Thermal conductive medium automatic recovery device (TCU)
CN309970200SActive Publication Date: 2026-05-08SHANGHAI BOYAN THERMOSTATIC EQUIPMENT CO LTD
View PDF 0 Cites 0 Cited by
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Designs(China)
- Current Assignee / Owner
- SHANGHAI BOYAN THERMOSTATIC EQUIPMENT CO LTD
- Filing Date
- 2025-09-05
- Publication Date
- 2026-05-08
Smart Images
Figure 000006_ABST
Abstract
1. The name of the design product: heat conduction medium automatic recycling device (TCU). 2. The use of the design product: for precise temperature control, intelligent management and resource recycling. 3. The design points of the design product: in shape. 4. The picture or photo that best indicates the design points: perspective view. 5. The bottom of the design product is not easily visible or not visible during use, and the top view is omitted.
Need to check novelty before this filing date? Find Prior Art