Device and method for processing glass or glass-ceramic elements using a laser

Abstract

Method (1) for laser processing of a glass or glass-ceramic element (2), in which: - the laser beam (7) of an ultrashort pulse laser (10) is concentrated to an elongated focus in the glass or glass-ceramic element (2) by means of a focusing optic (3), wherein: - a pulse power of the ultrashort pulse laser (10) is set which is sufficient to generate filament-shaped damage (6) within the glass or glass-ceramic by means of the laser pulses focused in the glass or glass-ceramic, wherein the focusing optic (3) comprises a lens (4) arranged in the beam path of the ultrashort pulse laser (10), and wherein: - by means of a lens movement device (9), during operation of the ultrashort pulse laser (10), the lens (4) is moved transversely to the beam direction (70) so that the position of the optical axis (40) of the lens (4) relative to the position of the laser beam (7) is changed.and the movement of the lens (4) relative to the laser beam (7) deflects the laser beam (7) and thus shifts the point of impact (71) of the laser beam on the glass or glass-ceramic element (2), wherein the point of impact (71) is guided along a predetermined path forming a dividing line (12) by means of a computing device (15), wherein the lens movement device (9) is controlled by successively emitting control signals, wherein, in response to the successively emitted control signals, the lens (4) of the focusing optics (3) is moved transversely to the beam direction (70), so that the position of the optical axis (40) of the lens (4) changes relative to the position of the laser beam (7), thereby moving the point of impact (71) of the laser beam (7) on the glass or glass-ceramic element (2),wherein- by means of a movement device (17) the glass or glass-ceramic element (2) is moved relative to the ultrashort pulse laser (10) during the incident laser beam (7), so that the point of impact (71) of the laser beam (7) is guided along a predetermined path forming the dividing line (12), which is formed by the superposition of the positions set by means of the lens movement device (9) and the movement device (17), wherein- by the movement of the lens (4) deviations of the point of impact (71) from the predetermined dividing line (12) caused by undesired movement of the glass or glass-ceramic element (2) relative to the ultrashort pulse laser (10), in particular by vibrations or overshoot, during a change of direction of movement are compensated.

Description

The invention relates generally to the processing of glass or glass-ceramic parts. In particular, the invention relates to a method for separating glass or glass-ceramic elements in order to separate parts from the elements. Filamentation is a well-known process in which damage is introduced into the glass. The special feature is that this damage is not point-like, as in stealth dicing, but rather linear along the cut edge, achieved through special optics. By placing several damages next to each other, a separation line is created along which the glass can be cut by applying tension. Various devices for creating separation lines using intense laser beams are known in the prior art. In these devices, a plasma is generated in the glass along the laser beam by ultrashort, high-intensity laser pulses, causing filamentary damage in the material. The laser beam is moved along a predetermined path, creating adjacent damage lines. The glass piece can then be separated along this path. Methods for producing filament-shaped damage for separation preparation are known, for example, from WO 2012 / 006736 A2 and DE 10 2012 110 971 A1. EP 2 781 296 A1 further describes a method for producing internal contours, wherein, in a contour definition step, a multitude of individual zones of internal damage are created in the substrate material by means of a laser beam guided over the substrate along a contour line that characterizes the contour to be produced. In a material removal or deformation step carried out after the contour definition step, substrate material is then removed or detached by plastic deformation or material removal. Special optics are often used to form a linear focus for creating elongated damage zones. In particular, an axicon or an optic with targeted spherical aberration is suitable for forming focal lines or a linear focus. These special optics are currently only available as fixed optics. During processing, the substrate is moved beneath the optic. At high speeds up to 2 m / s, problems can arise with geometries that have very small radii, as the axes cannot move the high mass of the substrate with the necessary accelerations while maintaining geometric accuracy. This is especially true for radii smaller than 10 mm, and particularly for radii smaller than 1 mm. Portal systems represent a further development, particularly for substrates with high mass. In this system, the optics move above the substrate, rather than beneath it. Due to the lower mass, even smaller radii (4-10 mm) can be produced with geometric accuracy at higher speeds. However, the mass to be accelerated is relatively high, and this is insufficient for producing the smallest radii (<1 mm) with geometric accuracy. A disadvantage is that the beam path is not rigidly structured, which can easily lead to misalignment. Furthermore, the length of the beam path changes, affecting the beam diameter and delays. From JP 2016-105 178 A, a laser processing device is known in which a pair of wedge prisms is provided to deflect the laser beam. The prisms deflect the beam in such a way that the angle of incidence can be varied while maintaining a fixed focus. This is therefore a so-called trepanning optic, in which the laser beam can be precisely controlled around a wobble point. Using this optic, the inclination of the laser-cut surface can then be adjusted by setting the angle of the beam to the workpiece normal. However, to guide the focus along a predetermined cutting line, the workpiece must again be moved, with the aforementioned disadvantage of the high mass that needs to be moved. JP 2003 220484 A relates to a laser processing method for drilling, cutting and joining (welding, soldering) using a laser beam. The laser beam is deflected by an eccentrically mounted, continuously rotating lens. WO 2015 / 113026 A2 discloses a combined laser and mechanical processing method for precisely fracturing or faceting the edges of glass substrates. The laser processing is performed using an ultrashort pulse laser focused with a line optic to create high aspect ratio defect lines in the glass. DE 92 15 587 U1 relates to a material processing laser for processing a workpiece, with a laser source and a lens arranged in the beam path of the emitted laser beam, focusing the laser beam onto the workpiece on a driven adjustable holder. EP 2 859 983 B1 describes a system for generating continuous laser filaments in transparent materials for precise separation, cutting, or structuring. An aberrant lens can be used for focusing. A galvanometer scanner can be used for beam deflection. A telecentric lens ensures that the beam strikes the substrate perpendicularly, even when deflected. DE 10 2013 210 052 A1 describes a laser processing device with two condenser lenses arranged one behind the other, which are moved in directions perpendicular to each other in order to deflect the laser beam. From JP 2010-42424A, a laser processing device is known with a continuously eccentrically rotating lens driven by an ultrasonic motor to guide the laser beam in a circular path on the workpiece. The device is used for welding, soldering, or drilling holes. The invention is therefore based on the objective of providing a method with which separation lines can be quickly and as faithfully as possible to specifications inscribed into an element to be processed using a laser. This problem is solved by the subject matter of claim 1. Advantageous embodiments of the invention are specified in the dependent claims. The invention is based on the finding that, during filamentation, depending on the beam diameter and the lens used, the laser beam can be deflected by positioning the lens without noticeably affecting the quality of the produced filaments. For this purpose, a device for laser processing of a glass or glass-ceramic element can be used, comprising: - an ultrashort pulse laser, - a focusing optic to concentrate the laser beam of the ultrashort pulse laser into an elongated focus, and to generate filament-shaped damage within the glass or glass-ceramic by means of the laser pulses focused within the glass or glass-ceramic, wherein the focusing optic comprises - a lens arranged in the beam path of the ultrashort pulse laser. A lens movement device allows the lens to be moved transversely to the beam direction, so that the position of the optical axis of the lens relative to the position of the laser beam can be changed.The lens is shaped in such a way that a movement of the lens relative to the laser beam deflects the laser beam and thus shifts the point of impact of the laser beam on the glass or glass-ceramic element, so that by moving the lens the point of impact of the laser beam can be guided along a predetermined path forming a dividing line. To enable the insertion of the filament-shaped defects, an ultrashort pulse laser with a correspondingly high pulse power is selected. Preferably, the lens used to deflect the laser beam has a positive focal length, i.e., it is a converging lens, so that this lens can concentrate the laser beam into a focus without an additional focusing lens. A method according to the invention for laser processing of a glass or glass-ceramic element, which can be carried out with the device, is based on the fact that the laser beam of the ultrashort pulse laser is concentrated to an elongated focus in the glass or glass-ceramic element using the focusing optics, wherein a pulse power of the ultrashort pulse laser is set that is sufficient to generate filament-shaped or elongated damage within the glass or glass-ceramic by means of the laser pulses focused in the glass or glass-ceramic, wherein the focusing optics comprise a lens arranged in the beam path of the ultrashort pulse laser. The invention allows the point of impact of the laser beam to be easily adjusted by changing the position of the lens relative to the beam position. For example, with a beam diameter of 12 mm and a biconvex lens with a diameter of 16 mm, a beam deflection of ±1 mm is possible without significantly degrading the beam geometry or the maximum intensity. Using the lens movement device, the lens is moved perpendicular to the beam direction during the operation of the ultrashort pulse laser, i.e., while it is emitting a laser beam, so that the position of the optical axis of the lens relative to the position of the laser beam is changed. The lens is shaped such that its movement relative to the laser beam deflects the laser beam and thus shifts the point of impact of the laser beam on the glass or glass-ceramic element, whereby the point of impact is guided along the predetermined path forming the dividing line by the movement of the lens. There are various ways to control the movement of the laser beam across the surface. According to one embodiment, a computing device is provided which is configured to successively send control signals to the lens movement device, so that the movement of the lens transverse to the beam direction by the lens movement device guides the point of impact of the laser beam along a predetermined path forming a dividing line. Particularly preferably, the movement of the laser beam across the glass or glass-ceramic element is controlled by a computer. To enable larger movements, a motion device can be used to move the glass or glass-ceramic element relative to the ultrashort pulse laser during laser beam illumination, so that the point of impact of the laser beam is guided along a predetermined path forming the dividing line. This path is formed by the superposition of the positions set by the positioning device and the motion device. Intermittent operation can also be provided, in which the motion device moves to specific positions on the glass or glass-ceramic element, at which the dividing line is then traced using the lens movement according to the invention. The invention is explained in more detail below with reference to the accompanying figures. These show: Fig. 1 a first embodiment of a device for laser processing, Fig. 2 a lens movement device, Fig. 3 a further embodiment of a lens movement device, Fig. 4 a ray tracing simulation of the laser beam with a centrally arranged lens, Figs. 5 and 6 ray tracing simulations of the laser beam with an eccentrically arranged lens, Figs. 7 and 8 light microscopic images of the cross-section of a glass element with inserted filament-shaped defects, Fig. 9 a parting line on a glass or glass-ceramic element with a deviation from the intended path, Fig. 10 a glass or glass-ceramic element with a plurality of parting lines, Fig. 11 velocity-time diagrams of the lens movement device, Fig. 12 a glass or glass-ceramic element with a processed outer contour. Fig. 1 shows a side view of a device 1 for laser processing of a glass or glass-ceramic element 2, with which adjacent filament-shaped defects 6 are created in the volume of the element 2 along a separation line. The glass or glass-ceramic element 2 can then be easily separated along this separation line through the introduced defects. The device 1 comprises an ultrashort pulse laser 10 and a focusing optic 3, with which the laser beam 7 of the ultrashort pulse laser 10 is concentrated into an elongated focus 41. For this purpose, at least one lens 4 is provided as a component of the focusing optic 3. In the case of an optical setup consisting of several beam-shaping elements, this lens is preferably the front lens of the imaging optic facing the material. In addition to the lens 3, the focusing optic 3 can also have one or more further optical elements 30, for example, to widen and / or collimate the laser beam.In general, without limiting oneself to the example shown, according to one embodiment of the invention, the diameter of the laser beam 7 striking the lens 4 is kept smaller than the aperture of the lens. This allows the lens 4 to be moved relative to the laser beam within a certain range without the laser beam being shading. The ratio of the beam diameter of the laser beam 7 to the diameter of the lens aperture is preferably at least 0.25, more preferably at least 0.5, and most preferably at least 2 / 3, although the ratio should remain less than 1 due to the unfavorable shading. For example, an Nd:YAG laser with a wavelength of 1064 nm is suitable as an ultrashort pulse laser. With such a laser, pulse energies of 200–250 µJ can be achieved at a pulse duration of 10 ps. The laser can also be operated in burst mode, in which the pulse energy is delivered in the form of pulse packets (also called bursts). In a burst with 1–8 individual pulses, the total energy of a burst, according to one embodiment, is 400–800 µJ, the burst frequency (i.e., the interval between the pulses of a burst) is 50 MHz, the distance between two filaments produced by a single burst is 4–8 µm, and the repetition rate of the bursts is between 5–200 kHz. In general, the following parameters of the ultrashort pulse laser are particularly suitable for the invention: The power of the ultrashort pulse laser is preferably in a range of 20 to 300 watts. The pulse energy of a burst is preferably more than 400 microjoules, particularly preferably more than 500 microjoules. When operating the ultrashort pulse laser in burst mode, the repetition rate is the rate at which bursts are emitted. The pulse duration is essentially independent of whether the laser is operated in single-pulse mode or in burst mode. The pulses within a burst typically have a similar pulse length to a pulse in single-pulse mode. The burst frequency can be in the range of 15 MHz to 90 MHz, preferably in the range of 20 MHz to 85 MHz. The number of pulses in the burst is preferably between 1 and 10 pulses, e.g. 6 or 8 pulses. The laser beam 7 of the ultrashort pulse laser 10 is subdivided into successively emitted laser pulses 8. The pulse power of the ultrashort pulse laser 10, carried by the pulses, is sufficient to generate filament-shaped defects 6 within the glass or glass-ceramic by means of the laser pulses 8 focused within the glass or glass-ceramic. These filament-shaped defects 6 form along the elongated, preferably linear, focus 41. The lens 4 is not only used to generate the elongated linear focus 41 within the volume of the glass or glass-ceramic element 2, which is caused by the large spherical aberration. Rather, the lens 4 is also shaped such that a change in the lens 4's position relative to the laser beam 7 deflects the laser beam 7, and the resulting change in the direction of the emerging laser beam 7 shifts the point of impact 71 of the laser beam 7 on the glass or glass-ceramic element 2. This is used to guide the laser beam 7 and thus trace the desired path along the intended dividing line. Generally, without being limited to the illustrated embodiments, a lens 4 is provided that exhibits a spherical aberration sufficient to laterally shift the focus of the laser beam when the laser beam is moved laterally across the lens. To enable the point of impact 71 of the laser beam 7 to be moved along the predetermined path forming the dividing line, a lens movement device 9 is provided, by means of which the lens 4 can be moved transversely to the beam direction. Such a change in position transversely to the beam direction, in particular perpendicular to the beam direction, leads to a change in the distance of the optical axis of the lens 4 from the center of the laser beam 7. In other words, the lens 4 can be positioned by means of the lens movement device 9 so that the laser beam selectively passes through the lens eccentrically. The lens 4 itself has a comparatively low mass and can therefore be moved very quickly. The invention thus makes it possible to produce even geometries with the smallest radii, as required for products in electronics and microfluidics, with high geometric accuracy at extremely high speeds. Thus, the point of impact 71 can be moved across the glass or glass-ceramic element by means of a movement of the lens at a speed of more than 0.05 meters per second, preferably at a speed of up to 0.1 meters per second, without being limited to the specific construction of the example shown in Fig. 1. At the same time, even the tightest curvatures of the dividing line can be achieved, regardless of the speed at which the intended dividing line is traversed. According to one embodiment of the method according to the invention, the movement of the lens 4 traces a dividing line having a radius of curvature in the range of 0.05 mm to 1 mm. According to a preferred embodiment of the invention, a computing unit 15 is provided which successively sends control signals to the lens movement device 9, so that the position of the lens 4 can be controlled and changed by the computing unit 15. In this way, the movement of the lens 4 by the lens movement device 9, transverse to the beam direction, can guide the point of impact 71 of the laser beam 7 along the intended path on the glass or glass-ceramic element 2 in a computer-controlled manner. Accordingly, in the example shown in Fig. 1, a computing unit 15 is connected to the lens movement device 9. In general, piezo actuators or electromagnetic actuators, for example, are suitable as components of the lens movement device 9. If necessary, several actuator types can also be combined. The lens movement device 9 can comprise two motors to move the lens in two independent directions transverse to the beam direction, thus enabling flexible imaging of any geometry. According to one embodiment, the lens movement device 9 therefore comprises two positioning devices for movement along two non-parallel directions transverse to the beam direction 70 of the laser beam 7. Fig. 2 shows, in a top view, i.e., viewed along the beam direction of the laser beam, an example of such a lens movement device 9 with an associated lens 4. The lens movement device 9 comprises two positioning devices 91, 92, which can each move and position the lens 4 along a direction indicated by a double arrow. The two directions lie in a plane, preferably perpendicular to the beam direction and preferably also perpendicular to each other.As shown, both actuators 91 and 92 can be controlled separately by the computer unit 15. Different movement parameters can thus be set for the two directions. Acceleration distances or accelerated movements can also be provided. According to yet another embodiment of the invention, movement of the lens transverse to the beam direction and relative to the beam center is effected by eccentric rotation of the lens. In this way, the optical axis of the lens 4 moves in a circular path around the axis of rotation. Accordingly, in this embodiment, a device for eccentric rotation of the lens is provided as part of the lens movement device 9. According to a further development of the invention, static and / or dynamic balancing can preferably be provided to prevent the rotating lens from generating vibrations and transmitting them to the optical system. Fig. 3 shows an example of such a lens movement device 9. This includes a lens holder 33, which is rotatably mounted by means of a motor 92. The optical axis 40 of the lens 4 is spaced apart from the axis of rotation 43 of the holder 33. Therefore, when the lens holder 33 rotates, the optical axis 40 follows a circular path 44 around the axis of rotation 41. In this way, the point of impact 71 of the laser beam 7 is also guided along a circular path. Its radius is generally smaller than the radius of the circular path 44 of the optical axis 40 around the axis of rotation 43. This embodiment can also be combined with movement in two independent directions by means of two actuators, as shown in the embodiment of Fig. 2. Furthermore, the control of the lens movement device 9 by means of the computing device 15 by successively outputting control signals can also be applied to the embodiment of Fig. 3, so that the lens 4 of the focusing optics 3 is moved transversely to the beam direction 70 and the position of the optical axis 40 of the lens 4 changes relative to the position of the laser beam 7, thereby moving the point of impact 71 of the laser beam 7 on the glass or glass-ceramic element 2. The movement of lens 4 enables very fast and precise guidance of the laser beam 7. On the other hand, the deflection of the beam is also limited by the maximum possible displacement of the lens relative to the laser beam, which is determined by the lens edge. In a preferred embodiment of the invention, therefore, the beam guidance by means of lens 4 is combined with a further movement mechanism. Accordingly, in a further development of the invention, a movement device 17 is provided with which the glass or glass-ceramic element 2 can be moved relative to the ultrashort pulse laser 10 during the incident laser beam 7, so that the point of impact 71 of the laser beam 7 can be guided along a predetermined path forming the dividing line, which is formed by the superposition of the positions set by means of the lens movement device 9 and the movement device 17.Naturally, the motion device 17 and the lens motion device 9 can also be operated intermittently. In the embodiment shown in Fig. 1, the motion device 17 comprises an xy-table. Here, the glass or glass-ceramic element 2 placed on the table is moved relative to the laser source. An embodiment as a gantry system is also possible, in which the optics for tracing the separation line are moved over the glass or glass-ceramic element 2 by a suitable motion device 17. Furthermore, a motion device 17 for moving the glass or glass-ceramic element 2 and another motion device 17 for moving the optics can be provided. Regardless of the specific embodiment of the motion device 17, according to a preferred embodiment, it is also controlled by a computing unit 15, just like the lens motion device 9. The mechanism of beam guidance by displacement of the lens 4 is explained in more detail below using examples. Fig. 4 shows a simulation of the focused laser beam 7 with a centrically arranged lens, where the beam axis, or rather the beam center 73 of the laser beam 7, coincides with the optical axis 4 of the biconvex lens 4. In the example shown in Fig. 5, the lens 4 is displaced by 0.4 millimeters relative to the beam center. In the simulation shown in Fig. 6, the parallel displacement between the beam center 73 and the optical axis 40 is 1.0 millimeter. The beam deflection resulting from the displacement of the lens 4 transversely to the laser beam 7, and thus the displacement of the point of impact 71 of the laser beam 7 on the glass or glass-ceramic element, is smaller and is not highlighted in the illustrations of Fig. 5 and Fig. 6. With the beam displacement of 0.4 millimeters according to Fig.In Fig. 5, the point of impact 71 shifts by 0.388 millimeters; with the beam displacement of 1 millimeter shown in Fig. 6, the displacement of the point of impact 71 is 0.979 millimeters. As can be seen from the simulations, the quality of the laser beam's focus remains essentially unchanged despite the displacement, so that the filamentation process, or plasma formation along the linear focus, is unaffected. The maximum beam intensity of the deflected beam is generally at least 85 percent, and usually at least 90 percent or even at least 95 percent, of the maximum intensity of a beam focused centrally through the lens 4. In general, according to one embodiment of the invention, the point of impact 71 on the glass or glass-ceramic element 2 is deflected by a distance smaller than the displacement of the lens 4 relative to a position with a centered lens 4. The reduction factor between the displacement of the lens 4 and the displacement of the point of impact 71 is generally advantageous for precisely inserting small structures into a glass or glass-ceramic element 2, in particular precise openings with a small diameter. According to one embodiment of the invention, the lens is preferably selected such that the reduction factor is in the range of 0.25 to 0.95. Figs. 7 and 8 show light microscopic images of the cross-section of a glass element with inserted filament-shaped defects. In the example shown in Fig. 7, the two filament-shaped defects 6 were produced by moving the lens 4 400 micrometers out of its central position. The distance between the two lens positions is therefore 800 µm. In contrast, the distance between the filament-shaped defects is only 575.95 µm, or approximately 600 µm. Thus, the deflection of the point of impact is reduced by a factor of ¾ compared to the deflection of the lens. In general, without being limited to the exemplary embodiments, a further development of the invention provides that the point of impact 71 on the glass or glass-ceramic element is deflected by a distance smaller than the displacement of the lens 4 compared to a position with a centered lens. A position with a centered lens is understood to be a position in which, as shown in Fig. 4, the optical axis 40 of the lens 4 is collinear with the central axis 73 of the laser beam 7. Fig. 8 shows a glass element 2 into which three filaments, or filament-shaped defects 6, have been inserted. The central filament-shaped defect 6 was inserted with a centered lens 4, while the two outer filament-shaped defects 6 were inserted with lens deflections of different magnitudes. This image clearly shows that the length of the filament-shaped defects 6, approximately 2600 µm, is essentially unaffected by the deflection. The measured distances are 243.01 µm between the left and central filaments, and 324.08 µm between the right and central filaments. Fig. 9 shows a top view of a separation line 12 on a glass or glass-ceramic element 2, as generated by the laser beam 7 through the adjacent insertion of filament-shaped defects 6. The separation line 12 exhibits an abrupt change in direction. More generally, the path of the separation line can be characterized as not continuously differentiable. To ensure subsequent separation along such a non-continuously differentiable path, acceleration sections of the movement can also be provided, which lead to an increase in the local filament density near the non-differentiable areas. In general, without being limited to the illustrated embodiment, the density of the filament-shaped defects, or the number of these defects per unit length along the separation line 12, can therefore be varied.This variation can, in particular, be carried out, as in the present embodiment, by increasing the density in the area of ​​a change of direction. Specifically, after subsequent separation, a right-angled edge should be produced at the separation line. In a device without the lens movement 4 according to the invention, in which the separation line 12 is traversed solely by relative movement of the optics and the glass or glass-ceramic element 2 with a movement device 17, such abrupt changes in direction can cause vibrations, so that the separation line 12 deviates from the intended path 13 as shown. Specifically, a damped oscillation of the separation line 12 around the intended path 13 results.As already explained, the motion device 17 can now move the glass or glass-ceramic element 2 relative to the ultrashort pulse laser 10 during the illumination of the laser beam 7, so that the point of impact 71 of the laser beam 7 is guided along a predetermined path forming the dividing line 12, which is formed by the superposition of the positions set by means of the positioning device 9 and the motion device 17. This can be achieved here by imposing a beam deflection by means of the lens movement device 9, which has an opposite oscillation, so that the actual dividing line 12 coincides with the intended path 13.In general, without limiting oneself to the specific example shown, it is provided according to one embodiment of the invention that the movement of the lens 4 compensates for deviations of the point of impact 71 from the predetermined dividing line 12 caused by unwanted movement of the glass or glass-ceramic element 2 relative to the ultrashort pulse laser 10, in particular by vibrations or overshoot during a change of direction of movement. In the example shown, the dividing line 12 ends at the edge of the glass or glass-ceramic element 2. However, it is also generally possible to trace a closed dividing line 12 with the point of impact 71 of the laser beam 7. Then, an opening shaped according to the form of the dividing line 12 can be created in the glass or glass-ceramic element 2 by cutting. Fig. 10 schematically shows an example of a typical application of the invention. A disc-shaped glass or glass-ceramic element 2 is provided, in which a plurality of parting lines 12 in the form of closed curves are inserted. If a movement mechanism is used, as shown in Fig. 3, circular parting lines 12 are particularly suitable. The inner part of three of the parting lines 12 has already been removed, resulting in openings 20. Generally, without being limited to the illustrated embodiment, parting along the parting line 12 can include etching along the inserted filament-shaped defects 6. Wet or dry chemical etching processes are suitable. Due to the defects, the etching process along the filaments proceeds faster than, for example, on the surface of the glass, so that widening channels are created during the etching process.Finally, the channels created along the damage 6 connect, forming a gap running along the separation line 12. If the separation line 12 is closed, this gap is ring-shaped and allows the inner part to be removed. The invention enables the processing of minute radii at very high speeds. Only the lens is moved relative to the beam and substrate to image minute radii or entire geometries, e.g., holes with a diameter of 0.7 mm. Larger movements can then be achieved by moving the substrate. Because the invention allows for very rapid beam movement with very low moving masses, such glass or glass-ceramic elements 2 with many small openings 20 can be manufactured economically in a short time.According to a preferred embodiment of the invention, the inscription of the separation lines 12 generally proceeds as follows: the glass or glass-ceramic element 2 and the focusing optics 3 are moved relative to each other to a processing position by means of the movement device 17; the movement is stopped; and then the separation line 12 is traced by means of the lens movement device by deflecting the laser beam 7, which is otherwise stationary relative to the glass or glass-ceramic element 2. Subsequently, the next processing position is approached by means of the movement device 17, and another separation line 12 is traced there. The steps are repeated until all intended separation lines 12 have been traced and inscribed. In this way, for example, a plurality of closed separation lines 12 can be produced for the manufacture of openings 20, as shown in the example of Fig. 10. A glass or glass-ceramic element 2, as shown in Fig. 10, can also be produced using an embodiment of the method according to the invention, in which a movement mechanism 17 moves the glass or glass-ceramic element 2 relative to the ultrashort pulse laser 10 during the inscription of the closed parting line 12 by deflecting the laser beam 7 and moving the lens 4. For this purpose, a movement component is superimposed on the lens movement, which compensates for the relative movement exerted by the movement device 17 between the ultrashort pulse laser 10 and the glass or glass-ceramic element 2, i.e., which is opposite to the relative movement. In this way, the insertion of the filaments can take place while the glass or glass-ceramic element 2 is moved relative to the ultrashort pulse laser 10. For clarification, Fig. 11 shows an example in the form of velocity-time diagrams.The upper diagram represents the movement in the x-direction, the lower one in the y-direction perpendicular to the x-direction. Only the movement of the point of impact, caused by the lens movement device 9, is shown. The movement device 17 additionally moves the glass or glass-ceramic element 2 relative to the ultrashort pulse laser 10 at a constant velocity v0 in the x-direction. At time t1, the inscription of filament-shaped damage 6 along a closed path begins and ends at time t5. The predefined dividing line 12 in this example, unlike the one shown in Fig. 10, is not circular but angular. In the time interval t1-t2, the laser beam moves in the opposite direction to the movement of the glass or glass-ceramic element 2. The point of impact thus moves in the opposite direction to that imposed on it by the movement device 17. This movement is precisely compensated for in the interval. Consequently, the point of impact 71 remains stationary in the x-direction.Simultaneously, the lens movement device 9 moves the laser beam perpendicular to the direction of movement of the movement device 17. Subsequently, in the interval t3-t4, a slower movement collinear with the direction of movement of the movement device 17 takes place. To complete the inscription, the point of impact is moved back in the y-direction, whereby the movement of the movement device 17 is again exactly compensated in the x-direction. At the end of this interval, the inscribed path closes. Due to the compensation of the continuous movement of the glass or glass-ceramic element 2, the lens movement device 9 has also been continuously adjusted in the x-direction. The lens movement device 9 is therefore finally moved back to its initial position in the interval t5-t6. Now another dividing line can be inscribed. This example has clearly demonstrated that, for compensating the movement of the movement device 17 and simultaneously inscribing a dividing line, it is generally advantageous if the lens movement device 9 is configured to move the point of impact 71 of the laser beam 7 on the glass or glass-ceramic element 2 faster than the relative velocity of the glass or glass-ceramic element 2 with respect to the ultrashort pulse laser 10, so that the point of impact 71 can be moved in the opposite direction to the movement of the glass or glass-ceramic element 2 exerted by the movement device 17. Both embodiments described above—namely, the alternating approach to movement positions and traversing separation lines, and the movement of the laser beam via the lens movement device superimposed on the movement of the movement mechanism 17—have one thing in common: During the periods between traversing the separation lines 12, it is advantageous for producing separate openings not to emit pulses or bursts. The operation of the ultrashort pulse laser can therefore be position-dependent in general, without being limited to the two aforementioned examples. Alternatively or additionally, the laser emission can be based on the speed of the movement. According to one embodiment of the invention, the laser emission is therefore synchronized with the position of the point of impact 71 or its speed.Synchronization can be controlled by the appropriately configured computing unit 15. A variable density of filaments along the contour is also advantageous when changing direction, such as on curved paths or corners, as in the example of Fig. 9, as well as when approaching the start and end points of a contour. If the laser is switched off, strictly speaking, there is no point of impact 71 of the laser light. In this case, the imaginary point of impact that would result if the laser were switched on should be understood. Synchronizing the laser emission with the movement or position of the point of impact involves more than simply switching the laser emission on or off. Other laser parameters, such as the repetition rate of the bursts, their energy, or the number of pulses in a burst, can also be synchronized. Another example is the insertion of short auxiliary cuts, where the point of impact is moved back to a point from which the path continues after the dividing line has been traversed. Here, the laser emission can be switched off during the return movement. The invention enables the rapid and economical production of a large number of small openings in disc-shaped glass or glass-ceramic elements 2. A correspondingly processed glass or glass-ceramic element is suitable, among other things, for applications in microfluidics or microelectronics. For example, the invention allows the production of a so-called glass interposer. This is an insulating substrate through which vias are routed. The conductors routed through the interposer can then be connected to contact pads on the opposite side. The interposer thus serves, for example, as a substrate and for redistributing the contacts of a chip. It is evident to those skilled in the art that the invention is not limited to the specific embodiments shown, but can be modified in a variety of ways within the scope of the following claims. The embodiments can also be combined with one another. For example, a lens movement device 9 can be provided which includes both an arrangement according to Fig. 2 and according to Fig. 3. This may be advantageous, for instance, for realizing an embodiment similar to Fig. 11. A first, linear lens movement device 9 can be provided which compensates for the movement of the glass or glass-ceramic element 2. With the eccentric rotation according to the embodiment shown in Fig. 3, a circular dividing line is then traced. Of course, it is not only possible to produce closed parting lines 12. Auxiliary cuts for special geometries or outer contours are also possible, where the simultaneous movement of the lens and material enables the generation of filaments along a predefined path. An example of this is shown in Fig. 12. The glass or glass-ceramic element 2 has an outer contour 24, which is essentially circular. The outer contour 24 also has a fine structure in the form of teeth 25. Such a contour can be produced by tracing the outer contour using the movement device 17, while the lens movement device 9 superimposes a deflection of the laser beam, which imprints the fine structure onto the parting line.In general, without limiting oneself to the specific example, a dividing line can be created by superimposing a deflection of the laser beam 7, generated by the lens movement, on a relative movement between the glass or glass-ceramic element 2 and the ultrashort pulse laser. A wide variety of glasses are suitable in principle for the processing according to the invention. Lithium aluminosilicate glasses, lithium aluminosilicate glass ceramics, soda-lime glasses, borosilicate glasses, aluminosilicate glasses and alkali metal aluminosilicate glasses are preferred. For example, the substrate can be a lithium aluminosilicate glass with the following composition (in wt.%): SiO255-69 Al2O318-25 Li2O3-5 Na2O + K2O0-30 MgO + CaO + SrO + BaO0-5 ZnO0-4 TiO20-5 ZrO20-5 TiO2 + ZrO2 + SnO22-6 P2O50-8 F0-1 B2O30-2 If desired, coloring oxides such as Nd2O3, Fe2O3, CoO, NiO, V2O5, MnO2, TiO2, CuO, CeO2, Cr2O3 may be added. 0-2 wt% As2O3, Sb2O3, SnO2, SO3, Cl, F and / or CeO2 may be added as a refining agent, and 0-5 wt% rare earth oxides may also be added to introduce magnetic, photon or optical functions into the glass layer or plate, with the total amount of the composition being 100 wt%. In particular, a material of the aforementioned composition can have a coefficient of thermal expansion between 3·10-6K-1 and 6·10-6K-1 or between 3.3·10-6K-1 and 5.7·10-6K-1. Preferably, the lithium aluminosilicate glass has the following composition (in wt.%): SiO257-66 Al2O318-23 Li2O3-5 Na2O + K2O3-25 MgO + CaO + SrO + BaO1-4 ZnO0-4 TiO20-4 ZrO20-5 TiO2 + ZrO2 + SnO22-6 P2O50-7 F0-1 B2O30-2 If desired, coloring oxides such as Nd2O3, Fe2O3, CoO, NiO, V2O5, MnO2, TiO2, CuO, CeO2, Cr2O3 may be added; 0-2 wt% As2O3, Sb2O3, SnO2, SO3, Cl, F and / or CeO2 may be added as a refining agent; and 0-5 wt% rare earth oxides may also be added to introduce magnetic, photon or optical functions into the glass layer or plate, and the total amount of the composition is 100 wt%. In particular, a material of the aforementioned composition can have a coefficient of thermal expansion between 4.5·10-6K-1 and 6·10-6K-1 or between 4.76·10-6K-1 and 5.7·10-6K-1. The lithium aluminosilicate glass preferably has the following composition (in wt.%): SiO257-63 Al2O318-22 Li2O3.5-5 Na2O + K2O5-20 MgO + CaO + SrO + BaO0-5 ZnO0-3 TiO20-3 ZrO20-5 TiO2 + ZrO2 + SnO22-5 P2O50-5 F0-1 B2O30-2 If desired, coloring oxides such as Nd2O3, Fe2O3, CoO, NiO, V2O5, MnO2, TiO2, CuO, CeO2, Cr2O3 may be added. 0-2 wt% As2O3, Sb2O3, SnO2, SO3, Cl, F and / or CeO2 may be added as a refining agent, and 0-5 wt% rare earth oxides may also be added to introduce magnetic, photon or optical functions into the glass layer or plate, and the total amount of the composition is 100 wt%. In particular, a material of the aforementioned composition can have a coefficient of thermal expansion between 4 × 10⁻⁶ K⁻¹ and 8 × 10⁻⁶ K⁻¹ or between 5 × 10⁻⁶ K⁻¹ and 7 × 10⁻⁶ K⁻¹. Alternatively, a corresponding glass-ceramic can be provided which has a coefficient of thermal expansion between -0.068 × 10⁻⁶ K⁻¹ and 1.16 × 10⁻⁶ K⁻¹. In another example, the substrate can be a soda-lime glass with the following composition (in wt.%): SiO240-81 Al2O30-6 B2O30-5 Li2O + Na2O + K2O5-30 MgO + CaO + SrO + BaO + ZnO5-30 TiO2 + ZrO20-7 P2O50-2 If desired, coloring oxides such as Nd2O3, Fe2O3, CoO, NiO, V2O5, MnO2, TiO2, CuO, CeO2, Cr2O3 may be added; 0-2 wt% As2O3, Sb2O3, SnO2, SO3, Cl, F and / or CeO2 may be added as a refining agent; and 0-5 wt% rare earth oxides may also be added to introduce magnetic, photon or optical functions into the glass layer or plate, and the total amount of the composition is 100 wt%. In particular, a material of the aforementioned composition can have a coefficient of thermal expansion between 5.25·10-6K-1 and 10*10-6K-1 or between 5.53·10-6K-1 and 9.77·10-6K-1. The soda-lime glass preferably has the following composition (in wt.%): SiO250-81 Al2O30-5 B2O30-5 Li2O + Na2O + K2O5-28 MgO + CaO + SrO + BaO + ZnO5-25 TiO2 + ZrO20-6 P2O50-2 If desired, coloring oxides such as Nd2O3, Fe2O3, CoO, NiO, V2O5, MnO2, TiO2, CuO, CeO2, Cr2O3 may be added; 0-2 wt% As2O3, Sb2O3, SnO2, SO3, Cl, F and / or CeO2 may be added as a refining agent; and 0-5 wt% rare earth oxides may also be added to introduce magnetic, photon or optical functions into the glass layer or plate, and the total amount of the composition is 100 wt%. In particular, a material of the aforementioned composition can have a coefficient of thermal expansion between 4.5·10-6K-1 and 11·10-6K-1 or between 4.94·10-6K-1 and 10.25·10-6K-1. The soda-lime glass preferably has the following composition (in wt.%): SiO255-76 Al2O30-5 B2O30-5 Li2O + Na2O + K2O5-25 MgO + CaO + SrO + BaO + ZnO5-20 TiO2 + ZrO20-5 P2O50-2 If desired, coloring oxides such as Nd2O3, Fe2O3, CoO, NiO, V2O5, MnO2, TiO2, CuO, CeO2, Cr2O3 may be added; 0-2 wt% As2O3, Sb2O3, SnO2, SO3, Cl, F and / or CeO2 may be added as a refining agent; and 0-5 wt% rare earth oxides may also be added to introduce magnetic, photon or optical functions into the glass layer or plate, and the total amount of the composition is 100 wt%. In particular, a material of the aforementioned composition can have a coefficient of thermal expansion between 4.5·10-6K-1 and 11·10-6K-1 or between 4.93·10-6K-1 and 10.25·10-6K-1. In another example, the substrate is a borosilicate glass with the following composition (in wt.%): SiO260-85 Al2O30-10 B2O35-20 Li2O + Na2O + K2O2-16 MgO + CaO + SrO + BaO + ZnO0-15 TiO2 + ZrO20-5 P2O50-2 If desired, coloring oxides such as Nd2O3, Fe2O3, CoO, NiO, V2O5, MnO2, TiO2, CuO, CeO2, Cr2O3 may be added; 0-2 wt% As2O3, Sb2O3, SnO2, SO3, Cl, F and / or CeO2 may be added as a refining agent; and 0-5 wt% rare earth oxides may also be added to introduce magnetic, photon or optical functions into the glass layer or plate, and the total amount of the composition is 100 wt%. In particular, a material of the aforementioned composition can have a coefficient of thermal expansion between 2.75·10-6K-1 and 10·10-6K-1 or between 3.0·10-6K-1 and 9.01·10-6K-1. The borosilicate glass preferably has the following composition (in wt.%): SiO263-84 Al2O30-8 B2O35-18 Li2O + Na2O + K2O3-14 MgO + CaO + SrO + BaO + ZnO0-12 TiO2 + ZrO20-4 P2O50-2 If desired, coloring oxides such as Nd2O3, Fe2O3, CoO, NiO, V2O5, MnO2, TiO2, CuO, CeO2, Cr2O3 may be added; 0-2 wt% As2O3, Sb2O3, SnO2, SO3, Cl, F and / or CeO2 may be added as a refining agent; and 0-5 wt% rare earth oxides may also be added to introduce magnetic, photon or optical functions into the glass layer or plate, and the total amount of the composition is 100 wt%. In particular, a material of the aforementioned composition can have a coefficient of thermal expansion between 2.5·10-6K-1 and 8·10-6K-1 or between 2.8·10-6K-1 and 7.5·10-6K-1. The borosilicate glass preferably has the following composition (in wt.%): SiO263-83 Al2O30-7 B2O35-18 Li2O + Na2O + K2O4-14 MgO + CaO + SrO + BaO + ZnO0-10 TiO2 + ZrO20-3 P2O50-2 If desired, coloring oxides such as Nd2O3, Fe2O3, CoO, NiO, V2O5, MnO2, TiO2, CuO, CeO2, Cr2O3 may be added; 0-2 wt% As2O3, Sb2O3, SnO2, SO3, Cl, F and / or CeO2 may be added as a refining agent; and 0-5 wt% rare earth oxides may also be added to introduce magnetic, photon or optical functions into the glass layer or plate, and the total amount of the composition is 100 wt%. In particular, a material of the aforementioned composition can have a coefficient of thermal expansion between 3.0·10-6K-1 and 8·10-6K-1 or between 3.18·10-6K-1 and 7.5·10-6K-1. In another example, the substrate is an alkali metal aluminosilicate glass with the following composition (in wt.%): SiO240-75 Al2O310-30 B2O30-20 Li2O + Na2O + K2O4-30 MgO + CaO + SrO + BaO + ZnO0-15 TiO2 + ZrO20-15 P2O50-10 If desired, coloring oxides such as Nd2O3, Fe2O3, CoO, NiO, V2O5, MnO2, TiO2, CuO, CeO2, Cr2O3 may be added; 0-2 wt% As2O3, Sb2O3, SnO2, SO3, Cl, F and / or CeO2 may be added as a refining agent; and 0-5 wt% rare earth oxides may also be added to introduce magnetic, photon or optical functions into the glass layer or plate, and the total amount of the composition is 100 wt%. In particular, a material of the aforementioned composition can have a coefficient of thermal expansion between 3.0·10-6K-1 and 11·10-6K-1 or between 3.3·10-6K-1 and 10·10-6K-1. The alkali metal aluminosilicate glass preferably has the following composition (in wt.%): SiO250-70 Al2O310-27 B2O30-18 Li2O + Na2O + K2O5-28 MgO + CaO + SrO + BaO + ZnO0-13 TiO2 + ZrO20-13 P2O50-9 If desired, coloring oxides such as Nd2O3, Fe2O3, CoO, NiO, V2O5, MnO2, TiO2, CuO, CeO2, Cr2O3 may be added; 0-2 wt% As2O3, Sb2O3, SnO2, SO3, Cl, F and / or CeO2 may be added as a refining agent; and 0-5 wt% rare earth oxides may also be added to introduce magnetic, photon or optical functions into the glass layer or plate, and the total amount of the composition is 100 wt%. In particular, a material of the aforementioned composition can have a coefficient of thermal expansion between 3.75·10-6K-1 and 11·10-6K-1 or between 3.99·10-6K-1 and 10.22·10-6K-1. The alkali aluminosilicate glass preferably has the following composition (in wt.%): SiO255-68 Al2O310-27 B2O30-15 Li2O + Na2O + K2O4-27 MgO + CaO + SrO + BaO + ZnO0-12 TiO2 + ZrO20-10 P2O50-8 If desired, coloring oxides such as Nd2O3, Fe2O3, CoO, NiO, V2O5, MnO2, TiO2, CuO, CeO2, Cr2O3 may be added; 0-2 wt% As2O3, Sb2O3, SnO2, SO3, Cl, F and / or CeO2 may be added as a refining agent; and 0-5 wt% rare earth oxides may also be added to introduce magnetic, photon or optical functions into the glass layer or plate, and the total amount of the composition is 100 wt%. In particular, a material of the aforementioned composition can have a coefficient of thermal expansion between 4.0·10-6K-1 and 10·10-6K-1 or between 4.5·10-6K-1 and 9.08·10-6K-1. In another example, the substrate is a low alkali aluminosilicate glass with the following composition (in wt.%): SiO250-75 Al2O37-25 B2O30-20 Li2O + Na2O + K2O0-4 MgO + CaO +SrO + BaO + ZnO5-25 TiO2+ZrO20-10 P2O50-5 If desired, coloring oxides such as Nd2O3, Fe2O3, CoO, NiO, V2O5, MnO2, TiO2, CuO, CeO2, Cr2O3 may be added; 0-2 wt% As2O3, Sb2O3, SnO2, SO3, Cl, F and / or CeO2 may be added as a refining agent; and 0-5 wt% rare earth oxides may also be added to introduce magnetic, photon or optical functions into the glass layer or plate, and the total amount of the composition is 100 wt%. In particular, a material of the aforementioned composition can have a coefficient of thermal expansion between 2.5·10-6K-1 and 7·10-6K-1 or between 2.8·10-6K-1 and 6.5·10-6K-1. The low alkali aluminosilicate glass preferably has the following composition (in wt.%): SiO252-73 Composition (wt%) Al2O37-23 B2O30-18 Li2O + Na2O + K2O0-4 MgO + CaO +SrO + BaO + ZnO5-23 TiO2+ZrO20-10 P2O50-5 If desired, coloring oxides such as Nd2O3, Fe2O3, CoO, NiO, V2O5, MnO2, TiO2, CuO, CeO2, Cr2O3 may be added; 0-2 wt% As2O3, Sb2O3, SnO2, SO3, Cl, F and / or CeO2 may be added as a refining agent; and 0-5 wt% rare earth oxides may also be added to introduce magnetic, photon or optical functions into the glass layer or plate, and the total amount of the composition is 100 wt%. In particular, a material of the aforementioned composition can have a coefficient of thermal expansion between 2.5·10-6K-1 and 7·10-6K-1 or between 2.8·10-6K-1 and 6.5·10-6K-1. The low alkali aluminosilicate glass preferably has the following composition (in wt.%): SiO253-71 Al2O37-22 B2O30-18 Li2O + Na2O + K2O0-4 MgO + CaO +SrO + BaO + ZnO5-22 TiO2 + ZrO20-8 P2O50-5 If desired, coloring oxides such as Nd2O3, Fe2O3, CoO, NiO, V2O5, MnO2, TiO2, CuO, CeO2, Cr2O3 may be added; 0-2 wt% As2O3, Sb2O3, SnO2, SO3, Cl, F and / or CeO2 may be added as a refining agent; and 0-5 wt% rare earth oxides may also be added to introduce magnetic, photon or optical functions into the glass layer or plate, and the total amount of the composition is 100 wt%. In particular, a material of the aforementioned composition can have a coefficient of thermal expansion between 2.5·10-6K-1 and 7·10-6K-1 or between 2.8·10-6K-1 and 6.5·10-6K-1. Thin glass or glass-ceramic elements are particularly suitable for use in conjunction with the small and very small structures that can be produced with the invention. In general, according to one embodiment of the invention, the glass or glass-ceramic element 2 has a thickness of less than 3000 µm, preferably less than 2500 µm, more preferably less than 1500 µm, more preferably less than 500 µm, and more preferably at least 3 µm, more preferably at least 50 µm, and more preferably at least 150 µm. Preferred thicknesses are 5, 10, 15, 25, 30, 35, 50, 55, 70, 80, 100, 130, 145, 160, 190, 210, or 280 µm. In particular, the glass or glass-ceramic element 2 can be designed as a thin glass ribbon or as a glass foil. Reference symbol list Device for laser processing 1 Glass or glass-ceramic element 2 Focusing optics 3 Lens 4 Filamentous damage 6 Laser beam 7 Laser pulse 8 Lens movement device 9 Ultrashort pulse laser 10 Cutting line 12 Intended path of 12 13 Computing device 15 Movement device 17 Opening in 2 20 Surface of 2 22 Outer contour of 2 24 Tooth 25 Optical element 30 Lens holder 33 Optical axis of 4 40 Rotation axis of 33 43 Focus of 4 41 Beam direction 70 Point of impact of the laser beam on 2 71 Beam center 73 Actuator 90, 91 Motor 92

Claims

Method (1) for laser processing of a glass or glass-ceramic element (2), in which: - the laser beam (7) of an ultrashort pulse laser (10) is concentrated to an elongated focus in the glass or glass-ceramic element (2) by means of a focusing optic (3), wherein: - a pulse power of the ultrashort pulse laser (10) is set which is sufficient to generate filament-shaped damage (6) within the glass or glass-ceramic by means of the laser pulses focused in the glass or glass-ceramic, wherein the focusing optic (3) comprises a lens (4) arranged in the beam path of the ultrashort pulse laser (10), and wherein: - by means of a lens movement device (9) during operation of the ultrashort pulse laser (10) the lens (4) is moved transversely to the beam direction (70) so that the position of the optical axis (40) of the lens (4) relative to the position of the laser beam (7) is changed,and the movement of the lens (4) relative to the laser beam (7) deflects the laser beam (7) and thus shifts the point of impact (71) of the laser beam on the glass or glass-ceramic element (2), wherein the point of impact (71) is guided along a predetermined path forming a dividing line (12) by means of a computing device (15), wherein the lens movement device (9) is controlled by successive output of control signals, wherein, in response to the successively output control signals, the lens (4) of the focusing optics (3) is moved transversely to the beam direction (70), so that the position of the optical axis (40) of the lens (4) changes relative to the position of the laser beam (7), thereby moving the point of impact (71) of the laser beam (7) on the glass or glass-ceramic element (2),wherein- by means of a movement device (17) the glass or glass-ceramic element (2) is moved relative to the ultrashort pulse laser (10) during the incident laser beam (7), so that the point of impact (71) of the laser beam (7) is guided along a predetermined path forming the dividing line (12), which is formed by the superposition of the positions set by means of the lens movement device (9) and the movement device (17), wherein- by the movement of the lens (4) deviations of the point of impact (71) from the predetermined dividing line (12) caused by undesired movement of the glass or glass-ceramic element (2) relative to the ultrashort pulse laser (10), in particular by vibrations or overshoot, during a change of direction of movement are compensated. Method according to claim 1, characterized in that the lens movement device (9) moves the point of impact (71) of the laser beam (7) in the opposite direction to the movement of the glass or glass-ceramic element (2) exerted by the movement device (17). Method according to one of the two preceding claims, characterized in that the lens movement device (9) moves the point of impact (71) of the laser beam (7) on the glass or glass ceramic element (2) faster than the relative velocity of the glass or glass ceramic element (2) relative to the ultrashort pulse laser (10). Method according to one of the preceding claims, characterized in that the point of impact (71) is moved over the glass or glass-ceramic element at a speed of more than 0.5 meters per second, preferably at a speed of up to 1 meter per second. Method according to the preceding claim, characterized in that a part of the glass or glass-ceramic element (2) is separated by cutting along the separation line (12). Method according to one of the preceding claims, characterized in that a closed separation line (12) is traced with the point of impact (71) of the laser beam (7) and then an opening (20) shaped according to the shape of the separation line (12) is produced in the glass or glass-ceramic part (2). Method according to the preceding claim, characterized in that by the movement of the lens dividing lines (12) and openings (20) with a diameter of less than 1 millimeter are produced in the glass or glass-ceramic element (2) according to the shape of the dividing line (12). Method according to one of the preceding claims, characterized in that the movement of the lens (4) traces a dividing line (12) which has a radius of curvature in the range of 0.05 mm to 1 mm. Method according to one of the preceding claims, characterized in that separating at the separation line (12) comprises etching along the inserted filament-shaped damage (6). Method according to one of the preceding claims, characterized in that the point of impact (71) on the glass or glass-ceramic element (2) is deflected relative to a position with a centered lens (4) by a distance which is smaller than the displacement of the lens (4). Method according to one of the preceding claims, characterized in that a glass or glass-ceramic element (2) made of lithium aluminosilicate glass, lithium aluminosilicate glass-ceramic, soda-lime glass, borosilicate glass, aluminosilicate glass or alkali metal aluminosilicate glass is processed. Method according to one of the preceding claims, characterized in that the number of filament-shaped defects (6) per unit length along the dividing line (12) is varied, in particular wherein the number of filament-shaped defects (6) per unit length is increased in the area of ​​a change of direction of the dividing line (12). A method according to one of the preceding claims, characterized in that the ultrashort pulse laser is operated with one or more of the following parameters: (i) the power of the ultrashort pulse laser is preferably in the range of 20 to 300 watts; (ii) the pulse energy of a burst is more than 400 microjoules; (iii) the repetition rate of the bursts is in the range of 15 MHz to 90 MHz, preferably in the range of 20 MHz to 85 MHz; (iv) the number of pulses in the burst is in the range of 1 to 10 pulses.

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