SMT reflow soldering temperature compensation device

Abstract

The utility model belongs to reflow soldering equipment technical field, and disclose a kind of SMT reflow soldering temperature compensation device, including reflow soldering equipment, infrared sensor is provided in reflow soldering equipment inner wall, cleaning assembly is provided in the cleaning assembly of infrared sensor outside in reflow soldering equipment inner wall, wherein, the cleaning assembly includes fixed frame, and the fixed frame outside is connected with reflow soldering equipment inner wall.The utility model is provided with mounting plate and mounting column, starts drive motor, drives connecting plate and mounting column rotation, and then mounting column extrusion drives mounting plate to move, and mounting plate moves along slide groove, so that it is cleaned by clean cloth to the dust adsorbed on infrared sensor mirror surface, to facilitate operator to clean infrared sensor, so that it avoids affecting infrared sensor scattering infrared to cause inaccurate temperature detection, prevent from compensating the temperature in reflow soldering and lead to welding not standard.

Description

Technical Field

[0001] This utility model belongs to the technical field of reflow soldering equipment, specifically an SMT reflow soldering temperature compensation device. Background Technology

[0002] Reflow soldering is a process that provides a heated environment to melt the solder paste pre-printed on PCB pads, thereby reliably bonding surface mount components and PCB pads together through the solder paste alloy. Reflow soldering significantly shortens process preparation time, reduces experimental costs, improves soldering quality, and reduces soldering defects.

[0003] In existing technologies, SMT production processes typically include internal temperature compensation devices. These devices use top-mounted infrared sensors to detect the workpiece temperature. When the temperature is below standard, the internal heating mechanism is controlled to lower or raise the temperature to meet SMT production standards. However, prolonged use of infrared sensors to detect product temperature can lead to dust accumulation at the sensor tip. This dust absorbs and scatters infrared radiation, affecting the sensor's detection accuracy and causing inaccurate internal temperature control. Therefore, improvements are needed. Utility Model Content

[0004] To address the problems mentioned in the background section, this invention provides an SMT reflow soldering temperature compensation device.

[0005] To achieve the above objectives, this utility model provides the following technical solution: an SMT reflow soldering temperature compensation device, including a reflow soldering equipment, wherein an infrared sensor is provided on the inner wall of the reflow soldering equipment, and a cleaning component located outside the infrared sensor is provided on the inner wall of the reflow soldering equipment.

[0006] The cleaning component includes a fixed frame, the outer side of which is connected to the inner wall of the reflow soldering equipment. A sliding groove is provided inside the fixed frame, and a mounting plate is movably connected inside the sliding groove. A cleaning cloth is provided on the inner side of the mounting plate. A drive motor is provided on the outer side of the reflow soldering equipment, and the drive motor drives a connecting plate located in the inner cavity of the fixed frame. A mounting column located in the inner cavity of the mounting plate is provided on the outer side of the connecting plate.

[0007] Preferably, the reflow soldering equipment includes a welding frame, a transmission assembly is provided inside the welding frame, and an end cap is hinged to the top of the welding frame.

[0008] Preferably, the welding frame is provided with a heating mechanism and a cooling mechanism inside, and the end cap is provided with a handle on the outside.

[0009] Preferably, the outer side of the slide groove is L-shaped, and the two sides of the mounting plate are adapted to the size of the slide groove.

[0010] Preferably, clamping blocks are provided on both sides of the inner cavity of the mounting plate, and the outer side of the clamping blocks is movably connected to the cleaning cloth.

[0011] Preferably, the inner wall of the mounting plate is provided with a connecting rod, and the outer surface of the connecting rod is movably connected to the inner wall of the clamping block.

[0012] Preferably, there are two clamping blocks, and a spring is provided between the two clamping blocks.

[0013] Compared with the prior art, the beneficial effects of this utility model are as follows:

[0014] This utility model is equipped with a mounting plate and a mounting column. When the drive motor is started, the connecting plate and the mounting column are rotated. Then, the mounting column squeezes and moves the mounting plate, which moves along the slide groove. This allows the dust adsorbed on the surface of the infrared sensor to be cleaned by the cleaning cloth, making it easier for operators to clean the infrared sensor. This prevents the infrared sensor from scattering infrared light, which could lead to inaccurate temperature detection, and also prevents the inability to compensate for the temperature during reflow soldering, which could result in non-standard soldering. Attached Figure Description

[0015] Figure 1 This is a schematic diagram of the overall structure of this utility model;

[0016] Figure 2 This is a side sectional view of the present invention.

[0017] Figure 3 This is a schematic diagram of the cleaning component of this utility model;

[0018] Figure 4 This is a cross-sectional view of the fixing frame of this utility model;

[0019] Figure 5 This is a cross-sectional view of the mounting plate of this utility model.

[0020] In the diagram: 1. Reflow soldering equipment; 101. Welding frame; 102. Transmission assembly; 103. End cap; 2. Infrared sensor; 3. Cleaning assembly; 301. Fixing frame; 302. Slide rail; 303. Mounting plate; 304. Cleaning cloth; 305. Connecting rod; 306. Clamping block; 307. Spring; 308. Drive motor; 309. Connecting plate; 310. Mounting column. Detailed Implementation

[0021] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.

[0022] Example 1

[0023] like Figures 1 to 5 As shown, this is the first embodiment of the utility model, which provides an SMT reflow soldering temperature compensation device, including a reflow soldering equipment 1, an infrared sensor 2 disposed on the inner wall of the reflow soldering equipment 1, and a cleaning component 3 disposed on the inner wall of the reflow soldering equipment 1 outside the infrared sensor 2.

[0024] The cleaning component 3 includes a fixed frame 301, the outer side of which is connected to the inner wall of the reflow soldering equipment 1. A sliding groove 302 is provided inside the fixed frame 301, and a mounting plate 303 is movably connected inside the sliding groove 302. A cleaning cloth 304 is provided on the inner side of the mounting plate 303. A drive motor 308 is provided on the outer side of the reflow soldering equipment 1. The drive motor 308 drives and connects to a connecting plate 309 located in the inner cavity of the fixed frame 301. A mounting post 310 is provided on the outer side of the connecting plate 309 located in the inner cavity of the mounting plate 303.

[0025] By starting the drive motor 308, the connecting plate 309 and the mounting column 310 are rotated. The mounting column 310 then presses and moves the mounting plate 303 inside the slide groove 302. The slide groove 302 limits the mounting plate 303 to prevent it from shifting position. As the mounting plate 303 moves, the cleaning cloth 304 cleans the mirror surface of the infrared sensor 2, removing the dust adsorbed on the mirror surface. This prevents the dust from affecting the use of the infrared sensor 2, thus ensuring the accuracy of temperature detection.

[0026] Example 2

[0027] like Figure 2 and Figure 3 As shown, this embodiment includes the features of embodiment 1. The distinguishing technical feature is that the reflow soldering equipment 1 includes a welding frame 101, a transmission assembly 102 is provided inside the welding frame 101, and an end cap 103 is hinged to the top of the welding frame 101.

[0028] Infrared sensor 2 receives infrared radiation emitted by an object, converts it into an electrical signal, and then the signal processing circuit calculates the temperature of the object. The collected data is sent to the reflow soldering equipment 1 for processing and analysis to cool down and heat up the reflow soldering equipment 1.

[0029] The welding frame 101 is equipped with a heating mechanism and a cooling mechanism, and the end cap 103 is equipped with a handle on the outside.

[0030] During the reflow soldering process of the PCB board, the internal temperature is detected by infrared sensor 2 and compared with the preset temperature value. The calculated temperature difference is then used to send instructions to the heating or cooling mechanism. When the temperature is lower than the preset value, the control system increases the power of the heating mechanism to raise the temperature. When the temperature is higher than the preset value, the control system reduces the power of the heating mechanism or turns on the cooling mechanism to lower the temperature, thus compensating for the reflow soldering temperature. At the same time, the end cover 103 can be pulled by the handle to make it easy to observe the processing status inside the soldering frame 101 and make timely adjustments.

[0031] The outer side of the slide groove 302 is L-shaped, and the two sides of the mounting plate 303 are adapted to the size of the slide groove 302;

[0032] When the operator starts the drive motor 308, it drives the connecting plate 309 and the mounting column 310 to rotate. The mounting column 310 then squeezes and moves the mounting plate 303 as a whole towards the angle of the slide groove 302, so that the outer side of the mounting plate 303 is released from the limit of the slide groove 302. This makes it easier for the operator to remove the mounting plate 303 as a whole from the fixed frame 301, making it easier to clean or replace the cleaning cloth 304 and avoid the cleaning cloth 304 failing to achieve a good cleaning effect after long-term use.

[0033] Example 3

[0034] like Figure 5 As shown, this embodiment includes the features of embodiment 1. The distinguishing technical feature is that clamping blocks 306 are provided on both sides of the inner cavity of the mounting plate 303, and the outer side of the clamping blocks 306 is movably connected to the cleaning cloth 304.

[0035] The cleaning cloth 304 is pressed into the mounting plate 303 by the clamping blocks 306 to prevent it from falling off during use.

[0036] The inner wall of the mounting plate 303 is provided with a connecting rod 305, and the outer surface of the connecting rod 305 is movably connected to the inner wall of the clamping block 306.

[0037] The connecting rod 305 limits the clamping block 306 to prevent it from shifting position, thus making it easier for the operator to snap the cleaning cloth 304 between the clamping block 306 and the mounting plate 303.

[0038] There are two clamping blocks 306, and a spring 307 is provided between the two clamping blocks 306.

[0039] At this time, since the spring 307 is in a compressed state, it will apply outward pressure to the two clamping blocks 306, which will help to fix the cleaning cloth 304 between the clamping blocks 306 and the mounting plate 303. At the same time, when the operator removes the mounting plate 303 from the inside of the fixing frame 301, by pulling the two clamping blocks 306, the operator can easily remove the cleaning cloth 304 for replacement.

[0040] Working principle and usage process of this utility model:

[0041] First, when the operator is cleaning the infrared sensor 2, the drive motor 308 is started. The operation of the drive motor 308 causes the connecting plate 309 and the mounting post 310 to rotate. The mounting post 310 presses and moves the mounting plate 303 within the slide groove 302, thereby moving the cleaning cloth 304 on the mounting plate 303 to clean the lens of the infrared sensor 2, preventing dust from affecting the normal use of the infrared sensor 2 and preventing temperature detection errors. Simultaneously, when it is necessary to replace the cleaning cloth 304, it is done by... Open the end cap 103 with the handle, then start the drive motor 308 in reverse. The mounting plate 303 is moved by the mounting post 310 to the angle of the slide groove 302, and the slide groove 302 is released from the obstruction of the mounting plate 303. The mounting plate 303 is then removed from the inside of the fixing frame 301. Then pull the clamping block 306 to release the clamping block 306 from the squeezing of the cleaning cloth 304, so that the cleaning cloth 304 can be replaced easily and avoid affecting the cleaning effect of the cleaning cloth 304 on the infrared sensor 2.

[0042] It should be noted that, in this document, relational terms such as "first" and "second" are used only to distinguish one entity or operation from another, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Furthermore, the terms "comprising," "including," or any other variations thereof are intended to cover non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements includes not only those elements but also other elements not expressly listed, or elements inherent to such process, method, article, or apparatus.

[0043] Although embodiments of the present invention have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made to these embodiments without departing from the principles and spirit of the present invention, the scope of which is defined by the appended claims and their equivalents.

Claims

1. An SMT reflow soldering temperature compensation device, comprising a reflow soldering machine (1), characterized in that: An infrared sensor (2) is provided on the inner wall of the reflow soldering equipment (1), and a cleaning component (3) is provided on the inner wall of the reflow soldering equipment (1) outside the infrared sensor (2); The cleaning component (3) includes a fixed frame (301), the outer side of which is connected to the inner wall of the reflow soldering equipment (1). A sliding groove (302) is provided inside the fixed frame (301), and an installation plate (303) is movably connected inside the sliding groove (302). A cleaning cloth (304) is provided on the inner side of the installation plate (303). A drive motor (308) is provided on the outer side of the reflow soldering equipment (1). The drive motor (308) drives a connecting plate (309) located in the inner cavity of the fixed frame (301). An installation column (310) located in the inner cavity of the installation plate (303) is provided on the outer side of the connecting plate (309).

2. The SMT reflow soldering temperature compensation device according to claim 1, characterized in that: The reflow soldering equipment (1) includes a welding frame (101), a transmission assembly (102) is provided inside the welding frame (101), and an end cap (103) is hinged to the top of the welding frame (101).

3. The SMT reflow soldering temperature compensation device according to claim 2, characterized in that: The welding frame (101) is equipped with a heating mechanism and a cooling mechanism, respectively, and the end cap (103) is equipped with a handle on the outside.

4. The SMT reflow soldering temperature compensation device according to claim 1, characterized in that: The outer side of the slide groove (302) is L-shaped, and the two sides of the mounting plate (303) are adapted to the size of the slide groove (302).

5. The SMT reflow soldering temperature compensation device according to claim 1, characterized in that: Clamping blocks (306) are provided on both sides of the inner cavity of the mounting plate (303), and the outer side of the clamping blocks (306) is movably connected to the cleaning cloth (304).

6. The SMT reflow soldering temperature compensation device according to claim 5, characterized in that: The inner wall of the mounting plate (303) is provided with a connecting rod (305), and the outer surface of the connecting rod (305) is movably connected to the inner wall of the clamping block (306).

7. The SMT reflow soldering temperature compensation device according to claim 5, characterized in that: Two clamping blocks (306) are provided, and a spring (307) is provided between the two clamping blocks (306).

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