Dual-path high-speed PCB layout solution

Abstract

A two-path signal connection on a printed circuit board, PCB, (210, 300, 320, 500), comprising: A first signal track (212, 302, 322, 502, 504) for the transmission of high-speed electrical signals; a first solder pad (214, 304, 324, 402, 506, 510) of a first size, which is arranged above and connected to the first signal track; a second solder pad (216, 306, 326, 404, 508, 512) of a second size, arranged above and connected to the first signal track, the second solder pad being separated from the first solder pad by a first gap; and a third solder pad (218, 308, 328, 406, 518, 520) of a third size, wherein the third solder pad is separated from the second solder pad by a second gap and connected to a second signal track (220, 310, 330, 514, 516); wherein the first and second solder pads serve to enable the simultaneous soldering of a pin (312, 400) of an external connector to the first and second solder pads, so that when the pin of the external connector is soldered, the high-speed electrical signals are routed to the external connector; and wherein the second and third solder pads serve to enable the simultaneous soldering of a conductor to the second and third solder pads, so that when the conductor is soldered, the high-speed electrical signals are routed to the second signal track.

Description

BACKGROUND

[0001] This disclosure relates generally to the design of a printed circuit board (PCB). More specifically, this disclosure relates to a two-path high-speed signal connection on the PCB that makes it possible to connect a high-speed signal path to two different types of device interfaces while maintaining the signal integrity of a high-speed channel.

[0002] US 9 433 083 B2 relates to cable connector interfaces arranged on a circuit board and, in particular, a connector arrangement with improved impedance matching.

[0003] US 11 093 426 B1 generally concerns information processing systems and, in particular, the configuration of a USB port in an information processing system.

[0004] US 2010 / 0 012 365 A1 concerns printed circuit boards, in particular a printed circuit board that supports various connectors.

[0005] The present invention aims to overcome, at least partially, the disadvantages of the known prior art.

[0006] This problem is solved by a two-path signal connection according to independent claim 1, a printed circuit board (PCB) according to independent claim 10 and a connector base according to independent claim 19. Embodiments are the subject of the respective dependent claims. BRIEF DESCRIPTION OF THE DRAWINGS Fig. shows a diagram illustrating a scenario that requires two routing channels for the same high-speed interface. Fig. shows a standard footprint of a cable connector pin on a printed circuit board according to the state of the art. Fig. shows a modified base area of ​​a cable connector pin according to one aspect of the present application. Fig. shows a first signal routing scenario that corresponds to one aspect of the present application. Fig. shows a second signal routing scenario that corresponds to an aspect of the present application. Fig. shows a side view of a soldered connector pin according to one aspect of the present application. Fig. shows a two-path connection for differential signals according to one aspect of the present application. Fig. shows an enlarged view of the connector solder pads and resistor solder pads to enable two-path routing of differential signals according to one aspect of the present application. Fig. shows a connector footprint to enable signal routing over two paths, according to one aspect of the present application. Fig. shows a partial view of the printed circuit board from above, which includes the connector base and the conductor tracks connected to the connector base, according to one aspect of the present application. Fig. shows a flowchart illustrating the process of designing a printed circuit board with a two-path connection according to one aspect of the present application.

[0007] In the illustrations, identical numbers refer to the same elements of the illustration. DETAILED DESCRIPTION

[0008] The following description is intended to enable the person skilled in the art to manufacture and use the examples and is given in connection with a specific application and its requirements. Various modifications of the examples shown are readily apparent to the person skilled in the art, and the general principles defined herein can be applied to other examples and applications without departing from the spirit and scope of this disclosure. Therefore, the scope of this disclosure is not limited to the examples shown but is intended to be as broad as possible, consistent with the principles and features disclosed herein.

[0009] The disclosure provides a solution for implementing routing paths on a printed circuit board (PCB) for high-speed buses, such as Peripheral Component Interconnect Express (PCIe) buses. Specifically, the proposed solution allows routing paths to coexist on a single PCB to two different types of destinations (e.g., a cable connector and a trace) without adding trace stubs, thereby significantly reducing PCB design and manufacturing costs without compromising signal integrity. The two-path high-speed connection includes a connector pad for connecting to a cable connector and a pair of resistor pads for connecting to a zero-ohm resistor.The connector pad and one resistor pad are positioned above and connected to a first high-speed signal track, with a gap between the connector pad and the resistor pad to prevent stub formation. The other resistor pad can be positioned above and connected to a second high-speed signal track, so that if a zero-ohm resistor is soldered to the pair of resistor pads, high-speed signals can be routed from the first high-speed signal track to the second. Conversely, if a wire connector is soldered to the connector pad along with the adjacent resistor pad, high-speed signals can be routed from the first high-speed signal track to the wire connector.

[0010] Hardware engineers are often faced with the challenge of designing printed circuit boards (PCBs) that can be used for multiple purposes. For example, equipment manufacturers might produce servers with similar specifications that could be deployed in different environments (e.g., in different types of enclosures). Due to the varying interface requirements of these different enclosures, a particular signal path on the server's motherboard might need to be routed to different destinations. For instance, in a server used in one type of chassis, a PCIe bus might run from the CPU to an embedded device (e.g., an embedded memory controller) on the chassis, while in a server used in a different type of chassis, the same PCIe bus might run to a cable connector (e.g., a connector for external storage) on a different chassis type.To reduce costs, it is desirable for both server types to use the same PCB design for their mainboard and to utilize BOM stuffing to select between the two printed circuit boards (PCAs) or two signal routing options. A simple approach is to place two circuits (e.g., two routing channels) for the two different purposes at different locations on the same PCB and add zero-ohm resistors as BOM options to select between the two routing channels. However, such an approach not only consumes valuable PCB space but can also be problematic for high-speed signals. In particular, using zero-ohm resistors to select between the two different routing channels can add significant stubs to the PCIe interface, which is especially problematic with high-speed signals (e.g., high-speed data).> 5 Gbps) would negatively impact signal integrity. It is noted that a stub is a transmission line where one end is connected to other circuitry and the other end remains open. In the situation described above, the unused routing channel can generate unwanted stubs, which can lead to signal degradation.

[0011] Fig. The diagram illustrates a scenario requiring two routing channels for the same high-speed interface. Fig. A printed circuit board 100 can contain a CPU 102, a cable connector 104, and an embedded device 106. The CPU 102 can contain a PCIe interface 108, which can be routed either to the cable connector 104 or to the embedded device 106. Fig. also shows that the conductor tracks 110, 112 and 114 are each connected to the PCIe interface 108, the cable connector 104 and the embedded device 106, with each conductor track having a solder pad at its end.

[0012] Fig. Figure 116 also shows a zero-ohm resistor 116, which can be used to couple conductor 110 and conductor 112 or conductor 110 and conductor 114. When the zero-ohm resistor 116 couples conductor 110 and conductor 112, signals can be routed from the PCIe interface 108 to the cable connector 104 and then to an external device (e.g., an external storage device) plugged into the cable connector 104. Similarly, signals can be routed from the PCIe interface 108 to an embedded device (e.g., an embedded memory controller) 106 when the zero-ohm resistor 116 connects conductor 110 to conductor 114. The zero-ohm resistor 116 can essentially act as a switch to determine which circuit in the final PCA is activated. For low-speed signals, this approach is simple and easy to implement.However, the solder pads and / or traces that form the two routing channels often introduce stubs, which can lead to signal degradation. Furthermore, this approach requires multiple pairs of solder pads, increasing the footprint of the signal connection, making it less practical for high-density printed circuit boards. Considering that multiple traces may need to be routed from the PCIe interface 108 to the cable connector 104 and the embedded device 106, the increased number of solder pads can significantly increase the overall footprint of the signal connection.

[0013] To provide a high-speed connection with two routing options without the aforementioned problems, one aspect of the present application proposes that the two-path connection can be achieved by modifying the standard footprint of the cable connector to integrate solder pads for the zero-ohm resistor as part of the connector's footprint. This approach does not add any stubs.

[0014] Fig. shows a standard footprint of a cable connector pin on a printed circuit board according to the state of the art. Fig. Figure 202 shows that a conductor track 202 is arranged on the top surface of a printed circuit board 200. More precisely, the conductor track 202 can be a microstrip transmission line. In one example, the conductor track 202 can be used to connect a pin of the PCIe interface of a CPU to a pin of a cable connector. Fig. Only a partial view of the circuit board 200 is shown; the PCIe interface and the part of the conductor track 202 that extends to the PCIe interface are not shown.

[0015] Fig. Figure 204 also shows a connector solder pad 204 positioned on top of conductor track 202. Connector solder pad 204 can be a surface-mount pad, allowing a surface-mount component (e.g., a cable connector) to be electrically connected (e.g., by soldering) to a conductor track on the printed circuit board. For example, a pin of a cable connector (in Fig. (not shown) are soldered to the connector solder pad 204, thereby establishing an electrical connection between the connector pin and the conductor track 202. The connector's solder pad 204 can also be referred to as the base of the connector pin. To show the portion of the conductor track 202 beneath the connector solder pad 204, the connector solder pad 204 is depicted as transparent, although it is actually opaque. In the Fig. In the example shown, only a portion of the connector solder pad 204 is located over the conductor track 202 along its length, while the remaining portion of the connector solder pad 204 rests on the bare circuit board. If the conductor track 202 is electrically connected to a PCIe interface pin, the signals from this pin can be routed to the cable connector pin soldered to the connector solder pad 204. This is the standard signal connection with single-path signal routing.

[0016] Fig. shows a modified base area of ​​a cable connector pin according to an aspect of the present application. Fig. A conductor track 212 is arranged on the top surface of the printed circuit board 210. Like conductor track 202, conductor track 212 can also be a microstrip that connects a pin of the PCIe interface of a CPU to a pin of a cable connector. Compared to conductor track 202, conductor track 212 extends further.

[0017] Fig. Also shown is a connector solder pad 214, which is located on top of the conductor track 212. Compared to the one in Fig. In contrast to the connector solder pad 204 shown, the connector solder pad 214 is smaller. In particular, the length of the connector solder pad 214 is reduced. Since the conductor track 212 is extended, the entire length of the connector solder pad 214 lies on the conductor track 212. Furthermore, the conductor track 212 extends beyond the edge of the connector solder pad 214, so that a first resistor solder pad 216 can be formed above the end of the conductor track 212. According to one aspect, the first resistor solder pad 216 can be a standard solder pad for soldering a surface-mount resistor, and the size of the first resistor solder pad 216 can be significantly smaller than that of the connector solder pad 204. It is noted that there is a gap between the first resistor solder pad 216 and the connector solder pad 214 so that they do not touch.

[0018] In addition to the first resistor pad 216, the modified base of the connector pin also includes a second resistor pad 218, which corresponds to the first resistor pad 216. The size of the second resistor pad 218 can be similar to that of the first resistor pad 216. The first and second resistor pads 216 and 218 form a resistor pad pair that allows the mounting of a surface-mount resistor on the printed circuit board 210. Furthermore, the second resistor pad 218 is positioned over the end of a conductor track 220. The conductor track 220 can be similar to the conductor track 212 and can be a microstrip transmission line. The conductor track 220 can be connected to another component (e.g., a surface-mount component) on the printed circuit board 210. The other component is in Fig. not shown.

[0019] The dimensions of the various components on the printed circuit board 210, including the conductor tracks 212 and 220 and the solder pads 214, 216, and 218, can be determined according to practical requirements (e.g., space constraints on the printed circuit board, transmission losses, size of the surface-mount resistor, etc.). The scope of this disclosure is not limited to the actual dimensions of the conductor tracks and solder pads. The drawings (including the Fig. These figures are for illustrative purposes only and are not drawn to the actual scale of the components. In one example, the width of traces 212 and 220 may be approximately 5 mil (or 0.13 mm). The spacing between solder pads 214 and 216 may be comparable to the width of the traces (e.g., between 5 mil and 10 mil). The distance between the end of solder pad 214 and the end of trace 212 may be approximately 0.3 mm. The size of resistor solder pads 216 and 218 and the spacing between them may be determined based on the dimensions of the resistor to be soldered. In one example, the surface-mount resistor may have dimensions of 0.6 mm × 0.3 mm.

[0020] Out of Fig. It is evident that conductor 220 is isolated from conductor 212 if the first and second resistor pads 216 and 218 are isolated from each other (e.g., if no resistor is soldered to these pads). In this case, signals from conductor 212 can be routed to a wire connector by soldering the wire connector pin to the connector pad 214. Conversely, if the conductor 210 is not populated with the wire connector (or if the connector is not soldered to the connector pad 214) and if a low-value resistor (e.g., a zero-ohm resistor) is soldered to the first and second resistor pads 216 and 218, conductor 220 is electrically connected to conductor 212, allowing signals to be routed from conductor 212 to conductor 220. The signals can then be routed via conductor track 220 to a device connected to conductor track 220.

[0021] Fig. This shows a first signal routing scenario according to one aspect of the present application. Fig. The circuit board 300 contains a first conductor track 302 and a second conductor track 310, which connects the in Fig. The circuit traces 212 and 220 shown may be similar. The circuit board 300 also contains a terminal pad 304 and resistor pads 306 and 308, which are similar to terminal pad 214 and resistor pads 216 and 218, respectively. In the Fig. In the example shown, connector pin 312 is soldered to both connector solder pad 304 and resistor solder pad 306 to create an improved connection between connector pin 312 and circuit board 300. Fig. It is evident that the signals are routed from trace 302 to connector pin 312. According to one interpretation, connector pin 312 could be part of a cable connector, allowing signals from trace 302 to be routed to a pluggable device connected to the cable connector. Note that in the Fig. In the example shown, no resistor is soldered between the resistor pads 306 and 308, so they remain isolated from each other. Consequently, no signal is passed to the conductor track 310.

[0022] Fig. This shows a second signal routing scenario according to one aspect of the present application. It is noted that the in Fig. shown circuit board 300 and the one in Fig. The circuit board 320 shown may have the same circuit board design, but may be populated with different components. Like circuit board 300, circuit board 320 may also have a first conductor track 322 and a second conductor track 330, which carry the components shown in Fig. The circuit traces 302 and 310 shown may be similar. The circuit board 320 may also contain a connector solder pad 324 and resistor solder pads 326 and 328, which are shown in Fig. The connector solder pads 304 and resistor solder pads 306 and 308 shown are similar. In contrast to the one in Fig. The example shown is in Fig. No connector pin is soldered to connector pad 324 because the corresponding cable connector is not mounted on circuit board 320. Instead, a zero-ohm resistor 332 is simultaneously soldered to resistor pads 326 and 328, thereby establishing an electrical connection between traces 322 and 330. Consequently, signals are routed from trace 322 to trace 330. According to one aspect, trace 330 can be connected to an embedded device (in Fig. (not shown) on PCB 320. It should be noted that the embedded device can be located on the same side of PCB 320 as conductor 322 or on the opposite side. Alternatively, conductor 330 can be connected to a connector at a different location on PCB 320 so that signals from conductor 322 can be routed to the connector.

[0023] Out of Fig. Figures 3A-3B show that the signal connection, consisting of the connector pad and the pair of resistor pads on the PCB, can provide two different routing paths, and the selection between these two paths can be achieved via the BOM stuffing option. When the cable connector is installed, the routing path runs from the first trace to the cable connector; when the zero-ohm resistor is installed, the routing path runs from the first trace to a second trace. This approach is compact (e.g., it requires only a relatively small change to the footprint of the cable connector), and there is no additional stub in the circuit, thus preserving signal integrity.

[0024] Fig. shows a side view of a soldered connector pin according to one aspect of the present application. More precisely, shows Fig. A connector pin 400 is soldered to both the connector pad 402 and the resistor pad 404. Although there is a gap between the connector pad 402 and the resistor pad 404, the connector pin 400 can be soldered by applying a sufficient amount of solder to both pads. It is important to note that the amount of solder must be carefully controlled to avoid excessive solder causing an unwanted contact. For example, the solder should not make contact between the resistor pads 404 and 406, as shown in [reference missing]. Fig. shown. The dome on the top of the resistor solder joint 406 consists of solder, which protects the joint 406 from oxidation. Fig. This shows that no stub is formed when soldering connector pin 400. Specifically, the heel area (indicated by a dashed box 408) of connector pin 400 is filled with solder, thus preventing the formation of a stub. Similarly, one can imagine that no stubs are formed when a zero-ohm resistor is soldered onto pads 404 and 406. Therefore, this solution for creating a two-path connection can be a zero-stub solution, making it ideal for high-speed signals.

[0025] Fig. Figures 3A-3B show a single conductor track for transmitting single-ended signals. However, in many situations, differential signals may also be required. The proposed two-path connection solution can also be used for differential signals. Fig. shows a two-path connection for differential signals according to one aspect of the present application. Fig. The printed circuit board 500 can contain a pair of traces 502 and 504 that transmit differential signals. Traces 502 and 504 can be connected to a high-speed interface of a device on the printed circuit board 500. For example, traces 502 and 504 can be connected to a PCIe interface of a CPU mounted on the printed circuit board 500. As shown in Fig. On the conductor track 212 shown, conductor tracks 502 and 504 can each be connected with a connector pad and a resistor pad. For example, the connector pad 506 and the resistor pad 508 are shown so that they lie on top of conductor track 502 and are thus electrically connected to conductor track 502; the connector pad 510 and the resistor pad 512 are shown so that they lie on top of conductor track 504 and are thus electrically connected to conductor track 504. Fig. It also shows another pair of conductor tracks (e.g., 514 and 516) and solder pads 518 and 520, each located above conductor tracks 514 and 516. As shown in the Fig. 3A and Fig. As shown in Figure 3B, if a pair of connector pins is soldered to the connector pads and the resistor pads on the pair of traces 502 and 504, differential signals carried by traces 502 and 504 can be routed to the connector. Conversely, if a pair of zero-ohm resistors is soldered to resistor pads 508 and 518 and resistor pads 512 and 520, the differential signals carried by traces 502 and 504 can be routed to traces 514 and 516.

[0026] For comparison, shows Fig. This also includes the connector's standard solder pads 522 and 524. Connector solder pad 522 is located above a trace 526. In this example, there is no need to provide duplicate traces to trace 526 (e.g., trace 526 carries a low-speed signal that can be routed via other mechanisms). Therefore, connector solder pad 522 can be a standard solder pad for soldering a connector pin. On the other hand, connector solder pad 524 is a ground plane, which can also be a standard solder pad. Fig. It is evident that if a conductor track needs to have two paths, the connector solder pad associated with the track can be modified (e.g., reduced in length) to allow a resistor solder pad to be connected to the same track. The track itself may also need to be lengthened to ensure contact with the additional resistor solder pad. This additional resistor and solder pad provides a bridge to another conductor track.

[0027] Fig. Figure 1 shows an enlarged view of the solder pads of the connector and the solder pads of the resistor to enable two-path routing of differential signals according to an aspect of the present application. Exemplary dimensions of the various solder pads, including the size of the gap between adjacent pads, are also shown in Figure 2. Fig. depicted.

[0028] A typical connector can have many pins, and not all signals need to have the option of dual-path routing. As in Fig. As shown, low-speed signals (e.g., less than 1 Gbit / s) and ground signals do not need to use this approach. Therefore, not all connector pin pads are changed. Fig. Figure 600 illustrates a connector footprint for enabling two-path routing according to one aspect of the present application. A connector footprint 600 can include a plurality of connector solder pads for soldering a connector to the printed circuit board and for making electrical connections between the connector and the conductor tracks leading to these connector solder pads. Some of the connector solder pads are standard-sized pads, such as pads 602 and 604. It should be noted that all solder pads of a conventional connector are standard pads with a uniform dimension. In addition to the standard connector solder pads, the connector footprint 600 can include modified connector solder pads (e.g., pads 606 and 608) and corresponding resistor solder pads to enable two-path routing.

[0029] A modified connector pad is shorter than the standard connector pad, and each modified connector pad is accompanied by a pair of resistor pads. For example, the modified connector pad 606 is accompanied by a pair of resistor pads 610, which are located adjacent to the connector pad 606 and along its longitudinal axis. The arrangement of the accompanying resistor pad pair ensures that the resistor pad immediately adjacent to the modified connector pad can be electrically connected to the conductor track that carries the signals to the connector.

[0030] Fig. Figure 1 shows a partial top view of the printed circuit board, including the connector footprint and the conductor tracks connected to the connector footprint, according to one aspect of the present application. The modified connector footprint (as indicated by the dashed box) can be the one shown in Figure 2. Fig. The connector footprint shown is similar to 600 and can contain both standard connector pads and modified connector pads. Specifically, areas with modified connector pads are indicated by two continuous rectangular boxes. The left box contains a pair of modified connector pads connected to a pair of differential traces. In one example, this pair of differential traces can provide a PCIe clock signal that can be routed either to the connector or to an embedded device. The right box contains four pairs of modified connector pads in its upper area. In one example, the four pairs of differential traces (indicated by the ellipse above the rectangular box) connected to these modified pads carry high-speed signals transmitted by the PCIe interface.The right-hand rectangular box also contains four pairs of modified connector solder pads in its lower section, which are connected to four pairs of differential traces (indicated by the ellipse below the rectangular box). In one example, these differential traces carry high-speed signals from a PCIe interface. It is noted that with the modified connector solder pads and the corresponding resistor solder pads, when the connector is not populated and the zero-ohm resistors are present on the circuit board, high-speed signals to and from the PCIe interface can be routed via the zero-ohm resistors to an embedded device (e.g., an embedded storage device).

[0031] In the Fig. 6A and Fig. In the example shown in Figure 6B, the cable connector has 74 pins. In practice, the proposed solution can be implemented for any type of connector, regardless of the number of pins or the dimensions of the individual connector solder pads. From one perspective, the types of connectors can include, but are not limited to: PCIe connectors, Universal Serial Bus (USB) connectors (which can also include various types of USB connectors), Ethernet connectors, etc.

[0032] Fig.Figure 702 shows a flowchart illustrating the process of designing a printed circuit board with a two-path connection according to one aspect of the present application. During this process, an initial PCB design for a routing option can be created (Process 702). The initial PCB design can, for example, assume the use of an external pluggable device and the connection of a CPU's PCIe interface to a cable connector. The initial PCB design can include a standard footprint for the cable connector, with all connector solder pads being of a standard size.

[0033] Next, a number of areas connected to high-speed signal paths can be identified among all connector solder pads (Procedure 704). The high-speed signal paths can include PCIe clock signals, PCIe transmit paths, PCIe receive paths, etc. Each identified connector solder pad can then be modified (Procedure 706). Specifically, the modified connector solder pad can be shorter. In addition to modifying the connector solder pad, the high-speed traces connected to the modified connector solder pad can also be lengthened (Procedure 708). With the lengthened traces and the shortened connector solder pads, corresponding resistor solder pads can be added to each modified connector solder pad (Procedure 710).

[0034] Additional traces can be added to connect the resistor pads to an embedded device (Procedure 712). The layout of the additional traces can be determined based on the dimensions of the embedded device and the available space on the printed circuit board (PCB). The PCB can then be fabricated based on the design (Procedure 714). Once the PCB is fabricated, it can be used for various applications, either with an external pluggable component or with the embedded device. If the PCB is used in the pluggable component application, the PCB bill of materials (BOM) can include the pluggable component and a wire connector that is soldered to the connector pads.If, however, the printed circuit board is used in the application with the embedded device, the bill of materials for the printed circuit board does not include the cable connector, but rather the embedded device and a corresponding number of zero-ohm resistors to be soldered onto the solder pads for the resistors.

[0035] In general, this disclosure provides a solution to the problem of enabling two-path signal routing on a printed circuit board without adding a stub. Specifically, in situations where high-speed signals need to be routed either to a pluggable device (e.g., via a cable connector) or to an embedded device (e.g., via traces), the footprint of the cable connector can be modified to allow two-path signal routing. According to one aspect, a standard connector solder pad can be shortened so that the shortened connector solder pad and a resistor solder pad can both be connected to a trace carrying high-speed signals. The shortened connector solder pad and the resistor solder pad should be separated by a gap, which is necessary during resistor installation to prevent excess solder and solder joints.A corresponding resistor pad and an additional trace connected to the resistor pad can also be provided as part of the two-path high-speed signal connection. When a wire connector is soldered to the wire connector base, both the shortened connector pad and the adjacent resistor pad are soldered to a connector pin, allowing high-speed signals to be routed from the trace to the wire connector. Conversely, if a zero-ohm resistor is soldered to the pair of resistor pads, high-speed signals are routed from the trace to the additional trace. This allows the choice between the two traces to be made using the PCB's BOM stuffing options. This approach does not add any stubs to the signal path and is therefore suitable for high-speed signals.

[0036] One aspect of the present application provides for a two-path signal connection on a printed circuit board (PCB). The connection can comprise a first signal track for transmitting high-speed electrical signals, a first solder pad of a first size positioned above the first signal track and electrically connected to it, a second solder pad of a second size positioned above the first signal track and electrically connected to it, and a third solder pad of a third size. The second solder pad is separated from the first solder pad by a first gap. The third solder pad is separated from the second solder pad by a second gap and electrically connected to a second signal track.The first and second solder pads are used to simultaneously solder a pin of an external connector to both pads, so that when the pin of the external connector is soldered, the high-speed electrical signals are routed to the external connector. The second and third solder pads allow a conductor to be soldered to them simultaneously, so that when the conductor is soldered, the high-speed electrical signals are routed to the second signal path.

[0037] In one variation of this aspect, the conductor includes a surface-mounted zero-ohm resistor.

[0038] In one variation of this aspect, the first size is larger than the second size.

[0039] In one variation of this aspect, the second and third quantities are essentially the same.

[0040] In one variation of this aspect, no stub is formed if the pin of the external connector is soldered to the first and second solder points simultaneously, or if the conductor is soldered to the second and third solder points simultaneously.

[0041] In one variation of this aspect, the first signal path is connected to a Peripheral Component Interconnect Express (PCIe) interface of a processor.

[0042] In one variation of this aspect, the external connector includes one of the following: a PCIe connector (Peripheral Component Interconnect Express), a USB connector (Universal Serial Bus), and an Ethernet connector.

[0043] In one variation of this aspect, the high-speed electrical signals are differential signals, and the first signal track comprises a pair of differential signal tracks.

[0044] One aspect of the present application provides for a printed circuit board (PCB). The PCB may have a plurality of signal traces and a connector base area connected to the plurality of signal traces. One or more signal traces and a portion of the connector base area form a two-path signal connection. The two-path signal connection may comprise a first signal trace for transmitting high-speed electrical signals, a first solder pad of a first size arranged above and connected to the first signal trace, a second solder pad of a second size arranged above and connected to the first signal trace, and a third solder pad of a third size. The second solder pad is separated from the first solder pad by a first gap. The third solder pad is separated from the second solder pad by a second gap and is connected to a second signal trace.The first and second solder pads are designed to allow a pin of an external connector to be soldered to both pads simultaneously, so that when the pin of the external connector is soldered, the high-speed electrical signals are routed to the external connector; and the second and third solder pads are designed to allow a conductor to be soldered to both pads simultaneously, so that when the conductor is soldered, the high-speed electrical signals are routed to the second signal path.

[0045] One aspect of the present application provides a connector base for mounting an external connector on a printed circuit board (PCB). The connector base can include a first set of connector solder pads, a second set of connector solder pads, and a set of resistor solder pads. A first connector solder pad within the first set is a standard solder pad for coupling a first pin of the external connector to a signal trace on the PCB.A second connector solder pad within the second set and a corresponding pair of resistor solder pads positioned next to the second connector solder pad form a two-path signal connection capable of carrying a signal from a first signal path connected to the second connector solder pad to a second pin of the external connector or to a second signal path connected to a distal resistor solder pad of the corresponding pair of resistor solder pads.The second conductor solder pad and a proximal resistance solder pad of the corresponding pair of resistance solder pads are intended to allow the second pin to be soldered simultaneously to the second conductor solder pad and the proximal resistance solder pad, so that when the external connector is soldered, the signal is routed from the first signal track to the second pin of the external connector; and the proximal and distal resistance solder pads are intended to allow a conductor to be soldered simultaneously to the proximal and distal resistance solder pads, so that when the conductor is soldered, the signal is routed from the first signal track to the second signal track.

[0046] The procedures and processes described in the "Detailed Description" section can be embodied as code and / or data, which can be stored on a computer-readable storage medium as described above. When a computer system reads and executes the code and / or data stored on the computer-readable storage medium, the computer system executes the procedures and processes embodied as data structures and code and stored on the computer-readable storage medium.

[0047] Furthermore, the methods and processes described above can be integrated into hardware modules or devices. These hardware modules or devices can include, among others, application-specific integrated circuits (ASIC chips), field-programmable gate arrays (FPGAs), dedicated or shared processors that execute a specific software module or piece of code at a specific time, and other programmable logic devices known today or developed later. When the hardware modules or devices are activated, they execute the methods and processes they contain.

[0048] The foregoing descriptions serve only for illustration and description. They do not claim to be exhaustive and do not limit the scope of this disclosure to the disclosed forms. Accordingly, many modifications and variations will be obvious to those skilled in the art.

Claims

[1] A two-path signal connection on a printed circuit board, PCB, (210, 300, 320, 500), comprising: A first signal track (212, 302, 322, 502, 504) for the transmission of high-speed electrical signals; a first solder pad (214, 304, 324, 402, 506, 510) of a first size, which is arranged above and connected to the first signal track; a second solder pad (216, 306, 326, 404, 508, 512) of a second size, arranged above and connected to the first signal track, the second solder pad being separated from the first solder pad by a first gap; and a third solder pad (218, 308, 328, 406, 518, 520) of a third size, wherein the third solder pad is separated from the second solder pad by a second gap and connected to a second signal track (220, 310, 330, 514, 516); wherein the first and second solder pads serve to enable the simultaneous soldering of a pin (312, 400) of an external connector to the first and second solder pads, so that when the pin of the external connector is soldered, the high-speed electrical signals are routed to the external connector; and wherein the second and third solder pads serve to enable the simultaneous soldering of a conductor to the second and third solder pads, so that when the conductor is soldered, the high-speed electrical signals are routed to the second signal track. [2] The two-path signal connection according to claim 1, wherein the conductor comprises a surface-mounted zero-ohm resistor (332). [3] The two-path signal connection according to claim 1, wherein the first quantity is larger than the second quantity. [4] The two-path signal connection according to claim 1, wherein the second quantity and the third quantity are substantially similar. [5] The two-path signal connection according to claim 1, wherein no stub is formed when the pin of the external connector is soldered to the first and second solder pads simultaneously, or when the conductor is soldered to the second and third solder pads simultaneously. [6] The two-path signal connection according to claim 1, wherein the first signal path is connected to a Peripheral Component Interconnect Express, PCIe, interface of a processor. [7] The two-path signal connection according to claim 1, wherein the external connector comprises one of the following connectors: a Peripheral Component Interconnect Express, PCIe, connector; a universal serial bus, USB, connector and an Ethernet connector. [8] The two-path signal connection according to claim 1, wherein the second signal path is connected to a surface-mounted component. [9] The two-path signal connection according to claim 1, wherein the high-speed electrical signals are differential signals and wherein the first signal path comprises a pair of differential signal paths (502, 504, 514, 516). [10] A printed circuit board, PCB, (210, 300, 320, 500), comprising: a plurality of signal tracks (212, 220, 302, 310, 322, 330, 502, 504, 514, 516) and a connector base area (600) that is connected to the majority of signal tracks; wherein one or more signal paths and part of the connector base form a two-path signal connection; and including the two-path signal connection: a first signal track (212, 302, 322, 502, 504) for the transmission of high-speed electrical signals; a first solder pad (214, 304, 324, 402, 506, 510) of a first size, which is arranged above and connected to the first signal track; a second solder pad (216, 306, 326, 404, 508, 512) of a second size, arranged above and connected to the first signal track, the second solder pad being separated from the first solder pad by a first gap; and a third solder pad (218, 308, 328, 406, 518, 520) of a third size, wherein the third solder pad is separated from the second solder pad by a second gap and electrically connected to a second signal track (220, 310, 330, 514, 516); wherein the first and second solder pads serve to enable the simultaneous soldering of a pin (312, 400) of an external connector to the first and second solder pads, so that when the pin of the external connector is soldered, the high-speed electrical signals are routed to the external connector; and wherein the second and third solder pads serve to enable the simultaneous soldering of a conductor to the second and third solder pads, so that when the conductor is soldered, the high-speed electrical signals are routed to the second signal track. [11] Printed circuit board according to claim 10, wherein the conductor comprises a surface-mounted zero-ohm resistor (332). [12] Printed circuit board according to claim 10, wherein the first size is larger than the second size. [13] Printed circuit board according to claim 10, wherein the second size and the third size are substantially the same. [14] Printed circuit board according to claim 10, wherein no stub is formed when the pin of the external connector is soldered to the first and second solder pads simultaneously or when the conductor is soldered to the second and third solder pads simultaneously. [15] Printed circuit board according to claim 10, wherein the first signal path is connected to a Peripheral Component Interconnect Express, PCIe, interface of a processor. [16] Printed circuit board according to claim 10, wherein the external connector comprises one of the following connectors: a Peripheral Component Interconnect Express (PCIe) connector, a Universal Serial Bus, USB connector and an Ethernet connector. [17] Printed circuit board according to claim 10, wherein the second signal track is connected to a surface-mounted component. [18] Printed circuit board according to claim 10, wherein the high-speed electrical signals are differential signals and the first signal track comprises a pair of differential signal tracks (502, 504, 514, 516). [19] A connector base (600) for mounting an external connector on a printed circuit board, PCB, (210, 300, 320, 500), comprising a first set of connector solder pads (602, 604); a second set of connector solder pads (606, 608) and a set of resistor solder pads (610); wherein a first connector solder pad (602, 604) within the first set is a standard solder pad for connecting a first pin of the external connector to a signal trace on the printed circuit board; wherein a second connector solder pad (606, 608) within the second set and a corresponding pair of resistor solder pads (610) positioned adjacent to the second connector solder pad form a two-path signal connection capable of routing a signal from a first signal path (212, 302, 322, 502, 504) connected to the second connector solder pad to a second pin (312, 400) of the external connector or to a second signal path (220, 310, 330, 514, 516) connected to a distal resistor solder pad of the corresponding pair of resistor solder pads; wherein the second conductor solder pad and a proximal resistor solder pad of the corresponding pair of resistor solder pads serve to enable the simultaneous soldering of the second pin to the second conductor solder pad and the proximal resistor solder pad, so that when the external connector is soldered, the signal is routed from the first signal path to the second pin of the external connector; and wherein the proximal and distal resistance solder pads serve to enable the simultaneous soldering of a conductor to the proximal and distal resistance solder pads, so that when the conductor is soldered, the signal is routed from the first signal track to the second signal track. [20] Connector base according to claim 19, wherein the external connector comprises one of the following connectors: a Peripheral Component Interconnect Express, PCIe, connector; a universal serial bus, USB, connector and an Ethernet connector.

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