Power semiconductor H-bridge module (DFN2)
CN309983248SActive Publication Date: 2026-05-15CHONGQING CLOUDCHILD TECH CO LTD
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Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Designs(China)
- Current Assignee / Owner
- CHONGQING CLOUDCHILD TECH CO LTD
- Filing Date
- 2025-10-29
- Publication Date
- 2026-05-15
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Figure 000007_ABST
Abstract
1. The name of the design product: power semiconductor H bridge module (DFN2). 2. The use of the design product: mainly used in motor controller, vehicle seat, door lock, tailgate, electric suction door, window lifter, sunroof and other motor control modules, BDC DC brush motor, etc. 3. The design points of the design product: in shape. 4. The picture or photo that best indicates the design points: design 1 perspective view. 5. Design 1 is designated as the basic design.
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