Power module (SIC)

CN310007707SActive Publication Date: 2026-05-29JIANGSU APT SEMICONDUCTOR CO LTD
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Patent Information

Authority / Receiving Office
CN · China
Patent Type
Designs(China)
Current Assignee / Owner
JIANGSU APT SEMICONDUCTOR CO LTD
Filing Date
2025-08-20
Publication Date
2026-05-29

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Abstract

1. Name of the designed product: power module (SIC). 2. Use of the designed product: used for assembling power module. 3. Design points of the designed product: in shape. 4. Picture or photo that best shows the design points: assembly state perspective view.
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