Modular cuff system for adaptive thermal coupling to cylindrical and prismatic thermal conductors

DE202026002121U1Undetermined Publication Date: 2026-07-16TOPNIK MICHAEL
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Patent Information

Authority / Receiving Office
DE · DE
Patent Type
Utility models
Current Assignee / Owner
TOPNIK MICHAEL
Filing Date
2026-04-23
Publication Date
2026-07-16
Patent Text Reader

Abstract

Modular cuff system for adaptive thermal coupling to cylindrical and prismatic thermal conductors, characterized in that the cuff consists of a plurality of articulated segments (10) which enable a positive-locking adaptation to different conductor geometries.
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