High Compatibility Motherboard (B760M COMPAT)
CN310053602SActive Publication Date: 2026-06-26SICHUAN XINXIN XUEFU INTELLIGENT TECHNOLOGY CO LTD
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Designs(China)
- Current Assignee / Owner
- SICHUAN XINXIN XUEFU INTELLIGENT TECHNOLOGY CO LTD
- Filing Date
- 2025-12-27
- Publication Date
- 2026-06-26
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Figure 000001_ABST
Abstract
1. The name of the design product: high compatibility mainboard (B760MCOMPAT). 2. The use of the design product: the design product is used for running programs and information processing. 3. The design points of the design product: in shape. 4. The picture or photo that best indicates the design points: perspective view.
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