Micromechanical component

Abstract

A micromechanical component (1), wherein the micromechanical component (1) encloses a cavity (3), wherein the micromechanical component (1) comprises a sensor element (5) arranged in the cavity (3), wherein the micromechanical component (1) comprises a getter (7) arranged in the cavity (3), wherein the micromechanical component (1) comprises a structure (9) arranged between the sensor element (5) and the getter (7) in such a way that a particle (11) desorbed by the getter (7) is sorbed on and / or in a region (13) of the micromechanical component (1) spaced apart from the sensor element (5), characterized in that the structure (9) is arranged between the getter (7) and a cap (19) of the micromechanical component (1).

Description

State of the art

[0001] The invention is based on a micromechanical component according to the preamble of claim 1.

[0002] Such a micromechanical component is well known.

[0003] For example, MEMS angular rate sensors require a high mechanical quality of the MEMS element. The quality of the MEMS element is essentially determined by the internal pressure in a MEMS cavity of the MEMS angular rate sensor. Friction between the residual gas and the mechanical oscillating structure of the MEMS angular rate sensor continuously drains energy from the system, limiting the maximum quality of the mechanical system and the maximum quality of the MEMS element.

[0004] To achieve a low internal pressure or high quality, the sensor wafer and cap wafer are bonded in a chamber with the desired internal pressure. Residual gas and outgassing from the surface facing into the cavity, for example, limit the achievable minimum internal pressures in the cavity.

[0005] By using a getter in the cavity, the internal pressure can be further reduced or kept essentially constant over the lifetime of the micromechanical component. Examples of corresponding known solutions can be found in the publications JP H10-206 455 A, DE 10 2012 202 183 A1, DE 10 2012 209 973 A1, and US 2011 / 0 050 046 A1. Disclosure of the invention

[0006] The object of the present invention is to provide a micromechanical component with a quality that can be specifically adjusted compared to the prior art in a manner that is gentle on the sensor element and is simple and cost-effective.

[0007] The object is achieved in that the micromechanical component comprises a structure arranged between the sensor element and the getter in such a way that a particle desorbed by the getter is sorbed on and / or in a region of the micromechanical component spaced apart from the sensor element.

[0008] This advantageously ensures that, thanks to the structure, the particle desorbed by the getter does not sorb onto and / or into the sensor element of the micromechanical component. This advantageously makes it possible to introduce the particle into the cavity to reduce the internal pressure in the cavity without the sensor element interacting with it. This enables a particularly effective and efficient getter that binds residual gas molecules in the cavity without negatively impacting the properties of the sensor element. Thus, a micromechanical component with specifically adjustable quality compared to the prior art is provided in a simple and cost-effective manner that is gentle on the sensor element.

[0009] In the context of the present invention, the term “micromechanical component” is to be understood as encompassing both micromechanical components and microelectromechanical components.

[0010] Preferably, a pressure prevails in the cavity and a gas, preferably a gas mixture, with a specific chemical composition is enclosed. According to the invention, "arranged in the cavity" preferably means "in contact with the gas." According to the invention, the cavity is preferably a hollow space. Particularly preferably, the micromechanical component according to the invention can provide internal pressures or pressures in the cavity of less than 1 mbar.

[0011] Furthermore, the micromechanical component preferably encloses a further cavity, wherein a further pressure prevails in the further cavity and a further gas with a different chemical composition is enclosed. Preferably, the pressure is lower than the further pressure.

[0012] The sensor element preferably comprises a rotation rate sensor element or a sensor core for measuring a rotation rate applied to the micromechanical component. Alternatively or additionally, the sensor element preferably comprises an acceleration sensor element or a sensor core for measuring an acceleration applied to the micromechanical component.

[0013] Furthermore, the micromechanical component preferably comprises a combination MEMS system. Particularly preferably, a yaw rate sensor element is arranged in the cavity, and an acceleration sensor element is arranged in the further cavity. This advantageously provides a micromechanical component with two separate cavities, e.g., for a yaw rate sensor and for an acceleration sensor, ensuring a low pressure for the yaw rate sensor and, at the same time, a higher pressure for the acceleration sensor. Particularly preferably, the sensor wafer and the cap wafer are bonded at the target pressure of the acceleration sensor. This advantageously sets the required internal pressure for the acceleration sensor. The getter or the getter material in the cap wafer or the getter arranged in the cavity then preferably binds the residual gas in the cavity or yaw rate cavity.

[0014] The getter preferably comprises or preferred getter materials are aluminum (Al) and / or barium (Ba) and / or calcium (Ca) and / or cerium (Ce) and / or magnesium (Mg) and / or niobium (Nb) and / or phosphorus (P) and / or strontium (Sr) and / or tantalum (Ta) and / or terbium (Tb) and / or thorium (Th) and / or titanium (Ti) and / or zirconium (Zr). The getter is preferably a chemically reactive material that serves to maintain a vacuum for as long as possible. The getter is preferably in a solid state and / or in a liquid state and / or in a gaseous state. For example, at the surface of the getter, gas atoms or gas molecules of the gas form a direct chemical bond with the atoms or molecules of the getter. Alternatively or additionally, however, it is also provided that the gas atoms or gas molecules are retained on the getter by sorption. In this way, the gas atoms orthe gas molecules are "captured" in or on the surface of the getter material. Particularly preferably, one getter particle or particle and / or several getter particles or particles desorb from the getter. In addition, the desorbed getter particle or particle and / or the desorbed getter particles or particles form a chemical bond with one or more gas atoms or gas molecules of the gas. Furthermore, it is particularly preferably provided that the getter particle or particle and / or the getter particles or particles sorb or sorb on and / or in the region of the micromechanical component spaced apart from the sensor element.

[0015] According to the invention, a particle is preferably understood to mean an atom or a collection of atoms, such as a molecule or a plurality of molecules or a collection of a plurality of molecules. In the context of the present invention, the particle is in a gaseous, liquid or solid state of aggregation or is part of a gaseous, liquid or solid phase and comprises at least one phase boundary with its environment. The particle preferably comprises a part of the getter or getter material or a part of the getter or getter material and additionally an atom or atoms and / or a molecule or molecules of the gas. In particular, according to the invention, a particle is understood to mean a body that is small in the scale of the micromechanical component, iea body which has a maximum extension of 1 / 10, preferably 1 / 100, particularly preferably 1 / 1000, very particularly preferably 1 / 10000, of a maximum extension of the micromechanical component.

[0016] In addition, the region spaced apart from the sensor element is preferably a surface of the micromechanical component facing the cavity or a surface of the micromechanical component in contact with the gas, wherein the surface and a further surface of the sensor element are preferably disjoint.

[0017] Advantageous embodiments and further developments of the invention can be found in the dependent claims and the description with reference to the drawings.

[0018] According to a preferred development, the micromechanical component is designed such that the particle is desorbed from the getter by introducing energy into an energy-absorbing region of the micromechanical component. This advantageously enables the particles to be delivered into the cavity in a particularly targeted manner, thereby allowing the internal pressure in the cavity to be adjusted in a particularly targeted manner.

[0019] Furthermore, the particle preferably desorbs by heating the micromechanical component, particularly preferably by heating the getter or the energy-absorbing region. The micromechanical component is preferably designed such that the getter is heated by heat conduction from the energy-absorbing region to the getter. Desorbing the particle preferably comprises evaporating the getter or the particle.

[0020] According to a preferred development, the micromechanical component comprises a transparent region arranged between the getter and an area surrounding the micromechanical component, wherein a transmittance of the transparent region for a wavelength interval and a wall thickness interval of the transparent region is greater than a transmittance threshold. This advantageously ensures that, depending on the transmittance threshold, a radiation source for introducing the energy can be determined in a targeted manner, thus allowing the particles to be delivered into the cavity in an even more targeted manner, and thus allowing the internal pressure in the cavity to be adjusted even more specifically.

[0021] According to the invention, the structure is arranged between the getter and a cap of the micromechanical component. This advantageously deflects a particle stream or an air stream from one direction toward the cap, thus increasing the time between the desorption of the particle from the getter and contact between the particle and the cap. Thus, the particle exhibits lower energy upon contact between the particle and the cap, significantly increasing the probability of the particle being sorbed onto and / or into the cap upon contact between the particle and the cap.

[0022] According to a preferred development, a projection of the getter onto a main extension plane of a substrate of the micromechanical component and a projection of the structure onto the main extension plane overlap. This advantageously enables a particle stream or an air stream to be deflected from a direction perpendicular to the main extension plane, while simultaneously providing a surface for particle sorption in the direction perpendicular to the main extension plane.

[0023] According to a preferred development, a projection of the getter onto a projection plane running perpendicular to a main extension plane of a substrate of the micromechanical component and a projection of the structure onto the projection plane overlap. This advantageously allows both the getter and the sensor element to be arranged on the substrate, and the structure prevents a direct particle flow or air flow in a direction parallel to the main extension plane.

[0024] Another object of the present invention is a method according to claim 6.

[0025] According to a preferred development, it is provided that in the second method step the particle is desorbed from the getter by introducing energy into an energy-absorbing region of the micromechanical component.

[0026] According to a preferred development, it is provided that the energy is introduced into the absorbing region through a transparent region of the micromechanical component arranged between the getter and an environment of the micromechanical component.

[0027] Another object of the present invention is a system according to claim 9.

[0028] The above-mentioned advantages of the micromechanical component according to the invention also apply accordingly to the method according to the invention and to the system according to the invention. Short description of the drawings Fig. 1 shows a schematic representation of a micromechanical component and a system according to an exemplary embodiment of the present invention. Fig. 2 shows a schematic representation of a micromechanical component according to an exemplary embodiment of the present invention. Fig. 3 shows a schematic representation of a transmittance as a function of a wavelength of a transparent region of a micromechanical component and a system according to an exemplary embodiment of the present invention. Fig. 4 shows a schematic representation of a method according to an exemplary embodiment of the present invention. Embodiments of the invention

[0029] In the various figures, identical parts are always provided with the same reference symbols and are therefore usually named or mentioned only once.

[0030] In Fig. 1 shows a schematic representation of a micromechanical component 1 and a system according to an exemplary embodiment of the present invention.

[0031] The Fig. The micromechanical component 1 illustrated by way of example in Figure 1 encloses a cavity 3, wherein the micromechanical component 1 comprises a sensor element 5 arranged in the cavity 3 and a getter 7 arranged in the cavity 3. Furthermore, the micromechanical component 1 comprises a structure 9 arranged between the sensor element 5 and the getter 7. The structure 9 is designed such that a particle 11 desorbed by the getter 7 is sorbed on and / or in a region 13 of the micromechanical component 1 spaced apart from the sensor element 5. The structure is preferably arranged in the cavity.

[0032] As in Fig. 1, the micromechanical component 1 comprises a cap 19 and a substrate 21. Furthermore, the getter 7 is preferably formed as a layer or as a getter layer (e.g., titanium, aluminum, etc.). Particularly preferably, the getter 7 is arranged on the cap 19 of the micromechanical component 1 and / or on the substrate 21 of the micromechanical component 1. Particularly preferably, the getter 7 is applied inside the sensor core or in the cavity 3, particularly preferably prior to bonding the cap 19 to the substrate 21.

[0033] Preferably, the micromechanical component 1 is designed such that the particle 11 is desorbed from the getter 7 by introducing energy into an energy-absorbing region 15 of the micromechanical component 1. For example, the micromechanical component 1 is designed such that a reduction in the pressure or the internal pressure in a MEMS cavity is enabled by evaporating a material or by evaporating the getter 7, wherein the evaporated material or the evaporated getter 7 binds air molecules or gas molecules of the gas and thus leads to a reduction in the internal pressure or the pressure in the cavity 3. A suitable structure within the chip or the structure 9 arranged between the sensor element 5 and the getter 7 ensures that the evaporated gate material does not settle on the functional mechanical structures of the sensor or on the sensor element 5.

[0034] Preferably, the energy absorbing region 15 is arranged in the cap 19. Additionally or alternatively, the energy absorbing region 15 is preferably as shown in Fig. 1, is arranged in the substrate 21. Particularly preferably, the energy-absorbing region 15 is arranged at least partially in the getter 7.

[0035] Furthermore, the micromechanical component 1 preferably comprises a transparent region 17 arranged between the getter 7 and an environment 200 of the micromechanical component 1, wherein a transmittance of the transparent region 17 for a wavelength interval and a wall thickness interval of the transparent region 17 is greater than a transmittance threshold value.

[0036] Preferably, the transparent region 17 is arranged in the cap 19. Additionally or alternatively, the transparent region 17 is preferably as shown in Fig. 1 by way of example, arranged in the substrate 21.

[0037] Particularly preferably, the transparent region 17 is arranged facing the environment 200 of the micromechanical component 1. Additionally or alternatively, the energy-absorbing region 15 is particularly preferably arranged facing the cavity 3. Furthermore, the energy-absorbing region 15 is particularly preferably arranged facing the getter 7 and / or touching the getter 7.

[0038] Furthermore, the energy-absorbing region 15 and the transparent region 17 are preferably arranged adjacent to one another. Particularly preferably, a further transmittance of the energy-absorbing region 15 for the wavelength interval and the wall thickness interval of the energy-absorbing region 15 is smaller than the transmittance threshold value.

[0039] Furthermore, the structure 9 is preferably arranged between the getter 7 and a cap 19 of the micromechanical component 1. Additionally or alternatively, the structure 9 is preferably arranged between the getter 7 and the substrate 21. Furthermore, the structure 9 is preferably formed as part of the cap 19. In other words, the micromechanical component 1 is preferably formed such that the cap 19 comprises at least part of the structure 9. Additionally or alternatively, the structure 9 is preferably formed as part of the substrate 21. In other words, the micromechanical component 1 is preferably formed such that the substrate 21 comprises at least part of the structure 9.

[0040] Preferably, a projection of the getter 7 onto a main extension plane 100 of a substrate 21 of the micromechanical component 1 and a projection of the structure 9 onto the main extension plane 100 overlap. Furthermore, a projection of the getter 7 onto a projection plane 300 extending perpendicular to the main extension plane 100 and a projection of the structure 9 onto the projection plane 300 preferably overlap.

[0041] Furthermore, Fig. 1 shows, by way of example, a system according to the invention, wherein the system comprises a micromechanical component 1, in particular a micromechanical component 1 according to the invention, and an energy source 23 for introducing energy into an energy-absorbing region 15 of the micromechanical component 1. The energy source 23 preferably comprises a radiation source or an optical energy source, particularly preferably a laser, very particularly preferably a CO2 laser. For example, the energy input required to evaporate the gate material is introduced by means of a suitable radiation source, preferably by means of a laser (e.g., a CO2 laser). Alternatively or additionally, the energy source 23 comprises a contact plate, in particular a metallic contact plate, wherein the contact plate is preferably designed such that energy can be introduced from the contact plate into the energy-absorbing region 15 by thermal conduction.Alternatively or additionally, the energy source 23 comprises a convection device, wherein the convection device is designed such that, in order to introduce energy into the energy-absorbing region 15, a fluid flows from the convection device onto the energy-absorbing region 15. Alternatively or additionally, the energy source 23 comprises a heat radiation device, wherein the heat radiation device is designed such that, in order to introduce energy into the energy-absorbing region 15, heat radiation from the heat radiation device strikes the energy-absorbing region 15 and is absorbed by the energy-absorbing region 15.

[0042] Preferably, the getter 7 or the getter material is heated and evaporated by the energy source 23 or a suitable radiation source, preferably a suitable laser source, and distributed in the cavity 3 or in the MEMS sensor. Furthermore, the getter 7 or the getter layer preferably absorbs the gas or the residual gas in the sensor, thereby reducing the pressure or the internal pressure in the cavity 3.

[0043] Preferably, a suitable laser source is used for which the wafer substrate or the transparent region 17 has a high transparency so that the largest part of the radiation energy can be used to evaporate the gate material or so that the largest part of the radiation energy can be absorbed in the energy-absorbing region 15.

[0044] Preferably, the structure 9 or a suitable structure 9 is built around the gate material or the structure 9 is designed such that the structure 9 at least partially encloses the getter 7, in particular along a direction parallel to the main extension plane 100. Furthermore, the structure 9 is designed such that an air flow 27 or a gas flow 27 of the gas or a particle flow in the cavity 3 can be channeled such that the evaporating getter material or the particle 11 does not settle on the functional structures of the mechanical components of the sensor or on the sensor element 5. Preferably, the air flow 27 or the gas flow 27 of the gas is guided past the getter 7 or suitably channeled.

[0045] Preferably, the energy source 23 or the laser is applied from the rear side of the substrate 21 or from the main extension plane 100. Preferably, the residual absorption or the absorption of the substrate 21 or substrate material with respect to the energy radiation 25 or the laser light 25 results in the substrate 21 being warmer than the cap 19. As a result, the heated air or the heated gas preferably rises from the substrate 21 and towards the cap 19 and cools down on the wafer cap or the cap 19. Preferably, the structure 9 is designed such that the gaseous getter material particles or the particles follow this air flow 27 or gas flow 27, such that the gaseous getter material particles or the particles cool down on the wafer cap or the cap 19 and settle there. Preferably, the gaseous getter material particles or the particles do not attach to the functional mechanical structures orthe sensor element 5.

[0046] Furthermore, the structure 9 is preferably arranged around the gate material. The structure 9 preferably comprises a first recess 91 or a first opening 91. The first recess 91 is preferably arranged between a center of mass of the structure 9 and the substrate 21. Particularly preferably, the first recess 91 is enclosed by the structure 9 and the substrate 21 in a plane perpendicular to the main extension plane 100. In other words, the first recess 91 is arranged in the vicinity of the wafer substrate or the substrate 21.

[0047] Furthermore, the structure 9 preferably comprises a further first recess 91' and / or a third first recess 91". Preferably, the further first recess 91' and / or the third first recess 91" are preferably arranged between a center of mass of the structure 9 and the substrate 21 (see Fig. 2). Particularly preferably, the further first recess 91' and / or the third first recess 91" are enclosed in a plane perpendicular to the main extension plane 100 by the structure 9 and the substrate 21.

[0048] In addition, the structure 9 preferably comprises a second recess 92 or an exit opening 92. The second recess 92 is preferably arranged between a center of mass of the structure 9 and the cap 19. Particularly preferably, the second recess 92 is enclosed by the structure 9 in a plane perpendicular to the main extension plane 100. Alternatively, the second recess 92 is enclosed by the structure 9 and the cap 19 in a plane perpendicular to the main extension plane 100. Preferably, the structure 9 comprises projections 29, 29', 29'', 29''' that protrude into the cavity 3 in the direction of the main extension plane 100 and are spaced apart from one another parallel to the main extension plane 100. In addition, the second recess 92 is preferably arranged near the cap 19.

[0049] Furthermore, the structure 9 preferably comprises a third recess 93. The third recess 93 is preferably arranged parallel to the main extension plane 100 between the sensor element 5 and the getter 7. Particularly preferably, the structure 9 is designed such that the third recess 93 is enclosed by the structure 9 in a plane perpendicular to the main extension plane 100.

[0050] In addition, the first recess 91, the second recess 92 and the third recess 93 are arranged such that the air flow 27 first passes through the first recess 91, then the third recess 93 and then the second recess 92.

[0051] According to the invention, after or during the introduction of energy, preferably in the second method step 102, warmer air or gas is preferably located in the region of the first recess 91 or in the region of the energy-absorbing region 15, with the warm air or gas rising from the substrate 21 toward the cap 19 and exiting again through the second recess 92. A similar principle to that used in a fireplace is preferably applied here.

[0052] Furthermore, the structure 9 is preferably designed in a labyrinthine manner. This preferably guides the air flow 27 to the getter 7 or getter material and away from there, so that the evaporating getter 7 or the evaporating getter material deposits on the walls of the structure 9 or auxiliary structure and / or on the cap 19 and not on the sensor element 5 or sensor part.

[0053] According to the invention, the structure 9 preferably comprises a plurality of recesses or holes, preferably differing in size, in order to suitably guide the air flow 27. In particular, according to the invention, different configurations of the structure 9 are provided around the getter 7 or the getter material such that no particle 11 or no getter 7 or no getter material settles on the mechanical structure or the sensor element 5.

[0054] In Fig. 2 shows a schematic representation of a micromechanical component 1 according to an exemplary embodiment of the present invention. In the Fig. 2 is essentially a side view at a section position along the projection plane 300 in Fig. 1.

[0055] In Fig. Figure 3 shows a schematic representation of a transmittance 400 as a function of a wavelength 500 of a transparent region of a micromechanical component 1 and a system according to an exemplary embodiment of the present invention. Preferably, the transmittance 400 is a transmittance of a 5 mm thick and uncoated silicon window, wherein the silicon window is arranged within the transparent region 17.

[0056] In Fig. 4 is a schematic representation of a method according to an exemplary embodiment of the present invention.

[0057] In the Fig. 4, the method according to the invention for adjusting an internal pressure in a cavity 3 of a micromechanical component 1, in particular a micromechanical component 1 according to the invention, is -- in a first method step 101, the micromechanical component 1 is provided and -- in a second method step 102, a particle 11 is desorbed from the getter 7 and sorbed on and / or in a region 13 of the micromechanical component 1 spaced apart from the sensor element 5.

[0058] Preferably, in the second method step 102, the particle 11 is desorbed from the getter 7 by introducing energy into an energy-absorbing region 15 of the micromechanical component 1.

[0059] Furthermore, the energy is preferably introduced into the absorbing region 15 through a transparent region 17 of the micromechanical component 1 arranged between the getter 7 and an environment 200 of the micromechanical component 1.

[0060] Furthermore, the method according to the invention is preferably carried out after a wafer bonding process.

[0061] Preferably, the method according to the invention and the micromechanical component 1 according to the invention enable the generation of a vacuum with a defined residual pressure in a MEMS element.

[0062] Advantages of the micromechanical component 1 according to the invention, the method according to the invention and the system according to the invention are in particular: -- separate setting of different pressures for rotation rates and acceleration sensors on one chip, -- more precise adjustment of the internal pressure and thus reduction of the quality variation of the sensor across the wafer and -- contactless process that does not require additional electrical contacts.

[0063] Preferably, the structure 9 or the auxiliary structures are applied and / or structured using processes suitable for inertial sensor technology. Thus, the micromechanical component 1 according to the invention can be advantageously manufactured using standard layer technology processes. In other words, the structure 9 or the structures can be integrated into standard process sequences.

Claims

[1] Micromechanical component (1), wherein the micromechanical component (1) encloses a cavity (3), wherein the micromechanical component (1) comprises a sensor element (5) arranged in the cavity (3), wherein the micromechanical component (1) comprises a getter (7) arranged in the cavity (3), wherein the micromechanical component (1) comprises a structure (9) arranged between the sensor element (5) and the getter (7) in such a way that a particle (11) desorbed by the getter (7) is sorbed on and / or in a region (13) of the micromechanical component (1) spaced apart from the sensor element (5), characterized by that the structure (9) is arranged between the getter (7) and a cap (19) of the micromechanical component (1). [2] Micromechanical component (1) according to claim 1, wherein the micromechanical component (1) is designed such that the particle (11) is desorbed from the getter (7) by introducing energy into an energy-absorbing region (15) of the micromechanical component (1). [3] Micromechanical component (1) according to one of the preceding claims, wherein the micromechanical component (1) comprises a transparent region (17) arranged between the getter (7) and an environment (200) of the micromechanical component (1), wherein a transmittance of the transparent region (17) for a wavelength interval and a wall thickness interval of the transparent region (17) is greater than a transmittance threshold value. [4] Micromechanical component (1) according to one of the preceding claims, wherein a projection of the getter (7) onto a main extension plane (100) of a substrate (21) of the micromechanical component (1) and a projection of the structure (9) onto the main extension plane (100) overlap. [5] Micromechanical component (1) according to one of the preceding claims, wherein a projection of the getter (7) onto a projection plane (300) extending perpendicular to a main extension plane (100) of a substrate (21) of the micromechanical component (1) and a projection of the structure (9) onto the projection plane (300) overlap. [6] Method for adjusting an internal pressure in a cavity (3) of a micromechanical component (1), in particular a micromechanical component (1) according to one of the preceding claims, wherein the micromechanical component (1) comprises a sensor element (5) arranged in the cavity (3), wherein the micromechanical component (1) comprises a getter (7) arranged in the cavity (3), wherein the micromechanical component (1) comprises a structure (9) arranged between the sensor element (5) and the getter (7), wherein -- in a first method step (101) the micromechanical component (1) is provided, characterized by , that -- in a second method step (102), a particle (11) is desorbed from the getter (7) and is sorbed on and / or in a region (13) of the micromechanical component (1) spaced apart from the sensor element (5), wherein the structure (9) is arranged between the getter (7) and a cap (19) of the micromechanical component (1). [7] Method according to claim 7, wherein in the second method step (102) the particle (11) is desorbed from the getter (7) by introducing energy into an energy-absorbing region (15) of the micromechanical component (1). [8] Method according to claim 7 or 8, wherein the energy is introduced into the absorbing region (15) through a transparent region (17) of the micromechanical component (1) arranged between the getter (7) and an environment (200) of the micromechanical component (1). [9] System comprising a micromechanical component (1) according to one of claims 1 to 5 and an energy source (23) for introducing energy into an energy-absorbing region (15) of the micromechanical component (1).

Images