Semiconductor mobile phone back clamping heat spreader (TX26)
CN309795112SActive Publication Date: 2026-02-13王思宁
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Patent Information
- Application Number
- CN202530407300.0
- Authority / Receiving Office
- CN · China
- Patent Type
- Designs(China)
- Current Assignee / Owner
- Filing Date
- 2025-07-11
- Publication Date
- 2026-02-13
- Estimated Expiration
- 2040-07-11
Smart Images
Figure 000002_ABST
Abstract
1. Name of the design product: Semiconductor mobile phone back clip heat sink (TX26). 2. Use of the design product: For mobile phone heat dissipation. 3. Design points of the design product: In shape. 4. Picture or photo best indicating the design points: Perspective view 1.
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