Badge heat transfer mold assembly and its main body
CN310059576SActive Publication Date: 2026-06-30HUNAN SIJIU TECH CO LTD
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Designs(China)
- Current Assignee / Owner
- HUNAN SIJIU TECH CO LTD
- Filing Date
- 2025-07-09
- Publication Date
- 2026-06-30
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Figure 000007_ABST
Abstract
1. Name of the product in this design: Badge heat transfer mold assembly and its main body. 2. Purpose of this design: The entire product is used to mount badges during vacuum heat transfer printing of badges. 3. The key design feature of this product is its shape. 4. The picture or photo that best illustrates the key design points: Design 1 3D diagram 1. 5. Design 1 is designated as the basic design. 6. Other situations requiring explanation: Other explanation: Designs 4 and 5 request protection for partial product designs. The features shown in the figures with dashed lines are not part of the design scope for which protection is requested.
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