Liner assembly and refrigeration box

Abstract

A liner assembly and a refrigeration box, wherein the liner assembly comprises: a liner (100), in which a refrigeration chamber (101) is constructed; an wind shield (200) which defines a dehumidification interlayer (103) together with a first side wall (102) of the liner (100), the dehumidification interlayer (103) being communicated with the refrigeration chamber (101); a thermal insulation layer (300) covering the outer surface of the liner (100) and providing clearance for the first side wall (102); a cold source portion (400), at least part of which is attached to the outer surface of the thermal insulation layer (300) and at least part of which is attached to the outer surface of the first side wall (102), so that the cold source portion (400) is used to cool the first side wall (102); and a semiconductor dehumidification module (500) which is arranged in the dehumidification interlayer (103) and comprises a cold-end heat dissipation sheet (501) for dehumidifying the gas flowing into the dehumidification interlayer (103) from the refrigeration chamber (101) and a hot-end heat dissipation sheet (502), wherein the hot-end heat dissipation sheet (502) is arranged close to the first side wall (102) so that the first side wall (102) is used to dissipate heat therefor. The liner assembly can improve the heat dissipation effect of a hot-end heat dissipater and the dehumidification efficiency of the semiconductor dehumidification module (500).

Description

[0001] This application claims priority to Chinese Patent Application No. 202311110955.8, filed on August 30, 2023, the content of which is incorporated herein by reference in its entirety.TECHNICAL FIELD

[0002] The present disclosure relates to the technical field of a refrigeration box, and more particularly to a liner assembly and a refrigeration box.BACKGROUND

[0003] A refrigeration box can provide a low-temperature environment. Even in a case of a power outage, the refrigeration box can be maintained within a low-temperature environment for a long time, making it widely applied in pharmaceuticals, cold chain transportation, food storage, and the like. In order to ensure the quality of the refrigerated goods, the gas humidity inside the refrigeration box needs to be maintained in an appropriate range. Exceeding the range, the refrigerated goods may be wet, even deteriorated, or damaged. Therefore, it is necessary to dehumidify the refrigeration box.

[0004] In the related art, a refrigeration box comprises a liner, a dehumidifying chamber, and a semiconductor dehumidifying module disposed in the dehumidifying chamber. The semiconductor dehumidifying module comprises a semiconductor cooling plate, a hot-side heat-dissipating device disposed at the hot side of the semiconductor cooling plate, and a cold-side heat-dissipating device disposed at the cold side of the semiconductor cooling plate. A cold-side heat-dissipating fan is disposed correspondingly with the cold-side heat-dissipating device, and the cold-side heat-dissipating fan is for driving the gas inside the liner to flow through the cold-side heat-dissipating device to dehumidify the gas. A hot-side heat-dissipating fan is disposed correspondingly with the hot-side heat-dissipating device, and the hot-side heat-dissipating device is for accelerating the flow velocity around the hot-side heat-dissipating device to dissipate heat for the hot side heat-dissipating device.

[0005] During the implementation of the embodiment of the present disclosure, at least the following problems have been found in the related arts:

[0006] The heat-dissipation effect of the hot-side heat-dissipating device in the related art is poor, resulting in a low dehumidifying efficiency of the semiconductor dehumidifying module, and gathering heat emitted by the hot-side heat-dissipating device in the dehumidifying chamber, resulting in a large temperature fluctuation of the dehumidifying chamber and affecting the temperature of the liner.

[0007] It should be noted that the above information disclosed in the background is only for enhancing the understanding of the background of the present disclosure and thus may contain information that does not form the prior art known to one having ordinary skills in the art.SUMMARY

[0008] A brief summary is given below to give a basic understanding of some aspects of the disclosed embodiments. The summary is not intended to be a general comment to identify crucial / essential constituent elements or to describe the protection scope of these embodiments, but rather to serve as a preface to the detailed description that follows.

[0009] The embodiment of the present disclosure provides a liner assembly and a refrigeration box, which employs a first sidewall with a lower temperature to dissipate heat for a hot-side heat-dissipating sheet, which is conducive to improving the heat-dissipation effect of the hot-side heat-dissipating device and the dehumidifying efficiency of the semiconductor dehumidifying module, alleviating gathering of heat in a dehumidifying interlayer, and reducing the temperature fluctuation of the dehumidifying interlayer and the temperature fluctuation of the liner.

[0010] In some embodiments, the liner assembly comprises: a liner, internally configured with a refrigeration chamber; a wind baffle, disposed in the liner and enclosing a dehumidifying interlayer with a first sidewall of the liner, the dehumidifying interlayer being communicated with the refrigeration chamber; an insulation layer, wrapped around an outer surface of the liner and avoiding the first sidewall; a cold source portion, at least partially attached to an outer surface of the insulation layer, and at least partially attached to an outer surface of the first sidewall, so as to provide cold to the first sidewall by the cold source portion; and a semiconductor dehumidifying module, disposed in the dehumidifying interlayer, comprising a cold-side heat-dissipating sheet and a hot-side heat-dissipating sheet; where the cold-side heat-dissipating sheet is configured to dehumidify the gas flowing from the refrigeration chamber to the dehumidifying interlayer, and the hot-side heat-dissipating sheet is arranged close to the first sidewall to dissipate heat by the first sidewall.

[0011] In some embodiments, the wind baffle is configured with an interlayer wind inlet, the interlayer wind inlet is configured to communicate the refrigeration chamber with the dehumidifying interlayer; the semiconductor dehumidifying module comprises: a module shell, configured with a module wind channel, a wind channel inlet communicated with the interlayer wind inlet, and a wind channel outlet facing the first sidewall; and a semiconductor cooling plate, disposed in the module shell, a cold side of the semiconductor cooling plate being connected to the cold-side heat-dissipating sheet, and a hot side of the semiconductor cooling plate being connected to the hot-side heat-dissipating sheet; where the cold-side heat-dissipating sheet is disposed at the wind channel inlet and the hot-side heat-dissipating sheet is disposed at the wind channel outlet.

[0012] In some embodiments, the semiconductor dehumidifying module further comprises: a heat-dissipating fan, disposed at an outer side of the wind channel outlet, the heat-dissipating fan is rotatable to adsorb gas from the refrigeration chamber, and the gas flows through the cold-side heat-dissipating sheet and the hot-side heat-dissipating sheet inside the module wind channel in sequence.

[0013] In some embodiments, the wind channel outlet is separated from the first sidewall by a first distance with a relationship of L>20% D; where L is the first distance, and D is a fan blade diameter of the heat-dissipating fan.

[0014] In some embodiments, the cold source portion comprises: a cold-storage layer, a part of the cold-storage layer being wrapped around an outer surface of the insulation layer, and the other part of the cold-storage layer being wrapped around the outer surface of the first sidewall; and an evaporating coil, coiled around an outer surface of the cold-storage layer.

[0015] In some embodiments, the liner assembly further comprises: one or more partition plates, vertically disposed in the dehumidifying interlayer to divide the dehumidifying interlayer into a plurality of sub-wind channels communicated with each other, thus prolonging the residence time of the gas in the dehumidifying interlayer and reducing an outlet temperature of the dehumidifying interlayer.

[0016] In some embodiments, the partition plates are distributed at two sides of the semiconductor dehumidifying module, and a height of each of the partition plates is lower than a height of the wind baffle to form a notch at an upper end / a lower end of each of the partition plates; where the two adjacent sub-wind channels are communicated by the notch, and the two adjacent notches are distributed at two opposite ends of the two adjacent partition plates.

[0017] In some embodiments, the wind baffle is formed with an insulation plate, and / or, the insulation layer is formed by a plurality of insulation plates spliced with each other, and / or, the cold-storage layer is formed by a plurality of cool-storage plates spliced with each other, and / or, the evaporating coil is spirally coiled along a height direction of the liner and forms a plurality of spiral circles.

[0018] In some embodiments, the liner assembly further comprises a controller, in a case where a current dehumidifying rate is lower than the dehumidifying rate threshold, configured to control the semiconductor dehumidifying module to be reversely powered to cause the cold-side heat-dissipating sheet to generate heat to defrost the cold-side heat-dissipating sheet.

[0019] In some embodiments, the refrigeration box comprises: a box shell; and any one of the above liner assemblies disposed in the box shell.

[0020] The liner assembly and the refrigeration box provided by the embodiment of the present disclosure have the following technical advantages:

[0021] The insulation layer of the liner assembly provided by the embodiment of the present disclosure is wrapped around the outer surface of the liner and avoids the first sidewall. A part of the cold source portion is attached to the outer surface of the insulation layer, and a part of the cold source portion is attached to the outer surface of the first sidewall, so as to directly provide cold to the first sidewall by the cold source portion, and to form the first sidewall with a lower temperature. The semiconductor dehumidifying module comprises the cold-side heat-dissipating sheet and the hot-side heat-dissipating sheet, where the cold-side heat-dissipating sheet is configured to dehumidify the gas flowing from the refrigeration chamber to the dehumidifying interlayer, so as the refrigeration chamber to be maintained in an appropriate humidity. The hot-side heat-dissipating sheet is arranged close to the first sidewall to dissipate heat for the hot-side heat-dissipating sheet by the first sidewall with a lower temperature. Thus, it is conducive to improving the heat-dissipation effect of the hot-side heat-dissipating device and improving the dehumidifying efficiency of the semiconductor dehumidifying module. The first sidewall with a lower temperature is provided to exchange heat with the gas in the dehumidifying interlayer, to alleviate the gathering of the heat emitted by the hot-side heat-dissipating device in the dehumidifying interlayer, and to reduce the temperature fluctuation of the dehumidifying interlayer and the liner.

[0022] The above general description and the description below are exemplary and explanatory only and are not intended to limit the present disclosure.BRIEF DESCRIPTION OF THE DRAWINGS

[0023] One or more embodiments are illustrated by means of the corresponding drawings, which do not constitute a limitation of the embodiments. The elements having the same reference numerals in the drawings are shown as similar elements, and the drawings do not constitute a limitation of proportion, where: Fig. 1 is a schematic structure diagram of a refrigeration box provided by the embodiment of the present disclosure; Fig. 2 is a schematic structure diagram of a liner assembly provided by the embodiment of the present disclosure; Fig. 3 is a schematic structure diagram of a semiconductor dehumidifying module provided by the embodiment of the present disclosure; Fig. 4 is a sectional view of the liner assembly provided by the embodiment of the present disclosure; Fig. 5 is another sectional view of the liner assembly provided by the embodiment of the present disclosure; Fig. 6 is another schematic structure diagram of the liner assembly provided by the embodiment of the present disclosure. REFERENCES IN THE DRAWINGS:

[0024] 100: liner; 101: refrigeration chamber; 102: first sidewall; 103: dehumidifying interlayer; 104: partition plate; 105: sub-wind channel; 106: notch; 200: wind baffle; 201: interlayer wind inlet; 300: insulation layer; 400: cold source portion; 401: cold-storage layer; 402: evaporating coil; 500: semiconductor dehumidifying module; 501: cold-side heat-dissipating sheet; 502: hot-side heat-dissipating sheet; 503: module shell; 504: semiconductor cooling plate; 505: heat-dissipating fan. DETAILED DESCRIPTION OF THE EMBODIMENTS

[0025] In order to enable a more detailed understanding of the features and technical content of the embodiments of the present disclosure, the implementation of the embodiments of the present disclosure will be described in detail below in conjunction with the accompanying drawings, which are for illustration only and are not intended to limit the embodiments of the present disclosure. In the following technical description for the convenience of explanation, several details are provided for a full understanding of the disclosed embodiments. However, one or more embodiments may still be practiced without these details. In other instances, the well-known structures and devices may simplify the disclosure in order to simplify the drawings.

[0026] The terms "first", "second", and the like in the specification and claims of embodiments of the present disclosure and the above drawings are used to distinguish similar elements and are not necessarily used to describe a particular order or priority. It should be understood that the data used in this way can be interchanged where appropriate for the present disclosure described herein. Furthermore, the terms "comprise" and "have" and any variations thereof are intended to cover a non-exclusive inclusion.

[0027] In embodiments of the present disclosure, directional or positional relationship indicated by terms such as "up", "down", "inside", "middle", "outside", "front" and "rear" is based on the directional or positional relationship shown in the figures. These terms are mainly intended to describe embodiments of the present disclosure, not to limit that the described devices, elements, or components must have a specific orientation or must be configured and operated in a specific orientation. Furthermore, in addition to indicating the directional or positional relationship, the above partial terms might also be used to convey other meanings. For example, the term "on" might also be used to indicate a dependency relationship or a connectional relationship in some cases. Those having ordinary skills in the art may understand specific meanings of these terms in the embodiments of the present disclosure according to specific situations.

[0028] In addition, the terms "dispose", "connect", and "fix" should be understood in a broad sense. For example, "connect" may be a fixed connection, detachable connection, or integral connection, maybe a mechanical connection or electrical connection, maybe a direct connection, an indirect connection through an intermediate medium, or maybe internal communication between two devices, elements, or components. Those having ordinary skills in the art may understand specific meanings of the above terms in the embodiments of the present disclosure according to specific situations.

[0029] Unless otherwise illustrated, the term "a plurality of" means two or more.

[0030] In the embodiment of the present disclosure, the character " / " indicates that the front element and rear element are in an "or" relationship. For example, A / B illustrates A or B.

[0031] The term "and / or" is an association relationship that describes elements, indicating that there can be three relationships. For example, A and / or B represent relationships: A or B, or A and B.

[0032] Embodiments of the present disclosure and features in the embodiments may be combined with one another without conflict.

[0033] A refrigeration box can provide a low-temperature environment. Even in a case of a power outage, the refrigeration box can be maintained within a low-temperature environment for a long time, making it widely applied in pharmaceuticals, cold chain transportation, food storage, and the like. For example, a refrigeration box is for storing vegetables, liquors, medicines, vaccines, and the like. In order to ensure the quality of the refrigerated goods, the gas humidity inside the refrigeration box needs to be maintained in an appropriate range. Exceeding the range, the refrigerated goods may be wet, even deteriorated, or damaged. It is necessary to dehumidify the refrigeration box.

[0034] A semiconductor cooling plate, also named a thermoelectric cooler, is a thermoelectric couple formed by an N-type semiconductor and a P-type semiconductor connected thereto. In a case where a current passes through the thermoelectric couple, energy transfers between the two semiconductors, a conductor with the current flowing from the N-type semiconductor to the P-type semiconductor absorbs heat to be defined as a cold side, and a conductor with the current flowing from the P-type semiconductor to the N-type semiconductor emits heat to be defined as a hot side. However, the intrinsic resistance of the semiconductor generates heat while the current flows through the semiconductor, affecting the thermal conduction effect. The heat between the two conductor plates is reversely thermally conducted through the gas and the semiconductor material itself. In a case where the cold side and the hot side reach a certain temperature difference and the two thermal values of the two thermal conductions are equal, a temperature equilibrium point is reached, and the forward thermal conduction and the reverse thermal conduction cancel each other out. At this point, the temperature of the cold side and the temperature of the hot side will no longer continue to change. The hot side needs to dissipate heat to make the cold side reach a lower temperature.

[0035] The embodiment of the present disclosure provides a liner assembly and a refrigeration box, which employs a first sidewall with a lower temperature to dissipate heat for a hot-side heat-dissipating sheet, which is conducive to improving the heat-dissipation effect of the hot-side heat-dissipating device and the dehumidifying efficiency of the semiconductor dehumidifying module, alleviating gathering of heat in a dehumidifying interlayer, and reducing the temperature fluctuation of the dehumidifying interlayer and the temperature fluctuation of the liner.

[0036] The first aspect, the embodiment of the present disclosure provides a liner assembly.

[0037] As shown in Figs. 1 to 6, the liner assembly is provided by the embodiment of the present disclosure and comprises a liner 100, a wind baffle 200, an insulation layer 300, a cold source portion 400, and a semiconductor dehumidifying module 500.

[0038] The liner 100 is configured with a refrigeration chamber 101 inside. It should be understood that the refrigerated goods are placed into the refrigeration chamber 101 of the liner 100.

[0039] The wind baffle 200 is disposed on the liner 100. The wind baffle 200 and the first sidewall 102 of the liner 100 enclose a dehumidifying interlayer 103. The dehumidifying interlayer 103 communicates with the refrigeration chamber 101. In a case where the refrigeration chamber 101 needs to be dehumidified, the gas inside the refrigeration chamber 101 enters into the dehumidifying interlayer 103, and after being dehumidified in the dehumidifying interlayer 103, the gas re-enters into the refrigeration chamber 101.

[0040] The insulation layer 300 is wrapped around an outer surface of the liner 100 and avoids the first sidewall 102. The temperature range of the refrigeration chamber is 2 °C to 8 °C. By providing the insulation layer 300, the liner 100 and the cold source portion 400 are separated, and the refrigeration chamber 101 is maintained within an appropriate temperature range, avoiding the temperature inside the refrigeration chamber being excessively low. In addition, by providing the insulation layer 300, it is conducive to improving the insulation effect of the refrigeration box, and even in a case of a power outage, the temperature of the refrigeration chamber 101 can be maintained for a long time.

[0041] At least part of the cold source portion 400 is attached to an outer surface of the insulation layer 300, and at least part is attached to an outer surface of the first sidewall 102, so as to provide cold for the first sidewall 102 by the cold source portion 400. The cold source portion 400 is directly attached to the outer surface of the first sidewall 102, making the temperature of the first sidewall 102 lower than the temperature of the other side walls.

[0042] The semiconductor dehumidifying module 500 is disposed in the dehumidifying interlayer 103. The semiconductor dehumidifying module 500 comprises a cold-side heat-dissipating sheet 501 and a hot-side heat-dissipating sheet 502. The cold-side heat-dissipating sheet 501 dehumidifies the gas flowing from the refrigeration chamber 101 to the dehumidifying interlayer 103. The hot-side heat-dissipating sheet 502 is arranged close to the first sidewall 102 to dissipate heat by the first sidewall 102. The primary function of the first sidewall 102 is to dissipate heat for the hot-side heat-dissipating sheet 502. By actively heat-dissipating to reduce the hot side temperature of the semiconductor cooling plate of the semiconductor dehumidifying module 500. The cold side temperature of the semiconductor cooling plate is correspondingly reduced, so as to reach a lower temperature and improve the dehumidifying effect of the semiconductor dehumidifying module.

[0043] The insulation layer 300 of the inner assembly provided by the embodiment of the present disclosure is wrapped around the outer surface of the liner 100 and avoids the first sidewall 102. A part of the cold source portion 400 is attached to the outer surface of the insulation layer 300, and a part of the cold source portion 400 is attached to the outer surface of the first sidewall 102 to directly provide cold for the first sidewall 102 by the cold source portion 400 and form the first sidewall 102 with a lower temperature. The semiconductor dehumidifying module 500 comprises the cold-side heat-dissipating sheet 501 and the hot-side heat-dissipating sheet 502. The cold-side heat-dissipating sheet 501 dehumidifies the gas flowing from the refrigeration chamber 101 to the dehumidifying interlayer 103, so that the refrigeration chamber 101 is maintained at an appropriate humidity. The hot-side heat-dissipating sheet 502 is arranged close to the first sidewall 102 to dissipate heat from the hot-side heat-dissipating sheet 502 by the first sidewall 102 with a lower temperature. Thus, it is conducive to improving the heat-dissipation effect of the hot-side heat-dissipating device and improving the dehumidifying efficiency of the semiconductor dehumidifying module 500. The first sidewall 102 with a lower temperature is provided to exchange heat with the gas in the dehumidifying interlayer 103, to alleviate the gathering of the heat emitted by the hot-side heat-dissipating device in the dehumidifying interlayer 103, and reduce the temperature fluctuation of the dehumidifying interlayer 103 and the liner 100.

[0044] In some embodiments, as shown in Fig. 2, the wind baffle 200 is configured with an interlayer wind inlet 201, and the interlayer wind inlet 201 communicates the refrigeration chamber 101 with the dehumidifying interlayer 103. The semiconductor dehumidifying module 500 comprises a module shell 503 and a semiconductor cooling plate 504.

[0045] The module shell 503 is configured with a module wind channel, a wind channel inlet, and a wind channel outlet. The wind channel inlet communicates the interlayer wind inlet 201 with the module wind channel, and the wind channel outlet faces the first sidewall 102. The semiconductor cooling plate 504 is disposed in the module shell 503, a cold side of the semiconductor cooling plate 504 is connected to the cold-side heat-dissipating sheet 501, and a hot side of the semiconductor cooling plate 504 is connected to the hot-side heat-dissipating sheet 502. The cold-side heat-dissipating sheet 501 is disposed at the wind channel inlet, and the hot-side heat-dissipating sheet 502 is disposed at the wind channel outlet.

[0046] The cold side of the semiconductor cooling plate is at a lower temperature, and the hot side of the semiconductor cooling plate is at a higher temperature. By providing the cold-side heat-dissipating sheet 501, the contact area between the cold side of the semiconductor cooling plate and the gas is expanded, which improves the dehumidifying effect on the gas flow. By providing the hot-side heat-dissipating sheet 502, the contact area between the hot side of the semiconductor cooling plate and the gas is expanded, which provides better heat dissipation from the hot side of the semiconductor cooling plate.

[0047] In a case where the refrigeration chamber 101 needs to be dehumidified, the gas inside the refrigeration chamber 101 enters into the wind channel inlet of the semiconductor dehumidifying module 500 via the interlayer wind inlet 201, and flows through the cold-side heat-dissipating sheet 501 at the wind channel inlet. The water vapor in the gas, at the cold-side heat-dissipating sheet 501, contacts with cold, condenses into water droplets, and is separated out, realizing dehumidification for the gas. The temperature of the dehumidified gas is lower. The dehumidified gas flows through the hot-side heat-dissipating sheet 502 to dissipate heat for the hot-side heat-dissipating sheet 502, making the cold side of the semiconductor cooling plate reach a lower temperature.

[0048] In addition, the cooling capacity of the semiconductor cooling plate is lower than the heating capacity, and the temperature of the gas flowing from the wind channel outlet remains higher than the gas inside the refrigeration chamber. By providing the wind channel outlet facing the first sidewall 102, the gas flowing from the wind channel outlet blows to the first sidewall 102 to cool the gas flowing from the wind channel outlet by the first sidewall 102, making the outlet temperature of the dehumidifying interlayer 103 consistent with the gas temperature inside the refrigeration chamber, and reducing the temperature fluctuation of the refrigeration chamber.

[0049] Optionally, the wind baffle 200 is configured with an interlayer wind outlet. The interlayer wind outlet communicates the dehumidifying interlayer 103 and the refrigeration chamber 101. In a case where the refrigeration chamber 101 needs to be dehumidified, the gas inside the refrigeration chamber 101 flows through the interlayer wind inlet 201 and the wind channel inlet, enters into the module wind channel of the semiconductor dehumidifying module 500, after flowing through the module wind channel, enters into the dehumidifying interlayer 103 via the wind channel outlet, and finally flows back to the refrigeration chamber via the interlayer wind outlet. Repeat this cycle, and the refrigeration chamber is dehumidified.

[0050] In some embodiments, as shown in Figs. 3 and 4, the semiconductor dehumidifying module 500 further comprises a heat-dissipating fan 505. The heat-dissipating fan 505 is disposed at the outer side of the wind channel outlet. The heat-dissipating fan is rotatable to adsorb gas from the refrigeration chamber 101, and the gas flows through the cold-side heat-dissipating sheet 501 and the hot-side heat-dissipating sheet 502 inside the module wind channel in sequence. The heat-dissipating fan 505 can provide power for the circulation of gas between the refrigeration chamber 101 and the dehumidifying interlayer.

[0051] The heat-dissipating fan 505 is in an adsorbing wind mode. In the function of the heat-dissipating fan 505, the gas inside the refrigeration chamber, after flowing through the cold-side heat-dissipating sheet, the module wind channel, the hot-side heat-dissipating sheet, and the heat-dissipating fan 505, blows to the first sidewall of the liner. By providing the heat-dissipating fan 505 disposed at the outer side of the wind channel outlet, it is better for dissipating heat for the hot-side heat-dissipating sheet 502.

[0052] The heat-dissipating fan 505 is disposed at the outer side of the wind channel outlet, that is, the heat-dissipating fan 505 is disposed at a side of the wind channel outlet facing the first sidewall 102.

[0053] In some embodiments, the wind channel outlet is separated from the first sidewall 102 by a first distance with a relationship of L>20% D, where L is the first distance, and D is the fan blade diameter of the heat-dissipating fan 505. By limiting the first distance to the above range, it is possible to reduce the influence of an obstacle at an exhaust side of the heat-dissipating fan on fan performance, reducing wind noise.

[0054] The fan blade diameter refers to the diameter of the fan blade's maximum rotation track.

[0055] In some embodiments, as shown in Fig. 6, the cold source portion 400 comprises a cold-storage layer 401 and an evaporating coil 402. A part of the cold-storage layer 401 is wrapped around the outer surface of the insulation layer 300, and the other part is wrapped around the outer surface of the first sidewall 102. The evaporating coil 402 is coiled around the outer surface of the cold-storage layer 401.

[0056] The evaporating coil 402 is in close contact with the cold-storage layer 401. The evaporating coil 402 and the cold-storage layer 401 exchange heat and store cold capacity inside the cold-storage layer 401. The cold-storage layer 401 transfers the cold capacity to the liner through the insulation layer 300. The liner exchanges heat with gas inside the refrigeration chamber to keep the temperature of the refrigeration chamber in the range of 2 °C to 8 °C. At the first sidewall 102, the cold-storage layer 401 is in close contact with the first sidewall 102, and the cold-storage layer 401 directly exchanges heat with the first sidewall 102, making the temperature of the first sidewall 102 lower than the other side walls of the liner 100, to dissipate heat for the hot-side heat-dissipating sheet by the first sidewall 102.

[0057] In some embodiments, as shown in Fig. 5, the liner assembly further comprises one or more partition plates 104. The partition plates 104 are vertically disposed in the dehumidifying interlayer 103 to divide the dehumidifying interlayer 103 into a plurality of sub-wind channels 105 communicated with each other, thus prolonging the residence time of the gas in the dehumidifying interlayer 103. Designing the sub-wind channels 105 prolongs the flow path of the dehumidified gas in the dehumidifying interlayer 103, thus increasing the heat exchange time between the dehumidified gas and the first sidewall 102, furthermore reducing the outlet temperature of the dehumidifying interlayer 103, making outlet temperature of the dehumidifying interlayer 103 consistent with the gas temperature inside the refrigeration chamber, and conducive to reducing the temperature fluctuation of the refrigeration chamber.

[0058] In some embodiments, as shown in Fig. 5, the partition plates 104 are distributed at two sides of the semiconductor dehumidifying module 500, and a height of each of the partition plates 104 is lower than a height of the wind baffle 200 to form a notch 106 at an upper end / a lower end of each of the partition plates 104. The two adjacent sub-wind channels are communicated by the notch 106, and the two adjacent notches 106 are distributed at two opposite ends of the adjacent partition plates 104. That is, the partition plates 104 are distributed on a first side and a second side of the semiconductor dehumidifying module 500, the sub-wind channel at the first side of the semiconductor dehumidifying module 500 is communicated to form an S-type flow path, and the sub-wind channel at the second side of the semiconductor dehumidifying module 500 is communicated to form an S-type flow path. Thus, it is conducive to extending the flow path of the dehumidified gas in the dehumidifying interlayer 103, increasing the heat exchange time between the dehumidified gas and the first sidewall 102, reducing the outlet temperature of the dehumidifying interlayer 103, making the outlet temperature of the dehumidifying interlayer 103 consistent with the gas temperature inside the refrigeration chamber, and reducing the temperature fluctuation of the refrigeration chamber. Correspondingly, the wind baffle 200 is disposed with interlayer wind outlets on two sides, thus convenient for the gas from two sides of the semiconductor dehumidifying module 500 to flow back into the refrigeration chamber through the corresponding interlayer wind outlet.

[0059] In some embodiments, the wind baffle 200 is formed with an insulation plate. Thus, it is possible to reduce the influence of the gas temperature of the dehumidifying interlayer 103 on the gas temperature of the refrigeration chamber 101.

[0060] In some embodiments, the insulation layer is formed by a plurality of insulation plates spliced with each other. Thus, it is convenient for the refrigeration box to be manufactured.

[0061] In some embodiments, the cold-storage layer is formed by a plurality of cool-storage plates spliced with each other. Thus, it is convenient for the refrigeration box to be manufactured.

[0062] In some embodiments, the liner assembly further comprises a controller. In a case where the current dehumidifying rate is lower than the dehumidifying rate threshold, the controller is configured to control the semiconductor dehumidifying module to be reversely powered to cause the cold-side heat-dissipating sheet 501 to generate heat to defrost the cold-side heat-dissipating sheet 501. Frosting on the cold-side heat-dissipating sheet leads to a low current dehumidifying rate of the semiconductor dehumidifying module. In a case where the current dehumidifying rate is lower than the dehumidifying rate threshold, it is necessary to defrost the cold-side heat-dissipating sheet. The controller controls the semiconductor dehumidifying module to be reversely powered to make the cold-side heat-dissipating sheet generate heat, so as to defrost the cold-side heat-dissipating sheet 501.

[0063] Optionally, in a case where the current dehumidifying rate is lower than the dehumidifying rate threshold, the controller is further configured to control the heat-dissipating fan to stop operation.

[0064] Optionally, in a case where the gas humidity inside the refrigeration chamber is higher than the humidity threshold, the semiconductor cooling plate is controlled to be energized, and the heat-dissipating fan is rotatable, so as to dehumidify the refrigeration chamber by the semiconductor dehumidifying module.

[0065] The second aspect, the embodiment of the present disclosure provides a refrigeration box.

[0066] The refrigeration box provided by the embodiment of the present disclosure comprises a box shell and a liner assembly according to any one of the above embodiments. The liner assembly is disposed in the box shell.

[0067] The insulation layer 300 of the refrigeration box provided by the embodiment of the present disclosure is wrapped around the outer surface of the liner 100 and avoids the first sidewall 102. A part of the cold source portion 400 is attached to the outer surface of the insulation layer 300, and a part of the cold source portion 400 is attached to the outer surface of the first sidewall 102, so as to directly provide cold to the first sidewall 102 by the cold source portion 400, and to form the first sidewall 102 with a lower temperature. The semiconductor dehumidifying module 500 comprises the cold-side heat-dissipating sheet 501 and the hot-side heat-dissipating sheet 502, where the cold-side heat-dissipating sheet 501 is configured to dehumidify the gas flowing from the refrigeration chamber 101 to the dehumidifying interlayer 103, so that the refrigeration chamber 101 is maintained at an appropriate humidity. The hot-side heat-dissipating sheet 502 is arranged close to the first sidewall 102 to dissipate heat from the hot-side heat-dissipating sheet 502 by the first sidewall 102 with a lower temperature. Thus, it is conducive to improving the heat-dissipation effect of the hot-side heat-dissipating device and improving the dehumidifying efficiency of the semiconductor dehumidifying module 500. The first sidewall 102 with the lower temperature is provided to exchange heat with the gas in the dehumidifying interlayer 103, to alleviate the gathering of the heat emitted by the hot-side heat-dissipating device in the dehumidifying interlayer 103, and reduce the temperature fluctuation of the dehumidifying interlayer 103 and the liner 100, improving refrigeration effect of the refrigeration box.

[0068] Optionally, the box shell and the liner assembly are fixed by foaming. That is, the refrigeration box further comprises a forming layer between the box shell and the liner assembly, which is convenient for fixing the box shell and the liner assembly and is conducive to further improving the insulation property of the refrigeration box.

[0069] The refrigeration box comprises a semiconductor dehumidifying module 500. The cold-storage layer 401 is in direct contact with the first sidewall 102 of the liner 100 to make the first sidewall 102 with a lower temperature. The first sidewall 102 with a lower temperature exchanges heat with the excess heat generated by the semiconductor dehumidifying module 500, and the heat is taken out of the refrigeration box by the refrigeration cycle. While achieving the purpose of dehumidifying, the temperature inside the refrigeration box is maintained in the range of 2 °C to 8 °C. It is verified through tests that, in a case where the environmental temperature is 43°C and a power outage, the refrigeration chamber of the refrigeration box can be maintained within a temperature range of 2 °C to 8 °C for over 50 hours.

[0070] The above description and drawings sufficiently illustrate embodiments of the present disclosure to enable practice by those skilled in the art. Other embodiments may comprise structural and other modifications. Embodiments represent only possible variations. Unless explicitly required, individual parts and functions are optional, and the order of operation can vary. Portions and features of some embodiments may be included in or in place of portions and features of other embodiments. Embodiments of the present disclosure are not limited to the structures already described above and shown in the figures, and are subject to various modifications and changes without departing from their scope. The scope of the present invention is defined by the attached claims.

Claims

1. A liner assembly, <b>characterized in that, comprising: a liner, internally configured with a refrigeration chamber; a wind baffle, disposed in the liner, and enclosing a dehumidifying interlayer with a first sidewall of the liner, the dehumidifying interlayer being communicated with the refrigeration chamber; an insulation layer, wrapped around an outer surface of the liner and avoiding the first sidewall; a cold source portion, at least partially attached to an outer surface of the insulation layer, and at least partially attached to an outer surface of the first sidewall, so as to provide cold to the first sidewall by the cold source portion; and a semiconductor dehumidifying module, disposed in the dehumidifying interlayer, comprising a cold-side heat-dissipating sheet and a hot-side heat-dissipating sheet; wherein the cold-side heat-dissipating sheet is configured to dehumidify a gas flowing from the refrigeration chamber to the dehumidifying interlayer, and the hot-side heat-dissipating sheet is arranged close to the first sidewall to dissipate heat by the first sidewall.

2. The liner assembly according to claim 1, wherein the wind baffle is configured with an interlayer wind inlet, the interlayer wind inlet communicates the refrigeration chamber and the dehumidifying interlayer; and the semiconductor dehumidifying module comprises: a module shell, configured with a module wind channel, a wind channel inlet communicated with the interlayer wind inlet, and a wind channel outlet facing the first sidewall; and a semiconductor cooling plate, disposed in the module shell, a cold side of the semiconductor cooling plate being connected to the cold-side heat-dissipating sheet, and a hot side of the semiconductor cooling plate being connected to the hot-side heat-dissipating sheet; wherein the cold-side heat-dissipating sheet is disposed at the wind channel inlet and the hot-side heat-dissipating sheet is disposed at the wind channel outlet.

3. The liner assembly according to claim 2, wherein the semiconductor dehumidifying module further comprises: a heat-dissipating fan, disposed at an outer side of the wind channel outlet; wherein the heat-dissipating fan is rotatable to adsorb the gas from the refrigeration chamber, and the gas flows through the cold-side heat-dissipating sheet and the hot-side heat-dissipating sheet inside the module wind channel in sequence.

4. The liner assembly according to claim 3, wherein the wind channel outlet is separated from the first sidewall by a first distance with a relationship of L>20% D; wherein L is the first distance, D is a fan blade diameter of the heat-dissipating fan.

5. The liner assembly according to any one of claims 1 to 4, wherein the cold source portion comprises: a cold-storage layer, a part of the cold-storage layer being wrapped around an outer surface of the insulation layer, and the other part of the cold-storage layer being wrapped around the outer surface of the first sidewall; and an evaporating coil, coiled around the outer surface of the cold-storage layer.

6. The liner assembly according to any one of claims 1 to 5, further comprising: one or more partition plates, vertically disposed in the dehumidifying interlayer, to divide the dehumidifying interlayer into a plurality of sub-wind channels communicated with each other, thus prolonging the residence time of the gas in the dehumidifying interlayer.

7. The liner assembly according to claim 6, wherein the partition plates are distributed at two sides of the semiconductor dehumidifying module, and a height of each of the partition plates is lower than a height of the wind baffle to form a notch at an upper end / a lower end of each of the adjacent partition plates; wherein the two adjacent sub-wind channels are communicated by the notch, and two adjacent notches are distributed at two opposite ends of the two adjacent partition plates.

8. The liner assembly according to any one of claims 1 to 7, wherein the wind baffle is formed with an insulation plate; and / or, the insulation layer is formed by a plurality of insulation plates spliced with each other.

9. The liner assembly according to any one of claims 1 to 8, further comprising: a controller, in case where a current dehumidifying rate is lower than a dehumidifying rate threshold, configured to control the semiconductor dehumidifying module to be reversely powered, to cause the cold-side heat-dissipating sheet to generate heat to defrost the cold-side heat-dissipating sheet.

10. A refrigeration box, comprising: a box shell; and the liner assembly according to any one of claims 1 to 9, disposed in the box shell.

Images