Semiconductor heat sink (JS88B)

CN309803392SActive Publication Date: 2026-02-17DONGGUAN ZHIWANPAI TECHNOLOGY CO LTD
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Patent Information

Application Number
CN202530463620.8
Authority / Receiving Office
CN · China
Patent Type
Designs(China)
Current Assignee / Owner
Filing Date
2025-08-06
Publication Date
2026-02-17
Estimated Expiration
2040-08-06

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Abstract

1. Name of the designed product: semiconductor heat sink (JS88B). 2. Use of the designed product: for mobile phone heat dissipation. 3. Design points of the designed product: in shape. 4. Picture or photo that best shows the design points: perspective view.
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