A high-strength light and thin touchpad module

Abstract

The utility model provides a kind of light and thin touchpad module of high strength, it is related to computer technical field, using PCBA layer, back adhesive layer+reinforcing structure layer, sheet metal layer is sequentially bonded in the mode of combination, reinforcing structure layer forms plane geometry and reinforces sheet metal layer, so that the thickness of touchpad module overall reduces;The utility model uses the sheet metal layer with the thickness of 0.5mm below, reinforcing structure layer is adhered in the dispensing area of sheet metal layer;Back adhesive layer is adhered to the upper surface of sheet metal layer, and reinforcing structure layer is flush with back adhesive layer;PCBA layer with the thickness of 0.8mm below is adhered through back adhesive layer and reinforcing structure layer and sheet metal layer, finally forms light and thin touchpad module, avoids the situation of warping deformation occurs, also significantly improves overall strength simultaneously;The utility model effectively reduces the degree of touchpad module, improves structural strength simultaneously, and then realizes that touchpad module is more light and thin and avoids the situation of warping deformation occurs.

Description

Technical Field

[0001] This utility model relates to the field of computer technology, and in particular to a high-strength, lightweight touchpad module. Background Technology

[0002] Laptops have become an indispensable part of people's daily work and life. The touchpad module, as a convenient component of laptops, allows users to interact with the system by swiping and clicking with their fingers. As people increasingly demand thinner and lighter laptops, touchpad modules also require similar slimmer designs.

[0003] In pursuit of thinner and lighter designs, the structural components of the module are constantly being thinned. The thickness of the main electronic component PCBA (Printed Circuit Board) has generally decreased from 1.0mm to below 0.8mm; the thickness of the main internal reinforcing sheet metal has decreased to below 0.5mm, resulting in a significant reduction in reinforcement capacity. The reduction in thickness inevitably leads to a sacrifice in strength. In particular, the internal reinforcing sheet metal has more openings on the short side to prevent gaps in electronic components, which increases the pressing stroke at the center point of the short side. This makes it difficult to trigger the Dome (metal spring conductive film tactile switch assembly), reduces the rebound ratio, and significantly worsens the touch feel. Currently, most of the PCBA is fully bonded to the plastic parts and internal reinforcing sheet metal using acrylic adhesive. The modulus of this type of polyester film is generally below 1Mpa, which cannot provide structural strength support at the bonding level.

[0004] Currently, some PCBAs are bonded to plastic parts and internal reinforcing sheet metal using high-strength adhesives such as hot melt adhesives and structural adhesives. These reactive structural adhesives, such as epoxy and polyurethane adhesives, generally have a modulus of over 100 MPa after curing. However, due to the significant differences in materials and modulus between PCBAs and sheet metal and plastic parts, the ability of each layer to resist internal stress is inconsistent. This makes it impossible to balance the bonding stress generated after the adhesive reaction and curing, which can easily lead to severe warping deformation of the module. Especially after reliability testing, the warping of products using this process has further deteriorated. Moreover, it is difficult to achieve uniform coating of liquid adhesive on the entire surface, which can easily lead to inconsistent height across the entire module.

[0005] Therefore, it is necessary to propose a high-strength, thin and light touchpad module to effectively reduce the thickness of the touchpad module while improving its structural strength, thereby making the touchpad module thinner and lighter and avoiding warping and deformation. Utility Model Content

[0006] To address the aforementioned issues, this invention proposes a high-strength, lightweight touchpad module to effectively reduce the thickness of the touchpad module while improving structural strength, thereby achieving a thinner and lighter touchpad module and preventing warping and deformation.

[0007] This utility model is achieved through the following technical solution:

[0008] This utility model proposes a high-strength, thin and light touch panel module, including a PCBA layer, an adhesive backing layer, a reinforcing structure layer, and a sheet metal layer. The bottom of the PCBA layer is adhered and fixedly connected to the sheet metal layer through the adhesive backing layer. The adhesive backing layer covers the sheet metal layer. The reinforcing structure layer is flush with the adhesive backing layer. The PCBA layer is fixedly connected to the sheet metal layer through the combined adhesive force of the adhesive backing layer and the reinforcing structure layer. The reinforcing structure layer forms a planar geometric structure to reinforce the sheet metal layer.

[0009] Furthermore, the sheet metal layer has an adhesive application area, and the reinforcing structure layer forms a planar geometric structure that is adhered and fixedly connected to the adhesive application area.

[0010] Furthermore, the reinforcing structural layer includes at least two first structural adhesives, which are symmetrically arranged along the center of the sheet metal layer and adhered and fixedly connected to the dispensing area.

[0011] Furthermore, the reinforcing structural layer also includes at least two second structural adhesives, which are symmetrically arranged along the center of the sheet metal layer and adhered and fixedly connected to the dispensing area. The at least two first structural adhesives and the at least two second structural adhesives together form a planar geometric structure.

[0012] Furthermore, the thickness of the sheet metal layer is a, where a ≤ 0.5 mm.

[0013] Furthermore, the dispensing area includes a first dispensing area with the same number of first structural adhesives, wherein the first structural adhesives correspond one-to-one with the first dispensing areas, and the first structural adhesives adhere to the first dispensing areas.

[0014] Furthermore, the dispensing area also includes a second dispensing area with the same number of the second structural adhesives, wherein the second structural adhesives correspond one-to-one with the second dispensing areas, and the second structural adhesives adhere to the second dispensing areas.

[0015] Furthermore, the sheet metal layer is provided with a weight-reducing groove area, the area of ​​the weight-reducing groove area is b, the total area of ​​the sheet metal layer is c, and 2b≥c.

[0016] Furthermore, the thickness of the PCBA layer is d, where d ≤ 0.8 mm.

[0017] Furthermore, the thickness of the adhesive backing layer is e, where e ≤ 0.13 mm.

[0018] The beneficial effects of this utility model are:

[0019] This utility model proposes a high-strength, thin and light touch panel module, which is combined by sequentially bonding a PCBA layer, an adhesive backing layer, a reinforcing structure layer, and a sheet metal layer. The reinforcing structure layer forms a planar geometric structure to reinforce the sheet metal layer, thereby reducing the overall thickness of the touch panel module, avoiding warping and deformation, and significantly improving its strength.

[0020] In summary, this high-strength, thin and light touchpad module can effectively reduce the thickness of the touchpad module while improving structural strength, thereby achieving a thinner and lighter touchpad module and avoiding warping and deformation. Attached Figure Description

[0021] Figure 1 This is an exploded view of the high-strength, lightweight touchpad module of this utility model;

[0022] Figure 2 This is a schematic diagram of the sheet metal layer of the high-strength, thin and light touch panel module of this utility model after the reinforcement structure layer has been adhered.

[0023] Figure 3 This is a schematic diagram of the sheet metal layer of the high-strength, lightweight touchpad module of this utility model;

[0024] Figure 4 This is a flowchart illustrating the manufacturing method of the high-strength, lightweight touchpad module of this utility model.

[0025] Figure 5 This is a table showing the strength data of each point of the high-strength, thin and light touchpad module of this utility model, tested using a displacement curve tester.

[0026] The attached figures are labeled as follows:

[0027] PCBA layer 1;

[0028] Adhesive backing layer 2, void-free area 21;

[0029] Reinforcing structural layer 3, first structural adhesive 31, second structural adhesive 32;

[0030] Sheet metal layer 4, glue application area 41, first glue application area 411, second glue application area 412, weight reduction groove area 42. Detailed Implementation

[0031] To more clearly and completely illustrate the technical solution of this utility model, the following description, in conjunction with the accompanying drawings, will further explain this utility model.

[0032] Please refer to Figures 1-3This utility model proposes a high-strength, lightweight touch panel module, including a PCBA layer 1, an adhesive backing layer 2, a reinforcing structure layer 3, and a sheet metal layer 4. The bottom of the PCBA layer 1 is adhered and fixedly connected to the sheet metal layer 4 through the adhesive backing layer 2, and the adhesive backing layer 2 covers the sheet metal layer 4. The adhesive backing layer 2 has a clearance area 21, and the reinforcing structure layer 3 is housed in the clearance area 21, making the reinforcing structure layer 3 flush with the adhesive backing layer 2. The PCBA layer 1 is fixedly connected to the sheet metal layer 4 through the combined adhesive force of the adhesive backing layer 2 and the reinforcing structure layer 3. The reinforcing structure layer 3 forms a planar geometric structure to reinforce the sheet metal layer 4. A touch panel is provided on the top of the PCBA layer 1, and the touch panel is electrically connected to the PCBA layer 1.

[0033] In this embodiment, PCBA layer 1, adhesive backing layer 2, reinforcing structure layer 3, and sheet metal layer 4 are bonded together in sequence. The reinforcing structure layer 3 forms a planar geometric structure to reinforce the sheet metal layer 4, thereby improving the overall strength of the sheet metal layer 4. This reduces the overall thickness of the touch panel module, avoids warping and deformation, and significantly improves its strength.

[0034] In this embodiment, a dispensing area 41 is provided on the sheet metal layer 4. The dispensing area 41 is located in the weak side region of the sheet metal layer 4 where the ultimate thinning strength is required. The reinforcing structure layer 3 forms a planar geometric structure and is adhered and fixedly connected to the dispensing area 41. The dispensing area 41 is designed in a concave form so that when the reinforcing structure layer 3 is adhered to the dispensing area 41, the surface of the reinforcing structure layer 3 is flush with the surface of the sheet metal layer 4. This helps to maintain a flush state when the backing adhesive layer 2 is adhered to the sheet metal layer 4, which facilitates the adhesion of the PCBA layer 1. The layered bonding design of the backing adhesive layer 2 and the reinforcing structure layer 3 achieves strength compensation. Since the dispensing area 41 is mainly concentrated on the weak side of the structure, the stress and strain area is small, achieving stress balance between the PCBA layer 1 and the sheet metal layer 4. This can effectively avoid the risk of module warping after the dispensing curing, resulting in a flat touch panel module product.

[0035] In this embodiment, the reinforcing structural layer 3 includes at least two first structural adhesives 31. The at least two first structural adhesives 31 are symmetrically arranged along the center of the sheet metal layer 4 and are adhered and fixedly connected to the dispensing area 41. The first structural adhesives 31 are applied in a straight line to form a reinforcing structure with a preset thickness, which can strengthen the strength of the sheet metal layer 4 after drying.

[0036] In this embodiment, the reinforcing structural layer 3 further includes at least two second structural adhesives 32. These at least two second structural adhesives 32 are symmetrically arranged along the center of the sheet metal layer 4 and adhered and fixedly connected to the dispensing area 41. The at least two first structural adhesives 31 and the at least two second structural adhesives 32 together form a planar geometric structure. The second structural adhesives 32 are also applied in a straight line. The second structural adhesives 32 can be perpendicular to the first structural adhesives 31. When at least two first structural adhesives 31 and at least two second structural adhesives 32 are applied, they can together form a planar geometric structure. For example, the first structural adhesive 31 is applied in a longer length, covering the top and bottom sections, while the second structural adhesive 32 is applied in a shorter length, covering the left and right sections, together forming a rectangular structure. This can be achieved according to the product design, on the weaker side, such as long side + long side, or long side... By reinforcing the short sides, the sheet metal layer 4 can be strengthened, improving its pressing elasticity. Alternatively, a chamfered structure can be used, consisting of a long first structural adhesive 31 and two short second structural adhesives 32. Taking a rectangular structure as an example, the two first structural adhesives 31 form the two long sides, and the two second structural adhesives 32 form the two short sides. The diagonal of the rectangle passes through the center of the touchpad module's pressing point. When the center of the touchpad module is pressed, the second structural adhesive 32 on one side will be subjected to pressing pressure. If the short sides of the rectangular structure are not reinforced, the rebound effect will be poor. By reinforcing the center of the short sides of the rectangular structure with adhesive, forming the second structural adhesive 32, the force transmission is improved, the touch travel is reduced, and the rebound ratio is effectively improved within the product specifications, significantly enhancing the touch feel.

[0037] In this embodiment, the reinforcing structural layer 3 is any one of polymethyl methacrylate, epoxy acrylate, or polyurethane. The above-mentioned adhesive has a higher degree of molecular cross-linking and can form a three-dimensional network structure after curing. It has a harder texture and an elastic modulus that is more than 10 times that of acrylic films. It has a stronger ability to resist compressive strain in the vertical direction and can effectively achieve the function of reinforcing the structural strength of the module.

[0038] In this embodiment, the dispensing area 41 includes the same number of first dispensing areas 411 as the first structural adhesive 31. The first structural adhesive 31 corresponds one-to-one with the first dispensing areas 411, and the first structural adhesive 31 is adhered to the first dispensing area 411. The first dispensing area 411 has a downwardly recessed structure, which is conducive to accommodating the first structural adhesive 31. When adhering the first structural adhesive 31, the first structural adhesive 31 is directly adhered to the first dispensing area 411. After the first structural adhesive 31 solidifies, it is flush with the upper surface of the sheet metal layer 4 and strengthens the structure of the sheet metal layer 4, thereby increasing the springback effect of the sheet metal layer 4.

[0039] In this embodiment, the dispensing area 41 also includes a second dispensing area 412, which is the same number as the second structural adhesive 32. The second structural adhesive 32 corresponds one-to-one with the second dispensing area 412, and the second structural adhesive 32 is adhered to the second dispensing area 412. The second dispensing area 412 has a downwardly recessed structure, which is conducive to accommodating the second structural adhesive 32. When the second structural adhesive 32 is adhered, it is directly adhered to the second dispensing area 412. After the second structural adhesive 32 solidifies, it is flush with the upper surface of the sheet metal layer 4 and strengthens the structure of the sheet metal layer 4, thereby increasing the springback effect of the sheet metal layer 4.

[0040] In this embodiment, the thickness of the sheet metal layer 4 is a, where a ≤ 0.5 mm. Sheet metal layers 4 with a thickness of less than 0.5 mm have sufficient strength and also have a suitable springback force.

[0041] In this embodiment, the sheet metal layer 4 is provided with a weight reduction groove area 42, the area of ​​the weight reduction groove area 42 is b, the overall area of ​​the sheet metal layer 4 is c, and 2b≥c; in order to further reduce the weight of the sheet metal layer 4, the sheet metal layer 4 can be designed for extreme weight reduction, and the area of ​​the weight reduction groove area 42 accounts for more than 50% of the total area of ​​the sheet metal layer 4, which can effectively reduce the touch travel, achieve better force transmission, effectively improve the rebound ratio within the product specifications, significantly improve the touch feel, and achieve a lightweight and thin product effect.

[0042] In this embodiment, the thickness of PCBA layer 1 is d, where d ≤ 0.8 mm. Using a thickness of less than 0.8 mm can minimize the overall thickness of the touchpad module, making the touchpad module thinner and lighter.

[0043] In this embodiment, the thickness of the adhesive backing layer 2 is e, where e ≤ 0.13 mm; the adhesive backing layer 2 is acrylic adhesive. Since the adhesive backing layer 2 covers the entire sheet metal layer 4, and since both the PCBA layer 1 and the sheet metal layer 3 are relatively thin, the thickness of the adhesive backing layer 2 is less than 0.13 mm to ensure a strong bond while ensuring a stable adhesion.

[0044] Please refer to Figure 4 This utility model also proposes a method for preparing a high-strength, thin and light touchpad module, which includes the following steps:

[0045] S1, a sheet metal layer 4 with a thickness of less than 0.5mm is used, and a reinforcing structure layer 3 is adhered to the adhesive application area 41 of the sheet metal layer 4, and the reinforcing structure layer 3 is any one of polymethyl methacrylate, epoxy acrylate, or polyurethane.

[0046] S2, the adhesive backing layer 2 is adhered to the upper surface of the sheet metal layer 4, and the reinforcing structure layer 3 is flush with the adhesive backing layer 2.

[0047] S3 uses a PCBA layer 1 with a thickness of less than 0.8mm to adhere to the sheet metal layer 4 through an adhesive layer 2 and a reinforcing structure layer 3.

[0048] In this embodiment, a sheet metal layer 4 with a thickness of less than 0.5 mm is used. A reinforcing structure layer 3 is adhered to the adhesive application area 41 of the sheet metal layer 4. The reinforcing structure layer 3 is any one of polymethyl methacrylate, epoxy acrylate, or polyurethane. An adhesive backing layer 2 is adhered to the upper surface of the sheet metal layer 4, and the reinforcing structure layer 3 is flush with the adhesive backing layer 2 to facilitate bonding of the PCBA layer 1 with a flat surface. A PCBA layer 1 with a thickness of less than 0.8 mm is adhered to the adhesive backing layer 2, so that the final touch panel assembly achieves an extremely lightweight product effect.

[0049] This utility model uses a combination of adhesive backing and dispensing to bond the PCBA layer 1 and the sheet metal layer 4. For large-area bonding, acrylic adhesive backing is used for stable adhesion. Specifically, the sheet metal layer 4 and PCBA layer 1 are bonded using acrylic adhesive backing. A dispensing area 41 is provided in the weaker area of ​​the sheet metal layer 4 during extreme thinning. The dispensing area 41 is used for bonding. After curing, the structural adhesive provides high-modulus structural strength compensation for sheet metal parts with large-area void designs; that is, the reinforcing structural layer 3 is bonded within the dispensing area 41. The dispensing area 41 is designed in the weaker area of ​​the sheet metal layer 4, eliminating the need for full-surface dispensing. Because the dispensing area 41 is small, uniform application of the liquid adhesive is easily achieved, ensuring consistent module height. The dispensing area 41 is concentrated in the weaker area of ​​the sheet metal layer 4, resulting in a shorter torque and a smaller stress-strain area after adhesive curing, effectively avoiding the risk of module warping after dispensing and curing.

[0050] In this embodiment, step S1 further includes:

[0051] S11, the reinforcing structural layer 3 is reinforced by forming a planar geometric structure with long side + long side or long side + short side.

[0052] In this embodiment, the planar geometric structure formed by long side + long side or long side + short side can be a rectangular structure. For example, the reinforcing structural layer 3 is provided with two first structural adhesives 31, which are the long sides of the rectangular structure, and the reinforcing structural layer 3 is provided with two second structural adhesives 32, which are the short sides of the rectangular structure. In this way, the bonding between the sheet metal layer 4 and the PCBA layer 1 can be structurally reinforced, and the pressing elasticity of the sheet metal layer 4 can be improved.

[0053] In summary, this high-strength, thin and light touchpad module can effectively reduce the thickness of the touchpad module while improving structural strength, thereby achieving a thinner and lighter touchpad module and avoiding warping and deformation.

[0054] Please refer to Figure 5 The strength data of each point of the module is tested by a displacement curve tester. Examples 1 / 2 / 3 are the high-strength solution products of PCBA + back adhesive + dispensing (reinforcing structural layer) + internal reinforcing sheet metal parts (sheet metal layer) described in this utility model. Comparative Examples 1 / 2 / 3 are ordinary modules of PCBA + back adhesive + internal reinforcing sheet metal parts (sheet metal layer) of the same thickness. Obviously, compared with the existing ordinary pressure-sensitive adhesive bonding modules, the strength of this utility model can be increased by more than 50%, the pressing stroke is significantly reduced, and the touch feel is significantly optimized.

[0055] Of course, there may be other implementations of this utility model. Based on this implementation, other implementations obtained by those skilled in the art without any creative effort are all within the scope of protection of this utility model.

Claims

1. A high-strength, lightweight touchpad module, characterized in that, The device includes a PCBA layer, an adhesive backing layer, a reinforcing structure layer, and a sheet metal layer. The bottom of the PCBA layer is adhered and fixedly connected to the sheet metal layer through the adhesive backing layer. The adhesive backing layer covers the sheet metal layer. The reinforcing structure layer is flush with the adhesive backing layer. The PCBA layer is fixedly connected to the sheet metal layer through the combined adhesive force of the adhesive backing layer and the reinforcing structure layer. The reinforcing structure layer forms a planar geometric structure to reinforce the sheet metal layer.

2. The high-strength, thin and light touchpad module according to claim 1, characterized in that, The sheet metal layer has an adhesive dispensing area, and the reinforcing structure layer forms a planar geometric structure that is adhered and fixedly connected to the adhesive dispensing area.

3. The high-strength, thin and light touchpad module according to claim 2, characterized in that, The reinforcing structural layer includes at least two first structural adhesives, which are symmetrically arranged along the center of the sheet metal layer and adhered and fixedly connected to the dispensing area.

4. The high-strength, thin and light touchpad module according to claim 3, characterized in that, The reinforcing structural layer further includes at least two second structural adhesives, which are symmetrically arranged along the center of the sheet metal layer and adhered and fixedly connected to the dispensing area. The at least two first structural adhesives and the at least two second structural adhesives together form a planar geometric structure.

5. The high-strength, thin and light touchpad module according to claim 1, characterized in that, The thickness of the sheet metal layer is a, where a ≤ 0.5 mm.

6. The high-strength, thin and light touchpad module according to claim 3, characterized in that, The dispensing area includes a first dispensing area with the same number of first structural adhesives, and the first structural adhesives correspond one-to-one with the first dispensing areas, with the first structural adhesives adhering to the first dispensing areas.

7. The high-strength, thin and light touchpad module according to claim 4, characterized in that, The dispensing area also includes a second dispensing area with the same number of the second structural adhesives. The second structural adhesives correspond one-to-one with the second dispensing areas, and the second structural adhesives adhere to the second dispensing areas.

8. The high-strength, thin and light touchpad module according to claim 1, characterized in that, The sheet metal layer has a weight-reducing groove area, the area of ​​the weight-reducing groove area is b, the total area of ​​the sheet metal layer is c, and 2b≥c.

9. The high-strength, thin and light touchpad module according to claim 1, characterized in that, The thickness of the PCBA layer is d, where d ≤ 0.8 mm.

10. The high-strength, thin and light touchpad module according to claim 1, characterized in that, The thickness of the adhesive backing layer is e, where e ≤ 0.13 mm.

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