Apparatus and computing system with microelectronic packaging and wireless connection

Abstract

Apparatus, comprehensive: an integrated circuit chip; a packing substrate to support the integrated circuit chip, wherein the packing substrate has conductive connectors for connecting the integrated circuit chip to external components; a radio coupled to the integrated circuit chip to receive data from the integrated circuit chip and modulate the data onto a radio frequency carrier; and an antenna on the packing substrate that is coupled to the radio to send the modulated data via the radio frequency carrier to an external device, wherein the radio is formed in a radio chip on the packing substrate, which is coupled to the integrated circuit chip through the packing substrate.

Description

AREA

[0001] The present description relates to communication between devices in a computer system and in particular to wireless communication using antennas on an integrated circuit package. BACKGROUND

[0002] In many computer systems, multiple integrated circuit chips communicate with each other to execute programmed operations. These chips can include central processing units, high-speed memory, mass storage devices, chipsets, video processors, and input / output interfaces. Some computers have more than one of each of these types of chips. The chips are typically mounted either directly or via a socket or daughterboard to a motherboard or system board.

[0003] The chips typically communicate using copper interconnects or connections that pass through vias in the chip package, through the platform's mainboard, and then back through the socket and package of the next chip. In another variation, a flexible connector cable is directly connected between two different packages to bypass the socket and the platform's mainboard. This provides a more direct path with fewer interfaces across various connections.

[0004] US 2009 / 0016417A1 describes an integrated circuit (IC) comprising an RF transceiver, a chip, a package substrate, an antenna element, and a transmission line circuit. The chip carries the RF transceiver, and the package substrate carries the chip. The antenna element has a length of less than approximately one-tenth of a wavelength or more than one and a half times the wavelength for a frequency band of approximately 55 GHz to 64 GHz. The transmission line circuit couples the RF transceiver to the antenna element.

[0005] US 2012 / 0286049A1 describes a scalable, high-bandwidth connectivity architecture for portable storage devices and memory modules. This architecture can utilize EHF communication link chip packages mounted in various two- and three-dimensional configurations on flat surfaces such as printed circuit boards (PCBs). Multiple electromagnetic communication links between devices distributed across the main surfaces of card-like devices can be provided with aligned pairs of communication units on each device. Adjacent communication units on a PCB can transmit or receive electromagnetic radiation with different polarizations, such as linear or elliptical polarization. Power supply and communication between communication devices can both be wireless. BRIEF DESCRIPTION OF THE DRAWINGS

[0006] Embodiments are shown in the figures of the accompanying drawings as examples and not for limitation, in which the same reference numerals refer to the same elements. Fig. Figure 1 is a side view in cross-section of a wireless intermediate link for chip-to-chip communications according to one embodiment. Fig. Figure 2 is a side view in cross-section of an alternative wireless intermediate connection for chip-to-chip communications according to one embodiment. Fig. Figure 3 is a block diagram of a radio chip and associated components according to one embodiment. Fig. Figure 4 is a top view of a package containing multiple wireless interconnects for chip-to-chip communications according to one embodiment. Fig. 5 is a side view of the package of Fig. 4. Fig. 6 is a side view in cross-section of the package of Fig. 4. Fig. Figure 7 is a block diagram of a computing system with multiple high-speed interfaces according to one embodiment. Fig. Figure 8 is a side view in cross-section of an alternative configuration of a package with a radio transmitter / receiver according to one embodiment. Fig. Figure 9 is a side view in cross-section of another alternative configuration of a package with a radio transmitter / receiver according to one embodiment. Fig. Figure 10 is a side view in cross-section of another alternative configuration of a package with a radio transmitter / receiver according to one embodiment. Fig. Figure 11 is a side view in cross-section of another alternative configuration of a package with a radio transmitter / receiver according to one embodiment. Fig. Figure 12 is a block diagram of a computing device that includes wireless interfaces according to one embodiment. SUMMARY OF THE INVENTION

[0007] The problem underlying the invention is solved by the subject matter of the independent claims. Further advantageous embodiments are specified in the dependent claims. DETAILED DESCRIPTION

[0008] As described here, a flexible radio frequency intermediary provides point-to-point or single-point-to-multi-point data communication. It can be used as the sole data interface or as a complement to cable or copper intermediary technologies. Some connections can be moved to a radio interface to reduce the complexity of the connector. This can also improve signal fidelity by avoiding losses in an electrical connection.

[0009] A wireless intermediary can be built on the package of a chip to enable radio transmission between two different microelectronic chips at very high data rates. The wireless intermediary can operate at millimeter-wave (mm-wave) or sub-terahertz (sub-THz) frequencies, and the antennas can be made extremely small to fit on the package of a small microelectronic chip. Additionally, the subbandwidth can be made very large to enable very high data rates with simple and low-power modulation schemes.

[0010] Fig. Figure 1 is a general side view in cross-section of an example of a wireless interconnect using antennas for chip-to-chip communication or free-space optics. A first 102 and a second 104 chip are mounted to form a corresponding pack 106, 108 using a ball grid array (BGA), land grid array (LGA), or other interconnect system incorporating pads, wire guides, or other connectors. The packs are mounted on a printed circuit board (PCB) 110, such as a mainboard, system or logic board, or daughterboard, using a solder ball array or other desired system. The packs 106, 108 are electrically connected to external components, power, or any other desired devices by traces (not shown) on or within the PCB. The chips are also interconnected through the PCB.The packages can be mounted on the PCB using sockets (not shown), depending on the specific implementation.

[0011] The first and second chips, 102 and 104, are discussed here as central processing units, specifically as server CPUs. However, the techniques and configurations described here can be applied to many different types of chips for which a high-speed communication link would be suitable. In some implementations, the chip can incorporate many different functions, as in a system-on-a-chip (SoC). In other implementations, the chips can be a memory, a communication interface hub, a storage device, a coprocessor, or any other desired type of chip. Additionally, the two chips can be different, so that one can be a CPU and the other, for example, a memory or a chipset.

[0012] Each chip is also connected to a corresponding radio die (112, 114) via the package. The radio die can be a single die, a multi-die package, or a package formed using another technique. Each radio die is mounted on the package near the edge closest to the other chip. The package may contain copper traces, wires, or layers to connect certain contact areas, pads, or solder balls of the chip to the radio die for data and control signals. The radio die may also be connected to the chip to provide power to the radio die. Alternatively, the radio die may receive power from an external source through the package connection to the PCB.

[0013] An antenna (116, 118) is also mounted on the package and coupled to the radio. Extremely small antennas can be used, integrated on or within the package substrate. The antennas are configured so that when the packages are mounted on the PCB, the antennas point towards each other. The short distance between the antennas allows for a low-power, low-noise connection between the two chips.

[0014] The wireless connection reduces the complexity of the socket and the complexity of the mainboard for the computing platform.

[0015] While different frequencies can be used to suit specific implementations, millimeter-wave and sub-THz frequencies allow for an antenna small enough to be integrated on the same package normally used for the chip. The antennas can also be constructed using the same materials as the package substrate and still exhibit good electrical performance.

[0016] In some embodiments, a server can be constructed with multiple CPUs. Each CPU can be mounted on a pack containing multiple parallel radio dies and antenna sets to provide multiple parallel channels within the server between two CPUs. A small antenna size, suitable for millimeter-wave signals, allows each antenna on the pack for one of the CPUs to be directed toward a corresponding antenna on the pack for the other CPU. This configuration can be used to combine parallel radio links and provide data rates of terabits per second.

[0017] In some embodiments, a wireless broadband intermediary can be used. For example, in a radio operating in the 100–140 GHz radio frequency range, the size of each antenna, including the keep-out zone, can be as small as 1.25 x 1.25 mm to 2.5 x 2.5 mm. The actual antenna can be even smaller. Considering a typical server CPU package, more than 30 antennas measuring 1.25 x 1.25 mm can be placed along one edge of the package. This would allow more than 30 separate links, each carrying 40–80 Gb / s, over a short distance. The separate links can all be used to communicate with a single second chip, as in Fig. Figure 1 shows that different pack antennas can be placed next to different antennas of the CPU pack. This allows the CPU pack to communicate with different chips using different connections.

[0018] In addition to the simple point-to-point connection of Fig. 1. Point-to-multipoint transmission can also be provided without using an external switching matrix. The antennas of multiple chip packs can be positioned within the antenna range of one of the CPU packs. The multiple chip packs can all simultaneously receive the same signal from the CPU pack. To control which of the multiple chip packs receives a transmission, the radio and antenna system can include beam steering.

[0019] Fig. Figure 2 is a side view in cross-section of an alternative configuration of a wireless intermediate link. As shown, a first 202 and a second 204 chip are mounted on corresponding packing substrates 206, 208, which are mounted on a main board 210. Each chip is connected to a corresponding radio die 212, 214 through its corresponding packing 206, 208. Each radio die 212, 214 is connected to a corresponding antenna 216, 218. The antennas are positioned to provide a clear and direct wireless link.

[0020] The packaged system can take one of numerous different forms. One or both of the packages can be a microelectronic module containing a system-on-chip (SoC) or CPU die 202, 204, a millimeter-wave or sub-THz transmitter / receiver (radio) chip 212, 214, and an antenna 216, 218 integrated on the package. Additional dies and other supporting components, such as passive devices and connectors, can also be mounted on the package substrate 206, 208. An SoC die is typically designed and implemented on low-resistance digital silicon and may also include typical functions found in the baseband section of a wireless module.If the transmitter / receiver or radio die is implemented as a separate die, as shown, it can be implemented in a high-resistance silicon or another type of RF semiconductor substrate, including gallium arsenide, gallium nitride, and certain polymers. Alternatively, the radio 212 can be implemented on the primary die 202. A low-loss packing material, machined to have low surface roughness, can be used for the packing 206 to provide improved electrical performance in the millimeter-wave and sub-THz frequency ranges. Packing materials can include liquid crystal polymers and their derivatives, prepreg (pre-impregnated glass fiber resin and epoxy), BT (bismaleimide triazine resin epoxy) laminates, other organic substrates, glass, silicon, or ceramics.

[0021] The wireless interconnect system includes the transmitter / receiver chip 212, 214, the antenna 216, 218 located on the package, and the routing 220, 222 located on the package to connect the transmitter / receiver chip to the main chip and the antenna. The wireless transmission also uses a wireless receiver on the other package. The receiver system can be a mirror image of the transmitter. For bidirectional transmission, the millimeter-wave / sub-THz transmitter / receiver can have both transmit and receive chains.

[0022] Fig. Figure 3 is a block diagram of an example of a transmitter / receiver or radio chip system architecture and associated components that can be used for the wireless interlink described here. The transmitter / receiver chip can take many other forms and may include additional functions, depending on the specific implementation. This radio design is provided only as an example. The radio chip 350 is mounted on the package substrate 352, on which the primary integrated circuit die or chip 202, 203 is also mounted, as shown in Fig. Figure 1 shows the substrate 352 mounted on the PCB or mainboard. The radio pack can include a local oscillator (LO) 302 or a connection to an external LO, and optionally a switch that allows the external LO feed to be used instead of or in addition to the internal LO. The LO signal can pass through an amplifier and multiplier, such as an active doubler 308 and a 0 / 90° quadrature hybrid 310, to drive a boost converter and mixer 314.

[0023] The RX (receive) chain 320 can include a receiving antenna 356 in the package, which is coupled to a low-noise amplifier (LNA) 322 and a broadband baseband (BB) amplifier chain 324 with step-down converters 312 for analog-to-digital conversion. The TX (transmit) chain 340 can include a digital BB driver chain 342 to the step-up converters 314 and a power amplifier (PA) 344 to the transmitting antenna 358. Multiple transmit and receive chains can be present for simultaneous transmission and reception over multiple channels. The various channels can be combined or consolidated in different ways, depending on the specific implementation.

[0024] The TX and RX chains are both coupled to the antenna via the substrate. There can be a single antenna for both TX and RX, or there can be separate RX and TX antennas, as shown. The antennas can be designed to have different radiation patterns to suit different wireless connections. In the example of Fig. The antenna 216 of the first chip has a wide transmit and receive pattern 330. This allows the chip to communicate with multiple antennas at different locations on the mainboard. The antenna 218 of the second chip, on the other hand, has a narrow transmit and receive pattern 332. This allows power to be concentrated in a single direction for communication with only one other device.

[0025] Fig. Figure 4 is a top view of an example implementation of multiple wireless intermediate links on a single microserver package. In this example, separate antennas are used for transmitting and receiving, but it is also possible to share the antenna between the Tx and Rx chains. The antenna size can vary from 1.25 x 1.25 mm or less to 2.5 x 2.5 mm or more, depending on the carrier frequency, desired gain, and transmission range.

[0026] A single integrated circuit chip, or die 402, contains both processing and baseband systems and is mounted on a package 404. The baseband sections of the chip are coupled by tracks 430 on the package to radio chips, or dies, which in turn are coupled by the package to antennas. In this example, the die-integrated circuit chip is a CPU for a microserver and is rectangular. Radio chips are located on each of the four sides of the CPU. The sides designated as top, left, and bottom in the drawing figure have a corresponding radio chip 424, 410, 420, coupled to a corresponding Tx, Rx antenna pair 426, 412, 422. The side shown on the right shows five radio devices, each coupled to a corresponding antenna pair. The number of radio devices and antennas on each side can be determined based on the communication rate requirements in each direction.

[0027] Very few high-speed connections may be required on a microserver package. A single connection is capable of delivering data rates exceeding 40 Gb / s over a distance of just a few centimeters. For transmission distances up to 50 cm, the data rate can still be in the range of 5-10 Gb / s.

[0028] Fig. Figure 4 shows multiple wireless connections implemented on the same side of a package. This allows for an increase in the overall data rate. Alternatively, data can be sent to various other devices located in the same general direction. Both the radio chips and the antennas are placed at the edge of the package to minimize obstacles in the radio path, such as those caused by heat sinks and heat spreaders. In general, the losses for a copper trace baseband signal are much lower than the losses through the same copper trace for an RF signal. As a result, the radio chips can be placed very close to the antenna. This limits electrical signal and power losses due to RF routing through the substrate. The radio chip can be installed on the package in any desired configuration and can even be embedded in the substrate or a portion thereof.By using multiple radio units, the millimeter-wave wireless intermediate links included in the package can be scaled for extremely high data rate applications. This can be useful in systems such as servers and media recording, processing, and editing systems. As shown, multiple links can be combined to achieve data rates of nearly 1 Tb / s.

[0029] Fig. Figure 5 is a side view in cross-section of the same microserver CPU 402 on a package 404 with radio equipment 406, 410, which is attached to the CPU on opposite sides. This radio equipment is then coupled to corresponding antennas 408, 412.

[0030] Fig. 6 is an alternative side view of the side view in cross-sectional view of Fig. 5. In this representation, the packing has multiple layers, such as alternating conductive 430, 434, and dielectric 436 layers for redistribution between the die and the PCB. The packing may include routing layers, mass planes, and other structures, depending on the specific implementation. For example, in Fig. As suggested in section 4, the radio equipment can be coupled to different baseband circuits on different sides of the die, or they can be coupled very close to each other. As in Fig. 1 and Fig. As shown in Figure 2, the chip can be coupled to the packing substrate using a large number of pads, contact surfaces, or spheres. These interconnect pads can be coupled to routing layers, which allow a baseband connection on one side of the chip that can be connected to radio equipment on any side of the chip. Traces in the routing and redistribution layers can be used to distribute signals from the chip to the 406, 410, 420, and 424. The traces can be located on the top surface of the substrate, as shown by lines 430 in the illustration. Fig. 4 indicated. The traces can also be present in other layers 434, 436 of the substrate, either directly or alternatively. The traces, which carry both baseband and millimeter wave signals, can be controlled impedance lines.

[0031] The packing substrate can also include vias (not shown) to route baseband signals between different traces on different layers. Any of a number of different cost-effective CPU packing substrates can be used, including prepreg, FP-4, ABF (Ajiomoto Build-up Film), LCP (Liquid Crystal Polymer), etc., to meet the antenna and signal routing requirements of the configurations shown.

[0032] The wireless intermediate links can operate at 100-140 GHz using FCCSP (Flip Chip Scale Package) technology or a variety of other packaging technologies. A CMOS transmitter / receiver die sufficient to power both a transmit and receive antenna can be smaller than 1.5 x 1.5 mm and would not exceed 3 x 3 mm even if the CPU die's baseband functionalities were included. Even with multiple radio channels and multiple transmit and receive chains on a single radio die, the size can still be very small. At these frequencies, an antenna of approximately 2.5 x 2.5 mm is capable of providing a data rate of 40 Gb / s or more, depending on the modulation and transmission formats, over distances exceeding 50 mm. For such data rates, the antennas can be designed to radiate perpendicular to the package surface.However, other types of antennas may be suitable for other configurations.

[0033] The frequency band above 100 GHz is easily accessible with current radio equipment and small antennas. These frequencies are not significantly affected by the switching noise of the CPU and other dies, or by other general noise sources within the package and computing systems. To further isolate noise, a ground plane can be fabricated within the package substrate to isolate various system components. The signal can be transmitted using a wide frequency band. In one example, the entire 100-140 GHz band, starting at 40 GHz, is used. A 30 GHz or higher band provides a large data carrying capacity and bandwidth. The specific band and frequencies can be customized to suit different implementations.

[0034] Wired methods are typical for fixed point-to-point communication. Bulky flexible cable connectors interfere with the mechanical and thermal mounting requirements of a computer system. Flexible cable connectors also have significant design limitations to ensure reliability and significantly increase the platform's Z-height. The wireless interconnect described here, however, only requires two devices to be within radio range of each other. The radio equipment and antennas can be placed on the package in locations that are already available, so the package size is not increased. The connection can also be more reliable because the problematic cable and cable connectors are not used.

[0035] Fig. Figure 7 is a block diagram of a 700 computing system with multiple high-speed interfaces, which can be implemented using the wireless connections described herein. The computing system can be implemented as a server, microserver, workstation, or other computing device. The system has two multi-core processors (704, 706), although more processors can be used depending on the specific implementation. The processors should be interconnected by a suitable intermediate connection, such as the wireless intermediate connection described herein. Each processor is connected to a corresponding DRAM (Dynamic Random Access Memory) module (708, 710) using a suitable connection, such as the wireless connection described herein. Each processor is also connected to a PCI (Peripheral Component Interconnect) interface (712, 714).This connection can be wired or wireless.

[0036] The PCI interfaces allow connections to a range of additional high-speed components, such as 716 graphics processors and other high-speed I / O systems for display, storage, and I / O. The graphics processor drives a 718 display. Alternatively, the graphics processor can be a core or a die in one or both of the processors. The graphics processor can also be coupled to a different interface via a chipset.

[0037] Both processors are also connected to a 702 chipset, which provides a single contact point for many other interfaces and connections. The connection to the chipset can be wired or wireless; one or both processors can be connected to the chipset, depending on the implementation. As shown, a 704 processor can have a wireless connection to one or more 706 processors, a 708 memory module, 712 peripheral components, and a 702 chipset. These connections can all be wireless, as demonstrated by the multiple radio devices and antennas of Fig. 4 is indicated. Alternatively, some of these connections may be wired. The processor may have multiple wireless connections to the other processor. Likewise, the 702 chipset may have wireless connections to one or more of the processors, as well as to the various peripheral interfaces, as shown.

[0038] The chipset is coupled to a USB (Universal Serial Bus) interface 720, which can provide connectors for connections to a variety of other devices, including a user interface 734. The chipset can be connected to SATA (Serial Advanced Technology Attachment) interfaces 722 and 724, which can provide connectors for a mass storage device 736 or other devices. The chipset can be equipped with other high-speed interfaces such as a SAS (Serial Attached Small Computer Serial Interface) interface 726 with connectors for an additional mass storage device 728, additional PCI interfaces 730, and communication interfaces 732, such as Ethernet or any other desired wired or wireless interface. The components described are all mounted on one or more disks and cards to provide the described connections.

[0039] Fig. Figure 8 is a side view in cross-section of an alternative configuration of a package with an ultra-high-speed radio transmitter / receiver. Compared to the example of Fig. In this example, the radio is placed in a cavity at the bottom of the packing substrate, rather than at the top. This method allows for a reduction in the footprint or top surface area of ​​the pack, but can result in a taller pack.

[0040] A package or package substrate 802 has an integrated circuit chip 804 attached to a top surface using a solder ball, a contact grid, a pad, or some other suitable interconnection system. The chip in this or any other example may be a CPU, memory, interface or communication hub, or other integrated circuit or data device. The substrate has a cavity 806 on the opposite side of the substrate. This is represented as the bottom surface as opposed to the top surface, which carries the integrated circuit chip. The bottom surface contains the solder ball 810 or some other type of interconnect to the system board 820. As in the other examples, the package 802 may be connected to a system board by a socket, a daughterboard, or in one of numerous ways.A Funk 808 is attached to the opposite side of the substrate inside the cavity 806 using a solder ball, contact grid, pad or other suitable connection system.

[0041] The chip 804 on the top side is coupled to surface traces 814 on the top side of the substrate 802 via some of its output pads. These traces are connected through the substrate via vias 816, which are connected to the interconnect pads in the cavity to connect the chip on the top side to the radio 808. The radio can be coupled in other ways, but the vias provide a fast and direct connection through the packing substrate to the radio. The radio is then connected to antennas via vias 818 from its interconnect pads. In this example, one antenna 822 is located on the top side of the substrate, and another antenna 824 is embedded in the substrate. The antenna on the top side may be easier to fabricate, while the embedded antenna can provide a smaller packing footprint.All of the antennas can be located on the top of the package, or all of the antennas can be embedded in the package, or a mixture can be used, as shown here.

[0042] Fig. Figure 9 shows a side view in cross-section of another alternative configuration for the packing described here. In this example, the radio is completely embedded in the packing substrate. There are several different techniques for embedding a die or individual analog components within the layers of a substrate. The specific technique can be chosen based on the type of substrate and the characteristics of the radio.

[0043] In the example of Fig. A packing substrate 902 carries an integrated circuit chip 904, which is attached to a top surface. The bottom surface faces the top surface and contains, for example, a solder ball grid assembly 910 for direct connection to the system board 920 or via an intermediate switch, socket, or other device. A radio 908 is embedded in the substrate and attached using solder balls or by any other desired method. The chip 904 on the top surface is connected to the radio by means of surface traces 914 on the top surface of the substrate 902, which are connected to the radio by vias 916. The radio is connected to the surface 922 or embedded 924 antennas by means of a second set of vias 918.

[0044] Fig. Figure 10 shows another alternative in which both the primary integrated circuit chip and the radio die are located at the bottom of the substrate. The antenna is located at the top of the substrate or is embedded in the substrate. This configuration is well-suited for lower-power primary chips, as cooling below the substrate may be limited. This configuration is also well-suited for stacked die systems. Additional dies (not shown) can be stacked on top of the substrate to add extra functionality or processing power to the package.

[0045] In this example, a packing substrate 1002 is coupled to a system plate 1020 on one bottom side using a ball grid arrangement 1010 or another fastening mechanism. A primary integrated circuit chip 1030 and a radio chip 1012 are also attached to the bottom side of the substrate. The two chips are connected to the bottom side of the packing via a trace 1014. The radio is then connected to the top side via antennas 1022 and 1024 with vias 1018 through the substrate, or via an embedded antenna. In this configuration with the integrated circuit and radio side by side, an optional heat spreader 1030 can be attached to both dies to help dissipate heat from the dies to the environment or to a cooling system (not shown).

[0046] Fig. Figure 11 shows another variation in which the primary and radio dies are both attached to the top of the substrate. A packing substrate 1102 is mounted to a system plate 1120 on one bottom side using a sphere grid arrangement 1110 or similar. A primary integrated circuit chip 1104 and a radio chip 1112 are instead attached to the top of the substrate opposite the system plate. The two chips are connected to each other by a track 1114 on the top side, as in the example of Figure 11. Fig. 1. The radio is then connected to the antennas. An antenna 1122 on the top surface can be connected to the radio using a trace on the top surface of the substrate. An embedded antenna 1124 can be connected to the embedded antenna using a via 1118 through the substrate. This connection can include horizontal traces across the top surface of the substrate or across any desired embedded layer, or a combination of several horizontal and vertical sections. A heat spreader 1130 is also attached across both dies.

[0047] In this example, as in several others, two different antennas are coupled to the radio. Each antenna can be the same or different. If the antennas have different radiation patterns, they can be used to communicate with another device. Alternatively, one can be for receiving and the other for transmitting. One can be for low data rates and the other for higher data rates. Alternatively, the two antennas can be combined to provide twice the overall data rate. In each of these examples, only two chips are shown attached to the package, but more radio devices can be present, as in the example of... Fig. Figure 4 is shown. Other types of chips may also be present to provide additional functions.

[0048] Fig. Figure 12 shows a computing device 100 according to another implementation. The computing device 100 contains a disk 2. The disk 2 can contain a number of components, including, but not limited to, a processor 4 and at least one communication chip 6. The processor 4 is physically and electrically coupled to the disk 2. In some implementations, the at least one communication chip 6 is also physically and electrically coupled to the disk 2. In other implementations, the communication chip 6 is part of the processor 4.

[0049] Depending on its applications, the computing device 11 may contain other components that may or may not be physically and electrically coupled to the disk 2. These other components include, but are not limited to, volatile memory (e.g., DRAM) 8, non-volatile memory (e.g.,ROM) 9, a flash memory (not shown), a graphics processor 12, a digital signal processor (not shown), a cryptoprocessor (not shown), a chipset 14, an antenna 16, a display 18 such as a touchscreen display, a touchscreen controller 20, a battery 22, an audio codec (not shown), a video codec (not shown), a power amplifier 24, a global positioning system (GPS) device 26, a compass 28, an accelerometer (not shown), a gyroscope (not shown), a loudspeaker 30, a camera 32, and a mass storage device (such as a hard disk drive) 10, a compact disc (CD) (not shown), a digital versatile disc (DVD) (not shown), and so on). These components may be connected to, mounted on, or combined with any of the other components.

[0050] The communication chip 6 enables wireless and / or wired communications for the transmission of data to and from the computing device 11. The term "wireless" and its derivatives can be used to describe circuits, devices, systems, methods, techniques, communication channels, etc., that can communicate data through a non-solid medium using modulated electromagnetic radiation. The term does not imply that the associated devices do not contain wires, although in some embodiments they might not. The communication chip 6 can implement any of a number of wireless or wired standards or protocols, including, but not limited to, Wi-Fi (IEEE 802.11 family), WiMAX (IEEE 802.16 family), IEEE 802.11, and IEEE 802.11.20, Long Term Evolution (LTE), Ev-DO, HSPA+, HSDPA+, HSUPA+, EDGE, GSM, GPRS, CDMA, TDMA, DECT, Bluetooth, Ethernet derivatives thereof, as well as all other wireless and wired protocols designated as 3G, 4G, 5G, and beyond. The computing device 11 can contain multiple communication chips 6. For example, a first communication chip 6 can be dedicated to shorter-range wireless communications, such as Wi-Fi and Bluetooth, and a second communication chip 6 can be dedicated to longer-range wireless communications, such as GPS, EDGE, GPRS, CDMA, WiMAX, LTE, Ev-DO, and others.

[0051] In some implementations, one or more of the components may be adapted to use the wireless connection described here. The system's features include... Fig. 12 can be attached to any of Fig. 7 can be adapted and vice versa. For example, the system can be from Fig. 12 multiple processors. The system of Fig. 7 may contain one or more of the peripheral devices that are in Fig. Figure 12 shows the following. The term "processor" can refer to any device or section of a device that processes electronic data from registers and / or a working memory in order to transform that electronic data into other electronic data that can be stored in registers and / or a memory.

[0052] In various implementations, the computing device 11 can be a laptop, netbook, notebook, ultrabook, smartphone, tablet, personal digital assistant (PDA), ultramobile PC, mobile phone, desktop computer, server, printer, scanner, monitor, set-top box, entertainment control unit, digital camera, portable music player, or digital video recorder. In other implementations, the computing device 11 can be any other electronic device that processes data, including a portable device.

[0053] Embodiments can be implemented as part of one or more memory chips, controllers, CPUs (Central Processing Units), microchips or integrated circuits connected using a mainboard, an application-specific integrated circuit (ASIC) and / or a field-programmable gate array (FPGA).

[0054] References to "a particular embodiment," "an embodiment," "an exemplary embodiment," "various embodiments," etc., indicate that the embodiment(s) so described may contain special features, structures, or properties, but not every embodiment necessarily contains these special features, structures, or properties. Furthermore, some embodiments may have some, all, or none of the features described for other embodiments.

[0055] In the following description and claims, "coupled" and its derivatives may be used together. "Coupled" is used to indicate that two or more elements cooperate or interact with each other, but that they may or may not have intervening physical or electrical components.

[0056] As used in the claims, unless otherwise specified, the use of the ordinal numbers "first", "second", "third", etc. to describe a general element only indicates that reference is made to different examples of the same element, and is intended to mean that the elements so described must be in a certain order, temporally, spatially, in a sequence or in any other way.

[0057] The drawings and the preceding description show examples of embodiments. It is clear to those skilled in the field that one or more of the described elements can be readily combined into a single functional element. Alternatively, certain elements can be divided into several functional elements. Elements from one embodiment can be added to another embodiment. For example, the sequences of processes described here can be changed and are not limited to the manner described here. Furthermore, the actions of each flowchart need not be implemented in the sequence shown; nor do all operations necessarily have to be carried out. Likewise, those operations that are not dependent on other operations can be carried out in parallel with the other operations. The scope of embodiments is in no way limited by these specific examples.Numerous variations are possible, whether expressly stated in the patent specification or not, such as differences in the structure, dimensions, and use of a material. The scope of embodiments is at least as extensive as defined by the following claims.

[0058] The following examples relate to further embodiments. The various features of the different embodiments can be combined in different ways, including some features and excluding others to accommodate a range of different applications. Some embodiments relate to an apparatus comprising an integrated circuit chip, a packing substrate to support the integrated circuit chip (the packing substrate having conductive connectors for connecting the integrated circuit chip to external components), a radio coupled to the integrated circuit chip to receive data from the integrated circuit chip and modulate the data onto a radio frequency carrier, and an antenna on the packing substrate coupled to the radio to transmit the modulated data over the carrier to an external device.

[0059] In further embodiments, the radio signal is formed in a radio chip on the packaging substrate, which is coupled to the integrated circuit chip through the packaging substrate.

[0060] In further embodiments, the radio includes a transmission chain coupled to the antenna and a receiving chain coupled to the antenna, wherein the antenna also serves to receive data from the external device.

[0061] In further embodiments, the radio includes a transmission chain coupled to the antenna and a receiving chain, wherein the apparatus further includes a receiving antenna coupled to the receiving chain to receive data from the external device.

[0062] In other embodiments, the radio frequency carrier is a millimeter wave carrier.

[0063] In further embodiments, the packing substrate is rectangular and the antenna is located on one side of the packing substrate, the apparatus further comprising at least one additional radio and an additional antenna on the packing substrate to transmit additional modulated data over the carrier.

[0064] Other embodiments include at least one additional radio and one additional antenna on a second side of the packing substrate to transmit additional modulated data over the carrier in a different direction.

[0065] In further embodiments, the radio system comprises multiple transmission chains to transmit multiple data streams through the antenna via several different radio frequency carriers.

[0066] In further embodiments, the integrated circuit chip and the radio are mounted on the same surface of the substrate, and the radio is coupled to the integrated circuit chip on the same surface of the substrate using traces.

[0067] In further embodiments, the antenna is embedded in the packing substrate and the antenna is coupled to the radio using a vertical through-hole through the packing.

[0068] Some embodiments relate to an apparatus comprising an integrated circuit chip, a packing substrate for supporting the integrated circuit chip, the packing substrate having conductive connectors for connecting the integrated circuit chip to external components, the integrated circuit chip being mounted on a first surface of the substrate, a radio coupled to the integrated circuit chip for receiving data from the integrated circuit chip and modulating the data onto a radio frequency carrier, the radio being mounted on a second surface of the substrate opposite the first surface and coupled to the integrated circuit chip using vertical vias through the substrate, and an antenna on the packing substrate coupled to the radio for transmitting the modulated data over the carrier to an external device.

[0069] In further embodiments, the antenna is coupled to the radio using vertical vias through the substrate.

[0070] In further embodiments, the substrate comprises a cavity in the second surface and the radio is mounted in the cavity.

[0071] In further embodiments, the antenna is embedded in the substrate and is coupled to the substrate by a vertical through-hole.

[0072] Some embodiments relate to a computing system comprising a system board and several integrated circuit chip packs coupled to the system board, each integrated circuit pack comprising an integrated circuit chip, a packing substrate to support the integrated circuit chip, the packing substrate having conductive connectors for connecting the integrated circuit chip to the system board, a radio coupled to the integrated circuit chip to receive data from the integrated circuit chip and to modulate the data onto a radio frequency carrier, and an antenna on the packing substrate coupled to the radio to transmit the modulated data over the carrier to another of the integrated circuit chip packs.

[0073] In further embodiments, the radio signal is formed in a radio chip on the packaging substrate, which is coupled to the integrated circuit chip through the packaging substrate.

[0074] In further embodiments, the radio includes a receiving chain, and the apparatus further comprises a receiving antenna which is coupled to the receiving chain in order to receive data from the external device.

[0075] In further embodiments, the packing substrate is rectangular and the antenna is located on one side of the packing substrate, the apparatus further comprising at least one additional radio and an additional antenna on the packing substrate to transmit additional modulated data over the carrier.

[0076] In further embodiments, the integrated circuit chip and the radio are mounted on the same surface of the substrate, and the radio is coupled to the integrated circuit chip using traces on the same surface of the substrate.

[0077] In further embodiments, the antenna is embedded in the packing substrate and the antenna is coupled to the radio using a vertical through-hole through the packing.

Claims

[1] Apparatus, comprising: an integrated circuit chip; a packing substrate to support the integrated circuit chip, wherein the packing substrate has conductive connectors for connecting the integrated circuit chip to external components; a radio coupled to the integrated circuit chip to receive data from the integrated circuit chip and modulate the data onto a radio frequency carrier; and an antenna on the packing substrate that is coupled to the radio to send the modulated data via the radio frequency carrier to an external device, wherein the radio is formed in a radio chip on the packing substrate, which is coupled to the integrated circuit chip through the packing substrate. [2] Apparatus according to claim 1, wherein the radio includes a transmission chain coupled to the antenna and a receiving chain coupled to the antenna, and wherein the antenna also serves to receive data from the external device. [3] Apparatus according to claim 1 or 2, wherein the radio includes a transmission chain coupled to the antenna and a receiving chain, the apparatus further comprising a receiving antenna coupled to the receiving chain to receive data from the external device. [4] Apparatus according to one or more of the above claims, wherein the radio frequency carrier is a millimeter wave carrier. [5] Apparatus according to one or more of the above claims, wherein the packing substrate is rectangular and the antenna is located on one side of the packing substrate, wherein the apparatus further comprises at least one additional radio and an additional antenna on the packing substrate to transmit additional modulated data over the carrier. [6] Apparatus according to claim 5, further comprising at least one additional radio and one additional antenna on a second side of the packing substrate to transmit additional modulated data over the carrier in another direction. [7] Apparatus according to one or more of the above claims, wherein the radio comprises multiple transmission chains to transmit multiple data streams through the antenna over multiple different radio frequency carriers. [8] Apparatus according to one or more of the above claims, wherein the integrated circuit chip and the radio are mounted on the same surface of the substrate and wherein the radio is coupled to the integrated circuit chip using traces on the same surface of the substrate. [9] Apparatus according to claim 8, wherein the antenna is embedded in the packing substrate and wherein the antenna is coupled to the radio using a vertical through-hole through the packing. [10] Apparatus, comprising: an integrated circuit chip; a packing substrate to support the integrated circuit chip, wherein the packing substrate has conductive connectors for connecting the integrated circuit chip to external components, wherein the integrated circuit chip is mounted on a first surface of the substrate; a radio coupled to the integrated circuit chip to receive data from the integrated circuit chip and to modulate the data onto a radio frequency carrier, wherein the radio is mounted on a second surface of the substrate opposite the first surface and is coupled to the integrated circuit chip using vertical vias through the substrate; and an antenna on the packing substrate that is coupled to the radio to send the modulated data via the carrier to an external device. [11] Apparatus according to claim 10, wherein the antenna is coupled to the radio using vertical vias through the substrate. [12] Apparatus according to claim 10 or 11, wherein the substrate comprises a cavity in the second surface and wherein the radio is mounted in the cavity. [13] Apparatus according to claim 10, 11 or 12, wherein the antenna is embedded in the substrate and wherein the antenna is coupled to the substrate by a vertical through-hole. [14] Computing system, comprising: a system disk; and several integrated circuit chip packages coupled to the system board, each integrated circuit package comprising an integrated circuit chip, a packing substrate supporting the integrated circuit chip, the packing substrate having conductive connectors for connecting the integrated circuit chip to the system board, a radio coupled to the integrated circuit chip to receive data from the integrated circuit chip and modulate the data onto a radio frequency carrier, and an antenna on the packing substrate coupled to the radio to transmit the modulated data over the carrier to another of the integrated circuit chip packages. wherein the radio is formed in a radio chip on the packing substrate, which is coupled to the integrated circuit chip through the packing substrate. [15] Computing system according to claim 14, wherein the radio includes a receiving chain, wherein the apparatus further comprises a receiving antenna coupled to the receiving chain to receive data from the external device. [16] Computing system according to one or more of claims 14 or 15, wherein the packing substrate is rectangular and the antenna is located on one side of the packing substrate, wherein the apparatus further comprises at least one additional radio and an additional antenna on the packing substrate to transmit additional modulated data over the carrier. [17] Computing system according to one or more of claims 14-16, wherein the integrated circuit chip and the radio are mounted on the same surface of the substrate and wherein the radio is coupled to the integrated circuit chip using traces on the same surface of the substrate. [18] Computing system according to claim 17, wherein the antenna is embedded in the packing substrate and wherein the antenna is coupled to the radio using a vertical through-hole through the packing.

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