Industrial camera mainboard, industrial linear array cis camera and camera system

Abstract

The embodiment of the application provides an industrial camera mainboard, an industrial linear CIS camera and a camera system, and relates to the technical field of machine vision.The industrial camera mainboard comprises an I / O module, a high-speed data interface, a first processor, a second processor and a contact image sensor (CIS) sensor connection module.The first processor is connected with the I / O module and the CIS sensor connection module respectively.The second processor is connected with the first processor and the high-speed data interface respectively.The first processor and the second processor are included in one industrial camera mainboard.Compared with a single processor, various processing functions can be shared by the two processors, so that the computing power requirement of the single processor is reduced.In addition, the number of pins of the two processors is more, the total number of pins can be increased compared with the single processor, communication with more modules can be supported, and the communication pin requirement of the processor can be adapted.

Description

Technical Field

[0001] This application relates to the field of machine vision technology, and in particular to industrial camera motherboards, industrial linear CIS cameras, and camera systems. Background Technology

[0002] Industrial line-scan CIS (Contact Image Sensor) cameras are integrated image acquisition devices based on photoelectric conversion principles, offering advantages such as low cost, low power consumption, and small size. Industrial line-scan CIS cameras employ a line-scanning image capture method, enabling macro photography. In practical industrial applications, to meet the required capture area, multiple industrial line-scan CIS cameras are often cascaded together to form a cascaded camera system.

[0003] In existing industrial line scan CIS cameras, the processor on the mainboard must receive image data acquired by the sensor module, handle cascaded communication between different mainboards, receive and process I / O (Input / Output) signals from the host computer (e.g., exposure trigger signals), perform ISP (Image Signal Processor) processing on the image data, and send the processed image data to the host computer. This not only places high demands on the processor's computing power but also requires the processor to have a sufficient number of pins to accommodate the processor's communication pin requirements. Utility Model Content

[0004] The purpose of this application is to provide an industrial camera motherboard, an industrial line-scan CIS camera, and a camera system to solve at least one of the above-mentioned problems. The specific technical solution is as follows:

[0005] In a first aspect, embodiments of this application provide an industrial camera motherboard, comprising:

[0006] I / O module, high-speed data interface, first processor, second processor, CIS sensor connection module;

[0007] The first processor is connected to the I / O module and the CIS sensor connection module respectively;

[0008] The second processor is connected to the first processor and the high-speed data interface respectively.

[0009] In one possible implementation, the industrial camera motherboard further includes: a first processor cascade module and / or a second processor cascade module, wherein the first processor is also connected to the first processor cascade module, and the first processor cascade module is used to connect to the first processor cascade module of other industrial camera motherboards; the second processor is also connected to the second processor cascade module, and the second processor cascade module is used to connect to the second processor cascade module of other industrial camera motherboards.

[0010] In one possible implementation, the industrial camera motherboard further includes: an inter-board cascade connector; the I / O module includes: an I / O interface and a signal conversion circuit;

[0011] The I / O interface is connected to the signal conversion circuit, and the I / O interface is also connected to the inter-board cascading connector; the first processor is connected to the signal conversion circuit; the inter-board cascading connector is used to connect other industrial camera motherboards.

[0012] In one possible implementation, the inter-board cascade connector includes a first inter-board cascade connector and a second inter-board cascade connector, which are respectively connected to the I / O interface.

[0013] In one possible implementation, the industrial camera motherboard further includes a lamp board connection module, which is connected to the first processor.

[0014] In one possible implementation, the industrial camera motherboard further includes a DIP switch connected to the second processor.

[0015] Secondly, embodiments of this application provide an industrial linear array CIS camera, including a CIS sensor module and any of the industrial camera motherboards described in this application, wherein the CIS sensor module is connected to the CIS sensor connection module of the industrial camera motherboard.

[0016] In one possible implementation, the industrial linear array CIS camera includes multiple CIS sensor modules and multiple industrial camera motherboards. The industrial camera motherboards include inter-board cascading connectors, and the industrial camera motherboards are connected to each other through the inter-board cascading connectors. One of the industrial camera motherboards is connected to at least one of the CIS sensor modules through a CIS sensor connection module.

[0017] In one possible implementation, the inter-board cascade connector of the industrial camera motherboard includes a first inter-board cascade connector and a second inter-board cascade connector; the first inter-board cascade connector of the industrial camera motherboard is connected to the second inter-board cascade connector of its upstream industrial camera motherboard, and the second inter-board cascade connector of the industrial camera motherboard is connected to the first inter-board cascade connector of its downstream industrial camera motherboard.

[0018] In one possible implementation, the industrial camera motherboard includes a DIP switch and a lamp board connection module. The industrial camera motherboard with the DIP switch in the first position is the main industrial camera motherboard. The I / O interface in the main industrial camera motherboard is used to connect to a host computer, and the lamp board connection module in the main industrial camera motherboard is used to connect to a lamp board array.

[0019] Thirdly, embodiments of this application provide a camera system, including a light panel array and any of the industrial line array CIS cameras described in this application. The industrial camera mainboard of the industrial line array CIS camera includes a light panel connection module, and the light panel connection module of the industrial line array CIS camera is connected to the light panel array.

[0020] The industrial camera motherboard, industrial linear scan CIS camera, and camera system provided in this application embodiment include two processors: a first processor and a second processor. In this case, compared to a single processor, various processing functions can be distributed among the two processors, thereby reducing the computing power requirements of a single processor. Furthermore, the two processors have a greater number of pins, increasing the total number of pins compared to a single processor, supporting communication with more modules, and adapting to the communication pin requirements of the processors. Of course, implementing any product of this application does not necessarily require achieving all of the advantages described above simultaneously. Attached Figure Description

[0021] To more clearly illustrate the technical solutions in the embodiments of this application or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings.

[0022] Figure 1 This is a first schematic diagram of an industrial camera motherboard according to an embodiment of this application;

[0023] Figure 2 This is a second schematic diagram of an industrial camera motherboard according to an embodiment of this application;

[0024] Figure 3 This is a third schematic diagram of an industrial camera motherboard according to an embodiment of this application;

[0025] Figure 4 This is a fourth schematic diagram of an industrial camera motherboard according to an embodiment of this application;

[0026] Figure 5 This is a first schematic diagram of the connection of the industrial camera motherboard in the embodiments of this application;

[0027] Figure 6 This is a fifth schematic diagram of an industrial camera motherboard according to an embodiment of this application;

[0028] Figure 7 This is a second schematic diagram illustrating the connection of the industrial camera motherboard in an embodiment of this application;

[0029] Figure 8 This is a sixth schematic diagram of an industrial camera motherboard according to an embodiment of this application;

[0030] Figure 9 This is a seventh schematic diagram of an industrial camera motherboard according to an embodiment of this application;

[0031] Figure 10 This is a first schematic diagram of an industrial linear CIS camera according to an embodiment of this application;

[0032] Figure 11 This is a second schematic diagram of an industrial linear CIS camera according to an embodiment of this application;

[0033] Figure 12 This is a third schematic diagram of an industrial linear CIS camera according to an embodiment of this application.

[0034] Figure 13a This is a schematic diagram of an industrial linear array CIS camera receiving differential signals in an embodiment of this application;

[0035] Figure 13b This is a schematic diagram of an industrial linear CIS camera receiving a single-ended signal in an embodiment of this application;

[0036] Figure 14 This is a fourth schematic diagram of an industrial linear CIS camera according to an embodiment of this application;

[0037] Figure 15 This is a schematic diagram of a camera system according to an embodiment of this application.

[0038] Explanation of reference numerals in the attached figures:

[0039] Industrial Linear Array CIS Camera-1, Industrial Camera Mainboard-10, First Processor-101, Second Processor-102, I / O Module-103, I / O Interface-1031, Signal Conversion Circuit-1032, Inter-Board Cascading Connector-104, First Inter-Board Cascading Connector-1041, Second Inter-Board Cascading Connector-1042, CIS Sensor Connection Module-105, High-Speed ​​Data Interface-106, Lamp Board Connection Module-107, DIP Switch-108, First Processor Cascading Module-109, Second Processor Cascading Module-110; CIS Sensor Module-20; Top Cover-30; Fan-40; Baffle-50;

[0040] Lamp panel array-2. Detailed Implementation

[0041] The technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this application, and not all embodiments. Based on the embodiments of this application, all other embodiments obtained by those skilled in the art based on this application are within the scope of protection of this application.

[0042] Existing industrial line scan CIS cameras all use a single processor, which not only requires high computing power from the processor, but also requires the processor to have a sufficient number of pins to meet the processor's communication pin requirements.

[0043] To reduce the computing power requirements of the processor in industrial line-scan CIS cameras and to meet the communication pin requirements of the processor in industrial line-scan CIS cameras, embodiments of this application provide an industrial camera motherboard, an industrial line-scan CIS camera, and a camera system, which are described in detail below:

[0044] In a first aspect, embodiments of this application provide an industrial camera motherboard 10, see [link to relevant documentation]. Figure 1 ,include:

[0045] The system comprises a first processor 101, a second processor 102, an I / O module 103, a CIS sensor connection module 105, and a high-speed data interface 106; the first processor 101 is connected to the I / O module 103 and the CIS sensor connection module 105 respectively; the second processor 102 is connected to the first processor 101 and the high-speed data interface 106 respectively.

[0046] I / O module 103 is used to connect to the host computer and receive I / O signals from the host computer, such as exposure trigger signals. CIS sensor connection module 105 is used to connect to the CIS sensor module. The industrial camera motherboard 10 in this embodiment supports CIS sensor modules of various specifications. The preset specifications of the CIS sensor modules can be set according to actual detection needs. Through the cascading of industrial camera motherboards 10, the scanning range of the preset specifications can be used as the minimum splicing unit to achieve adaptation to any CIS sensor module with an integer multiple of the preset specifications in length, which can reduce the motherboard development cost for CIS sensor modules of different lengths. CIS sensor connection module 105 supports the transmission of single-ended signals, LVDS (Low Voltage Differential Signaling) signals, and power supply signals. The industrial camera motherboard 10 can configure the CIS sensor module through single-ended signals and power the CIS sensor module through power supply signals. In addition, the industrial camera motherboard 10 can also receive LVDS signals (image signals acquired by the CIS sensor module) from the CIS sensor module.

[0047] The high-speed data interface 106 is used to connect to external devices such as a host computer. The high-speed data interface 106 can be an optical module, including an SFP (Small Form Pluggable) and an optical port. In one example, the high-speed data interface 106 can include two SFPs and optical ports, supporting a maximum transmission bandwidth of 20Gbps. For a 600mm CIS sensor module, the required output bandwidth is 14688 (dot) × 10 (bit / dot) × 98.4 (kHz) = 14.45Gbps. The design of two SFPs and optical ports can support the data output of a 600mm CIS sensor module. The communication protocol used by the high-speed data interface 106 can be customized according to actual needs. In one example, the high-speed data interface 106 can use the XoFLink protocol to communicate with the outside world. Besides optical modules, the high-speed data interface 106 can also be a network port or a CXP (CoaXPress, an asymmetric high-speed point-to-point serial communication digital interface standard), all of which are within the scope of this application.

[0048] The first processor 101 interacts with the host computer via I / O module 103 using I / O signals. The first processor 101 also interacts with the CIS sensor module via CIS sensor connection module 105, including triggering the CIS sensor module to perform exposure and acquiring image signals collected by the CIS sensor module. The first processor 101 is also used to transmit the image signals to the second processor 102. The second processor 102 performs ISP processing on the image signals and sends the processed image signals to the host computer via high-speed data interface 106.

[0049] In this embodiment, the industrial camera motherboard 10 includes two processors: a first processor 101 and a second processor 102. Compared to a single processor, various processing functions can be distributed among the two processors, thereby reducing the computing power requirements of a single processor. Furthermore, the two processors have a greater number of pins, increasing the total number of pins compared to a single processor, supporting communication with more modules, and adapting to the communication pin requirements of the processors.

[0050] Inter-board communication is required between the processors of different industrial camera motherboards 10. In one possible implementation, the first processors 101 of different industrial camera motherboards 10 can be connected for communication via a first processor cascade module 109, for example... Figure 2 As shown, the industrial camera motherboard 10 further includes a first processor cascade module 109. The first processor 101 is also connected to the first processor cascade module 109, which is used to connect to the first processor cascade module 109 of other industrial camera motherboards. In this embodiment, the first processors 101 of different industrial camera motherboards 10 are connected through the first processor cascade module 109, enabling communication between different industrial camera motherboards 10. The communication protocol used by the first processor cascade module 109 can be customized according to actual conditions. In one example, the first processor cascade module 109 can use the SPI (Serial Peripheral Interface) protocol for communication.

[0051] In one possible implementation, different industrial camera motherboards 10 can communicate with each other via a first processor cascade module, for example... Figure 3 As shown, the industrial camera motherboard 10 also includes a second processor cascade module 110. The second processor 102 is also connected to the second processor cascade module 110, which is used to connect to the second processor cascade module 110 of other industrial camera motherboards. In this embodiment, the second processors 102 of different industrial camera motherboards 10 are connected through the second processor cascade module 110, enabling communication between different industrial camera motherboards 10. The communication protocol used by the second processor cascade module 110 can be customized according to actual conditions. In one example, the second processor cascade module 110 can use the SPI protocol for communication.

[0052] In one possible implementation, the industrial camera motherboard 10 may also include a first processor cascade module 109 and a second processor cascade module 110 to realize the separate cascading of the first processor 101 and the second processor 102, thereby meeting various communication requirements.

[0053] In related technologies, for cascading scenarios of multiple industrial camera motherboards, the host computer sends the exposure trigger signal to the I / O module of the main industrial camera motherboard. The processor of the main industrial camera motherboard receives the exposure trigger signal through the I / O module and then sends it sequentially to the processors of each of the cascaded slave industrial camera motherboards. In this method, there is a certain delay in the exposure trigger signal received by each slave industrial camera motherboard, especially for the last slave motherboard to receive the signal, where the exposure time interval between it and the main industrial camera motherboard is relatively long. This difference in exposure time leads to discrepancies in the image data acquisition timing of each industrial camera motherboard, resulting in image distortion in the final stitched image.

[0054] To reduce image distortion issues, in one possible implementation, see [link to relevant documentation]. Figure 4 The industrial camera motherboard 10 further includes: an inter-board cascade connector 104; the I / O module 103 includes: an I / O interface 1031 and a signal conversion circuit 1032;

[0055] The I / O interface 1031 is connected to the signal conversion circuit 1032, and the I / O interface 1031 is also connected to the inter-board cascading connector 104; the first processor 101 is connected to the signal conversion circuit 1032; the inter-board cascading connector 104 is used to connect other industrial camera motherboards to the inter-board cascading connector 104.

[0056] The inter-board cascading interconnect 104 is used to connect other industrial camera motherboards, that is, industrial camera motherboards are spliced ​​together through the inter-board cascading interconnect 104. In one example, taking four industrial camera motherboards 10, their connection can be as follows: Figure 5 As shown, it can be seen that the I / O signal received by the I / O interface 1031 of one industrial camera motherboard 10 can be received by the I / O interfaces 1031 of the other three industrial camera motherboards 10 at the same time.

[0057] In this embodiment, the exposure trigger signal received by the I / O interface 1031 of one industrial camera motherboard 10 can be transmitted to the I / O interfaces 1031 of other industrial camera motherboards 10 via the inter-board cascade connector 104. This is equivalent to each industrial camera motherboard 10's I / O interface 1031 receiving the exposure trigger signal simultaneously. Compared to the prior art where the processor of the main industrial camera motherboard sends the exposure trigger signal to each processor of the slave industrial camera motherboard one by one, this reduces the time difference in the reception of the exposure trigger signal by the processors of each industrial camera motherboard, thereby reducing the difference in exposure time and alleviating the problem of image distortion.

[0058] Apart from Figure 5 In addition to the connection method shown, cascading between industrial camera motherboards 10 can also be achieved through bidirectional connection. In one possible implementation, see... Figure 6 The inter-board cascading connector 104 includes a first inter-board cascading connector 1041 and a second inter-board cascading connector 1042, which are respectively connected to the I / O interface 1031. Taking four industrial camera motherboards 10 as an example, their cascading configuration can be as follows: Figure 7 As shown, for an industrial camera motherboard 10, the first inter-board cascading connector 1041 of the industrial camera motherboard 10 is connected to the second inter-board cascading connector 1042 of its upstream industrial camera motherboard 10; the second inter-board cascading connector 1042 of the industrial camera motherboard 10 is connected to the first inter-board cascading connector 1041 of its downstream industrial camera motherboard 10. The board-to-board cascading cabling and bidirectional connection structure facilitate wiring design and can support the cascading of any number of industrial camera motherboards 10.

[0059] In one possible implementation, see Figure 8 The industrial camera motherboard 10 further includes a light board connection module 107, which is connected to the first processor 101. The light board connection module 107 is used to connect a light board array, and the first processor 101 can control the light board array through the light board connection module 107 to meet the lighting requirements during shooting.

[0060] For multiple cascaded industrial camera motherboards 10, the I / O interfaces 1031 of each industrial camera motherboard 10 are essentially connected in parallel, allowing them to simultaneously receive I / O signals from the host computer. However, when an industrial camera motherboard 10 sends a message to the host computer through its I / O interface 1031, if multiple industrial camera motherboards 10 send I / O signals simultaneously, it will lead to transmission errors. Therefore, for multiple cascaded industrial camera motherboards 10, it is necessary to distinguish between the master industrial camera motherboard and the slave industrial camera motherboards. The master industrial camera motherboard controls the sending of I / O signals to the host computer. In one possible implementation, see [link to implementation details]. Figure 9 The industrial camera motherboard 10 further includes a DIP switch 108, which is connected to the second processor 102. The DIP switch 108 has multiple positions. To facilitate differentiation between the various industrial camera motherboards 10, the positions of the DIP switches 108 on each cascaded industrial camera motherboard 10 are different. The DIP switch 108 on the master industrial camera motherboard is in the first position, and the DIP switch 108 on each slave industrial camera motherboard is in a separate position and not in the first position. Therefore, different industrial camera motherboards 10 can be distinguished based on the positions of the DIP switches 108. When the second processor 102 detects that its connected DIP switch 108 is in the first position, the second processor 102 determines that its connected industrial camera motherboard is the master industrial camera motherboard. When the second processor 102 detects that its connected DIP switch 108 is not in the first position, the second processor 102 determines that its connected industrial camera motherboard is a slave industrial camera motherboard.

[0061] The main industrial camera motherboard is responsible for controlling the transmission of I / O signals to the host computer. A DIP switch 108 distinguishes between the main and slave industrial camera motherboards. The main industrial camera motherboard has both lamp control signals and output signals. When it receives an exposure trigger signal, the main industrial camera motherboard simultaneously controls the lamp array to illuminate via the lamp board connection module 107, ensuring synchronization between the exposure time of all CIS sensor modules and the lamp array illumination time. When the main industrial camera motherboard performs I / O output, it sets all external I / O ports of the slave industrial camera motherboards to input mode, allowing only the main industrial camera motherboard to perform I / O output. This avoids transmission errors caused by multiple industrial camera motherboards simultaneously sending I / O signals.

[0062] like Figure 9 As shown, the first processor 101 is connected to the second processor 102, the signal conversion circuit 1032, the CIS sensor connection module 105, and the lamp board connection module 107, respectively; the second processor 102 is connected to the high-speed data interface 106 and the DIP switch 108, respectively. The first processor 101 is mainly responsible for the drive control of the CIS sensor module, the drive control of the lamp board array, and the transmission of image signals; the second processor 102 is mainly responsible for ISP processing and image signal transmission, and is also responsible for the identification of the master and slave industrial camera motherboards. Compared with a single processor, the advantage of using a dual processor is that it can expand logic resources, solve the problems of insufficient pin count and insufficient logic resources of a single processor, and at the same time, it can achieve real-time transmission of image signals.

[0063] Secondly, this application provides an industrial linear scan CIS camera, see [link to relevant documentation]. Figure 10This includes a CIS sensor module 20 and any of the industrial camera motherboards 10 described in this application. The CIS sensor module 20 is connected to the CIS sensor connection module 105 of the industrial camera motherboard 10. The CIS sensor module 20 is used for acquiring image signals. Besides the industrial camera motherboard 10 and the CIS sensor module 20, other components include... Figure 11 As shown, the industrial camera in this embodiment may also include a top cover 30, a fan 40, and a baffle 50.

[0064] To accommodate the needs of large-area shooting, see Figure 12 An industrial linear array CIS camera may include multiple CIS sensor modules 20 and multiple industrial camera motherboards 10. Figure 12 This example uses three industrial camera motherboards 10 and three CIS sensor modules 20 (the specific number can be customized according to actual needs). Each industrial camera motherboard 10 is connected to at least one CIS sensor module 20 through a CIS sensor connection module 105. The inter-board cascade connector 104 supports differential and single-ended signal communication. Each industrial camera motherboard 10 has a signal conversion circuit 1032 with the same structure, which can convert I / O signals (differential or single-ended signals) into single-ended signals of the same frequency and logic processor level and provide them to the first processor 101. This allows external signals to be simultaneously provided to the first processor 101 of all cascaded industrial camera motherboards 10.

[0065] In one example, the I / O interface 1031 and the signal conversion circuit 1032, as well as the I / O interface 1031 and the inter-board cascade connector 104, can be connected via differential signal traces. Figure 12 In the diagram, the P-trace represents the positive terminal of the differential signal trace, and the N-trace represents the negative terminal. When using differential signal traces, the transmission rate is faster, reaching up to 10Mbps, resulting in faster I / O signal transmission. Furthermore, since the I / O signals are transmitted differentially, this design allows for threshold comparison between the P-trace and N-trace at the end of the differential signal; a comparison threshold of 200mV or higher is sufficient to detect the exposure trigger signal. The I / O interface 1031 can simultaneously support both differential and single-ended signals. When a differential signal is received, for example… Figure 13a As shown, a signal can be detected when the P-line voltage minus the N-line voltage is greater than 200mV, thereby generating a level flip and sending it to the first processor 101. When a single-ended signal is received, for example... Figure 13b As shown, there is a clamping voltage at the N terminal for comparison. When the P line voltage minus the clamping voltage is greater than 200mV, the signal can be detected, thereby generating a level flip and sending it to the first processor 101.

[0066] In one possible implementation, see Figure 14The inter-board cascading connector 104 of the industrial camera motherboard 10 includes a first inter-board cascading connector 1041 and a second inter-board cascading connector 1042. The first inter-board cascading connector 1041 of the industrial camera motherboard 10 is connected to the second inter-board cascading connector 1042 of its upstream industrial camera motherboard 10, and the second inter-board cascading connector 1042 of its downstream industrial camera motherboard 10 is connected to the first inter-board cascading connector 1041 of its downstream industrial camera motherboard 10. In one example, the first inter-board cascading connector 1041 of the first industrial camera motherboard 10 can be left unconnected because it has no upstream industrial camera motherboard 10; similarly, the second inter-board cascading connector 1042 of the last industrial camera motherboard 10 can be left unconnected because it has no downstream industrial camera motherboard 10. In another example, the first inter-board cascading connector 1041 of the first industrial camera motherboard can be connected to the second inter-board cascading connector 1042 of the last industrial camera motherboard 10 to form a ring connection, thereby improving the availability of the circuit. The number of industrial camera motherboards 10 in each industrial linear array CIS camera can be set according to actual conditions. Figure 14 The example only uses three industrial camera motherboards 10, and is not intended to limit the number of industrial camera motherboards 10.

[0067] In a scenario where an industrial line-scan CIS camera comprises multiple industrial camera motherboards 10, in one possible implementation, each industrial camera motherboard 10 includes a DIP switch 108 and a lamp board connection module 107. The industrial camera motherboard 10 with the DIP switch 108 in its first position is the master industrial camera motherboard, while the industrial camera motherboard 10 with the DIP switch 108 not in its first position is a slave industrial camera motherboard. The I / O interface 1031 in the master industrial camera motherboard is used to connect to a host computer, and the lamp board connection module 107 in the master industrial camera motherboard is used to connect to a lamp board array. The number of industrial camera motherboards 10 in each industrial line-scan CIS camera can be set according to actual needs.

[0068] The DIP switch 108 has multiple positions. When the second processor 102 detects that the DIP switch 108 connected to it is in the first position, the second processor 102 determines that the industrial camera motherboard it is connected to is the master industrial camera motherboard. When the second processor 102 detects that the DIP switch 108 connected to it is not in the first position, the second processor 102 determines that the industrial camera motherboard it is connected to is the slave industrial camera motherboard. The master industrial camera motherboard has lamp control signals and output signals. When it receives an exposure trigger signal, the first processor 101 of the master industrial camera motherboard controls the lamp board array to light up through the lamp board connection module 107, and controls the exposure of the CIS sensor module through the CIS sensor connection module 105. When the slave industrial camera motherboard and the master industrial camera motherboard receive exposure trigger signals at the same time, the first processor 101 of the slave industrial camera motherboard simultaneously controls the exposure of the CIS sensor module through the CIS sensor connection module 105. This allows the exposure time of the CIS sensor module in all areas to be synchronized with the lighting time of the lamp board array. When the main industrial camera motherboard performs I / O output, the second processor 102 of the main industrial camera motherboard communicates with the second processor 102 of the slave industrial camera motherboard. The second processor 102 of the slave industrial camera motherboard controls the first processor 101 of the slave industrial camera motherboard, thereby setting the external I / O of each slave industrial camera motherboard to the input state, and only the main industrial camera motherboard performs I / O output; thus avoiding the situation of transmission errors caused by multiple industrial camera motherboards sending I / O signals at the same time.

[0069] In a scenario where an industrial linear scan CIS camera comprises multiple industrial camera motherboards 10, in one possible implementation, each industrial camera motherboard 10 includes a first processor cascade module 109 and / or a second processor cascade module 110. The industrial camera motherboards 10 can communicate with each other via the second processor cascade module 110 (either between second processors 102) or between first processors 101 via the first processor cascade module 109. Alternatively, the second processors 102 and the first processors 101 can communicate with each other via the second processor cascade module 110 and the first processor cascade module 109, respectively. This enables communication between the processors of the industrial camera motherboards 10, facilitating control of the slave industrial camera motherboards by the master industrial camera motherboard.

[0070] Thirdly, embodiments of this application provide a camera system, see [link to relevant documentation]. Figure 15 The system includes a light panel array 2 and an industrial line array CIS camera 1 as described in this application. The industrial camera mainboard 10 of the industrial line array CIS camera 1 includes a light panel connection module 107, which is connected to the light panel array 2. Figure 15This example uses a single industrial line-scan CIS camera, comprising two industrial camera mainboards 10, and is not intended to limit the number of industrial camera mainboards 10 in an industrial line-scan CIS camera. The main industrial camera mainboard in the industrial line-scan CIS camera 1 controls the illumination of the lamp array 2. Upon receiving an exposure trigger signal, the first processor 101 of the main industrial camera mainboard simultaneously controls the CIS sensor module 20 to perform exposure and the illumination of the lamp array 2. The number of lamp arrays 2 can be multiple (…). Figure 15 (This example only uses two light panel arrays 2 and is not intended to limit the number of light panel arrays 2.) The light panel arrays 2 are cascaded, and each light panel array 2 can be lit simultaneously under the control of the main industrial camera motherboard.

[0071] To meet the need for shooting larger areas, in one possible implementation, the camera system includes multiple industrial line-scan CIS cameras 1. The shooting area can be expanded by splicing the industrial line-scan CIS cameras 1 together. Splicing the industrial line-scan CIS cameras 1 involves connecting their industrial camera motherboards 10. The connection method of the industrial camera motherboards 10 can be found in the above embodiments and will not be repeated here. When multiple industrial line-scan CIS cameras 1 are spliced ​​together, only one industrial camera motherboard 10 is the master industrial camera motherboard, and the remaining industrial camera motherboards are slave industrial camera motherboards.

[0072] It should be noted that, in this document, relational terms such as "first" and "second" are used only to distinguish one entity or operation from another, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Furthermore, the terms "comprising," "including," or any other variations thereof are intended to cover non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements includes not only those elements but also other elements not expressly listed, or elements inherent to such a process, method, article, or apparatus. Without further limitations, an element defined by the phrase "comprising one..." does not exclude the presence of other identical elements in the process, method, article, or apparatus that includes said element.

[0073] The various embodiments in this specification are described in a related manner. Each embodiment focuses on the differences from other embodiments, and the same or similar parts between the various embodiments can be referred to each other.

[0074] The above description is merely a preferred embodiment of this application and is not intended to limit the scope of protection of this application. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of this application are included within the scope of protection of this application.

Claims

1. An industrial camera motherboard, characterized in that, include: I / O module, high-speed data interface, first processor, second processor, contact image sensor (CIS) sensor connection module; The first processor is connected to the I / O module and the CIS sensor connection module respectively; The second processor is connected to the first processor and the high-speed data interface respectively.

2. The industrial camera motherboard according to claim 1, characterized in that, The industrial camera motherboard further includes: a first processor cascade module and / or a second processor cascade module, wherein the first processor is also connected to the first processor cascade module, and the first processor cascade module is used to connect to the first processor cascade module of other industrial camera motherboards; the second processor is also connected to the second processor cascade module, and the second processor cascade module is used to connect to the second processor cascade module of other industrial camera motherboards.

3. The industrial camera motherboard according to claim 1 or 2, characterized in that, The industrial camera motherboard also includes: an inter-board cascade connector; the I / O module includes: an I / O interface and a signal conversion circuit. The I / O interface is connected to the signal conversion circuit, and the I / O interface is also connected to the inter-board cascading connector; the first processor is connected to the signal conversion circuit; the inter-board cascading connector is used to connect other industrial camera motherboards.

4. The industrial camera motherboard according to claim 3, characterized in that, The inter-board cascade connector includes a first inter-board cascade connector and a second inter-board cascade connector, which are respectively connected to the I / O interface.

5. The industrial camera motherboard according to claim 1, characterized in that, The industrial camera motherboard also includes a lamp board connection module, which is connected to the first processor.

6. The industrial camera motherboard according to claim 1, characterized in that, The industrial camera motherboard also includes a DIP switch, which is connected to the second processor.

7. An industrial linear array CIS camera, characterized in that, It includes a CIS sensor module and an industrial camera motherboard as described in any one of claims 1-6, wherein the CIS sensor module is connected to the CIS sensor connection module of the industrial camera motherboard.

8. The industrial linear array CIS camera according to claim 7, characterized in that, The industrial linear array CIS camera includes multiple CIS sensor modules and multiple industrial camera motherboards. The industrial camera motherboards include inter-board cascading connectors, and the industrial camera motherboards are connected to each other through the inter-board cascading connectors. Each industrial camera motherboard is connected to at least one of the CIS sensor modules through a CIS sensor connection module.

9. The industrial linear array CIS camera according to claim 8, characterized in that, The inter-board cascading connector of the industrial camera motherboard includes a first inter-board cascading connector and a second inter-board cascading connector; the first inter-board cascading connector of the industrial camera motherboard is connected to the second inter-board cascading connector of its upstream industrial camera motherboard, and the second inter-board cascading connector of the industrial camera motherboard is connected to the first inter-board cascading connector of its downstream industrial camera motherboard.

10. The industrial linear array CIS camera according to claim 8, characterized in that, The industrial camera motherboard includes a DIP switch and a lamp board connection module. The industrial camera motherboard with the DIP switch in the first position is the main industrial camera motherboard. The I / O interface in the main industrial camera motherboard is used to connect to a host computer. The lamp board connection module in the main industrial camera motherboard is used to connect to a lamp board array.

11. A camera system, characterized in that, The system includes a light panel array and an industrial line array CIS camera as described in any one of claims 7-10. The industrial camera mainboard of the industrial line array CIS camera includes a light panel connection module, and the light panel connection module of the industrial line array CIS camera is connected to the light panel array.

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