Printed circuit board system connectable to an encapsulated cooling system

Abstract

The invention relates to a printed circuit board system connectable to an encapsulated cooling system for a motor vehicle, comprising at least the following components: - at least one first circuit board with an electronic first connection and an electronic power unit; - a second printed circuit board with at least one second electronic connection; wherein the first printed circuit board and the second printed circuit board are communicatively connectable to each other by means of their corresponding electronic connections, and wherein the power supply unit of the at least one first printed circuit board can be brought into at least indirect thermally conductive contact with a corresponding encapsulated cooling line. The printed circuit board system is characterized in particular by the fact that the first connection and the corresponding second connection can be connected to each other in a locally variable manner, at least in one joining direction, enabling thermally conductive contact between the power supply unit and the corresponding cooling line. The printed circuit board system proposed here enables secure electronic communication during mobile vehicle operation, while efficiently cooling the power components. Simultaneously, it allows for easy assembly, maintenance, and replacement of (initial) circuit boards.

Description

[0001] The invention relates to a printed circuit board system connectable to an encapsulated cooling system, a subrack with such a printed circuit board system for a motor vehicle, and a motor vehicle with such a subrack.

[0002] A printed circuit board system is known, for example, for use in a subrack for a motor vehicle. The printed circuit board system comprises a (main) printed circuit board to which one or more functional carriers are attached as (secondary) printed circuit boards, for example as so-called blades, in an electronically communicating and mechanically secured manner. Motor vehicles require increasingly greater computing power, especially for semi-autonomous and (fully) autonomous driving, for example in the context of the so-called ADAS (Advanced Driver Assistance System). The challenges here are the mobility-related vibration and shock to which the subrack is subject, and on the other hand, the high heat output in the printed circuit board system, which must be actively dissipated. For this purpose, the thermal management system already present in a motor vehicle can be used, for example.Due to the criticality of the printed circuit board system and the need for easy maintenance, for example, the replacement of individual printed circuit boards, it is desirable for a cooling line connected to the thermal management system to be closed, i.e., encapsulated, from the printed circuit board system. For sufficiently efficient heat conduction, it is therefore necessary to place the source of the waste heat generated by the printed circuit boards, i.e., the power device, as close as possible to the associated cooling line and also to provide a thermally conductive material between the cooling line and the printed circuit board. However, for a thermally conductive material, such as a thermal paste and / or a thermal pad, very tight tolerances must be maintained in series production and to achieve an acceptable heat transfer coefficient.

[0003] Based on this, the present invention is based on the object of at least partially overcoming the disadvantages known from the prior art. The features of the invention are derived from the independent claims, for which advantageous embodiments are presented in the dependent claims. The features of the claims can be combined in any technically reasonable manner, whereby the explanations from the following description as well as features from the figures, which comprise additional embodiments of the invention, can also be consulted for this purpose.

[0004] The invention relates to a printed circuit board system connectable to an encapsulated cooling system for a motor vehicle, comprising at least the following components: - at least a first circuit board with an electronic first terminal and an electronic power device; - a second circuit board with at least one second electronic connection; wherein the first circuit board and the second circuit board can be communicatively connected to one another by means of their corresponding electronic connections, and wherein the power device of the at least one first circuit board can be brought into at least indirect heat-conducting contact with a corresponding encapsulated cooling line.

[0005] The printed circuit board system is characterized in particular in that the first terminal and the corresponding second terminal can be connected to each other in a spatially variable manner at least in one joining direction for the heat-conducting contact between the power device and the corresponding cooling line.

[0006] Unless explicitly stated otherwise, ordinal numbers used in the preceding and following descriptions serve only to clearly distinguish them and do not reflect the order or ranking of the designated components. An ordinal number greater than one does not necessarily imply that another such component must be present.

[0007] The printed circuit board system proposed here is, as described in the introduction, suitable for use in a motor vehicle, but is not limited to this and can therefore also be used in other applications. The second printed circuit board here refers to the main printed circuit board and the at least one first printed circuit board refers to a so-called blade. The second printed circuit board has a number of electronic (second) connections which is greater than or equal to the number of first printed circuit boards. Each of the first printed circuit boards comprises an electronic (first) connection which can be communicatively connected to a corresponding electronic second connection and is connected during operation of the printed circuit board system. These electronic connections generally comprise a multiplicity of individual contact elements via which electronic signals can be transmitted for communication between the interconnected printed circuit boards.

[0008] The first circuit board comprises a power device, for example, a processor, a memory element, and / or a boost converter. It should be noted that the power device comprises one or a plurality of individual power components. Preferably, the first circuit board does not comprise its own active cooling element, but is itself cooled passively or via external cooling. This power device, for example, is itself housed in a housing of the first circuit board and is preferably connected to the housing by means of a thermally conductive material with high thermal conductivity, i.e., a high heat transfer coefficient. In this case, the housing of the power device can be brought into direct or indirect thermally conductive contact with a corresponding cooling line, or is brought into such contact during operation.Otherwise, i.e. without a housing, the power device itself can be brought into direct or indirect heat-conducting contact with a corresponding cooling line or can be brought into such contact during operation.

[0009] It should be noted that a thermally conductive contact considered technically relevant here has a heat transfer coefficient that enables heat transfer that is (preferably significantly) greater than that achieved solely by (passive or forced) convection and thermal radiation. For example, an achievable heat transfer coefficient of the thermally conductive contact is at least 1 W / m 2 K [one watt per square meter and Kelvin] up to 30 W / mK, preferably at 3 W / m 2 K to 10 W / m 2 K.

[0010] It should also be noted that the corresponding encapsulated cooling line is preferably not a component of the printed circuit board system, but rather an integral component of an external device, for example, a thermal management system, preferably of a motor vehicle. Alternatively or additionally, such a cooling line is a component of the printed circuit board system, a subrack, and / or (at least during initial assembly) can be connected to an external device, for example, a thermal management system, or can be integrated into it and integrated during operation. Alternatively or additionally, the cooling line and / or another provided cooling device that can be brought into thermally conductive contact with the power device (and brought into operation) is a so-called heat pipe (also referred to as a heat pipe).

[0011] To establish the thermally conductive contact, the first circuit board must be moved relative to the second circuit board, and especially relative to the corresponding encapsulated cooling line, in a joining direction. In one embodiment, this joining direction is one-dimensional, for example, in the z-direction in a Cartesian coordinate system, while the first circuit board has its (largest) areal extent in the x-direction and y-direction. Alternatively, a multi-dimensional movement is necessary, for example, including one or more tilting movements.

[0012] Here, it is proposed that the (first) terminal of the first circuit board and the (second) terminal of the second circuit board can be connected to each other in a spatially variable manner, such that a predetermined and secure communication connection is established during (especially mobile) operation. The spatial variability is at least configured such that a double fit with regard to the tolerance for efficient thermally conductive contact and the tolerance for secure electronic communication during operation do not conflict with each other or form a tolerance chain.

[0013] This ensures, on the one hand, sufficient and designed-for heat transfer from the power device to the corresponding cooling line during assembly, and, on the other hand, disassembly for maintenance is safe and simplified compared to previously known solutions. The boundary conditions for the required secure electronic communication between the first circuit board and the second circuit board can be met, even for a mobile application such as in a motor vehicle.

[0014] It is further proposed in an advantageous embodiment of the printed circuit board system that a plastically deformable thermally conductive material, preferably a thermally conductive paste and / or a thermally conductive pad, is arranged between the power device of the at least one first printed circuit board and the corresponding cooling line.

[0015] Particularly good heat transfer can be achieved when there are as few gaps as possible and the largest possible heat-conducting contact is established using a solid or pasty material (with the highest possible thermal conductivity coefficient and low thermal resistance). For this purpose, a plastically (and optionally also elastically) deformable thermally conductive material is preferably provided between the power device (or its housing and / or another component) and the corresponding cooling line. This material can be molded with high precision and permanently nestled into the gap between the respective cooling line and the power device. Particularly efficient heat conduction can be achieved using a thermal paste. Easier handling can be achieved using a thermal pad.However, combinations and / or other thermal conduction materials, such as adhesives or adhesive tapes or soldering, can also be used.

[0016] It is further proposed in an advantageous embodiment of the printed circuit board system that the at least one first printed circuit board and the second printed circuit board are arranged perpendicular to one another.

[0017] A classic blade arrangement is proposed here, in which the at least one first circuit board is arranged like a cooling fin to the second circuit board. This arrangement has the advantage that the second circuit board is easy to assemble and disassemble, and the electronic connections of the circuit boards can be designed with minimal complexity.

[0018] It should be noted that a mechanical fastening of the first circuit board to the second circuit board is preferably accomplished by a separate component, for example by means of a clamping element, which, like the electronic connections, is indifferent at least within a sufficiently large tolerance for the heat-conducting contact of the power device with the corresponding cooling line.

[0019] It is further proposed in an advantageous embodiment of the printed circuit board system that the first terminal of the at least one first printed circuit board and / or the second terminal of the second printed circuit board comprises spring-loaded electronic contact elements.

[0020] Here, it is proposed that a spring-loaded, i.e., prestressed, electronic contact be formed during operation. The travel tolerance of such spring-loaded contact elements can be adjusted slightly larger than that for the thermally conductive contact. Preferably, the electrically conductive contact elements of the respective connection are themselves made of a material (e.g., containing a high copper content) and in a form (e.g., as a leaf spring) with sufficient elasticity, for example, as a copper leaf spring.

[0021] Alternatively or additionally, such an electronic contact element is plastically deformable for assembly. Preferably, additional securing of the relative position and / or sufficient elasticity to withstand external stress caused by vibrations and / or shocks during operation while maintaining secure electronic communication between the circuit boards is provided.

[0022] It is further proposed in an advantageous embodiment of the printed circuit board system that the first terminal of the at least one first printed circuit board and / or the second terminal of the second printed circuit board comprises rail-shaped electronic contact elements aligned in the joining direction.

[0023] Such a rail shape is particularly advantageous for a path-tolerant connection in a (single) joining direction because it is easy to manufacture and mechanically robust. In one embodiment, a spring, for example a leaf spring, is integrated into such a rail-shaped electronic contact element.

[0024] It should be noted that a rail-shaped contact element does not necessarily have a single joining direction and / or does not necessarily have to be free of kinks and curves along its length in the mounting direction. Such a rail-shaped electronic contact element is preferably aligned (approximately or exactly) along a (not necessarily straight) joining path and is particularly preferably configured to guide the complementary electronic contact element.

[0025] It is further proposed in an advantageous embodiment of the printed circuit board system that the joining direction of two adjacent first printed circuit boards is aligned opposite to each other and the respective corresponding second terminals of the second printed circuit board are aligned correspondingly mirrored to each other.

[0026] In this embodiment, a cooling line is preferably in thermally conductive contact from two sides with the respective power device of two or more (first) printed circuit boards. For a cost-efficient design, the second terminals and / or the first terminals are preferably formed as separate structural units and are always connected in the same way to the corresponding printed circuit board. To ensure efficient utilization of the surface of the respective cooling line, at least the (second) terminals of the second printed circuit board, each of which is assigned to (at least) a common cooling line, are connected in a mirrored arrangement. This takes into account the opposing orientation (of at least part of) the joining direction (or more complex joining path). At the same time, however, identical components can also be used, thus achieving cost advantages due to economies of scale.

[0027] According to a further aspect, a subrack for a motor vehicle is proposed, comprising at least the following components: - at least one printed circuit board system according to an embodiment as described above; and - at least one cooling line for conducting a cooling fluid to dissipate waste heat from the power device of the printed circuit board system, wherein at least the first printed circuit boards are in heat-conducting contact with the cooling line, wherein the cooling line is preferably connectable to a thermal management system such that the at least one power device can be cooled by means of the thermal management system.

[0028] Here, a subrack (also referred to as a rack) is proposed which comprises one or more printed circuit board systems, preferably a single printed circuit board system with a single second printed circuit board and a plurality of first printed circuit boards. At least one cooling line is provided, which in one embodiment is part of a thermal management system or can be connected to it (at least during initial assembly) or integrated into it. The at least one cooling line is preferably configured to carry a cooling fluid, for example, cooling oil, cooling water (preferably mixed with de-icing agent such as glycol), coolant, or a cooling emulsion. Alternatively or additionally, a cooling line and / or a further cooling device is provided, for example, designed as a so-called heat pipe (also referred to as a heat pipe).

[0029] The thermal management system is configured, for example, for cooling and preferably also for heating multiple functional components of a motor vehicle, for example, a component of a drive system (e.g., an internal combustion engine, an electric drive motor, a high-voltage battery, a pulse-controlled inverter, and / or a transport cell). In one embodiment, a separate cooling circuit is provided for the subrack. Alternatively, the subrack is arranged in series or parallel with other functional components of the respective motor vehicle in a common cooling circuit and can be cooled or heated by the thermal management system.

[0030] The subrack proposed here enables secure electronic communication, especially in the mobile operation of a motor vehicle, and at least one power device can be efficiently cooled. At the same time, easy assembly and maintenance, including the replacement of (initial) printed circuit boards, are achieved.

[0031] According to a further aspect, a motor vehicle is proposed, comprising a transport cell, a drive system, at least one drive wheel, a thermal management system and an electronic control device, wherein the electronic control device comprises at least one module carrier that can be cooled by means of the thermal management system according to an embodiment according to the above description.

[0032] Here, a motor vehicle, for example a passenger car or truck or an autonomous means of transport, is proposed, in which a drive system (comprising, for example, an internal combustion engine and / or an electric drive motor and a high-voltage battery) for propelling the motor vehicle is movable via at least one drive wheel (for example two or four drive wheels). These functional components and one (or a plurality of) electronic control devices can be cooled by means of a (preferably common) thermal management system, and preferably also heated. The control device comprises at least one subrack (also referred to as a rack) that can be cooled by means of the thermal management system as described above. It is not excluded that the at least one subrack cannot also be cooled by means of at least one further cooling device.

[0033] With the motor vehicle proposed here, including a control device with at least one subrack, secure electronic communication can be achieved during mobile operation of the motor vehicle, and the at least one power device can be efficiently cooled. At the same time, easy assembly and maintenance, including the replacement of (first) printed circuit boards, is achieved.

[0034] The invention described above is explained in detail below against the relevant technical background with reference to the accompanying drawings, which show preferred embodiments. The invention is in no way limited by the purely schematic drawings, whereby it should be noted that the drawings are not to scale and are not suitable for defining proportions. It is shown in Fig. 1: a conventional printed circuit board system in a conventional subrack in a schematic sectional view; Fig. 2: a printed circuit board system in a subrack in a schematic sectional view in a first embodiment during an assembly process; Fig. 3: the printed circuit board system according to Fig. 2 in assembled state; Fig. 4: a printed circuit board system with a spring-loaded first contact element in a subrack in a schematic sectional view in a second embodiment; Fig. 5: a section of a printed circuit board system at the connections according to the second embodiment in a perspective detailed view; Fig. 6: a printed circuit board system with a spring-loaded first contact element in a subrack in a schematic sectional view in a third embodiment; Fig. 7: a printed circuit board system with a spring-loaded first contact element in a subrack in a schematic sectional view in a fourth embodiment; and Fig. 8: a motor vehicle with a control device with a module carrier.

[0035] In Fig. 1 shows a conventional printed circuit board system 20 in a conventional subrack 21 in a schematic sectional view, as is known from the prior art. The printed circuit board system 20 comprises a first printed circuit board 3 and a second printed circuit board 6, wherein the first printed circuit board 3 comprises a first conventional connection 22 and the second printed circuit board 6 comprises a second conventional connection 23. The two printed circuit boards 3, 6 are arranged perpendicular to one another here. The conventional connections 22, 23 are configured for electronically connecting the two printed circuit boards 3, 6 in a communicative manner. The first printed circuit board 3 here comprises a power device 5, for example a processor, a memory unit and / or a boost converter.The power device 5 is configured by means of the first circuit board 3 and its first conventional connection 22 for communication or data exchange via the second conventional connection 23 with the second circuit board 6.

[0036] The power device 5 is enclosed in a housing 24 to protect it from contamination and / or mechanical damage. It should be noted that the power device 5 comprises one or more power components. Not necessarily, but preferably, all power components are enclosed and / or preferably directly or indirectly in heat-conducting contact with the cooling line 8.

[0037] When used in a motor vehicle 2, the conventional printed circuit board system 20 is subject to vibrations and shocks, such as those that occur in a motor vehicle 2 while driving, and must therefore be mechanically secured. During operation, the power device 5 generates waste heat, which must be dissipated to ensure proper operation. Heat is dissipated by means of (in this embodiment, two layers of) thermally conductive material 10, for example, thermal paste and / or thermally conductive pad, which here are in direct contact with the power device 5 and the housing 24 or in direct contact with the housing 24 and a cooling line 8 of a thermal management system 15 of the conventional subrack 21.A cooling fluid 14, such as cooling oil, cooling water (preferably mixed with a de-icing agent such as glycol), refrigerant, or a cooling emulsion, is circulated within the cooling system. The waste heat generated by the power device 5 can thus be transported away by the cooling fluid 14 in the cooling line 8.

[0038] The two conventional connections 22, 23 are to be brought into contact with each other to the left, as shown here. The first circuit board 3 is to be moved relative to the second circuit board 6 along the joining direction 9 shown (upward as shown) until the upper thermally conductive material 10 (preferably under elastic and / or plastic deformation) is in direct thermally conductive contact with the cooling line 8. This distance is subject to fluctuations due to tolerances and contradicts the requirements for the conventional connections 22, 23. Thus, the connections 22, 23 may be (pre-)loaded with a moment, and under certain circumstances, the thermally conductive connection between the power device 5 of the first circuit board 3 and the cooling line 8 may be impaired during operation due to vibrations and / or shocks.

[0039] In Fig. Figure 2 shows a circuit board system 1 in a subrack 13 in a schematic sectional view in a first exemplary embodiment during an assembly process. For the sake of clarity and better understanding, the circuit board system 1 is largely identical to the circuit board system shown in Fig. 1. Only the differences will be discussed below. In this exemplary embodiment, the two printed circuit boards 3, 6 of the printed circuit board system 1 also comprise a first connection 4 and a second connection 7, respectively, the second connection 7 being L-shaped here and the second connection 7 correspondingly U-shaped. Both connections 4, 7 with their corresponding contact elements 11, 12 are designed to be conductive over a length which corresponds at least to the tolerance for establishing the heat-conducting contact between the power device 5 of the first printed circuit board 3 and the cooling line 8. It should be noted that the contact elements 11, 12 are designated here purely by way of example on one (complementary) side of the connections 4, 7 each. Alternatively or additionally, the contact elements 11, 12 are arranged on the other side of the connections 4, 7 (complementary to one another).However, the contact elements 11,12 extend in the joining direction 9 (compare . Fig. 3).

[0040] During assembly, the first circuit board 3 with the power device 5 and the housing 24 as well as the thermally conductive materials 10 is first inserted along the insertion direction 31 (horizontally as shown) relative to the already (pre-) assembled second circuit board 6. Subsequently, the first circuit board 3 is inserted as shown in Fig. 3 is moved upwards, i.e., vertically, as shown. This brings the terminals 4, 7 into contact with each other, and also brings the power device 5 of the first circuit board 3 into thermally conductive contact with the cooling line 8.

[0041] In Fig. 3, the printed circuit board system 1 is in a subrack 13 according to Fig. 2 shown in assembled condition. In contrast to Fig. 2, the first printed circuit board 3 is inserted vertically along the joining direction 9 into the printed circuit board system 1, as shown, such that the two terminals 4, 7 are in electronically communicating contact, and the power device 5 is in thermally conductive contact with the cooling line 8 of the subrack 13. Due to the L-shaped and U-shaped configurations of the first terminal 4 and the second terminal 7, respectively, local variability in the joining direction 9 is achieved. The local variability is configured such that a double fit with regard to the tolerance for efficient thermally conductive contact and a tolerance for reliable electronic communication during operation do not conflict with each other, nor do they form a tolerance chain.Thus, on the one hand, a sufficient or design-compliant heat transfer from the power device 5 to the corresponding cooling line 8 is ensured during assembly and, on the other hand, disassembly for maintenance is safe and, in comparison to previously known solutions (cf. Fig. 1) simplified.

[0042] In Fig. 4 shows a circuit board system 1 with at least one spring-loaded first contact element 11 in a subrack 13 in a schematic sectional view in a second exemplary embodiment. The circuit board system 1 is also largely identical to the circuit board system shown in Fig. 2. Only the differences will be discussed below. In this second exemplary embodiment, the two circuit boards 3, 6 of the circuit board system 1 also comprise a first connection 4 and a second connection 7, respectively, wherein the second connection 7 is equipped here with one or a plurality of rail-shaped (second) electronic contact elements 12 and the first connection 4 comprises one or a plurality of corresponding spring-loaded electronic (first) contact elements 11. In this exemplary embodiment, the electrically conductive first contact element 11 of the relevant (first) connection 4 is itself made of a material (for example containing a high copper content) and in a shape (here as a leaf spring) with sufficient elasticity.Additional securing of the relative position and / or sufficient elasticity for external stress caused by vibrations and / or shocks during operation is provided while maintaining secure electronic communication between the circuit boards 3, 6. By means of the at least one rail-shaped second contact element 12, a path-tolerant connection in the joining direction 9 can be achieved, and in combination with the at least one first corresponding contact element 11, robust electrical communication between the circuit boards 3, 6 can be achieved.

[0043] In Fig. Figure 5 shows a section of a printed circuit board system 1 at the terminals 4, 7 according to the second exemplary embodiment in a perspective detailed view. Here, a specific exemplary embodiment of the terminals 4, 7 of the first printed circuit board 3 and the second printed circuit board 6 is shown. The two printed circuit boards 3, 6 are arranged perpendicular to one another. The first terminal 4 comprises a plurality of electrically conductive (first) contact elements 11, which, by means of forming, form a spring-loaded, electrically conductive contact with the complementary (here rail-shaped) second contact elements 12 of the second terminal 7.From the first (here purely illustratively and possibly simplified four) contact elements 11, a prestress is applied to the second contact elements 12, so that a path-tolerant connection in the joining direction 9 (approximately vertical as shown) and electronic communication between the two printed circuit boards 3, 6 that is robust against vibrations and shocks is ensured.

[0044] In Fig. 6 shows a circuit board system 1 with a spring-loaded first contact element 11 in a subrack 13 in a schematic sectional view in a third exemplary embodiment. The circuit board system 1 is also largely identical to the circuit board system shown in Fig. 2 to Fig. 4. Only the differences will be discussed below. In this third embodiment, the electrically conductive (first) contact element 11 of the respective terminal 4 is pre-tensioned by a helical compression spring against the complementary second contact element 12 of the second terminal 7. Functionally, the same is achieved as in Fig. 5 shown and described.

[0045] In Fig. 7 shows a circuit board system 1 with a spring-loaded first contact element 11 in a subrack 13 in a schematic sectional view in a fourth exemplary embodiment. The circuit board system 1 is also largely identical to the circuit board system shown in Fig. 2 to Fig. 6. Only the differences will be discussed below. In this fourth embodiment, the second printed circuit board 6 of the printed circuit board system 1 comprises a first terminal 4 with a Fig. 6, preloaded by a helical compression spring. The complementary second contact element 12 is arranged here in a U-shaped (second) connection 7. An offset in the joining direction 9 can be compensated for by the mobility of the helical compression spring transversely to its spring axis (oriented horizontally as shown).

[0046] In Fig.8 shows a schematic plan view of a motor vehicle 2 with a control device 19 having a subrack 13. The motor vehicle 2 is depicted here purely optionally as a passenger car. Depending on the design of the motor vehicle 2, at least one person (and / or cargo) can be transported within a transport cell 16. The motor vehicle 2 is actively movable by means of a drive system 17 comprising (here purely optionally two) electric drive motors 26 and a high-voltage battery (not depicted here) for propelling the motor vehicle 2 via the (here purely optionally four) drive wheels 18. In this exemplary embodiment, the drive system 17 comprises a transmission 27 and a differential 28 at least on the front axle (on the left as shown). These functional components and one (or a plurality of) electronic control devices 19 can here purely optionally be cooled and / or heated by means of a common thermal management system 15.A control device 19 comprises at least one module carrier 13 (also referred to as a rack), as described above, which can be cooled by means of the thermal management system 15. The control device 19 is configured, for example, for partially autonomous or (fully) autonomous driving of the motor vehicle 2 and, at least in this case, is communicatively connected to the drive system 17. Alternatively or additionally, the thermal management system 15 and / or other components of the motor vehicle 2 can preferably be controlled or regulated by means of the control device 19.

[0047] The subrack 13 (or its at least one power device 5) can be cooled (or heated) by means of at least one cooling line 8, which in this exemplary embodiment is integrated into the thermal management system 15 purely optionally. The cooling line 8 is configured to carry a cooling fluid 14, for example a cooling oil, cooling water, refrigerant, or a cooling emulsion, which is pumped by a pump 25 through the lines and also the cooling line 8 of the subrack 13. In this exemplary embodiment, the cooling power in the cooling line 8 can be regulated and / or switched on and off by means of a purely optionally provided control valve 30 (and a check valve 29).

[0048] The circuit board system proposed here enables secure electronic communication during mobile operation of the motor vehicle, while efficiently cooling the power components. At the same time, easy assembly, maintenance, and replacement of (initial) circuit boards are achieved. List of reference symbols 1 PCB system 2 motor vehicles 3 first circuit board 4 first connection 5 Power facility 6 second circuit board 7 second connection 8 Cooling line 9 Joining direction 10 Thermal conductive material 11 first contact element 12 second contact element 13 subracks 14 Cooling fluid 15 Thermal management system 16 Transport cell 17 Drive system 18 Drive wheel 19 Control device 20 conventional circuit board system 21 conventional subrack 22 first conventional connection 23 second conventional connection 24 housings 25 Pump 26 drive machine 27 gearboxes 28 Differential 29 Check valve 30 Control valve 31 Insertion direction

Claims

[1] Printed circuit board system (1) connectable to an encapsulated cooling system for a motor vehicle (2), comprising at least the following components: - at least one first circuit board (3) with an electronic first terminal (4) and an electronic power device (5); - a second circuit board (6) with at least one electronic second terminal (7); wherein the first circuit board (3) and the second circuit board (6) can be connected to one another in a communicative manner by means of their corresponding electronic connections (4, 7), and wherein the power device (5) of the at least one first printed circuit board (3) can be brought into at least indirect heat-conducting contact with a corresponding encapsulated cooling line (8), characterized by , that the first connection (4) and the corresponding second connection (7) can be connected to one another in a spatially variable manner at least in one joining direction (9) for the heat-conducting contact between the power device (5) and the corresponding cooling line (8). [2] Printed circuit board system (1) according to claim 1, wherein a plastically deformable thermally conductive material (10), preferably a thermally conductive paste and / or a thermally conductive pad, is arranged between the power device (5) of the at least one first printed circuit board (3) and the corresponding cooling line (8). [3] Printed circuit board system (1) according to claim 1 or claim 2, wherein the at least one first printed circuit board (3) and the second printed circuit board (6) are arranged perpendicular to each other. [4] Printed circuit board system (1) according to one of the preceding claims, wherein the first terminal (4) of the at least one first printed circuit board (3) and / or the second terminal (7) of the second printed circuit board (6) comprises spring-loaded electronic contact elements (11). [5] Printed circuit board system (1) according to one of the preceding claims, wherein the first terminal (4) of the at least one first printed circuit board (3) and / or the second terminal (7) of the second printed circuit board (6) comprises rail-shaped electronic contact elements (12) aligned in the joining direction (9). [6] Printed circuit board system (1) according to one of the preceding claims, wherein the joining direction (9) of two adjacent first printed circuit boards (3) are aligned opposite to each other and the respectively corresponding second terminals (7) of the second printed circuit board (6) are aligned correspondingly mirrored to each other. [7] Subrack (13) for a motor vehicle (2), comprising at least the following components: - at least one printed circuit board system (1) according to one of the preceding claims; and - at least one cooling line (8) for conducting a cooling fluid (14) for dissipating waste heat from the power device (5) of the printed circuit board system (1), wherein at least the first printed circuit boards (3) are in heat-conducting contact with the cooling line (8), wherein preferably the cooling line (8) is connectable to a thermal management system (15) such that the at least one power device (5) can be cooled by means of the thermal management system (15). [8] Motor vehicle (2), comprising a transport cell (16), a drive system (17), at least one drive wheel (18), a thermal management system (15) and an electronic control device (19), wherein the electronic control device (19) comprises at least one module carrier (13) according to claim 7, which can be cooled by means of the thermal management system (15).

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