturization, higher requirements are placed on the manufacturing processes for mass production.

[0003] The ferrite is placed at the center of the central conductor. The central conductor pins are bent along the outer wall of the ferrite in a certain order. After each pin is bent, a PI film is attached to the pin so that the projection of the center of the PI film in the vertical direction overlaps with the projection of the center of the ferrite in the vertical direction. The central conductor pin is then subjected to pressure using a forming mold to complete the bending and final forming, thus obtaining the central conductor module.

[0004] During the bending and forming process of the center conductor, the conductor leads deform under bending pressure. When subjected to external force but not fully plastically deformed, the elastically deformed portion will recover its original shape after the force is removed. Since both the upper and lower molds of the final formed center conductor module are planar, the leads will spring back due to elastic deformation after forming, resulting in the three lead ends not being at the same height. During assembly, the leads need to overlap with the capacitor solder joints. The solder joints, after melting, are approximately 0.1mm thick. If the lead height is too large after springback, and the height difference exceeds 0.1mm, there is a risk of reduced overlap area or desoldering. Utility Model Content

[0005] The purpose of this invention is to design a central guide mold to solve the above problems. The central guide pin height is increased and the forming angle is increased so that the pin forming part undergoes plastic deformation under pressure, thereby reducing the springback at the bending point of the central guide and the stress release of the device during the manufacturing process. At the same time, by adjusting the pin forming height, the three pins maintain a consistent end face height after slight springback, so as to avoid desoldering and cold solder joints during the module mounting / use process.

[0006] This utility model achieves the above objectives through the following technical solutions:

[0007] This utility model provides a middle guide mold assembly mold, including an upper mold, a lower mold, upper mold core one, upper mold core two, upper mold core three and an upper mold adjustment block installed in the upper mold, and lower mold core one, lower mold core two, lower mold core three and a lower mold adjustment block installed in the lower mold; when the mold is closed, the upper mold applies pressure to the lower mold direction, and the upper and lower mold cores correspond respectively (upper mold core one corresponds to lower mold core one, upper mold core two corresponds to lower mold core two, and upper mold core three corresponds to lower mold core three).

[0008] As a preferred embodiment of this invention, the second lower mold core is fixedly connected within the lower mold core. The second lower mold core corresponds to the pin of the first bend of the central conductor, i.e., the pin at the bottom after molding. This pin is less prone to deformation and warping. Therefore, the molding surface of the second lower mold core is established as the reference surface, and the height of the molding surfaces of the other mold cores is adjusted according to the reference surface. The two threaded holes three at the bottom of the lower mold adjusting block correspond to the lower mold core and the third lower mold core, respectively, and the height of the two lower mold cores is adjusted by threaded fastening.

[0009] As a preferred embodiment of this utility model, the upper mold and the lower mold are the same. The upper mold core 2 is fixedly connected in the upper mold 7, and the upper mold core 2 corresponds to the lower mold core 2. The upper mold core 2 is the reference surface of the upper mold. The two threaded holes 2 on the top of the upper mold adjusting block correspond to the upper mold core 1 and the upper mold core 3 respectively. The height of the two upper mold cores is adjusted by threaded fastening, and they are fixed by the two threaded holes 1 on the side of the upper mold 7.

[0010] The planar height difference forming mode is adopted. By adjusting the height of the forming surface of the three mold core ports of the upper and lower molds, the optimal forming height is found so that the height of the three pins is on the same plane after springback, and the height difference does not exceed 0.06mm.

[0011] The beneficial effects of this utility model are as follows: The mold structure of this utility model can adjust the height of the center guide pin and increase the forming angle, so that the pin forming part produces plastic deformation under pressure, thereby reducing the springback at the bending point of the center guide and the stress release of the device during the manufacturing process. At the same time, by adjusting the pin forming height, the three-terminal pins maintain the same end face height after slight springback, so as to avoid desoldering and cold solder joints during the mounting / use of the module. Attached Figure Description

[0012] Figure 1 A schematic diagram of the central conductor assembly.

[0013] Figure 2 This is a schematic diagram before the center guide module is mounted.

[0014] Figure 3 This is a schematic diagram of the mid-mount module after mounting.

[0015] Figure 4 This is a schematic diagram comparing the center conductor before and after its rebound.

[0016] Figure 5 This is a schematic diagram showing the height of each pin in the middle guide after molding using this mold.

[0017] Figure 6 This is a structural diagram of the upper mold of the forming mold.

[0018] Figure 7 This is a structural diagram of the upper mold adjustment block of the forming mold.

[0019] Figure 8 This is a structural diagram of the lower mold of the forming mold.

[0020] Figure 9 This is a structural diagram of the lower mold adjustment block of the forming mold.

[0021] Figure 10 This is an assembly drawing of the molding die.

[0022] In the diagram: 1-Plastic encapsulated shell, 2-Capacitor, 3-Center conductor, 4-PI film, 5-Ferrite, 6-Center conductor assembly, 7-Upper mold, 701-Threaded hole one, 8-Lower mold, 9-Upper mold core one, 10-Upper mold core two, 11-Upper mold core three, 12-Upper mold adjusting block, 1201-Threaded hole two, 13-Lower mold core one, 14-Lower mold core two, 15-Lower mold core three, 16-Lower mold adjusting block, 1601-Threaded hole three, 17-Resistor. Detailed Implementation

[0023] To make the objectives, technical solutions, and advantages of the embodiments of this utility model clearer, the technical solutions of the embodiments of this utility model will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some, not all, of the embodiments of this utility model. The components of the embodiments of this utility model described and shown in the accompanying drawings can generally be arranged and designed in various different configurations.

[0024] Therefore, the following detailed description of the embodiments of the present invention provided in the accompanying drawings is not intended to limit the scope of the claimed invention, but merely to illustrate selected embodiments of the invention. All other embodiments obtained by those skilled in the art based on the embodiments of the present invention without inventive effort are within the scope of protection of the present invention.

[0025] It should be noted that similar labels and letters in the following figures indicate similar items. Therefore, once an item is defined in one figure, it does not need to be further defined and explained in subsequent figures.

[0026] In the description of this utility model, it should be understood that the terms "upper", "lower", "inner", "outer", "left", "right", etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings, or the orientation or positional relationship that the utility model product is usually placed in during use, or the orientation or positional relationship that is commonly understood by those skilled in the art. They are only used to facilitate the description of this utility model and to simplify the description, and are not intended to indicate or imply that the device or component referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this utility model.

[0027] Furthermore, the terms "first," "second," etc., are used only to distinguish descriptions and should not be interpreted as indicating or implying relative importance.

[0028] In the description of this utility model, it should also be noted that, unless otherwise explicitly specified and limited, terms such as "set" and "connection" should be interpreted broadly. For example, "connection" can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium; it can be a connection within two components. Those skilled in the art can understand the specific meaning of the above terms in this utility model according to the specific circumstances.

[0029] The following is in conjunction with the appendix Figure 1-10 The specific embodiments of this utility model will be described in detail below.

[0030] As attached Figure 1-4 As shown, the plastic-encapsulated housing 1 of this circulator / isolator is manufactured using in-mold injection molding.

[0031] Apply solder to the designated position on the plastic casing 1, and then mount the resistor 17 and capacitor 2 onto the plastic casing 1.

[0032] PI film 4 is bonded to each of the three branches of the central conductor 3; ferrite 5 is placed at the center of the central conductor 3, and the branches of the integral central conductor with PI film 4 bonded are bent along the bendable line to wrap around the outer wall of the ferrite 5, so that the projection of the center of the PI film 4 in the vertical direction overlaps with the projection of the center of the ferrite 5 in the vertical direction. Pressure is applied to the pins of the central conductor 3 using a molding die, so that the pin forming part is bent under pressure and the pin is flat, thus obtaining the central conductor assembly 6.

[0033] 8. Apply solder to the resistor 17 and capacitor 2 on the plastic-encapsulated housing 1, place the three-terminal pins of the integrated center conductor assembly 6 on the soldering point, complete the soldering, and proceed to the next process for use.

[0034] As attached Figure 5-10 As shown, this embodiment provides a middle guide mold assembly mold, including an upper mold 7, a lower mold 8, upper mold core 1 9, upper mold core 2 10, upper mold core 3 11 and upper mold adjustment block 12 installed in the upper mold, and lower mold core 1 13, lower mold core 2 14, lower mold core 3 15 and lower mold adjustment block 16 installed in the lower mold; when the mold is closed, the upper mold applies pressure in the direction of the lower mold, and the upper and lower mold cores correspond respectively (upper mold core 1 9 corresponds to lower mold core 1 13, upper mold core 2 10 corresponds to lower mold core 2 14, upper mold core 3 11 corresponds to lower mold core 3 15).

[0035] Furthermore, lower mold core 2 14 is fixedly connected in the lower mold core. Lower mold core 2 14 corresponds to the first bent pin of the central conductor 3, that is, the bottommost pin after molding. This pin is not easily deformed or warped, so the molding surface of lower mold core 2 14 is established as the reference surface, and the height of the molding surfaces of the other mold cores is adjusted according to the reference surface. The two threaded holes 3 1601 at the bottom of the lower mold adjustment block 16 correspond to lower mold core 1 13 and lower mold core 3 15 respectively, and the height of the two lower mold cores is adjusted by threaded fastening. a, b, and c are the heights of the three pins from the bottom of the molding die, respectively.

[0036] Furthermore, the upper mold is the same as the lower mold. The upper mold core 2 10 is fixedly connected in the upper mold 7. The upper mold core 2 10 corresponds to the lower mold core 2 14. The upper mold core 2 10 is the reference surface of the upper mold. The two threaded holes 2 1201 on the top of the upper mold adjusting block 12 correspond to the upper mold core 1 9 and the upper mold core 3 11 respectively. The height of the two upper mold cores is adjusted by threaded fastening. At the same time, they are fixed by the two threaded holes 1 701 on the side of the upper mold 7.

[0037] The planar height difference forming mode is adopted. By adjusting the forming surface height of the three mold core ports of the upper mold 7 and the lower mold 8, the optimal forming height is found so that the height of the three pins is on the same plane after springback, and the height difference does not exceed 0.06mm.

[0038] Although the present invention has been described herein with reference to illustrative embodiments, the above embodiments are merely preferred embodiments of the present invention, and the implementation of the present invention is not limited to the above embodiments. It should be understood that those skilled in the art can design many other modifications and implementations, which will fall within the scope and spirit of the principles disclosed in this application.

Claims

1. A type of mold for forming a central guide mold, characterized in that, It includes an upper mold (7), a lower mold (8), an upper mold core and an upper mold adjustment block (12) installed in the upper mold, and a lower mold core and a lower mold adjustment block (16) installed in the lower mold; when the mold is closed, the upper mold applies pressure to the lower mold direction, and the upper and lower mold cores correspond respectively.

2. The middle guide mold assembly mold according to claim 1, characterized in that, The upper mold core includes upper mold core one (9), upper mold core two (10), and upper mold core three (11), with upper mold core two (10) fixedly connected in the upper mold (7).

3. The intermediate guide mold assembly mold according to claim 1, characterized in that, The lower mold core includes lower mold core one (13), lower mold core two (14), and lower mold core three (15), with lower mold core two (14) fixedly connected in the lower mold core.

4. The intermediate guide mold assembly mold according to claim 1, characterized in that, The upper mold 7 is also provided with two threaded holes (701) on its side to fix the upper mold core (9) and the upper mold core (11).

5. A middle guide mold assembly mold according to claim 1, characterized in that, The top of the upper mold adjustment block (12) is also provided with two threaded holes (1201) corresponding to the upper mold core one (9) and the upper mold core three (11) respectively. The height of the two upper mold cores can be adjusted by tightening the threads.

6. A middle guide mold assembly mold according to claim 1, characterized in that, The bottom of the lower mold adjustment block (16) is also provided with two threaded holes (1601) corresponding to the lower mold core one (13) and the lower mold core three (15) respectively, and the height of the two lower mold cores can be adjusted by thread fastening.

Images