HEAD CHIP, LIQUID BEAM HEAD AND LIQUID BEAM RECORDING DEVICE

Abstract

A head chip, a liquid jet head, and a liquid jet recording device are provided, each of which can reduce deviations in output power. The head chip according to one aspect of the present disclosure is provided with a nozzle plate and with an actuator plate arranged such that it faces the nozzle plate. The actuator plate is provided with an opposing section arranged in a state in which it is separated from the nozzle plate in a Z-direction, and with a separating section formed integrally with the opposing section, projecting from the opposing section in the Z-direction, and separating adjacent pressure chambers.At least part of the separating section is arranged in a position that does not overlap a drive section when viewed from the Z direction, with the drive section being located in the opposite section between the first groove and the second groove that are adjacent in the X direction.

Description

TECHNICAL AREA OF INVENTION

[0001] The present disclosure relates to a head chip, a liquid jet head and a liquid jet recording device. STATE OF THE ART

[0002] In a printhead chip built into an inkjet printer, an electric field is generated in an actuator plate made of a piezoelectric material. This deforms the actuator plate, causing a pressure change in a pressure chamber. This pressure change then ejects the ink from the pressure chamber through a nozzle.

[0003] For example, JP7220327B discloses an embodiment in which a flow path plate is arranged between an actuator plate and a nozzle plate.

[0004] The flow path plate forms a separation section that separates adjacent pressure chambers between the actuator plate and the nozzle plate.

[0005] Furthermore, the head chip employs a design in which the actuator plate, the flow path plate, and the nozzle plate are stacked sequentially. If, for example, a misalignment occurs in a connection position of each plate in one arrangement direction of the pressure chambers, it is possible that this could lead to a reduction in the degree of actuator deformation, a reduction in the pressure change within the pressure chamber, and so on. Consequently, the head chip, based on the related technology, still offers potential for improvement with regard to reducing the deviation in output performance.

[0006] The present disclosure provides a head chip, a liquid jet head and a liquid jet recording device, each of which can reduce the deviation in the output power. BRIEF SUMMARY OF THE INVENTION

[0007] To solve the problems described above, the present revelation introduces the following aspects. (1) A head chip according to one aspect of the present disclosure comprises a beam-hole plate penetrated by a plurality of beam holes in a first direction, wherein the plurality of beam holes are arranged side by side in a second direction intersecting the first direction, and an actuator plate facing the beam-hole plate in the first direction, and comprising a plurality of pressure chambers formed between the actuator plate and the beam-hole plate, wherein the plurality of pressure chambers is each connected to the plurality of beam holes, wherein the actuator plate has an opposite section having a first surface facing the plurality of pressure chambers in the first direction and a second surface facing a side opposite the first direction with respect to the first surface, and is arranged in a statein which it is separated from the beam hole plate in the first direction, wherein a separating section is formed integrally with the opposite section projecting from the opposite section in the first direction and is configured to separate the pressure chambers adjacent to each other in the second direction, wherein a first electrode is provided on an inner surface of a first groove which is formed at a position which, viewed from the first direction on the first surface, faces each of the plurality of pressure chambers, and wherein a second electrode is provided on an inner surface of a second groove which is formed at a position which, viewed from the first direction on the second surface, faces each of the separating sections, and wherein at least a part of the separating section is arranged at a position which, viewed from the first direction, does not overlap with a drive section,wherein the drive section between the first groove and the second groove, which lie next to each other in the second direction, is located in the opposite section.

[0008] According to the present aspect, the electric field in the drive section is generated due to the potential difference created between the first electrode, formed in the first groove, and the second electrode, formed in the second groove. By deforming the drive section in the first direction in the so-called shear mode, it is thus possible to expel the fluid through the jet hole.

[0009] In particular, in the present case, since at least part of the separating section is located in a position that does not overlap the drive section when viewed from the first direction, a gap in the first direction is created between the jet plate and the drive section. Therefore, the jet plate, etc., prevents the drive section from being impeded by deformation during fluid ejection. Consequently, it is easy to ensure the degree of deformation of the actuator plate is sufficient to maintain the pressure generated in the pressure chamber.

[0010] Furthermore, according to the present aspect, the separating section also functions as at least part of the separation section that divides the adjacent pressure chambers. Thus, it is possible to improve the positional accuracy in the second direction between the drive section and the separating section compared to the design where the entire separating section is formed by an element separate from the actuator plate. Consequently, the deviation in the jet power can be reduced.

[0011] (2) In the case of the head chip according to aspect (1) described above, it is preferable that the entire separation section overlaps the second groove when viewed from the first direction.

[0012] Based on the present aspect, it is easy to ensure the area of ​​a section that does not overlap the separation section when viewed from the first direction in the drive section. Consequently, it is easy to ensure the extent of deformation of the actuator plate to guarantee the pressure generated in the pressure chamber.

[0013] (3) In the case of the head chip according to aspect (1) described above, it is preferable that a dimension in the second direction in the parting section is smaller than a dimension in the second direction in the second groove.

[0014] According to this aspect, the drive section is easier to deform. Consequently, it is simple to ensure the extent of deformation of the actuator plate is sufficient to maintain the pressure generated in the pressure chamber.

[0015] (4) In the case of the head chip according to one of the aspects described above (1) to (3), it is preferable that an intermediate plate is arranged between the beam hole plate and the actuator plate and that the intermediate plate is provided with a connecting hole designed to connect the beam hole and the pressure chamber.

[0016] According to the present aspect, the beam plate and the actuator plate are stacked on top of each other via the intermediate plate. In this case, the degree of freedom in choosing the material of the beam plate, for example for the required stiffness of the beam plate, can be dispensed with, since the stiffness is ensured by the intermediate plate.

[0017] (5) In the case of the head chip according to one of the aspects described above (1) to (3), it is preferable that the beam hole plate is stacked directly over the separation section onto the actuator plate.

[0018] According to the present aspect, since the jet hole plate is stacked directly onto the actuator plate, the number of components can be reduced in order to achieve a reduction in costs compared to the case in which the intermediate plate is left between the actuator plate and the nozzle plate.

[0019] (6) In the case of the head chip according to one of the aspects described above (1) to (5), it is preferable that a dimension in the second direction in the separation section is larger than a dimension in the second direction in the drive section.

[0020] Based on the present aspect, it is easy to ensure the stiffness of the separation section by ensuring its dimensions. Therefore, it is possible to deform the drive section with the desired behavior.

[0021] (7) In the case of the head chip according to one of the aspects (1) to (6) described above, it is preferable that a support plate is stacked on the actuator plate on one side opposite the beam hole plate in the first direction and that a deformation receiving section which allows deformation of the actuator plate is arranged in a section which, viewed from the first direction, is opposite at least a part of the pressure chamber in an area between the actuator plate and the support plate.

[0022] Based on the present aspect, since the support plate is stacked on the actuator plate on the side opposite the jet hole plate, it is possible to support the actuator plate with the support plate from the side opposite the pressure chambers when the first surface of the actuator plate is provided with the pressure chambers, etc., or to smooth the first surface of the actuator plate. Thus, it is possible to improve the machining accuracy of the actuator plate. Based on this, by arranging the deformation absorption section in a section that is opposite at least a part of the pressure chamber in the support plate, the inhibition of the actuator plate's deformation by the support plate during fluid ejection can be reduced. Consequently, it can be easily ensured that the pressure is generated by the pressure chamber.

[0023] (8) A liquid jet head according to one aspect of the present disclosure comprises the head chip according to one of the aspects described above (1) to (7).

[0024] Based on the present aspect, it is possible to provide a liquid jet head that exhibits excellent reliability.

[0025] (9) A liquid jet recording device according to one aspect of the present disclosure comprises the liquid jet head according to aspect (8) described above.

[0026] Based on the present aspect, it is possible to provide a liquid jet recording device that exhibits excellent reliability.

[0027] According to one aspect of the present disclosure, a deviation in beam power can be reduced. BRIEF DESCRIPTION OF THE DRAWINGS Fig. Figure 1 is a schematic configuration diagram of an inkjet printer according to a first embodiment. Fig. Figure 2 is a schematic configuration diagram of an inkjet head and an ink circulation mechanism associated with the first embodiment. Fig. Figure 3 is a perspective exploded view of an ejection unit in connection with the first embodiment. Fig. Figure 4 is a perspective exploded view of a head chip according to the first embodiment. Fig. Figure 5 is a top view of an actuator plate in connection with the first embodiment. Fig. Figure 6 is a cross-sectional view of the head chip as shown in Fig. 4 shown line VI-VI. Fig. Figure 7 is a cross-sectional view of the ejection unit as shown in Fig. 6 shown line VII-VII. Fig. Figure 8 is a cross-sectional view of the ejection unit as shown in Fig. 6 shown line VIII-VIII. Fig. Figure 9 is a bottom view of a support plate in connection with the first embodiment. Fig. Figure 10 is a top view of a support plate in connection with the first embodiment. Fig. Figure 11 is a flowchart describing a method for manufacturing the ejection unit in connection with the first embodiment. Fig. Figure 12 is a manufacturing diagram that describes the first actuator process step and is a cross-sectional view accordingly. Fig. 6 is involved. Fig. Figure 13 is a manufacturing diagram that describes the first actuator process step and is a cross-sectional view accordingly. Fig. 6 is involved. Fig. Figure 14 is a manufacturing diagram that describes the first support plate process step and is a cross-sectional view accordingly. Fig. 7 is involved. Fig. Figure 15 is a manufacturing diagram that describes the first support plate process step and is a cross-sectional view accordingly. Fig. 7 is involved. Fig. Figure 16 is a manufacturing diagram that describes the first support plate process step and is a cross-sectional view accordingly. Fig. 7 is involved. Fig. Figure 17 is a manufacturing diagram that describes a first bonding step and is a cross-sectional view accordingly. Fig. 6 is involved. Fig. Figure 18 is a manufacturing diagram that describes a second actuator process step and is a cross-sectional view accordingly. Fig. 6 is involved. Fig. Figure 19 is a manufacturing diagram that describes a step in the formation of a protective film and is a cross-sectional view accordingly. Fig. 6 is involved. Fig. Figure 20 is a cross-sectional view of a head chip according to a second embodiment. Fig. Figure 21 is a cross-sectional view of a head chip according to a third embodiment. DETAILED DESCRIPTION OF THE INVENTION

[0028] Some embodiments according to the present disclosure are described below with reference to the drawings. In the embodiments and modified examples described below, corresponding components are designated by the same reference numerals, so that in some cases their description is omitted. In the following descriptions, terms that denote relative or absolute arrangements, such as "parallel," "perpendicular," "central," and "coaxial," do not strictly refer only to such arrangements, but also to the state of a relative displacement with a tolerance, angle, or distance, insofar as the same function can be achieved.In the following embodiment, the description is given by citing as an example an inkjet printer (hereinafter referred to simply as the "printer") for making a recording on a recording target medium using ink (a liquid). The scale of each element is arbitrarily changed to give the element a recognizable size in the drawings used in the following description. (First embodiment)[Printer 1]

[0029] Fig. Figure 1 is a schematic configuration diagram of a printer.

[0030] The in Fig. 1 Printer 1 shown (a liquid jet recording device) is equipped with a pair of conveying mechanisms 2, 3, ink reservoirs 4, ink jet heads (liquid jet heads) 5, ink circulation mechanisms 6 and a scan mechanism 7.

[0031] In the following explanation, the description is given as needed using an orthogonal coordinate system of X, Y, and Z. In this case, the X direction corresponds to a feed direction (a subscan direction) of a recording target medium P (e.g., paper). The Y direction corresponds to a scan direction (a main scan direction) of the scan mechanism 7. The Z direction represents a vertical direction (a gravitational direction) that is perpendicular to both the X and Y directions. In the following explanation, the description is given by defining, in the drawings, one side of an arrow in each of the X, Y, and Z directions as the positive (+) side and the opposite side as the negative (-) side. In this description, the +Z side corresponds to an upper side in the gravitational direction, and the -Z side corresponds to a lower side in the gravitational direction.

[0032] The conveying mechanisms 2, 3 convey the recording target medium P in the direction of the +X side. The conveying mechanisms 2, 3 each comprise a pair of rollers 11, 12, which extend, for example, in the Y direction.

[0033] The ink reservoirs 4 each contain four ink colors, such as yellow ink, magenta ink, cyan ink, and black ink. The inkjet heads 5 are configured to eject each of the four ink colors—namely, yellow ink, magenta ink, cyan ink, and black ink—in accordance with the ink reservoirs 4 to which they are connected.

[0034] Fig. Figure 2 is a schematic configuration diagram of the inkjet head 5 and the ink circulation mechanism 6.

[0035] As in Fig. 1 and Fig. As shown in Figure 2, the ink circulation mechanism 6 circulates the ink between the ink reservoir 4 and the inkjet head 5. In particular, the ink circulation mechanism 6 is provided with a circulation flow path 23 comprising an ink supply tube 21 and an ink outlet tube 22, a pressure pump 24 connected to the ink supply tube 21, and a suction pump 25 connected to the ink outlet tube 22.

[0036] The pressure pump 24 pressurizes the inside of the ink supply tube 21 to supply ink to the inkjet head 5 through the ink supply tube 21. This creates an overpressure in the ink supply tube 21 relative to the inkjet head 5.

[0037] The suction pump 25 relieves the pressure inside the ink outlet tube 22 in order to draw the ink through the ink outlet tube 22 from the inkjet head 5. This creates a vacuum in the ink outlet tube 22 relative to the inkjet head 5. The arrangement is such that the ink can circulate between the inkjet head 5 and the ink reservoir 4 through the circulation flow path 23 by driving the pressure pump 24 and the suction pump 25.

[0038] As in Fig. As shown in Figure 1, the scan mechanism 7 moves the inkjet heads 5 back and forth in the Y direction. The scan mechanism 7 is provided with a guide rail 28 extending in the Y direction and a carriage 29 which is movably mounted on the guide rail 28. <Tintenstrahlköpfe 5>

[0039] The inkjet heads 5 are mounted on the carriage 29. In the example shown, the multiple inkjet heads 5 are mounted on the single carriage 29 such that they are arranged side by side in the Y direction. The inkjet heads 5 are each equipped with an ejection unit 30 (see Fig. 2), an ink supply unit (not shown) for connecting to the ink circulation mechanism 6 and the ejection unit 30, and a control unit (not shown) for applying the drive voltages to the ejection unit 30. (First embodiment) [Ejection unit 30]

[0040] Fig. Figure 3 is a perspective exploded view of the ejection unit 30.

[0041] The in Fig. The ejection unit 30 shown is a so-called recirculating side-shot ejection unit 30, which circulates the ink with the ink reservoir 4 and simultaneously ejects the ink from a central section in the extension direction (the Y-direction) into a pressure chamber 50. The ejection unit 30 is equipped with a flow path frame element 31, a head chip 32, a flow path cover 34, and a flexible circuit board 35 (see Figure 3). Fig. 7) provided. <Strömungsweg-Rahmenelement 31>

[0042] The flow path frame element 31 is configured as a rectangular frame shape with a thickness direction aligned with the Z-direction and a longitudinal direction aligned with the X-direction. The flow path frame element 31 separates a chip housing section 31a, a common inlet flow path 31b, and a common outlet flow path 31c. The chip housing section 31a, the common inlet flow path 31b, and the common outlet flow path 31c penetrate the flow path frame element 31 in the Z-direction in a state where they are interconnected.

[0043] The chip housing section 31a is formed in a central section in the Y direction within the flow path frame element 31. The chip housing section 31a is formed with an elongated hole shape which, in a top view, has a longitudinal direction aligned with the X direction.

[0044] The common inlet flow path 31b is formed in a section of the flow path frame element 31, with the section located on the +Y side relative to the chip housing section 31a. Similar to the chip housing section 31a, the common inlet flow path 31b is configured with an elongated hole shape that has a longitudinal orientation aligned with the X direction. A +X-side end section in the common inlet flow path 31b protrudes in the X direction relative to the chip housing section 31a.

[0045] The common outlet flow path 31c is formed in a section of the flow path frame element 31, with the section located on the -Y side relative to the chip housing section 31a. Similar to the common inlet flow path 31b, the common outlet flow path 31c has an elongated slot shape with a longitudinal orientation aligned with the X direction. An -X-side end section in the common outlet flow path 31c protrudes in the X direction relative to the chip housing section 31a. <Kopfchip 32>

[0046] Fig. Figure 4 is a perspective exploded view of the head chip 32.

[0047] As in Fig. As shown in Figure 4, the head chip 32 is provided with a plurality of pressure chambers 50, in which the ink is housed, arranged in the X direction and simultaneously ejects the ink from the pressure chambers 50 through nozzle holes 39a, which are each connected to the pressure chambers 50, due to pressure changes in the pressure chambers 50. The head chip 32 is provided with a chip module 37 and a nozzle plate 39.

[0048] As in Fig. As shown in Figure 3, the chip module 37 is configured such that it has a block shape with a thickness direction aligned with the Z-direction and a longitudinal direction aligned with the X-direction. The chip module 37 is installed in the chip housing section 31a. In particular, the chip module 37 is configured such that it has a thickness in the Z-direction corresponding to that of the flow path frame element 31 and a flat shape corresponding to that of the chip housing section 31a. In this case, a +X-sided end face of the chip module 37 is attached with an adhesive or the like to a surface facing the -X-side of the inner surfaces of the chip housing section 31a, and a -X-sided end face of the chip module 37 is attached with an adhesive or the like to a surface facing the -X-side of the inner surfaces of the chip housing section 31a.Therefore, in the flow path frame element 31, the common inlet flow path 31b and the common outlet flow path 31c are separated by the chip module 37.

[0049] Fig. Figure 5 is a top view of an actuator plate 41. Fig. Figure 6 is a cross-sectional view of the head chip 32 as shown in Fig. 4 shown line VI-VI. Fig. Figure 7 is a cross-sectional view of the ejection unit 30 as shown in Fig. 6 shown line VII-VII. Fig. Figure 8 is a cross-sectional view of the ejection unit 30 as shown in Figure 8. Fig. 6 shown line VIII-VIII.

[0050] As in Fig. 4 to Fig. As shown in Figure 8, the chip module 37 is provided with the actuator plate 41, a support plate 42, and an intermediate plate 43. The chip module 37 is configured such that the intermediate plate 43, the actuator plate 41, and the support plate 42 are stacked on top of each other in that order. In the following explanation, the description is given in some cases by defining a direction (+Z-side) from the intermediate plate 43 to the support plate 42 along the Z-direction as an upper side and a direction (-Z-side) from the support plate 42 to the intermediate plate 43 along the Z-direction as a lower side. In the first embodiment, a lower surface of the head chip 32 is arranged such that it is coplanar with a lower surface of the flow path frame element 31. Meanwhile, an upper surface of the head chip 32 is arranged such that it is coplanar with an upper surface of the flow path frame element 31. <Aktorplatte 41>

[0051] The actuator plate 41 forms part of the pressure chamber 50 and simultaneously causes a pressure change in the pressure chamber 50 when it ejects the ink. The actuator plate 41 is made of a piezoelectric material such as PZT (lead zirconate titanate). For example, a so-called monopole substrate is used as the actuator plate 41, in which the polarization direction is unidirectional across the entire surface in the Z-direction. In other words, the actuator plate 41 is designed as a single unit without any transition interfaces. It should be noted that a so-called chevron substrate can also be used as the actuator plate 41. This substrate is formed by stacking two piezoelectric plates with different polarization directions in the Z-direction on top of each other.

[0052] The actuator plate 41 is provided with an opposing section 55 and separating sections 56.

[0053] The opposing section 55 is configured such that it has a plate shape with a thickness direction aligned with the Z-direction. The opposing section 55 forms an upper wall of each of the pressure chambers 50. In particular, the opposing section 55 lies over all pressure chambers 50 in such a way that it spans them.

[0054] The separating sections 56 project downwards from the opposite section 55 and simultaneously extend parallel to each other along their entire length in the Y-direction into the opposite section 55. The separating section 56 separates the adjacent pressure chambers 50 in the X-direction. In other words, the separating section 56 forms a side wall of the pressure chamber 50.

[0055] In the opposite section 55, recessed sections 57 are formed in a section located between the adjacent separating sections 56 in the X-direction. The recessed section 57 is open to a lower surface of the opposite section 55 and simultaneously extends straight along its entire length in the Y-direction into the opposite section 55. The recessed section 57 also functions as part of the pressure chamber 50.

[0056] As in Fig. As shown in Figure 6, the width in the X-direction of the recessed section 57 is narrower than the distance between the adjacent separating sections 56. Furthermore, the recessed section 57 is located at a position encompassing the center in the X-direction of the pressure chamber 50 and is not in contact with the separating section 56. Therefore, the pressure chamber 50 is designed to have a stepped shape, in which the width in the X-direction of a section located on an upper side is narrower than the width in the X-direction of a section located on a lower side. Fig. The cross-sectional view shown in Figure 6 is shown. It should be noted that in the first embodiment, the center in the X-direction in the recessed section 57 coincides with the center in the X-direction of the pressure chamber 50.

[0057] Furthermore, the depth in the Z-direction in the recessed section 57 is specified such that it is not less than half the thickness in the Z-direction in the opposite section 55. However, the depth in the Z-direction in the recessed section 57 can be modified appropriately.

[0058] In the opposite section 55, decoupling grooves 58 are formed in a section located between the recessed sections 57 adjacent to each other in the X-direction. The decoupling groove 58 is open towards an upper surface of the opposite section 55 and simultaneously extends in a straight line in the Y-direction. Therefore, the decoupling grooves 58 and the recessed sections 57 are arranged alternately in the X-direction (in offset positions when viewed from the Z-direction) and run parallel to each other in the top view. Both end sections in the Y-direction of the decoupling groove 58 are not open towards both end faces in the Y-direction of the opposite section 55.

[0059] As in Fig. As shown in Figure 6, the decoupling groove 58 is configured such that its width in the X-direction is less than the distance between the adjacent recessed sections 57. Furthermore, the decoupling groove 58 is positioned at a location that encompasses the X-center of the separating section 56 and is not in contact with the recessed section 57. It should be noted that in the first embodiment, the decoupling groove 58 is configured such that its X-center coincides with the X-center of the separating section 56, and its X-center width is narrower than the X-center width of the separating section 56. Therefore, the entire decoupling groove 58 overlaps the entire separating section 56 in a top view. It should be noted that the width of the decoupling groove 58 cannot be less than the width of the separating section 56.Furthermore, it is sufficient that the separation section 56 and the decoupling groove 58 overlap at least partially in the top view.

[0060] Furthermore, the decoupling groove 58 is designed such that its depth in the Z-direction is no less than half the thickness in the Z-direction of the opposite section 55. Therefore, the decoupling groove 58 and the recessed section 57 partially overlap (in the Z-direction) when viewed from the X-direction.

[0061] In the first embodiment, the pressure chamber 50 is surrounded by the adjacent separating sections 56 and a portion of the opposite section 55 located between the adjacent separating sections 56. The pressure chamber 50 extends in a straight line in the Y-direction over the entire length of the actuator plate 41. A +Y-side opening section in the pressure chamber 50 is individually connected to the common inlet flow path 31b. A -Y-side opening section in each of the pressure chambers 50 is individually connected to the common outlet flow path 31c. In other words, the common inlet flow path 31b and the common outlet flow path 31c are interconnected via the pressure chambers 50.

[0062] In the opposite section 55, a section located between the recessed section 57 and the decoupling groove 58, which lie side by side in the X-direction, forms a drive section 59. In the cross-sectional view perpendicular to the Y-direction, the drive section 59 has a thickness that corresponds to the thickness of the opposite section 55. Furthermore, the width in the X-direction of the opposite section 55 is narrower than the widths of the recessed section 57, the decoupling groove 58, and the separating section 56. In the illustrated example, the drive section 59 is arranged in a position that, in the top view, does not completely overlap the separating section 56. However, the drive section 59 can partially overlap the separating section 56 in the top view.

[0063] The drive sections 59 are each arranged at positions corresponding to the two end sections in the X-direction with respect to a pressure chamber 50. In some cases, in the following description, the drive section 59 located at a +X-side end section in the pressure chamber 50 is referred to as the +X-side drive section 59a, and the drive section 59 located at a -X-side end section in the pressure chamber 50 is referred to as the -X-side drive section 59b. In the first embodiment, the +X-side drive section 59a of one pressure chamber 50 also functions as the -X-side drive section 59b of another pressure chamber 50 located on the +X side adjacent to the first pressure chamber 50. The -X-side drive section 59b of one pressure chamber 50 also functions as the +X-side drive section 59b of another pressure chamber 50 located on the -X side adjacent to the first pressure chamber 50. <Stützplatte 42>

[0064] As in Fig. 4 and Fig. As shown in Figure 6, the support plate 42 is intended to ensure the rigidity of the chip module 37 and is stacked on top of the actuator plate 41 to support it from above. The support plate 42 is shaped like a plate with a flat surface corresponding to that of the actuator plate 41. The support plate 42 is attached to an upper surface of the actuator plate 41 (the opposite section 55) with an adhesive or the like. In the example shown, the thickness of the support plate 42 is greater than that of the actuator plate 41. However, the thickness of the support plate 42 can also be less than that of the actuator plate 41. It should be noted that the support plate 42 can be made of, for example, metal, metal oxide, glass, resin, or ceramic.

[0065] Fig. Figure 9 is a bottom view of the support plate 42.

[0066] As in Fig. 6 to Fig. As shown in Figure 9, deformation absorption sections 60 are formed in the support plate 42 at positions that overlap at least part of the drive sections 59 in plan view. The deformation absorption section 60 is a groove that is open towards a lower surface of the support plate 42. The deformation absorption sections 60 extend straight along the Y-direction along the pressure chamber 50 into sections that are located in both end sections (outer circumferential sections) in the X-direction of the pressure chamber 50 in plan view.In particular, of the deformation absorption sections 60, the deformation absorption section 60, which is located on the +X side, is designed such that it spans the entirety of the +X-side drive section 59a, which corresponds to a pressure chamber 50, the decoupling groove 58 and the -X-side drive section 59b, which corresponds to the other pressure chamber 50, which is located next to the one pressure chamber 50, in the X direction (so that it overlaps them in the top view). Of the deformation absorption sections 60, the deformation absorption section 60, which is located on the -X side, is designed such that it spans the entirety of the -X-side drive section 59b, which corresponds to a pressure chamber 50, the decoupling groove 58 and the +X-side drive section 59a, which corresponds to the other pressure chamber 50, which is located next to the one pressure chamber 50, in the X direction (so that it overlaps them in the top view).Therefore, the drive sections 59 and the decoupling grooves 58 are in the in . Fig. The cross-sectional view shown in section 6 is not in contact with the support plate 42.

[0067] As in Fig. 7 and Fig. As shown in Figure 8, the length in the Y-direction of the deformation absorption section 60 is shorter than the length in the Y-direction of the support plate 42. In other words, both end sections in the Y-direction of the deformation absorption section 60 are not open to both end faces in the Y-direction of the support plate 42. In the Y-direction, the deformation absorption section 60 is designed such that it has a length corresponding to the length of the decoupling groove 58. In the top view, the deformation absorption section 60 overlaps the entire decoupling groove 58 in the Y-direction. Therefore, the drive sections 59 and the decoupling grooves 58 are in the Fig. 7 and Fig. The cross-sectional view shown in Figure 8 is not in contact with the support plate 42. However, the dimensions of the deformation absorption section 60 can be modified appropriately.

[0068] As in Fig. 4 and Fig. As shown in Figures 7 to 9, the support plate 42 is provided with shared conductive sections 61 and individually used conductive sections 62. The shared conductive sections 61 are arranged in a +Y-side end section of the support plate 42. The individually used conductive sections 62 are arranged in a -Y-side end section of the support plate 42.

[0069] The shared conductive sections 61 are each formed in a section located on the +Y side relative to the deformation absorption section 60 in the support plate 42. The shared conductive section 61 is provided with a common recessed section 65 and a common connecting groove 66.

[0070] The common recessed section 65 is open towards the upper surface of the support plate 42. The common recessed section 65 forms an upper end opening section of the shared conductive section 61. A plurality of common recessed sections 65 are arranged at intervals in the X-direction.

[0071] The common connecting groove 66 is open towards the lower surface of the support plate 42 and extends in a straight line in the X-direction. In other words, the common connecting groove 66 forms a lower end opening section of the shared conductive section 61. The common connecting groove 66 is arranged such that it traverses the plurality of common recessed sections 65 in the X-direction. The common connecting groove 66 is connected to each of the common recessed sections 65 by sections that overlap the common recessed sections 65 in plan view. In the shared conductive section 61, a section connected to both the common recessed section 65 and the common connecting groove 66 forms a common penetration section 67 that penetrates the support plate 42 in the Z-direction.It is pointed out that the common connecting groove 66, when spanning all common recessed sections 65, is not limited to this, but merely has to span at least the adjacent common recessed sections 65.

[0072] The individually used conductive section 62 is formed at a position that, for example, overlaps a -Y-sided end section of the deformation absorption section 60 in the top view in the support plate 42. The individually used conductive section 62 is provided with a single recessed section 70 and a single connecting groove 71.

[0073] The individual recessed section 70 is open towards the upper surface of the support plate 42. The individual recessed section 70 forms an upper end opening section of the individually used conductive section 62. A plurality of individual recessed sections 70 are arranged at intervals in the X-direction. In the first embodiment, the common recessed sections 65 and the individual recessed sections 70 are arranged alternately in the X-direction at positions that differ from each other in the Y-direction. However, the position of the common recessed section 65 relative to the individual recessed section 70 can be changed in a suitable manner.

[0074] The individual connecting groove 71 is open towards the lower surface of the support plate 42 and extends in a straight line in the X-direction. In other words, the individual connecting groove 71 forms a lower end opening section of the individually used conductive section 62. The individual connecting groove 71 is arranged such that it traverses the plurality of individual recessed sections 70 in the X-direction. The individual connecting groove 71 is connected to each of the individual recessed sections 70 by sections that overlap the individual recessed sections 70 in plan view. In the individually used conductive section 62, a section with which the individual recessed section 70 and the individual connecting groove 71 are connected forms a single penetration section 73 that penetrates the support plate 42 in the Z-direction.It is pointed out that the individual connecting groove 71, when spanning all individual recessed sections 70, is not limited to this, but merely has to span at least the adjacent individual recessed sections 70.

[0075] As in Fig. 4 and Fig. As shown in Figure 6, the intermediate plate 43 is stacked on the nozzle plate 39 to reinforce it. The intermediate plate 43 covers a lower surface of the actuator plate 41. The intermediate plate 43 is bonded to the lower surface of the actuator plate 41 by an adhesive or the like. Thus, the intermediate plate 43 covers the lower end opening sections of the pressure chambers 50 in one piece. Preferably, the intermediate plate 43 is made of a material with superior stiffness compared to the nozzle plate 39. However, the intermediate plate 43 can be made of a material with lower stiffness than the nozzle plate 39, as long as the stiffness can be ensured in conjunction with the nozzle plate 39. In this case, the intermediate plate 43 can be a single-layer structure or a laminate structure made of a resin, metal, glass, silicone, or the like.

[0076] The intermediate plate 43 is provided with a plurality of connecting holes 43a that penetrate the intermediate plate 43 in the Z-direction. In plan view, the connecting holes 43a overlap the pressure chambers 50. In the first embodiment, the connecting holes 43a are open in a central section in the Y-direction and the X-direction of a corresponding pressure chamber 50.

[0077] In the actuator plate 41, the lower end face of the drive section 59 is located above the lower end face of the separating section 56. In other words, the lower end face of the drive section 59 is positioned in a state where it is separated in the Z-direction from an upper surface of the intermediate plate 43. In this case, a gap 77 formed between the lower surface of the drive section 59 and the upper surface of the intermediate plate 43 forms part of the pressure chamber 50. It should be noted that when the upper surface of the intermediate plate 43 connects to the actuator plate 41, the gap 77 acts as an adhesive receptacle, or, when the ink is ejected, as a space for deformation of the drive section 59. <Düsenplatte 39>

[0078] The nozzle plate 39 covers the lower surfaces of the chip module 37 and the flow path frame element 31 in one piece. The nozzle plate 39 is bonded to the lower surfaces of the intermediate plate 43 and the flow path frame element 31 by an adhesive or the like. Thus, the nozzle plate 39 covers the lower end opening sections of the common inlet flow path 31b and the common outlet flow path 31c and the lower end opening sections of the connecting holes 43a in one piece, and the nozzle plate 39 is made, for example, of a resin material (polyimide or the like). However, in addition to the resin material, the nozzle plate 39 can also be made of a metal material (SUS, Ni-Pd or the like), glass, silicone or the like.

[0079] The nozzle plate 39 is provided with a plurality of nozzle holes 39a that penetrate the nozzle plate 39 in the Z-direction. The nozzle holes 39a are each configured such that they have, for example, a conical shape in which the inner diameter gradually decreases along a direction from the top to the bottom. The nozzle holes 39a overlap the connecting holes 43a in the top view. In particular, the nozzle holes 39a are each connected to the pressure chambers 50 via the connecting holes 43a.

[0080] It is noted that in the first embodiment, it is sufficient that the connecting hole 43a is larger than at least the nozzle hole 39a. In particular, the connecting hole 43a can have a shape that is slightly larger than the nozzle hole 39a, as in the illustrated example, or it can have a shape corresponding to the pressure chamber 50.

[0081] Then, various types of connections with which the head chip 32 is equipped are described.

[0082] The head chip 32 is provided with common connections 81 and individual connections 82 as drive connections.

[0083] As in Fig. As shown in Figures 6 to 8, the common connection 81 is provided with a common electrode 81a, a connection 81b guided on an end face, a connection 81c guided on an upper surface, a through connection 81d and a common contact point 81e.

[0084] The common electrode 81a is formed on at least one inner surface of each of the recessed sections 57 on the lower surface of the opposite section 55. In the example shown, the common electrode 81a extends over the entire inner surface of the recessed section 57. In other words, the entire common electrode 81a faces the inside of the pressure chamber 50.

[0085] The connection 81b, guided on the end face, is formed on the +Y-side end face in the opposite section 55. In the first embodiment, the connection 81b, guided on the end face, is formed over the entire +Y-side end face in the opposite section 55. The connection 81b, guided on the end face, is connected to the common electrode 81a in a boundary section between the lower surface and the +Y-side end face of the opposite section 55.

[0086] As in Fig. 4 and Fig. As shown in Figure 5, the connection 81c, which is guided on the upper surface, is formed on the +Y-side end section of the upper surface of the opposite section 55. The connection 81c on the upper surface is designed such that it has the form of a strip extending in the X-direction on the upper surface of the opposite section 55. The connection 81c on the upper surface is connected to the connection 81b on the end face in a boundary section between the upper surface and the +Y-side end face of the opposite section 55. The connection 81c on the upper surface is separated from the decoupling groove 58 in the Y-direction.

[0087] As in Fig. As shown in Figure 8, the through-connection 81d serves to connect the connection 81c, which is guided on the upper surface, and the common contact point 81e to each other and is arranged such that it penetrates the support plate 42. The through-connection 81d is formed on an inner surface of the common penetration section 67. The through-connection 81d is connected to the connection 81c, which is guided on the upper surface, at a lower end edge of the common penetration section 67. It should be noted that it is sufficient for the through-connection 81d to ensure the connection over its entire length in the Z-direction of the inner surface of the common penetration section 67. In other words, the through-connection 81d can be formed over, for example, the entire inner surface of the common penetration section 67 in the circumferential direction, or it can be formed over only a portion of it in the circumferential direction.

[0088] Fig. Figure 10 is a top view of the support plate 42.

[0089] As in Fig. 4 and Fig. As shown in Figure 10, the common contact point 81e is formed on the upper surface of the support plate 42. The common contact point 81e is connected to the through connection 81d at the upper end edge of the common penetration section 67.

[0090] As in Fig. 4 and Fig. As shown in Figure 6, the individual connections 82 are each provided with a first single electrode 82a, a second single electrode 82b, a third single electrode 82c, a connection 82d guided on the upper surface, a through connection 82e and a single contact point 82f.

[0091] The first individual electrodes 82a are each formed on a section that overlaps each of the pressure chambers 50 in a top view on the upper surface of the opposite section 55. In the first embodiment, the first individual electrodes 82a are each formed on a section that overlaps the recessed section 57 in a top view on the upper surface of the opposite section 55. Therefore, the first individual electrode 82a faces the common electrode 81a across the opposite section 55 in the Z-direction. On the upper surface of the opposite section 55, the +Y-side end section in the first individual electrode 82a is separated from the connection 81c guided on the upper surface.

[0092] The second single electrode 82b is formed on an inner surface of the decoupling groove 58 (the +X-side decoupling groove 58a), which is located on the +X side with respect to the pressure chamber 50. The second single electrode 82b is formed above the inner surface facing the +X-side and the bottom surface in the inner surfaces of the +X-side decoupling groove 58a. Therefore, the second single electrode 82b faces the common electrode 81a across the +X-side drive section 59a.

[0093] The third single electrode 82c is formed on an inner surface of the decoupling groove 58 (the -X-side decoupling groove 58b), which is located on the -X side with respect to the pressure chamber 50. The third single electrode 82c is formed above the inner surface facing the -X side and the bottom surface of the inner surfaces of the -X-side decoupling groove 58b. Therefore, the third single electrode 82c faces the common electrode 81a across the -X-side drive section 59b. The second single electrode 82b, corresponding to one pressure chamber 50, and the third single electrode 82c, corresponding to another pressure chamber 50 located adjacent to the first pressure chamber 50, are separated on the bottom surface of the decoupling groove 58.

[0094] The connection 82d, which runs along the upper surface, connects the first single electrode 82a, the second single electrode 82b, and the third single electrode 82c to each other on the upper surface of the opposite section 55. These electrodes are arranged to form a pressure chamber 50. The connection 82d runs along the upper surface and extends like a strip in the X-direction into the -Y-side end section on the upper surface of the opposite section 55. The connection 82d runs along the upper surface and is connected to the first single electrode 82a in a central section in the X-direction. The connection 82d runs along the upper surface and is connected to the second single electrode 82b in the +X-side end section. The connection 82d runs along the upper surface and is connected to the third single electrode 82c in the -X-side end section.

[0095] The through-connection 82e serves to connect the connection 82d, which is guided on the upper surface, and the individual contact point 82f to each other and is arranged such that it penetrates the support plate 42. The through-connection 82e is formed on an inner surface of the individual penetration section 73. The through-connection 82e is connected to the connection 82d, which is guided on the upper surface, at a lower end edge of the individual penetration section 73. It should be noted that it is sufficient for the through-connection 82e to ensure the connection over its entire length in the Z-direction of the inner surface of the individual penetration section 73. In other words, the through-connection 82e can be formed over, for example, the entire inner surface of the individual penetration section 73 in the circumferential direction, or it can be formed over only a portion of it in the circumferential direction.

[0096] As in Fig. 4 and Fig. As shown in Figure 10, the single contact point 82f is formed on the upper surface of the support plate 42. The single contact point 82f is connected to the through connection 82e at the upper end opening edge of the single penetration section 73.

[0097] As in Fig. As shown in Figure 6, the actuator plate 41 is provided with a protective film 88 that covers the actuator plate from below. The protective film 88 is arranged such that it covers the entire surface of the inner surfaces of the pressure chamber 50 and the lower surface of the separation section 56. Thus, the protective film 88 protects the common electrode 81a. The protective film 88 comprises an organic insulating material such as a para-xylylene resin material (e.g., Parylen (a registered trademark)) as the insulating material. The protective films 88 can be made of tantalum oxide (Ta₂O₅), silicon nitride (SiN), silicon carbide (SiC), silicon dioxide (SiO₂), diamond-like carbon, or the like, or at least comprise one of these materials. <Strömungsweg-Abdeckung 34>

[0098] As in Fig. 3 and Fig. As shown in Figure 7, the flow path frame element 31 and the chip module 37 are clamped between the flow path cover 34 and a reinforcement plate 38. The flow path cover 34 is provided with a cover base 90, an input port 91, and an output port 92.

[0099] The outer shape of the cover base 90, as seen from above, is that of a rectangular plate, designed to have an outer shape corresponding to the flow path frame element 31. The cover base 90 is stacked onto the upper surface of each of the flow path frame elements 31 and the chip module 37. The cover base 90 is bonded to the upper surface of each of the flow path frame elements 31 and the chip module 37 by an adhesive or the like, and is simultaneously fastened to the flow path frame element 31 by screws or the like. Thus, the cover base 90 closes off an upper end opening section of each of the common inlet flow path 31b and the common outlet flow path 31c.

[0100] A slot 90a is formed in a central section in the Y-direction of the cover base 90. The slot 90a penetrates the cover base 90 in the Z-direction and extends simultaneously in the X-direction. The slot 90a is formed at a position that overlaps the central section (a section without an outer circumferential section) of the chip module 37. In particular, the Y-direction dimension of the slot 90a is smaller than the Y-direction dimension of the chip module 37. The X-direction dimension of the slot 90a is smaller than the X-direction dimension of the chip module 37. The slot 90a exposes at least a portion of the common contact point 81e and the individual contact point 82f on the upper surface of the support plate 42.

[0101] The inlet port 91 is located in an end section on the +Y side and the +X side of the cover base 90. The inlet port 91 projects upward from the cover base 90. The inlet port 91 is connected to the common inlet flow path 31b through the +X-side end section (a section projecting towards the chip housing section 31a) in the common inlet flow path 31b. In other words, the ink flowing through the ink supply tube 21 is fed into the common inlet flow path 31b through the inlet port 91.

[0102] The output port 92 is located in an end section on the -Y side and the -X side of the cover base 90. The output port 92 projects upward from the cover base 90. The output port 92 is connected to the common outlet flow path 31c through the -X-side end section (a section projecting towards the chip housing section 31a) in the common outlet flow path 31c. In other words, the ink flowing through the common outlet flow path 31c is discharged through the output port 92 to the ink outlet tube 22.

[0103] The flexible circuit board 35 is connected to the upper surface of the support plate 42 through slot 90a by pressure bonding. The flexible circuit board 35 is connected to the common contact points 81e and the individual contact points 82f on the upper surface of the support plate 42. The flexible circuit board 35 is pulled upwards and then connected to the control unit. [Operating procedure of printer 1]

[0104] The following describes how a character, figure, or the like is recorded on the recording target medium P using printer 1, which is configured as described above.

[0105] It is noted that it is assumed that, as an initial state, sufficient ink of different colors is present in the four [unclear text]. Fig. The ink reservoir 4 shown in Figure 1 is filled. Furthermore, a state is provided in which the inkjet heads 5 are each filled with the ink in the ink reservoirs 4 via the ink circulation mechanisms 6.

[0106] In such an initial state, the recording target medium P is transported to the +X side during operation of the printer 1, while it is clamped by the rollers 11, 12 of the conveying mechanisms 2, 3. Furthermore, the inkjet heads 5 mounted on the carriage 29 move back and forth in the Y-direction due to the carriage 29 simultaneously moving in the Y-direction.

[0107] While the inkjet heads 5 perform the back-and-forth movement, the ink from each of the inkjet heads 5 is ejected in a suitable manner towards the recording target medium P. Thus, it is possible to record the character, image, and the like on the recording target medium P.

[0108] The operation of each of the 5 inkjet heads is described in detail below.

[0109] In such a recirculating side-shot inkjet head 5 as in the first embodiment, the ink is initially circulated in the circulation flow path 23 by the pressure pump 24 and the suction pump 25, which are located in Fig. The ink, as shown in Figure 2, is operated as follows: In this case, the ink circulating through the ink supply tube 21 is fed into the common inlet flow path 31b through the inlet port 91. The ink fed into the common inlet flow path 31b is distributed to the pressure chambers 50 through the +Y-side opening section in each of the pressure chambers 50 and then flows through each of the pressure chambers 50 to the -Y-side. Subsequently, the ink is discharged from each of the pressure chambers 50 through the -Y-side opening section to the common outlet flow path 31c. The ink discharged to the common outlet flow path 31c flows through the outlet port 92 into the ink outlet tube 22, thus returning to the ink reservoir 4. This allows the ink to circulate between the inkjet head 5 and the ink reservoir 4.

[0110] If the back-and-forth movement of the inkjet heads 5 is due to the adjustment of the carriage 29 (see Fig. 1) When the process is started, the drive voltages are applied between the common electrodes 81a and the individual electrodes 82a to 82c via the flexible circuit boards 35. At this point, the common electrode 81a is set to a reference potential GND, and the individual electrodes 82a to 82c are set to a drive potential Vdd to apply the drive voltage. A potential difference then arises between the common electrode 81a and the individual electrodes 82a to 82c, which are oriented towards each other across the opposite section 55, thereby generating an electric field in the opposite section 55.

[0111] Specifically, the potential difference in the Z-direction occurs between the common electrode 81a and the first individual electrode 82a. Due to this potential difference in the Z-direction, the electric field in the opposite section 55 is generated in a direction parallel to the polarization direction (the Z-direction). Consequently, strain deformation occurs in the actuator plate 41 in the Z-direction in a bending mode. Furthermore, the potential difference in the X-direction occurs between the common electrode 81a and the second individual electrode 82b, and between the common electrode 81a and the third individual electrode 82c. Since the electric field in the drive section 59 is generated due to the potential difference produced in the X-direction, the thickness shear deformation in the Z-direction in the drive section 59 occurs in a shear mode.As a result, an upward shear deformation occurs in the opposite section 55 in each of the pressure chambers 50 in a direction from both end sections towards the central section in the X-direction. In other words, this leads to both the shear mode deformation and the bend mode deformation occurring in the actuator plate 41 in the Z-direction in the head chip 32 according to the first embodiment. Specifically, the actuator plate 41 (the opposite section 55) deforms in a direction away from the pressure chamber 50 due to the application of the drive voltage. This increases the volume in the pressure chamber 50.

[0112] Subsequently, when the drive voltage is set to zero, the opposite section 55 is reset to restore the volume in the pressure chamber 50. During the reset process of the actuator plate 41, the pressure in the pressure chamber 50 increases, causing the ink in the pressure chamber 50 to be expelled through the connecting hole 43a and the nozzle hole 39a. As the expelled ink lands on the recording target medium P, the print information is recorded on the recording target medium P. <Verfahren zur Herstellung der Ausstoßeinheit 30>

[0113] The procedure for manufacturing the ejection unit 30 described above is then described. Fig. Figure 11 is a flowchart that describes a process for manufacturing the output unit 30.

[0114] As in Fig. Figure 11 illustrates the process for manufacturing the ejection unit 30, comprising a first actuator process step S11, a first support plate process step S12, a first bonding step S13, a second actuator process step S14, a second support plate process step S15, a step for forming a protective film S16, a second bonding step S17, an assembly step S18, and a third bonding step S19. For the sake of simplicity, the following description illustrates the manufacturing of the chip module 37 chip by chip.

[0115] Fig. 12 and Fig. 13 are manufacturing diagrams that describe the first actuator process step S11 and which are Fig. 6 corresponding cross-sectional views.

[0116] As in Fig. As shown in Figure 12, in the first actuator process step S11, the decoupling grooves 58 are formed in the actuator plate 41 (one step to form the decoupling groove). Specifically, the decoupling grooves 58 are formed by performing a sawing operation or the like on the upper surface of the actuator plate 41.

[0117] Then, as in Fig. Figure 13 shows that in the first actuator process step S11, sections of the drive connections (the individual electrodes 82a to 82c, the connections 81c, 82d, etc. guided on the upper surface) are formed on the upper surface of the actuator plate 41 (a first step for forming connections). In this first step, a mask structure with open areas for forming the drive connections is formed on the upper surface of the actuator plate 41. Then, for example, an electrode material is deposited onto the actuator plate 41 by oblique vapor deposition. The electrode material is deposited onto the actuator plate 41 through openings in the mask structure. This forms the drive connections on the upper surface of the actuator plate 41 and on the inner surfaces of the decoupling grooves 58.Subsequently, by irradiating the bottom surfaces of the decoupling grooves 58 with a laser beam, the second single electrode 82b, which corresponds to a pressure chamber 50, and the third single electrode 82c, which corresponds to another pressure chamber 50 located next to the first pressure chamber 50, are separated from each other at each of the bottom surfaces of the decoupling grooves 58.

[0118] Fig. 14 and Fig. 16 are manufacturing diagrams that describe the first support plate process step S12 and which are Fig. 7 corresponding cross-sectional views.

[0119] As in Fig. As shown in Figure 14, in the support plate process step S12, the support plate 42 is first provided with the conductive sections 61, 62. Specifically, the common recessed sections 65 and the individual recessed sections 70 are prepared on the upper surface of the support plate 42 by sandblasting or similar processes. Subsequently, as shown in Fig. As shown in Figure 15, the lower surface of the support plate 42 is provided with the common connecting groove 66 and the individual connecting grooves 71 by sawing or the like. During this process, the common connecting groove 66 and the individual connecting grooves 71 are formed such that the common connecting groove 66 and the common recessed sections 65 are interconnected, and the individual connecting grooves 71 and the individual recessed sections 70 are each interconnected. This forms the conductive sections 61, 62.

[0120] Then, as in Fig. Figure 16 shows that in the first support plate process step S12, the deformation absorption sections 60 are formed. The deformation absorption sections 60 are formed on the lower surface of the support plate 42 by sawing or the like.

[0121] Fig. Figure 17 is a manufacturing diagram that describes the first bonding step S13 and is a cross-sectional view accordingly. Fig. 6 is involved.

[0122] As in Fig. As shown in Figure 17, the support plate 42 is attached to the upper surface of the actuator plate 41 with an adhesive or the like in the first bonding step S13. In the first bonding step S13, excess adhesive, which inevitably flows together during the pressure bonding of the actuator plate 41 and the support plate 42, is retained in the common connection groove 66, the individual connection grooves 71, and the deformation absorption sections 60.

[0123] Fig. Figure 18 is a manufacturing diagram that describes the second actuator process step S14 and is a cross-sectional view accordingly. Fig. 6 is involved.

[0124] As in Fig. As shown in Figure 18, in the second actuator process step S14, grooves with a width corresponding, for example, to the recessed sections 57, are provided on the lower surface of the actuator plate 41 by sawing or the like. Subsequently, sections of the drive connections (the common electrodes 81a, the connections guided on the end face 81b, etc.) are formed on the lower surface and the +Y-side end face of the actuator plate 41 (the second step for forming connections). Then, for example, by sawing on the lower surface of the actuator plate 41, sections are formed that each correspond to a region between the adjacent separating sections 56 of the pressure chambers 50.

[0125] It is noted that in the second actuator process step S14, a grinding operation or the like is carried out in a suitable manner to smooth the lower surface of the actuator plate 41. Since the support plate 42 is stacked on the upper surface of the actuator plate 41, it follows that the grinding operation is carried out on the lower surface of the actuator plate 41 in the state in which it is supported by the support plate 42.

[0126] In the second support plate process step S15, the support plate 42 is provided with the through-connections 81d, 82e and the contact points 81e, 82f of the drive connections (the third step for forming connections). Specifically, a mask structure is formed on the upper surface of the support plate 42, in which areas for forming the through-connections 81d, 82e and the contact points 81e, 82f are open. Then, the electrode material is applied to the support plate 42, for example, by oblique vapor deposition from the Y direction. The electrode material is applied to the support plate 42 through openings in the mask structure. This forms the through-connections 81d, 82e and the contact points 81e, 82f.

[0127] Fig. Figure 19 is a manufacturing diagram that describes a step in forming a protective film S16 and is a cross-sectional view accordingly. Fig. 6 is involved. As in Fig. As shown in Figure 19, the protective film 88 is formed in the step to form a protective film S16 on the lower surface of the actuator plate 41.

[0128] In the second bonding step S17, the intermediate plate 43 is attached to the lower surface of the actuator plate 41 using an adhesive or the like.

[0129] In this way, chip module 37 is completed.

[0130] Subsequently, in assembly step S18, the chip module 37 is mounted to the flow path frame element 31. Specifically, the chip module 37 is installed in the chip housing section 31a such that the lower surface of the flow path frame element 31 and the lower surface of the chip module 37 are arranged in a coplanar manner.

[0131] In the third bonding step S19, the nozzle plate 39 is then attached such that it covers the lower surface of the flow path frame element 31 and the lower surface of the chip module 37 in one piece. The flow path cover 34 is then attached to the upper surface of the flow path frame element 31.

[0132] In this way, the ejection unit 30 is completed.

[0133] As described above, the head chip 32 according to the first embodiment is provided with the nozzle plate (jet hole plate) 39, which is penetrated by the plurality of nozzle holes (jet holes) 39a in the Z direction (a first direction) and in which the plurality of nozzle holes are arranged such that they are arranged in the X direction (a second direction), and the actuator plate 41 is arranged such that it faces the nozzle plate 39.The actuator plate 41 is provided with the opposite section 55, which has a lower surface (a first surface) facing the pressure chamber 50 in the Z direction, and an upper surface (a second surface) facing a side opposite the pressure chamber 50, and is arranged in a state in which it is separated from the nozzle plate 39 in the Z direction, and with the separating section 56, which is formed integrally with the opposite section 55 and at the same time projects from the opposite section 55 in the Z direction.In the opposite section 55, the common electrode (a first electrode) 81a, arranged on an inner surface of the recessed section (a first groove) 57 formed on the lower surface at a position opposite the pressure chamber 50, and the individual electrodes (second electrodes) 82b, 82c are provided, arranged on an inner surface of the decoupling groove (a second groove) 58 formed on the upper surface at a position that overlaps the separating section 56 in plan view. At least part of the separating section 56 is arranged at a position that does not overlap the drive section 59 in plan view.

[0134] According to this design, the electric field in the drive section 59 arises from the potential difference generated between the common electrode 81a, with which the recessed section 57 is provided, and the individual electrodes 82b, 82c, which are formed in the decoupling groove 58. Thus, by deforming the drive section 59 in the Z-direction in the so-called shear mode, it is possible to eject the ink through the nozzle hole 39a.

[0135] In particular, in the first embodiment, since at least part of the separating section 56 is arranged in a position that does not overlap the drive section 59 in the top view, a gap in the Z-direction occurs between the intermediate plate 43 or the nozzle plate 39 and the drive section 59. Therefore, the deformation of the drive section 59 by the nozzle plate 39 or the intermediate plate 43 during ink ejection can be avoided. Consequently, it is easy to ensure the extent of deformation of the actuator plate 41 to guarantee the pressure generated in the pressure chamber 50.

[0136] According to the first embodiment, the separating section 56 also functions as at least a part of the separating section 56 that separates the adjacent pressure chambers 50. This makes it possible to improve the positional accuracy in the X-direction between the drive section 59 and the separating section 56 compared to the embodiment in which the entire separating section 56 is formed from an element separate from the actuator plate 41. As a result, the deviation in the output power can be reduced.

[0137] In the head chip 32 according to the first embodiment, the entire separation section 56 overlaps the decoupling groove 58 in the top view.

[0138] According to this design, it is easy to ensure the area of ​​a section that, viewed from the Z-direction, does not overlap the separation section 56 in the drive section 59. Consequently, it is easy to ensure the extent of deformation of the actuator plate 41 to guarantee the pressure generated in the pressure chamber 50.

[0139] In the head chip 32 according to the first embodiment, the dimension in the X direction in the separation section 56 is smaller than the dimension in the X direction in the decoupling groove 58.

[0140] This design allows the drive section to deform more easily. Consequently, it is simple to ensure the correct degree of deformation of the actuator plate to maintain the pressure generated in the pressure chamber.

[0141] In the head chip 32 according to the first embodiment, the intermediate plate 43 is provided with the connecting holes 43a, each of which connects the nozzle hole 39a and the pressure chambers 50.

[0142] According to this embodiment, the nozzle plate 39 and the actuator plate 41 are stacked on top of each other via the intermediate plate 43. In this case, by ensuring stiffness with the intermediate plate 43, the degree of freedom in choosing the material of the nozzle plate 39 can be increased, for example by disregarding the stiffness required for the nozzle plate 39.

[0143] In the head chip 32 according to the first embodiment, the dimension in the X direction (the width) in the separating section 56 is larger than the dimension in the X direction in the drive section 59.

[0144] According to this design, it is easy to ensure the stiffness of the separating section 56 by ensuring its dimensions. Therefore, it is possible to deform the drive section 59 with a desired behavior.

[0145] In the head chip 32 according to the first embodiment, the support plate 42 is provided, which is stacked on the actuator plate 41 on a side opposite the pressure chambers 50. The embodiment used is such that the deformation-receiving section 60, which enables the deformation of the actuator plate 41, is arranged in a section that, viewed from the Z-direction, is opposite at least a part of the pressure chamber 50 in an area between the actuator plate 41 and the support plate 42.

[0146] According to this embodiment, since the support plate 42 is stacked on the actuator plate 41 on a side opposite the pressure chambers 50, it is possible to support the actuator plate 41 with the support plate 42 from the side opposite the pressure chambers 50, if the lower surface of the actuator plate 41 is provided with the pressure chambers 50, etc., or to smooth the lower surface of the actuator plate 41. Thus, it is possible to improve the machining accuracy of the actuator plate 41. Based on this, by arranging the deformation absorption section 60 in a section that is opposite at least a part of the pressure chamber 50 in the support plate 42, the inhibition of the deformation of the actuator plate 41 by the support plate 42 during ink ejection can be reduced. Consequently, it can be easily ensured that the pressure is generated by the pressure chamber 50.

[0147] Since the inkjet head 5 and the printer 1 are each equipped with the head chip 32 described above according to the first embodiment, it is possible to provide the inkjet head 5 and the printer 1 that exhibit excellent reliability. (Second embodiment)

[0148] Fig. Figure 20 is a cross-sectional view of a head chip 32 according to a second embodiment. The second embodiment differs from each of the embodiments described above in that the nozzle plate 39 is connected to the actuator plate 41 without the intermediate plate 43.

[0149] At the in Fig. In the head chip 32 shown in Figure 20, the nozzle plate 39 is made of a material with relatively high stiffness, such as a metal. The nozzle plate 39 is connected to the lower surface of the actuator plate 41 (the separating section 56) by an adhesive or the like. In the second embodiment, the lower end face of the drive section 59 is arranged in a state in which it is separated in the Z-direction from an upper surface of the nozzle plate 39. In this case, a gap 77 formed between the lower surface of the drive section 59 and the upper surface of the nozzle plate 39 forms part of the pressure chamber 50.

[0150] According to this design, since the jet hole plate 39 is stacked directly onto the lower surface of the actuator plate 41, the number of components can be reduced in order to achieve a reduction in costs compared to the case in which the intermediate plate 43 is placed between the actuator plate 41 and the nozzle plate 39.

[0151] Furthermore, in each of the embodiments described above, the configuration in which the support plate 42 is provided with the deformation-absorbing sections 60 is described, but this configuration does not represent a limitation. As in the second embodiment, the deformation-absorbing section 60 is not an essential element. (Third embodiment)

[0152] Fig. Figure 21 is a cross-sectional view of a head chip 32 according to a third embodiment. The third embodiment differs from each of the embodiments described above in that the common electrodes are formed on the upper surface of the opposite section 55 and the individual electrodes are formed on the lower surface of the opposite section 55.

[0153] At the in Fig. The head chip 32 shown in 21 includes the common connections first common electrodes 81j and second common electrodes 81k.

[0154] The first common electrodes 81j are each formed on a section that overlaps each of the pressure chambers 50 in plan view on the upper surface of the opposite section 55. In particular, the first common electrodes 81j are each formed on a section that overlaps each recessed section 57 in plan view on the upper surface of the opposite section 55.

[0155] The second common electrodes 81k are each formed on an inner surface of the decoupling groove 58. In the example shown, the second common electrode 81k is formed over the entire inner surface of the decoupling groove 58.

[0156] The individual connections 82 comprise individual electrodes 82j on the lower surface of the opposite section 55. The individual electrode 82j is formed on at least one inner surface of each of the recessed sections 57 on the lower surface of the opposite section 55. In the illustrated example, the individual electrode 82j is formed over the entire inner surface of the recessed section 57. In other words, the first individual electrode 82j faces the first common electrode 81j across the opposite section 55 in the Z-direction.

[0157] According to this configuration, a potential difference arises in the Z-direction between the first common electrode 81j and the individual electrode 82j. Due to the potential difference in the Z-direction, an electric field is generated in the actuator plate 41 in a direction parallel to the polarization direction (the Z-direction). Consequently, a strain deformation occurs in the actuator plate 41 in the Z-direction in a bending mode.

[0158] Furthermore, a potential difference occurs in the X-direction between the second common electrode 81k and the single electrode 82j. Due to the potential difference generated in the X-direction, thickness shear deformation occurs in the Z-direction in the actuator plate 41 in shear mode. Consequently, in the third embodiment, this also leads to both the deformation caused by the shear mode and the deformation caused by the bending mode occurring in the actuator plate 41 in the Z-direction. Thus, the ink in the pressure chamber 50 is expelled outwards through the nozzle hole 39a. (Other modified examples)

[0159] It should be noted that the scope of the present disclosure is not limited to the embodiments described above, but that a multitude of modifications may be made within the scope of protection or the spirit of the present disclosure.

[0160] For example, in the embodiments described above, the inkjet printer 1 is mentioned in the description as an example of the liquid jet recording device, but the liquid jet recording device is not limited to the printer. For example, a fax machine, a print-on-demand printing press, etc., can also be used.

[0161] In the embodiments described above, the description cites as an example the configuration (a so-called pendulum machine) in which the inkjet heads move relative to the recording target medium during printing, but this configuration does not represent a limitation. The configuration relating to the present disclosure can be applied as the configuration (a so-called stationary-head machine) in which the recording target medium is moved relative to the inkjet heads in the state where the inkjet heads are stationary.

[0162] In the embodiments described above, the explanation refers to paper as the recording target medium P, but this configuration does not represent a limitation. The recording target medium P is not limited to paper, but can also be a metal material, a resin material, a foodstuff, or the like.

[0163] The embodiments described above explain the configuration in which the liquid jet heads are integrated into the liquid jet recording device, but this configuration does not represent a limitation. In particular, the liquid ejected by the liquid jet heads is not limited to what lands on the recording target medium, but can also be, for example, a medical solution to be mixed during a dispensing process, a food additive such as a seasoning or spice to be added to a foodstuff, or a fragrance to be sprayed into the air.

[0164] In the embodiments described above, the configuration is explained in which the Z-direction coincides with the direction of gravity, but this configuration does not represent a limitation, and it is also possible to set the Z-direction to a direction along the horizontal direction.

[0165] In each of the embodiments described above, the configuration is described in which the pressure chamber 50 is designed such that it has a groove shape that penetrates the chip module 37 in a straight line in the Y direction; however, this configuration does not represent a limitation. The pressure chamber 50 can be suitably modified so that, for example, it has a round shape in top view. Even if the pressure chamber 50 is designed, for example, to have a round shape, it is preferable that the deformation absorption section extends along the outer circumferential section of the pressure chamber 50 in top view.

[0166] In the embodiments described above, the configuration in which the actuator plate 41 is deformed in both bending mode and shearing mode is described, but this configuration does not represent a limitation. It is sufficient that the actuator plate 41 is deformed in at least either bending mode or shearing mode.

[0167] Furthermore, it is arbitrarily possible to replace the components in the embodiments described above with known components within the scope of protection or spirit of the present disclosure, and it is also possible to combine the modified examples described above arbitrarily. QUOTES INCLUDED IN THE DESCRIPTION

[0000] This list of documents cited by the applicant was automatically generated and is included solely for the reader's convenience. The list is not part of the German patent or utility model application. The DPMA accepts no liability for any errors or omissions. Cited patent literature

[0000] JP 7220327B

[0003]

Claims

[1] Head chip, encompassing: a beam-hole plate penetrated by a plurality of beam holes in a first direction, and in which the plurality of beam holes are arranged side by side in a second direction intersecting the first direction; and an actuator plate facing the beam hole plate in the first direction and having a plurality of pressure chambers formed between the actuator plate and the beam hole plate, wherein the plurality of pressure chambers are each connected to the plurality of beam holes, wherein The actuator plate includes the following: an opposite section having a first surface facing the plurality of pressure chambers in the first direction and a second surface facing a side opposite to the first direction with respect to the first surface, and arranged in a state in which it is separated from the beam hole plate in the first direction, a separating section which is integrally formed with the opposite section projecting from the opposite section in the first direction and is designed to separate the pressure chambers lying side by side in the second direction, a first electrode provided on an inner surface of the first groove, which is formed on the first surface at a position opposite each of the plurality of pressure chambers when viewed from the first direction, and a second electrode provided on an inner surface of a second groove formed on the second surface at a position that overlaps each of the separation sections when viewed from the first direction, and wherein at least part of the separating section is arranged in a position which does not overlap a drive section when viewed from the first direction, wherein the drive section is located in the opposite section between the first groove and the second groove, which are adjacent in the second direction. [2] Head chip according to claim 1, wherein an entirety of the separating section overlaps the second groove when viewed from the first direction. [3] Head chip according to claim 1, wherein a dimension in the second direction in the separation section is smaller than a dimension in the second direction in the second groove. [4] Head chip according to claim 1, wherein an intermediate plate is arranged between the beam hole plate and the actuator plate, and the intermediate plate is provided with a connecting hole designed to connect the jet hole and the pressure chamber. [5] Head chip according to claim 1, wherein the beam hole plate is stacked directly onto the actuator plate over the separation section. [6] Head chip according to claim 1, wherein a dimension in the second direction in the separation section is larger than a dimension in the second direction in the drive section. [7] Head chip according to claim 1, wherein a support plate is stacked on the actuator plate on one side opposite the beam hole plate in the first direction, and a deformation absorption section, which allows deformation of the actuator plate, is arranged in a section that, viewed from the first direction, is opposite at least a part of the pressure chamber in an area between the actuator plate and the support plate. [8] Liquid jet head, comprising: the head chip according to claim 1. [9] Liquid jet recording device comprising: the liquid jet head according to claim 8.

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