Surface mount device, component detection device and component detection method

Abstract

Surface mount device (1) comprising: a component holder (26) holding a component (P) comprising a light emitter (E) for emitting light and a housing (K) having a step (S) between the light emitter (E) and the housing (K) along a peripheral edge (Ee) of the light emitter (E); a light emitter (65) which forms a first shadow (H1) along the step (S) by emitting light towards the component (P); an imager (61) that images an image including the first shadow (H1); a position detector (130) that detects a position of the light emitter (E) from a position of the imaged first shadow (H1); a mounting head (31) which mounts the component (P) removed from the component holder (26) on a plate (B); and a mounting controller (140) that controls a position where the mounting head (31) mounts the component (P) on the board (B) based on the position of the light emitter (E) detected by the position detector (130).

Description

[TECHNICAL FIELD]

[0001] The invention relates to a technique for detecting the position of a light emitter of a component configured to emit light from the light emitter.

[0002] For example, when a component including a light emitter, such as a surface-mount type LED (light-emitting diode), is mounted on a board, the position of the light emitter may be required to align with a predetermined position on the board. Accordingly, in a surface-mount device disclosed in JP 2015-126216 A, a lamp is provided for illuminating light to excite phosphors constituting a light emitter. The position of the light emitter is detected based on an image obtained by imaging the light emitter, which emits light upon receiving light from this lamp.

[0003] The publication DE 10 2014 210 654 A1 describes a motor vehicle headlight comprising a circuit board with an SMD semiconductor light source component, wherein the circuit board is manufactured according to a method for applying the SMD semiconductor light source component to the circuit board for the motor vehicle headlight. In a first step, a position of a light-emitting region of the SMD semiconductor light source component is determined, wherein in a second step, the SMD semiconductor light source component is positioned on the circuit board depending on the position of the light-emitting region, and wherein in a third step, the SMD semiconductor light source component is connected to the circuit board using an induction soldering process.

[0004] JP H02-10204A describes that data of each chip component, such as position, external dimensions, etc., are first input to an image recognition unit so that the relative position and allowable range of a shadow from the center of gravity of the component are determined. Then, a light is turned on to create a shadow of the component. The position of the center of gravity of the created shadow is calculated. Similarly, the lights are turned on sequentially, creating the corresponding shadows. The respective positions of the center of gravity of these shadows are calculated. Next, a position determined by the relative position of the other positions is determined to narrow the search range for detecting the position of the component according to the size of the previously registered objects to be detected. Then, detection is performed.The position and size of the object are then recorded in detail and compared with the previously registered conditions, resulting in the final assessment.

[0005] JP 2014-72681 A describes a monitoring device comprising a recording section for capturing a photographic image from a photographing section that photographs an object and generates the photographic image. The monitoring device further comprises a control section for controlling an irradiation section that irradiates the object with a plurality of light beams in respective different directions, a detection section that detects an image of a shadow created by irradiating the object with the plurality of light beams from the irradiation section, and a detection section that detects the object based at least on the shadow detected by the detection section.

[0006] The document JP 2000 - 150 970 A describes an apparatus for bonding a light-emitting device is equipped with a probe that causes the LED chip to emit light before an LED chip is bonded to a circuit board, an imaging device that detects the emission center of the LED chip and performs image recognition of the coordinates of the external shape reference point of the LED chip with respect to the detected emission center, and a holding device for the light-emitting device that positions the LED chip at a bonding position on the circuit board based on the coordinates of the external shape reference point that have been subjected to image recognition.

[0007] US 2016 / 0 255 752 A1 describes a component mounting method for mounting a light-emitting component on a circuit board by picking up the light-emitting component from a pocket formed in a carrier tape using a mounting head. The method includes detecting a reference part formed in the circuit board, detecting a light-emitting part of the light-emitting component by imaging the light-emitting component from above in a state where the light-emitting component is held in the pocket from below by a holder, picking up the light-emitting component using the mounting head in the state where the light-emitting component is held in the pocket from below by the holder, and mounting the picked-up light-emitting component on the circuit board based on a detection result of the reference part and a detection result of the light-emitting part. [SUMMARY][TECHNICAL TASK]

[0008] By causing the light emitter to emit light in this way, a boundary between a housing adjacent to the light emitter and the light emitter becomes clear, allowing the position of the light emitter to be precisely detected. However, there are also LEDs that do not include a phosphor in a light emitter, and the above method is not necessarily effective for such devices.

[0009] The invention has been developed with the foregoing object in mind and aims to provide a technique that enables the precise detection of the position of a light emitter regardless of whether the light emitter of a component comprises phosphors or not. [SOLUTION OF THE TASK]

[0010] A surface mount apparatus according to the invention comprises: a component holder that holds a component having a light emitter for emitting light and a housing having a step between the light emitter and the housing along a peripheral edge of the light emitter; a light emitter that forms a first shadow along the step by irradiating light toward the component; an imager that images an image including the first shadow; a position detector that detects a position of the light emitter from a position of the imaged first shadow; a mounting head that mounts the component taken out of the component holder onto a board; and a mounting controller that controls a position where the mounting head mounts the component onto the board based on the position of the light emitter detected by the position detector.

[0011] A component detection device according to the invention comprises: a light emitter that emits light toward a component, the light emitter including a light emitter for emitting light and a housing having a step between the light emitter and the housing along a peripheral edge of the light emitter to form a shadow along the step; an imager that images an image including the shadow; and a position detector that detects a position of the light emitter based on a position of the imaged shadow.

[0012] A component recognition method according to the invention comprises: forming a shadow along a step by irradiating light toward a component including a light emitter for emitting light and a package having the step between the light emitter and the package along a peripheral edge of the light emitter; imaging an image including the shadow; and recognizing a position of the light emitter from a position of the imaged shadow.

[0013] The invention (surface mount device, component detection apparatus, component detection method) thus configured forms a shadow (first shadow) along the step between the light emitter and the component package by radiating light toward the component. Thus, a boundary between the package adjacent to the light emitter and the light emitter is emphasized by the shadow, which is why the position of the component's light emitter can be precisely detected regardless of whether the component's light emitter includes phosphors or not. [ADVANTAGEOUS EFFECTS OF THE INVENTION]

[0014] According to the invention, it is possible to precisely detect the position of the light emitter regardless of whether the light emitter of the component comprises phosphors or not. [BRIEF DESCRIPTION OF THE DRAWINGS] Fig. 1 is a partial plan view schematically showing an example of a surface mount device according to the invention. Fig. 2 is a partial side view schematically showing an example of an imager. Fig. 3 is a block diagram showing an example of the electrical configuration of the surface mount device of Fig. 1 shows. Fig. 4 is a flowchart showing an example of a component mounting method used by the surface mount apparatus of Fig. 1 is carried out. Fig. 5 is a diagram schematically showing an operation performed in the light emitter detection method. Fig. 6 is a diagram schematically showing an operation performed in the component outer shape recognition method. [DESCRIPTION OF THE EMBODIMENT]

[0015] Fig. Figure 1 is a partial plan view schematically showing an example of a component mounting apparatus according to the invention. A Cartesian XYZ coordinate system consisting of a Z direction parallel to a vertical direction and an X direction and a Y direction each parallel to a horizontal direction is shown in Fig. 1. This surface mounting device 1 comprises a pair of conveyors 12, 12 provided on a base 11. The surface mounting device 1 mounts components P on a plate B, which is conveyed by the conveyors 12 from an upstream side in the X direction (plate conveying direction) to an operating position Bo (position of the plate B from Fig. 1) and unloads the plate B having the components fully mounted thereon from the conveyors 12 from the operating position to a downstream side in the X direction.

[0016] A pair of Y-axis rails 21, 21 extending in the Y direction, a Y-axis ball screw 22 extending in the Y direction, and a Y-axis motor My for rotating the Y-axis ball screw 22 are provided in the surface mount device 1, and a head support member 23 is fixed to a nut of the Y-axis ball screw 22 while being supported on the pair of Y-axis rails 21, 21 movably in the Y direction. An X-axis ball screw 24 extending in the X-direction orthogonal to the Y-direction and an X-axis motor Mx for rotating the X-axis ball screw 24 are mounted on the head support member 23, and a head unit 3 is fixed to a nut of the X-axis ball screw 24 while being supported on the head support member 23 movably in the X-direction.Therefore, the head unit 3 can be moved in the Y direction by rotating the Y-axis ball screw 22 of the Y-axis motor My or can be moved in the X direction by rotating the X-axis ball screw 24 of the X-axis motor Mx.

[0017] Two component feed units 25 are mounted in the X direction on each of both sides of the pair of conveyors 12, 12 in the Y direction, and a plurality of belt feeders 26 mounted in the X direction are detachably attached to each component feed unit 25. Each belt feed unit 26 is loaded with a belt that accommodates the components P, respectively, in a plurality of pockets mounted in the Y direction. Each belt feed unit 26 advances this belt in the Y direction (toward the conveyor 12) to feed the component P to a component removal position provided at its tip on the side of the conveyor 12.

[0018] The head unit 3 includes a plurality of (four) mounting heads 31 mounted in the X direction. Each mounting head 31 has an elongated shape extending in the Z direction and can suck and hold the component by means of a nozzle disengageably mounted at the lower end thereof. In other words, the mounting head 31 moves to a position above the component removal position and sucks the component P supplied by the tape feeder 26 to the component removal position. Subsequently, the mounting head 31 moves to a position above the platen B at the operating position Bo and releases the sucked component P for mounting the component P on the platen B. In this way, the mounting head 31 performs component mounting by extracting the component P supplied to the component removal position by the tape feeder 26 and mounting the component P on the platen B.

[0019] Furthermore, the surface mount device 1 comprises two upper detectors 5A, 5B, each having an upward-facing camera. Of these, the upper detector 5A is fixed to the base 11 between the two component feed units 25, which are arranged in the X direction on one side (upper side of Fig. 1) in the Y direction, and the upper detector 5B is fixed to the base 11 between the two component feeding units 25 arranged in the X direction on the other side (lower side of Fig. 1) are arranged in the Y direction. Each of the upper detectors 5A, 5B images the component P sucked by the mounting head 31 and passing thereover using the camera.

[0020] Furthermore, the surface mount apparatus 1 includes a lower detector 6 mounted on the head unit 3. This lower detector 6 is movable in the X direction and the Y direction together with the head unit 3 and is used to image reference marks F applied to the plate B loaded into the operating position Bo and the components P held by the tape feeders 26.

[0021] Fig. 2 is a partial side view schematically showing an example of an imager. As described above, the lower detector 6 images an imaging object J, such as the component P or the reference mark F arranged thereunder. This lower detector 6 includes a camera 61 facing the imaging object J from above. The camera 61 includes a built-in solid-state image sensor 62, such as a CCD image sensor or a CMOS image sensor, and images the imaging object J from above using the solid-state image sensor 62. An optical axis A61 of the camera 61 is parallel to the Z direction (vertical direction), and the camera 61 faces the imaging object J in the Z direction.It should be noted that since the component P or the reference mark F serving as the imaging object J is held horizontally in the surface mount device 1, a normal to a surface of the imaging object J is parallel to the optical axis A61 of the camera 61 and the Z direction.

[0022] Furthermore, the lower detector 6 includes a light emitter 65. The light emitter 65 includes a frame 66 mounted on the camera 61. The frame 66 is arranged below the camera 61 and includes a circular opening 661 at a position facing the camera 61. Thus, the camera 61 images the imaging object J through the opening 661. Furthermore, the light emitter 65 includes lamps 67 mounted on the frame 66 on both sides across the opening 661 in the X direction. Each lamp 67 is configured to emit light by two-dimensionally arranging a plurality of light-emitting elements (e.g., LEDs) and emits light from an area wider than the imaging object J in the Y direction. An optical axis A67 of each luminaire 67 is oblique to the optical axis A61 of the camera 61 and intersects at an acute angle θ with the optical axis A61 of the camera 61.In other words, an incident angle θ of the optical axis A67 of each luminaire 67 on the imaging object J is inclined with respect to the normal to the imaging object J, and each luminaire 67 radiates light from an oblique upper side to the illumination object J.

[0023] The lower detector 6 having such a configuration images the imaging object J by means of the camera 61 while radiating light from the oblique upper side to the imaging object J by means of the light emitter 65. In this way, an imaged image of the imaging object J is obtained by the lower detector 6.

[0024] Fig. 3 is a block diagram showing an example of the electrical configuration of the surface mount device of Fig. 1. The surface mount device 1 includes a main controller 100 for the overall control of the configuration of the entire machine, and the main controller 100 includes an arithmetic processor 110, a memory 120, a recognition controller 130, and a drive controller 140. The arithmetic controller 110 is a computer including a CPU (Central Processing Unit), a RAM (Random Access Memory), and the like. Moreover, the memory 120 is one including a hard disk (HDD) and the like, and stores a mounting program for specifying a method for component mounting in the surface mount device 1, a program for specifying a method of a flowchart of Fig. 4, which will be described later, and the like.

[0025] The detection controller 130 controls a detection process using the upper detectors 5A, 5B, and 6. That is, the detection controller 130 outputs an imaging control signal to the upper detectors 5A, 5B, and 6, and the upper detectors 5A, 5B, and 6 image the imaging object J at a time corresponding to the received imaging control signal. Then, the detection controller 130 obtains information about the position of the imaging object J based on the respective imaged images of the upper detectors 5A, 5B, and 6.

[0026] For example, in the case of detecting the position of the reference mark F, the light emitter 65 irradiates light to the reference mark F provided on the plate B, and the camera 61 images the reference mark F irradiated with light from the light emitter 65. Then, the detection controller 130 detects the position of the plate B loaded into the operating position Bo based on a calculation result of the position of the reference mark F from an image imaged by the camera 61. Alternatively, in the case of detecting the position of the component P, a method described later using Fig. 4 to 6, is carried out by the detection control or regulation 130.

[0027] The drive controller 140 moves the head unit 3 in the X direction and the Y direction by controlling the X-axis motor Mx and the Y-axis motor My. Specifically, when component mounting is performed, the drive controller 140 moves the mounting head 31 mounted on the head unit 3 between the component feed unit 25 and the platen B. At this time, the drive controller 140 corrects the XY position of the mounting head 31 based on the position of the component P detected by the detection controller 130.

[0028] Furthermore, the surface-mount device 1 includes a display unit 150, which is formed, for example, by a liquid crystal display, and an input operation unit 160, which is formed, for example, by a mouse or a keyboard. Accordingly, an operator can recognize a state of the surface-mount device 1 by recognizing a display on the display unit 150 and can input a command to the surface-mount device 1 by performing an input operation on the input operation unit 160. Incidentally, the display unit 150 and the input operation unit 160 do not necessarily have to be configured separately and may be configured integrally, for example, by means of a touchscreen display.

[0029] Fig. 4 is a flowchart showing an example of a component mounting method used by the surface mount apparatus of Fig. 1 is carried out. The flow chart of Fig. 4 is executed by control from the main controller 100. When the belt feeder 26 of the component feed unit 25 feeds the component P to the component removal position in step S101, the camera 61 of the lower detector 6 moves to a position above this component P in step S102.

[0030] In step S103, a light emitter detection process is performed for the component at the component removal position. Fig. Fig. 5 is a diagram schematically showing an operation performed in the light emitter detection method, wherein a partial sectional view of the component is shown in a “sectional view” field of Fig. 5 and a partial top view of the component in a field “Top view” of Fig. 5. The component 5, which is shown in Fig. 5 is an LED of a so-called surface mount type.

[0031] This component P includes a light emitter E that emits light, and a housing K that supports the light emitter E. The housing K has a rectangular outer shape in a plan view, and a recess Kc having a rectangular parallelepiped shape is provided in a central part of the housing K. The light emitter E is arranged at a lower part of this recess Kc. With the component P held by the tape feeder 26, a surface Ks of the recess Kc and a surface Ec of the light emitter E are each held horizontally. An inner wall of the recess Kc, which surrounds a peripheral edge Ee of the light emitter E while being adjacent to this peripheral edge Ee, protrudes further than the surface Es of the light emitter E to form a step S between the light emitter E and the housing K.As just described, the housing K has the step S between the light emitter E and the housing K along the peripheral edge Ee of the light emitter E.

[0032] In the light emitter detection method, light L is irradiated from the light emitter 65 of the lower detector 6 toward the component P held by the tape feeder 26. In this way, the light L is incident obliquely on the component P (surface Ks of the casing K and surface Es of the light emitter E) from a side outside the component P and is irradiated onto a region including the light emitter E. At this time, since a part of the light L is blocked by the step S, the amount of light L incident on a peripheral edge part Re of the light emitter E is smaller than the amount of light L incident on the surface Ks of the casing K and the amount of light L incident on a central part Re of the light emitter E. Thus, a shadow H1 of the step S is formed on the peripheral edge part Re of the light emitter E, as indicated by hatching in the “top view” of Fig. 5. That is, the light emitter 65 of the lower detector 6 has a function of forming the shadow H1 along the step S (in other words, along the peripheral edge Ee of the light emitter E). Consequently, contrast is generated to make the peripheral edge part Re of the light emitter E darker than the surface Ks of the casing K. In the light emitter detection process in step S103, an imaged image shown in the "top view" of Fig. 5, by imaging an image including the shadow H1 thus formed from the camera 61 of the lower recognizer 6, and this imaged image is output to the recognition controller 130.

[0033] In step S104, a component outer shape recognition process is performed for the component P at the component removal position. Fig. Fig. 6 is a diagram schematically showing an operation performed in the component outer shape recognition method, wherein a partial sectional view of the component and the tape supporting this component is shown in a “sectional view” field of Fig. 6 and a partial plan view of the component and the belt supporting this component in a field “Plan view” of Fig. 6 is shown.

[0034] In the tape loaded and held in the tape feed device 26, a plurality of pockets Tp, each having a rectangular shape in a plan view, are arranged in a row in the Y direction, and the component P is stored in each pocket Tp. The pocket Tp is larger in each of the X direction and the Y direction than the housing K of the component P, and a clearance d is formed between the housing K of the component P stored in the pocket Tp and an inner wall Tw of the pocket Tp.

[0035] In the component outer shape detection method, light L is irradiated from the light emitter 65 of the lower detector 6 toward the pocket Tp that stores the component P at the component removal position. In this way, the light L is irradiated to be obliquely incident from a side outside the pocket Tp on the component P (surface Ks of the casing K) stored in the pocket Tp to a region including the pocket Tp. At this time, since a part of the light L is blocked by a peripheral edge part Te of the pocket Tp, the amount of light L incident on the clearance d between the inner wall Tw of the pocket Tp and the casing K of the component P is smaller than the amount of light L incident on the surface Ks of the casing K and the amount of light L incident on the peripheral edge part Te of the tape T.Thus, a shadow H2 is formed in the clearance d between the inner wall Tw of the pocket Tp and the housing K of the component P, as shown by hatching in the “top view” of . Fig. 6. That is, the light emitter 65 of the lower detector 6 has a function of forming the shadow H2 along the outer shape of the casing K of the component P. Consequently, contrast is generated to make the clearance d between the inner wall Tw of the pocket Tp and the casing K of the component P darker than the surface Ks of the casing K of the component P and the peripheral edge part Te of the tape T. In the component outer shape detection process in step S104, an imaged image shown in the “top view” of Fig. 6, by imaging an image including the shadow H2 thus formed from the camera 61 of the lower recognizer 6, and this imaged image is output to the recognition controller 130.

[0036] In step S105, the position of the light emitter E with respect to the outer shape of the housing K is calculated by the recognition controller 130 based on the position of the shadow H1 imaged in step S103 and the position of the shadow H2 imaged in step S104. Specifically, a boundary between the surface Ks of the housing K and the shadow H1 is detected as a peripheral edge Ee (in other words, a contour) of the light emitter E from the image (image in the "top view" of Fig. 5) obtained by imaging the shadow H1. This peripheral edge Ee of the light emitter E can be extracted, for example, by performing edge detection for a brightness difference (i.e., contrast) between the surface Ks of the housing K and the shadow H1. Moreover, a boundary between the shadow H2 and the surface Ks of the housing K is extracted as a peripheral edge part Ke (in other words, a contour) of the housing K from the image (image in the "top view" of Fig. 6) obtained by imaging the shadow H2. This peripheral edge part Ke of the package K can be extracted, for example, by performing edge detection for a brightness difference (i.e., contrast) between the surface Ks of the package K and the shadow H2. Then, the position of the light emitter E relative to the outer shape of the package K is calculated based on the respective extraction results of the position of the peripheral edge Ee of the light emitter E and the position of the peripheral edge part Ke of the package K.

[0037] In step S106, the mounting head 31 moves to a position above the component P on which the processings of steps S103 and S104 have been performed, and sucks this component. Then, in a component recognition process of step S107, the mounting head 31 moves to a position above the imager of the nearer one of the upper recognizers 5A, 5B, and the imager images the lower surface of the casing K of the component P passing thereover and sends the imaged lower surface to the recognition controller 130. In this way, a positional relationship between the casing K of the component P sucked by the mounting head 31 and the mounting head 31 is recognized by the recognition controller 130.

[0038] Then, in the component mounting of step S108, the drive controller 140 controls the position of the mounting head 31 with respect to the board B in the X direction and the Y direction based on the position of the light emitter E with respect to the housing K obtained in step S105 and the position of the housing K with respect to the mounting head 31 obtained in step S107. At this time, reference is made to the position of the board B detected based on the reference marks F. In this way, the component P is mounted on the board B such that the light emitter E is aligned with a predetermined XY position. Steps S101 to S108 are repeatedly performed until all the components are mounted (until "YES" is judged in step S109).

[0039] In the thus configured embodiment, the shadow H1 (first shadow) is formed by radiating the light L toward the component P along the step S between the light emitter E and the housing K of the component P (light emitter detection process of step S103). Thus, the boundary (peripheral edge Ee) between the housing K adjacent to the light emitter E and the light emitter E is emphasized by the shadow H1, and therefore the position of the light emitter E of the component P can be precisely detected regardless of whether the light emitter E of the component P includes phosphors or not.

[0040] Incidentally, the component detection method can be adapted to both the light emitter E that includes phosphors and the light emitter E that does not include phosphors. Note that when the light emitter E does not include phosphors, the lamps 67 of the light emitter 65 can emit light L (e.g., visible light) in a wavelength range detectable by the solid-state image sensor 62 (detection wavelength range).

[0041] Alternatively, when the light emitter E includes phosphors to be excited by emitting light having a wavelength in a predetermined excitation wavelength range, the lamps 67 of the light emitter 65 may emit light having a wavelength within the detection wavelength range and outside the excitation wavelength range (ie, not having a wavelength within the excitation wavelength range) and not exciting the phosphors. This can prevent the shadow H1 formed along the step S between the light emitter E and the housing K of the component P from becoming brighter due to the excitation and light emission of the phosphors of the light emitter E. Thus, the position of the light emitter E of the component P can be precisely detected by emphasizing the boundary between the housing K adjacent to the light emitter E and this light emitter E by means of the shadow H1.

[0042] Incidentally, to excite the phosphors of the light emitter E, light having a wavelength within the excitation wavelength range and a light quantity equal to or higher than a predetermined value must be emitted to the phosphors. In such a case, even if light having a wavelength within the excitation wavelength range is emitted, the phosphors of the light emitter E will not be excited if the light quantity is below the predetermined value. Accordingly, the lamps 67 of the light emitter 65 can emit light having a wavelength within the detection wavelength range and within the excitation wavelength range and a light quantity below the predetermined value to the component P.This can also prevent the shadow H1 from becoming brighter due to the excitation and light emission of the phosphors of the light emitter E, and the position of the light emitter E of the component P can be precisely detected.

[0043] Moreover, in the component outer shape recognition process of step S104, the shadow H2 (second shadow) is formed in the clearance d between the inner wall Tw of the pocket Tp supporting the component P and the casing K of the component P by irradiating the light L toward the component P. Accordingly, the outer shape (peripheral edge Ke) of the casing K of the component P is emphasized by the shadow H2, and therefore the position of the casing K of the component P can be precisely recognized, with the result that the position of the light emitter E with respect to the casing K can also be precisely recognized. Based on such recognition results, the XY position at which the mounting head 31 mounts the component P on the board B is controlled, and therefore the light emitter E of the component P can be mounted at the correct XY position on the board B.

[0044] Moreover, each of the reference marks F and the component P is detected by the lower detector 6 and the detection controller 130. By jointly employing a configuration for detecting each of the reference marks F and the component P in this way, the configuration of the surface mount device 1 is simplified.

[0045] As just described, in the foregoing embodiment, the surface mounting apparatus 1 corresponds to a “surface mounting apparatus” of the invention, the tape feeder 26 corresponds to an example of a “component holder” of the invention, the component P corresponds to an example of a “component” of the invention, the light emitter E corresponds to an example of a “light emitter” of the invention, the peripheral edge Ee corresponds to an example of a “peripheral edge of the light emitter” of the invention, the casing K corresponds to an example of a “casing” of the invention, the step S corresponds to an example of a “step” of the invention, the light emitter 65 corresponds to an example of a “light emitter” of the invention, the light L corresponds to an example of “light” of the invention, the shadow H1 corresponds to an example of a “first shadow” of the invention, the camera 61 corresponds to an example of an “imager” of the invention, the recognition controller 62 corresponds to an example of a “recorder” of the invention, and the detection controller 63 corresponds to an example of a “recorder” of the invention.-controller 130 corresponds to an example of a "position detector" of the invention, the mounting head 31 corresponds to an example of a "mounting head" of the invention, the plate B corresponds to an example of a "plate" of the invention, the drive controller 140 corresponds to an "assembly controller" of the invention, the belt T corresponds to an example of a "belt" of the invention, the pocket Tp corresponds to an example of a "pocket" of the invention, the inner wall Tw corresponds to an example of a "pocket wall surface" of the invention, the clearance d corresponds to an example of a "clearance" of the invention, the shadow H2 corresponds to an example of a "second shadow" of the invention, the reference mark F corresponds to an example of a "reference mark" of the invention, and a component recognition device 6X (. Fig. 3), which includes the lower detector 6 and the detection controller 130, corresponds to an example of a “component detection device” of the invention.

[0046] It should be noted that the invention is not limited to the above embodiment, and, besides those mentioned above, various changes may be made without departing from the gist of the invention. For example, in the flowchart of Fig. 4, the component outer shape recognition process of step S104 is performed after the light emitter recognition process of step S103 is performed. However, an execution sequence thereof may be reversed.

[0047] Alternatively, if the intensity of the light emitted by the light emitter 65 can be made equal in the light emitter detection process and the component outer shape detection process, that is, if the shadows H1 and H2 can be simultaneously formed by light having the same intensity, the light emitter detection process and the component outer shape detection process can be performed simultaneously. This allows the shadows H1 and H2 to be effectively imaged at once.

[0048] Alternatively, when the light emitter detection process and the component outer shape detection process are performed at separate times, the light emitted by the light emitter 65 in the component outer shape detection process can be made stronger than the light emitted by the light emitter 65 in the light emitter detection process. In such a configuration, the outer shape of the housing K of the component P can be emphasized by the shadow H2 by ensuring contrast between the clearance d between the inner wall Tw of the pocket Tp and the housing K of the component P and the housing K of the component P.

[0049] Moreover, the intensity of the light emitted by the light emitter 65 can be adjusted in various ways in each of the light emitter detection method and the component outer shape detection method. Accordingly, in the light emitter detection method, light L to be reflected from the surface Ks of the package K with an intensity equal to or higher than a detectable area of ​​the solid-state image sensor 62 and to cause partial obscuration highlights in the image of the surface Ks of the package K can be emitted from the light emitter 65. In this way, the light emitter E can be detected more precisely by reliably ensuring contrast between the surface Ks of the package K and the shadow H1.Similarly, in the component external shape recognition method, the contrast between the surface Ks of the package K and the shadow H2 can be more reliably ensured, and the external shape of the package K can be more accurately recognized by irradiating such light from the light emitter 65 that darkening highlights are created in the image of the surface Ks of the package K. Note that the light L that creates darkening highlights in the image of the surface Ks of the package K can be obtained by adjusting the intensity of the light L or an exposure time.

[0050] Furthermore, the image captured in the light emitter detection process (image in the “top view” of Fig. 5) are displayed on the display unit 150. This allows an operator to adjust, for example, the intensity or exposure time of the light L emitted by the light emitter 65 while confirming the image displayed on the display unit 150, such as when the shadow H1 cannot be properly extracted in the light emitter detection process.

[0051] Furthermore, the image shown (image in the “top view” of Fig. 6) in the component outer shape recognition process are displayed on the display unit 150. This allows the operator to adjust, for example, the intensity or exposure time of the light L emitted by the light emitter 65 while confirming the image displayed on the display unit 150, such as when the shadow H2 cannot be properly extracted in the component outer shape recognition process.

[0052] Furthermore, the mounting positions, width, or number of the lights 67 can also be appropriately changed. For example, light is emitted toward the component P from the two light emitters 65 facing each other in a plan view in the previous example. Meanwhile, light may be emitted toward the component P from four light emitters 65 arranged to surround the opening 661 at an interval of 90° in a plan view. Alternatively, the lights 67 may be mounted in a circular manner to surround the opening 661. Furthermore, the angle of incidence θ of the optical axis A67 of the light 67 onto the component P can also be appropriately changed.Accordingly, the luminaire 67 can, for example, be mounted such that the angle of incidence θ lies in a range of 50° to 65°, in other words, an angle between the optical axis A67 of the luminaire 67 and the light emitter E of the component P lies in a range of 25° to 40°.

[0053] Moreover, in the previous example, the component P and the reference mark F are each detected by irradiating light from the same light emitter 65. At this time, an illuminance of the light emitted by the light emitter 65 upon detection of the component P and that of the light emitted by the light emitter 65 upon detection of the reference mark F may be changed. Alternatively, the angle θ ( Fig. 2) the emission of light in the case of detecting the component P and in the case of detecting the reference mark F can be changed. Specifically, the angle θ when the reference mark F is imaged can be made smaller than the angle θ when the light emitter E of the component P is imaged. Moreover, in order to make the emission angle θ of light to the light emitter E variable, the lower detector 6 can be configured such that a mounting angle of each light emitter 65 can be automatically changed, or the lower detector 6 can be provided with light emitters 65 each corresponding to different angles θ.

[0054] Moreover, the specific shape of the component P is not limited to the example of Fig. 5 and Fig.6. Accordingly, the preceding embodiment can also be applied to the detection of a component P having a light emitter E or a housing K that is, for example, circular in plan view.

[0055] Furthermore, the specific configuration for feeding the components P is not limited to the belt feeder 26. Accordingly, the foregoing embodiment can also be applied to detecting a component P fed by a bar feeder or a floor feeder.

[0056] Moreover, in the lower detector 6, a mounting angle of the camera 61 can also be changed appropriately.

[0057] As described above as the specific example, various modifications described below can be appropriately added to the invention.

[0058] That is, the surface mount apparatus may be configured such that the component holder holds a tape including a pocket that supports the component; the light emitter forms a second shadow in a clearance between a wall surface of the pocket and the housing of the component by radiating light toward the component; the imager images an image including the second shadow; the position detector detects a position of the light emitter relative to the housing based on positions of the respective imaged first shadow and second shadow, and the mounting controller controls the position where the mounting head mounts the component on the board based on the position of the light emitter relative to the housing detected by the position detector.Such a configuration causes the second shadow to be formed in the gap between the wall surface of the pocket supporting the component and the component's housing by radiating light toward the component. Thus, the external shape of the component's housing is emphasized by the second shadow, allowing the position of the component's housing to be precisely detected, with the result that the position of the light emitter relative to the housing can also be precisely detected. Since the position where the mounting head mounts the component on the board is controlled based on such a detection result, the component's light emitter can be mounted at a correct position on the board.

[0059] The surface-mount device can be configured such that the light emitter simultaneously forms the first shadow and the second shadow by radiating light toward the component; and the imager simultaneously images the first shadow and the second shadow. In such a configuration, the first shadow and the second shadow can effectively be imaged at the same time.

[0060] The surface mount device can be configured such that the imager forms an image including the first shadow, while the light emitter forms the first shadow by radiating light toward the component, and the imager forms an image including the second shadow, while the light emitter forms the second shadow by radiating light toward the component that is stronger than the light when the first shadow is formed. In such a configuration, the external shape of the component's housing can be emphasized by the second shadow by ensuring contrast between the clearance between the wall surface of the pocket and the housing of the component.

[0061] The surface-mount device may be configured such that the light emitter includes phosphors to be excited by emitting light having a wavelength within a predetermined range; and the light irradiator emits light having a wavelength outside the predetermined range that does not excite the phosphors to the component. Such a configuration can prevent the shadow formed along the step between the light emitter and the component housing from becoming brighter due to the excitation and light emission of the light emitter. Thus, the position of the component's light emitter can be precisely detected by emphasizing a boundary between the housing adjacent to the light emitter and the light emitter by means of the shadow.

[0062] The surface-mount device may be configured such that the light emitter radiates light toward a reference mark provided on the board; the imager images the reference mark irradiated with light from the light emitter; and the position detector detects a position of the board from the position of the reference mark imaged by the imager. In such a configuration, the light emitter and the imager can be used together to image a shadow of the boundary between the housing adjacent to the light emitter and the light emitter and to image the reference mark of the board, and the device design can be simplified. [INDUSTRIAL APPLICABILITY]

[0063] This invention can be generally applied to techniques for detecting the position of a light emitter of a component configured to emit light from the light emitter.

Claims

[1] Surface mount device (1) comprising: a component holder (26) holding a component (P) comprising a light emitter (E) for emitting light and a housing (K) having a step (S) between the light emitter (E) and the housing (K) along a peripheral edge (Ee) of the light emitter (E); a light emitter (65) which forms a first shadow (H1) along the step (S) by emitting light towards the component (P); an imager (61) that images an image including the first shadow (H1); a position detector (130) that detects a position of the light emitter (E) from a position of the imaged first shadow (H1); a mounting head (31) which mounts the component (P) removed from the component holder (26) on a plate (B); and a mounting controller (140) that controls a position where the mounting head (31) mounts the component (P) on the board (B) based on the position of the light emitter (E) detected by the position detector (130). [2] Surface mount device (1) according to claim 1, wherein: the component holder (26) holds a band comprising a pocket that supports the component (P); the light emitter (65) forms a second shadow (H2) in a clearance (d) between a wall surface of the pocket (Tw) and the housing (K) of the component by emitting light towards the component (P); the imager (61) images an image comprising the second shadow (H2); the position detector (130) detects a position of the light emitter (E) relative to the housing (K) based on positions of the corresponding imaged first shadow (H1) and second shadow (H2), and the mounting controller (140) controls the position where the mounting head (31) mounts the component (P) on the plate (B) based on the position of the light emitter (E) relative to the housing (K) detected by the position detector (130). [3] Surface mount device (1) according to claim 2, wherein: the light emitter (65) simultaneously forms the first shadow (H1) and the second shadow (H2) by emitting light towards the component (P); and the imager (61) images the first shadow (H1) and the second shadow (H2) simultaneously. [4] The surface mount device (1) according to claim 2, wherein the imager (61) images an image including the first shadow (H1) while the light emitter (65) forms the first shadow (H1) by irradiating light toward the component (P), and the imager (61) images an image including the second shadow (H2) while the light emitter (65) forms the second shadow (H2) by irradiating light that is stronger than the light when the first shadow (H1) is formed toward the component (P). [5] Surface mounting device (1) according to one of claims 1 to 4, wherein: the light emitter (E) comprises phosphors which are to be excited by means of the emission of light having a wavelength in a predetermined range; and the light emitter (65) emits light having a wavelength outside the predetermined range and not exciting the phosphors to the component (P). [6] Surface mounting device (1) according to one of claims 1 to 5, wherein: the light emitter (65) emits light to a reference mark provided on the plate (B); the imager (61) images the reference mark irradiated with the light from the light emitter (65); and the position detector (130) detects a position of the plate (B) from the position of the reference mark imaged by the imager (61). [7] Component detection device (6X), comprising: a light emitter (65) which emits a light towards a component (P) comprising a light emitter (E) for emitting light and a housing (K) having a step (S) between the light emitter (E) and the housing (K) along a peripheral edge (Ee) of the light emitter (E) to form a shadow along the step (S); an imager (61) which images an image comprising the shadow; and a position detector (130) that detects a position of the light emitter (E) based on a position of the imaged shadow. [8] Component recognition method, comprising: Forming a shadow along a step (S) by radiating light towards a component (P) comprising a light emitter (E) for emitting light and a housing (K) having the step (S) between the light emitter (E) and the housing (K) along a peripheral edge (Ee) of the light emitter (E); depicting an image that includes the shadow; and Detecting a position of the light emitter (E) from a position of the imaged shadow.

Images