Heat dissipation device with double-coupled ribs

Abstract

In general terms, a heat dissipation device comprises a first plate, a second plate, and a fluid channel defined at least in part by the first and second plates. The heat dissipation device includes a plurality of fins arranged in the fluid channel, which mechanically connect the first plate to the second plate.

Description

CROSS-REFERENCE TO RELATED REGISTRATIONS

[0001] This application claims the benefit of the preliminary U.S. application No. 63 / 729,118, filed on December 6, 2024, which is hereby incorporated by reference in its entirety. TECHNICAL AREA

[0002] This description refers to semiconductor package assemblies and, in particular, to a heat dissipation device with double-coupled fins. BACKGROUND

[0003] Semiconductor package assemblies (e.g., power modules for semiconductor devices) can include substrates bonded to heat dissipation mechanisms (e.g., heat sinks, water jackets, etc.). Mechanical stresses from thermal cycling can weaken the bond between the semiconductor package assemblies and the heat sink, leading to poor cooling performance and even detachment. SUMMARY

[0004] The techniques described herein relate to a heat dissipation device. In general terms, a heat dissipation device includes a first plate, a second plate, and a fluid channel defined at least in part by the first and second plates. The heat dissipation device includes a plurality of fins arranged in the fluid channel, the plurality of fins mechanically connecting the first plate to the second plate.

[0005] In some aspects, the multitude of ribs extends from a surface of the first plate, and the heat dissipation device further includes a multitude of metallurgical connections, each connecting the multitude of ribs to the second plate.

[0006] In some aspects, the multitude of metallurgical joints is one of a multitude of soldered joints or a multitude of welded joints.

[0007] In some aspects, the multitude of ribs and the first plate are formed in one piece.

[0008] In some aspects, the second plate includes a multitude of recesses. The multitude of recesses corresponds to the multitude of ribs inserted into the multitude of recesses. In some aspects, the multitude of recesses is a multitude of through holes.

[0009] In some aspects, the heat dissipation device includes a cover plate that is connected to the first plate.

[0010] In some aspects, the heat dissipation device includes an inlet port and an outlet port coupled to the fluid channel, with the inlet port and outlet port being located at opposite ends of the heat dissipation device.

[0011] In some aspects, the heat dissipation device includes an inlet port and an outlet port coupled to the fluid channel, with the inlet port and outlet port being located on a bottom surface of the second plate.

[0012] In general terms, a heat dissipation device includes a first plate that incorporates a plurality of depressions. The heat dissipation device includes a second plate that incorporates a plurality of fins extending from the second plate and interacting with the plurality of depressions. The heat dissipation device includes a fluid channel that is defined at least partially by the first plate and the second plate, with the plurality of fins arranged in the fluid channel.

[0013] In some aspects, the heat dissipation device incorporates a variety of metallurgical connections that link the multiple fins to the second plate. These connections can be either soldered or welded joints.

[0014] In some aspects, the first plate is a top plate and the second plate is a bottom plate, and the multitude of ribs are formed integrally with the bottom plate.

[0015] In some aspects, the multitude of depressions is a multitude of through holes.

[0016] In some aspects, the upper surfaces of the multitude of ribs are essentially coplanar with a surface of the cover plate.

[0017] In some aspects, the heat dissipation device includes a cover plate coupled to the cover plate, the cover plate being configured for attachment to a power module.

[0018] In some aspects, the first plate is a base plate, and the second plate is a top plate, and the multitude of ribs are formed integrally with the top plate.

[0019] In some aspects, the multitude of depressions represents a multitude of cavities in a surface of the base plate within the fluid channel.

[0020] In general terms, a method includes coupling a first plate to a second plate such that a plurality of ribs extending from the first plate contact the second plate, the first plate and the second plate defining at least a portion of a fluid channel, with the plurality of ribs arranged within the fluid channel. The method also includes forming a metallurgical bond between the plurality of ribs and the second plate.

[0021] In some aspects, forming the metallurgical bond involves soldering a large number of ribs to the second plate. In other aspects, forming the metallurgical bond involves welding a large number of ribs to the second plate.

[0022] In some aspects, coupling the first plate with the second plate involves joining the multitude of ribs with a multitude of depressions in the second plate.

[0023] In some aspects, the multitude of depressions is a multitude of through holes, and the process also includes arranging a cover plate on the second plate and forming a metallurgical bond between the cover plate and the second plate and between the cover plate and the respective upper surfaces of the multitude of ribs.

[0024] The details of one or more implementations are set out in the accompanying drawings and the following description. Other features will become apparent from the description, the drawings, and the claims. BRIEF DESCRIPTION OF THE DRAWINGS Fig. Figure 1 is a perspective view of an example cooling assembly according to at least one embodiment of the present disclosure. Fig. Figure 2 is a sectional view from the front of a cooling assembly according to at least one embodiment of the present disclosure. Fig. Figure 3 is a sectional view from the front of a cooling assembly according to at least one embodiment of the present disclosure. Fig. Figure 4 is a sectional view from the front of a cooling assembly according to at least one embodiment of the present disclosure. Fig. Figure 5 is a sectional view from the front of a cooling assembly according to at least one embodiment of the present disclosure. Fig. Figure 6 is a sectional view from the front of a cooling assembly according to at least one embodiment of the present disclosure. Fig. Figure 7 schematically illustrates a top view of a cover plate configured with through holes according to at least one embodiment of the present disclosure. Fig. Figure 8 schematically illustrates a base plate that includes an arrangement of ribs according to at least one embodiment of the present disclosure. Fig. Figure 9 schematically illustrates a sectional view of a cooling assembly that includes a power module coupled to a cooler according to at least one embodiment of the present disclosure. Fig. Figures 10A to 10C describe an example process for manufacturing a heat dissipation device that includes a doubly coupled rib arrangement according to at least one embodiment of the present disclosure. Fig. Figures 11A to 11D present another example process for manufacturing a heat dissipation device that includes a doubly coupled rib arrangement according to at least one embodiment of the present disclosure. Fig. Figures 12A to 12C present a further example process for manufacturing a heat dissipation device which includes a doubly coupled rib arrangement according to at least one embodiment of the present disclosure. Fig. 13 presents an exemplary method for a heat dissipation device which includes a doubly coupled rib arrangement according to at least one embodiment of the present disclosure.

[0025] In the various drawings, which are not necessarily drawn to scale, the same reference numerals may indicate the same and / or similar components (elements, structures, etc.) in different views and / or implementations. The drawings generally illustrate, by way of example but not as an exhaustive limitation, various implementations described in this disclosure. Reference numerals shown in one drawing may not be repeated for the same and / or similar elements in related views. Reference numerals repeated in multiple drawings may not be specifically discussed with respect to each of these drawings but are repeated for the sake of context and ease of cross-referencing between related views.Similarly, not all identical elements in the drawings may be specifically referenced with a reference symbol if multiple instances of an element are illustrated. DETAILED DESCRIPTION

[0026] A cooler is a heat dissipation structure configured to remove heat from one or more attached semiconductor devices. The cooler includes a body that defines an internal fluid channel through which a coolant (e.g., water, dielectric fluid, or refrigerant) flows between an inlet port and an outlet port. In some implementations, a cooler includes a housing and an attached cover plate that define the fluid channel. The cooler may include internal fins, rods, turbulators, or other flow-breaking structures arranged within the fluid channel to increase the internal surface area and improve heat transfer.A mounting surface of the cooler provides a thermally conductive interface to a semiconductor package, power module, or other electronic assembly, enabling efficient transfer of heat generated during operation to the coolant. The cooler can be made of thermally conductive materials such as copper, aluminum, or combinations thereof.

[0027] Semiconductor devices, such as power modules or integrated circuit packages, are coupled to the heatsink to dissipate the heat they generate. For example, the semiconductor devices can be sintered directly onto the heatsink using a metal sintering layer (e.g., silver) or by soldering. During thermal cycling, differences in the coefficient of thermal expansion between the heatsink and the semiconductor package create stresses at the interface. If the heatsink lacks sufficient stiffness, warping will cause the heatsink surface and / or the semiconductor device to deflect, introducing bending stresses into the connection point (e.g., sintered or soldered joint).Such deformation can lead to local lifting or detachment of the sintered layer, potentially creating microcracks, voids, or delaminations, which increases thermal resistance and can ultimately lead to device failure. Furthermore, deformation of the semiconductor device can lead to cracking in the die or delamination of the die from its substrate.

[0028] A cooler's housing comprises an upper and a lower section. Typically, the fins extend from one section of the housing into the fluid channel to the other section. In some cases, the fins contact the other housing section, which can provide the cooler with some structural rigidity. However, a potential weak point is created by tiny gaps between the ends of the fins in the fluid channel and the surface of the opposite housing section. These microscopic gaps reduce the structural rigidity of the heat dissipation device and allow for slight warping of the structure. Even this slight warping can cause damage to the semiconductor package.

[0029] To overcome this, the heat dissipation devices described herein employ a “double-coupled rib” architecture. As used herein, “double-coupled rib” refers to internal ribs that are mechanically and thermally attached to both the top and bottom plates of the fluid channel, creating a uniform and rigid internal support structure. This double coupling is achieved in several ways. In some embodiments, ribs formed integrally with a plate are permanently joined to the opposing plate using a metallurgical bond, such as a brazed or welded joint. In other embodiments, the mechanical coupling is achieved by the interaction of the ribs with a suitable arrangement of recesses (e.g., cavities or through-holes) in the opposing plate into which the ribs are inserted.This mechanical interlock can be further reinforced by a metallurgical bond within the recesses. The primary advantage of any double-coupled design is a significant increase in the overall structural rigidity of the cooler. By creating a unified, reinforced structure, the fins act as support pillars, preventing the top and bottom plates from flexing or warping under the mechanical stress of temperature cycling. This improved stability maintains the integrity of the bond between the cooler and the attached semiconductor device, ensuring reliable long-term thermal performance and preventing premature device failure.

[0030] Fig. Figure 1 is a perspective view of an example cooling assembly 100 according to at least one embodiment of the present disclosure. The cooling assembly includes a cooler 110 configured to dissipate heat generated by the semiconductor devices 130, 132, 134 coupled to the cooler 110. The cooler includes a lower housing 101 and an upper housing 103. The lower housing 101 and the upper housing 103 define an internal fluid channel of the cooler 110. A fluid inlet port 114 and a fluid outlet port (not shown) are fluidically coupled to the fluid channel such that a cooling medium enters the cooler 110 through the inlet port 114, flows through the fluid channel, and exits through the outlet port. The assembly 100 enables direct heat transfer from the semiconductor devices 130, 132, 134 to the cooler 110 and to the coolant flowing through the fluid channel.

[0031] In various implementations, the cooler 110 can be constructed from thermally conductive materials such as copper, aluminum, or combinations thereof. In some implementations, both the upper housing 103 and the lower housing 101 are constructed of aluminum (e.g., constructed entirely of aluminum). In other implementations, both the upper housing 103 and the base plate 201 are constructed of copper (e.g., constructed entirely of copper). In still other implementations, the upper housing 103 is copper, and the lower housing 101 is aluminum, allowing copper to be positioned close to the semiconductor device to improve thermal conductivity, while aluminum reduces the overall mass and cost. In other implementations, the upper housing 103 is aluminum, and the lower housing 101 is copper, providing structural rigidity while reducing the mass of the upper housing 103.In other implementations, at least one of the upper housing 103 and the lower housing 101 is a hybrid construction that includes both aluminum and copper components. For example, the upper housing 103 may include an aluminum body and a copper- or nickel-plated copper surface.

[0032] In some implementations, the upper housing 103 and the lower housing 101 can be joined by brazing, diffusion bonding, adhesive bonding, laser welding, or other suitable joining techniques, in addition to being joined by a rib arrangement. In one particular implementation, the upper housing 103 and the lower housing 101 are joined by friction stir welding. As used here, friction stir welding (FSW) refers to a solid-state joining process in which a rotating tool is pressed against and guided along a seam between adjacent components. The heat generated by friction plastically deforms the material without melting it, thereby creating a metallurgically bonded joint. FSW provides a low-porosity, high-strength interface and preserves the mechanical and thermal properties of the joined materials.The use of friction stir welding to couple the upper housing 103 and the lower housing 101 can be particularly advantageous when the cooler 110 is constructed of dissimilar metals, such as a copper top plate and an aluminum housing, or vice versa. In these implementations, friction stir welding can create a mechanical seal capable of withstanding the internal coolant pressure while maintaining heat conduction across the interface. Furthermore, the solid-state nature of the bonding process minimizes distortions and residual stresses that could otherwise contribute to warping of the cooler 110.

[0033] In some implementations, the upper housing 103 and the lower housing 101 are mechanically fastened together using screws, bolts, or other threaded fasteners. In these embodiments, one or more threaded holes may be formed in the upper housing 103 and / or lower housing 101, and appropriate fasteners are used to apply a compressive clamping force along the interface. The mechanical fasteners may be used alone or in combination with other joining techniques, including friction stir welding, brazing, or adhesive bonding, to provide both mechanical strength and fluid sealing performance.

[0034] In some implementations, a seal (not shown) is arranged between the upper housing 103 and the lower housing 101 to provide a coolant-tight interface around the fluid channel. In some examples, the lower housing 101 includes a recessed groove formed along at least one section of its circumference, and the seal is positioned within the groove before the components are joined, as described in more detail below. In various implementations, the seal may include an O-ring, a gasket, a compressible polymer seal, an elastomeric ring, or another sealing structure or consumable sealing material configured to prevent coolant leakage when the upper housing 103 is attached to the lower housing 101.During assembly, the seal between the upper housing 103 and the lower housing 101 is compressed when the components are attached or welded together.

[0035] In some implementations, the semiconductor devices 130, 132, 134 may be or include a power semiconductor die. In some implementations, one or more semiconductor dies may be (e.g., be a section thereof) or include one or more metal-oxide-semiconductor field-effect transistor (MOSFET) devices, an insulated two-pole gate transistor (IGBT), an integrated circuit (IC), an inverter, a power conversion circuit, a bridge circuit, a fast recovery diode (FRD), a diode, and / or so forth. In one particular example, a semiconductor die of the semiconductor devices 130, 132, 134 is configured as a switching device for a high-voltage DC input power supply (e.g., at least 400 V). In some implementations, one or more semiconductor chips may be a component for an electric vehicle (EV) (e.g.,(may be part of it) or include it. In various examples, the semiconductor die can be fabricated using a silicon substrate (Si substrate) or a substrate made of a wide-bandgap material such as silicon carbide (SiC), gallium nitride (GaN), or gallium arsenide (GaAs).

[0036] In some implementations, the semiconductor devices 130, 132, 134 are each a power module, which together form a three-phase inverter, with each power module providing one phase of a three-phase output. In some examples, each semiconductor device 130, 132, 134 can include a half-bridge circuit. To generate the three-phase output, each phase can be driven by a half-bridge circuit comprising at least two power switching devices in each semiconductor device 130, 132, 134, with each phase using a high-side and a low-side switch to generate the corresponding phase voltage.

[0037] Fig. Figure 2 is a front sectional view of a cooling assembly 200 according to at least one embodiment of the present disclosure. The cooling assembly 200 can be used to implement the cooling assembly 100 of Fig. 1 can be used. For example, Fig. 2. Show a section of the cooling assembly 100, which runs along a line A in Fig. 1 was carried out. The example cooling assembly 200 of Fig. 2 includes a cooler 250 with a base plate 201 and a top plate 203. If the cooler 250 is used to implement the cooler 110 of Fig. 1 is used, the base plate 201 can be placed in the lower housing 101 of Fig. 1 be included, and the cover plate 203 can be inserted into the upper housing 103 of Fig. 1 be included. The top plate 203 and the bottom plate 201 define at least part of an internal fluid channel 218 of the cooler 250. A fluid inlet port 214 and a fluid outlet port 216 are fluidically coupled to the fluid channel 218, such that a cooling medium enters the cooler 250 through the inlet port 214, flows through the fluid channel 218, and exits through the outlet port 216. The in Fig. The assembly 200 shown enables direct heat transfer from the semiconductor devices 130, 132, 134 to the cooler 250 and to the coolant flowing through the fluid channel 218.

[0038] The top plate 203 encloses an upper surface 260, to which the semiconductor devices 130, 132, 134 can be coupled, and a lower surface 262, which faces the upper surface 260. The bottom plate 201 encloses a recessed area 240, defined by a wall 242 that extends at least partially around a circumference of the bottom plate 201. The lower surface 262 of the top plate, the surface(s) of the wall 242, and the recessed area 240 define at least partially the fluid channel 218. The fluid channel 218 can convey various types of coolant. In some examples, the coolant includes water or water-based solutions containing corrosion inhibitors. In other examples, the coolant is a dielectric fluid, which allows the cooler to operate in electrically sensitive environments, such as high-voltage power modules.Suitable dielectric fluids include, for example, fluorinated fluids, silicone oils, or hydrocarbon-based dielectric coolants. In some cases, refrigerants can be used in phase-change cooling systems.

[0039] In some implementations, such as in Fig. As shown in Figure 2, an arrangement of ribs 206 extends into the fluid channel 218 to increase the internal surface area exposed to the coolant flow. In the example of Fig. 2. The ribs 206 are formed as part of the base plate 201 and extend from the bottom of the recessed area 240 of the base plate 201 into the fluid channel 218. In some implementations, the ribs 206 are formed integrally with the base plate 201, such that the ribs 206 are one piece with the base plate 201 and form a monolithic structure. The term "one piece," as used, can refer to the fact that the base plate 201 and the ribs 206 are manufactured as a single piece, such as by extrusion, die casting, machining from a solid block (e.g., milling or computer numerical control (CNC)), or peeling. As a result, each rib 206 is formed continuously with the base plate 201 and has no joint, seam, bond line, or interface that might otherwise occur if the ribs 206 were attached separately.

[0040] The fins 206 can have various geometries, including, but not limited to, straight fins, needle fins, lamellar fins, tapered fins, or curved fins configured to induce turbulence or directed flow. In some implementations, the fins 206 extend between the top plate 203 and the bottom plate 201 to mechanically couple the opposing walls of the fluid channel 218 and increase the structural stiffness of the cooler 250. Increasing the fin height, thickness, or density can further increase stiffness and reduce the warping of the cooler 250.

[0041] While the ribs 206 are formed integrally with the base plate 201, they are coupled to the top plate 203 by metallurgical bonds 208. For example, the upper surfaces of the ribs 206 can be metallurgically bonded to the lower surface 262 of the top plate 203. In some embodiments, the ribs 206 are connected to the top plate 203 by a brazing process. For example, the ribs 206 can be positioned against the lower surface 262 of the top plate 203 such that each rib 206 contacts a corresponding bonding area on the lower surface 262. A brazing material is applied at least at the interface between each rib 206 and the bonding area. The cooler 250 is then heated to a temperature sufficient to melt the brazing material while the top plate 203 and the ribs 206 are kept below their melting temperatures.Upon reaching soldering temperature, the molten solder material wets the surface of the cover plate 203 and the fins, forming a metallurgical bond. The assembly is then cooled, allowing the solder material to solidify and create a bond that secures each fin to the heat sink. In various implementations, the solder material can be provided as a preform, wire, paste, plating layer, or electroplated coating. Furthermore, in different implementations, the solder material can include silver-based alloys, copper-based alloys, aluminum-based alloys, nickel-based alloys, gold-based alloys, and the like.

[0042] In some implementations, the ribs 206 are connected to the cover plate 203 by a welding process. The welding process may involve positioning each rib 206 at a corresponding bonding area on the cover plate 203. The ribs 206 can be held in contact with the cover plate 203 using a jig, magnetic alignment tools, or gravity-assisted placement. After positioning, a welding operation is performed to fuse each rib 206 to the cover plate 203. The welding can be performed using any suitable welding technique, including resistance welding, laser welding, electron beam welding, micro-arc welding, and so on.During welding, localized heat is applied to at least one section of the interface between each rib 206 and the cover plate 203 to heat the interface to a temperature sufficient to melt at least one of the rib material and the cover plate 203 material, thereby forming a fused weld area. The weld area is allowed to solidify, creating a metallurgical bond that secures the rib to the cover plate 203.

[0043] In the example of Fig. 2 The semiconductor devices 130, 132, 134 are coupled to the upper surface of the cooler 250, more precisely to the top plate 203. The semiconductor devices 130, 132, 134 can include a semiconductor package, a power module, a multi-die package, or a bare semiconductor die. In some implementations (as in Fig. As shown in Figure 2, a bonding layer 232 is arranged between the semiconductor devices 130, 132, 134 and the cooler 250, providing both thermal conductivity and mechanical attachment. The bonding layer 232 can include solder, sintered metal (e.g., silver sintering paste), conductive adhesive, a temporary liquid-phase bonding material, or other fastening materials. Additionally or alternatively, the semiconductor devices 130, 132, 134 can be mechanically attached to the cooler 250 using screws, bolts, clamps, and the like.

[0044] Fig. Figure 3 is a front sectional view of a cooling assembly 300 according to at least one embodiment of the present disclosure. The cooling assembly 300 can be used to implement the cooling assembly 100 of Fig. 1 can be used. For example, Fig. 3 show a section of the cooling assembly 100, which runs along line A in Fig. 1 was carried out. The example cooling assembly 300 from Fig. 3 includes a cooler 350 with a base plate 301 and a top plate 303. If the cooler 350 is used to implement the cooler 110 of Fig. 1 is used, the base plate 301 can be placed in the lower housing 101 of Fig. 1 be included and the cover plate 303 can be in the upper housing 103 of Fig. 1 be included. The top plate 303 and the bottom plate 301 define at least part of an internal fluid channel 318 of the cooler 350. A fluid inlet port 314 and a fluid outlet port 316 are fluidically coupled to the fluid channel 318, such that a cooling medium enters the cooler 350 through the inlet port 314, flows through the fluid channel 318, and exits through the outlet port 316. The in Fig. The assembly 300 shown enables direct heat transfer from the semiconductor devices 130, 132, 134 to the cooler 350 and to the coolant flowing through the fluid channel 318.

[0045] The top plate 303 encloses an upper surface 360, to which the semiconductor devices 130, 132, 134 can be coupled, and a lower surface 362, which faces the upper surface 360. The bottom plate 301 encloses a recessed area 340, which is defined by a wall 342 that extends at least partially around a circumference of the bottom plate 301. The lower surface 362 of the top plate, the surface(s) of the wall 342, and the recessed area 340 define at least partially the fluid channel 318. The fluid channel 318 can convey various types of coolant. In some examples, the coolant includes water or water-based solutions containing corrosion inhibitors. In other examples, the coolant is a dielectric fluid, which allows the cooler to operate in electrically sensitive environments, such as high-voltage power modules.Suitable dielectric fluids include, for example, fluorinated fluids, silicone oils, or hydrocarbon-based dielectric coolants. In some cases, refrigerants can be used in phase-change cooling systems.

[0046] In some implementations, such as in Fig. As shown in Figure 3, an arrangement of ribs 306 extends into the fluid channel 318 to increase the internal surface area exposed to the coolant flow. In the example of Fig. The ribs 306 are formed as part of the cover plate 303 and extend from the lower surface 362 of the cover plate 303 into the fluid channel 318. In some implementations, the ribs 306 are formed integrally with the cover plate 303, forming a monolithic structure. The term "integrally formed," as used, can refer to the fact that the cover plate 303 and the ribs 306 are manufactured as a single piece, such as by extrusion, die casting, machining from a solid block (e.g., milling or computer numerical control (CNC)), or peeling. As a result, each rib 306 is formed continuously with the cover plate 303 and has no joint, seam, tie line, or interface that might otherwise occur if the ribs 306 were attached separately.

[0047] The fins 306 can have various geometries, including, but not limited to, straight fins, needle fins, lamellar fins, tapered fins, or curved fins configured to induce turbulence or directed flow. In some implementations, the fins 306 extend between the top plate 303 and the bottom plate 301 to mechanically couple the opposing walls of the fluid channel 318 and increase the structural stiffness of the cooler 350. Increasing the fin height, thickness, or density can further increase stiffness and reduce the warping of the cooler 350.

[0048] While the ribs 306 are formed integrally with the top plate 303, they are coupled to the bottom plate 301 by metallurgical bonds 308. For example, the upper surfaces of the ribs 306 can be metallurgically bonded to the recessed area 340 of the bottom plate 301. In some embodiments, the ribs 306 are connected to the bottom plate 301 by a brazing process. For example, the ribs 306 can be positioned against the lower surface 362 of the bottom plate 301 such that each rib 306 contacts a corresponding bonding area on the bottom plate 301. A brazing material is applied at least at the interface between each rib 306 and the bonding area. The cooler 350 is then heated to a temperature sufficient to melt the solder material, while the top plate 303, the bottom plate 301 and the fins 306 are kept below their melting temperatures.Upon reaching soldering temperature, the molten solder material wets the surface of the base plate 301 and the fins, forming a metallurgical bond. The assembly is then cooled, allowing the solder material to solidify and create a bond that secures each fin to the heat sink. In various implementations, the solder material can be provided as a preform, wire, paste, plating layer, or electroplated coating. Furthermore, in different implementations, the solder material can include silver-based alloys, copper-based alloys, aluminum-based alloys, nickel-based alloys, gold-based alloys, and the like.

[0049] In some implementations, the ribs 306 are connected to the base plate 301 by a welding process. The welding process may involve positioning each rib 306 at a corresponding bonding area on the base plate 301. The ribs 306 can be held in contact with the base plate 301 using a jig, magnetic alignment tools, or gravity-assisted placement. After positioning, a welding process is performed to fuse each rib 306 to the base plate 301. The welding can be performed using any suitable welding technique, including resistance welding, laser welding, electron beam welding, micro-arc welding, and so on.During welding, localized heat is applied to at least one section of the interface between each rib 306 and the base plate 301 to heat the interface to a temperature sufficient to melt at least one of the rib material and the base plate 301 material, thereby forming a fused weld area. The weld area is allowed to solidify, creating a metallurgical bond that secures the rib to the base plate 301.

[0050] In the example of Fig. 3. The semiconductor devices 130, 132, 134 are coupled to the upper surface of the cooler 350, more precisely to the cover plate 303. The semiconductor devices 130, 132, 134 can include a semiconductor package, a power module, a multi-die package, or a bare semiconductor die. In some implementations (as in Fig. As shown in Figure 3, a bonding layer 332 is arranged between the semiconductor devices 130, 132, 134 and the cooler 350, providing both thermal conductivity and mechanical attachment. The bonding layer 332 can include solder, sintered metal (e.g., silver sintering paste), conductive adhesive, a temporary liquid-phase bonding material, or other attachment materials. Additionally or alternatively, the semiconductor devices 130, 132, 134 can be mechanically attached to the cooler 350 using screws, bolts, clamps, and the like.

[0051] Fig. Figure 4 is a sectional front view of a cooling assembly 400 according to at least one embodiment of the present disclosure. The cooling assembly 400 can be used to implement the cooling assembly 100 of Fig. 1 can be used. For example, Fig. 4 shows a section of the cooling assembly 100, which runs along line A in Fig. 1 was carried out. The example cooling assembly 400 of Fig. 4 includes a cooler 450 with a base plate 401 and a top plate 403. If the cooler 450 is used to implement the cooler 110 of Fig. 1 is used, the base plate 401 can be placed in the lower housing 101 of Fig. 1 be included, and the cover plate 403 can be placed in the upper housing 103 of Fig. 1. The top plate 403 and the bottom plate 401 define at least part of an internal fluid channel 418 of the cooler 450. A fluid inlet port 414 and a fluid outlet port 416 are fluidically coupled to the fluid channel 418, such that a cooling medium enters the cooler 450 through the inlet port 414, flows through the fluid channel 418, and exits through the outlet port 416. The fluid channel 418 can carry various types of coolant. In some examples, the coolant includes water or water-based solutions containing corrosion inhibitors. In other examples, the coolant is a dielectric fluid, which allows the cooler to operate in electrically sensitive environments, such as high-voltage power modules. Suitable dielectric fluids include, for example, fluorinated fluids, silicone oils, or hydrocarbon-based dielectric coolants.In some examples, refrigerants can be used in phase-change cooling systems. The ones in... Fig. The assembly 400 shown enables direct heat transfer from the semiconductor devices 130, 132, 134 to the cooler 450 and to the coolant flowing through the fluid channel 418.

[0052] The base plate 401 encloses a recessed area 440, which is defined by a wall 442 that extends at least partially around a perimeter of the base plate 401. In some implementations, such as in Fig. As shown in Figure 4, an arrangement of ribs 406 extends into the fluid channel 418 to increase the internal surface area exposed to the coolant flow. In the example of Fig. In 4, the ribs 406 are formed as part of the base plate 401 and extend from the bottom of the recessed area 440 of the base plate 401 into the fluid channel 418. In some implementations, the ribs 406 are formed integrally with the base plate 401, forming a monolithic structure. The term "integrally formed," as used, can refer to the fact that the base plate 401 and the ribs 406 are manufactured as a single piece, such as by extrusion, die casting, machining from a solid block (e.g., milling or computer numerical control (CNC)), or peeling. As a result, each rib 406 is formed continuously with the base plate 401 and has no joint, seam, tie line, or interface that might otherwise occur if the ribs 406 were attached separately.

[0053] The fins 406 can have various geometries, including, but not limited to, straight fins, needle fins, lamellar fins, tapered fins, or curved fins configured to induce turbulence or directed flow. In some implementations, the fins 406 extend between the top plate 403 and the bottom plate 401 to mechanically couple the opposing walls of the fluid channel 418 and increase the structural stiffness of the cooler 450. Increasing the fin height, thickness, or density can further increase stiffness and reduce the warping of the cooler 450.

[0054] The cover plate 403 is configured with an arrangement of depressions 460 that interact with the arrangement of ribs 406. In various implementations, each depression 460 can be implemented as a through-hole extending completely through the thickness of the cover plate 403, or as a cavity extending only partially through the thickness of the cover plate 403. The depressions 460 can be dimensioned and shaped to accommodate the ribs 406 and can be configured with a geometry that matches the geometry of the ribs 406. The cover plate 403 can include any number of depressions 460 distributed across its surface, and the depressions 460 can be arranged in a pattern that matches a pattern of the ribs 406.The cover plate 403 with the recesses 460 can be manufactured using any suitable manufacturing technique, such as drilling, milling, punching, laser processing, casting or molding.

[0055] In some implementations, the recesses 460 are through holes extending from one surface of the cover plate 403 to the opposite surface. In these implementations, the cover plate 403 is mounted to the ribs such that the ends of the ribs 406 are inserted into the through holes. For example, the ribs 406 are inserted into a lower surface 462 of the cover plate 403, which faces the base plate 401, so that the upper surfaces of the ribs 406 are exposed on the upper surface 461 of the cover plate 403. In some examples, the upper surfaces of the ribs 406 are coplanar with the upper surface 461 of the cover plate 403. In other examples, the ends of the ribs 406 are partially inserted into the through holes, so that the upper surfaces of the ribs 406 are not coplanar, as they are recessed relative to the upper surface 461 of the cover plate.In some examples, the insertion of the ribs 406 into the recesses 460 (e.g. through holes) mechanically couples the ribs 406, and thus the base plate 401 to the top plate 403 via frictional force.

[0056] In other implementations, the recesses 460 are cavities or, in other words, indentations that extend only partially through the thickness of the cover plate 403. In these implementations, the cover plate 403 is mounted to the ribs such that the ends of the ribs 406 are inserted into and received by the cavities. For example, the cavities are arranged on a lower surface 462 of the cover plate 403, which faces the base plate 401. In these implementations, the upper surfaces of the ribs 406 are not exposed on the upper surface 461 of the cover plate. In some examples, the insertion of the ribs 406 into the recesses 460 (e.g., through-holes) mechanically couples the ribs 406, and thus the base plate 401, to the cover plate 403 via frictional force.

[0057] The lower surface 462 of the cover plate, the surface(s) of the wall 442 and the recessed area 440 (e.g. the floor) define at least part of the fluid channel 418.

[0058] In some implementations, the ribs 406 are coupled to the cover plate 403 by metallurgical bonds. For example, the ends of the ribs 406 can be metallurgically bonded in the recesses 460 of the cover plate 403. In some embodiments, the ribs 406 are joined to the cover plate 403 by a soldering process. For example, the ribs 406 can be positioned in the recesses 460 of the cover plate 403. A solder material is applied at least to the interface between each rib 406 and the recess. The heat sink 450 is then heated to a temperature sufficient to melt the solder material while the cover plate 403 and the ribs 406 are kept below their melting temperatures, thus forming a metallurgical bond. The assembly is then cooled, allowing the solder material to solidify and create a bond that secures each rib to the heat sink.In various implementations, the solder material can be provided as a preform, wire, paste, plating layer, or electroplated coating. In different implementations, the solder material can include silver-based alloys, copper-based alloys, aluminum-based alloys, nickel-based alloys, gold-based alloys, and the like.

[0059] In some implementations, the ribs 406 are connected to the cover plate 403 by a welding process. The welding process may involve positioning each rib 406 in a corresponding recess 460 in the cover plate 403. After positioning, a welding operation is performed to fuse each rib 406 to the cover plate 403. The welding can be performed using any suitable welding technique, including resistance welding, laser welding, electron beam welding, micro-arc welding, and so on.

[0060] In some implementations, such as in Fig. As shown in Figure 4, the cooler 450 includes a cover plate 470 that is coupled to the upper surface 461 of the cover plate 403. In some implementations, where the recesses 460 are through holes, the cover plate 470 can be coupled to the upper surface 461 of the cover plate 403 and also to the upper surfaces of the fins 406. In some implementations, the cover plate is coupled to the upper surface 461 of the cover plate 403 and also to the upper surfaces of the fins 406 via a bonding layer 420. The bonding layer 420 can include a thermally conductive adhesive, such as silver-filled epoxy resin, polymers, solder or sintered material, brazing material, and the like. In some examples, the cover plate 470 is coupled to the plate 403 and the upper surfaces of the ribs 406 using a layer of solder material.This means that in some implementations, the cover plate 470 can be soldered to the cover plate 403 and the upper surfaces of the fins 406. In some implementations, the cover plate 470 can be coupled to the upper surfaces of the fins 406 and the cover plate 403 using a solid-state joining process, such as friction stir welding (FSW). In various examples, the cover plate 470 can be made of aluminum, copper, nickel-plated copper, and so on. In some implementations, the cover plate 470 is composed of a material that differs from the material composition of the cover plate 403. The use of copper for the cover plate 470 can increase the thermal conductivity of the cooler 450, for example, compared to coolers that include only aluminum.

[0061] In the example of Fig. 4. The semiconductor devices 130, 132, 134 are coupled to the upper surface of the cover plate 470. The semiconductor devices 130, 132, 134 can include a semiconductor package, a power module, a multi-die package, or a bare semiconductor die. In some implementations (as in Fig. As shown in Figure 4, a bonding layer 432 is arranged between the semiconductor devices 130, 132, 134 and the cooler 450, providing both thermal conductivity and mechanical attachment. The bonding layer 432 can include solder, sintered metal (e.g., silver sintering paste), conductive adhesive, a temporary liquid-phase bonding material, or other attachment materials. Additionally or alternatively, the semiconductor devices 130, 132, 134 can be mechanically attached to the cooler 450 using screws, bolts, clamps, and the like.

[0062] Fig. Figure 5 is a front sectional view of a cooling assembly 500 according to at least one embodiment of the present disclosure. The cooling assembly 500 can be used to implement the cooling assembly 100 of Fig. 1 can be used. For example, Fig. 5 shows a section of the cooling assembly 100, which runs along line A in Fig. 1 was carried out. The example cooling assembly 500 of Fig. 5 includes a cooler 550 with a base plate 501 and a top plate 503. If the cooler 550 is used to implement the cooler 110 of Fig. 1 is used, the base plate 501 can be placed in the lower housing 101 of Fig. 1 be included, and the cover plate 503 can be placed in the upper housing 103 of Fig. 1. The top plate 503 and the bottom plate 501 define at least part of an internal fluid channel 518 of the cooler 550. A fluid inlet port 514 and a fluid outlet port 516 are fluidically coupled to the fluid channel 518, such that a cooling medium enters the cooler 550 through the inlet port 514, flows through the fluid channel 518, and exits through the outlet port 516. The fluid in the Fig. The assembly 500 shown enables direct heat transfer from the semiconductor devices 130, 132, 134 to the cooler 550 and to the coolant flowing through the fluid channel 518.

[0063] The top plate 503 encloses an upper surface 561, to which the semiconductor devices 130, 132, 134 can be coupled, and a lower surface 562, which faces the upper surface 561. The bottom plate 501 includes a recessed area 540, defined by a wall 542 that extends at least partially around a circumference of the bottom plate 501, and a base that encloses a section of the upper surface of the bottom plate 501. The lower surface 562 of the top plate, the surface(s) of the wall 542, and the recessed area 540 define at least part of the fluid channel 518. The fluid channel 518 can convey various types of coolant.

[0064] In some implementations, such as in Fig. As shown in Figure 5, an arrangement of ribs 506 extends into the fluid channel 518 to increase the internal surface area exposed to the coolant flow. In the example of Fig. In 5, the ribs 506 are formed as part of the cover plate 503 and extend from the lower surface 562 of the cover plate 503 into the fluid channel 518. In some implementations, the ribs 506 are formed integrally with the cover plate 503, forming a monolithic structure.

[0065] The fins 506 can have various geometries, including, but not limited to, straight fins, needle fins, lamellar fins, tapered fins, or curved fins configured to induce turbulence or directed flow. In some implementations, the fins 506 extend between the top plate 503 and the bottom plate 501 to mechanically couple the opposing walls of the fluid channel 518 and increase the structural stiffness of the cooler 550. Increasing the fin height, thickness, or density can further increase stiffness and reduce the warping of the cooler 550.

[0066] The base plate 501 is configured with an arrangement of depressions that interact with the arrangement of ribs 506. In various implementations, each depression can be implemented as a cavity 560 that extends only partially through the thickness of the base plate 501. The cavities 560 can be dimensioned and shaped to accommodate the ribs 506 and can be configured with a geometry that matches the geometry of the ribs 506. The base plate 501 can include any number of cavities 560 distributed across its surface, and the cavities 560 can be arranged in a pattern that matches a pattern of the ribs 506. The base plate 501 with the cavities 560 can be manufactured using any suitable manufacturing technique, such as drilling, milling, punching, laser machining, casting, or molding. As in Fig. As shown in Figure 5, the ribs 506 have a section that is located in the fluid channel 518 and has a height h1, and a section that is located within the cavity 560 and has a height h2. The height h1 is greater than the height h2, so that most of the rib 506 is exposed to the fluid channel, while only a section is located in the cavity 560.

[0067] In some implementations, the ribs 506 are mounted on the base plate 501, such that the ends of the ribs 506 are inserted into and received by the cavities. For example, the cavities are arranged on the floor of the recessed area 540 of the base plate 501, which faces the top plate 503. In some examples, the insertion of the ribs 506 into the cavities 560 mechanically couples the ribs 506, and thus the top plate 503, to the base plate 501 via frictional force.

[0068] In some implementations, the ribs 506 are coupled to the base plate 501 by metallurgical bonds. For example, the ends of the ribs 506 can be metallurgically bonded to the cavities 560 in the recessed area 540 of the base plate 501. In some embodiments, the ribs 506 are connected to the base plate 501 by a brazing process. For example, the ribs 506 can be positioned in the cavities 560 of the base plate 501, such that each rib 506 is inserted into a corresponding cavity 560. A brazing material can be applied at least at the interface between each rib 506 and the cavity 560. The cooler 550 is then heated to a temperature sufficient to melt the brazing material while the top plate 503, the base plate 501, and the ribs 506 are kept below their melting temperatures, thereby forming a metallurgical bond.The assembly is then cooled, allowing the solder to solidify and create a bond that secures each fin to the heat sink. In various implementations, the solder can be provided as a preform, wire, paste, plating layer, or electroplated coating. Furthermore, the solder can include silver-based alloys, copper-based alloys, aluminum-based alloys, nickel-based alloys, gold-based alloys, and the like.

[0069] In some implementations, the ribs 506 are connected to the base plate 501 by a welding process. The welding process may involve positioning each rib 506 at a corresponding bonding area on the base plate 501. The ribs 506 can be held in contact with the base plate 501 using a jig, magnetic alignment tools, or gravity-assisted placement. After positioning, a welding process is performed to fuse each rib 506 to the base plate 501. The welding can be performed using any suitable welding technique, including resistance welding, laser welding, electron beam welding, micro-arc welding, and so on.During welding, localized heat is applied to at least one section of the interface between each rib 506 and the base plate 501 to heat the interface to a temperature sufficient to melt at least one of the rib material and the base plate 501 material, thereby forming a fused weld area. The weld area is allowed to solidify, creating a metallurgical bond that secures the rib to the base plate 501.

[0070] In the example of Fig. In Figure 5, the semiconductor devices 130, 132, and 134 are coupled to the upper surface of the cooler 550, more precisely to the cover plate 503. The semiconductor devices 130, 132, and 134 can include a semiconductor package, a power module, a multi-die package, or a bare semiconductor die. In some implementations (such as in Figure 5), the semiconductor devices 130, 132, and 134 are coupled to the upper surface of the cooler 550, specifically to the cover plate 503. Fig. As shown in Figure 5, a bonding layer 532 is arranged between the semiconductor devices 130, 132, 134 and the cooler 550, providing both thermal conductivity and mechanical attachment. The bonding layer 532 can include solder, sintered metal (e.g., silver sintering paste), conductive adhesive, a temporary liquid-phase bonding material, or other attachment materials. Additionally or alternatively, the semiconductor devices 130, 132, 134 can be mechanically attached to the cooler 550 using screws, bolts, clamps, and the like.

[0071] Fig. Figure 6 is a sectional front view of a cooling assembly 600 according to at least one embodiment of the present disclosure. The example cooling assembly 600 of Fig. Figure 6 includes a cooler 650 with a base plate 601 and a top plate 603, which are connected to each other by an arrangement of ribs 606. The cooler 650 can be constructed in the same way as the cooler 250 of Fig. 2, the cooler 350 from Fig. 3, the cooler 450 from Fig. 4 and / or the 550 cooler from Fig. 5. That is, the ribs 606 can be formed integrally with the base plate 601 and metallurgically bonded to the top plate 603; or the ribs 606 can be formed integrally with the top plate 603 and metallurgically bonded to the base plate 601. The base plate 601 or the top plate 603 can include recesses with which the ribs 606 interact.

[0072] The 650 cooler differs from the coolers of the Fig. 6 to 5 by the fact that the cooler 650 includes a fluid inlet port 614 and a fluid outlet port 616, which are arranged on a bottom surface of the base plate 601. For example, the fluid inlet port 614 can be described as being located on a bottom surface of the cooler 650 at (near, close to, etc.) a proximal end of the cooler 650, while the fluid outlet port 616 can be described as being located on a bottom surface of the cooler 650 at (near, close to, etc.) a distal end of the cooler 650. In some implementations, other configurations for fluid inlets and outlets may be used (e.g., inlets and outlets arranged on a top surface of the cooler, or an inlet arranged on a top surface and an outlet arranged on a bottom surface, or vice versa).

[0073] The fluid inlet port 614 and the fluid outlet port 616 are fluidically coupled to a fluid channel 618 of the cooler, so that a cooling medium enters the cooler 650 through the inlet port 614, flows through the fluid channel 618 and exits through the outlet port 616. The in Fig. The assembly 600 shown enables direct heat transfer from the semiconductor devices 130, 132, 134 to the cooler 650 and to the coolant flowing through the fluid channel 618.

[0074] To further illustrate, Fig. Figure 7 schematically shows a top view of a cover plate 700 configured with through holes 702 according to at least one embodiment of the present disclosure. The cover plate 700 with the through holes 702 can be manufactured using suitable manufacturing techniques such as drilling, milling, punching, laser processing, casting, or molding. In some examples, the cover plate 700 can be used to implement the cover plate 403 of Fig. 4 can be used. It goes without saying that Fig. Figure 7 illustrates that the cover plate 700 can include any number of through-holes, which can be arranged in any pattern corresponding to a rib arrangement. Although the through-holes 702 are shown having a circular or cylindrical geometry, it is understood that the through-holes 702 can have other geometries, such as the rib geometries discussed above.

[0075] To further illustrate, Fig. Figure 8 schematically shows a base plate 800 enclosing an arrangement of ribs 806, which are monolithic and formed in one piece as part of the base plate 800. The ribs 806 extend orthogonally from the upper surface 802 of the base plate 800. In some implementations, the base plate 800 encloses a wall 804 that defines a recessed area 810 of the base plate 800, where a floor of the recessed area 810 encloses a section of the upper surface 802 of the base plate 800. In various implementations, the base plate 800 can enclose the base plate 201 of Fig. 2 and / or the base plate 401 of Fig. 4. Implement. Although the ribs 806 are shown having a cylindrical geometry, it is understood that the ribs 806 can have other geometries, such as those discussed above. It is understood that Fig. Figure 8 illustrates that the base plate 800 can include any number of ribs, which can be arranged in various other patterns.

[0076] To further illustrate Fig. Figure 9 schematically shows a sectional view of a cooling assembly 900, which includes a power module 902 coupled to a cooler 904. For example, the cooler 904 can be from Fig. 9 through the cooler 110 from Fig. 1, the cooler 250 from Fig. 2, the cooler 350 from Fig. 3, the cooler 450 from Fig. 4, the 550 cooler from Fig. 5 and / or the 650 cooler from Fig. 6. The power module 902 can be implemented as the semiconductor devices 130, 132, 134, although for the sake of simplicity only a single power module 902 is shown.

[0077] In the example of Fig. 9. The power module 902 includes one or more semiconductor dies 948, 950. In some implementations, a semiconductor die 948, 950 may include a power device for conditioning, converting, or switching a power supply. In various examples, the semiconductor die 948, 950 may implement an IGBT power electronics device, a MOSFET power electronics device, or other electronic devices suitable for controlled switching in high-voltage applications. In one particular example, the semiconductor die 948, 950 is configured as a switching device for a high-voltage DC input power supply (e.g., at least 1000 V).In various examples, the semiconductor dies 948, 950 can be manufactured using silicon, silicon carbide, gallium nitride, gallium arsenide, a silicon-silicon carbide hybrid material and other suitable semiconductor die materials known on the basis of the present disclosure.

[0078] At least one semiconductor die 948 is mounted on a substrate 906. For example, the semiconductor die 948 can be coupled to a substrate by a thermally conductive adhesive, such as solder, thermal interface material, phase-change material, sintered material, and so forth. In some implementations, the substrate 906 is a DBM substrate. In some implementations, the DBM substrate (e.g., direct-bonded copper (DBC)) includes an insulating layer 932, which is positioned between a first metal layer 934 (e.g., an upper metal layer) and a second metal layer 936 (e.g., a lower metal layer). The insulating layer 932 can, for example, be a ceramic layer. In some implementations, the insulating layer 932 can, for example, be or include a ceramic material such as aluminum oxide (Al₂O₃) or aluminum nitride (AlN). In some implementations, a DBM substrate can be created by binding one or more of the metal layers (e.g.,The first metal layer, the second metal layer) may be formed on the insulating layer. In some implementations, one or more of the metal layers may be bonded to the insulating layer, for example, using a high-temperature process (e.g., diffusion bonding).

[0079] In some implementations, the first metal layer 934 of the DBM substrate 906 may be or include a structured metal layer that encloses one or more electrically conductive traces. In some implementations, the first metal layer 934 may be or include a structured layer configured to form one or more electrical circuits, one or more conductive blind vias, and / or through-hole vias, and / or so forth. In some examples, the first metal layer 934 includes one or more circuit sections, contacts, pads, and so forth.

[0080] In the example of Fig. 9 corresponds to a lower surface of the base metal layer 936 of the substrate 906 and to a surface SS1 of the substrate 906, which is coupled to the heat dissipation device 904 via a thermally conductive adhesive material 938 through a bonding process such as soldering or sintering. In these implementations, the conductive adhesive material 938 can be a solder material, a sintering material (e.g., silver or copper), an epoxy material (e.g., silver-filled epoxy), or a thermally conductive material, and so on.

[0081] In some implementations, such as in Fig. As shown in Figure 9, the power module 902 includes one or more signal pins 912 extending in a direction orthogonal to the structured first metal layer 934 on the upper surface of the substrate 906. In some examples, the signal pins 912 can be inserted (e.g., pressed) into the substrate 906. For example, the signal pins 912 can be pressed into plated openings in the substrate 906, the plated openings being electrically connected to respective sections of the structured first metal layer 934 of the substrate 906. The signal pins 912 provide an external electrical connection for the power module 902.

[0082] In some implementations, the power module 902 includes one or more input current terminals 914, which provide an external electrical connection for the power module 902 to receive an input power supply, such as a DC supply. For example, the input current terminals may be located on a top surface of the power module 902. In these implementations, the power module 902 also includes one or more output current terminals (not shown) that extend from the power module 902, for example, in a direction parallel to the substrate 906. For example, the power modules 914 provide an electrical connection for power output from the power module 902. In these implementations, the power module 902 can provide power regulation, switching, phase reversal, and other power control or conditioning functions.

[0083] In some implementations, the semiconductor package assembly includes a second semiconductor die 950 mounted on substrate 906. The semiconductor die 948 and the semiconductor die 950 are power switching devices arranged as a half-bridge circuit, providing high-side and low-side switching.

[0084] The power module 902 also includes molding material 916, which encapsulates or partially encapsulates the components of the power module 902. For example, in Fig. As shown in Figure 9, the molding material 916 encapsulates the semiconductor die 948 and the metal layer 934 of the substrate 906, while the molding material 916 partially encapsulates the substrate 906, the signal pins 912, and the power terminals 914. The lower metal layer 936 (surface SS1) of the substrate 906 is exposed through the molding material 916, while the signal pins 912 extend through the molding material 916. The molding material 916 can be an epoxy molding compound, a resin molding compound, a gel molding compound, and so on. Although in Fig. Not specifically shown in 9, other elements may be included in the performance module 902 in some implementations.

[0085] In some implementations, the power module 902 is bonded to the heat sink 904, with the lower metal layer 936 bonded to a surface of the heat sink 904. In some implementations, the lower metal layer 936 and the heat sink 904 are joined using a thermally conductive adhesive material 938. In these implementations, such a conductive adhesive material can be a solder material, a sintered material (e.g., silver or copper), an epoxy material (e.g., silver-filled epoxy), or a plating material (e.g., a tin plating material). In some implementations, the power module 902 is mechanically coupled to the heat sink 904. For example, the power module 902 can be coupled to the heat sink 904 by means of mechanical fasteners such as screws, clamps, nuts, bolts, and the like. In some implementations, the power module 902 is both bonded and mechanically attached to the heat sink.For example, the semiconductor package can be sintered onto the cooler 904 and screwed or clamped onto the cooler 904.

[0086] For further explanation, Fig. Figures 10A to 10C describe an example process for manufacturing a heat dissipation device with a double-coupled fin arrangement according to at least one embodiment of the present disclosure. Starting with Fig. In 10A, a base plate 1001 is provided with an arrangement of one-piece formed ribs 1006. For example, the base plate 1001 and the ribs 1006 can be manufactured as a single piece, such as by extrusion, die casting, forging, or machining from a solid block (e.g., milling or CNC). As a result, each rib 1006 is formed continuously with the base plate 1001 and has no joint, seam, tie line, or interface that might otherwise occur if the ribs 1006 were attached separately. For example, the base plate 1001 can be connected to the base plate 201 of Fig. 2 or the base plate 401 of Fig. 4 correspond.

[0087] In Fig. 10B is a cover plate 1003 mounted on the arrangement of ribs 1006. For example, the cover plate 1003 of the cover plate 203 of Fig. 2 correspond. In Fig. In 10C, the ribs 1006 are metallurgically bonded to a lower surface of the cover plate 1003. In various examples, the ribs 1006 are metallurgically connected by soldering or welding.

[0088] For further explanation, Fig. Figures 11A to 11D describe a further example process for manufacturing a heat dissipation device with a doubly coupled fin arrangement according to at least one embodiment of the present disclosure. Starting with Fig. 11A provides a base plate 1101 with an arrangement of one-piece formed ribs 1106. For example, the base plate 1101 and the ribs 1106 can be manufactured as a single piece, such as by extrusion, injection molding, forging or machining from a solid block (e.g. milling or CNC).

[0089] In Fig. 11B provides a cover plate 1103. The cover plate 1103 includes an arrangement of recesses 1108, which may be cavities or through-holes, as discussed above. For example, the cover plate 1103 can be the cover plate 403 of Fig. 4 correspond.

[0090] In Fig. In Figure 11C, the cover plate 1103 is mounted on the arrangement of ribs 1106. The cover plate 1103 is arranged on the ribs 1106 such that the ribs 1106 interact with the recesses 1108 and are at least partially inserted into the recesses 1108. For example, the cover plate 1103 can be configured with recesses as shown in Figure 11C. Fig. Figure 7 shows this. In some implementations, the recesses 1108 are through holes, so that the upper surfaces of the ribs 1106 are exposed at an upper surface 1110 of the cover plate 1103. The upper surfaces of the ribs 1106 may be coplanar with the upper surface 1110 of the cover plate 1103 or may be recessed relative to the upper surface 1110.

[0091] In Fig. 11D is a cover plate 1107 coupled to the cover plate 1103. In some examples, the cover plate 1107 is coupled to the upper surface 1110 of the cover plate and the upper surfaces of the ribs 1106, which are exposed by the cover plate 1103. In some examples, the cover plate 1107 is coupled by soldering. In these examples, a layer of solder material can be applied to the upper surface 1110 of the cover plate 1103 and to the upper surfaces of the ribs 1106, if they are exposed. The cover plate 1107 is then metallurgically bonded to the cover plate 1103 and the upper surfaces of the ribs 1106 via a soldering process, such as the soldering process discussed above.

[0092] For further explanation, Fig. Figures 12A to 12C describe a further example process for manufacturing a heat dissipation device with a doubly coupled fin arrangement according to at least one embodiment of the present disclosure. Starting with Fig. In 12A, a cover plate 1203 is provided with an arrangement of one-piece formed ribs 1206. For example, the cover plate 1203 and the ribs 1206 can be manufactured as a single piece, such as by extrusion, die casting, forging, or machining from a solid block (e.g., milling or CNC). As a result, each rib 1206 is formed continuously with the cover plate 1203 and has no joint, seam, tie line, or interface that might otherwise occur if the ribs 1206 were attached separately. For example, the cover plate 1203 can be connected to the cover plate 303 of Fig. 3 or the cover plate 503 from Fig. 5 correspond.

[0093] In Fig. 12B is the arrangement of ribs 1206 on a base plate 1201. For example, the base plate 1201 can be the base plate 301 of Fig. 3 or the base plate 501 of Fig. 5 correspond. In Fig. In 12C, the ribs 1206 are metallurgically bonded to an upper surface of the base plate 1201. In various examples, the ribs 1206 are metallurgically connected by soldering or welding.

[0094] Fig. Figure 13 is a flowchart of an example procedure for manufacturing a heat dissipation device, such as the cooler described herein. The procedure begins at step 1302, which involves coupling a first plate to a second plate so that a plurality of fins extending from the first plate contact the second plate. The first and second plates define, at least partially, a fluid channel in which the fins are arranged. In some examples, the first plate is a bottom plate with integrally formed fins, and the second plate is a top plate, for example, as in Fig. 2 and Fig. 4 shown. In other examples, the first plate is a top plate with ribs formed in one piece, and the second plate is a bottom plate, for example as in Fig. 3 and Fig. Figure 5 shows that in some implementations, coupling can involve the interaction of multiple ribs with multiple recesses in the second plate. For example, the ribs can be inserted into through holes in the second plate, as in the process of Fig. Figures 11A to 11C are shown. In other examples, the ribs are inserted into cavities formed in a surface of the second plate, as in Fig. 5 shown. Alternatively, the ribs can directly touch a surface of the second plate without depressions, as shown in Fig. 2 and Fig. 3 shown.

[0095] In step 1304, a metallurgical bond is formed between the multitude of ribs and the second plate. This mechanically connects the first and second plates via the rib structure and increases the rigidity of the heat dissipation device. In some examples, forming the metallurgical bond involves brazing the multitude of ribs to the second plate. This may involve applying a brazing material (e.g., as a paste, preform, or plating layer) to the interface and heating the assembly to melt the brazing material, which then solidifies to form strong bonds. In other examples, forming the metallurgical bond involves welding the multitude of ribs to the second plate using a process such as laser welding, resistance welding, or electron beam welding to fuse the ribs to the plate.In implementations where the second plate has through holes, the method may further include arranging a cover plate on the second plate and forming a metallurgical bond between the cover plate, the second plate and the respective upper surfaces of the ribs, as in . Fig. 11D shown.

[0096] The heat dissipation device described herein offers significant advantages in terms of structural rigidity and thermal performance. By mechanically connecting the first and second plates with a multitude of fins, the overall structure acts as a single, reinforced assembly. The formation of metallurgical bonds, such as brazed or welded joints, between the fins and the opposing plate creates a continuous, high-strength connection that significantly increases the cooler's resistance to bending and deflection. Furthermore, in implementations where the fins interact with corresponding recesses in the opposing plate, the movement of the fins is mechanically restricted, thereby further stiffening the assembly.This metallurgical bonding and / or mechanical locking effectively reduces warping caused by temperature cycles, thereby preserving the integrity of the bonding point with an attached semiconductor device and ensuring reliable long-term operation.

[0097] In some implementations, soldering may be or include a process of joining two surfaces (e.g., metal surfaces) using a molten filler metal (e.g., metal alloy, tin (Sn), lead (Pb), silver (Ag), copper (Cu)) that may be referred to as a solder.

[0098] In some implementations, sintering can be a process of fusing particles into a solid mass by using, for example, a combination of pressure and / or heat, or it can include fusing without melting the materials. In some implementations, sintering can involve fusing a material (e.g., a powdered material) into a solid or porous mass by heating, and usually also compressing the material without liquefaction. In some implementations, the materials usable for sintering can include metals such as silver (Ag), copper (Cu), and / or metal alloys. In some implementations, sintered compounds can exhibit desirable electrical and / or thermal conductivity, durability, and a relatively high melting point.

[0099] In some implementations, one or more of the components described herein can be coupled using materials such as a solder, a sintered material (e.g., silver, copper material) and / or other metal-to-metal bonding materials.

[0100] In some implementations, coupling of components can be carried out, for example, using a soldering process, a sintering process (e.g., a silver sintering process, a copper sintering process) and / or other metal-metal bonding processes.

[0101] In some implementations, the directly bonded metal substrate (DBM substrate) (e.g., directly bonded copper (DBC)) can enclose an insulating layer positioned between a first metal layer and a second metal layer. The insulating layer can be, for example, a ceramic layer. In some implementations, the insulating layer can be, for example, a ceramic material such as aluminum oxide (Al₂O₃) or aluminum nitride (AlN).

[0102] In some implementations, a DBM substrate can be formed by bonding one or more of the metal layers (e.g., first metal layer, second metal layer) to the insulating layer. In some implementations, one or more of the metal layers can be bonded to the insulating layer, for example, using a high-temperature process.

[0103] In some implementations, the first and / or second metal layer of the DBM substrate can be or function as a heat sink. In some implementations, the first and / or second metal layer can be coupled to a heat sink. In some implementations, at least a portion of one or more of the first or second metal layers can be exposed by a molding material.

[0104] In some implementations, the first and / or second metal layer of the DBM substrate may be or include a structured metal layer that incorporates one or more electrically conductive traces. In other implementations, the first and / or second metal layer may be or include a structured layer configured to form one or more electrical circuits, one or more conductive vias (both reactive and / or through-holes), and / or so forth.

[0105] In some implementations, the DBM substrate can be or include a directly bonded copper substrate (DBC substrate) (e.g., a DBM with copper metal layers). In some implementations, such as DBC substrate implementations, the first metal layer and / or the second metal layer is a copper layer.

[0106] In some implementations, one or more semiconductor dies (e.g., one or more semiconductor components) may be or include a power semiconductor die. In some implementations, one or more semiconductor dies may be (e.g., be a section thereof) or include one or more metal-oxide-semiconductor field-effect transistors (MOSFETs), an insulated-gate bipolar transistor (IGBT), an integrated circuit (IC), an inverter, a power conversion circuit, a bridge circuit, a fast recovery diode (FRD), a diode, and / or so on. In some implementations, one or more semiconductor chips may be (e.g., be a part thereof) a component for an electric vehicle (EV).

[0107] More than one semiconductor die can be included in the implementations described herein. In some implementations, different semiconductor dies (where more than one semiconductor die is included) can be fabricated using different semiconductor substrates (e.g., a silicon carbide substrate (SiC substrate), a silicon substrate (Si substrate), a gallium nitride substrate (GaN substrate), etc.). In other words, the different semiconductor dies can be fabricated on different semiconductor wafers or materials, for example. This can be referred to as a hybrid die configuration. For example, a first semiconductor die can be formed using a SiC substrate, and a second semiconductor die (separate from the first semiconductor die) can be formed using a silicon substrate.As another example, an IGBT can be manufactured using a SiC substrate, while a controller can be manufactured using a silicon substrate.

[0108] In example implementations, a first semiconductor die can be connected to a second semiconductor die, for example, by an electrical connection (e.g., a wire bond, an electrical clip connection) extending directly from the first die to the second die, or by a trace formed in the first conductive layer (e.g., a metal layer) of the power electronics substrate. The first of the multiple semiconductor dies can also be connected to terminal frame posts by electrical connections such as wire bonds or clips.

[0109] In example implementations, a package (e.g., a power module) can be a hybrid device package that includes one or more semiconductor dies integrated on a unifying power electronics substrate (e.g., a ceramic substrate, a DBM or DBC substrate, or an AMB substrate). In some implementations, multiple semiconductor devices (e.g., fabricated on the same substrate, such as a SiC substrate) may be suitable for high-power applications.

[0110] The semiconductor device packages described herein can include a variety of signal connections. These signal connections can be power connections, input signal connections, output signal connections, and so on. In some implementations, the signal connections can be enclosed within a connection frame. In some implementations, a connection frame can include any type of conductive section of a package (e.g., conductive section, conductive connection) that provides an external connection point from the package. Accordingly, a connection frame can be referred to as a conductive section of a package or assembly. In some implementations, one or more sections of a connection frame can be coupled to a pad (e.g., a bond pad) on at least one section of a DBM substrate and / or a semiconductor die.

[0111] Although referred to as a connection frame in at least some sections of this detailed description, the connection frame can encompass any type of conductive section of a package (e.g., conductive section, conductive terminal) that can provide an external connection point from the package. Accordingly, the connection frame can be referred to as the conductive section of the package. In some implementations, one or more sections of a connection frame can be coupled to a pad (e.g., a bond pad) on at least one section of a DBM substrate.

[0112] In some implementations, a molding compound (e.g., a molding material or encapsulation material) can be or include a non-conductive layer / material. In some implementations, the molding compound is a non-conductive material, such as an epoxy resin, that can be formed (applied, etc.) using a transfer molding or compression molding process. In some implementations, the molding compound can include a separate plastic housing that is enclosed within the semiconductor device assembly.

[0113] One or more wire bonds, which may be enclosed in at least some of the implementations described herein, can be replaced by a conductive component. For example, in some implementations, one or more wire bonds can be replaced by a conductive clip. The conductive clip can be coupled to another component (e.g., a connection pad, a connection frame, a semiconductor die, and / or so on) by, for example, using solder (e.g., a soldering process), a sintered connection (e.g., a sintering process), a weld, and / or so on. In some implementations, one or more wire bonds and / or clips can function as input and / or output power connectors, signal connectors, power connectors, and / or so on.

[0114] In some implementations, one or more semiconductor dies associated with the implementations described herein may be embedded in a layer (rather than being mounted on the surface). For example, one or more semiconductor dies may be arranged in a depression (which may be a cavity or also be referred to as such) of a layer (e.g., a substrate, a printed circuit board, a conductive layer, or an insulating layer).

[0115] In some implementations, a module (e.g., a package containing a semiconductor device) can be enclosed within another module. The module can be referred to as a package. For example, one or more modules can be one or more submodules contained within another module. In other words, a first module can be contained as a submodule within a second module.

[0116] It is understood that in the foregoing description, when an element, such as a layer, region, or substrate, is described as being "on," "connected to," "electrically connected to," "coupled with," or "electrically coupled to" another element, it may be directly attached to, connected to, or coupled to the other element, or one or more intervening elements may be present. In contrast, when an element is described as being "directly on," "directly connected to," or "directly coupled to" another element or layer, no intervening elements or layers are present. Although the terms "directly on," "directly connected to," or "directly coupled to" may not be used in the detailed description, elements shown as being "directly on," "directly connected," or "directly coupled" may be identified as such.The claims of the application may be amended to specify exemplary relationships that are described in the patent specification or shown in the figures.

[0117] As used in this patent specification, a singular form may include a plural form unless the context clearly indicates a specific case. Spatial terms (e.g., above, over, upper, under, below, beneath, lower, top, bottom, and the like) are intended to include various orientations of the device in use or operation in addition to the orientation depicted in the figures. In some implementations, the relative terms "above" and "below" may each include "vertically above" and "vertically below," respectively. In some implementations, the term "adjacent" may include "laterally adjacent to" or "horizontally adjacent to."

[0118] While certain features of the described implementations have been illustrated as described herein, many modifications, substitutions, changes, and equivalents are now apparent to the person skilled in the art. It is therefore understood that the accompanying claims are intended to cover all such modifications and changes that fall within the scope of protection of the implementations. It is understood that they have been presented only as examples, without being limiting, and that various changes to form and details may be made. Each section of the device and / or procedure described herein may be combined in any combination, except for mutually exclusive combinations. The implementations described herein may include various combinations and / or subcombinations of the functions, components, and / or features of the various described implementations. QUOTES INCLUDED IN THE DESCRIPTION

[0000] This list of documents cited by the applicant was automatically generated and is included solely for the reader's convenience. The list is not part of the German patent or utility model application. The DPMA accepts no liability for any errors or omissions. Cited patent literature

[0000] US 63 / 729,118

[0001]

Claims

[1] Heat dissipation device comprising: a first record; a second record; a fluid channel that is defined at least in part by the first plate and the second plate; and a multitude of ribs arranged in the fluid channel, the multitude of ribs mechanically connecting the first plate to the second plate. [2] Heat dissipation device according to claim 1, wherein the plurality of ribs extends from a surface of the first plate, wherein the heat dissipation device further comprises a plurality of metallurgical connections which connect the plurality of ribs to the second plate. [3] Heat dissipation device according to claim 2, wherein the plurality of metallurgical connections is one of a plurality of soldered joints or a plurality of welded joints. [4] Heat dissipation device according to claim 2, wherein the plurality of ribs and the first plate are formed in one piece. [5] Heat dissipation device according to claim 1, wherein the second plate includes a plurality of recesses, wherein the plurality of recesses corresponds to the plurality of ribs, wherein the plurality of ribs is inserted into the plurality of recesses. [6] Heat dissipation device according to claim 5, wherein the plurality of recesses is a plurality of through holes. [7] Heat dissipation device according to claim 6, further comprising: a cover plate that is connected to the first plate. [8] Heat dissipation device according to claim 1, further comprising an inlet port and an outlet port coupled to the fluid channel, wherein the inlet port and the outlet port are arranged on opposite sides of the heat dissipation device. [9] Heat dissipation device according to claim 1, further comprising an inlet port and an outlet port coupled to the fluid channel, wherein the inlet port and the outlet port are arranged on a lower surface of the second plate. [10] Heat dissipation device comprising: a first plate that includes a multitude of depressions; a second plate enclosing a multitude of ribs extending from the second plate and interacting with the multitude of depressions; and a fluid channel defined at least in part by the first plate and the second plate, wherein the plurality of ribs is arranged in the fluid channel. [11] Heat dissipation device according to claim 10, further comprising a plurality of metallurgical connections which connect the plurality of ribs to the second plate, wherein the plurality of metallurgical connections is one of a plurality of soldered joints or a plurality of welded joints. [12] Heat dissipation device according to claim 10, wherein the first plate is a top plate and the second plate is a bottom plate, wherein the plurality of ribs is formed integrally with the bottom plate. [13] Heat dissipation device according to claim 12, wherein the plurality of recesses is a plurality of through holes. [14] Heat dissipation device according to claim 13, wherein upper surfaces of the plurality of ribs are coplanar with a surface of the cover plate. [15] Heat dissipation device according to claim 13, further comprising a cover plate coupled to the cover plate, wherein the cover plate is configured for attachment to a power module. [16] Heat dissipation device according to claim 10, wherein the first plate is a base plate and the second plate is a top plate, wherein the plurality of ribs is formed integrally with the top plate. [17] Heat dissipation device according to claim 16, wherein the plurality of depressions is a plurality of cavities in a surface of the base plate within the fluid channel. [18] Procedures, including: Coupling a first plate with a second plate such that a plurality of ribs extending from the first plate contact the second plate, wherein the first plate and the second plate define at least partially a fluid channel, the plurality of ribs being arranged in the fluid channel; and Formation of a metallurgical bond between the multitude of ribs and the second plate. [19] Method according to claim 18, wherein the formation of the metallurgical bond includes: Soldering a large number of ribs to the second plate. [20] Method according to claim 18, wherein the formation of the metallurgical bond includes: Welding a large number of ribs to the second plate. [21] Method according to claim 18, wherein coupling the first plate with the second plate includes: Interaction of the numerous ribs with the numerous depressions in the second plate. [22] Method according to claim 21, wherein the plurality of depressions is a plurality of through holes, wherein the method further comprises: Arranging a cover plate on the second plate; and Formation of a metallurgical bond between the cover plate and the second plate and between the cover plate and the respective upper surfaces of the multitude of ribs.

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