Anti-interference power equipment fault diagnosis device

CN224609205UActive Publication Date: 2026-08-07HENAN LINGLINGQI ELECTRIC POWER TECHNOLOGY CO LTD +1
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Patent Information

Authority / Receiving Office
CN · China
Patent Type
Utility models(China)
Current Assignee / Owner
HENAN LINGLINGQI ELECTRIC POWER TECHNOLOGY CO LTD
Filing Date
2025-08-22
Publication Date
2026-08-07

AI Technical Summary

Technical Problem

[0003]现有技术中:在户外或工业场景中的温湿度剧烈波动、粉尘附着、机械振动等环境因素,会影响传感器灵敏度或数据传输链路稳定性,造成诊断装置误报或漏报的情况发生

Benefits of technology

[0014]本实用新型通过由密封胶条、导电橡胶衬垫、金属簧片和金属屏蔽罩共同构成的电磁屏蔽密封舱体,以及对称布局的滤波阵列板(含共模电感、X/Y电容),该装置能有效隔离外部空间电磁辐射和抑制线缆上的传导干扰,为内部核心模块提供洁净的工作环境,显著降低数据误码和诊断误判风险。

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Abstract

The utility model discloses an anti -interference's electric power equipment fault diagnosis device, including device body, the shell subassembly of device body outside swing installation, device body includes the wiring port of setting at device body top, and device body bottom is provided with the outgoing line mouth, and the anti -collision angle of fixed connection is all established in device body top four quarters, and device body top is provided with the solar cell panel of connection, and the heat -conducting silicone grease is all daubed in device body inner wall, and the mainboard of fixed connection is established in device body inside, and the silica gel shock pad of setting connection is established in the mainboard top surface, by the electromagnetic shielding sealed cabin body that constitutes by sealing rubber strip, conducting rubber gasket, metal spring piece and metal shield together, and the filter array board (including common mode inductance, X / Y electric capacity) of symmetrical layout, can effectively isolate external interference, provide clean working environment for internal core module.
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Description

Technical Field

[0001] This utility model relates to the field of power engineering technology, specifically to an anti-interference power equipment fault diagnosis device. Background Technology

[0002] In the stable operation of a power system, condition monitoring and fault diagnosis of power equipment (such as transformers, circuit breakers, and cables) are the core links, and the diagnosis results directly determine the equipment maintenance strategy and the reliability of the power supply system.

[0003] In existing technologies, environmental factors such as drastic fluctuations in temperature and humidity, dust adhesion, and mechanical vibration in outdoor or industrial settings can affect sensor sensitivity or data transmission link stability, leading to false alarms or missed alarms by diagnostic devices.

[0004] No effective solutions have yet been proposed to address the problems in the relevant technologies. Utility Model Content

[0005] In view of the problems in related technologies, this utility model proposes an anti-interference power equipment fault diagnosis device to overcome the above-mentioned technical problems existing in the existing related technologies.

[0006] Therefore, the specific technical solution adopted by this utility model is as follows: An anti-interference power equipment fault diagnosis device includes a device body, an outer shell assembly movably mounted on the outside of the device body, a wiring port at the top of the device body, a wiring outlet at the bottom of the device body, anti-collision corner guards fixedly connected to all four sides of the top of the device body, a solar panel connected to the top of the device body, thermally conductive silicone grease applied to the inner wall of the device body, a main board fixedly connected inside the device body, a silicone shock-absorbing pad connected to the top surface of the main board, and a core module connected to the top surface of the silicone shock-absorbing pad.

[0007] Preferably, the housing assembly includes an outer housing disposed outside the device body, a cover opening at the top of the housing, a connecting cover plate movably connected to the top of the cover opening, a cavity inside the housing, a connecting plate movably connected to the front end of the housing, a first wire through opening through the surface of the connecting plate, a filter array plate fixedly connected to the inner wall of the connecting plate, a slide rail connected to the inner wall of the housing, a metal spring fixedly connected to the inner wall of the housing, and a second wire through opening at the bottom end of the housing.

[0008] Preferably, conductive rubber pads are fixedly connected to the inner walls of both the first and second wire-through openings, and a honeycomb ventilation plate is fixedly connected to the bottom of the outer casing.

[0009] Preferably, sealing strips are provided between the joining plate and the outer shell, and between the connecting cover plate and the cover opening, to form an electromagnetic shielding sealed chamber.

[0010] Preferably, there are two sets of slide rails, symmetrically arranged on the inner walls of both sides of the cavity, and the two sides of the device body are provided with slide grooves that are adapted to the slide rails.

[0011] Preferably, a heat dissipation fin is fixedly connected inside the device body, with one end of the heat dissipation fin contacting the inner wall coated with thermal grease, and the other end extending to the outside of the outer shell assembly.

[0012] Preferably, the common-mode inductor, X capacitor, and Y capacitor on the filter array board are arranged symmetrically, and the filter array board is isolated from the inner wall of the bonding plate by a separate metal shield, which is electrically connected to the outer shell through the metal spring.

[0013] Preferably, the core module is rigidly connected to the silicone damping pad and the motherboard by at least four damped shock-absorbing bolts, and the space between the core module and the inner wall of the device body is filled with non-cured damping adhesive.

[0014] This invention utilizes an electromagnetic shielding sealed chamber composed of sealing strips, conductive rubber gaskets, metal springs, and a metal shielding cover, along with a symmetrically arranged filter array board (including common-mode inductors and X / Y capacitors). This device effectively isolates external electromagnetic radiation and suppresses conducted interference on cables, providing a clean working environment for the internal core modules and significantly reducing the risk of data errors and diagnostic misjudgments.

[0015] This invention employs a multi-layered shock absorption design, utilizing silicone shock-absorbing pads, damped shock-absorbing bolts, and non-cured damping shock-absorbing adhesive. This design effectively absorbs and buffers external mechanical vibrations and impact energy, preventing the core module and its connections from becoming loose, worn, or damaged by sudden impacts due to continuous vibration. This enhances the physical stability and service life of the device in harsh industrial environments.

[0016] This invention utilizes thermally conductive silicone grease applied to the inner wall of the device body, combined with heat dissipation fins extending to the outside, to form an efficient thermal management pathway, facilitating internal heat dissipation. Simultaneously, the bottom honeycomb ventilation plate ensures effective airflow while also providing dust and foreign object protection. This design effectively addresses the challenges of large temperature and humidity fluctuations and high dust levels in outdoor or industrial environments, preventing performance degradation or malfunctions due to overheating or dust accumulation. Attached Figure Description

[0017] Figure 1 This is a schematic diagram of the overall structure according to an embodiment of the present utility model; Figure 2 This is a schematic diagram of the external structure of the device body according to an embodiment of the present utility model; Figure 3 This is a schematic diagram of the external structure of the device body according to an embodiment of the present utility model; Figure 4 This is a schematic diagram of the shell assembly structure according to an embodiment of the present utility model; Figure 5 This is a schematic diagram of the bottom structure of the outer shell assembly according to an embodiment of the present utility model.

[0018] In the diagram: 1. Device body; 101. Wiring port; 102. Cable outlet; 103. Anti-collision corner protectors; 104. Solar panel; 105. Thermal grease; 106. Main board; 107. Silicone shock-absorbing pad; 108. Core module; 2. Shell assembly; 201. Cover opening; 202. Connecting cover; 203. Cavity; 204. Connecting plate; 205. First cable entry port; 206. Filter array plate; 207. Slide rail; 208. Metal spring; 209. Second cable entry port; 210. Conductive rubber pad; 211. Honeycomb ventilation plate. Detailed Implementation

[0019] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments of the present utility model. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments.

[0020] According to an embodiment of the present invention, an interference-resistant power equipment fault diagnosis device is provided.

[0021] Example 1; like Figure 1-5 As shown, an anti-interference power equipment fault diagnosis device according to an embodiment of the present invention includes a device body 1, an outer shell assembly 2 movably mounted on the outside of the device body 1, a wiring port 101 at the top of the device body 1, a wiring outlet 102 at the bottom of the device body 1, anti-collision corner guards 103 fixedly connected to all four sides of the top of the device body 1, a solar panel 104 fixedly connected to the top of the device body 1, thermally conductive silicone grease 105 applied to the inner wall of the device body 1, a main board 106 fixedly connected inside the device body 1, a silicone shock-absorbing pad 107 connected to the top surface of the main board 106, and a core module 108 connected to the top surface of the silicone shock-absorbing pad 107.

[0022] In this embodiment, the outer shell assembly 2 includes an outer shell disposed outside the device body 1. A cover plate opening 201 is provided at the top of the outer shell, and a connecting cover plate 202 is movably connected to the top of the cover plate opening 201. A cavity 203 is provided inside the outer shell, and a connecting plate 204 is movably connected to the front end of the outer shell. A first wire through hole 205 is provided through the surface of the connecting plate 204, and a filter array plate 206 is fixedly connected to the inner wall of the connecting plate 204. A slide rail 207 is provided and connected to the inner wall of the outer shell, and a metal spring 208 is fixedly connected to the inner wall of the outer shell. A second wire through hole 209 is provided at the bottom end of the outer shell. The outer shell assembly 2 can provide external protection for the entire device body 1, thereby improving the effectiveness of the device.

[0023] In this embodiment, conductive rubber gaskets 210 are fixedly connected to the inner walls of the first wire-through port 205 and the second wire-through port 209, and a honeycomb ventilation plate 211 is fixedly connected to the bottom of the outer casing. The conductive rubber gaskets 210 have the dual functions of environmental sealing and electrical connection. On the one hand, their elastic properties can tightly wrap cables of different diameters to form a seal, preventing dust and moisture from entering the device through the gaps in the cables. On the other hand, the honeycomb ventilation plate 211 has a unique hexagonal hole structure, which has excellent air intake efficiency in terms of fluid dynamics, allowing natural air convection or forced air cooling, effectively dissipating the heat generated by the motherboard, core module, etc. inside the device, and preventing the performance degradation of components or false alarms due to overheating.

[0024] In this embodiment, sealing strips are provided between the connecting plate 204 and the outer shell, and between the connecting cover plate 202 and the cover opening 201, forming an electromagnetic shielded sealed chamber. These sealing strips effectively isolate the intrusion of external dust, moisture, and even salt spray, preventing corrosion of internal precision electronic components or short circuits, thus greatly improving the long-term operational reliability of the device in harsh industrial environments. Simultaneously, this sealed chamber significantly attenuates the impact of external electromagnetic interference on the internal core module and suppresses the external radiation of internal signals, achieving bidirectional electromagnetic shielding and ensuring the purity of fault diagnosis signal acquisition and processing.

[0025] In this embodiment, there are two sets of slide rails 207, symmetrically arranged on the inner walls of both sides of the cavity 203. The two sides of the device body 1 are provided with slide grooves that are compatible with the slide rails 207. The cooperation between the slide rails 207 and the slide grooves makes the installation of the device body 1 convenient, the positioning accurate, and the maintenance on site easy. The metal spring 208 on the inner wall is a key design. When the device body 1 is pushed into place along the slide rail 207, the metal spring 208 will make elastic contact with the outer shell of the device body under pressure, forming a large-area, low-impedance electrical connection. This provides the device body 1 with an extremely reliable grounding path, which can quickly discharge the charge accumulated on the device body 1 due to electrostatic induction or external coupling. At the same time, it ensures that the metal shell of the device body 1 is at the same potential as the external shielding chamber, avoiding measurement errors caused by ground loop interference and potential difference.

[0026] In this embodiment, a heat dissipation fin is also fixedly connected inside the device body 1. One end of the heat dissipation fin contacts the inner wall coated with thermal grease 105, and the other end extends to the outside of the outer shell assembly 2. The thermal grease 105 transfers the heat generated inside to the inner wall of the metal device body 1, and then conducts it to the heat dissipation fin that is in close contact with it. The heat dissipation fin greatly increases the contact area with the external cooling air, which greatly improves the heat dissipation efficiency. This method of actively "guiding" heat to the outside avoids the accumulation of heat inside the sealed shell, providing a relatively low temperature and stable working environment for the core module, and ensuring the calculation accuracy and long-term stability.

[0027] In this embodiment, the common-mode inductor, X capacitor, and Y capacitor on the filter array board 206 are arranged symmetrically, and the filter array board 206 is isolated from the inner wall of the bonding plate 204 by a separate metal shield. The metal shield is electrically connected to the outer shell through a metal spring 208. The symmetrical arrangement of the filter array board is conducive to balanced filtering and improves the suppression effect of common-mode interference. The separate metal shield confines the electromagnetic field generated by the powerful filter circuit itself inside, preventing its secondary radiation from interfering with other sensitive circuits inside. The shield is reliably connected to the outer shell through the metal spring 208, ensuring the integrity of the shield and providing good grounding.

[0028] In this embodiment, the core module 108 is rigidly connected to the silicone damping pad 107 and the main board 106 through at least four damped shock-absorbing bolts. The area between the core module 108 and the inner wall of the device body 1 is filled with non-cured damping damping adhesive. The silicone damping pad 107 is designed for mechanical vibration and impact in outdoor or industrial environments. The damped shock-absorbing bolts provide a stable mechanical connection, and their built-in damping material can effectively absorb high-frequency vibration energy. The silicone damping pad 107 further isolates and attenuates the vibration transmitted from the main board 106. The non-cured damping damping adhesive filled around the perimeter is a high-performance material that always maintains viscoelasticity and can tightly wrap the core module 108. It can not only buffer impacts from all directions, but also dissipate mechanical kinetic energy by converting it into heat energy through friction within the material.

[0029] To facilitate understanding of the above-mentioned technical solutions of this utility model, the working principle or operation method of this utility model in actual process will be described in detail below.

[0030] In practical applications, firstly, the sealing strips between the connecting plate 204 and the outer shell, and between the connecting cover plate 202 and the cover opening 201, are used in conjunction with the conductive rubber gaskets 210 on the inner walls of the first wiring port 205 and the second wiring port 209 to form a closed electromagnetic shielding enclosure, blocking electromagnetic radiation from the outside space from entering the device body 1. The metal spring 208 on the inner wall of the outer shell is electrically connected to the metal shielding cover of the filter array plate 206, further enhancing the shielding effect and preventing interference from the shielding cover itself. When the cable is connected through the first wiring port 205 and the second wiring port 209, the filter array plate 206 (with a symmetrical layout of common mode inductor, X capacitor, and Y capacitor) can filter the conducted interference signals on the cable, ensuring that the electrical signals entering the core module 108 are clean. Then, the core module 108 is rigidly connected to the motherboard 106 through a dual structure of "damped shock-absorbing bolts and silicone shock-absorbing pads 107", which can absorb most of the vertical vibration energy. The non-cured damping adhesive filling around the perimeter can buffer horizontal vibrations and instantaneous impacts, prevent loosening and wear of internal components, and ensure circuit stability. Finally, the thermal grease 105 on the inner wall of the device body 1 can quickly conduct the heat generated by the core module 108 during operation. The heat is discharged through the heat sink fins to achieve efficient heat dissipation and avoid high temperature causing component performance degradation. The honeycomb ventilation plate 211 at the bottom of the outer shell can prevent external dust from entering the device while ensuring internal and external air circulation and assisting in heat dissipation, thus reducing the impact of dust adhesion on sensor sensitivity and circuits. The solar panel 104 can convert light energy into electrical energy to provide auxiliary power to the device, ensuring continuous operation of the device in outdoor or temporary power supply scenarios.

[0031] The above are merely preferred embodiments of the present utility model and are not intended to limit the present utility model. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of the present utility model shall be included within the protection scope of the present utility model.

Claims

1. An anti-interference power equipment fault diagnosis device, comprising a device body (1), characterized in that: The device body (1) is externally mounted with a shell assembly (2). The device body (1) includes a wiring port (101) at the top of the device body (1), a wire outlet (102) at the bottom of the device body (1), anti-collision corner guards (103) are fixedly connected to the top of the device body (1), a solar panel (104) is connected to the top of the device body (1), the inner wall of the device body (1) is coated with thermal conductive silicone grease (105), a main board (106) is fixedly connected inside the device body (1), a silicone shock-absorbing pad (107) is connected to the top surface of the main board (106), and a core module (108) is connected to the top surface of the silicone shock-absorbing pad (107).

2. The anti-interference power equipment fault diagnosis device according to claim 1, characterized in that, The outer casing assembly (2) includes an outer casing disposed outside the device body (1). A cover plate opening (201) is provided at the top of the outer casing. A connecting cover plate (202) is movably connected to the top of the cover plate opening (201). A cavity (203) is provided inside the outer casing. A connecting plate (204) is movably connected to the front end of the outer casing. A first wire through hole (205) is provided through the surface of the connecting plate (204). A filter array plate (206) is fixedly connected to the inner wall of the connecting plate (204). A slide rail (207) is provided and connected to the inner wall of the outer casing. A metal spring (208) is fixedly connected to the inner wall of the outer casing. A second wire through hole (209) is provided at the bottom end of the outer casing.

3. The anti-interference power equipment fault diagnosis device according to claim 2, characterized in that, The inner walls of the first wire insertion port (205) and the second wire insertion port (209) are both fixedly connected with conductive rubber pads (210), and the bottom of the outer shell is fixedly connected with a honeycomb ventilation plate (211).

4. The anti-interference power equipment fault diagnosis device according to claim 2, characterized in that, Sealing strips are provided between the connecting plate (204) and the outer shell, and between the connecting cover plate (202) and the cover plate opening (201), together forming an electromagnetic shielding sealed chamber.

5. The anti-interference power equipment fault diagnosis device according to claim 2, characterized in that, There are two sets of slide rails (207), which are symmetrically arranged on the inner walls of both sides of the cavity (203). The two sides of the device body (1) are provided with slide grooves that are compatible with the slide rails (207).

6. The anti-interference power equipment fault diagnosis device according to claim 1, characterized in that, The device body (1) is also fixedly connected to a heat dissipation fin. One end of the heat dissipation fin contacts the inner wall coated with thermal grease (105), and the other end extends to the outside of the outer shell assembly (2).

7. The anti-interference power equipment fault diagnosis device according to claim 2, characterized in that, The common-mode inductor, X capacitor and Y capacitor on the filter array board (206) are arranged symmetrically, and the filter array board (206) is isolated from the inner wall of the bonding plate (204) by a separate metal shield, which is electrically connected to the outer shell through the metal spring (208).

8. The anti-interference power equipment fault diagnosis device according to claim 1, characterized in that, The core module (108) is rigidly connected to the silicone damping pad (107) and the main board (106) by at least four damped shock-absorbing bolts, and the core module (108) is filled with non-cured damping adhesive between its periphery and the inner wall of the device body (1).