An integrated circuit (IC) chip

Abstract

The utility model relates to integrated circuit IC chip technical field, concretely is an integrated circuit IC chip, including body, pin and enclosure, the pin sets up on the body, the pin is equipped with several, several the pin evenly arranges in the body four quarters, the enclosure sets up the body bottom, the enclosure top with the body back fixed connection, the enclosure side is equipped with injection hole, injection hole is equipped with two, two injection hole diagonal sets up, the enclosure one side is equipped with observation window, the observation window embeds the enclosure, the utility model relates to an integrated circuit IC chip, solved the problem that the heat conduction medium is easy to overflow when filling the gap between the present chip and circuit board again.

Description

Technical Field

[0001] This utility model relates to the field of integrated circuit (IC) chip technology, specifically to an integrated circuit (IC) chip. Background Technology

[0002] As is well known, an integrated circuit (IC) chip is a miniature electronic device with specific circuit functions formed by integrating a large number of electronic components such as transistors, resistors, capacitors and wiring onto a small piece of semiconductor wafer (such as a silicon wafer) through semiconductor manufacturing processes.

[0003] When existing integrated circuit (IC) chips fill the gap between their bottom and the circuit board with thermally conductive medium, the lack of an effective boundary constraint structure often leads to the thermally conductive medium overflowing and contaminating the circuit board or the chip itself. This overflow phenomenon may not only cause short circuit risks on the circuit board, but also affect heat dissipation efficiency due to uneven distribution of the thermally conductive medium, which in turn leads to abnormally high chip operating temperature. In severe cases, it will affect the electrical performance and lifespan of the chip. Utility Model Content

[0004] (a) Technical problems to be solved

[0005] To address the shortcomings of existing technologies, this utility model provides an integrated circuit (IC) chip.

[0006] (II) Technical Solution

[0007] To achieve the above objectives, this utility model provides the following technical solution: an integrated circuit (IC) chip, comprising a body, pins, and a enclosure. The pins are disposed on the body, and a plurality of pins are evenly arranged around the body. The enclosure is disposed at the bottom of the body, and the top of the enclosure is fixedly connected to the back of the body. The enclosure has two injection holes on its side, which are diagonally arranged. An observation window is provided on one side of the enclosure and is embedded in the enclosure.

[0008] To improve the sealing effect, the present invention is improved by providing a sealing ring at the bottom of the enclosure, and a groove is provided at the bottom of the enclosure, with the sealing ring partially disposed in the groove and bonded to the groove.

[0009] To improve heat dissipation, the present invention is improved by providing heat dissipation grooves on the front side of the main body, and a plurality of heat dissipation grooves are provided.

[0010] To improve the strength of the observation window, this utility model is improved by using tempered glass as the observation window material.

[0011] To improve the effectiveness of use, the present invention is improved by using alumina ceramic material for the enclosure.

[0012] (III) Beneficial Effects

[0013] Compared with the prior art, the present invention provides an integrated circuit (IC) chip, which has the following beneficial effects:

[0014] This integrated circuit (IC) chip effectively solves the overflow problem when filling the gap between the chip and the circuit board with thermally conductive medium through a structured design. After the pins are soldered to the circuit board, the alumina ceramic enclosure at the bottom of the chip and the circuit board form a closed area. Combined with the bottom silicone rubber sealing ring, the gas leakage rate can be controlled to 1×10⁻⁶. -6 Pa·m 3 To prevent potting compound overflow, diagonally positioned injection holes enable vacuum potting with a fill rate exceeding 95%, avoiding air bubble residue. Loctite 352 UV adhesive seals the injection holes to ensure insulation. The enclosure uses alumina ceramic with a thermal expansion coefficient of 7.2ppm / ℃, providing excellent thermal compatibility with the silicon chip. Deformation difference under temperature cycling is <0.01mm, preventing potting compound cracking. The heat dissipation groove design on the front of the main body increases the heat dissipation area by 22%. Combined with the copper plating and bottom potting compound, the chip junction temperature is reduced by 8-12℃. The tempered glass viewing window has an impact resistance of 50J / cm². 2 This ensures visibility of the potting process. The overall solution has been verified through reliability testing. Its heat dissipation efficiency is 22% higher than that of traditional solutions, and it combines high sealing performance, heat dissipation, and process feasibility. Attached Figure Description

[0015] Figure 1 This is a schematic diagram of the structure of this utility model;

[0016] Figure 2 This is a schematic diagram of the axial structure of this utility model;

[0017] Figure 3 This utility model Figure 2 A magnified schematic diagram of the local structure at point A;

[0018] Figure 4 This utility model Figure 1 Top view;

[0019] In the diagram: 1. Body; 2. Pins; 3. Enclosure; 4. Sealing ring; 5. Injection hole; 6. Observation window; 7. Heat sink. Detailed Implementation

[0020] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.

[0021] Please see Figure 1-4 An integrated circuit (IC) chip includes a body 1, pins 2, and a enclosure 3. The pins 2 are disposed on the body 1, and a plurality of pins 2 are evenly arranged around the body 1. The enclosure 3 is disposed at the bottom of the body 1, and its top is fixedly connected to the back of the body 1. Two injection holes 5 are provided on the side of the enclosure 3, arranged diagonally. An observation window 6 is provided on one side of the enclosure 3 and is embedded therein.

[0022] In this embodiment, the main body 1 is precisely positioned to the preset pad area of ​​the circuit board, so that the pin 2 is aligned with the pad of the circuit board. The electrical connection and mechanical fixation of the pin 2 and the circuit board are completed by conventional soldering processes such as reflow soldering or wave soldering. After the soldering is completed, the lower end face of the enclosure 3 at the bottom of the main body 1 forms a surface contact seal with the surface of the circuit board. The gap between the two forms a closed potting cavity due to the ring constraint of the enclosure 3.

[0023] During the glue dispensing operation, the operator uses a vacuum injection syringe equipped with precise air pressure control to select one of the injection holes 5 set diagonally on the enclosure 3 as the glue inlet, and the other hole automatically serves as the exhaust channel. By adjusting the air pressure to 0.1-0.2MPa, the glue dispensing flow rate is controlled at 5-10μL / s. The principle of fluid dynamics is used to achieve a gap filling rate of more than 95% in the cavity, effectively avoiding air bubble residue.

[0024] The selected liquid thermally conductive potting compound must meet the rheological requirement of viscosity <1000 cP. After injection, it is cured at a constant temperature of 80℃ for 2 hours using a hot air circulation device, with a cured shrinkage rate of <0.5%, ensuring a gapless thermally conductive interface with the bottom surface of the chip and the surface of the circuit board. After potting, Loctite 352UV curing adhesive is used to seal the injection hole. Its insulation performance with a breakdown voltage >20kV / mm after curing avoids the risk of electrical short circuits. Tempered glass observation windows (0.5mm thick) embedded in the three side walls of the enclosure can monitor the potting liquid level and the status of air bubble discharge in real time. After potting, the temperature distribution on the chip surface is detected by a thermal infrared imager to ensure that the thermal resistance is ≤0.5℃·cm. 2 / W.

[0025] To improve sealing reliability, an annular groove is formed at the bottom of the enclosure 3 in this embodiment. A silicone rubber sealing ring 4 is embedded in the groove. The sealing ring 4 is made of high-temperature resistant silicone rubber with a Shore hardness of 60±5A (temperature resistance ≥200℃). Its cross-section is trapezoidal, with a design that is wider at the top and narrower at the bottom, which can generate radial expansion force under pressure. During installation, the upper half of the sealing ring 4 is embedded in the groove and fixed to the side wall of the groove by thermosetting adhesive (bonding strength ≥3MPa). The lower half extends 0.15mm beyond the bottom surface of the groove. When the enclosure 3 comes into contact with the circuit board, the sealing ring 4 is compressed and undergoes elastic deformation, forming a contact pressure of 0.2MPa. Combined with the flatness of the enclosure 3 (≤5μm), the gas leakage rate can be controlled to 1×10 -6 Pa·m 3 With a speed below [value missing], it effectively prevents potting compound overflow and external contaminant intrusion. This structure has been verified by a 1000-hour damp heat test at 85℃ / 85%RH, and the sealing ring 4 showed no signs of aging or cracking. The peel strength retention rate at the adhesive interface is over 95%.

[0026] To improve heat dissipation efficiency, this embodiment features several uniformly distributed heat dissipation slots 7 on the front side of the main body 1. The heat dissipation slots 7 adopt a rectangular structure with a depth of 0.3 mm, a width of 0.5 mm, and a spacing of 1.2 mm between adjacent slots. ANSYS thermal simulation verification shows that this design can increase the heat dissipation area of ​​the main body 1 by 22%. A 5 μm thick copper metal layer (thermal conductivity 401 W / m·K) is deposited on the surface of the slots using magnetron sputtering, forming an efficient heat conduction path. Combined with the three-dimensional structure of the heat dissipation slots 7, the heat flux density on the chip surface can be reduced from 2.8 W / mm². 2 Reduced to 2.1W / mm 2 When the chip is operating, natural convection can occur within the heat sink 7. Combined with the bottom heat dissipation path of the thermally conductive potting compound, dual-sided heat dissipation is achieved. Actual measurements show that the chip junction temperature can be reduced by 8-12℃, meeting the heat dissipation requirements under high-power conditions.

[0027] To enhance the structural strength and reliability of the observation window 6, this embodiment uses 0.5mm thick tempered glass as the observation window material. This tempered glass undergoes high-temperature quenching at 650℃, resulting in a surface compressive stress ≥90MPa and an impact strength of 50J / cm². 2 Compared to ordinary glass, this glass offers 3-5 times better performance, effectively resisting the 0.1-0.2MPa air pressure impact during the potting process and the thermal stress during subsequent temperature cycling tests. The observation window 6 uses an embedded installation method, with a 0.1mm buffer gap between the edge and the enclosure 3, filled with silicone sealant (Shore hardness 40A). This ensures both optical transparency (transmittance > 92%) and absorption of vibration stress. Tests conducted using a drop ball impact test (100g steel ball dropped freely from a height of 50cm) and a temperature cycling test from -40℃ to 125℃ verified that the observation window 6 showed no cracking or delamination, meeting the reliability requirements of industrial-grade chips.

[0028] To mitigate the difference in thermal expansion coefficients between the enclosure 3 and the chip, this embodiment selects alumina ceramic as the material for the enclosure 3. The thermal expansion coefficient of this alumina ceramic (Al2O3 content ≥96%) is 7.2ppm / ℃, which is relatively small compared to that of the silicon chip (thermal expansion coefficient 2.6ppm / ℃). This effectively reduces thermal stress during temperature cycling. Finite element analysis verifies that the enclosure 3 made of this material exhibits a thermal deformation of only 0.02mm within a temperature fluctuation range of -40℃ to 125℃, significantly lower than the 0.01mm thermal deformation of the silicon chip. The deformation difference between the two is controlled within 0.01mm, which avoids the problem of potting compound cracking caused by thermal expansion and contraction. In addition, alumina ceramic also has a thermal conductivity of 28W / m·K, which can help conduct heat from the bottom of the chip and further optimize the heat dissipation path.

[0029] Although embodiments of the present invention have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made to these embodiments without departing from the principles and spirit of the present invention, the scope of which is defined by the appended claims and their equivalents.

Claims

1. An integrated circuit (IC) chip, comprising a body (1), pins (2), and a enclosure (3), characterized in that: The pins (2) are disposed on the body (1), and there are several pins (2). The pins (2) are evenly arranged around the body (1). The enclosure (3) is disposed at the bottom of the body (1). The top of the enclosure (3) is fixedly connected to the back of the body (1). The side of the enclosure (3) is provided with injection holes (5). There are two injection holes (5). The two injection holes (5) are arranged diagonally. The side of the enclosure (3) is provided with an observation window (6). The observation window (6) is embedded in the enclosure (3).

2. The integrated circuit (IC) chip according to claim 1, characterized in that: The bottom of the enclosure (3) is provided with a sealing ring (4), and a groove is opened at the bottom of the enclosure (3). The sealing ring (4) is partially placed in the groove and partially bonded to the groove.

3. An integrated circuit (IC) chip according to claim 2, characterized in that: The main body (1) has a heat dissipation groove (7) on its front side, and there are several heat dissipation grooves (7).

4. An integrated circuit (IC) chip according to claim 3, characterized in that: The observation window (6) is made of tempered glass.

5. An integrated circuit (IC) chip according to claim 4, characterized in that: The enclosure (3) is made of alumina ceramic.

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