BUILDING COMPONENT HANDLING DEVICE

Description

background

[0001] This section describes a component handling device. The interaction of this component handling device with a receiving unit and an imaging sensor is explained.

[0002] A component in this context is, for example, an (electronic) semiconductor component, also referred to as a "chip" or "die." Such a component typically has a prismatic shape, an essentially polygonal, for example, rectangular or square, cross-section with several lateral surfaces, as well as an end face and a top face. The lateral surfaces and the two (lower and upper) top faces of the component are subsequently referred to generally as side faces. The component can also have a different number of lateral surfaces than four. A component can also be an optical component (prism, mirror, lens, etc.). In general, a component can have any geometric shape.

[0003] The applicant's operational practice includes known so-called pick-up and drop-down devices in which components are picked up from a component table by means of a suction cup or clamp and then placed on a carrier, in a transport container, or the like. Before placing the component, it is usually inspected. For this purpose, images of one or more surfaces of the component are captured with one or more cameras and evaluated using automated image processing. State of the art

[0004] Such clamping devices hold a component securely during transport and while capturing an image of, for example, the bottom surface of the component. DE 10 2008 018 586 A1 discloses an optical scanning device for capturing the surface of a component being transported from a first to a second workstation. This device includes a camera directed at at least one first surface of the component, a light source that emits short-wavelength light rays to the first surface, and a second light source that emits long-wavelength light rays to at least one second surface of the component. The camera receives the first and second light rays reflected from the surfaces. The second surface(s) are oriented differently relative to the first surface(s), as is the case, for example, with cuboid components that have a bottom surface and a total of four lateral surfaces.

[0005] EP 1 470 747 B1 relates to a chip removal device, a chip removal system, a placement system, and a method for removing and further processing chips. The chips are removed from a wafer, transported to a transfer position, and simultaneously rotated. This chip removal device for removing chips from structured semiconductor wafers is equipped with a rotatable removal tool for removing the chips from the wafer and rotating the removed chips 180° about their longitudinal or transverse axis, and a rotatable turning tool for rotating the removed chips again 180° about their longitudinal or transverse axis, which interacts with the removal tool. The removal tool has a first transfer position, and the turning tool has a second transfer position, at which the chips can be transferred to a placement head for further processing.

[0006] EP 0 906 011 A2 relates to a device for removing and placing electrical components on a substrate. The device comprises a rotatable transfer unit that removes the electrical components from a feed module at a receiving position and transfers them to a suction belt for further processing at a first transfer position. A rotatable placement head picks up the components from the suction belt and transports them to a second transfer position.

[0007] WO 02 / 054480 A1 relates to a device for the optical inspection of various surfaces of a chip to be assembled. The device comprises a first, upper transport disc configured to remove the chips from a feeder unit and transport them to a first transfer position. The chips are held in suction openings formed on the outer surface of the upper transport disc and moved by rotating the upper transport disc. The device further comprises a second, lower transport disc, configured similarly to the upper transport disc, which receives the removed chips at the first transfer position and transports them to a second transfer position. The device enables inspection of the chips by arranging cameras laterally next to the transport discs, which inspect the chips on their upper and lower surfaces.The chips are still passed, relative to their original orientation, to a sorting device for further processing.

[0008] US Patent 4,619,043 discloses a device and a method for removing and placing electronic components, in particular chips, on a printed circuit board. The device comprises a conveying means for receiving the chips in receiving units and for transporting the received chips to a first transfer position. The conveying means has a conveying chain and a rotatable sprocket, which are meshed together. The device further comprises a rotatable mounting tool with placement heads for receiving the chips at the first transfer position. The mounting tool is further configured to transport the received chips to a second transfer position by means of a rotary motion, whereby they are turned over.

[0009] JP 2-193813 relates to a device for picking up and rotating electronic components for inspection by test equipment. The device comprises a feed unit from which chip-like electronic components are removed by a first rotating body and arranged around its circumference. A rotational movement of the rotating body transports the electronic components to a first transfer position, where they are rotated about their longitudinal or transverse axis. The device further comprises a second rotating body, which picks up the removed electronic components at the first transfer position and transports them to a second transfer position. During this second transfer, the electronic components are rotated again about their longitudinal or transverse axis. The device thus enables the inspection of different sides of the components.

[0010] US Patent 6,079,284 relates to a device for the comprehensive visual inspection of tablets. The device comprises a first inspection drum which, by means of suction holes formed on its outer surface, removes the tablets from a feeder and transports them by rotation to a second inspection drum. The second drum is similarly equipped with suction holes, like the first drum, which receive the tablets at the transfer position. The device further comprises inspection units that enable a comprehensive inspection of the tablets.

[0011] Further technological background can be found in documents JP 2001-74664 (A), JP 1-193630 (A), US 5,750,979, WO 85 / 04385 A1, DE 199 13 134 A1, JP 8-227904 A, WO 03 / 058708 A, CN 103 489 811 A, EP 1 806 043 B1, JP 2009 154889 A, JP 2012 186505 A, JP H11 295236 A and WO 2014 / 087682A, JP. Problem to be solved

[0012] A component handling device should enable precise handling and inspection of components at high throughput. Solution presented here

[0013] This problem is solved by a component handling device according to claim 1.

[0014] The arrangement presented here forms an integrated handling / inspection system. Imaging sensors inspect all or nearly all top and / or side surfaces of a component, providing relevant data for positioning the manipulators (receivers) and receiving points. This system thus forms the core of a closed machine system with the necessary process-related peripherals, such as components (e.g., wafer table) and component storage (e.g., pocket or carrier belt). The component handling device presented here picks up components from a component supply (wafer disk) arranged, for example, horizontally in the upper area of ​​the device, using a stationary ejection unit. The component supply moves within the plane relative to this stationary ejection unit. The ejection unit ejects the components either by means of a needle or without contact (e.g.,...(by means of a laser beam) that the components are individually released from the component supply and picked up by a receiver. The ejected components are fed to up to six or more inspection processes and finally conveyed to receiving points (pockets) of the pocket or carrier belt. The terms receiving point and (disposal) pocket are used synonymously here. Defective parts can be rejected in this process. The optical inspection of the component, integrated into the transfer process, is divided into several inspection steps. It uses one or more imaging sensors to optically detect the top and / or outer surface(s) of a component, as well as the positions of the receivers at the transfer / receiving points. These imaging sensors are configured to capture at least one image of one of the top and / or outer surfaces of a component in each of several inspection steps.The components are conveyed / transported while receivers of turning devices hold each component. A held component undergoes individual inspection processes during transport. The acquired (image) data from the imaging sensors also serves to coordinate the position control of the manipulators (receivers) and the receiving stations. The component conveying system is designed to transport a component essentially continuously or intermittently along its path.

[0015] The complete assembly presented here functionally combines two aspects: handling and inspection. These two functions are interwoven for the rapid and precise qualitative assessment of multiple (up to six or more) sides of the components, while these are quickly and individually removed from the component stock, classified as good parts by inspection, and precisely placed at the receiving point(s).

[0016] The component handling device has two preferably controlled, and preferably substantially orthogonal (90° ± up to 15°) rotating devices arranged in an approximately star- or wheel-shaped configuration. The rotating devices could also have a rectangular shape. Each of these rotating devices carries several receivers that can be moved radially around its axis of rotation in order to feed the components, each fixed to a receiver, within a swivel angle between component pickup and transfer to one or more process stations for inspection, rejection of defective parts, and, if necessary, further stations.

[0017] In the component handling device presented here, the star- or wheel-shaped turning devices support the components on radially outward-facing receivers arranged on the (imaginary) circumference of the two turning devices. This differs from component handling devices where the receivers of one or both turning devices are oriented coplanarly or parallel to their axis of rotation.

[0018] While several inspection procedures have been mentioned above, this does not imply a fixed sequence or order (e.g., image acquisition in a first inspection procedure followed by image acquisition in a subsequent procedure). Rather, cases where the reverse order is more advantageous are also conceivable. Since, depending on the number of sensors on each turning device, several components can be imaged simultaneously at each turning device, the inspection procedures also take place concurrently, albeit on different components.

[0019] The (top / bottom) cover and / or (side) surface(s) of a component detected by the imaging sensors in the individual examination processes may be different cover and / or surface areas of the component.

[0020] One aspect of the optical inspection involves the component conveyor completing its path with virtually no downtime. During this process, or during minimal downtime, one or more top and / or outer surfaces of the component are captured by imaging sensors. These images are then analyzed using image processing methods. One variation of this optical acquisition / inspection method uses one or more color or monochrome cameras as imaging sensors.

[0021] The imaging sensors can have one or more mirrors, optical prisms, lenses, or the like.

[0022] Imaging sensors can be assigned to radiation or light sources. Each source can be configured to emit light / radiation with a different spectral or wavelength range to illuminate at least one section of the component. The wavelength ranges can differ, overlap, or coincide, at least partially. For example, the light from the first light source might be red, and the light from the second might be blue. However, the reverse assignment or a different wavelength pairing (e.g., infrared and visible light) is also possible.

[0023] The light sources can be briefly switched on by a control arrangement at the moment the sensor with the component is within the respective detection range, so that the top and / or outer surfaces of the component can be illuminated with a short flash of light for detection by the respective imaging sensor. Alternatively, continuous illumination can be used.

[0024] In one variant, the component handling device is assigned a dispensing unit configured to dispense one component at a time from the structured component supply to a receiver of the first turning unit, which is positioned accordingly by the control system. This receiver can be a component ejector that pushes the component through the wafer carrier film using a needle, or a laser pulse generator that selectively melts the adhesive bonding the component to the carrier film. The dispensing unit is assigned a position and / or property sensor configured to detect the position of the dispensing unit relative to the component being dispensed, and / or position data of the component being dispensed, and / or properties of the component being dispensed, and to provide this information to the control system for actuating the dispensing unit.

[0025] In one variant, the component handling device is equipped with a receiving unit assigned to the storage location for a component conveyed there. The receiving unit is equipped with position and / or property sensors configured to acquire position data of the component conveyed to the storage location, position data and / or properties of receiving points within the receiving unit and / or the component located therein, and to make this data available to a control system. The control system is configured to rotate the receiving unit, at least partially, around a third axis containing the storage location by means of a third rotary drive. Alternatively, the control system can be configured to move the receiving unit, at least partially, along an axis in a controlled manner by means of at least one third linear drive.Finally, the control system can also be configured to move a carrier guided by the receiving device along one of the first and / or second axes in a controlled manner using a linear drive. This carrier serves to hold the components individually.

[0026] In one variant of the component handling device, the receivers of the first and / or second turning device are configured to be extended and retracted in a controlled manner radially to the axis of rotation or the center of rotation of the respective turning device, and / or to be subjected to controlled negative and / or positive pressure for receiving and dispensing a component to be conveyed, and / or to be immobile about their respective radial axis of movement, or to be rotated in a controlled manner about their respective radial axis of movement by an angle of rotation.

[0027] In one variant of this type of component handling device, the receivers of the first and / or second turning unit are equipped with linear drives for radial extension and retraction at the dispensing point, the transfer point between the first and second turning units. These linear drives engage the correspondingly positioned receivers from outside the respective turning units and extend and retract the receiver radially. In another variant, these linear drives only extend the receiver, while a return spring retracts it. In yet another variant, each receiver is assigned a bidirectional or unidirectional radial drive.

[0028] In one variant of the component handling device, valves provide each of the individual sensors with an individual and positionally appropriate supply of negative and positive pressure in order to realize the following functions, either freely or positionally controlled: (i) suction of the component, (ii) holding of the component, (iii) placing of the component with or without controlled blow-off impulse, and / or free blow-off of the component.

[0029] In one variant of the component handling device, position and property sensors are assigned to the first turning device between the dispensing point and the transfer point, and / or to the second turning device between the transfer point and the storage point. These sensors are configured to acquire position data and / or properties of the conveyed component and / or position data for controlling the position of the manipulators (receivers) and the receiving points, and to make this data available for the control system.

[0030] In one variant of the component handling device, at least some of the position and property sensors are configured to inspect at least one top surface and / or one or more lateral surfaces of the conveyed component in order to record its position data and / or properties and make them available for control.

[0031] In one variant of the component handling device, an imaging property and / or position sensor is provided in the center of the first turning device and / or in the center of the second turning device for determining the properties and / or position of a component to be received or for determining the position of receiving points in the receiving device and / or the component located therein. Based on the property data and / or the position data of the sensor(s), a correction can then be made by the control system in case of property errors and / or position errors of the component to be received or the receiving point. The imaging position sensor(s) is / are configured to acquire an image during each turning movement of the first or second turning device.The second turning device is to be implemented between adjacent receivers and made available for control to initiate corresponding corrective movements of the ejection unit, the component supply or wafer, the turning devices, and / or the receiving device. In another variant, the ejection unit is stationary.

[0032] In addition to or as an alternative to these imaging property and / or position sensors, externally mounted imaging property and / or position sensors can be provided relative to the first and second turning devices to determine the properties and / or position of a component to be received or to determine the position of receiving points in the receiving device and / or the component located therein. Based on the property and / or position data of this sensor(s), the control system can then correct for property errors and / or position errors of the component to be received or the receiving point. Independently of the inspection system described above, and functionally considered part of the handling system, an upward-facing component storage camera (with a 90° mirror system and illumination) can be located in the center of each of the two turning devices.A downward-facing assembly, preferably but not necessarily identical in design, is arranged as a placement camera. It serves to detect the position of the components or receiving points with the aim of correcting any positional errors. The image is captured during the pivoting movement of the two turning devices through a window area between the sensors, followed by a wafer or receiving device correction movement. Alternatives with externally mounted wafer or placement cameras are also possible.

[0033] In one variant of the component handling device, an ejection point is located upstream or downstream of the transfer point and / or the storage point, which is designed, controlled by the control system, to eject a component identified by the control system as a defective part by means of at least one of the position and property sensors, and not to place it as a good part in the receiving device.

[0034] In one variant of the component handling device, the first and / or the second turning unit are each assigned an integer number n of sensors, where n >= 2. The number of sensors in the first turning unit and the number of sensors in the second turning unit can be the same or different.

[0035] In one variant of the component handling device, the first, second and / or third axes each enclose an angle of 90° plus / minus a maximum of 10° or 15° to each other.

[0036] In one variant of the component handling device, the position / property sensors are imaging sensors with matching or differing detection spectra, or contact or non-contact distance-measuring position sensors, or contact or non-contact detecting property sensors.

[0037] The position and property sensors can be imaging sensors with straight or angled optical axes.

[0038] The camera systems of the position and property sensors, including their mirror and illumination units, can be spatially arranged in such a way that the inspection of the facing component surface and two of its lateral surfaces can be performed in parallel at a single process position. In total, two process positions are sufficient for the complete inspection of all six sides of, for example, a cuboid component. At each of the two process positions, three of the six sides of the component are captured. In one variant, the third process position can be defined as the inspection position of each turning device, approximately horizontally at the level of the rotation or swivel axis.

[0039] Additional position-measuring tasks can be assigned to two further camera systems (front / rear camera).

[0040] In one variant of the component handling device, the first and / or second turning devices are designed in an approximately star- or wheel-shaped configuration. The turning devices can be precision-bearing mounted, and their positioning along or around the respective axes can be achieved by means of an axially arranged linear or rotary drive, coupled with a high-resolution (e.g., rotary or linear) encoder. The respective sensors can be distributed around the outer circumference and have radially outward-facing suction contact points for the components to be conveyed.

[0041] One advantage of the axially offset arrangement of the turning devices relative to each other (by approximately 90°) is that, during the conveying process, the components undergo a 90° rotation around the sensor axis, relative to the respective plane of motion of the sensors (or turning device axis), when transferred from one turning device to the next, without requiring the sensor itself to be mounted for rotation. This change in component orientation, in turn, significantly simplifies the inspection of the four component cross-sectional surfaces (=component side surfaces). This is achieved using a camera system, each camera system facing the component cross-sectional surface and arranged orthogonally to the sensor's plane of motion (i.e., in the axial direction of the turning device), preferably at a very short distance from the component cross-sectional surfaces (=component's outer surfaces) themselves.

[0042] The detection of mispositioning between the sensor and the component relative to each other, or to the transfer and inspection positions, is carried out using camera systems as a sensor / component position-detecting measuring system. For very high accuracy requirements, three additional distance-measuring sensors for bond tool position detection can be provided for each turning unit.

[0043] The cameras' optical axes "penetrate" the inspected component surface. They form a reference system for the sensor position. Based on this, distance-measuring sensors, arranged in a plane parallel to the ideal sensor motion plane of the rotating turning device, can determine deviations of the sensor's movement path from the target movement path. From this, the resulting positional errors at the transfer positions can be determined and compensated for by the control system.

[0044] Depending on the operating principle of the additional position sensors, reference measurements for the sensor position can be performed during the ongoing process or during cyclically repeated reference runs (for example, using touch-type sensors). This requires cyclic reference runs both at the beginning of the process to detect spatial position errors and during the process to account for thermally induced displacements (with brief process interruptions for touch-type sensors), the latter of which can be relatively long.

[0045] In one variant, to compensate for positional errors of the turning devices of the sensors, particularly in the component transfer positions and of the components fixed to them (in transfer and inspection positions), a rotary correction movement of the rotor drive and an orthogonal linear correction movement in the axial direction are performed. For this purpose, in one variant, the rotor drive assembly can be arranged on a traversing carriage and moved by means of a position-controlled drive, for example an eccentric drive, through limited travel segments.

[0046] In one variant of the component handling device, the rigid coupling of several sensors on a turning unit necessitates the transfer of correction values ​​from a component transfer or inspection position to the next positions in the sequence. These corrections can begin at a fixed transfer position and end with the final component transfer to the receiving station. The receiving unit compensates for the cumulative positional errors along up to three axes and the rotation about up to three axes.

[0047] In one version of the component handling device, the receivers are not rotatably mounted on their respective turning units. This means that orientation errors of the components cannot be compensated for during conveying. Therefore, in one version, a rotary correction option must be provided in the downstream peripheral area, particularly in the receiving unit, in addition to axis position correction.

[0048] In another variant of the component handling device, rotation correction is achieved using rotatably mounted sensors. This allows for the compensation of component orientation errors during conveying itself. The orientation error is then corrected by the rotatably mounted sensors of the upper and / or lower turning unit, preferably by the sensors of the lower turning unit.

[0049] The variants presented here are more cost-effective compared to the state of the art and offer a higher component throughput, more time for inspections and have less moving mass.

[0050] More precisely, a solution is presented for a receiving device, in particular for a component handling device of the type described above, which is configured to rotate at least partially around a third axis containing the receiving device relative to the storage location by means of a rotary drive, and / or to move at least partially along one of the first, second and / or third axes in a controlled manner by means of at least one linear drive, and / or to move a carrier guided by the receiving device along one of the first and / or second axes in a controlled manner by means of a rotary drive.

[0051] The solution presented here allows the position and orientation of the turning devices to be compensated simultaneously by the position and / or rotation of the receiving device. Therefore, the machine's component throughput can be increased compared to the prior art. To avoid backlash in the conveyor drive of the unloading belt, the drives must be adjusted relative to each other in the prior art. The solution presented here avoids this, as transport always occurs in only one direction. This is particularly helpful in applications where the pockets of the carrier belt are gradually sealed with an adhesive cover tape. If the carrier belt were transported back, problems might arise when the cover tape had to be removed. The backlash in the drive can be disregarded in this case.

[0052] In another variant, transport can also take place in the opposite direction.

[0053] The component's position is corrected at the receiving unit, allowing more time for this process. Return transport of the conveyor belt, on which the components are placed, is no longer necessary, enabling a simpler receiving unit design. A second drive wheel for the conveyor belt's return, as required in prior art, is no longer needed. Instead, when required, the entire receiving unit moves in the opposite direction to the conveyor belt's transport direction. The advantage is higher positioning accuracy of the conveyor belt compared to previously known designs where positioning is achieved solely through the conveyor belt's movement. Applying a (self-adhesive) cover tape to the conveyor belt is also easier with this design.

[0054] In one variant, the receiver is positioned above a stationary base plate, while the motors of the three drives are located below the base plate. The receiver's position can be adjusted in the X, Y, and Z axes. Each direction of movement of the receiver has its own drive. The position of the individual drives is not fixed. The axis of rotation for Z-axis correction is located near the component placement position or at its center.

[0055] In one version of the receiving device, it is equipped with two receiving points which must be aligned at least approximately with the storage location by controlled actuation of the rotary drive of the linear drive(s). The two receiving points must be positioned relative to each other according to a grid dimension of adjacent component receptacles on the carrier.

[0056] In one variant of the receiving device, an imaging property and / or position sensor is provided for determining the properties and / or position of a component to be received in relation to its properties and / or its position relative to at least one of the receiving points in the receiving device. This imaging property and / or position sensor is located in or near the center of the lower turning device. Using the image data from this sensor, the control system can generate correction instructions for property and / or position errors of the component to be received or the receiving point, initiating corresponding corrective movements.

[0057] In another variant, two additional imaging property and / or position sensors are provided at the receiving unit. One sensor is directed downwards towards the second window to examine quality defects. The other sensor is positioned laterally at the first window to better detect any tilting of the component compared to the sensor described above.

[0058] In one variant of the receiving device, the fourth rotary drive is configured, controlled by control signals from the controller, to move the carrier guided by the receiving device along one of the first and / or second axes in a controlled manner by approximately 80–120%, preferably approximately 100% ± a maximum of 3%, of the grid dimension of adjacent component receptacles of the carrier. The rotary drive can also be configured, controlled by control signals from the controller, to rotate at least one of the receiving points, with the component receptacle of the carrier located there, around the third axis containing the storage location in a controlled manner by up to ± 6°, preferably up to ± 3°, depending on signals from the imaging property and / or position sensor.Furthermore, additionally or alternatively, at least one linear drive can be equipped to control the receiving device by means of control signals from the control unit, in a controlled manner by approximately plus or minus a maximum of 20%, preferably up to plus or minus 3% of the grid dimension of adjacent component mounts of the carrier along one of the first, second and / or third axes.

[0059] In one variant of the receiving device, the fourth rotary drive is configured to advance the carrier guided by the receiving device along one of the first and / or second axes according to a grid dimension of adjacent component receptacles of the carrier.

[0060] In one variant of the receiving device, an extraction and / or blowing device is provided to remove a component identified as defective and / or incorrectly placed from at least one of the receiving points in the receiving device and / or the carrier guided in the receiving device.

[0061] In one variant of the receiving device, a spiked wheel, driven by the fourth rotary drive, engages in transport holes of the conveyor belt to move it in the conveying direction. The spiked wheel preferably rotates only in a forward direction. The conveyor belt has regularly spaced pockets for the components. For each pocket, the spiked wheel rotates by a fixed angular amount (e.g., 30°, 60°, 90°, 180°, ..., 360°). The position of the pocket into which the component has been placed is known from the image captured by the camera in the center of the second turning device. Furthermore, the camera on the outer circumference of the second turning device indicates whether the next component to be placed is held at a twisted position on the receiver. Based on this positional information, the control system calculates the distance and / or angle by which the receiving device must be repositioned.Furthermore, the positioning of the receiving unit also takes into account that the turning unit will move accordingly in the x and y directions to correctly transfer the component from the upper to the lower turning unit at the transfer position. The receiving unit is then moved linearly along the (X, Y) axes and, if necessary, rotated to ensure fine-tuning the component's placement.

[0062] Once a component has been placed in the storage position, the camera in the center of the second turning device located above it also detects whether the component is defective, i.e., whether it was damaged during storage or already had a defect beforehand. If a component was identified as defective beforehand, it is not stored.

[0063] The placement position in the receiving unit can also serve as a first extraction point. For this purpose, a vacuum extractor is located at the placement point on the receiving unit. In the conveying direction of the conveyor belt, there is a second, alternative extraction point. This means that the receiving unit has two windows: a first window for a placement position and a second window for an extraction point. The distance between the two windows corresponds to the grid spacing of the conveyor belt and is adjustable to this grid spacing. If the component is not placed correctly, i.e., it lies at an angle or protrudes partially, this is detected by a camera in the center of the second turning unit. The conveyor belt cannot continue its journey due to the incorrectly placed component. Therefore, the component is extracted at the placement point and replaced by the next component to be placed.If a component is damaged, it can also be removed at this position and replaced by the next component to be placed. At the position of the second window, another camera can be used to inspect for defects. If a component is identified as defective, the entire receiving unit is moved back and vacuumed onto the defective component at the placement position.

[0064] Alternatively, the second extraction position can be used to remove the component identified as defective.

[0065] The arrangement presented here makes it possible to inspect a component for defects. The component is placed using the first and second turning devices, and a component identified as defective is removed from the placement position. This all takes place at a common location.

[0066] The receiving unit moves in three directions: in the X and Y directions, and around its (Z) vertical axis at or near the center of the deposit position. This also distinguishes it from conventional arrangements where the conveyor belt is advanced in the transport direction and the receiving unit is moved perpendicular to the belt transport direction for positioning at the component deposit point. The deposit point can also be in the form of a tray (e.g., a JEDEC tray) or an antenna track.

[0067] In an alternative variant, the receiving device is assigned an extraction and / or blowing device in order to remove a component identified as defective and / or incorrectly placed from at least one of the receiving points in the receiving device and / or the carrier guided in the receiving device.

[0068] In one variant, the receiving device can receive components from a turning device whose axis of rotation is essentially parallel to the conveying direction of the receiving device, or in another variant, the receiving device can receive components from a turning device whose axis of rotation is essentially perpendicular to the conveying direction of the receiving device.

[0069] In one variant, an imaging property and / or position sensor is provided at the center of the turning device for determining the properties and / or position of a component to be received, or for determining the position of receiving points in the receiving device and / or the component located therein. This imaging property and / or position sensor is configured to execute image acquisitions of at least one of the receiving points in the receiving device between adjacent sensors located around the circumference of the turning device.

[0070] In an alternative embodiment, a deflecting mirror or prism is arranged in the center of the turning device. This mirror or prism is associated with the imaging property and / or position sensor located outside the turning device. It is used to determine the properties and / or position of a component to be received, or to determine the position of receiving points in the receiving device and / or the component located therein. The deflecting mirror or prism, together with the imaging property and / or position sensor located outside the turning device, is configured to create image acquisitions of at least one of the receiving points in the receiving device between adjacent sensors located around the circumference of the turning device.

[0071] The receiving device is to be moved, at least partially, in a controlled manner in both directions along a first axis relative to a storage location by means of a linear drive. A carrier guided by the receiving device is to be moved in a controlled manner along one of the first and / or second axes in a conveying direction by means of a rotary drive. The carrier guided by the receiving device is equipped with two receiving points, which are to be aligned at least approximately with a storage location for components by controlled actuation of the drives. An imaging property and / or position sensor provides properties and / or position of a component to be examined with respect to its properties and / or position at at least one of the receiving points in the receiving device.Based on image data from the property and / or position sensor, correction instructions are issued by a controller in the event of property and / or positional errors of the component, initiating corresponding corrective movements of the receiving device and / or the carrier guided within it. The receiving device is assigned an extraction and / or blow-out device to remove a component identified as defective and / or incorrectly positioned from at least one of the receiving points in the receiving device and / or the carrier guided within the receiving device.

[0072] In another variant, position and property sensors are assigned to the first or second turning devices, which are configured to acquire position data of the first or second turning devices (ii), position data of components located on the sensors, and / or (iii) properties of components located on the sensors of the first or second turning devices and to make them available for a control system (i).

[0073] A method for removing defective components from a receiving device, in particular of the above-described design / function, comprises the steps defined in claim 11.

[0074] Due to increased quality requirements coupled with decreasing dimensions of electronic components, which also have to be processed in ever-decreasing process times, conventional sensor arrangements were recognized as insufficient.

[0075] As a variant, an imaging sensor is therefore proposed that is suitable and intended for detecting the position and / or properties of a component, particularly in a component handling device of the type disclosed above. This imaging sensor is equipped with at least two different detection spectra. It is particularly suitable and intended for detecting property defects and / or positional defects of a component located in the receiving area of ​​a receiving device. This imaging sensor is suitable and intended to interact with radiation sources that are matched to the imaging sensor with respect to their radiation spectrum and angle of incidence and / or angle of reflection. The imaging sensor is suitable and configured to provide a separate image input for each of its detection spectra to a downstream image processing unit.

[0076] In this imaging sensor, for example, at least two different detection spectra are configured in the visible and invisible ranges. These can also be configured as a red color range (630 nm ± 30 nm), and / or a green color range (530 nm ± 60 nm), and / or a blue color range (460 nm ± 50 nm) of a color sensor.

[0077] In one variant of the imaging sensor, optically effective elements are provided which are designed to optically couple the sensor with a component in at least one of the receiving points in the receiving device and / or the carrier guided in the receiving device.

[0078] In one variant of the imaging sensor, the optically effective elements include deflecting mirrors, prisms, color filters and / or lenses.

[0079] Individual optically effective elements and / or radiation sources may be configured to be activated, aligned and / or adjusted / focused independently of others.

[0080] The integrated handling / inspection device disclosed here uses imaging sensors that, on the one hand, inspect all or almost all top and / or side surfaces of a component and, on the other hand, also provide relevant data for the positioning of the manipulators (receivers) at the first and / or second turning device and the receiving points.

[0081] The imaging sensor of the first (upper) turning unit is, in one variant, a color camera located in the center of the turning unit. Alternatively, the camera can also be a black and white camera, which, in another variant, is positioned laterally and interacts with a 45° deflecting mirror in the center of the turning unit. During the rotation of the upper turning unit, this camera captures the component, which will be separated from the component supply by the component ejector in the next step, through the gap between two sensors. The resulting image allows for both inspection of the component and precise determination of its position within the component supply. The image acquisition occurs during the rotation of the upper turning unit, within the period referred to as the viewing window.

[0082] The integrated handling / inspection device disclosed here also uses imaging sensors in the form of side cameras on the upper turning unit. These are arranged radially outside the upper turning unit at approximately 90° such that the component is captured frontally by a central camera on its flight path and by the opposing surfaces on either side of the central camera. These cameras are not necessarily color cameras. Several image acquisitions can be made because the upper turning unit is briefly stationary (10 ms to 60 ms, for example, 40 ms) in the 180° position for the subsequent component transfer. This short standstill period is sufficient for the inspection. Black and white cameras can also be used for this purpose. The side inspection by the two side cameras examines the end faces of the component for damage.The rear side of the component is inspected for damage using the middle camera. Multiple image captures can be performed for this inspection to highlight different defects. The cameras used here can also be color cameras. However, this is not strictly necessary, as sufficient time is available due to the downtime, as mentioned above.

[0083] The integrated handling / inspection device disclosed here also uses imaging sensors in the form of side cameras on the lower turning unit. These are arranged at approximately 90° radially outside the lower turning unit such that the component is captured frontally by a central camera during its flight path, while the cameras on either side of the central camera capture opposing surfaces. These cameras are not necessarily color cameras; black and white cameras can also be used. At this position, the component is inspected for defects, and the image data is evaluated for positional information. The side inspection by the two side cameras examines the component's cut surfaces for damage. The rear inspection by the central camera examines the back of the component for damage.For backside inspection, multiple image acquisitions can be performed to highlight various defects. For subsequent placement of the component in the receiving device, the component's positional data (x, y, rotation) can be determined using side inspection. Alternatively, backside inspection can be used for this purpose. This information is used by the control system to make any necessary corrections. The cameras used here can also be color cameras. However, this is not strictly necessary, as sufficient time is available during the downtime.

[0084] The integrated handling / inspection device disclosed here further utilizes imaging sensors in the form of a camera located in the center of the lower turning mechanism. This camera can be a color camera with three separate channels (R, G, B). It is irrelevant whether a 3-chip or 1-chip color camera is used. 3-chip cameras have a separate image sensor for each color (R, G, B), while a 1-chip camera uses alternately activated filters in front of the image sensor. A black and white camera suitable for this application has one channel with, for example, 255 gray levels, while in a color camera, each of the three channels has, for example, 255 intensity levels of a color. The essential requirement is that the camera's three color channels can be addressed / read separately, or at least that the three color channels can be split within the control system. Different exposure times are possible for each channel.For example, the following exposure times can be used: 5 ms (green), 12 ms (red), 15 ms (blue). Depending on the activated color channels, different illumination colors are used in the integrated handling / inspection device disclosed here. While white light is a mixture of all colors, meaning that all channels could theoretically be addressed simultaneously with this illumination color, this is explicitly not done here if the achievable image quality does not meet the requirements.

[0085] In one variant, the imaging sensor is associated with a semi-transparent mirror, positioned at an angle of approximately 45° to the optical axis of the camera chip. This mirror serves to optically couple colored light from two, several, or any number of different detection spectra from corresponding light sources and direct it onto an inspection area. This light, directed onto the inspection area—i.e., the component's top or side surface and, if applicable, its surroundings within the pocket—is reflected there and captured by at least one camera chip of the imaging sensor.

[0086] Furthermore, in one variant, a ring light source is assigned to the imaging sensor around the inspection point. This ring light source emits scattered light at an angle of approximately 5° to 45° in a third color range. This light, directed towards the inspection area, is also reflected there and captured by at least one camera chip of the imaging sensor. The light, or the different colored light sources, can be arranged arbitrarily or even have the same beam angle.

[0087] The integrated handling / inspection device disclosed here uses a deflecting mirror in the center of the lower turning mechanism to couple coaxial illumination from the receiving device. More precisely, the carrier, in the form of a conveyor belt with pockets for the components, guided by the receiving device, is captured by the camera. A single image capture performs an inspection for defects, such as the component being placed at an angle, resulting in incorrect positioning in its pocket, or for quality defects. This single image also captures the positional data of the conveyor belt's pocket for placing the next component. The information obtained from the individual color channels can be divided as needed, according to the tasks being investigated, for example, as follows: Image channel 1 with illumination type 1: Position of the conveyor belt's pocket for positioning the next component.Image channel 2 with illumination type 2: Quality inspection of the component (cracks, laser marks, chips, etc.). Image channel 3 with illumination type 3: Additional inspections for special components or customer-specific defects.

[0088] In one variant of the integrated handling / inspection system, the component is placed "blindly." This means that the actual placement process is based on information or positional data acquired from the image captured before the placement process, which is associated with the previous component. At the moment of placement, the camera in the center of the second turning unit cannot see the placement point because the sensor currently placing the component obstructs its view.

[0089] In one variant, a camera on the outer circumference of the lower turning device provides information or position data indicating whether a component is rotated. This information or position data is then transmitted to the control unit of the receiving device. The position of the receiving device is known from the image of the component previously placed in the storage pocket of the conveyor belt. The distance between the two pockets is also known. From this, the angle and x- and y-coordinates by which the receiving device must be moved can be calculated for the next component to be placed.

[0090] Further aspects of the device result in corresponding supplementary or alternative process steps.

[0091] The imaging sensor array presented here requires fewer image acquisitions than conventional sensor arrays. The acquired image data can be used both for rejecting defective parts and for positioning the actuators of the handling / inspection system. This integrated architecture and the resulting workflow reduce process time and offer improved inspection quality at higher throughput rates. Brief description of the characters

[0092] Further features, properties, advantages, and possible variations will become clear to a person skilled in the art from the following description, which refers to the accompanying drawings. The figures schematically show an optical inspection device for a component. Fig. 1schematically shows a component handling device for removing prismatic or cylindrical components from a structured component supply and placing them on a receiving device in a side view. Fig. 2 schematically shows the orientation of the various position and property sensors of the component handling device. Fig. 1 with regard to the side surfaces of a component. Fig. 3 The figure schematically shows one of the position and property sensors arranged on the circumference of one or both turning devices of the component handling device in a top view. Fig. 4 schematically shows a receiving device for use with the component handling device in a perspective view. Fig. 5 schematically shows one of the position and property sensors with associated lighting arrangement for use with the component handling device. Detailed description of the figures

[0093] In Fig. 1Figure 100 illustrates a component handling device for removing prismatic components B in the form of electronic semiconductor chips from a structured component supply and placing them on a receiving device 200. The component handling device 100 presented here takes the components B from a component supply, in this case a wafer disk, arranged horizontally in the upper area of ​​the component handling device, using a stationary ejection unit 110.

[0094] In the illustrated variant, the ejection unit 110 operates with a needle controlled by an ECU, or, for example, it operates contactlessly with a laser beam to release the components individually from the component supply so that they can be fed to a first turning unit 130. This first turning unit 130 is in the shape of a star or wheel and has several (eight in the illustrated example) receivers 132 around its circumference for the individual components B. Each receiver 132 is configured to receive a component from the structured component supply at a dispensing point PLC when it is closest to the ejection unit 110 at the 0° position of the first turning unit 130.

[0095] The receivers 132 are arranged radially outwards on the (imaginary) circumference of the star- or wheel-shaped first turning device 130 and carry the components B. The receivers 132 of the first turning device 130 are radially movable relative to the axis of rotation (here the X-axis). Thus, these receivers 132 can convey the components B, each fixed to one of the receivers 132, within a swivel angle – here between 0° and 180° – between component pickup and transfer.

[0096] The first turning device 130 rotates component B, controlled by the control unit (not illustrated), around a first axis, here the X-axis, to a first transfer point ÜS by a first predetermined angle, here 180°. In doing so, component B is turned around its longitudinal or transverse axis. A second turning device 150, similar to the first turning device 130 and equipped with several, here also eight, second receivers 152, is configured to receive component B at the transfer point ÜS from a receiver 132 of the first turning device 130 when the component is closest to the transfer point ÜS at the 0° position of the second turning device 130.

[0097] The second turning device 150 turns the received component B, controlled by the control unit ECU, around a second axis, here the Y-axis, around a second predetermined angle, here around approximately 180°, around its longitudinal or transverse axis and conveys it to a storage point ABS.

[0098] The first, second and / or third axes each enclose an angle of 90° plus / minus a maximum of 10° or 15° and are oriented to a three-dimensional orthogonal coordinate system.

[0099] The two star- or wheel-shaped reversing devices 130, 150 are arranged orthogonally to each other and are otherwise identical in their construction. This differs from the illustration in Fig. 1 The arrangement of the two turning devices 130, 150 relative to the conveying direction of the receiving device 200 can also be rotated by 90° around the Z-axis. In this case, the lower turning device 150 is oriented at least approximately transversely to the conveying direction of the receiving device 200.

[0100] The first and second turning devices 130, 150 are assigned position and property sensors K1 ... K4. As in Fig. 1As shown, these sensors are located at several points within the overall arrangement. They are configured to acquire position data of the first and second turning devices 130, 150, position data of components B located on the sensors 132, 152, as well as properties of components B located on the sensors 132, 152. The data acquired is made available to a controller. In the embodiment illustrated here, a first camera arrangement K1 is located in the center of the first turning device 130 and is directed vertically upwards towards the component supply. A second camera arrangement K2 with three cameras - in Fig. 1 Not visible – is located at the periphery of the first turning device 130 and is directed at 90° towards the component B being moved past it. Details of this second camera arrangement K2 will be provided in connection with Fig. 3As explained, a third camera arrangement K3, corresponding to the second camera arrangement K2 and consisting of three cameras, is positioned at the periphery of the second turning device 150 at a 90° angle, directed towards the component B being moved past it. A fourth camera arrangement K4 is located in the center of the second turning device 150 and directed towards the storage point ABS or the first receiving point ES1 in the receiving device 200.

[0101] The ECU control unit is designed to rotate the first turning device 130 around a first axis (here the X-axis) in a controlled manner using a first rotary drive DA1 and to move the first turning device 130 along the first axis in a controlled manner using a first linear drive LA1.

[0102] The ECU control unit is further configured to rotate the second turning device 150 in a controlled manner around a second axis (here the Y-axis) that is not collinear with the first axis (here the X-axis) by means of a second rotary drive DA2, and to move the second turning device 150 along the second axis in a controlled manner by means of a second linear drive LA2.

[0103] The imaging sensors inspect the top and / or side surface(s) of component B and also provide relevant data for the positioning of the first and second turning devices 130, 150 longitudinally and around their axes, as well as the sensors 132, 152 and the components B and the receiving points located on them.

[0104] The component handling device 100 is equipped with a receiving unit 200 assigned to the storage location ABS for a component B conveyed there. The receiving unit 200 is equipped with position and property sensors K4 and K5, which are configured to acquire position data of the component B conveyed to the storage location ABS, position data and properties of receiving locations ES1 and ES2 within the receiving unit 200, and of the components B located therein, and to make this data available to a control unit (ECU). Position and property sensor K5 is a fifth camera array directed at a second window at the second receiving location ES2.The ECU control unit is configured to rotate the receiving unit 200 around a third axis (here the Z-axis) containing the ABS storage location using a third rotary drive DA3, and to move the receiving unit along the first and second axes using a third and a fourth linear drive LA3, LA4. A fourth rotary drive DA4 moves a carrier 320, guided by the receiving unit 200, along the first axis (here the X-axis). This carrier 320 serves to pick up the components B individually from the second turning unit 150. The turning units 130, 150 and the rotary drives DA1, DA2, ... each have a high-resolution rotary angle encoder (not shown) connected to the ECU control unit to determine their respective rotational position.

[0105] In the receiving unit 200, the fourth rotary drive DA4, controlled by control signals from the control unit ECU, serves to move the carrier 320, guided by the receiving unit 200, along the first axis (here the X-axis) in a controlled manner by approximately 100% plus or minus a maximum of 3% of the grid dimension of adjacent component receptacles (pockets) of the carrier 320. The grid dimension is derived from the center distance between two consecutive pockets. The third rotary drive DA3, controlled by control signals from the control unit ECU, is configured to rotate one of the receiving stations E1, with the component receptacle of the carrier 320 located there, around the Z-axis containing the storage location by up to plus or minus 6°, depending on signals from the imaging property and position sensor in the center of the second turning unit 150.

[0106] The fourth rotary drive DA4 of the receiving unit 200 has in the Fig. 4The variants shown feature a spiked wheel that engages in transport holes 325 of the carrier 320 (discharge belt) to transport it in the conveying direction. The spiked wheel preferably rotates only in a forward direction.

[0107] In this variant of the receiving unit 200, an extraction and / or blow-out device 340 is provided on the downstream side of the receiving point ES1. This is optional, however. Controlled by signals from the control unit ECU, this device removes components identified as defective or incorrectly positioned from their pocket.

[0108] To draw component B into the receivers 132, 152, to hold component B in the receivers 132, 152, to release component B with or without a controlled blow-off pulse, and to freely blow component B out of the receivers 132, 152, these receivers are connected to a pneumatic unit (not illustrated). Controlled by the ECU, the pneumatic unit applies overpressure or underpressure to the individual receivers 132, 152 via valves at the required time or for the required period to individually pick up, hold, and release the components.

[0109] If the inspection results obtained by the control unit (ECU) and the position and property sensors at the individual stations are positive, the respective component B is placed in the receiving station ES1, i.e., the pocket of the carrier 320, which is currently located at the drop-off point ABS. If the inspection results obtained are negative, the component B is rotated one position further to a first suction unit 330, where it is sucked off by its receiver 152 at the second turning device 150. If a position and property sensor monitoring this receiving station ES1 detects (see also Fig. 5If the system detects that the deposited component B has a positional or property defect after being deposited, it is extracted from the pocket of the carrier 320 by means of a second suction unit 340 located downstream of the receiving point ES1. Subsequently, in this case, and controlled by the ECU, the entire receiving unit 200, together with the carrier 320, is reset by the center-to-center distance of two pockets of the carrier 320 using the third linear drive unit LA3, in the opposite direction to the conveying direction of the carrier 320. Then, the next component B is inserted into the vacated pocket of the carrier 320 at the second turning unit 150.

[0110] In another variant, the first receiving station ES1 is assigned an additional extraction device (not shown) to extract material from a component lying at an angle at receiving station ES1. Any quality defects can be detected by the position and property sensor K4 or by the position and property sensor K5 at the second window. If the position and property sensor K5 detects a quality defect, the receiving device 200 is transported back together with the carrier 320, and the component B is then extracted from the pocket of the carrier 320 at the storage location. A tilting of a component lying at an angle at receiving station ES1 can be detected by a position and property sensor K6 (not shown), which is assigned to receiving station ES1.This position and property sensor K6 is arranged laterally to the support 320 and detects the receiving point ES1 directly or via a deflection mirror over the top edge of the support 320. This allows any tilting or protrusion of an incorrectly positioned component to be detected.

[0111] As in the Fig. 2 in connection with the Fig. 1 As illustrated, the camera arrangement K1, acting as a position and property sensor, is located in the center of the first turning unit 130 and directed towards the component supply. This allows the top surface D2 of component B to be inspected for position and defects. The camera arrangement K1 is configured to perform an image acquisition between two adjacent sensors 132 during each turning movement of the first turning unit 130. Based on this image data, the control system generates corresponding corrective movements of the ejection unit, the component supply or wafer, and the first turning unit 130.

[0112] The second camera arrangement K2, acting as a position and property sensor, with its three cameras, is positioned at the periphery of the first turning device 130 at approximately 90° and directed towards the three sides S2, S4, and D1 of component B. A top view of the camera arrangement K2 with its three cameras K2-1, K2-2, and K2-3 is shown in Fig. 3This is illustrated. Here, the middle camera K2-2 inspects the top surface D1 of component B, and the two outer cameras K2-1 and K2-3 inspect the side surfaces S2 and S4 of component B via their respective mirrors SP1 and SP2. From the captured images, in addition to any defects of component B on these surfaces, the exact position and rotation of component B on its sensor 132 can be determined. This information is used in the control unit (ECU) to change the orientation of the first turning unit 130 and the second turning unit 150 along their axes and rotational orientation when the inspected component B is transferred from the first turning unit 130 to the second turning unit 150 at the transfer point ÜS.

[0113] The third camera arrangement K3, acting as a position and property sensor, is externally mounted at the periphery of the second turning device 150 at approximately 90° and directed towards the three sides S1, S3, and D2 of component B. Its three cameras are directed at approximately 90°. This camera arrangement K3 corresponds in its design and arrangement to camera arrangement K2 with its three cameras and two mirrors. Fig. 3From the image insets captured, in addition to any defects of component B on these surfaces, the exact position and rotation of component B on its sensor 152 of the second turning device 150 can also be determined. This information is used in the control unit ECU to change the orientation of the second turning device 150 and the receiving device 200 along their axes and rotational orientations when the inspected component B is placed at the transfer point ÜS from the second turning device 150 into the receiving point ES1 located at the drop-off point ABS, i.e., the pocket of the carrier 320.

[0114] The fourth camera array, K4, is positioned as a position and property sensor in the center of the second turning unit 150 and directed towards the receiver E1 in the receiver 200. This camera array K4 is also configured to perform an image acquisition between two adjacent sensors during each turning movement of the second turning unit 150. The control unit ECU then initiates corresponding corrective movements of the second turning unit 150 and the receiver 200.

[0115] The in Fig. 5The illustrated position and property sensor 400 is a variant of the camera arrangements K1 - K5 as an imaging sensor. This sensor 400 has a camera chip 410 that captures the visible light spectrum. In this imaging sensor 400, the three differing detection spectra are designed as a red color range (630 nm ± 30 nm), a green color range (530 nm ± 60 nm), and a blue color range (460 nm ± 50 nm) of a color sensor.

[0116] The imaging sensor 400 is associated with a semi-transparent mirror 420, which is arranged at an angle of approximately 45° to the optical axis of the camera chip 410. The semi-transparent mirror 420 serves to optically couple colored light from two detection spectra, here the green and blue color ranges, from corresponding light sources 440 and direct it onto a surface of component B. The camera chip 410 detects this light directed onto component B in the green and blue color ranges. Depending on the spatial conditions, other deflecting mirrors, prisms, color filters, or lenses may also be used.

[0117] Another light source 450 is arranged in a ring light source configuration around the receiving station ES1 located at the ABS drop-off point and delivers scattered light at an angle of approximately 5° - 45° in the red color range onto the top surface of component B. This light directed onto component B in the red color range is also detected by the camera chip 410.

[0118] Individual optically effective elements and / or radiation sources may be designed to be aligned and / or adjusted / focused independently of others.

[0119] In this particular version, the camera chip 410 is a color camera with three individual channels: R, G, and B. However, it can also be a camera with multiple channels. The three color channels of the camera can be addressed / read out independently. With a single image capture, component B is inspected for defects, such as incorrect placement of component B in the designated pocket of the carrier 320, or for quality defects. This single image also captures the exact position data of the pocket on the carrier 320 for placing the next component B. The information obtained from the individual color channels is divided as follows: Image channel 1 with illumination type 1: Position of the storage pocket on the conveyor belt for positioning the next component. Image channel 2 with illumination type 2: Quality inspection of the component (cracks, laser marks, chips, etc.).Image channel 3 with lighting type 3: Additional inspections for special components or customer-specific defects.

[0120] The imaging sensor technology presented here requires fewer image acquisitions than conventional sensor arrangements to achieve defective part rejection and actuator positioning.

[0121] It should be noted that although numerical ranges and numerical values ​​have been disclosed here, all numerical values ​​between the disclosed values ​​and any numerical subrange within the mentioned ranges are also to be considered as disclosed.

[0122] The previously described variants of the device, as well as their design and operational aspects, serve only to facilitate a better understanding of its structure, function, and properties; they do not limit the disclosure to these exemplary embodiments. The figures are partly schematic, with essential properties and effects sometimes significantly enlarged to illustrate the functions, operating principles, technical configurations, and features. Each function, principle, technical configuration, and feature disclosed in the figures or text can be freely and arbitrarily combined with all claims, features in the text and in the other figures, other functions, principles, technical configurations, and features contained in or arising from this disclosure, so that all conceivable combinations can be attributed to the described procedure.This includes combinations of all individual descriptions in the text, that is, in every section of the description, in the claims, and also combinations of different variants in the text, in the claims, and in the figures. The claims do not limit the disclosure and thus the possible combinations of all the features shown. All disclosed features are explicitly disclosed here, both individually and in combination with all other features. However, the scope of protection of the European patent is determined by the patent claims. Reference sign

[0123] Storage area ABS component B Side surfaces S1, S2, S3, S4 of the component's cover surfaces D1, D2 of the component first rotary drive DA1 for rotating the first reversing device around the first axis (X-axis) second rotary drive DA2 third rotary drive for rotating the second reversing device around the second axis (Y-axis). DA3 fourth rotary drive for rotating the receiving device around a third axis (Z-axis) containing the ABS storage location DA4 The receiving device transports the carrier in the conveying direction; first linear drive LA1 for the procedure of the first turning device along the first axis (X-axis) second linear drive LA2 for the procedure of the second turning device along the second axis (Y-axis) third linear drive LA3 fourth linear drive for the process of the receiving device along the first axis LA4 for the procedure of the receiving device along the second axis of the fifth linear drive LA5 for the process of a carrier guided by the receiving device along the first axis (X-axis) first receiving point ES1 second receiving point ES2 steering ECU Position and property sensors K1 ... K4, K5 first camera setup K1In the center of the first turning device, directed vertically upwards, is the second camera arrangement. K2 Three cameras are positioned at the periphery of the first turning device, aimed at the component being moved past it at a 90° angle; the third camera arrangement K3 With three cameras, the fourth camera arrangement is directed at the periphery of the second turning device at 90° towards the component being moved past it. K4 is located in the center of the second turning device and is directed towards the storage point or the first receiving point in the receiving device; fifth camera arrangement K5 is directed at the second window at the second reception point. Mirror SP1, SP2 Donation point PLC handover point ÜS Component handling device 100 Ejection unit 110 first turning device 130 first recorders 132 second reversing device 150 second recorder 152 Reception facility 200 carrier 320Transport holes 325 first extractor 330 Discharge point 335 Extraction and / or blowing device 340 sensor 400 camera chip 410 semi-transparent mirror 420 Light sources 440 additional light source 450

Claims

1. A component-handling device (100) for removing components from a structured component supply and depositing them at a reception device (200), having - a first turning device (130) having a plurality of pick-up elements (132) which is adapted o to receive a component (B) from the structured component supply at a dispensing point (SPS), and o to turn the received component through a first predetermined angle about its longitudinal or transverse axis (LA, QA) and to convey it to a transfer point (ÜS); - a second turning device (150) having a plurality of pick-up elements (152) which is adapted o to receive the component (B) from a pick-up element (132) of the first turning device (130) at the transfer point (ÜS), o to turn the received component (B) through a second predetermined angle about its longitudinal or transverse axis (LA, QA) and to convey it to a deposit point (AS); and - a controller (ECU) is adapted o to rotate the first turning device (130) in a controlled manner about a first axis (X-axis) by means of a first rotary drive (DA1) and to move the first turning device (130) in a controlled manner along the first axis (X-axis) by means of a first linear drive (LA1); o to rotate the second turning device (150) in a controlled manner about a second axis (Y-axis) that is not collinear with the first axis (X-axis) by means of a second rotary drive (DA2) and to move the second turning device (150) in a controlled manner along the second axis (Y-axis) by means of a second linear drive (LA2); and wherein - the first and the second turning device (130, 150) are at least approximately star-shaped or wheel-shaped, and - the pick-up elements (132, 152) of the first and the second turning device (130, 150) have radially outward facing suction contact points for the components (B) to be conveyed.

2. The component-handling device (100) as claimed in claim 1, having - a delivery device (110) which is adapted to deliver a component (B) from the structured component supply (wafer) to a pick-up element (132), correspondingly positioned by the controller, of the first turning device (130), and - a position and / or property sensor (K1) associated with the delivery device (110), which sensor is adapted to detect the position of the delivery device (110) relative to the component (B) to be delivered and / or position data of the component (B) to be delivered and / or properties of the component (B) to be delivered, and to provide them to the controller (ECU) for operation of the delivery device (110).

3. The component-handling device (100) as claimed in claim 1 or 2, having - a reception device (200), associated with the deposit point (ABS), for a component (B) fed thereto, wherein the reception device (200) - has associated position and property sensors (K4, K5) which are adapted to detect and provide to a controller (ECU) o position data of the component (B) fed to the deposit point (ABS), o position data and / or properties of reception points (ES1, ES2) in the reception device (200) and / or of the component (B) situated therein, wherein - the controller (ECU) is adapted o to rotate the reception device (200) in a controlled manner at least partly about a third axis (Z-axis) containing the deposit point (ABS) by means of a third rotary drive (DA3), and / or o to move the reception device (200) in a controlled manner at least partly along one of the first, second and / or third axes (X-, Y-, Z-axis) by means of at least a third and / or fourth linear drive (LA3, LA4), and / or o to move a carrier (320) guided by the reception device (200) along one of the first and / or second axes (X-, Y-axis) in a controlled manner by means of a fourth rotary drive (DA4).

4. The component-handling device (100) as claimed in any one of the preceding claims, wherein the pick-up elements (132, 152) of the first and / or second turning device (130, 150) are adapted - to be deployed and retracted in a controlled manner radially to their respective axis of rotation (X-, Y-axis), and / or - to be subjected to negative pressure and excess pressure in a controlled manner in order to receive and deliver a component (B) to be fed, and / or - to be immovable about their respective radial movement axis, or - to be rotated in a controlled manner through an angle of rotation about their respective radial movement axis.

5. The component-handling device (100) as claimed in the preceding claim, wherein the pick-up elements (132, 152) of the first and / or second turning device (130, 150) are provided with associated linear drives for radial deployment / retraction at the dispensing point (SPS), the transfer point (ÜS) between the first and second turning devices (130, 150), which linear drives engage with the correspondingly positioned pick-up elements (132, 152) in each case from outside and deploy and retract the respective pick-up element (132, 152) or deploy the respective pick-up element (132, 152) while a return spring retracts the respective pick-up element (132, 152), or each of the pick-up elements (132, 152) has an associated radial drive.

6. The component-handling device (100) as claimed in the preceding claim, wherein valves provide each of the individual pick-up elements (132, 152), individually and in the correct position, with negative pressure and excess pressure in order to perform the following functions, freely or in a position-controlled manner: (i) suction of the component (B), (ii) holding of the component (B), (iii) deposition of the component (B) with or without a controlled blow-off pulse, and / or free blowing-off of the component (B).

7. The component-handling device (100) as claimed in any one of the preceding claims, wherein position and property sensors (K2, K3) are associated with the first turning device (130) between the dispensing point (SPS) and the transfer point (ÜS) and / or with the second turning device (150) between the transfer point (ÜS) and the deposit point (AS), which sensors are adapted to detect position data and / or properties of the fed component (B) and to provide them to the controller (ECU), and / or wherein at least some of the position and property sensors (K1, ..., K4, K5) are adapted to inspect at least one end face (D1, D2) and / or one or more side faces (S1-S4) of the fed component (B) in order to detect the position data and / or properties thereof and provide them to the controller (ECU), and / or wherein - an imaging property and / or position sensor is provided in the center of the first turning device (130) and / or in the center of the second turning device (150) for determining properties and / or the position of a component (B) to be received or for determining the position of reception points (ES1, ES2) in the reception device (200) and / or of the component (B) situated therein, for the purpose of correction by the controller (ECU) in the event of property defects and / or position errors of the component (B) to be received or of the reception point, wherein the imaging position sensor(s) is / are adapted to perform an image acquisition between adjacent pick-up elements (132, 152) during the turning movement of the first or second turning device and to provide it to the controller (ECU) in order to effect corresponding correction movements, and / or - imaging property and / or position sensors, provided externally relative to the first and second turning devices (130, 150), for determining properties and / or the position of a component (B) to be received or for determining the position of reception points (ES1, ES2) in the reception device (200) and / or of the component (B) situated therein, for the purpose of correction by the controller (ECU) in the event of property defects and / or position errors of the component (B) to be received or of the reception point.

8. The component-handling device (100) as claimed in any one of the preceding claims, wherein a discharge point (335) is arranged upstream or downstream of the transfer point (ÜS) and / or the deposit point (ABS), which discharge point is adapted, under the control of the controller (ECU), to discharge a component (B) identified by the controller (ECU) as being a reject part by means of at least one of the position and property sensors and not to deposit it in the reception device (200), and / or wherein a whole number of n pick-up elements (132, 152) is associated with the first and / or second turning device (130, 150), wherein n is >= 2, and wherein the number of pick-up elements (132) of the first turning device (130) and the number of pick-up elements (152) of the second turning device (150) is the same or different, and / or wherein the first, second and / or third axes (X-, Y-, Z-axes) enclose an angle relative to one another of in each case 90° plus / minus not more than 10°, and / or wherein the position and property sensors are imaging sensors having corresponding or different detection spectra, or position sensors which measure distance by contact or without contact, or property sensors which detect by contact or without contact, and / or wherein the position and property sensors are imaging sensors with straight or bent optical axes.

9. The component-handling device (100) as claimed in any one of the preceding claims, wherein - the first and / or second turning devices (130, 150) are at least approximately star- or wheel-shaped, and - the respective pick-up elements (132, 152) have radially outward facing suction contact points for the components (B) to be conveyed.

10. Component handling device (100) according to one of the preceding claims, in which the position and property sensors (K1, ..., K5) assigned to the first and second turning devices (132, 152) are configured to: o position data of the first and second turning devices (130, 150), o position data of components (B) located on the pick-up elements (132, 152), and / or o properties of components (B) located on the pick-up elements (132, 152) of the first and second turning devices (130, 150) acquire and provide to a controller (ECU).

11. A method for removing components from a structured component supply and for depositing them at a reception device, comprising the steps: - by means of a first turning device (130) which is controlled to rotate about a first axis (X-axis), having a plurality of pick-up elements (132) which have suction contact points for the components (B) to be conveyed that point radially outwards to the first axis (X-axis), receiving a component (B) from the structured component supply at a dispensing point (SPS); - turning the received component (B) through a first predetermined angle about its longitudinal or transverse axis (LA, QA) and conveying it to a transfer point (ÜS); - by means of a second turning device (150) which is controlled to rotate about a second, non-collinear axis (Y-axis) to the first axis (X-axis), having a plurality of pick-up elements (152) which have suction contact points for the components (B) to be conveyed that point radially outwards to the second axis (Y-axis), receiving the component (B) at the transfer point (ÜS) from a pick-up element (132) of the first turning device (130); - turning the received component (B) through a second predetermined angle about its longitudinal or transverse axis (LA, QA) and conveying it to a deposit point (ABS); and - rotating the first turning device (130) in a controlled manner about a first axis (X-axis) by means of a first rotary drive (DA1); and - to move the first turning device (130) in a controlled manner along the first axis (X-axis) by means of a first linear drive (LA1); and - rotating the second turning device (150) in a controlled manner about a second axis (Y-axis) that is not collinear with the first axis (X-axis) by means of a second rotary drive (DA2); and - to move the second turning device (150) in a controlled manner along the second axis (Y-axis) by means of a second linear drive (LA2).