Wafer chuck jaw and cleaning chamber

Abstract

This utility model belongs to the field of electrical component technology, specifically relating to a device specifically suitable for handling semiconductors or solid-state devices during manufacturing or processing, and particularly to a wafer gripper and cleaning chamber. This wafer gripper features a gripper body at its top, which, under the action of a connecting shaft, allows for gripper posture transformation. Specifically, when the connecting shaft moves upward, the pushing gripper body flips outward, allowing it to clear the wafer placement position. After the wafer is placed, the connecting shaft moves downward, causing the gripper body to flip back to its original position, thereby clamping the edge of the wafer. Through the gripper posture transformation, the gripper clamps the wafer only through the end of the gripper body, reducing the contact area between the gripper and the wafer and increasing the cleaning area.

Description

Technical Field

[0001] This utility model belongs to the field of electrical component technology, specifically relating to a device specifically suitable for handling semiconductor or solid-state devices during manufacturing or processing, and particularly to a wafer gripper and cleaning chamber. Background Technology

[0002] In the semiconductor manufacturing process, electroplating is one of the core processes, directly determining the yield and performance of chips. Currently, common electroplating equipment is mainly divided into vertical electroplating and horizontal electroplating. Vertical electroplating equipment usually has a cleaning chamber module to clean the wafers before electroplating, preventing the wafers from contaminating the chemicals in the subsequent electroplating tank. The cleaning chamber usually uses a single-wafer cleaning method, which has a better cleaning effect. However, related technologies usually use a clamping method to hold the wafers, which results in a larger contact area with the wafer, thus reducing the effective cleaning area.

[0003] There is an urgent need to provide a cleaning device that reduces the contact area with the wafer in order to solve the technical problems in the related technology.

[0004] It should be noted that the information disclosed in this background section is only for understanding the background technology of the present application concept, and therefore, the above description is not considered to constitute prior art information. Utility Model Content

[0005] This disclosure provides at least one wafer gripper, comprising: a gripper body and a gripper collar; the gripper collar is vertically disposed at the top of the gripper body; and The claw body has an internal cavity, and a connecting shaft is slidably installed inside the cavity; The top end of the connecting shaft corresponds to the bottom end of the claw body; whereby The connecting shaft is configured to push the claw body from a clamping posture to an avoidance posture when it moves upward; and After the connecting shaft moves down, the claw body flips from the avoidance posture to the clamping posture, thereby clamping the edge of the placed wafer.

[0006] In one alternative embodiment, a spring receiving area is provided at the lower end of the cavity; A first resistance spring is installed within the spring receiving area; wherein The first resistance spring is configured to push the connecting shaft downward.

[0007] In one alternative embodiment, a pivot is provided at the top of the claw body; and The claw body has a rotating hole that matches the rotating shaft; The claw body is connected to the rotating shaft through a rotating hole.

[0008] This disclosure also provides at least one cleaning chamber, including: the above-mentioned wafer grippers, and including: a wafer receiving cavity; A mounting ring is provided at the top of the wafer accommodating cavity; The mounting ring has several wafer clamp mounting positions around it.

[0009] In one alternative embodiment, the cleaning chamber further includes a lifting device; The lifting device is located below the wafer grippers; whereby The lifting device is configured to lift the connecting shaft of the wafer gripper so that the wafer gripper rotates to an inclined position.

[0010] In one alternative embodiment, a connecting ring is provided on the body of the wafer gripper, and the wafer gripper is connected to the mounting ring through the connecting ring to place the wafer gripper in the wafer gripper mounting position.

[0011] In one alternative embodiment, a second resistance spring is also fitted on the outer side of the claw body; The top of the second resistance spring abuts against the bottom of the mounting ring; and The bottom of the second resistance spring abuts against the bottom of the claw body; wherein The stiffness of the second resistance spring is greater than that of the first resistance spring, meaning that the lifting device is suitable for first pushing the connecting shaft to move so that the claw body flips from a vertical posture to an inclined posture before pushing the entire claw body upward.

[0012] In one optional embodiment, the cleaning chamber further includes: a lifting spindle; The lifting spindle is connected to the jacking device, and the lifting spindle is configured to drive the jacking device to move up and down; and A rotating cylinder is sleeved on the outside of the lifting spindle, and the rotating cylinder is configured to drive the lifting device to rotate so that the lifting device is aligned with the wafer gripper.

[0013] In one alternative embodiment, a lifting device mounting position is provided on the outer wall of the rotating cylinder.

[0014] In one alternative embodiment, the mounting ring is further provided with several support posts; Each support pillar is spaced apart from the wafer gripper; and The support pillars are configured to support the placed wafer.

[0015] The beneficial effect of this utility model is that the wafer gripper has a gripper body set at the top of the gripper body, thereby realizing the posture transformation of the gripper body under the action of the connecting shaft. Specifically, when the connecting shaft moves upward, the pushing gripper body flips outward, so that the gripper body avoids the wafer placement position. After the wafer is placed, the connecting shaft moves downward, so that the gripper body flips back to its original position, thereby clamping the edge of the wafer. Through the posture transformation of the gripper body, the gripper clamps and fixes the wafer only through the end of the gripper body, reducing the contact area between the gripper and the wafer and increasing the cleaning area.

[0016] Other features and advantages of this invention will be set forth in the description which follows, and will be apparent in part from the description, or may be learned by practicing the invention. The objectives and other advantages of this invention are realized and obtained through the structures particularly pointed out in the description and the accompanying drawings.

[0017] To make the above-mentioned objectives, features and advantages of this utility model more apparent and understandable, preferred embodiments are described below in detail with reference to the accompanying drawings. Attached Figure Description

[0018] To more clearly illustrate the specific embodiments of this utility model or the technical solutions in the prior art, the drawings used in the description of the specific embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are some embodiments of this utility model. For those skilled in the art, other drawings can be obtained from these drawings without creative effort.

[0019] Figure 1 A three-dimensional structural schematic diagram of the wafer gripper provided in an embodiment of this disclosure is shown; Figure 2 A schematic cross-sectional view of the wafer gripper provided in an embodiment of this disclosure is shown. Figure 3 A schematic diagram of the internal structure of the wafer gripper provided in an embodiment of this disclosure is shown; Figure 4 This diagram illustrates the state of the wafer gripper in a vertical orientation according to an embodiment of the present disclosure. Figure 5 This diagram illustrates the state of the wafer gripper in an inclined orientation according to an embodiment of the present disclosure. Figure 6 A cross-sectional view of the internal structure of the cleaning chamber provided in an embodiment of this disclosure is shown; Figure 7 A schematic diagram of the internal structure of the cleaning chamber provided in an embodiment of this disclosure is shown; Figure 8 A top view of the cleaning chamber provided in an embodiment of this disclosure is shown.

[0020] In the picture: 1. Claw body; 10. Spring receiving area; 11. Connecting shaft; 12. First resistance spring; 13. Rotating shaft; 2. Claw body; 21. Limiting component; 3. Wafer receiving cavity; 31. Mounting ring; 4. Lifting device; 41. Lifting spindle; 42. Rotating cylinder; 43. Support column. Detailed Implementation

[0021] To make the objectives, technical solutions, and advantages of the embodiments of this utility model clearer, the technical solutions of this utility model will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this utility model, not all embodiments. Based on the embodiments of this utility model, all other embodiments obtained by those skilled in the art without creative effort are within the protection scope of this utility model.

[0022] It should be noted that similar reference numerals and letters in the following figures indicate similar items; therefore, once an item is defined in one figure, it does not need to be further defined and explained in subsequent figures. Furthermore, in the figures, the thickness of parts may be exaggerated or reduced for the purpose of effectively depicting the technical content.

[0023] The following detailed description, with reference to the accompanying drawings, describes some embodiments of the present invention. Unless otherwise specified, the following embodiments and features can be combined with each other.

[0024] See Figure 1 , Figure 1 A wafer clamping jaw is shown, comprising: a jaw body 1 and a jaw body 2; the jaw body 2 is vertically disposed on the top of the jaw body 1; and a cavity is provided inside the jaw body 1, and a connecting shaft 11 is slidably disposed in the cavity; the top end of the connecting shaft 11 corresponds to the bottom end of the jaw body 2; wherein the connecting shaft 11 is configured to push the jaw body 2 from a clamping posture to an avoidance posture when it moves upward; and the jaw body 2 from the avoidance posture to the clamping posture after the connecting shaft 11 moves downward, thereby performing edge clamping on the placed wafer.

[0025] See Figure 2 , Figure 3 , Figure 4 and Figure 5 In some embodiments, by setting a claw body 2 on the top of the claw body 1, the posture transformation of the claw body 2 is realized under the action of the connecting shaft 11. Specifically, when the connecting shaft 11 moves upward, it pushes the claw body 2 to flip outward, so that the claw body 2 avoids the wafer placement position. After the wafer is placed, the connecting shaft 11 moves downward, so that the claw body 2 flips and resets, thereby clamping the edge of the wafer. Through the posture transformation of the claw body 2, the gripper clamps the wafer only through the end of the claw body 2, reducing the contact area between the gripper and the wafer.

[0026] See Figure 2 In some embodiments, a spring receiving area 10 is provided at the lower end of the cavity; a first resistance spring 12 is provided in the spring receiving area 10; wherein the first resistance spring 12 is configured to push the connecting shaft 11 downward.

[0027] Specifically, the first resistance spring 12 is set in the spring receiving area 10. When the connecting shaft 11 is moved upward by the external driving force, the first resistance spring 12 is compressed and contracted. When the external driving force disappears, the first resistance spring 12 pushes the connecting shaft 11 downward to reset under the action of its elastic restoring force, thereby causing the claw body 2 to change its posture.

[0028] See Figure 2 In some embodiments, a rotating shaft 13 is provided at the top of the claw body 1; and a rotating hole adapted to the rotating shaft 13 is provided on the claw body 2; the claw body 2 is connected to the rotating shaft 13 through the rotating hole.

[0029] Specifically, the claw body 2 is connected to the claw body 1 through the cooperation of the rotating shaft 13 and the rotating hole. In order to ensure the stability of the rotation of the claw body 2, a limiting component 21 is also provided on the claw body 1. The limiting component 21 is symmetrically arranged on both sides of the claw body 1, and a limiting protrusion is provided on the limiting component 21. A corresponding limiting groove is opened on the claw body 1. The length of the limiting groove is greater than the length of the limiting protrusion, so that the connecting shaft 11 is always limited by the limiting structure on both sides when sliding, ensuring the stable sliding of the connecting shaft 11.

[0030] See Figure 6 At least one other disclosed embodiment also provides a cleaning chamber employing the above-described wafer grippers, comprising: a wafer receiving cavity 3; a mounting ring 31 is provided on the top of the wafer receiving cavity 3; and a plurality of wafer gripper mounting positions are provided around the mounting ring 31.

[0031] See Figure 7 In some embodiments, a mounting ring 31 is provided in the wafer receiving cavity 3. The mounting ring 31 is provided, including but not limited to being mounted on the lifting spindle 41. The mounting ring 31 has wafer gripper mounting positions. A connecting ring is sleeved on the outer side of the gripper body 1 of each wafer gripper. The connecting ring is connected to the mounting ring 31, and the connection method includes but is not limited to bolt connection.

[0032] See Figure 7In some embodiments, the cleaning chamber further includes a lifting device 4; the lifting device 4 is disposed below the wafer gripper; wherein the lifting device 4 is configured to lift the connecting shaft 11 of the wafer gripper so that the wafer gripper rotates to an inclined position. The lifting device 4 is located below the wafer gripper. By moving the lifting device 4 upward, it presses the connecting shaft 11 of the wafer gripper, thereby changing the posture of the gripper body 2 and realizing the placement and clamping of the wafer. Specifically, a second resistance spring is provided on the outside of the gripper body 1, and the stiffness of the second resistance spring is greater than that of the first resistance spring 12. Therefore, when the lifting device 4 applies pressure to the wafer gripper, the first resistance spring 12 will be compressed first, thereby changing the posture of the gripper body 2. Then, the lifting device 4 continues to move upward, at which time the second resistance spring is also compressed, thereby causing the gripper body 1 to move upward to actively receive the wafer. When the lifting device 4 moves downward, the gripper body 1 also moves downward as a whole, that is, after the wafer is stably moved down to the cleaning position, the posture of the gripper body 2 rotates from the tilted posture back to the vertical posture, realizing the clamping and limiting of the wafer.

[0033] In some embodiments, the lifting spindle 41 is located in the center of the cleaning chamber, and the lifting spindle 41 is lifted and lowered by means of a lifting cylinder, and the lifting spindle 41 is slidably connected to the mounting ring 31, so that the top surface of the lifting spindle 41 can move upward from inside the mounting ring 31 to support the bottom of the wafer, and when the lifting spindle 41 descends, its top surface can detach from the wafer, so as not to encroach on the cleaning surface of the wafer.

[0034] See Figure 8 In some embodiments, a rotating cylinder 42 is also sleeved on the outside of the lifting spindle 41. The rotating cylinder 42 is driven to rotate by an external drive motor, and the lifting device 4 is set on the rotating cylinder 42. Under the rotation of the rotating cylinder 42, each lifting device 4 is aligned with the wafer clamp and rotates away after being clamped by the wafer clamp. This avoids accidental opening of the wafer clamp due to equipment vibration or pressure fluctuation in the subsequent cleaning process, and ensures the stability of wafer clamping.

[0035] See Figure 8 In some embodiments, the mounting ring 31 is further provided with a plurality of support posts 43; each support post 43 is spaced apart from the wafer grippers; and the support posts 43 are configured to support the placed wafer. The supporting force of the support posts 43 and the clamping force of the wafer grippers achieve the limiting and fixing of the wafer, and ensure a small contact area with the wafer.

[0036] In summary, this wafer gripper, by setting a gripper body 2 at the top of the gripper body 1, achieves posture transformation of the gripper body 2 under the action of the connecting shaft 11. Specifically, when the connecting shaft 11 moves upward, it pushes the gripper body 2 to flip outward, thereby allowing the gripper body 2 to avoid the wafer placement position. After the wafer is placed, the connecting shaft 11 moves downward, causing the gripper body 2 to flip and reset, thereby clamping the edge of the wafer. Through the posture transformation of the gripper body 2, the gripper clamps and fixes the wafer only through the end of the gripper body 2, reducing the contact area between the gripper and the wafer and increasing the cleaning area.

[0037] In this document, when it is said that the first component is located on the second component, this can mean that the first component can be directly formed on the second component, or that the third component can be inserted between the first component and the second component.

[0038] In this document, when an element or layer is referred to as “located,” “joined to,” “connected to,” “attached to,” or “coupled to” another element or layer, it may be directly located, joined, connected, attached to, or coupled to the other element or layer, or there may be intermediate elements or layers present. Conversely, when an element is referred to as “directly on another element or layer,” “directly joined to,” “directly connected to,” “directly attached to,” or “directly coupled to” another element or layer, there may be no intermediate elements or layers present. Other terms used to describe relationships between elements should be interpreted in a similar manner (e.g., “between” versus “directly between,” “adjacent” versus “directly adjacent,” etc.). As used herein, the term “and / or” includes any and all combinations of one or more of the related listed items.

[0039] In the description of the embodiments of this utility model, unless otherwise explicitly specified and limited, the terms "installation," "connection," and "linking" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; and they can refer to the internal connection of two components. Those skilled in the art can understand the specific meaning of the above terms in this utility model based on the specific circumstances.

[0040] In the description of this utility model, it should be noted that the terms "center," "upper," "lower," "left," "right," "vertical," "horizontal," "inner," and "outer," etc., indicating orientation or positional relationships, are based on the orientation or positional relationships shown in the accompanying drawings and are only for the convenience of describing this utility model and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this utility model. Furthermore, terms such as "first," "second," and other numerical terms used herein do not imply order or sequence unless expressly indicated herein. Therefore, without departing from the teachings of the exemplary embodiments, the first element, component, region, layer, or segment discussed above may be referred to as the second element, component, region, layer, or segment.

[0041] Based on the above-described preferred embodiments of this utility model, and through the foregoing description, those skilled in the art can make various changes and modifications without departing from the technical concept of this utility model. The technical scope of this utility model is not limited to the contents of the specification, but must be determined according to the scope of the claims.

Claims

1. A wafer gripper, characterized in that, include: Claw body (1) and claw body (2); The claw body (2) is vertically disposed at the top of the claw body (1); and The claw body (1) has a cavity inside, and a connecting shaft (11) is slidably disposed inside the cavity. The top end of the connecting shaft (11) corresponds to the bottom end of the claw body (2); wherein The connecting shaft (11) is configured to push the claw (2) from a clamping posture to an avoidance posture when it moves upward; as well as After the connecting shaft (11) moves down, the claw body (2) rotates from the avoidance posture back to the clamping posture, thereby clamping the edge of the placed wafer.

2. The wafer gripper as described in claim 1, characterized in that, A spring receiving area (10) is provided at the lower end of the cavity. A first resistance spring (12) is provided in the spring receiving area (10); wherein The first resistance spring (12) is configured to push the connecting shaft (11) downward.

3. The wafer gripper as described in claim 2, characterized in that, The top of the claw body (1) is provided with a pivot (13); and The claw body (2) is provided with a rotating hole that is compatible with the rotating shaft (13); The claw body (2) is connected to the rotating shaft (13) through the rotating hole.

4. A cleaning chamber, characterized in that, include: The wafer gripper as described in any one of claims 1-3, and comprising: Wafer housing cavity (3); The wafer receiving cavity (3) is provided with a mounting ring (31) on the top of the cavity; The mounting ring (31) has several wafer clamp mounting positions arranged around it.

5. The cleaning chamber as described in claim 4, characterized in that, Also includes: Lifting device (4); The lifting device (4) is located below the wafer clamps; wherein The lifting device (4) is configured to lift the connecting shaft (11) of the wafer gripper so that the wafer gripper rotates to an inclined position.

6. The cleaning chamber as described in claim 5, characterized in that, The wafer gripper has a connecting ring on its gripper body (1). The wafer gripper is connected to the mounting ring (31) through the connecting ring so as to place the wafer gripper in the wafer gripper mounting position.

7. The cleaning chamber as described in claim 6, characterized in that, A second resistance spring is also fitted on the outer side of the claw body (1); The top of the second resistance spring abuts against the bottom of the mounting ring (31); and The bottom of the second resistance spring abuts against the bottom of the claw body (1); wherein The stiffness of the second resistance spring is greater than that of the first resistance spring (12), that is, the lifting device (4) is adapted to first push the connecting shaft (11) to move so that the claw body (2) flips from a vertical posture to an inclined posture and then pushes the claw body (1) to move upward as a whole.

8. The cleaning chamber as described in claim 4, characterized in that, Also includes: Lifting spindle (41); The lifting spindle (41) is connected to the lifting device (4), and the lifting spindle (41) is configured to drive the lifting device (4) to move up and down; and A rotating cylinder (42) is sleeved on the outside of the lifting spindle (41), and the rotating cylinder (42) is configured to drive the lifting device (4) to rotate so that the lifting device (4) is aligned with the wafer gripper; wherein The lifting device (4) is located below the wafer clamps; wherein The lifting device (4) is configured to lift the connecting shaft (11) of the wafer gripper so that the wafer gripper rotates to an inclined position.

9. The cleaning chamber as described in claim 8, characterized in that, The outer wall of the rotating cylinder (42) is provided with a lifting device mounting position.

10. The cleaning chamber as described in claim 4, characterized in that, The mounting ring (31) is also provided with several support columns (43); Each of the aforementioned support pillars (43) is spaced apart from the wafer clamps; and The support pillar (43) is configured to support the placed wafer.

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