Heatsink (MX660)
CN310064185SActive Publication Date: 2026-06-30DONGGUAN BINGMAN ELECTRONIC TECH CO LTD
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Designs(China)
- Current Assignee / Owner
- DONGGUAN BINGMAN ELECTRONIC TECH CO LTD
- Filing Date
- 2025-10-17
- Publication Date
- 2026-06-30
Smart Images
Figure 000008_ABST
Abstract
1. Name of the product in this design: Heatsink (MX660). 2. Purpose of this design: For heat dissipation of computer CPUs. 3. The key design feature of this product is its shape. 4. The image or photograph that best illustrates the design's key points: 3D rendering 1.
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