Power module with features to minimize base plate movement

Abstract

A power module comprises a base plate and a housing. The base plate includes a first surface with multiple openings. The housing includes a first surface facing the first surface of the base plate and multiple pins protruding from this first surface. Each pin of the housing engages a corresponding opening in the base plate. A first pin of the housing engages a first opening in the base plate and is configured to minimize lateral movement of the base plate relative to the housing. A second pin of the housing engages a second opening in the base plate and is configured to minimize rotation of the base plate around the first pin.

Description

background

[0001] The demand for electronic modules for power applications, commonly referred to as power modules, continues to rise rapidly across a wide range of industries, including automotive, consumer electronics, renewable energy, manufacturing, and medical technology, among many others. Advances in semiconductor materials such as silicon carbide (SiC) and gallium nitride (GaN) have enabled the production of such power modules with advantageous features, including smaller footprints, higher voltage and current capabilities, and faster switching speeds. Many applications have specific dimensional requirements for the power module (e.g., external dimensions, feature orientation, etc.). In some cases, meeting these dimensional requirements necessitates tighter tolerances during power module manufacturing, potentially increasing manufacturing complexity and / or costs.

[0002] Therefore, there is a need for a solution that allows the power module to be manufactured with looser tolerances, while still meeting the dimensional requirements of applications that use the power module. Brief description

[0003] According to one embodiment of a power module, the power module comprises: a base plate comprising a first surface with a plurality of openings; and a housing comprising a first surface facing the first surface of the base plate and a plurality of pins projecting from the first surface, each of the pins of the housing being inserted into a respective opening of the base plate, wherein a first pin of the housing being inserted into a first opening of the base plate and being configured to minimize lateral movement of the base plate relative to the housing, and wherein a second pin of the housing being inserted into a second opening of the base plate and being configured to minimize rotation of the base plate about the first pin.

[0004] According to one embodiment of a power module, the power module comprises: a base plate comprising a first surface with a plurality of openings; and a housing comprising a first surface facing the first surface of the base plate and a plurality of pins projecting from the first surface, each of the pins of the housing being inserted into a respective opening of the base plate, wherein a first pin of the housing being inserted into a first opening of the base plate, the first opening being configured to minimize lateral movement of the base plate relative to the housing, and wherein a second pin of the housing being inserted into a second opening of the base plate, the second opening being configured to minimize rotation of the base plate about the first pin.

[0005] The expert will recognize additional features and advantages upon reading the following detailed description and upon examining the accompanying drawings. Brief description of the characters

[0006] The elements in the drawings are not necessarily to scale relative to each other. Identical reference numerals denote corresponding similar parts. The features of the various illustrated embodiments can be combined, provided they are not mutually exclusive. Embodiments are shown in the drawings and are described in detail in the following description. Fig. Figure 1A illustrates a disassembled perspective view of a power module according to one embodiment. Fig. Figure 1B illustrates a perspective view of a power module according to one embodiment. Fig. 2A and Fig. Figure 2B illustrates bottom top views of a power module according to embodiments. Fig. Figures 3A-3C illustrate bottom top views of a power module according to embodiments. Detailed description

[0007] This document describes a power module comprising a housing and a base plate, which are connected by inserting pins from the housing into openings in the base plate. Two of the pins and / or the respective openings into which they are inserted are designed with different dimensions, characteristics, etc., than the other pins / openings, such that these two pins and / or their respective openings minimize the movement of the base plate relative to the housing.In this way, the alignment requirements between the housing and the base plate for a given application of the power module can be met by designing only these pins and their respective openings to the tolerances required to meet the alignment requirements, thereby allowing the rest of the pins and their respective openings to be designed with looser tolerances, and potentially providing a simpler, more cost-effective method for manufacturing the power module.

[0008] Next, with reference to the figures, exemplary embodiments of the power module are described, featuring characteristics configured to minimize the movement of the base plate relative to the housing.

[0009] Fig. Figure 1A illustrates an exploded perspective view of a power module 100 according to one embodiment. The power module 100 comprises a base plate 110, a housing 120, a substrate 130, and a power semiconductor chip 140. The base plate 110 includes a first surface 110 S1 with a multitude of openings 112. In this example, each of the openings 112 extends through the base plate 110 to a second surface 110 S2 , the first surface 110 S1 opposite, although this is not a requirement. That is, one or more of the openings 112 may only partially extend through the base plate 110. Each of the openings 112 is located in a recessed section of the second surface 110. S2 positioned, although this is not a requirement either. The housing 120 includes a multitude of pins 122, which consist of a first surface 120 S1 stand out. The first surface 120 S1The first surface of the casing is 110 S1 facing the base plate 110.

[0010] The base plate 110 can be made of any suitable material, e.g., a metal or metal alloy with high thermal conductivity such as copper (Cu), aluminum (Al), AlCu, etc., to facilitate heat dissipation through the power module 100. Although in Fig. Not illustrated in Figure 1A, the base plate 110 may include protruding features (e.g., pins, ribs, etc.) that extend beyond the second surface 110. S2 are distributed and extend from the second surface 110 S2 extend, e.g. in the -z-direction of Fig. 1A. Such features can improve heat dissipation through the power module 100, for example by positioning it in a chamber of a cooling system to which the power module 100 is mounted.

[0011] The enclosure 120 can be a frame enclosure. A frame enclosure can comprise one or more pieces of metal, plastic, composite material, and / or another suitable material that are structured and arranged (e.g., connected to the base plate 110) to enclose the substrate 130 and the power semiconductor chip 140. In some examples, the enclosure 120 is a molded enclosure formed from a molding compound. A molding compound is a plastic encapsulating material typically composed of an organic resin, such as an epoxy resin. The plastic encapsulating material may include fillers, such as non-melting inorganic materials. Catalysts may be used to accelerate the curing reaction of the organic resin. Other materials, such as flame retardants, adhesion promoters, ion traps, stress relievers, dyes, etc., may optionally be added to the plastic encapsulating material.The molding compound can be formed by injection molding, compression molding, film-assisted molding (FAM), reaction injection molding (RIM), resin transfer molding (RTM), blow molding, etc.

[0012] The posts 122 of the housing can be formed from the same material as the rest of the housing 120 or from a different material. For example, the posts 122 can be formed integrally with the rest of the housing 120. In another example, the posts 122 can be formed separately from the rest of the housing 120 and attached to the housing 120, inserted into openings in the housing 120, partially embedded in the housing 120, etc. In some examples, the posts 122 are configured to dissipate heat to the base plate 110. Although the posts 122 are illustrated here as having a circular cylindrical shape, other shapes of the posts 122 are also considered (e.g., square, rectangular, hexagonal, triangular, etc.).

[0013] Examples of substrate 130 include a DCB (direct copper bonding) or AMB (active metal braze) substrate, a printed circuit board (PCB), a conductor frame, or another substrate, such as an insulated metal substrate (IMS), etc. Substrate 130 may include one or more insulating layers and / or metallization layers. An insulating layer may be a ceramic, a polymer such as polyimide, etc. A metallization layer may be copper, aluminum, an alloy, etc., and may include one or more conductor tracks and / or contact pads. In some examples, a metallization layer may be configured to bond with another component (e.g., the base plate 110).

[0014] The power semiconductor chip 140 can include one or more devices, including transistors, diodes, resistors, capacitors, and / or other types of active or passive devices. In some examples, the power semiconductor chip 140 is a vertical power semiconductor chip (e.g., a vertical power transistor chip). For a vertical power transistor chip, the primary current flow path is located between the front and back faces of the power semiconductor chip 140 (along the z-direction). Fig. 1A). In one embodiment, the power semiconductor chip 140 is a SiC transistor chip, such as a SiC power MOSFET (metal-oxide-semiconductor field-effect transistor) chip. The power semiconductor chip 140 can be a Si power MOSFET chip, HEMT (high-electron mobility transistor) chip, IGBT (insulated-gate bipolar transistor) chip, JFET (junction field-effect transistor) chip, etc.

[0015] Although not specifically illustrated, the power module 100 may include one or more additional substrates 130 and / or additional power semiconductor chips 140. The substrates 130 may all be of a similar or identical design, or some or each of the substrates 130 may have different designs. Likewise, the power semiconductor chips 140 may all be of a similar or identical design (e.g., device type, structure, materials, dimensions, etc.), or some or each of the power semiconductor chips 140 may have different designs. Various arrangements and designs of the power semiconductor chip(s) 140 and the substrate(s) 130 within the power module 100 are considered.The power semiconductor chip(s) 140 and / or their component parts can be arranged to form all or part of a power electronics circuit, such as a DC / AC inverter, a DC / DC converter, an AC / DC converter, an AC / AC converter, a multiphase inverter, an H-bridge, a motor driver, etc. In some examples, a power electronics circuit incorporating the power semiconductor chip(s) 140 is a half-bridge or full-bridge circuit.

[0016] Fig. Figure 1B illustrates a perspective view of the power module 100 according to one embodiment. In particular, it illustrates Fig. 1B the power module 100 in an assembled state. The power module 100 can be assembled by attaching the power semiconductor chip 130 to the substrate 140 (e.g. by soldering, diffusion soldering, brazing, gluing, etc.) and connecting the housing 120 to the base plate 110, such that the base plate 110 and the housing 120 define an interior space of the power module 100 in which the power semiconductor chip 130 and the substrate 140 are enclosed (not illustrated).

[0017] The housing 120 is connected to the base plate 110, such that each of the pins 122 of the housing 120 is inserted into a corresponding opening 112 of the base plate 110. A first pin 1221 of the housing 120 is inserted into a first opening 1121 of the base plate 110. A second pin 1222 of the housing 120 is inserted into a second opening 1122 of the base plate 110. A remainder of the pins 122 Rincludes all of the multiple pins 122 except for the first pin 1221 and the second pin 1222. In this example, the remaining pins 122 R two pens 122 R , although any number of remaining pins 122 R Each pin 122 of the housing 120 is inserted into a respective opening 112, such that the pin 122 extends through the base plate 110 and a distal end 122 E of the pen 122 over the second surface 110 S2 extends beyond the base plate 110 (e.g. in the -z direction of Fig. 1B). In some examples, the volume of each of the first pen is 1221, of the second pen 1222, and of each of the remaining pens 122. R approximately the same.

[0018] According to one embodiment, the first pin 1221 and / or the first opening 1121 are configured to minimize lateral movement of the base plate 110 relative to the housing 120 (e.g., lateral movement in the x and / or y direction). According to another embodiment, the second pin 1222 and / or the second opening 1122 are configured to minimize rotational movement of the base plate 110 about the first pin 1221. As discussed, minimizing the lateral and rotational movement of the base plate 110 relative to the housing 120 with the configurations of the first and second pins 1221 and 1222 and / or the first and second openings 1121 and 1122 can provide a simpler, more cost-effective method for manufacturing the power module 100.

[0019] If the pins 122 are made of a deformable material, the housing 120 can be deformed by deforming the distal end 122. EThe pins 122 are attached to the base plate 110. If the pins 122 are made of a plastic material, such as a molding compound, for example, the distal end 122 E The pins 122 can be deformed by heating, pressure, ultrasonic welding, etc. The deformed distal end 122 E The pins 122 have a wider lateral dimension than the base plate opening 112, which ensures that the pins 122 do not pull out of the openings 112.

[0020] Fig. 2A and Fig. Figure 2B illustrates bottom top views of the power module 100 according to embodiments. Fig. 2A and Fig. Figure 2B illustrates examples where the first pin 1221 is configured to minimize lateral movement of the base plate 110 relative to the housing 120, and the second pin 1222 is configured to minimize rotation of the base plate 110 about the first pin 1221.

[0021] As in Fig. As illustrated in 2A, the first opening 1121 has a width w 112,1 and the second opening 1122 has a width w 112,2 on. The first pin 1221 has a width w 122,1 and the second pin 1222 has a width w 122,2 up. A pen 122 R of the remaining 122 pens R has a width w 122 open and is in a respective opening 112 with a width w 112 used. The width w 122,1 the first pin 1221 is larger than the width w 122 of the pen 122 R Similarly, the width w 122,2 of the second pin 1222 greater than the width w 122 of the pen 122 R . If this configuration of the housing 120 is combined with an example of the base plate 110, where the widths w 112,1 , w 112,2 and w 112Since the openings 1121, 1122 and 112 are similar to each other, a tighter tolerance results between the first pin 1221 and the first opening 1121 and between the second pin 1222 and the second opening 1122 compared to the tolerance between the pin 122 R with a width w 122 and the respective opening 112 into which it is inserted. In examples where the others of the remaining pins 122 RSince the pins 122 exhibit similar or even greater tolerances with the respective openings 112 into which they are inserted, any movement of the base plate 110 relative to the housing 120 (e.g., lateral and rotational movement in the x and / or y direction) is minimized by the first pin 1221 and the second pin 1222. In this way, the alignment requirements between the housing 120 and the base plate 110 can be met by designing only two of the pins 122, in particular the first pin 1221 and the second pin 1222, and their respective base plate openings 1121 and 1122 with the required tolerances, thus allowing the remaining pins 122 R and their respective openings 112 are designed with looser tolerances, and potentially a simpler, more cost-effective method for manufacturing the power module 100 is provided.

[0022] Fig. Figure 2B illustrates an example of the power module 100, where the first pin 1221 of the housing 120 comprises a first set of motion constraint features 1241, and the second pin 1222 of the housing 120 comprises a second set of motion constraint features 1242. Each of the first set of motion constraint features 1241 extends from a surface 122 1,S of the first pen 1221 to a surface 112 1,S , which defines the first opening 1121. In this example, each of the first set of motion restriction features 1241 extends from the surface 122. 1,S of the first pin 1221 radially outwards. Likewise, each of the second plurality of motion-limiting features 1242 extends from a surface 122 2,S of the second pen 1222, in this example from surface 122 2,S radially outwards, towards a surface 112 2,S, which defines the second opening 1122. Each of the motion-restricting features of the first variety 1241 and the second variety 1242 can be a rib or other projection and can extend along part or even the entire length of the respective pin 1221 and 1222. While the illustrated second variety of motion-restricting features 1242 has fewer motion-restricting features than the first variety of motion-restricting features 1241, this is only an example and not a requirement.

[0023] As in the example of Fig. 2A describes the movement of the base plate 110 relative to the housing 120 in the example of Fig. 2B is minimized by the first pin 1221 and the second pin 1222. However, in this example, the motion constraint features 1241 and 1242 of the first pin 1221 and the second pin 1222, respectively, minimize the movement of the base plate 110 relative to the housing 120. In particular, the width w 122,1 of the first pen 1221, which in this example are connected by ends 124 1,E the first set of movement restriction features 1241 is defined as being greater than the width w 122 of the pen 122 R of the remaining 122 pens R The width w 122,2 of the second pin 1222, which in this example are connected by ends 124 2,E The second set of movement restriction features defined in 1242 is greater than the width w 122 of the pen 122 R of the remaining 122 pens R As in the example of Fig. 2A, when this configuration of the housing 120 is connected to an example of the base plate 110, where the widths w 112,1 , w 112,2 and w 112 Since the openings 1121, 1122 and 112 are similar to each other, a tighter tolerance results between the first pin 1221 (in particular the first plurality of movement restriction features 1241) and the first opening 1121 and between the second pin 1222 (in particular the second plurality of movement restriction features 1242) and the second opening 1122 compared to the tolerance between the pin 122 R with a width w 122 and the respective opening 112 into which it is inserted. In examples where the others of the remaining pins 122 RSince the tolerances of the respective openings 112 into which they are inserted are similar, any movement of the base plate 110 relative to the housing 120 is thus minimized by the first plurality of movement limiting features 1241 of the first pin 1221 and the second plurality of movement limiting features 1242 of the second pin 1222.

[0024] In the example of Fig. 2B Each of the second set of motion-limiting features 1242 is oriented substantially perpendicular to an axis a extending between the first opening 1121 and the second opening 1122. Thus, as illustrated, the first set of motion-limiting features 1241 of the first pin 1221 minimizes lateral movement of the base plate 110 relative to the housing 120 (e.g., in the x and / or y direction), while the second set of motion-limiting features 1242 minimizes rotational movement of the base plate 110 about the first pin 1221 due to its orientation perpendicular to the axis a.

[0025] In this way, the alignment requirements between the housing 120 and the base plate 110 can be met by designing the dimensions, orientation, alignment, etc. of the motion-limiting features 1241 and 1242 of the first pin 1221 and the second pin 1222 respectively relative to their respective openings 1121 and 1122, thereby enabling the remaining pins 122 Rand their respective openings 112 can be designed with looser tolerances, potentially providing a simpler, more cost-effective method for manufacturing the power module 100. Additionally, instead of simply widening the first pin 1221 and the second pin 1222, the use of the motion-limiting features 1241 and 1242 can effectively loosen the alignment tolerance between the housing 120 and the base plate 110, since only portions of each of the first pin 1221 and the second pin 1222 (i.e., the first and second sets of motion-limiting features 1241 and 1242) need to meet the required tolerances.

[0026] Fig. Figures 3A-3C illustrate bottom top views of the power module 100 according to embodiments. Fig. Figures 3A-3C illustrate examples in which the first opening 1121 is configured to minimize lateral movement of the base plate 110 relative to the housing 120, and the second opening 1122 is configured to minimize rotation of the base plate 110 around the first pin 1221.

[0027] In the example of Fig. 3A are the width w 112,1 the first opening 1121 and the width w 112,2 the second opening 1122 smaller than the width w 112 the respective opening 112 into which the pin 122 R of the remaining 122 pens R is used. When this configuration of the base plate 110 is combined with an example of the housing 120, where the widths w 122,1 , w 122,2 and w 122 of the first pen 1221, of the second pen 1222 or of the pen 122 RSince they are similar to each other, a tighter tolerance results between the first pin 1221 and the first opening 1121 and between the second pin 1222 and the second opening 1122 compared to the tolerance between the pin 122 R and the respective opening 112 into which it is inserted. In examples where the others of the remaining pins 122 R Since the base plate 110 has similar tolerances with the respective openings 112 into which it is inserted, any movement of the base plate 110 relative to the housing 120 (e.g., a lateral and rotational movement in the x and / or y direction) is damped by the first pin 1221 and the second pin 1222 due to the widths w. 112,1 and w 112,2the first opening 1121 and the second opening 1122 are minimized. In this way, the alignment requirements between the housing 120 and the base plate 110 can be met by designing only two of the openings 112 of the base plate 110, in particular the first opening 1121 and the second opening 1122, and their respective pins 1221 and 1222 with the required tolerances, thus enabling the remaining pins 122 R and their respective openings 112 are designed with looser tolerances, and potentially a simpler, more cost-effective method for manufacturing the power module 100 is provided.

[0028] Fig. Figure 3B illustrates an example where the second opening 1122 of the base plate 110 has an elongated (e.g., elliptical) profile. In particular, the second opening 1122 of the base plate 110 has a profile that is elongated (e.g., elliptical). Fig. 3B a first width w 112,2,1, which is parallel to the axis a, which extends between the first opening 1121 and the second opening 1122, and a second width w 112,2,2 perpendicular to the axis a, where the first width w 112,2,1 greater than the second width w 112,2,2 is. Furthermore, the second width is w 112,2,2 the second opening 1122 smaller than the width w 112 the respective opening 112 into which the pin 122 R of the remaining 122 pens R is used. When this configuration of the base plate 110 is combined with an example of the housing 120, where the widths w 122,2 and w 122 of the second pen 1122 or of pen 112 R Being similar to each other, the second opening 1122 minimizes a rotational movement of the base plate 110 around the first pin 1221 due to its narrowed width w 112,2,2perpendicular to axis a. Forming the second opening 1122 with this configuration can reduce the alignment tolerance between the housing 120 and the base plate 110 compared to the example of the second opening 1122 from Fig. 3A effectively loosens, as only one dimension of the second opening 1122 has a tighter tolerance with the second pin 1222.

[0029] Fig. 3C illustrates an example of the power module 100, where the first opening 1121 of the base plate 110 contains a first plurality of motion restriction features 1141, and the second opening 1122 of the base plate 110 contains a second plurality of motion restriction features 1142. Each of the first plurality of motion restriction features 1141 extends from the surface 112 1,S , which defines the first opening 1121 of the base plate, to the surface 122 1,Sof the first pin 1221. Likewise, each of the second set of motion restriction features 1142 extends from the surface 112 2,S , which defines the second opening 1122 of the base plate 110, to the surface 122 2,S of the second pin 1222. Each of the movement-restricting features of the first variety 1141 and the second variety 1142 can be a rib or other projection and can extend along part or even the entire length of the respective surface 112 1,S and 112 2,S extend. While the illustrated second set of movement restriction features 1142 has fewer movement restriction features than the first set of movement restriction features 1141, this is only an example and not a requirement.

[0030] As in the example of movement restriction features 1241 and 1242 from Fig. 2B describes the movement of the base plate 110 relative to the housing 120 in the example of Fig. 3C is minimized by the motion restriction features 1141 and 1142. In this example, the width w 112,1 the first opening 1121, which was completed by ends 114 1,E the first set of movement restriction features is defined as 1141, smaller than the width w 112 the opening 112, into which the pin 122 R of the remaining 122 pens R is used. The width w 112,2 the second opening 1122, which is through ends 114 2,E The second set of movement restriction features defined in 1142 is smaller than the width w. 112 the opening 112, into which the pin 122 R of the remaining 122 pens R is used. When this configuration of the base plate 110 is combined with an example of the housing 120, where the widths w 122,1 , w 122,2 and w 122of the first pen 1221, of the second pen 1222 or of the pen 122 R Since they are similar to each other, a tighter tolerance results between the first pin 1221 and the first opening 1121 (in particular the first plurality of movement restriction features 1141) and between the second pin 1222 and the second opening 1122 (in particular the second plurality of movement restriction features 1142) compared to the tolerance between the pin 122 R and the respective opening 112 into which it is inserted. In examples where the others of the remaining pins 122 R Since the base plate 110 has similar tolerances to the respective openings 112 into which they are inserted, any movement of the base plate 110 relative to the housing 120 is minimized by the first set of movement limiting features 1141 of the first opening 1121 and the second set of movement limiting features 1142 of the second opening 1122.

[0031] In the example of Fig. 3C Each of the second set of motion-limiting features 1142 of the second opening 1122 of the base plate 110 is oriented substantially perpendicular to the axis a extending between the first opening 1121 and the second opening 1122. Thus, as illustrated, the first set of motion-limiting features 1141 of the first opening 1121 minimizes lateral movement of the base plate 110 relative to the housing 120 (e.g., in the x and / or y direction), while the second set of motion-limiting features 1142 of the second opening 1122 minimizes rotational movement of the base plate 110 about the first pin 1221 due to its orientation perpendicular to the axis a.

[0032] In this way, the alignment requirements between the housing 120 and the base plate 110 can be met by designing the dimensions, orientation, alignment, etc. of the motion-limiting features 1141 and 1142 of the first opening 1121 and the second opening 1122 respectively relative to their respective pins 1221 and 1222, thereby enabling the remainder of the openings 112 and the pins 122 Rwith looser tolerances, and potentially a simpler, more cost-effective method for manufacturing the power module 100 is provided. Additionally, the use of the motion-limiting features 1141 and 1142, instead of simply narrowing the first opening 1121 and the second opening 1122, can effectively loosen the alignment tolerance between the housing 120 and the base plate 110, since only portions of each of the first opening 1121 and the second opening 1122 (i.e., the first and second sets of motion-limiting features 1141 and 1142) need to meet the required tolerances.

[0033] Although the present revelation is not limited to this, the following numbered examples illustrate one or more aspects of the revelation.

[0034] Example 1. Power module comprising: a base plate comprising a first surface with a plurality of openings; and a housing comprising a first surface facing the first surface of the base plate and a plurality of pins projecting from the first surface, each of the pins of the housing being inserted into a respective opening of the base plate, a first pin of the housing being inserted into a first opening of the base plate and configured to minimize lateral movement of the base plate relative to the housing, and a second pin of the housing being inserted into a second opening of the base plate and configured to minimize rotation of the base plate about the first pin.

[0035] Example 2. Power module according to Example 1, wherein the first pin of the housing comprises a first plurality of motion constraint features, each extending from a surface of the first pin to a surface defining the first opening.

[0036] Example 3. Power module according to Example 2, wherein each of the first set of motion constraint features extends radially outward from the surface of the first pin.

[0037] Example 4. Power module according to any one of Examples 1 to 3, wherein the second pin of the housing comprises a second plurality of motion constraint features, each extending from a surface of the second pin to a surface defining the second opening, each of the second plurality of motion constraint features being oriented substantially perpendicular to an axis extending between the first opening and the second opening.

[0038] Example 5. Power module according to Example 4, wherein each of the second set of motion constraint features extends radially outward from the surface of the second pin.

[0039] Example 6. Power module according to any one of Examples 1 to 5, wherein the first pin of the enclosure comprises a first plurality of motion constraint features, each extending from a surface of the first pin to a surface defining the first opening, wherein the second pin of the enclosure comprises a second plurality of motion constraint features, each extending from a surface of the second pin to a surface defining the second opening, wherein each of the second plurality of motion constraint features is oriented substantially perpendicular to an axis extending between the first opening and the second opening, and wherein the second plurality of motion constraint features has fewer motion constraint features than the first plurality of motion constraint features.

[0040] Example 7. Power module according to one of Examples 1 to 6, wherein a remainder of the pins comprises all of the plurality of pins except the first pin and the second pin, and wherein a width of the first pin is greater than a width of at least one of the remainder of the pins.

[0041] Example 8. Power module according to Example 7, wherein the first pin of the housing comprises a first plurality of motion constraint features, each extending from a surface of the first pin to a surface defining the first opening, and wherein the width of the first pin is defined by ends of the first plurality of motion constraint features.

[0042] Example 9. Power module according to one of Examples 1 to 8, wherein a remainder of the pins comprises all of the plurality of pins except the first pin and the second pin, and wherein a width of the second pin is greater than a width of at least one of the remainder of the pins.

[0043] Example 10. Power module according to Example 9, wherein the second pin of the housing comprises a second plurality of motion constraint features, each extending from a surface of the second pin to a surface defining the second opening, each of the second plurality of motion constraint features being oriented substantially perpendicular to an axis extending between the first opening and the second opening, and wherein the width of the second pin is defined by ends of the second plurality of motion constraint features.

[0044] Example 11. Power module according to one of Examples 1 to 10, wherein a remainder of the pins comprises all of the plurality of pins except the first pin and the second pin, and wherein a volume of each of the first pin, the second pin and each of the remainder of the pins is approximately equal.

[0045] Example 12. Power module according to one of Examples 1 to 11, wherein at least one of the plurality of openings in the base plate extends through the base plate to a second surface of the base plate opposite the first surface of the base plate, wherein a respective pin of the housing is inserted into a respective opening of the base plate extending through the base plate, such that the respective pin extends through the base plate and one end of the respective pin extends beyond the second surface of the base plate.

[0046] Example 13. Power module comprising: a base plate comprising a first surface with a plurality of openings; and a housing comprising a first surface facing the first surface of the base plate and a plurality of pins projecting from the first surface, each of the pins of the housing being inserted into a respective opening of the base plate, a first pin of the housing being inserted into a first opening of the base plate, the first opening being configured to minimize lateral movement of the base plate relative to the housing, and a second pin of the housing being inserted into a second opening of the base plate, the second opening being configured to minimize rotation of the base plate about the first pin.

[0047] Example 14. Power module according to one of Examples 1 to 13, wherein a remainder of the pins comprises all of the plurality of pins except the first pin and the second pin, and wherein a width of the first opening is less than a width of at least one opening into which a respective pin of the remainder of the pins is inserted.

[0048] Example 15. Power module according to Example 14, wherein the first opening of the base plate comprises a first plurality of motion constraint features, each extending from a surface defining the first opening to a surface of the first pin, and wherein the width of the first opening is defined by ends of the first plurality of motion constraint features.

[0049] Example 16. Power module according to one of Examples 1 to 15, wherein a remainder of the pins comprises all of the plurality of pins except the first pin and the second pin, and wherein a width of the second opening is less than a width of at least one opening into which a respective pin of the remainder of the pins is inserted.

[0050] Example 17. Power module according to Example 16, wherein the second opening of the base plate comprises a second plurality of motion constraint features, each extending from a surface defining the second opening to a surface of the second pin, each of the second plurality of motion constraint features being oriented substantially perpendicular to an axis extending between the first opening and the second opening, and wherein the width of the second opening is defined by ends of the second plurality of motion constraint features.

[0051] Example 18. Power module according to any of Examples 1 to 17, wherein the second opening has a first width parallel to an axis extending between the first opening and the second opening, wherein the first width is greater than a second width of the second opening, wherein the second width is perpendicular to the axis extending between the first opening and the second opening.

[0052] Example 19. Power module according to Example 18, wherein a remainder of the pins comprises all of the plurality of pins except the first pin and the second pin, and wherein the second width of the second opening is less than a width of at least one opening into which a respective pin of the remainder of the pins is inserted.

[0053] Example 20. Power module according to one of Examples 1 to 19, wherein at least one of the plurality of openings in the base plate extends through the base plate to a second surface of the base plate opposite the first surface of the base plate, wherein a respective pin of the housing is inserted into a respective opening of the base plate extending through the base plate, such that the respective pin extends through the base plate and one end of the respective pin extends beyond the second surface of the base plate.

[0054] Terms like "first," "second," and the like are used to describe different elements, regions, sections, etc., and are not intended to be restrictive. The same terms refer to the same elements throughout the description.

[0055] As used herein, the terms "possessing," "containing," "encompassing," "comprehensive," and the like are open terms that indicate the presence of specified elements or features but do not exclude additional elements or features. The articles "a," "an," and "the" are intended to include both the plural and the singular unless the context clearly indicates otherwise.

[0056] The expression "and / or" should be interpreted to include all possible conjunctive and disjunctive combinations unless explicitly stated otherwise. For example, the expression "A and / or B" should be interpreted to mean A but not B, B but not A, or both A and B. The expression "at least one of" should be interpreted in the same way as "and / or" unless explicitly stated otherwise. For example, the expression "at least one of A and B" should be interpreted to mean A but not B, B but not A, or both A and B.

[0057] It is understood that the features of the various embodiments described herein may be combined with one another, unless expressly stated otherwise.

[0058] Although specific embodiments have been illustrated and described herein, it is understood by the person skilled in the art that a multitude of alternative and / or equivalent implementations can replace the specific embodiments shown and described without departing from the scope of the present invention. This application is intended to cover any adaptations or variations of the specific embodiments discussed herein. Therefore, it is intended that this invention is limited only by the claims and their equivalents.

Claims

[1] Performance module, comprising: a base plate comprising a first surface with a multitude of openings; and a housing comprising a first surface facing the first surface of the base plate and a plurality of pins projecting from the first surface, each of the pins of the housing being inserted into a respective opening in the base plate, wherein a first pin of the housing is inserted into a first opening of the base plate and is configured to minimize lateral movement of the base plate relative to the housing, and wherein a second pin of the housing is inserted into a second opening in the base plate and is configured to minimize rotation of the base plate around the first pin. [2] Power module according to claim 1, wherein the first pin of the housing comprises a first plurality of motion limitation features, each extending from a surface of the first pin to a surface defining the first opening. [3] Power module according to claim 2, wherein each of the first plurality of motion limitation features extends radially outwards from the surface of the first pin. [4] Power module according to one of the preceding claims, wherein the second pin of the housing comprises a second plurality of motion-limiting features, each extending from a surface of the second pin to a surface defining the second opening, wherein each of the second plurality of motion-limiting features is oriented substantially perpendicular to an axis extending between the first opening and the second opening. [5] Power module according to claim 4, wherein each of the second plurality of motion limitation features extends radially outwards from the surface of the second pin. [6] Power module according to any one of the preceding claims, wherein the first pin of the housing comprises a first plurality of motion-limiting features, each extending from a surface of the first pin to a surface defining the first opening, wherein the second pin of the housing comprises a second plurality of motion-limiting features, each extending from a surface of the second pin to a surface defining the second opening, each of the second plurality of motion-limiting features being oriented substantially perpendicular to an axis extending between the first opening and the second opening, and where the second set of movement restriction features has fewer movement restriction features than the first set of movement restriction features. [7] Power module according to any one of the preceding claims, wherein a remainder of the pens comprises all of the multitude of pens except the first pen and the second pen, and where the width of the first pin is greater than the width of at least one of the remaining pins. [8] Power module according to claim 7, wherein the first pin of the housing comprises a first plurality of motion-limiting features, each extending from a surface of the first pin to a surface defining the first opening, and where the width of the first pin is defined by the ends of the first plurality of motion restriction features. [9] Power module according to any one of the preceding claims, wherein a remainder of the pens comprises all of the multitude of pens except the first pen and the second pen, and where the width of the second pin is greater than the width of at least one of the remaining pins. [10] Power module according to claim 9, wherein the second pin of the housing comprises a second plurality of motion-limiting features, each extending from a surface of the second pin to a surface defining the second opening, each of the second plurality of motion-limiting features being oriented substantially perpendicular to an axis extending between the first opening and the second opening, and where the width of the second pen is defined by the ends of the second set of motion restriction features. [11] Power module according to any one of the preceding claims, wherein a remainder of the pens comprises all of the multitude of pens except the first pen and the second pen, and where the volume of each of the first pencil, the second pencil, and each of the remaining pencils is approximately the same. [12] Power module according to any one of the preceding claims, wherein at least one of the plurality of openings in the base plate extends through the base plate to a second surface of the base plate, which is opposite the first surface of the base plate, wherein a respective pin of the housing is inserted into a respective opening of the base plate which extends through the base plate, such that the respective pin extends through the base plate and one end of the respective pin extends beyond the second surface of the base plate. [13] Performance module, comprising: a base plate comprising a first surface with a multitude of openings; and a housing comprising a first surface facing the first surface of the base plate and a plurality of pins projecting from the first surface, each of the pins of the housing being inserted into a respective opening in the base plate, wherein a first pin of the housing is inserted into a first opening of the base plate, the first opening being configured to minimize lateral movement of the base plate relative to the housing, and wherein a second pin of the housing is inserted into a second opening in the base plate, the second opening being configured to minimize rotation of the base plate around the first pin. [14] Power module according to claim 13, wherein a remainder of the pens comprises all of the multitude of pens except the first pen and the second pen, and wherein the width of the first opening is less than the width of at least one opening into which a respective pin of the rest of the pins is inserted. [15] Power module according to claim 14, wherein the first opening of the base plate comprises a first plurality of motion-limiting features, each extending from a surface defining the first opening to a surface of the first pin, and where the width of the first opening is defined by the ends of the first plurality of movement restriction features. [16] Power module according to one of claims 13 to 15, wherein a remainder of the pens comprises all of the multitude of pens except the first pen and the second pen, and wherein the width of the second opening is smaller than the width of at least one opening into which a respective pin of the remaining pins is inserted. [17] Power module according to claim 16, wherein the second opening of the base plate comprises a second plurality of motion-limiting features, each extending from a surface defining the second opening to a surface of the second pin, each of the second plurality of motion-limiting features being oriented substantially perpendicular to an axis extending between the first opening and the second opening, and where the width of the second opening is defined by the ends of the second set of motion restriction features. [18] Power module according to any one of claims 13 to 17, wherein the second opening has a first width which is parallel to an axis extending between the first opening and the second opening, wherein the first width is greater than a second width of the second opening, wherein the second width is perpendicular to the axis extending between the first opening and the second opening. [19] Power module according to claim 18, wherein a remainder of the pens comprises all of the multitude of pens except the first pen and the second pen, and wherein the second width of the second opening is smaller than the width of at least one opening into which a respective pin of the rest of the pins is inserted. [20] Power module according to any one of claims 13 to 19, wherein at least one of the plurality of openings in the base plate extends through the base plate to a second surface of the base plate, which is opposite the first surface of the base plate, wherein a respective pin of the housing is inserted into a respective opening of the base plate which extends through the base plate, such that the respective pin extends through the base plate and one end of the respective pin extends beyond the second surface of the base plate.

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