A pickling and grinding device for a circuit board

Abstract

This utility model discloses an acid pickling and grinding device for circuit board processing, including a platform top frame, an extension frame, an electric drive guide rail, a movable slide table, and a board acid pickling and grinding unit. During use, to ensure effective acid rinsing of the substrate, an external air pump can be driven to inject gas into the air supply pipeline. The gas ejected from the air supply pipeline will push the acid pickling liquid inside the acid pickling chamber to circulate and spray from both sides of the board, ensuring the acid pickling effect. After the electric drive grinding roller is started, it again drives two sets of grinding frames to rotate and approach the substrate surface via the electric drive shaft, performing contact grinding on the substrate surface. To ensure that the electric drive grinding roller effectively grinds all positions on the substrate surface, during the grinding step, the grinding frame can be moved vertically back and forth by driving the vertical guide rail, allowing the electric drive grinding roller on the grinding frame to fully grind the substrate surface, ensuring a good stencil effect on the substrate surface.

Description

Technical Field

[0001] This utility model relates to the field of pickling and grinding technology for circuit boards, specifically to a pickling and grinding device for circuit board processing. Background Technology

[0002] The function of pickling and grinding plates in circuit board processing: 1. Pickling removes surface oxides and contaminants. Pickling reacts with acidic solutions (such as sulfuric acid and hydrochloric acid) on the metal surface, effectively dissolving impurities such as oxide film, residual flux, and grease on the copper layer surface. This process can prevent oxides from interfering with conductivity and provide a clean substrate for subsequent processes. 2. Improves surface smoothness and gloss The grinding process reduces the microscopic unevenness of the copper layer surface and lowers the roughness through mechanical or chemical grinding, making the circuit board surface smoother. A uniform surface helps to improve etching accuracy and solder mask adhesion, and avoids problems such as burrs on the circuit edges. 3. Enhances coating adhesion and welding reliability The cleaned copper surface has higher activity, which can make the electroplating layer, solder resist ink or metal coating adhere more tightly and reduce the risk of delamination. Pre-welding treatment can avoid defects such as cold solder joints and insufficient solder joint strength caused by oxides. 4. Pickling and grinding can remove potential defects such as micro-cracks and burrs, reducing the risk of short circuits or open circuits caused by surface problems during etching, lamination and other processes of the circuit board. Grinding can also reduce residues in the holes and avoid tin bead contamination during subsequent tin spraying or immersion gold. 5. Improves conductivity and signal transmission performance After removing the oxide layer and impurities, the conductivity of the copper conductor surface is restored, reducing signal transmission loss, which is especially important for the performance stability of high-frequency and high-speed circuit boards.

[0003] In the prior art, publication number "CN222602695U" discloses an acid pickling and grinding device for circuit board processing, including an acid pickling tank and a bracket fixed to the top of the acid pickling tank. Inside the acid pickling tank, from top to bottom, are arranged an upper brush and a lower brush, with a placement plate between them. The top of the placement plate has a placement groove, and the bottom of the placement plate contacts the top of the lower brush. This utility model designs a cleaning mechanism that allows for the simultaneous cleaning of multiple circuit boards, ensuring that both the top and bottom surfaces of the circuit boards are in full contact with the upper and lower brushes. The rotation of the upper and lower brushes and the contact of the brush bristles ensure that the acidic solution can fully penetrate all areas of the circuit board, preventing stacked circuit boards from causing some areas to remain uncleaned. This improves the cleaning effect and ensures the quality and performance of the circuit boards.

[0004] However, existing technologies still have significant shortcomings, such as: In the aforementioned apparatus and existing technologies, the oil stain layer on the substrate surface is removed during substrate pickling to facilitate the effective construction of subsequent steps. However, the pickling and grinding steps cannot be integrated during the processing. The substrate needs to undergo separate pickling and grinding steps, resulting in low processing efficiency and difficulty in meeting the needs of large-volume substrate processing. Utility Model Content

[0005] The purpose of this invention is to provide an acid pickling and grinding device for circuit board processing, so as to solve the problems mentioned in the background art.

[0006] To achieve the above objectives, this utility model provides the following technical solution: a pickling and grinding device for circuit board processing, comprising a platform top frame, an extension frame, an electric drive guide rail, a movable slide table, and a board pickling and grinding unit. The platform top frame is installed on an external working plane. The extension frame is configured in two sets, wherein the two sets of extension frames are symmetrically installed at the bottom of the platform top frame. The electric drive guide rail is installed between adjacent extension frames. The movable slide table is installed on the moving end of the electric drive guide rail. The board pickling and grinding unit is located in the bottom area of ​​the movable slide table and is used to perform pickling and grinding treatments on the circuit board.

[0007] Preferably, the plate pickling and grinding unit includes a pickling section, the pickling section includes a movable cylinder, the movable cylinder is installed on the top of the movable slide, a fixed frame is provided at the bottom of the movable slide, the top of the fixed frame is fixed to the moving end of the movable cylinder, vertical guide rails are provided on both sides of the fixed frame, a plate frame is installed at the bottom of the fixed frame, plate clamps are installed on both sides of the plate frame, and a pickling tank is provided in the bottom area of ​​the electric drive guide rail.

[0008] Preferably, the plate pickling grinding unit further includes a grinding plate part, which includes a fixed arm. The fixed arm is mounted on the moving end of the vertical guide rail. An electric drive shaft is embedded in the surface of the fixed arm. A grinding frame is mounted on the rotating end of the electric drive shaft. An installation cavity is provided through the surface of the grinding frame. Multiple sets of electric drive grinding rollers are arranged at equal intervals inside the installation cavity.

[0009] Preferably, the pickling tank is equipped with an acid flow guiding unit for the pickling of sheet metal.

[0010] Preferably, the acid solution guiding unit for the pickling process of the sheet includes a partition plate, the pickling tank is provided with a pickling chamber, and the partition plate is configured in several groups, with the several groups of partition plates installed at equal intervals inside the pickling chamber.

[0011] Preferably, air supply lines are installed on both sides of the pickling chamber, and the air supply lines are configured as two sets.

[0012] Preferably, the surface of the electrically driven grinding roller is provided with a nano-ceramic layer.

[0013] Compared with the prior art, the beneficial effects of this utility model are: 1. During use, after the board clamp is reset, drive the electric drive guide rail. The electric drive guide rail moves the movable slide to the top center area of ​​the pickling tank. After the movable slide is in place, stand still for 5 seconds. Then drive the movable cylinder to insert the board frame and board clamp into the pickling tank. In order to ensure that the board is effectively rinsed with pickling solution, gas can be injected into the air supply line by driving the external air pump. The gas sprayed out of the air supply line will push the pickling solution inside the pickling chamber to circulate and spray from both sides of the board to ensure the pickling effect of the board. 2. When in use, start the electric drive grinding roller to rotate. After the electric drive grinding roller is started, it will drive the two sets of grinding frames to rotate and approach the substrate surface through the electric drive shaft. The electric drive grinding roller will then perform contact grinding on the substrate surface. In order to ensure that the electric drive grinding roller can effectively grind all parts of the substrate surface, the grinding frame can be moved vertically back and forth by driving the vertical guide rail during the grinding process. This allows the electric drive grinding roller on the grinding frame to fully grind the substrate surface and ensure the template effect on the substrate surface. Attached Figure Description

[0014] Figure 1 This is a schematic diagram of the overall device of this utility model; Figure 2 This is a schematic diagram of the grinding frame part in this utility model; Figure 3 This is a schematic diagram of the fixing frame and vertical guide rail in this utility model; Figure 4 This is a schematic diagram of the partition plate portion in this utility model; Figure 5 This is a schematic diagram of the gas supply pipeline in this utility model.

[0015] In the diagram: 1. Platform top frame; 2. Extension frame; 3. Electric drive guide rail; 4. Movable slide table; 41. Movable cylinder; 5. Fixed frame; 51. Vertical guide rail; 6. Fixed arm; 61. Electric drive shaft; 7. Grinding frame; 71. Mounting cavity; 72. Electric drive grinding roller; 8. Sheet frame; 81. Sheet clamp; 9. Pickling tank; 91. Pickling cavity; 92. Partition plate; 93. Air supply pipeline. Detailed Implementation

[0016] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.

[0017] Please see Figure 1-5 This utility model provides a technical solution: Example 1: A pickling and grinding device for circuit board processing: including a platform top frame 1, an extension frame 2, an electric drive guide rail 3, a movable slide table 4, and a board pickling and grinding unit. The platform top frame 1 is installed on the external working plane. The extension frame 2 is set in two sets, with the two sets of extension frames 2 symmetrically installed at the bottom of the platform top frame 1. The electric drive guide rail 3 is installed between adjacent extension frames 2. The movable slide table 4 is installed on the moving end of the electric drive guide rail 3. The board pickling and grinding unit is set in the bottom area of ​​the movable slide table 4 and is used to perform pickling and grinding treatment on the circuit board respectively.

[0018] The plate pickling and grinding unit includes a pickling section, which includes a movable cylinder 41. The movable cylinder 41 is installed on the top of the movable slide table 4. A fixed frame 5 is provided at the bottom of the movable slide table 4. The top of the fixed frame 5 is fixed to the moving end of the movable cylinder 41. Vertical guide rails 51 are provided on both sides of the fixed frame 5. A plate rack 8 is installed at the bottom of the fixed frame 5. Plate clamps 81 are installed on both sides of the plate rack 8. A pickling tank 9 is provided in the bottom area of ​​the electric drive guide rail 3.

[0019] The plate pickling grinding unit also includes a grinding plate section, which includes a fixed arm 6. The fixed arm 6 is mounted on the moving end of the vertical guide rail 51. An electric drive shaft 61 is embedded in the surface of the fixed arm 6. A grinding frame 7 is mounted on the rotating end of the electric drive shaft 61. An installation cavity 71 is provided through the surface of the grinding frame 7. Multiple sets of electric drive grinding rollers 72 are arranged at equal intervals inside the installation cavity 71.

[0020] The surface of the electrically driven grinding roller 72 is provided with a nano-ceramic layer.

[0021] In this embodiment, the electric drive shaft 61 drives two sets of grinding frames 7 to rotate and approach the substrate surface. The electric drive grinding rollers 72 perform contact grinding on the substrate surface. In order to ensure that the electric drive grinding rollers 72 can effectively grind all positions on the substrate surface, during the grinding step, the grinding frame 7 can be driven to move vertically back and forth by the drive vertical guide rail 51, so that the electric drive grinding rollers 72 on the grinding frame 7 can fully grind the substrate surface and ensure the template effect on the substrate surface.

[0022] Example 2: Based on Embodiment 1, this embodiment takes into account that if the pickling step is carried out by immersion, the oil stain layer on the surface of the board needs to be quickly peeled off by pressurized acidic liquid rinsing. If a pressurized structure cannot be provided, the problem of slow oil stain layer peeling rate will easily occur. Therefore, this embodiment is provided with an acid liquid guiding unit for board pickling to avoid the above problem. The pickling tank 9 is equipped with an acid flow diversion unit for the pickling of sheet metal.

[0023] The acid solution diversion unit for pickling sheet metal includes a partition plate 92. The pickling tank 9 is equipped with a pickling chamber 91. The partition plates 92 are set in several groups, and the several groups of partition plates 92 are installed at equal intervals inside the pickling chamber 91.

[0024] Both sides of the pickling chamber 91 are equipped with air supply lines 93, and the air supply lines 93 are configured in two sets.

[0025] In this embodiment, after all the multiple sets of plate clamps 81 are loaded, the plate frame 8 and the plate clamps 81 are partially raised and reset by driving the movable cylinder 41. After the plate clamps 81 are reset, the electric drive guide rail 3 is driven, and the electric drive guide rail 3 drives the movable slide 4 to move to the top middle area of ​​the pickling tank 9. After the movable slide 4 moves into place, it is left to stand for 5 seconds. Then, the movable cylinder 41 is driven to drive the plate frame 8 and the plate clamps 81 to insert into the pickling tank 9. In order to ensure that the substrate is effectively rinsed with pickling solution, gas can be injected into the air supply pipe 93 by driving the external air pump. The gas sprayed out of the air supply pipe 93 will push the pickling solution inside the pickling chamber 91 to circulate and spray from both sides of the plate to ensure the pickling effect of the plate.

[0026] Working principle: The operator drives the electric drive rail 3, which moves the movable slide 4 to the plate stacking rack outside the pickling tank 9. Then, the operator drives the movable cylinder 41 to move the fixed frame 5 towards the plate stacking rack area. When the plate clamp 81 at the bottom of the fixed frame 5 is in place, the operator installs the plate onto the plate clamp 81. After all the plate clamps 81 are loaded, the operator drives the movable cylinder 41 to lift and reset the plate rack 8 and the plate clamp 81. The electric drive guide rail 3 drives the movable slide 4 to move to the top center area of ​​the pickling tank 9. After the movable slide 4 moves into place, it stands still for 5 seconds. Then, the movable cylinder 41 drives the board frame 8 and the board clamp 81 to be inserted into the pickling tank 9. In order to ensure that the board is effectively rinsed with pickling solution, gas can be injected into the air supply pipe 93 by driving an external air pump. The gas sprayed out of the air supply pipe 93 will push the pickling solution inside the pickling chamber 91 to circulate and spray from both sides of the board to ensure the pickling effect of the board. After the plate has completed the cyclic pickling, the plate frame 8 and the plate clamp 81 are lifted and reset by the drive cylinder 41. After the plate has been lifted and reset, the plate is left to stand for 5 seconds to allow the pickling liquid on the plate surface to fall back into the pickling tank 9. Then, the electric drive guide rail 3 is driven to move the plate of the movable slide 4 and the plate clamp 81. During the movement of the plate clamp 81, the plate clamp 81 and the substrate will shake slightly, so that the pickling liquid remaining on the substrate surface can flow back smoothly into the pickling tank 9, further improving the recycling effect of the pickling liquid. After the residual pickling solution on the substrate surface is fully drained, the drive shaft 61 drives the two sets of polishing frames 7 to rotate and adjust towards the substrate surface. When the two sets of polishing frames 7 are fully deployed, the electric-driven polishing rollers 72 on the surface of the two sets of polishing frames 7 will approach the substrate surface. Then, the electric-driven polishing rollers 72 are started to rotate. After the electric-driven polishing rollers 72 are started, the drive shaft 61 drives the two sets of polishing frames 7 to rotate and approach the substrate surface again. The electric-driven polishing rollers 72 perform contact polishing on the substrate surface. In order to ensure that the electric-driven polishing rollers 72 can effectively polish all parts of the substrate surface, during the polishing step, the vertical guide rail 51 can drive the polishing frame 7 to move vertically back and forth, so that the electric-driven polishing rollers 72 on the polishing frame 7 can fully polish the substrate surface and ensure the template effect on the substrate surface.

[0027] Although embodiments of the present invention have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made to these embodiments without departing from the principles and spirit of the present invention, the scope of which is defined by the appended claims and their equivalents.

Claims

1. A pickling and grinding device for circuit board processing, characterized in that: The system includes a platform top frame (1), an extension frame (2), an electric drive rail (3), a movable slide (4), and a board pickling and grinding unit. The platform top frame (1) is installed on the external working plane. The extension frame (2) is set in two sets, with the two sets of extension frames (2) symmetrically installed at the bottom of the platform top frame (1). The electric drive rail (3) is installed between adjacent extension frames (2). The movable slide (4) is installed on the moving end of the electric drive rail (3). The board pickling and grinding unit is located in the bottom area of ​​the movable slide (4) and is used to pickle and grind the circuit board respectively.

2. The pickling and grinding device for circuit board processing according to claim 1, characterized in that: The plate pickling and grinding unit includes a pickling section, which includes a movable cylinder (41). The movable cylinder (41) is installed on the top of the movable slide (4). A fixed frame (5) is provided at the bottom of the movable slide (4). The top of the fixed frame (5) is fixed to the moving end of the movable cylinder (41). Vertical guide rails (51) are provided on both sides of the fixed frame (5). A plate rack (8) is installed at the bottom of the fixed frame (5). Plate clamps (81) are installed on both sides of the plate rack (8). A pickling tank (9) is provided in the bottom area of ​​the electric drive guide rail (3).

3. The pickling and grinding device for circuit board processing according to claim 2, characterized in that: The plate pickling grinding unit also includes a grinding plate part, which includes a fixed arm (6). The fixed arm (6) is mounted on the moving end of the vertical guide rail (51). An electric drive shaft (61) is embedded in the surface of the fixed arm (6). A grinding frame (7) is mounted on the rotating end of the electric drive shaft (61). An installation cavity (71) is provided through the surface of the grinding frame (7). Multiple sets of electric drive grinding rollers (72) are arranged at equal intervals inside the installation cavity (71).

4. The pickling and grinding device for circuit board processing according to claim 2, characterized in that: The pickling tank (9) is equipped with an acid flow guiding unit for the pickling of sheet metal.

5. The pickling and grinding device for circuit board processing according to claim 4, characterized in that: The acid solution guiding unit for the pickling process of the plate includes a partition plate (92), the pickling tank (9) is provided with a pickling chamber (91), the partition plate (92) is set in several groups, and the several groups of partition plates (92) are installed at equal intervals inside the pickling chamber (91).

6. The pickling and grinding device for circuit board processing according to claim 5, characterized in that: The pickling chamber (91) is equipped with air supply lines (93) on both sides, and the air supply lines (93) are configured in two sets.

7. The pickling and grinding device for circuit board processing according to claim 3, characterized in that: The surface of the electrically driven grinding roller (72) is provided with a nano-ceramic layer.

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