DISPLAY DEVICE

Abstract

A display device (100, 200) according to an exemplary embodiment of the present disclosure can comprise a substrate (111) comprising a display area (AA) and a non-display area (NA) outside the display area (AA), a plurality of first connecting lines (LL1) and a plurality of second connecting lines (LL2) arranged above the substrate (111) in the non-display area (NA) and separated from each other, a planarization layer (115, 215, 215') extending from the display area (AA) to the non-display area (NA), an adhesive layer (165) arranged above the planarization layer (115, 215, 215'), an encapsulation substrate (160) arranged on the adhesive layer (165), a circuit part (180) arranged within the adhesive layer (165) in the non-display area (NA) and comprising a driver IC arranged therein, a first Connecting part (185a, 285a),which is arranged between the plurality of first connecting lines (LL1) and the circuit part (180) to electrically connect the plurality of first connecting lines (LL1) to the circuit part (180), and a second connecting part (185b, 285b) which is arranged between the plurality of second connecting lines (LL2) and the circuit part (180) to electrically connect the plurality of second connecting lines (LL2) to the circuit part (180).

Description

Area The present disclosure relates to a display device. BACKGROUND Currently, the field of display devices that visually indicate electrical information signals is developing rapidly as it enters a complete information age, and research is currently being conducted to develop features such as thinning, weight reduction and low power consumption for various display devices. Representative display devices include a liquid crystal display (LCD), an electrowetting display (EWD), and an organic light-emitting display (OLED). Among these, the electroluminescent display device, which incorporates an organic light-emitting display element, is a self-emitting display device and, unlike a liquid crystal display device, does not require a separate light source. Therefore, it can be manufactured to be lightweight and thin. Furthermore, the electroluminescent display device is advantageous not only in terms of power consumption due to low-voltage drive, but also in terms of color rendering, response time, viewing angle, and contrast ratio, so it is expected to be used in various fields. The electroluminescent display device receives various signals, such as a control signal and a data signal, through a printed circuit board to display an image. Currently, a disadvantage is the number of components and the complexity of the assembly process, as the source circuit board is manufactured separately from the display panel and attached to it. Furthermore, manufacturing costs can increase and productivity can decrease due to the greater number of components and process steps. SUMMARY One problem to be solved by the present disclosure is to provide a display device in which components and processes are simplified. Another problem to be solved by the present disclosure is to provide a display device that is able to improve reliability against the ingress of moisture. The tasks of this disclosure are not limited to those mentioned above, and other tasks not mentioned above can be clearly understood by a person skilled in the art from the following descriptions. According to aspects of this disclosure, display devices are provided in accordance with the independent claims. Further embodiments are described in the dependent claims. A display device according to an exemplary embodiment of the present disclosure may comprise a substrate comprising a display area and a non-display area outside the display area, a plurality of first connecting lines and a plurality of second connecting lines arranged above the substrate in the non-display area and separated from each other, a planarization layer extending from the display area to the non-display area, an adhesive layer arranged above the planarization layer, an encapsulation substrate arranged on the adhesive layer, a circuit part arranged within the adhesive layer in the non-display area and comprising a driver IC arranged thereon or therein, and a first connecting part arranged between the plurality of first connecting lines and the circuit part.to electrically connect the majority of first connecting lines to the circuit part, and to have a second connecting part arranged between the majority of second connecting lines and the circuit part to electrically connect the majority of second connecting lines to the circuit part. A display device according to a further exemplary embodiment of the present disclosure can comprise a substrate comprising a display area and a non-display area outside the display area, a plurality of first connecting lines and a plurality of second connecting lines arranged on the substrate in the non-display area and separated from one another, a planarization layer extending from the display area to the non-display area, a sealing element arranged on the planarization layer, a first adhesive layer and a second adhesive layer, a barrier layer arranged between the first adhesive layer and the second adhesive layer, a reinforcing substrate arranged on the second adhesive layer, a circuit component arranged in the first adhesive layer in the non-display area, and a driver IC arranged thereon or therein.and comprising a first connecting part arranged between the plurality of first connecting lines and the circuit part to electrically connect the plurality of first connecting lines to the circuit part, and a second connecting part arranged between the plurality of second connecting lines and the circuit part to electrically connect the plurality of second connecting lines to the circuit part. Further detailed aspects of the embodiments are included in the detailed description and drawings. According to the present disclosure, a circuit component, such as a source circuit board required to drive a display panel, is formed within an encapsulation structure, thereby simplifying components and processes. Accordingly, this provides the effect of improved process efficiency and reduced costs. Furthermore, the reliability of the moisture barrier performance can be improved by extending the design area of ​​the encapsulation structure, and thus the reliability of the display device can also be improved. The effects according to the present revelation are not limited to the contents exemplified above, and various other effects are included in the present revelation. BRIEF DESCRIPTION OF THE DRAWINGS The above and other aspects, features, and other advantages of the present disclosure will be more clearly understood from the following detailed description in conjunction with the accompanying drawings, in which: Fig. 1 is a block diagram of a display device according to one embodiment of the present disclosure. Fig. 2 is a circuit diagram of a subpixel of the display device of Fig. 1. Fig. 3 is a top view of a display device according to one embodiment of the present disclosure. Fig. 4 is a cross-sectional view of a subpixel. Fig. 5 is a cross-sectional view along line II' of Fig. 3. Fig. 6 is an enlarged top view of part A of Fig. 5. Fig. 7 is another top view showing an enlarged part A of Fig. 5. Fig. 8 is a cross-sectional view of a display device according to another embodiment of the present disclosure.9 is a cross-sectional view of a display device according to yet another embodiment of the present disclosure. DETAILED DESCRIPTION OF THE EXECUTION FORM The advantages and properties of the present disclosure and a method for achieving these advantages and properties will become clear by referring to exemplary embodiments, which are described in detail below together with the accompanying drawings. However, the present disclosure is not limited to the exemplary embodiments disclosed herein, but is implemented in various forms. The exemplary embodiments are provided only as examples so that the person skilled in the art can fully understand the disclosures and the scope of the present disclosure. The shapes, sizes, ratios, angles, numbers, and the like shown in the accompanying drawings to describe embodiments of the present disclosure are merely examples, and the present disclosure is not limited to them. Furthermore, a detailed explanation of known related technologies may be omitted from the following description of the present disclosure to avoid unnecessarily obscuring the subject matter of the present disclosure. The terms used herein, such as "including," "comprising," and "consisting of," are generally intended to permit the addition of other components unless the terms are used with the term "only." Any references to the singular may include the plural unless expressly stated otherwise. Components are interpreted as including a normal error range, even if this is not explicitly stated. When the positional relationship between two parts is described using terms such as "on", "above", "below" and "next", one or more parts can be positioned between the two parts unless the terms are used with the term "immediately" or "directly". If one element or layer is placed “on” another element or layer, that other layer or element can be placed directly on top of the other element or in between. Although the terms "first," "second," and the like are used to describe different components, these components are not limited by these terms. These terms are merely used to distinguish one component from the other components. Therefore, a first component mentioned below could be a second component in a technical concept of the present disclosure. Throughout the entire revelation, the same reference symbols generally denote the same elements. A size and thickness of each component shown in the drawing are shown for the sake of simplicity, and the present disclosure is not limited to the size and thickness of the component shown. The features of different embodiments of the present disclosure can be partially or completely combined or joined together and can be interlocked and operated in various technical ways, and the embodiments can be carried out independently of one another or in combination with one another. Exemplary embodiments of the present disclosure are described in detail below with reference to the accompanying drawings. Fig. 1 is a block diagram of a display device according to an embodiment of the present disclosure. Referring to Fig. 1, a display device 100 according to an embodiment of the present disclosure can include an image processor 151, a timing device 152, a data driver 153, a gate driver 154 and a display panel 110. The image processor 151 can output a data signal DATA, a data release signal DE and the like via an externally supplied data signal DATA. The image processor 151 can output one or more of a vertical synchronization signal, a horizontal synchronization signal and a clock signal in addition to the data release signal DE. The data signal DATA, along with the data release signal DE or a control signal containing the vertical synchronization signal, the horizontal synchronization signal, and the clock signal, is supplied to the timing unit 152 by the image processor 151. The timing unit 152 can output a gate timing signal GDC for controlling the operating timing of the gate driver 154 and a data timing signal DDC for controlling the operating timing of the data driver 153 based on the control signal. Furthermore, the data driver 153 samples the DATA data signal supplied by the timing control unit 152 in response to the DDC data timing signal supplied by the timing control unit 152 and stores it in order to convert the data signal into a gamma reference voltage and output the converted gamma reference voltage. The data driver 153 can output the DATA data signal via data lines DL1 to DLn. Furthermore, the gate driver 154 can output the gate signal while shifting the level of the gate voltage in response to the gate timing signal GDC supplied by the timing device 152. The gate driver 154 can output the gate signal through gate lines GL1 to GLm. The display panel 110 can display an image while a subpixel P emits light in response to the DATA signal and the gate signal supplied by the data driver 153 and the gate driver 154. A detailed structure of the subpixel P is described with reference to Fig. 2 and Fig. 4. Fig. 2 is a circuit diagram of a subpixel of the display device of Fig. 1 . With reference to Fig. 2, a subpixel of a display device according to an exemplary embodiment of the present disclosure can include a switching transistor ST, a driver transistor DT, a compensation circuit CC and a light-emitting element 130. The light-emitting element 130 can be operated to emit light according to a driver current formed by the driver transistor DT. The switching transistor ST can perform a switching operation such that a data signal supplied through a data line DL is stored in a capacitor as a data voltage in response to a gate signal supplied through a gate line GL. Furthermore, the driver transistor DT can be operated so that a constant driver current flows between a high potential line VDD and a low potential line GND in response to the data voltage stored in the capacitor. The compensation circuit CC is a circuit used to compensate for a threshold voltage, etc., of the driver transistor DT, and the compensation circuit CC can include one or more thin-film transistors and capacitors. The configuration of the compensation circuit CC can vary depending on the compensation method used. For example, the subpixel shown in Fig. 2 is configured by a 2T(transistor)1C(capacitor) which includes a switching transistor ST, a driver transistor DT, a capacitor, and a light-emitting element 130. However, if the compensation circuit CC is added, the subpixel can be configured in various forms, such as 3T1C, 4T2C, 5T2C, 6T1C, 6T2C, 7T1C, and 7T2C. Fig. 3 is a top view of a display device according to an embodiment of the present disclosure. Referring to Fig. 3, the display device 100 according to the exemplary embodiment of the present disclosure can include a display panel 110 and a cable 195 which is connected to the display panel 110 by the connector 190. The display panel 110 is a panel for displaying an image to a user. The display panel 110 can include a display element configured to show images, a driver element configured to operate the display element, and wiring configured to transmit various signals to the display element and the driver element. The display element can be defined differently depending on the type of display panel 110. For example, if the display panel 110 is an organic light-emitting display panel, the display element can be an organic light-emitting element comprising an anode, an organic light-emitting layer, and a cathode. Although the display panel 110 is assumed to be an organic light-emitting display panel, the display panel 110 is not limited to the organic light-emitting display panel below. The display panel 110 can include a display area AA and a non-display area NA. The AA display area is an area where images are displayed on the 110 display panel. Within the display area AA, a plurality of subpixels, which together form a plurality of pixels, and a circuit for driving these plurality of subpixels can be arranged. The plurality of subpixels are minimal units that constitute the display area AA, and the display element can be located within any of the plurality of subpixels, and the plurality of subpixels can form a single pixel. For example, the organic light-emitting element, which includes the anode, the organic emission layer, and the cathode, can be located within any of the plurality of subpixels, but is not limited to doing so. Furthermore, the circuit for driving the plurality of subpixels can include a driver element, wiring, and the like. For example, the circuit can consist of, but is not limited to, a thin-film transistor, a storage capacitor, a gate line, a data line, or the like. The non-display area (NA) is an area where no image is displayed. Fig. 3 illustrates that the non-display area NA encloses the display area AA with a rectangular shape. However, the shapes and arrangements of the display area AA and the non-display area NA are not limited to the example shown in Fig. 3. The non-display area NA can contain various wiring and circuits for controlling the organic light-emitting element of the display area AA. For example, the non-display area NA can contain, but is not limited to, a connecting line for transmitting signals to the majority of subpixels and circuits of the display area AA, or a driver IC, such as a gate driver IC or a data driver IC. Traditionally, a circuit component, such as a source board, is required to drive the display panel. In the conventional module process, the source board is attached to one end of the display panel and electrically connected to the pad portion of the display panel via a driver IC. A disadvantage of this approach is the complexity of the component count and assembly process, as the source board is manufactured separately from the display panel and then attached to it. Furthermore, the additional components and process steps can increase manufacturing costs and potentially reduce productivity. Accordingly, the display device 100 according to the exemplary embodiment of the present disclosure is characterized in that the circuit part 180 is arranged within the display panel 110 and provides various signals, such as control signals and data signals received through the external cable 195, to the plurality of subpixels and circuits of the display area AA. The circuit section 180 can take on the role of a conventional source circuit board, and a driver IC, such as a data driver IC, can be placed in it. Accordingly, components and processes can be simplified, resulting in increased process efficiency and reduced costs. Furthermore, the reliability of the moisture barrier performance can be improved by expanding the design area of ​​the encapsulation structure, thus enhancing the reliability of the 100 display device. For example, the circuit part 180 can be located in the non-display area NA of the display panel 110. The circuit part 180 can be arranged between the substrate 111 and the encapsulation substrate 160. For example, the circuit part 180 can be arranged within the adhesive layer 165. For example, the circuit part 180 can be arranged within the adhesive layer 165 between the substrate 111 and an additional insulating layer. Cable 195 is a component for supplying signals to the majority of subpixels and the circuitry of the display area AA via the circuitry 180 and can be electrically connected to connector 190. Cable 195 is located at one end of the non-display area NA of the display panel 110 to supply a supply voltage, a data voltage, and the like to the majority of subpixels and the circuitry of the display area AA. Cable 195 can be electrically connected to an external control element of the arrangement. For example, cable 195 and connector 190 can form an external contact structure for connection to an external control element of the arrangement. The connector 190 can be positioned above the substrate 111 in the non-display area NA, which is not covered by the encapsulation substrate 160. A plurality of connectors 190 and cables 195 may be provided, but the present disclosure is not limited thereto and may be provided as one. Cable 195 can correspond one-to-one with connector 190, but is not limited to this. The cable 195 can be inserted into and attached to the connector 190, but is not limited to this. The connector 190, the cable 195 and the circuit part 180 are described in more detail with reference to Fig. 5, Fig. 6 to Fig. 7. Fig. 4 is a cross-sectional view of a subpixel. Fig. 5 is a cross-sectional view along line II' of Fig. 3 . Fig. 6 is an enlarged top view of part A of Fig. 5. Fig. 7 is another top view showing an enlarged part A of Fig. 5. In Fig. 5, for the sake of simplicity, at least some of a buffer layer 112, a gate insulating layer 113 and an intermediate insulating layer 114 are shown as insulating layers 117. In Figures 6 and 7, the configuration above the protective layer 140 has been omitted for the sake of simplicity. Figures 6 and 7 illustrate an example of a contact structure between the bond structure 170 and the circuit section 180, but are not limited to this and can be implemented in various forms. Referring to Fig. 4, Fig. 5, Fig. 6 to Fig. 7, in the display device 100 of Fig. 3 according to the exemplary embodiment of the present disclosure, the driver element 120 can be arranged on the substrate 111. Furthermore, the planarization layer 115 can be arranged above the driver element 120. Furthermore, the light-emitting element 130, which is electrically connected to the driver element 120, can be arranged above the planarization layer 115, and the protective layer 140 can be arranged above the light-emitting element 130. The adhesive layer 165, the additional insulating layer 145 and the encapsulation substrate 160 can be arranged sequentially over the protective layer 140. However, the display device 100 according to the exemplary embodiment of the present disclosure is not limited to such a stacked structure. Substrate 111 can be a glass or plastic substrate. In the case of a plastic substrate, a polyimide-based or polycarbonate-based material can be used to provide flexibility. In particular, polyimide is a material that can be applied and coated using a high-temperature process, making it widely used as a plastic substrate. A buffer layer 112 can be arranged on the substrate 111. However, although not shown, a light-shielding layer can be arranged on the substrate 111 to block light introduced from a lower section of the substrate 111. The light-shielding layer can be arranged on the substrate 111 at a position where the active layer 124 is to be formed. In particular, it is preferred that the size of the light-shielding layer is somewhat larger in order to completely cover the active layer 124. The buffer layer 112 can be arranged on the entire surface of the substrate 111 on which the light-shielding layer is formed. The buffer layer 112 is a layer for protecting various electrodes and wiring from impurities, such as alkali ions, discharged from the substrate 111 or the underlying layers. The buffer layer 112 can have a multilayer structure, comprising a first buffer layer 112a and a second buffer layer 112b, but is not limited to this. For example, the buffer layer 112 can be made of silicon oxide (SiOx), silicon nitride (SiNx), or a multilayer thereof. The buffer layer 112 can delay the diffusion of moisture and / or oxygen penetrating the substrate 111. Furthermore, the buffer layer 112 can contain a multi-layer buffer and / or an active buffer. The active buffer protects the active layer 124, which is made from the semiconductor of the driver element 120, and can perform a function of blocking various types of defects introduced by the substrate 111. The active buffer can be made of amorphous silicon (a-Si) or the like. Meanwhile, various wiring and circuits for controlling the light-emitting element 130 of the display area AA can be arranged in the non-display area NA. For example, the circuit section 180, which includes a plurality of connecting lines LL1 and LL2 for transmitting signals to the plurality of subpixels and circuits of the display area AA, as well as driver ICs, such as a gate driver IC and a driver IC, can be arranged in the non-display area NA, but is not limited to this. For example, the first connecting line LL1 and the second connecting line LL2 can be located on the substrate 111 in the non-display area NA. The first connecting line LL1 can be located at an edge of the lower non-display area NA. The second connecting line LL2 can be spaced a predetermined distance away from the first connecting line LL1 and located further inwards than the first connecting line LL1. For example, the second connecting line LL2 can be separated from the first connecting line LL1. Multiple first interconnect lines LL1 and multiple second interconnect lines LL2 can be provided. For example, the first interconnect line LL1 and the second interconnect line LL2 can be arranged in a number corresponding to the number of signal lines. For example, at a resolution of 1024 × 768, each of the first interconnect line LL1 and the second interconnect line LL2 can be arranged in 1024 units, corresponding to the number of horizontal pixels (horizontal resolutions). For example, the first connecting line LL1 and the second connecting line LL2 can be made of a conductive material that forms the light shielding layer and / or the driver element 120 of the display area AA, but are not limited to this. For example, the second connecting line LL2 includes a lower second connecting line LL2b and an upper second connecting line LL2a. The upper second connecting line LL2a can be electrically connected to the lower second connecting line LL2b via a contact hole CH (see Fig. 6 and Fig. 7). Furthermore, the lower second connecting line LL2b can, for example, be formed from a material that forms the light shielding layer, and the upper second connecting line LL2a can be formed from a material that forms the gate electrode, but is not limited to this. In addition, the first connecting line LL1 can be formed from the same conductive material on the same layer as the upper second connecting line LL2a, but is not limited to this. Furthermore, the first connecting line LL1 and the second connecting line LL2 can be arranged parallel in one direction, but are not limited to this. The first connecting line LL1 and the second connecting line LL2 can be arranged in a zigzag pattern or can be arranged so that they are inclined at a predetermined angle. Moreover, any one of the first connecting lines LL1 and the second connecting line LL2 can be arranged so that they are inclined at different angles. The control element 120 can comprise an active layer 124, a gate insulating layer 113, a gate electrode 121, an intermediate insulating layer 114, a source electrode 122, and a drain electrode 123. Furthermore, the control element 120 can be electrically connected to the light-emitting element 130 via a connecting electrode 125 to transmit a current or signal to the light-emitting element 130. In addition to the upper gate structure shown, the control element 120 can be applied in various ways, such as a lower gate in which the gate electrode is located below the active layer, and a coplanar structure in which the gate electrode, source electrode, and drain electrode are arranged on the same plane. The active layer 124 can be positioned on the buffer layer 112. The active layer 124 can be made of polysilicon (p-Si), in which case a predetermined region can be doped with impurities. Furthermore, the active layer 124 can be made of amorphous silicon (a-Si) and can be made of an organic semiconductor material such as pentacene. Finally, the active layer 124 can be formed from an oxide semiconductor. The gate insulating layer 113 can be positioned on the active layer 124. For example, the gate insulating layer 113 can be formed from an insulating inorganic material such as silicon dioxide (SiOx) or silicon nitride (SiNx), or from an insulating organic material. The gate electrode 121 can be positioned on the gate insulating layer 113. For example, the gate electrode 121 can be made of various conductive materials such as magnesium (Mg), aluminum (Al), nickel (Ni), chromium (Cr), molybdenum (Mo), tungsten (W), gold (Au), or an alloy thereof. The interlayer insulating layer 114 can be positioned on the gate electrode 121. For example, the interlayer insulating layer 114 can be formed from an insulating material such as silicon oxide (SiOx) or silicon nitride (SiNx) or an insulating organic material. A contact hole, through which the source and drain regions are exposed, can be formed by selectively removing the gate insulating layer 113 and the intermediate insulating layer 114. The source electrode 122 and the drain electrode 123 can be formed on the intermediate insulating layer 114 in a single layer or a multilayer structure using an electrode material. If necessary, an additional protective layer made of an inorganic insulating material can be formed to cover the source electrode 122 and the drain electrode 123. The planarization layer 115 can be arranged above the driver element 120, which is configured as described above. The planarization layer 115 can have a multilayered structure containing at least two layers. For example, with reference to Fig. 4, the planarization layer 115 can contain, but is not limited to, a first planarization layer 115a and a second planarization layer 115b. For example, the first planarization layer 115a is arranged to cover the control element 120 and may be arranged to expose part of the source electrode 122 or the drain electrode 123 of the control element 120. The planarization layer 115 can be a coating layer, but is not limited to that. The connecting electrode 125 for electrically connecting the control element 120 and the light-emitting element 130 can be arranged on the first planarization layer 115a. Although not shown in Fig. 4, various metal layers serving as wires / electrodes, such as data lines and signal lines, can be arranged on the first planarization layer 115a. Furthermore, a color filter CF can be arranged on the first planarization layer 115a. However, the present disclosure is not limited to this. The color filter CF can be omitted depending on the type of light-emitting element 130. Each subpixel's color filter (CF) can be red, green, or blue. Furthermore, in the case of a subpixel where white is implemented, the color filter CF may not be provided. The arrangement of red, green, and blue filters can be configured in various ways, and a black matrix capable of absorbing external light can be placed between the color filters CF. In the case of the lower emission type, the color filter CF can be located below the anode 131. Furthermore, the second planarization layer 115b can be arranged on the first planarization layer 115a and the connecting electrode 125. The second planarization layer 115b can be formed to expose part of the connecting electrode 125. Furthermore, the drain electrode 123 of the control element 120 and the anode 131 of the light-emitting element 130 can be electrically connected via the connecting electrode 125. In this case, the light-emitting element 130 can be formed such that the anode 131, a plurality of organic layers 132, and the cathode 133 are arranged sequentially. That is, the light-emitting element 130 can include an anode 131 arranged on the planarization layer 115, an organic layer 132 arranged on the anode 131, and a cathode 133 arranged on the organic layer 132. The display device 100 can be implemented in an upper emission type or a lower emission type. In the upper emission type, a reflective layer made of an opaque conductive material with high reflectivity, such as silver (Ag), aluminum (Al), gold (Au), molybdenum (Mo), tungsten (W), chromium (Cr), or an alloy thereof, can be added below the anode 131, so that light emitted by the organic layer 132 is reflected by the anode 131 and directed upwards, that is, towards the cathode 133 at the top. Conversely, in the case of the lower emission type, the anode 131 may be made of a transparent conductive material such as indium tin oxide (ITO), indium zinc oxide (IZO), or indium gallium zinc oxide (IGZO).The following description is given under the assumption that the display device 100 of the present disclosure is a lower emission type. However, the present disclosure is not limited to this. A bank 116 can be formed on the planarization layer 115 in a different area than the emission region. That is, the bank 116 has a bank hole that exposes the anode 131 according to the emission region. The bank 116 can be made of an inorganic insulating material such as silicon nitride (SiNx) or silicon oxide (SiOx), or an organic insulating material such as benzocyclobutene (BCB), acrylic resin, or imide resin. The organic layer 132 can be arranged on the anode 131, which is exposed by the bank 116. The organic layer 132 can include an emission layer, an electron injection layer, an electron transport layer, a hole transport layer, a hole injection layer, and the like. The cathode 133 can be arranged on the organic layer 132. In the case of the upper emission type, the cathode 133 can comprise a transparent conductive material. For example, the cathode 133 can be made of indium tin oxide (ITO), indium zinc oxide (IZO), indium gallium zinc oxide (IGZO), or the like. In the case of the lower emission type, the cathode 133 can comprise one of a group consisting of a metallic material such as gold (Au), silver (Ag), aluminum (Al), molybdenum (Mo), magnesium (Mg), palladium (Pd), copper (Cu), or an alloy thereof. Alternatively, the cathode 133 can be formed by laminating a layer made of a transparent conductive material such as indium tin oxide (ITO), indium zinc oxide (IZO), indium gallium zinc oxide (IGZO) and a layer made of a metallic material such as gold (Au), silver (Ag), aluminum (Al), molybdenum (Mo), magnesium (Mg), palladium (Pd), copper (Cu) or an alloy thereof, but is not limited to this. Although not shown, a cover layer can be arranged on the cathode 133. The cover layer can be made of a material with a high refractive index and a high light absorption rate to reduce the diffuse reflection of external light. The protective layer 140 can be arranged on the light-emitting element 130, which is configured as described above. The protective layer 140 can be an inorganic layer and in this case can be made of silicon oxide (SiOx), silicon nitride (SiNx) or a multiple layer thereof. However, at least some layers of the buffer layer 112, the gate insulating layer 113 and the intermediate insulating layer 114, i.e. the insulating layer 117, can extend to the non-display area NA. Furthermore, the planarization layer 115 can extend to the non-display area NA. The insulating layer 117 and the planarizing layer 115, which extend to the non-display area NA, may have certain sections selectively removed, forming a first contact hole 140a and a second contact hole 140b, exposing sections of the first connecting line LL1 and the second connecting line LL2. The first contact hole 140a and the second contact hole 140b can be arranged to correspond to the first connecting line LL1 and the second connecting line LL2, respectively. Furthermore, outer sections of the insulating layer 117 and the planarizing layer 115 can be selectively removed to expose another section of the first connecting line LL1. In this case, the exposed other section of the first connecting line LL1 can be electrically connected to the connector 190. The connector 190 can be positioned above the substrate 111 in the non-display area NA, which is not covered by the encapsulating substrate 160, to be electrically connected to the exposed other section of the first connecting line LL1. Furthermore, the cable 195 can be positioned at one end of the non-display area NA of the display panel 110 and electrically connected to the connector 190. Furthermore, a first contact electrode 135a and a second contact electrode 135b can be arranged above the planarization layer 115 in the non-display area NA. A plurality of first contact electrodes 135a and a plurality of second contact electrodes 135b can be provided. The first contact electrode 135a can be electrically connected to the first connecting line LL1 through the first contact hole 140a, and the second contact electrode 135b can be electrically connected to the second connecting line LL2 through the second contact hole 140b. The first contact electrode 135a and the second contact electrode 135b can correspond one-to-one to the first connecting line LL1 and the second connecting line LL2 respectively, but are not limited to this. For example, the first contact electrode 135a and the second contact electrode 135b can be arranged parallel in one direction, but are not limited to this. For example, the first contact electrode 135a and the second contact electrode 135b can overlap the first connecting line LL1 and the second connecting line LL2, respectively. For example, the first contact electrode 135a and the second contact electrode 135b can be formed from a conductive material that forms the anode 131, but are not limited to this. Furthermore, Bank 116 can extend to the non-display area NA. A portion of bank 116 can form an island-shaped dummy bank 116' at an edge of the non-display area NA. The dummy bank 116' can be positioned between the first contact electrode 135a and the second contact electrode 135b. The dummy bank 116' can be spaced apart from another portion (e.g., a remaining portion) of bank 116. The first contact electrode 135a and the second contact electrode 135b can be separated from each other by the dummy bank 116'. For example, the dummy bench 116' can be arranged in a different direction perpendicular to one direction. The dummy bank 116' can be arranged between the first contact electrode 135a and the second contact electrode 135b in a direction that crosses the first contact electrode 135a and the second contact electrode 135b. Meanwhile, in the non-display area NA, the organic layer 132 can be located on bank 116. The organic layer 132 extends to the non-display area NA, and its edges may be located within the edges of bank 116, but it is not restricted thereto. The cathode 133 can extend to the non-display area NA. In the non-display area NA, the cathode 133 can be arranged on the organic layer 132. The cathode 133 can extend to the non-display area NA to cover the organic layer 132 and the bank 116. The protective layer 140 can extend to the non-display area NA. The protective layer 140 can extend to the non-display area NA to cover the cathode 133. For example, the protective layer 140 can be made of an inorganic insulating material. The protective layer 140 can delay moisture permeation from above and suppress defects caused by pressing or foreign particles. The adhesive layer 165 and the encapsulation substrate 160 can be arranged above the protective layer 140. However, the present disclosure is not limited thereto, and an encapsulation structure of a multilayer structure consisting of a sealing element and a reinforcing substrate may be arranged on the protective layer 140. However, one embodiment of the present disclosure is characterized in that the additional insulating layer 145 is arranged between the adhesive layer 165 and the encapsulation substrate 160. The adhesive layer 165 can be arranged between the protective layer 140 and the additional insulating layer 145. For example, the adhesive layer 165 can serve to delay lateral moisture permeation. For example, the adhesive layer 165 may also contain a desiccant such as a getter in addition to isobutyl rubber resin. The desiccant may contain calcium oxide. The desiccant can be hygroscopic particles that absorb moisture and oxygen from the outside to minimize the penetration of moisture and oxygen into the AA display area. The additional insulating layer 145 can be arranged on the adhesive layer 165. The additional insulating layer 145 can be added to prevent a short circuit between the circuit part 180 and the encapsulation substrate 160. The encapsulation substrate 160 can be arranged on the additional insulating layer 145. The encapsulation substrate 160, together with the adhesive layer 165, can protect the light-emitting element 130 from external moisture, oxygen, shocks and the like. For example, the encapsulation substrate 160 can be used to prevent moisture permeation from the front. For example, the encapsulation substrate 160 can be made of stainless steel (SUS) or Invar, but is not limited to these materials. At this time, Invar is one of the alloys consisting of nickel and iron and has a very low coefficient of thermal expansion, making it relatively stable under temperature changes. However, according to one embodiment of the present disclosure, the circuit part 180 is arranged within the display panel (110 in Fig. 3). The circuit section 180 can take on the role of a conventional source circuit board, and a driver IC, such as a data driver IC, can be placed in it. For example, the circuit section 180 can be located within the non-display area NA of the display panel 110. The circuit section 180 can be located at the edge of the non-display area NA. The circuit part 180 can be arranged between the substrate 111 and the encapsulation substrate 160. For example, the circuit part 180 can be arranged within the adhesive layer 165. For example, the circuit part 180 can be arranged within the adhesive layer 165 between the substrate 111 and the additional insulating layer 145. In this case, the reliability of moisture permeation can be improved because the design area of ​​the encapsulation structure can be extended. That is, conventionally, the pad part was not covered by the encapsulation structure to connect the source circuit board to the pad part, but according to one embodiment of the present disclosure, the circuit part 180 can be arranged within the encapsulation structure and electrically connected to the bond structure 170 without a pad part, thus allowing the encapsulation structure to be extended.Expanding the encapsulation structure delays moisture permeation, thus improving reliability. The circuit section 180 can be electrically connected to the bond structure 170. For example, the bond structure 170 can electrically connect the circuit part 180 and the first connecting line LL1 and the second connecting line LL2. The bond structure 170 can, for example, include a first contact hole 140a and a second contact hole 140b, a first contact electrode 135a and a second contact electrode 135b, and first connecting parts 185a and 285a and second connecting parts 185b and 285b. For example, the input unit of circuit part 180 and the first contact electrode 135a can be electrically connected by the first connecting parts 185a and 285a. For example, the input unit can include a plurality of input terminals, but is not limited to them. For example, the output unit of circuit part 180 and the second contact electrode 135b can be electrically connected by the second connecting parts 185b and 285b. For example, the output unit can include, but is not limited to, a plurality of output terminals. For example, the first connecting parts 185a and 285a and the second connecting parts 185b and 285b can be formed from a conductor such as an anisotropic conductive film (ACF). That is, for example, the first connecting parts 185a and 285a and the second connecting parts 185b and 285b can be configured by the conductive spheres as in Fig. 6 or the conductive rods as in Fig. 7, but are not limited to this. However, in the present disclosure, in order to minimize the penetration of moisture, the planarization layer of the padbond section can be formed in an island shape, which is described in detail with reference to the drawings. Fig. 8 is a cross-sectional view of a display device according to a further embodiment of the present disclosure. In another embodiment of Fig. 8, one configuration of the planarization layers 215 and 215' differs from that of the embodiment described above in Figs. 1, 2, 3, 4, 5, 6 to 7, and other configurations are essentially the same, so redundant descriptions are omitted. The same components are designated by the same reference numerals. The following description of the same reference numerals may refer to Figs. 1, 2, 3, 4, 5, 6 to 7. In Fig. 8, for the sake of simplicity, at least some of the buffer layer 112, the gate insulating layer 113 and the intermediate insulating layer 114 are shown as insulating layers 117. Referring to Fig. 8, in the display device 200 according to a further exemplary embodiment of the present disclosure a driver element (120 in Fig. 4) can be arranged above the substrate 111. Furthermore, a planarization layer 215 can be arranged above the driver element 120. Furthermore, a light-emitting element (130 in Fig. 4) which is electrically connected to the driver element 120 can be arranged above the planarization layer 215, and a protective layer 240 can be arranged above the light-emitting element 130. The adhesive layer 165, the additional insulating layer 145 and the encapsulation substrate 160 can be arranged sequentially over the protective layer 240. However, the display device 200 according to a further exemplary embodiment of the present disclosure is not limited to such a stacked structure. For example, the first connecting line LL1 and the second connecting line LL2 can be arranged above the substrate 111 in the non-display area NA. The first connecting line LL1 can be located at an edge of the lower non-display area NA. The second connecting line LL2 can be spaced a predetermined distance away from the first connecting line LL1 and located further inwards than the first connecting line LL1. Furthermore, at least some of the buffer layer (112 in Fig. 4), the gate insulating layer (113 in Fig. 4) and the intermediate insulating layer (114 in Fig. 4), i.e. the insulating layer 117, can extend to the non-display area NA. Furthermore, the planarization layer 215 can extend to the non-display area NA. The display device 200 according to a further exemplary embodiment of the present disclosure is characterized in that the planarization layer 215, which extends to the non-display area NA, is separated from the planarization layer 215' of the bond structure 170. In addition, the display device 200 according to a further exemplary embodiment of the present disclosure is characterized in that the trench T is provided in the non-display area NA to ensure reliability, such as the prevention of moisture permeation. However, for the sake of simplicity, the planarization layer 215 can be referred to as an inner planarization layer 215, and the planarization layer 215' of the bond structure 170 can be referred to as an outer planarization layer 215'. In this case, according to a further embodiment of the present disclosure, the planarization layers 215 and 215' can include the inner planarization layer 215, which is arranged inside the trench T with respect to the trench T, and the outer planarization layer 215', which is arranged outside the trench T. For example, the trenches T can be arranged side by side in one direction. For example, one direction can be parallel to the gate line. For example, trench T can be arranged parallel to dummy bank 116'. The inner planarization layer 215 and the outer planarization layer 215' can be formed by the same process, but are not limited to it, and can be formed by different processes. As described above, according to a further exemplary embodiment of the present disclosure, the display device 200 can effectively block the penetration of moisture through the inner planarization layer 215 by separating and forming the inner planarization layer 215 and the outer planarization layer 215' around the trench T. However, Bank 116 can extend to the non-display area NA. For example, an edge of bank 116 extending to the non-display area NA may be arranged inwards compared to an edge of the inner planarization layer 215, but is not limited to this. A portion of bank 116 can form an island-shaped dummy bank 116' at an edge of the non-display area NA. The dummy bank 116' can be spaced apart from another portion (e.g., a remaining portion) of bank 116. Furthermore, in the non-display area NA, the organic layer 132 can be located on bank 116. The organic layer 132 extends to the non-display area NA, and its edge may be positioned inwards compared to the edge of bank 116, but it is not restricted to this. The cathode 233 can extend to the non-display area NA. In the non-display area NA, the cathode 233 can be located on the organic layer 132. The cathode 233 can extend to the non-display area NA to cover the organic layer 132, the bank 116, and the inner planarization layer 215. The cathode 233 can extend into the trench T to cover part of the upper surface of the exposed insulating layer 117. The cathode 233 can be in contact with an upper surface of the exposed insulating layer 117. The cathode 233 can be spaced away from the outer planarization layer 215' by a predetermined distance. The protective layer 240 can extend to the non-display area NA. The protective layer 240 can extend to the non-display area NA to cover the cathode 233. The protective layer 240 can extend into the trench T to cover a section of the upper surface of the cathode 233 and the exposed insulating layer 117. The protective layer 240 can be in contact with the upper surface of the exposed insulating layer 117. The protective layer 240 can be spaced away from the outer planarization layer 215' by a predetermined distance. The adhesive layer 165 and the encapsulation substrate 160 can be arranged above the protective layer 240. However, according to the present disclosure, an encapsulation structure of a multilayer structure consisting of a sealing element and a reinforcing substrate can be arranged above the protective layer, which is described in detail with reference to the drawings. Fig. 9 is a cross-sectional view of a display device according to yet another embodiment of the present disclosure. Another embodiment of Fig. 9 is essentially the same as the other embodiment of Fig. 8, except that an encapsulation structure of a multilayer structure composed of a sealing element 365 and a reinforcing substrate 360 ​​is applied. Therefore, repeated descriptions of the identical components are omitted. Furthermore, the same reference numerals are used for the same components. The following description of the same reference numerals may refer to Figs. 1, 2, 3, 4, 5, 6, 7 to 8. With reference to Fig. 9, in the display device 300 according to yet another exemplary embodiment of the present disclosure, an encapsulation structure of a multilayer structure, composed of a sealing element 365 and a reinforcing substrate 360, can be arranged above the protective layer 240. A small-format display panel used in mobile and portable devices has a small display area, allowing for rapid heat dissipation and fewer bonding issues. However, in a large-format display panel used in a monitor, tablet, or television receiver, the display area is large, necessitating an encapsulation structure for optimal heat dissipation and bond strength. Furthermore, to ensure sufficient rigidity, the display device may also include a separate inner plate on the encapsulation substrate. In this case, it is necessary to provide space for this separate inner plate, and a problem arises from the weight of the inner plate, which limits the slimming and lightening of the display device. Additionally, a vertical space is created by an air gap between the encapsulation substrate and the inner plate, extending to the thickness of the adhesive tape used to bond them, thus reducing heat dissipation performance. Accordingly, in yet another embodiment of the present disclosure, it is possible to fix the reinforcing substrate 360, which has a relatively large thickness, while the separate inner plate is removed, and it is characterized in that the encapsulation structure of the multilayer structure, which includes a sealing element 365 that can prevent a process defect, is applied. For example, according to yet another exemplary embodiment of the present disclosure, the sealing element 365 can comprise a first adhesive layer 365a facing the substrate 111, a second adhesive layer 365c facing the reinforcing substrate 360, and a barrier layer 365b arranged between the first adhesive layer 365a and the second adhesive layer 365c. In this case, both the first adhesive layer 365a and the second adhesive layer 365c can be made from a polymer material with adhesive properties. For example, the first adhesive layer 365a can be made from any of the polymer materials based on olefins, epoxides, and acrylates. Furthermore, the second adhesive layer 365c can be made from any of the materials based on olefins, epoxides, acrylates, amines, phenols, and acid anhydrides that do not contain a carboxyl group. For heat dissipation from the substrate 111, at least the first adhesive layer 365a and the second adhesive layers 365a and 365c can be formed from a mixture containing particles of an adhesive polymer material and a metal material. For example, the metal material particles can be nickel (Ni) powder. In this way, the heat dissipation effect on the substrate 111 can be improved, since the speed at which the control heat generated in the substrate 111 is dissipated by the sealing element 365 can be improved. Furthermore, to prevent moisture permeation, the first adhesive layer 365a can be formed from a mixture that also contains a hygroscopic inorganic filler. The hygroscopic inorganic filler can be at least one of barium oxide (BaO), calcium oxide (CaO), and magnesium oxide (MgO). Since the first adhesive layer 365a and the second adhesive layer 365c are formed in a multi-layered structure, there is also an advantage in that the reliability in reducing the warping phenomenon, in which the display panel is bent, can also be improved. The barrier layer 365b can be formed from any metallic material and an inorganic insulating material. That is, the barrier layer 365b can contain a metallic material such as Al, Cu, Sn, Ag, Fe, Zn, and the like. Alternatively, the barrier layer 365b can be formed from a thin film of an inorganic insulating material such as SiOx and SiONx. Since, according to yet another embodiment of the present disclosure, the sealing element 365 comprises the first adhesive layer 365a and the second adhesive layer 365c, which are separated by the barrier layer 365b, it can be implemented to have a thickness approximately twice that of the adhesive material of each layer without any process defect. Since the reinforcing substrate 360, which is fixed by the sealing element 365, can be of considerable thickness, an advantage is that the increase in stiffness and the improvement in heat dissipation can be easily achieved. For example, the reinforcing substrate 360 ​​can be made from any of the glass, metal, and plastic polymers. For example, the reinforcing substrate 360 ​​can be made from a metal material containing components of Al, Cu, Sn, Ag, Fe, or Zn. However, in yet another embodiment of the present disclosure, an additional insulating layer 345 can be arranged between the first adhesive layer 365a and the barrier layer 365b. The additional insulating layer 345 can be added to prevent a short circuit between the circuit part 380 and the junction layer 365b. The circuit element 380, according to yet another embodiment of the present disclosure, can be arranged between the substrate 111 and the reinforcing substrate 360. For example, the circuit element 380 can be arranged in the first adhesive layer 365a. For example, the circuit element 380 can be arranged in the first adhesive layer 365a between the substrate 111 and the additional insulating layer 345. The exemplary embodiments of the present disclosure can also be described as follows: A display device according to an exemplary embodiment of the present disclosure can comprise a substrate comprising a display area and a non-display area outside the display area, a plurality of first connecting lines and a plurality of second connecting lines arranged above the substrate in the non-display area and separated from each other, a planarization layer extending from the display area to the non-display area, an adhesive layer arranged above the planarization layer, an encapsulation substrate arranged on the adhesive layer, a circuit part arranged within the adhesive layer in the non-display area and comprising a driver IC arranged therein, and a first connecting part arranged between the plurality of first connecting lines and the circuit part.to electrically connect the majority of first connecting lines to the circuit part, and to have a second connecting part arranged between the majority of second connecting lines and the circuit part to electrically connect the majority of second connecting lines to the circuit part. The display device may further include a first contact hole and a second contact hole formed by removing a section of the planarization layer of the non-display area to expose a section of upper surfaces of at least one of the plurality of first connecting lines and at least one of the plurality of second connecting lines. The display device may further include a first contact electrode arranged above the planarization layer and electrically connected to at least one of the plurality of first connecting lines through the first contact hole, and a second contact electrode arranged above the planarization layer and electrically connected to at least one of the plurality of second connecting lines through the second contact hole, and the first contact electrode and the second contact electrode may be electrically connected to the first connecting part and the second connecting part, respectively. The first contact electrode and the second contact electrode can be provided multiple times, and the plurality of first contact electrodes and the plurality of second contact electrodes can each correspond one to one to the plurality of first connecting leads and the plurality of second connecting leads. The first contact electrode and the second contact electrode can overlap at least one of the plurality of first connecting leads or at least one of the plurality of second connecting leads, and the first contact electrode and the second contact electrode can be arranged side by side in one direction. The first contact electrode and the second contact electrode can be made of a conductive material that forms an anode. The display device may further include a bank arranged above the planarization layer and extending to the non-display area; part of the bank may form an island-shaped dummy bank at an edge of the non-display area; and the dummy bank may be spaced apart from another part (e.g., a remaining part) of the bank. The dummy bank can be positioned between the first contact electrode and the second contact electrode, and the dummy bank can be positioned in a different direction perpendicular to one direction. The display device may further include an organic layer arranged on the bank and may extend to the non-display area such that the edge of the organic layer is arranged inwards compared to the edge of the bank. A cathode arranged on the organic layer may further be included, and the cathode may extend to the non-display area to cover the organic layer and the bank. A protective layer arranged on the cathode may further be included, and the protective layer may extend to the non-display area to cover the cathode. The display device may further include an insulating layer arranged between the adhesive layer and the encapsulation substrate, and the circuit part may be arranged at an edge of the non-display area in the adhesive layer between the substrate and the insulating layer. The display device may further include a connector arranged above the substrate in the non-display area not covered by the encapsulation substrate, and a cable electrically connected to the connector. The display device may further include a trench located in the non-display area and formed by selectively removing a section of the planarization layer, and the planarization layer may include an inner planarization layer located within the trench in relation to the trench, and an outer planarization layer located outside the trench. The trench can be arranged parallel to the dummy bench. The display device may further include an organic layer arranged on the bank and may extend to the non-display area such that the edge of the organic layer is arranged inwards compared to the edge of the bank. A cathode located on the organic layer may further be included, and the cathode may extend to the non-display area to cover the organic layer, the bank, and the inner planarization layer. The display device may further include a protective layer arranged on the cathode, and the protective layer may extend into the trench to cover the cathode. A display device according to a further exemplary embodiment of the present disclosure can comprise a substrate comprising a display area and a non-display area outside the display area, a plurality of first connecting lines and a plurality of second connecting lines arranged above the substrate in the non-display area and separated from each other, a planarization layer extending from the display area to the non-display area, a sealing element arranged above the planarization layer and comprising a first adhesive layer and a second adhesive layer and a barrier layer arranged between the first adhesive layer and the second adhesive layer, a reinforcing substrate arranged on the second adhesive layer, a circuit part arranged within the first adhesive layer in the non-display area and comprising a driver IC arranged therein,comprising a first connecting part arranged between the plurality of first connecting lines and the circuit part in order to electrically connect the plurality of first connecting lines to the circuit part, and a second connecting part arranged between the plurality of second connecting lines and the circuit part in order to electrically connect the plurality of second connecting lines to the circuit part. The display device may further include an insulating layer arranged between the first adhesive layer and the barrier layer, and the circuit part may be arranged at an edge of the non-display area in the first adhesive layer between the substrate and the insulating layer.

Claims

A display device (100, 200) comprising: a substrate (111) comprising a display area (AA) and a non-display area (NA) outside the display area (AA); a plurality of first connecting lines (LL1) and a plurality of second connecting lines (LL2) arranged above the substrate (111) in the non-display area (NA) and separated from each other; a planarization layer (115, 215, 215') extending from the display area (AA) to the non-display area (NA); an adhesive layer (165) arranged above the planarization layer (115, 215, 215'); an encapsulation substrate (160) arranged on the adhesive layer (165); a circuit section (180) arranged within the adhesive layer (165) in the non-display area (NA) and comprising a driver IC arranged therein;a first connecting part (185a, 285a) arranged between the plurality of first connecting lines (LL1) and the circuit part (180) to electrically connect the plurality of first connecting lines (LL1) to the circuit part (180); and a second connecting part (185b, 285b) arranged between the plurality of second connecting lines (LL2) and the circuit part (180) to electrically connect the plurality of second connecting lines (LL2) to the circuit part (180). The display device (100, 200) according to claim 1, further comprising: a first contact hole (140a) and a second contact hole (140b) formed by removing a section of the planarization layer (115, 215, 215') of the non-display area (NA) to expose a section of upper surfaces of at least one of the plurality of first connecting lines (LL1) and at least one of the plurality of second connecting lines (LL2). The display device (100, 200) according to claim 2, further comprising: a first contact electrode (135a) arranged above the planarization layer (115, 215, 215') and electrically connected to at least one of the plurality of first connecting lines (LL1) through the first contact hole (140a); and a second contact electrode (135b) arranged above the planarization layer (115, 215, 215') and electrically connected to at least one of the plurality of second connecting lines (LL2) through the second contact hole (140b), wherein the first contact electrode (135a) and the second contact electrode (135b) are electrically connected to the first connecting part (185a, 285a) and the second connecting part (185b, 285b), respectively. The display device (100, 200) according to claim 3, wherein a plurality of first contact electrodes (135a) and a plurality of second contact electrodes (135b) are provided, and wherein the plurality of first contact electrodes (135a) and the plurality of second contact electrodes (135b) correspond in an associated manner to the plurality of first connecting lines (LL1) and the plurality of second connecting lines (LL2). The display device (100, 200) according to claim 3, wherein the first contact electrode (135a) and the second contact electrode (135b) overlap at least one of the plurality of first connecting lines (LL1) and at least one of the plurality of second connecting lines (LL2), respectively, and wherein the first contact electrode (135a) and the second contact electrode (135b) are arranged side by side in one direction. The display device (100, 200) according to one of claims 3 to 5, wherein the first contact electrode (135a), the second contact electrode (135b) and an anode are formed from a conductive material. The display device (100, 200) according to claim 5, further comprising: a bank (116) arranged above the planarization layer (115, 215, 215') and extending to the non-display area (NA), wherein a part of the bank (116) includes an island-shaped dummy bank (116') at an edge of the non-display area (NA), and wherein the dummy bank (116') is spaced apart from another part of the bank (116). The display device (100, 200) according to claim 7, wherein the dummy bank (116') is arranged between the first contact electrode (135a) and the second contact electrode (135b). The display device (100, 200) according to one of claims 1 to 8, further comprising: an insulating layer (145) arranged between the adhesive layer (165) and the encapsulation substrate (160), wherein the circuit part (180) is arranged at an edge of the non-display area (NA) in the adhesive layer (165) between the substrate (111) and the insulating layer (145). The display device (100, 200) according to any one of claims 1 to 9, further comprising: a connector (190) arranged above the substrate (111) in the non-display area (NA) which is not covered by the encapsulation substrate (160); and a cable (195) electrically connected to the connector (190). The display device (200) according to claim 7 or any one of claims 8 to 10 by direct or indirect reference to claim 7, further comprising: a trench (T) arranged in the non-display area (NA) formed by selectively removing a section of the planarization layer (215, 215'), wherein the planarization layer (215, 215') comprises an inner planarization layer (215) arranged within the trench (T) with respect to the trench (T), and an outer planarization layer (215') arranged outside the trench (T), and wherein the trench (T) is arranged to be parallel to the dummy bank (116'). The display device according to claim 7, further comprising: an organic layer (132) arranged on the bank (116) and extending to the non-display area (NA) such that an edge of the organic layer (132) is arranged inwards compared to an edge of the bank (116); and a cathode (133) arranged on the organic layer (132) and extending to the non-display area (NA) to cover the organic layer (132) and the bank (116). A display device (300) comprising: a substrate (111) comprising a display area (AA) and a non-display area (NA) outside the display area (AA); a plurality of first connecting lines (LL1) and a plurality of second connecting lines (LL2) arranged above the substrate (111) in the non-display area (NA) and separated from each other; a planarization layer (215, 215') extending from the display area (AA) to the non-display area (NA); a sealing element (365) arranged above the planarization layer (215, 215') comprising a first adhesive layer (365a) and a second adhesive layer (365c) and a barrier layer (365b) arranged between the first adhesive layer (365a) and the second adhesive layer (365c); a reinforcing substrate (360) arranged on the second adhesive layer (365c);a circuit part (380) arranged within the first adhesive layer (365a) in the non-display area (NA) and comprising a driver IC arranged therein; a first interconnection part (185a, 285a) arranged between the plurality of first interconnection lines (LL1) and the circuit part (380) to electrically connect the plurality of first interconnection lines (LL1) to the circuit part (380); and a second interconnection part (185b, 285b) arranged between the plurality of second interconnection lines (LL2) and the circuit part (380) to electrically connect the plurality of second interconnection lines (LL2) to the circuit part (380). The display device (300) according to claim 13, further comprising: an insulating layer (345) arranged between the first adhesive layer (365a) and the barrier layer (365b), wherein the circuit part (380) is arranged at an edge of the non-display area (NA) and in the first adhesive layer (365a) between the substrate (111) and the insulating layer (345). A display device (100, 200, 300) comprising: a substrate (111) comprising a display area (AA) and a non-display area (NA) outside the display area (AA); a plurality of first connecting lines (LL1) and a plurality of second connecting lines (LL2) arranged above the substrate (111) in the non-display area (NA) and separated from each other; a planarization layer (115, 215, 215') extending from the display area (AA) to the non-display area (NA); an encapsulation structure (160, 165, 360, 365) arranged on the planarization layer (115, 215, 215'); a circuit section (180, 380) located within the encapsulation structure (160, 165, 360, 365) in the non-display area (NA). is arranged and has a driver IC arranged therein;a first connecting part (185a, 285a) arranged between the plurality of first connecting lines (LL1) and the circuit part (180) to electrically connect the plurality of first connecting lines (LL1) to the circuit part (180, 380); and a second connecting part (185b, 285b) arranged between the plurality of second connecting lines (LL2) and the circuit part (180, 380) to electrically connect the plurality of second connecting lines (LL2) to the circuit part (180, 380). The display device (300) according to claim 15, wherein the encapsulation structure comprises a multilayer structure composed of a sealing element (365) and a reinforcing substrate (360). The display device (300) according to claim 16, wherein the sealing element (365) comprises a first adhesive layer (365a), a second adhesive layer (365c) and a barrier layer (365b) arranged between the first adhesive layer (365a) and the second adhesive layer (365c), and the reinforcing substrate (360) is arranged on the second adhesive layer (365c). The display device (100, 200) according to claim 17, wherein the first adhesive layer (365a) contains particles of an adhesive polymer material and a metal material. The display device (100, 200) according to claim 17, wherein the first adhesive layer (365a) contains a hygroscopic inorganic filler. The display device according to claim 17, wherein the circuit part (180) is arranged in the first adhesive layer (365a).

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