Heating assembly, atomizer, and electronic atomization device

Abstract

This application discloses a heating assembly, an atomizer, and an electronic atomization device, where the heating assembly includes a substrate and a heating film. The substrate includes a liquid absorbing surface and an atomizing surface that are oppositely disposed, the substrate is provided with a plurality of liquid guiding holes that run through the liquid absorbing surface and the atomizing surface. The heating film is disposed on the atomizing surface, the liquid guiding holes extend to the heating film and run through the heating film. A current flow direction in the heating film is defined as a first direction, a direction perpendicular to the current flow direction in the heating film is defined as a second direction, and the arrangement density of the plurality of liquid guiding holes in the first direction is greater than the arrangement density of the plurality of liquid guiding holes in the second direction, thereby ensuring the stability of the heating film while increasing the porosity of the substrate.

Description

CROSS-REFERENCE TO RELATED APPLICATIONS

[0001] This application claims priority to Chinese Patent Application No. 202321202509.5, filed on May 17, 2023, which is incorporated by reference in its entirety.TECHNICAL FIELD

[0002] This application relates to the field of electronic atomization technologies, and in particular, to a heating assembly, an atomizer, and an electronic atomization device.BACKGROUND

[0003] An electronic atomization device consists of components such as a heating assembly, a battery and a control circuit. As a core element of the electronic atomization device, the characteristics of the heating assembly determine the atomization effect and use experience of the electronic atomization device.

[0004] The relatively common atomization method for existing heating assemblies is resistance heating. Specifically, the heating assembly includes a substrate and a heating film disposed on the surface of the substrate. The substrate is provided with through holes, and the through holes is used for guiding an aerosol generating substrate. To improve the porosity of the heating assembly, increasing the density of the through holes is one of the most straightforward methods. However, the existing uniform hole forming methods increase the hole density while the spacing between the holes is reduced, thereby increasing the resistance of the heating film, reducing the stability of the heating film, resulting in a significant increase in failures during operation of the heating assembly.SUMMARY

[0005] A heating assembly, an atomizer, and an electronic atomization device are provided in this application to improve the stability of a heating film while improving the hole density.

[0006] To resolve the foregoing technical problems, a first technical solution provided in this application is to provide a heating assembly applied to an electronic atomization device to atomize an aerosol generating substrate. The heating assembly includes a substrate and a heating film. The substrate includes a liquid absorbing surface and an atomizing surface that are oppositely disposed; the substrate is provided with a plurality of liquid guiding holes that run through the liquid absorbing surface and the atomizing surface. The heating film is disposed on the atomizing surface; the liquid guiding holes extend to the heating film and run through the heating film. A current flow direction in the heating film is defined as a first direction, a direction perpendicular to the current flow direction in the heating film is defined as a second direction. The arrangement density of the plurality of liquid guiding holes in the first direction is greater than the arrangement density of the plurality of liquid guiding holes in the second direction.

[0007] In an implementation, the heating film comprises a heating portion, a first electrode, and a second electrode; the heating portion is strip-shaped, and the heating portion extends linearly in the first direction; and the first electrode and the second electrode are respectively disposed at two opposite ends of the heating portion in the first direction.

[0008] In an implementation, the plurality of liquid guiding holes are arranged in a plurality of rows and a plurality of columns, a row direction is parallel to the first direction, and a column direction is parallel to the second direction; a plurality of liquid guiding holes in each row are spaced apart, a plurality of liquid guiding holes in each column are spaced apart.

[0009] In an implementation, the aperture of the liquid guiding holes is greater than or equal to 20 µm and less than or equal to 50 µm; the distance between hole centers of neighboring liquid guiding holes in each row is less than or equal to 100 µm; and / or the distance between hole centers of neighboring liquid guiding holes in each column is greater than or equal to 40 µm and less than or equal to 100 µm.

[0010] In an implementation, the plurality of liquid guiding holes are arranged in a plurality of rows and a plurality of columns, a row direction is parallel to the first direction, and a column direction is parallel to the second direction; at least two of a plurality of liquid guiding holes in each row are in communication with each other; and a plurality of liquid guiding holes in each column are spaced apart.

[0011] In an implementation, ports of at least two of the plurality of liquid guiding holes in each row overlap with each other on the atomizing surface.

[0012] In an implementation, the plurality of liquid guiding holes in each row are divided into a plurality of groups of liquid guiding holes; each group of liquid guiding holes include at least two liquid guiding holes, and all the liquid guiding holes in each group of liquid guiding holes are in communication with each other.

[0013] In an implementation, each group of liquid guiding holes comprises the same number of the liquid guiding holes; and / or the distances between hole centers of neighboring liquid guiding holes in each group of liquid guiding holes are the same; and / or among the plurality of groups of liquid guiding holes into which the plurality of liquid guiding holes in each row are divided, two neighboring groups of liquid guiding holes are spaced apart by the same spacing.

[0014] In an implementation, the aperture of the liquid guiding holes is greater than or equal to 20 µm and less than or equal to 50 µm; among the plurality of groups of liquid guiding holes into which the plurality of liquid guiding holes in each row are divided, the distance between hole centers of neighboring liquid guiding holes is less than or equal to 100 µm; and / or the distance between hole centers of neighboring liquid guiding holes in each column is greater than or equal to 40 µm and less than or equal to 100 µm.

[0015] In an implementation, the substrate is a dense substrate or a porous substrate.

[0016] In an implementation, the substrate is the dense substrate, and the material of the substrate is at least one of glass and dense ceramic; or the substrate is the porous substrate, and the material of the substrate is porous ceramic. In an implementation, the thickness of the substrate is 0.2 mm to 2.5 mm.

[0017] To resolve the foregoing technical problems, a second technical solution provided in this application is to provide an atomizer. The atomizer includes a liquid storage cavity and a heating assembly. The liquid storage cavity is configured to store an aerosol generating substrate. The heating assembly is in fluid communication with the liquid storage cavity, the heating assembly is configured to atomize the aerosol generating substrate, and the heating assembly is the heating assembly of any one of the foregoing items.

[0018] To resolve the foregoing technical problems, a third technical solution provided in this application is to provide an electronic atomization device. The electronic atomization device includes the atomizer as described above and a main unit. The main unit is configured to supply electric energy for operation of the heating assembly of the atomizer and control the heating assembly of the atomizer to atomize the aerosol generating substrate.

[0019] Beneficial effects of this application are as follow: different from the prior art, this application discloses a heating assembly, an atomizer, and an electronic atomization device. The heating assembly includes a substrate and a heating film The substrate includes a liquid absorbing surface and an atomizing surface that are oppositely disposed, and the substrate is provided with a plurality of liquid guiding holes that run through the liquid absorbing surface and the atomizing surface. The heating film is disposed on the atomizing surface, and the liquid guiding holes extend to the heating film and run through the heating film. A current flow direction in the heating film is defined as a first direction, a direction perpendicular to the current flow direction in the heating film is defined as a second direction, and the arrangement density of the plurality of liquid guiding holes in the first direction is greater than the arrangement density of the plurality of liquid guiding holes in the second direction, thereby ensuring the stability of the heating film while increasing the porosity of the substrate.BRIEF DESCRIPTION OF THE DRAWINGS

[0020] To describe the technical solutions of the embodiments of this application more clearly, the following briefly introduces the accompanying drawings required for describing the embodiments. Apparently, the accompanying drawings in the following description show only some embodiments of this application, and a person of ordinary skill in the art may still derive other drawings from these accompanying drawings without creative efforts. FIG. 1 is a schematic structural diagram of an embodiment of an electronic atomization device provided in this application; FIG. 2 is a schematic structural diagram of an atomizer provided in an embodiment of this application; FIG. 3 is a schematic structural diagram of a heating assembly provided in an embodiment of this application; FIG. 4 is a schematic cross-sectional view of the heating assembly shown in FIG. 3 along a line A-A; FIG. 5a is a schematic partial structural diagram of an implementation of a substrate of the heating assembly shown in FIG. 3; FIG. 5b is a schematic cross-sectional view of the substrate shown in FIG. 5a along a line B-B; FIG. 6a is a schematic partial structural diagram of another implementation of the substrate of the heating assembly shown in FIG. 3; FIG. 6b is a schematic cross-sectional view of the substrate shown in FIG. 6a along a line C-C; FIG. 7a is a schematic partial structural diagram of yet another implementation of the substrate of the heating assembly shown in FIG. 3; FIG. 7b is a schematic cross-sectional view of the substrate shown in FIG. 7a along a line D-D; FIG. 8a is a schematic partial structural diagram of yet another implementation of the substrate of the heating assembly shown in FIG. 3; FIG. 8b is a schematic cross-sectional view of the substrate shown in FIG. 8a along a line E-E; FIG. 9 is a comparison diagram of the current density distribution of a first test specimen, a second test specimen, and a third test specimen; FIG. 10 is a comparison diagram of the Joule heat distribution of a first test specimen, a second test specimen, and a third test specimen. DETAILED DESCRIPTION

[0021] Technical solutions in embodiments of this application are clearly and completely described below with reference to accompanying drawings in the embodiments of this application. Apparently, the described embodiments are merely some rather than all of the embodiments of this application. All other embodiments derived by a person of ordinary skill in the art based on the embodiments of this application without creative efforts shall fall within the protection scope of this application.

[0022] In the following description, for the purpose of illustration rather than limitation, specific details such as the specific system structure, interface, and technology are proposed to thoroughly understand this application.

[0023] The terms "first", "second", and "third" in this application are merely intended for a purpose of description, and shall not be understood as indicating or implying of relative importance or implicitly indicating the number of indicated technical features. Therefore, features defining "first", "second", and "third" can explicitly or implicitly include at least one of the features. In the description of this application, "a plurality of" means at least two, such as two or three, unless otherwise definitely and specifically defined. All directional indications (for example, upper, lower, left, right, front, and back) in the embodiments of this application are only used for explaining relative position relationships, movement situations, or the like between the various components in a specific posture (as shown in the accompanying drawings). If the specific posture changes, the directional indications change accordingly. In the embodiments of this application, the terms "include", "have", and their any variations are intended to cover non-exclusive encompassing. For example, a process, method, system, product, or apparatus that includes a series of steps or units is not limited to the listed steps or units, but further optionally includes a step or unit that is not listed, or further optionally includes another step or component that is intrinsic to the process, method, product, or apparatus.

[0024] "Embodiment" mentioned herein means that specific features, structures, or characteristics described with reference to the embodiment may be included in at least one embodiment of this application. The term appearing at different positions of this specification may not refer to the same embodiment or an independent or alternative embodiment that is mutually exclusive with another embodiment. A person skilled in the art explicitly or implicitly understands that the embodiments described herein can be combined with other embodiments.

[0025] The following describes this application in detail with reference to the accompanying drawings and embodiments.

[0026] With reference to FIG. 1, FIG. 1 is a schematic structural diagram of an embodiment of an electronic atomization device provided in this application.

[0027] In this embodiment, an electronic atomization device 100 is provided. The electronic atomization device 100 may be used for atomizing an aerosol generating substrate. The electronic atomization device 100 includes an atomizer 1 and a main unit 2 that are electrically connected to each other.

[0028] An atomizer 1 is configured to store the aerosol generating substrate and atomize the aerosol generating substrate to form aerosols that can be inhaled by a user. The atomizer 1 may be specifically applied in different fields, such as medical care, cosmetology, and recreational inhalation. In a specific embodiment, the atomizer 1 may be applied to an electronic aerosol generating device for atomizing the aerosol generating substrate and generating aerosols for inhalation by a user. The following embodiments are all described by using the recreational smoking as an example.

[0029] Reference may be made to the specific structure and functions of the atomizer 1 involved in the following embodiments for the specific structure and functions of the atomizer 1, and same or similar technical effects may also be achieved. Details are not described herein again. A main unit 2 includes a battery (not shown) and a controller (not shown). The battery is configured to supply electric energy for operation of the atomizer 1, to enable the atomizer 1 to atomize the aerosol generating substrate to generate aerosols. The controller is configured to control the operation of the atomizer 1, that is, to control the atomizer 1 to atomize the aerosol generating substrate. The main unit 2 further includes other elements such as a battery holder and an airflow sensor.

[0030] The atomizer 1 and the main unit 2 may be integrally arranged or may be detachably connected, which may be designed according to a specific requirement.

[0031] With reference to FIG. 2, FIG. 2 is a schematic structural diagram of an atomizer provided in an embodiment of this application.

[0032] The atomizer 1 includes a housing 10, a heating assembly 11, and an atomization base 12. The atomization base 12 has a mounting cavity (not shown), and the heating assembly 11 is disposed within the mounting cavity. The heating assembly 11 and the atomization base 12 are collectively disposed within the housing 10. The housing 10 is formed with a aerosol outlet channel 13. An inner surface of the housing 10, and an outer surface of the aerosol outlet channel 13, and a top surface of the atomization base 12 cooperate to form a liquid storage cavity 14. The liquid storage cavity 14 is configured to store a liquid aerosol generating substrate. The heating assembly 11 is electrically connected to the main unit 2, to atomize an aerosol generating substrate to generate an aerosol.

[0033] The atomization base 12 includes an upper base 121 and a lower base 122. The upper base 121 and the lower base 122 cooperate to form the mounting cavity. The surface of the heating assembly 11 that faces away from the liquid storage cavity 14 and the cavity wall of the mounting cavity cooperate to form an atomization cavity 120. The upper base 121 is provided with a liquid feeding channel 1211. The aerosol generating substrate in the liquid storage cavity 14 flows into the heating assembly 11 through the liquid feeding channel 1211, that is, the heating assembly 11 is in fluid communication with the liquid storage cavity 14. The lower base 122 is provided with an air inlet channel 15. External air enters the atomization cavity 120 through the air inlet channel 15, carries aerosols atomized by the heating assembly 11, and flows to the aerosol outlet channel 13. A user inhales the aerosols through the port of the aerosol outlet channel 13.

[0034] With reference to FIG. 3 to FIG. 8b, FIG. 3 is a schematic structural diagram of a heating assembly provided in an embodiment of this application. FIG. 4 is a schematic cross-sectional view of the heating assembly shown in FIG. 3 along a line A-A. FIG. 5a is a schematic partial structural diagram of an implementation of a substrate of the heating assembly shown in FIG. 3. FIG. 5b is a schematic cross-sectional view of the substrate shown in FIG. 5a along a line B-B. FIG. 6a is a schematic partial structural diagram of another implementation of the substrate of the heating assembly shown in FIG. 3. FIG. 6b is a schematic cross-sectional view of the substrate shown in FIG. 6a along a line C-C. FIG. 7a is a schematic partial structural diagram of yet another implementation of the substrate of the heating assembly shown in FIG. 3. FIG. 7b is a schematic cross-sectional view of the substrate shown in FIG. 7a along a line D-D. FIG. 8a is a schematic partial structural diagram of yet another implementation of a substrate of the heating assembly shown in FIG. 3. FIG. 8b is a schematic cross-sectional view of the substrate shown in FIG. 8a along a line E-E.

[0035] The heating assembly 11 includes a substrate 111 and a heating film 112. The substrate 111 includes a liquid absorbing surface 1111 and an atomizing surface 1112 that are oppositely disposed. The substrate 111 is provided with a plurality of liquid guiding holes 1113 that run through the liquid absorbing surface 1111 and the atomizing surface 1112, and the liquid guiding holes 1113 have a capillary force. The liquid guiding holes 1113 are configured to guide an aerosol generating substrate from the liquid absorbing surface 1111 to the atomizing surface 1112. The heating film 112 is disposed on the atomizing surface 1112, and the liquid guiding holes 1113 extend to the heating film 112 and extend through the heating film 112. The heating film 112 is configured to heat and atomize the aerosol generating substrate.

[0036] A current flow direction in the heating film 112 is defined as a first direction X, and a direction perpendicular to the current flow direction in the heating film 112 is defined as a second direction Y. The arrangement density of the plurality of liquid guiding holes 1113 in the first direction X is greater than the arrangement density of the plurality of liquid guiding holes 1113 in the second direction Y.

[0037] In the prior art, the arrangement density of the plurality of liquid guiding holes in the first direction is the same as the arrangement density of the plurality of liquid guiding holes in the second direction. Compared with the prior art, in this application, the arrangement density of the plurality of liquid guiding holes 1113 in the first direction X is greater than the arrangement density of the plurality of liquid guiding holes 1113 in the second direction Y This increases the porosity of the substrate 111 while ensuring the spacing between the liquid guiding holes 1113 in the second direction Y , thereby facilitating to improve the stability of the heating film 112.

[0038] In an implementation, compared with the prior art, the arrangement density of the liquid guiding holes 1113 is increased only in the current flow direction. That is, only the arrangement density of the plurality of liquid guiding holes 1113 in the first direction X is increased, and the arrangement density of the plurality of liquid guiding holes 1113 in the second direction Y is the same as the arrangement density in the prior art.

[0039] It should be noted that, according to the law of resistance, for a same material, resistance is directly proportional to length and inversely proportional to cross-sectional area. Using a conventional full -column manner to increasing the hole density (the conventional method for increasing the hole density is as follow: a plurality of liquid guiding holes are arranged in a plurality of rows and a plurality of columns, with a plurality of liquid guiding holes in a row direction being spaced apart and a plurality of liquid guiding holes in a column direction being spaced apart, while reducing the spacing between neighboring liquid guiding holes in the row direction and the spacing between neighboring liquid guiding holes in the column direction, and the reduced spacing in the row direction is the same as the reduced spacing in the column direction) directly leads to a decrease in the spacing between holes in the row direction (i.e., an increase in hole arrangement density in the row direction ) and a decrease in the spacing between holes in the column direction (i.e., an increase in hole arrangement density in the column direction). If the row direction is the current flow direction and the column direction is perpendicular to the current flow direction, a decrease in the spacing between holes in the column direction will result in a decrease in the cross-sectional area through which the current flows and, in turn, an increase in resistance; the decrease in the cross-sectional area will also reduce the local volume of the heating film. When a constant-power power supply is used for atomizing, a local heat flux will further increase. Consequently, the local temperature of the heating film is excessively high, resulting in cracking of the heating film due to uneven stresses, or in burnout due to excessively high temperatures. In this application, the arrangement density of the liquid guiding holes 1113 is increased only in the current flow direction, such that the arrangement density of the liquid guiding holes 1113 perpendicular to the current flow direction is the same as the arrangement density of the liquid guiding holes in the column direction in the prior art, thereby keeping the cross-sectional area through which the current flows unchanged, and ensuring that the resistance of the heating film 112 remains unchanged while the porosity is increased, with the current distribution density being almost the same as before, thus avoiding the cracking and burnout of the heating film 112 due to excessively high local heat flux.

[0040] In an implementation, compared with the prior art, the arrangement density of the liquid guiding holes 1113 is increased in a current flow direction, and the arrangement density of the liquid guiding holes 1113 is also increased in a direction perpendicular to the current flow direction. For example, the spacing between neighboring liquid guiding holes 1113 in the current flow direction is reduced, and the spacing between neighboring liquid guiding holes 1113 in a direction perpendicular to the current flow direction is also reduced. The reduced spacing in the current flow direction is greater than the reduced spacing in the direction perpendicular to the current flow direction. The reduced spacing in the direction perpendicular to the current flow direction is designed such that the spacing between neighboring liquid guiding holes 1113 in the direction perpendicular to the current flow direction is maintained at a safe value at which the heating film 112 does not easily fail.

[0041] In an implementation, the plurality of liquid guiding holes 1113 are arranged in a plurality of rows and a plurality of columns, a row direction is parallel to the first direction X, and a column direction is parallel to the second direction Y. A plurality of liquid guiding holes 1113 in each row are spaced apart, and a plurality of liquid guiding holes 1113 in each column are spaced apart (as shown in FIG. 5a and FIG. 5b). It should be noted that, the arrangement density of the liquid guiding holes 1113 in the row direction is increased by reducing the spacing between neighboring liquid guiding holes 1113 in each row; and / or the arrangement density of the liquid guiding holes 1113 in the column direction is increased by reducing the spacing between neighboring liquid guiding holes 1113 in each column.

[0042] Optionally, the distance D1 between hole centers of neighboring liquid guiding holes 1113 in each column is greater than or equal to 40 µm and less than or equal to 100 µm. It may be understood that, the distance D1 between hole centers of neighboring liquid guiding holes 1113 in each column is related to the aperture of the liquid guiding hole 1113. The aperture of the liquid guiding hole 1113 is approximately greater than or equal to 20 µm and less than or equal to 50 µm. The distance D1 between hole centers of the neighboring liquid guiding holes 1113 in each column is set to be greater than or equal to 40 µm and less than or equal to 100 µm, to ensure that the neighboring liquid guiding holes 1113 in each column are independent of each other, and to ensure that a part of the heating film 112 between two neighboring rows of liquid guiding holes 1113 has a sufficient width to achieve electrical conduction. For example, the distance D1 between hole centers of neighboring liquid guiding holes 1113 in each column is greater than or equal to 40 µm and less than or equal to 80 µm. For example, the distance D1 between hole centers of neighboring liquid guiding holes 1113 in each column is 50 µm. For example, the distance D1 between hole centers of neighboring liquid guiding holes 1113 in each column is 90 µm.

[0043] Optionally, the distance D2 between hole centers of neighboring liquid guiding holes 1113 in each row is less than or equal to 100 µm. It may be understood that, the distance D2 between hole centers of neighboring liquid guiding holes 1113 in each row is related to the aperture of the liquid guiding hole 1113. The aperture of the liquid guiding hole 1113 is approximately greater than or equal to 20 µm and less than or equal to 50 µm. The distance D2 between hole centers of neighboring liquid guiding holes 1113 in each row is set to be less than or equal to 100 µm, to ensure that the neighboring liquid guiding holes 1113 in each row are independent of each other. The spacing between the neighboring liquid guiding holes 1113 in each row hardly affects the cross-sectional area of the heating film 112 through which the current flows. Therefore, the spacing between the neighboring liquid guiding holes 1113 in each row may be made as small as practicable under process constraints. An excessively large distance D2 between hole centers of the neighboring liquid guiding holes 1113 in each row is not beneficial for increasing the porosity of the substrate 111; reduces liquid supply of the substrate 111; and may prevent the heating film 112 from achieving the required atomization. For example, the distance D2 between hole centers of neighboring liquid guiding holes 1113 in each row is greater than or equal to 30 µm and less than or equal to 90 µm. For example, the distance D2 between hole centers of neighboring liquid guiding holes 1113 in each row is 50 µm. For example, the distance D2 between hole centers of neighboring liquid guiding holes 1113 in each row is 40 µm.

[0044] In an implementation, the plurality of liquid guiding holes 1113 are arranged in a plurality of rows and a plurality of columns, a row direction is parallel to the first direction X, and a column direction is parallel to the second direction Y. At least two of the plurality of liquid guiding holes 1113 in each row are in communication with each other. By in communication with each other means that the liquid guiding holes 1113 are in direct communication. A plurality of liquid guiding holes 1113 in each column are spaced apart (as shown in FIG. 6a to FIG. 8b). It should be noted that, the arrangement density of the liquid guiding holes 1113 in the row direction is increased by making at least two of the plurality of liquid guiding holes 1113 in each row to in communication with each other; and / or the arrangement density of the liquid guiding holes 1113 in the column direction is increased by reducing the spacing between neighboring liquid guiding holes 1113 in each column.

[0045] Optionally, ports of at least two liquid guiding holes 1113 of the plurality of liquid guiding holes 1113 in each row overlap with each other on the atomizing surface 1112, to achieve that at least two liquid guiding holes 1113 are in communication with each other. By ports of the two liquid guiding holes 1113 overlap with each other on the atomizing surface 1112 means that the ports of the two liquid guiding holes 1113 partially overlap on the atomizing surface 1112, such that portions of the two liquid guiding holes 1113 near the atomizing surface 1112 are partially in communication with each other. For example, referring to FIG. 6b, portions of the two liquid guiding holes 1113 above a dashed line L are in communication with each other, and portions of the two liquid guiding holes 1113 below the dashed line L are independent of each other.

[0046] Optionally, a plurality of liquid guiding holes 1113 in each row are divided into a plurality of groups of liquid guiding holes 1113. Each group of liquid guiding holes 1113 includes at least two liquid guiding holes 1113, and all the liquid guiding holes 1113 in each group of liquid guiding holes 1113 are in communication with each other. Ports of two neighboring liquid guiding holes 1113 in each group of liquid guiding holes 1113 overlap with each other on the atomizing surface 1112. Each group of liquid guiding holes 1113 comprises the same number of the liquid guiding holes 1113; and / or the distances between hole centers of neighboring liquid guiding holes 1113 in each group of liquid guiding holes 1113 are the same; and / or among the plurality of groups of liquid guiding holes 1113 into which the plurality of liquid guiding holes 1113 in each row are divided, two neighboring groups of liquid guiding holes 1113 are spaced apart by the same spacing, so as to facilitate processing and ensure uniform liquid supply across the substrate 111. It should be noted that, in each group of the liquid guiding holes 1113 may have different number of the liquid guiding holes 1113, the distances between hole centers of neighboring liquid guiding holes 1113 in each group of the liquid guiding holes 1113 may be different, and the spacings between two neighboring groups of the liquid guiding holes 1113 may be different, which is specifically designed according to requirements.

[0047] Optionally, the distance D1 between hole centers of neighboring liquid guiding holes 1113 in each column is greater than or equal to 40 µm and less than or equal to 100 µm. It may be understood that, the distance D1 between hole centers of neighboring liquid guiding holes 1113 in each column is related to the aperture of the liquid guiding hole 1113. The aperture of the liquid guiding hole 1113 is approximately greater than or equal to 20 µm and less than or equal to 50 µm. The distance D1 between hole centers of the neighboring liquid guiding holes 1113 in each column is set to be greater than or equal to 40 µm and less than or equal to 100 µm, to ensure that the neighboring liquid guiding holes 1113 in each column are independent of each other, and to ensure that a part of the heating film 112 between two neighboring rows of liquid guiding holes 1113 has a sufficient width to achieve electrical conduction. For example, the distance D1 between hole centers of neighboring liquid guiding holes 1113 in each column is greater than or equal to 40 µm and less than or equal to 80 µm. For example, the distance D1 between hole centers of neighboring liquid guiding holes 1113 in each column is 50 µm. For example, the distance D1 between hole centers of neighboring liquid guiding holes 1113 in each column is 90 µm.

[0048] Optionally, a plurality of liquid guiding holes 1113 in each row are divided into a plurality of groups of liquid guiding holes 1113, and the hole center distance between neighboring liquid guiding holes 1113 is less than or equal to 100 µm. The hole center distance between neighboring liquid guiding holes 1113 is greater than or equal to 10 µm. It may be understood that, the distance between hole centers of neighboring liquid guiding holes 1113 in each row is related to the aperture of the liquid guiding hole 1113. The aperture of the liquid guiding hole 1113 is approximately greater than or equal to 20 µm and less than or equal to 50 µm. The distance between hole centers of the neighboring liquid guiding holes 1113 in each row is set to be less than or equal to 100 µm, to ensure that the neighboring liquid guiding holes 1113 in each row may be either independent or overlap, that is, the plurality of liquid guiding holes 1113 in each row may be divided into a plurality of groups of liquid guiding holes 1113, two neighboring groups of liquid guiding holes 1113 are spaced apart, and the plurality of liquid guiding holes 1113 in each group of liquid guiding holes 1113 overlap. The distance between hole centers of neighboring liquid guiding holes 1113 is set to be greater than or equal to 10 µm, such that when the neighboring liquid guiding holes 1113 overlap, the neighboring liquid guiding holes 1113 overlap by at most half.

[0049] The spacing D3 between two neighboring groups of liquid guiding holes 1113 is the spacing between two neighboring liquid guiding holes 1113 between the two groups of liquid guiding holes 1113, and the spacing between the two neighboring groups of liquid guiding holes 1113 is greater than or equal to 30 µm. If the spacing D3 between two neighboring groups of liquid guiding holes 1113 is less than 30 µm, the liquid supply may be excessive, and the heating film 112 may not be able to atomize in time, resulting in liquid leakage and degrading the atomization taste. For example, the pacing D3 between two neighboring groups of liquid guiding holes 1113 is greater than or equal to 30 µm and less than or equal to 90 µm. For example, the spacing D3 between two neighboring groups of liquid guiding holes 1113 is 50 µm. For example, the spacing D3 between two neighboring groups of liquid guiding holes 1113 is 40 µm.

[0050] Optionally, a plurality of liquid guiding holes 1113 in each row are divided into a plurality of groups of liquid guiding holes 113. In each group of liquid guiding holes 1113, the distance between hole centers of neighboring liquid guiding holes 1113 is greater than or equal to 20 µm and less than or equal to 60 µm. It may be understood that, the distance between hole centers of neighboring liquid guiding holes 1113 in each group of liquid guiding holes 1113 affects the porosity of the substrate 111, thereby affecting the liquid supply capability. The distance of hole centers is set to be greater than or equal to 20 µm and less than or equal to 60 µm, such that the substrate 111 has a better liquid supply capability while ensuring the strength of the substrate 111.

[0051] In an implementation, cross-sectional shapes are the same throughout the liquid guiding holes 1113. The cross-sectional area of the liquid guiding hole 1113 gradually decreases in the direction from the atomizing surface 1112 towards the liquid absorbing surface 1111. By cross-section refers to a section taken in a direction parallel to the atomizing surface 1112. Optionally, the cross-sectional shape of the liquid guiding hole 1113 is a circle, and the longitudinal sectional shape of the liquid guiding hole 1113 is an isosceles trapezoid. By longitudinal section refers to a section taken in a direction parallel to the thickness direction of the substrate 111. It should be noted that, at this point, the aperture of the liquid guiding hole 1113 is the aperture of a port of the liquid guiding hole 1113 at the atomizing surface 1112. The distance D1 between hole centers of neighboring liquid guiding holes 1113 in each column is the distance between hole centers of ports of neighboring liquid guiding holes 1113 in each column that are located on the atomizing surface 1112. The distance D2 between hole centers of neighboring liquid guiding holes 1113 in each row is the distance between hole centers of ports of neighboring liquid guiding holes 1113 in each row at the atomizing surface 1112.

[0052] In an implementation, cross-sectional shapes are the same throughout the liquid guiding holes 1113. The cross-sectional area of the liquid guiding hole 1113 is constant in the direction from the atomizing surface 1112 towards the liquid absorbing surface 1111, By cross-section refers to a section taken in a direction parallel to the atomizing surface 1112. Optionally, the cross-sectional shape of the liquid guiding hole 1113 is a circle, and the longitudinal sectional shape of the liquid guiding hole 1113 is a rectangle. By longitudinal section refers to a section taken in a direction parallel to the thickness direction of the substrate 111.

[0053] In an implementation, the liquid absorbing surface 1111 and the atomizing surface 1112 are disposed in parallel, to facilitate processing and assembly.

[0054] In an implementation, the substrate 111 is a dense substrate. Optionally, the material of the substrate 111 is at least one of glass and dense ceramic. It may be understood that, the material of the substrate 111 includes, but is not limited to, glass and dense ceramic, and is specifically designed according to requirements. The substrate 111, made of dense materials such as glass, has a smooth surface, allowing a continuous and stable metal heating film 112 deposited on the surface of the substrate 111 in a manner of physical vaporous deposition or chemical vaporous deposition. The thickness of the heating film 112 is in the range of several micrometers to nanometers, which not only allows the heating assembly 11 to be miniaturized, but also reduces consumption of the heating film 112 material.

[0055] In an implementation, the substrate 111 is a porous substrate. Optionally, the material of the substrate 111 is porous ceramic. Porous ceramic is a type of porous ceramic material with open pore aperture and high open porosity, and prepared by shaping raw materials followed by a special high-temperature sintering process. During the preparation process, porous ceramic forms multiple disordered pores.

[0056] In an implementation, the thickness of the substrate 111 is 0.2 mm to 2.5 mm. When the thickness of the substrate 111 is greater than 2.5 mm, the liquid supply requirement cannot be satisfied, resulting in a decrease in the amount of aerosols and an increase in heat loss, and it is difficult to penetrate the substrate when forming the liquid guiding holes 1113, and the cost of creating the liquid guiding holes 1113 is high. When the thickness of the substrate 111 is less than 0.2 mm, the strength of the substrate 111 cannot be ensured, which is not beneficial for improving the performance of the electronic atomization device. Optionally, the thickness of the substrate 111 is 0.2 mm to 0.5 mm. Optionally, the thickness of the substrate 111 is 0.2 mm to 1 mm.

[0057] In some implementations, the heating film 112 includes a heating portion 1122, a first electrode 1122, and a second electrode 1123. The heating portion 1121 is strip-shaped, and the heating portion 1121 extends linearly in the first direction X. The first electrode 1122 and the second electrode 1123 are respectively disposed at two opposite ends of the heating portion 1121 in the first direction X. For example, the first electrode 1122 is a positive electrode, the second electrode 1123 is a negative electrode, and a current flow direction in the heating portion 1121 is from the first electrode 1122 to the second electrode 1123.

[0058] For example, as shown in FIG. 6a and FIG. 6b, the plurality of liquid guiding holes 1113 are arranged in a plurality of rows and a plurality of columns, a row direction is parallel to the first direction X, and a column direction is parallel to the second direction Y. Two neighboring rows of liquid guiding holes 1113 are spaced apart. A plurality of liquid guiding holes 1113 in each row are divided into a plurality of groups of liquid guiding holes 1113. Each group of liquid guiding holes 1113 includes two liquid guiding holes 1113, and the two liquid guiding holes 1113 in each group of liquid guiding holes 1113 are in communication with each other. The number of liquid guiding holes 1113 in each group of liquid guiding holes 1113 is two. The distance between hole centers of neighboring liquid guiding holes 1113 in each group of liquid guiding holes 1113 is the same. A plurality of liquid guiding holes 1113 in each row are divided into a plurality of groups of liquid guiding holes 1113, and two neighboring groups of liquid guiding holes 1113 are spaced apart by the same spacing. Ports of two liquid guiding holes 1113 in each group of liquid guiding holes 1113 overlap with each other on the atomizing surface 1112, increasing the volumetric porosity and improving the liquid supply effect, thereby facilitating increased atomization, without affecting current flow through the heating film 112 on the atomizing surface 1112. Ports of the two liquid guiding holes 1113 in each group of liquid guiding holes 1113 are spaced from each other on the liquid absorbing surface 1111, helping reduce air backflow during heating and atomization. The cross-sectional shape of the liquid guiding hole 1113 is a circle, and the longitudinal sectional shape of the liquid guiding hole 1113 is an isosceles trapezoid.

[0059] For example, as shown in FIG. 7a and FIG. 7b, the plurality of liquid guiding holes 1113 are arranged in a plurality of rows and a plurality of columns, a row direction is parallel to the first direction X, and a column direction is parallel to the second direction Y. Two neighboring rows of liquid guiding holes 1113 are spaced apart. A plurality of liquid guiding holes 1113 in each row are divided into a plurality of groups of liquid guiding holes 1113. Each group of liquid guiding holes 1113 includes five liquid guiding holes 1113, and the neighboring liquid guiding holes 1113 in each group of liquid guiding holes 1113 are in communication with each other. The number of liquid guiding holes 1113 in each group of liquid guiding holes 1113 is five. The distance between hole centers of neighboring liquid guiding holes 1113 in each group of liquid guiding holes 1113 is the same. The plurality of liquid guiding holes 1113 in each row are divided into a plurality of groups of liquid guiding holes 1113, and two neighboring groups of liquid guiding holes 1113 are spaced apart by the same spacing. Ports of five liquid guiding holes 1113 in each group of liquid guiding holes 1113 overlap with each other on the atomizing surface 1112, increasing the volumetric porosity and improv the liquid supply effect, thereby facilitating increased atomization, without affecting current flow through the heating film 112 on the atomizing surface 1112. The ports of the five liquid guiding holes 1113 in each group of liquid guiding holes 1113 are spaced from each other on the liquid absorbing surface 1111, helping reduce air backflow during heating and atomization. The cross-sectional shape of the liquid guiding hole 1113 is a circle, and the longitudinal sectional shape of the liquid guiding hole 1113 is an isosceles trapezoid.

[0060] For example, as shown in FIG. 8a and FIG. 8b, the plurality of liquid guiding holes 1113 are arranged in a plurality of rows and a plurality of columns, a row direction is parallel to the first direction X, and a column direction is parallel to the second direction Y. Two neighboring rows of liquid guiding holes 1113 are spaced apart. A plurality of liquid guiding holes 1113 in each row are divided into a plurality of groups of liquid guiding holes 1113. Each group of liquid guiding holes 1113 includes twelve liquid guiding holes 1113, and the neighboring liquid guiding holes 1113 in each group of liquid guiding holes 1113 are in communication with each other. The number of liquid guiding holes 1113 in each group of liquid guiding holes 1113 is twelve. The distance between hole centers of neighboring liquid guiding holes 1113 in each group of liquid guiding holes 1113 is the same. The plurality of liquid guiding holes 1113 in each row are divided into a plurality of groups of liquid guiding holes 1113, and two neighboring groups of liquid guiding holes 1113 are spaced apart by the same spacing. Ports of twelve liquid guiding holes 1113 in each group of liquid guiding holes 1113 overlap with each other on the atomizing surface 1112, increasing the volumetric porosity and improving the liquid supply effect, thereby facilitating increased atomization, without affecting current flow through the heating film 112 on the atomizing surface 1112. The ports of the twelve liquid guiding holes 1113 in each group of liquid guiding holes 1113 are spaced from each other on the liquid absorbing surface 1111, helping reduce air backflow during heating and atomization. The cross-sectional shape of the liquid guiding hole 1113 is a circle, and the longitudinal sectional shape of the liquid guiding hole 1113 is an isosceles trapezoid.

[0061] Referring to FIG. 9 and FIG. 10, FIG. 9 is a comparison diagram of the current density distribution of a first test specimen, a second test specimen, and a third test specimen, and FIG. 10 is a comparison diagram of the Joule heat distribution of a first test specimen, a second test specimen, and a third test specimen.

[0062] A substrate in the prior art is defined as a first test specimen. The substrate in the prior art has a plurality of liquid guiding holes, and the plurality of liquid guiding holes are arranged in a plurality of rows and a plurality of columns. Any two neighboring rows of liquid guiding holes are spaced apart, and any two neighboring columns of liquid guiding holes are spaced apart. Any two neighboring rows of liquid guiding holes are spaced apart by the same spacing, any two neighboring columns of liquid guiding holes are spaced apart by the same spacing, and the spacing between two neighboring rows of liquid guiding holes is the same as the spacing between two neighboring columns of liquid guiding holes.

[0063] The porosity is increased by using a conventional method for the substrate in the prior art, and the substrate whose porosity is increased by using the conventional method is defined as a second test specimen. Specifically, the spacing between two neighboring rows of liquid guiding holes is reduced, the spacing between two neighboring columns of liquid guiding holes is reduced at the same time, and other parameters, such as aperture and open hole shape, remain unchanged.

[0064] The substrate in the prior art whose porosity is increased by using the methods in this application is defined as a third test specimen. Specifically, a plurality of liquid guiding holes 1113 in each row are divided into a plurality of groups of liquid guiding holes 1113, each group of liquid guiding holes 1113 includes five liquid guiding holes 1113, and neighboring liquid guiding holes 1113 in each group of liquid guiding holes 1113 are in communication with each other. Meanwhile, the spacing between two neighboring rows of liquid guiding holes is not changed, and other parameters, such as aperture and open hole shape, remain unchanged.

[0065] It can be seen by comparing the current distribution density and the Joule heat distribution of the first test specimen, the second test specimen, and the third test specimen that the methods provided in this application increase the porosity. Despite the increased porosity, the cross-sectional area of the conductive channel between neighboring rows of liquid guiding holes 1113 and the heat flux remain unchanged. Thereby the current distribution density is almost basically the same as that of the first test specimen, and localized excessively high heat flux can be avoided.

[0066] What are described above are only implementations of this application, and do not limit the patent scope of this application. Any equivalent structure or equivalent process transformation made on the basis of the contents of the description and drawings of this application or directly or indirectly applied to other related technical fields is similarly included in the patent protection scope of this application.

Examples

Embodiment Construction

[0021]Technical solutions in embodiments of this application are clearly and completely described below with reference to accompanying drawings in the embodiments of this application. Apparently, the described embodiments are merely some rather than all of the embodiments of this application. All other embodiments derived by a person of ordinary skill in the art based on the embodiments of this application without creative efforts shall fall within the protection scope of this application.

[0022]In the following description, for the purpose of illustration rather than limitation, specific details such as the specific system structure, interface, and technology are proposed to thoroughly understand this application.

[0023]The terms "first", "second", and "third" in this application are merely intended for a purpose of description, and shall not be understood as indicating or implying of relative importance or implicitly indicating the number of indicated technical features. Therefore, ...

CROSS-REFERENCE TO RELATED APPLICATIONS

[0001] This application claims priority to Chinese Patent Application No. 202321202509.5, filed on May 17, 2023, which is incorporated by reference in its entirety.TECHNICAL FIELD

[0002] This application relates to the field of electronic atomization technologies, and in particular, to a heating assembly, an atomizer, and an electronic atomization device.BACKGROUND

[0003] An electronic atomization device consists of components such as a heating assembly, a battery and a control circuit. As a core element of the electronic atomization device, the characteristics of the heating assembly determine the atomization effect and use experience of the electronic atomization device.

[0004] The relatively common atomization method for existing heating assemblies is resistance heating. Specifically, the heating assembly includes a substrate and a heating film disposed on the surface of the substrate. The substrate is provided with through holes, and the through holes is used for guiding an aerosol generating substrate. To improve the porosity of the heating assembly, increasing the density of the through holes is one of the most straightforward methods. However, the existing uniform hole forming methods increase the hole density while the spacing between the holes is reduced, thereby increasing the resistance of the heating film, reducing the stability of the heating film, resulting in a significant increase in failures during operation of the heating assembly.SUMMARY

[0005] A heating assembly, an atomizer, and an electronic atomization device are provided in this application to improve the stability of a heating film while improving the hole density.

[0006] To resolve the foregoing technical problems, a first technical solution provided in this application is to provide a heating assembly applied to an electronic atomization device to atomize an aerosol generating substrate. The heating assembly includes a substrate and a heating film. The substrate includes a liquid absorbing surface and an atomizing surface that are oppositely disposed; the substrate is provided with a plurality of liquid guiding holes that run through the liquid absorbing surface and the atomizing surface. The heating film is disposed on the atomizing surface; the liquid guiding holes extend to the heating film and run through the heating film. A current flow direction in the heating film is defined as a first direction, a direction perpendicular to the current flow direction in the heating film is defined as a second direction. The arrangement density of the plurality of liquid guiding holes in the first direction is greater than the arrangement density of the plurality of liquid guiding holes in the second direction.

[0007] In an implementation, the heating film comprises a heating portion, a first electrode, and a second electrode; the heating portion is strip-shaped, and the heating portion extends linearly in the first direction; and the first electrode and the second electrode are respectively disposed at two opposite ends of the heating portion in the first direction.

[0008] In an implementation, the plurality of liquid guiding holes are arranged in a plurality of rows and a plurality of columns, a row direction is parallel to the first direction, and a column direction is parallel to the second direction; a plurality of liquid guiding holes in each row are spaced apart, a plurality of liquid guiding holes in each column are spaced apart.

[0009] In an implementation, the aperture of the liquid guiding holes is greater than or equal to 20 µm and less than or equal to 50 µm; the distance between hole centers of neighboring liquid guiding holes in each row is less than or equal to 100 µm; and / or the distance between hole centers of neighboring liquid guiding holes in each column is greater than or equal to 40 µm and less than or equal to 100 µm.

[0010] In an implementation, the plurality of liquid guiding holes are arranged in a plurality of rows and a plurality of columns, a row direction is parallel to the first direction, and a column direction is parallel to the second direction; at least two of a plurality of liquid guiding holes in each row are in communication with each other; and a plurality of liquid guiding holes in each column are spaced apart.

[0011] In an implementation, ports of at least two of the plurality of liquid guiding holes in each row overlap with each other on the atomizing surface.

[0012] In an implementation, the plurality of liquid guiding holes in each row are divided into a plurality of groups of liquid guiding holes; each group of liquid guiding holes include at least two liquid guiding holes, and all the liquid guiding holes in each group of liquid guiding holes are in communication with each other.

[0013] In an implementation, each group of liquid guiding holes comprises the same number of the liquid guiding holes; and / or the distances between hole centers of neighboring liquid guiding holes in each group of liquid guiding holes are the same; and / or among the plurality of groups of liquid guiding holes into which the plurality of liquid guiding holes in each row are divided, two neighboring groups of liquid guiding holes are spaced apart by the same spacing.

[0014] In an implementation, the aperture of the liquid guiding holes is greater than or equal to 20 µm and less than or equal to 50 µm; among the plurality of groups of liquid guiding holes into which the plurality of liquid guiding holes in each row are divided, the distance between hole centers of neighboring liquid guiding holes is less than or equal to 100 µm; and / or the distance between hole centers of neighboring liquid guiding holes in each column is greater than or equal to 40 µm and less than or equal to 100 µm.

[0015] In an implementation, the substrate is a dense substrate or a porous substrate.

[0016] In an implementation, the substrate is the dense substrate, and the material of the substrate is at least one of glass and dense ceramic; or the substrate is the porous substrate, and the material of the substrate is porous ceramic. In an implementation, the thickness of the substrate is 0.2 mm to 2.5 mm.

[0017] To resolve the foregoing technical problems, a second technical solution provided in this application is to provide an atomizer. The atomizer includes a liquid storage cavity and a heating assembly. The liquid storage cavity is configured to store an aerosol generating substrate. The heating assembly is in fluid communication with the liquid storage cavity, the heating assembly is configured to atomize the aerosol generating substrate, and the heating assembly is the heating assembly of any one of the foregoing items.

[0018] To resolve the foregoing technical problems, a third technical solution provided in this application is to provide an electronic atomization device. The electronic atomization device includes the atomizer as described above and a main unit. The main unit is configured to supply electric energy for operation of the heating assembly of the atomizer and control the heating assembly of the atomizer to atomize the aerosol generating substrate.

[0019] Beneficial effects of this application are as follow: different from the prior art, this application discloses a heating assembly, an atomizer, and an electronic atomization device. The heating assembly includes a substrate and a heating film The substrate includes a liquid absorbing surface and an atomizing surface that are oppositely disposed, and the substrate is provided with a plurality of liquid guiding holes that run through the liquid absorbing surface and the atomizing surface. The heating film is disposed on the atomizing surface, and the liquid guiding holes extend to the heating film and run through the heating film. A current flow direction in the heating film is defined as a first direction, a direction perpendicular to the current flow direction in the heating film is defined as a second direction, and the arrangement density of the plurality of liquid guiding holes in the first direction is greater than the arrangement density of the plurality of liquid guiding holes in the second direction, thereby ensuring the stability of the heating film while increasing the porosity of the substrate.BRIEF DESCRIPTION OF THE DRAWINGS

[0020] To describe the technical solutions of the embodiments of this application more clearly, the following briefly introduces the accompanying drawings required for describing the embodiments. Apparently, the accompanying drawings in the following description show only some embodiments of this application, and a person of ordinary skill in the art may still derive other drawings from these accompanying drawings without creative efforts. FIG. 1 is a schematic structural diagram of an embodiment of an electronic atomization device provided in this application; FIG. 2 is a schematic structural diagram of an atomizer provided in an embodiment of this application; FIG. 3 is a schematic structural diagram of a heating assembly provided in an embodiment of this application; FIG. 4 is a schematic cross-sectional view of the heating assembly shown in FIG. 3 along a line A-A; FIG. 5a is a schematic partial structural diagram of an implementation of a substrate of the heating assembly shown in FIG. 3; FIG. 5b is a schematic cross-sectional view of the substrate shown in FIG. 5a along a line B-B; FIG. 6a is a schematic partial structural diagram of another implementation of the substrate of the heating assembly shown in FIG. 3; FIG. 6b is a schematic cross-sectional view of the substrate shown in FIG. 6a along a line C-C; FIG. 7a is a schematic partial structural diagram of yet another implementation of the substrate of the heating assembly shown in FIG. 3; FIG. 7b is a schematic cross-sectional view of the substrate shown in FIG. 7a along a line D-D; FIG. 8a is a schematic partial structural diagram of yet another implementation of the substrate of the heating assembly shown in FIG. 3; FIG. 8b is a schematic cross-sectional view of the substrate shown in FIG. 8a along a line E-E; FIG. 9 is a comparison diagram of the current density distribution of a first test specimen, a second test specimen, and a third test specimen; FIG. 10 is a comparison diagram of the Joule heat distribution of a first test specimen, a second test specimen, and a third test specimen. DETAILED DESCRIPTION

[0021] Technical solutions in embodiments of this application are clearly and completely described below with reference to accompanying drawings in the embodiments of this application. Apparently, the described embodiments are merely some rather than all of the embodiments of this application. All other embodiments derived by a person of ordinary skill in the art based on the embodiments of this application without creative efforts shall fall within the protection scope of this application.

[0022] In the following description, for the purpose of illustration rather than limitation, specific details such as the specific system structure, interface, and technology are proposed to thoroughly understand this application.

[0023] The terms "first", "second", and "third" in this application are merely intended for a purpose of description, and shall not be understood as indicating or implying of relative importance or implicitly indicating the number of indicated technical features. Therefore, features defining "first", "second", and "third" can explicitly or implicitly include at least one of the features. In the description of this application, "a plurality of" means at least two, such as two or three, unless otherwise definitely and specifically defined. All directional indications (for example, upper, lower, left, right, front, and back) in the embodiments of this application are only used for explaining relative position relationships, movement situations, or the like between the various components in a specific posture (as shown in the accompanying drawings). If the specific posture changes, the directional indications change accordingly. In the embodiments of this application, the terms "include", "have", and their any variations are intended to cover non-exclusive encompassing. For example, a process, method, system, product, or apparatus that includes a series of steps or units is not limited to the listed steps or units, but further optionally includes a step or unit that is not listed, or further optionally includes another step or component that is intrinsic to the process, method, product, or apparatus.

[0024] "Embodiment" mentioned herein means that specific features, structures, or characteristics described with reference to the embodiment may be included in at least one embodiment of this application. The term appearing at different positions of this specification may not refer to the same embodiment or an independent or alternative embodiment that is mutually exclusive with another embodiment. A person skilled in the art explicitly or implicitly understands that the embodiments described herein can be combined with other embodiments.

[0025] The following describes this application in detail with reference to the accompanying drawings and embodiments.

[0026] With reference to FIG. 1, FIG. 1 is a schematic structural diagram of an embodiment of an electronic atomization device provided in this application.

[0027] In this embodiment, an electronic atomization device 100 is provided. The electronic atomization device 100 may be used for atomizing an aerosol generating substrate. The electronic atomization device 100 includes an atomizer 1 and a main unit 2 that are electrically connected to each other.

[0028] An atomizer 1 is configured to store the aerosol generating substrate and atomize the aerosol generating substrate to form aerosols that can be inhaled by a user. The atomizer 1 may be specifically applied in different fields, such as medical care, cosmetology, and recreational inhalation. In a specific embodiment, the atomizer 1 may be applied to an electronic aerosol generating device for atomizing the aerosol generating substrate and generating aerosols for inhalation by a user. The following embodiments are all described by using the recreational smoking as an example.

[0029] Reference may be made to the specific structure and functions of the atomizer 1 involved in the following embodiments for the specific structure and functions of the atomizer 1, and same or similar technical effects may also be achieved. Details are not described herein again. A main unit 2 includes a battery (not shown) and a controller (not shown). The battery is configured to supply electric energy for operation of the atomizer 1, to enable the atomizer 1 to atomize the aerosol generating substrate to generate aerosols. The controller is configured to control the operation of the atomizer 1, that is, to control the atomizer 1 to atomize the aerosol generating substrate. The main unit 2 further includes other elements such as a battery holder and an airflow sensor.

[0030] The atomizer 1 and the main unit 2 may be integrally arranged or may be detachably connected, which may be designed according to a specific requirement.

[0031] With reference to FIG. 2, FIG. 2 is a schematic structural diagram of an atomizer provided in an embodiment of this application.

[0032] The atomizer 1 includes a housing 10, a heating assembly 11, and an atomization base 12. The atomization base 12 has a mounting cavity (not shown), and the heating assembly 11 is disposed within the mounting cavity. The heating assembly 11 and the atomization base 12 are collectively disposed within the housing 10. The housing 10 is formed with a aerosol outlet channel 13. An inner surface of the housing 10, and an outer surface of the aerosol outlet channel 13, and a top surface of the atomization base 12 cooperate to form a liquid storage cavity 14. The liquid storage cavity 14 is configured to store a liquid aerosol generating substrate. The heating assembly 11 is electrically connected to the main unit 2, to atomize an aerosol generating substrate to generate an aerosol.

[0033] The atomization base 12 includes an upper base 121 and a lower base 122. The upper base 121 and the lower base 122 cooperate to form the mounting cavity. The surface of the heating assembly 11 that faces away from the liquid storage cavity 14 and the cavity wall of the mounting cavity cooperate to form an atomization cavity 120. The upper base 121 is provided with a liquid feeding channel 1211. The aerosol generating substrate in the liquid storage cavity 14 flows into the heating assembly 11 through the liquid feeding channel 1211, that is, the heating assembly 11 is in fluid communication with the liquid storage cavity 14. The lower base 122 is provided with an air inlet channel 15. External air enters the atomization cavity 120 through the air inlet channel 15, carries aerosols atomized by the heating assembly 11, and flows to the aerosol outlet channel 13. A user inhales the aerosols through the port of the aerosol outlet channel 13.

[0034] With reference to FIG. 3 to FIG. 8b, FIG. 3 is a schematic structural diagram of a heating assembly provided in an embodiment of this application. FIG. 4 is a schematic cross-sectional view of the heating assembly shown in FIG. 3 along a line A-A. FIG. 5a is a schematic partial structural diagram of an implementation of a substrate of the heating assembly shown in FIG. 3. FIG. 5b is a schematic cross-sectional view of the substrate shown in FIG. 5a along a line B-B. FIG. 6a is a schematic partial structural diagram of another implementation of the substrate of the heating assembly shown in FIG. 3. FIG. 6b is a schematic cross-sectional view of the substrate shown in FIG. 6a along a line C-C. FIG. 7a is a schematic partial structural diagram of yet another implementation of the substrate of the heating assembly shown in FIG. 3. FIG. 7b is a schematic cross-sectional view of the substrate shown in FIG. 7a along a line D-D. FIG. 8a is a schematic partial structural diagram of yet another implementation of a substrate of the heating assembly shown in FIG. 3. FIG. 8b is a schematic cross-sectional view of the substrate shown in FIG. 8a along a line E-E.

[0035] The heating assembly 11 includes a substrate 111 and a heating film 112. The substrate 111 includes a liquid absorbing surface 1111 and an atomizing surface 1112 that are oppositely disposed. The substrate 111 is provided with a plurality of liquid guiding holes 1113 that run through the liquid absorbing surface 1111 and the atomizing surface 1112, and the liquid guiding holes 1113 have a capillary force. The liquid guiding holes 1113 are configured to guide an aerosol generating substrate from the liquid absorbing surface 1111 to the atomizing surface 1112. The heating film 112 is disposed on the atomizing surface 1112, and the liquid guiding holes 1113 extend to the heating film 112 and extend through the heating film 112. The heating film 112 is configured to heat and atomize the aerosol generating substrate.

[0036] A current flow direction in the heating film 112 is defined as a first direction X, and a direction perpendicular to the current flow direction in the heating film 112 is defined as a second direction Y. The arrangement density of the plurality of liquid guiding holes 1113 in the first direction X is greater than the arrangement density of the plurality of liquid guiding holes 1113 in the second direction Y.

[0037] In the prior art, the arrangement density of the plurality of liquid guiding holes in the first direction is the same as the arrangement density of the plurality of liquid guiding holes in the second direction. Compared with the prior art, in this application, the arrangement density of the plurality of liquid guiding holes 1113 in the first direction X is greater than the arrangement density of the plurality of liquid guiding holes 1113 in the second direction Y This increases the porosity of the substrate 111 while ensuring the spacing between the liquid guiding holes 1113 in the second direction Y , thereby facilitating to improve the stability of the heating film 112.

[0038] In an implementation, compared with the prior art, the arrangement density of the liquid guiding holes 1113 is increased only in the current flow direction. That is, only the arrangement density of the plurality of liquid guiding holes 1113 in the first direction X is increased, and the arrangement density of the plurality of liquid guiding holes 1113 in the second direction Y is the same as the arrangement density in the prior art.

[0039] It should be noted that, according to the law of resistance, for a same material, resistance is directly proportional to length and inversely proportional to cross-sectional area. Using a conventional full -column manner to increasing the hole density (the conventional method for increasing the hole density is as follow: a plurality of liquid guiding holes are arranged in a plurality of rows and a plurality of columns, with a plurality of liquid guiding holes in a row direction being spaced apart and a plurality of liquid guiding holes in a column direction being spaced apart, while reducing the spacing between neighboring liquid guiding holes in the row direction and the spacing between neighboring liquid guiding holes in the column direction, and the reduced spacing in the row direction is the same as the reduced spacing in the column direction) directly leads to a decrease in the spacing between holes in the row direction (i.e., an increase in hole arrangement density in the row direction ) and a decrease in the spacing between holes in the column direction (i.e., an increase in hole arrangement density in the column direction). If the row direction is the current flow direction and the column direction is perpendicular to the current flow direction, a decrease in the spacing between holes in the column direction will result in a decrease in the cross-sectional area through which the current flows and, in turn, an increase in resistance; the decrease in the cross-sectional area will also reduce the local volume of the heating film. When a constant-power power supply is used for atomizing, a local heat flux will further increase. Consequently, the local temperature of the heating film is excessively high, resulting in cracking of the heating film due to uneven stresses, or in burnout due to excessively high temperatures. In this application, the arrangement density of the liquid guiding holes 1113 is increased only in the current flow direction, such that the arrangement density of the liquid guiding holes 1113 perpendicular to the current flow direction is the same as the arrangement density of the liquid guiding holes in the column direction in the prior art, thereby keeping the cross-sectional area through which the current flows unchanged, and ensuring that the resistance of the heating film 112 remains unchanged while the porosity is increased, with the current distribution density being almost the same as before, thus avoiding the cracking and burnout of the heating film 112 due to excessively high local heat flux.

[0040] In an implementation, compared with the prior art, the arrangement density of the liquid guiding holes 1113 is increased in a current flow direction, and the arrangement density of the liquid guiding holes 1113 is also increased in a direction perpendicular to the current flow direction. For example, the spacing between neighboring liquid guiding holes 1113 in the current flow direction is reduced, and the spacing between neighboring liquid guiding holes 1113 in a direction perpendicular to the current flow direction is also reduced. The reduced spacing in the current flow direction is greater than the reduced spacing in the direction perpendicular to the current flow direction. The reduced spacing in the direction perpendicular to the current flow direction is designed such that the spacing between neighboring liquid guiding holes 1113 in the direction perpendicular to the current flow direction is maintained at a safe value at which the heating film 112 does not easily fail.

[0041] In an implementation, the plurality of liquid guiding holes 1113 are arranged in a plurality of rows and a plurality of columns, a row direction is parallel to the first direction X, and a column direction is parallel to the second direction Y. A plurality of liquid guiding holes 1113 in each row are spaced apart, and a plurality of liquid guiding holes 1113 in each column are spaced apart (as shown in FIG. 5a and FIG. 5b). It should be noted that, the arrangement density of the liquid guiding holes 1113 in the row direction is increased by reducing the spacing between neighboring liquid guiding holes 1113 in each row; and / or the arrangement density of the liquid guiding holes 1113 in the column direction is increased by reducing the spacing between neighboring liquid guiding holes 1113 in each column.

[0042] Optionally, the distance D1 between hole centers of neighboring liquid guiding holes 1113 in each column is greater than or equal to 40 µm and less than or equal to 100 µm. It may be understood that, the distance D1 between hole centers of neighboring liquid guiding holes 1113 in each column is related to the aperture of the liquid guiding hole 1113. The aperture of the liquid guiding hole 1113 is approximately greater than or equal to 20 µm and less than or equal to 50 µm. The distance D1 between hole centers of the neighboring liquid guiding holes 1113 in each column is set to be greater than or equal to 40 µm and less than or equal to 100 µm, to ensure that the neighboring liquid guiding holes 1113 in each column are independent of each other, and to ensure that a part of the heating film 112 between two neighboring rows of liquid guiding holes 1113 has a sufficient width to achieve electrical conduction. For example, the distance D1 between hole centers of neighboring liquid guiding holes 1113 in each column is greater than or equal to 40 µm and less than or equal to 80 µm. For example, the distance D1 between hole centers of neighboring liquid guiding holes 1113 in each column is 50 µm. For example, the distance D1 between hole centers of neighboring liquid guiding holes 1113 in each column is 90 µm.

[0043] Optionally, the distance D2 between hole centers of neighboring liquid guiding holes 1113 in each row is less than or equal to 100 µm. It may be understood that, the distance D2 between hole centers of neighboring liquid guiding holes 1113 in each row is related to the aperture of the liquid guiding hole 1113. The aperture of the liquid guiding hole 1113 is approximately greater than or equal to 20 µm and less than or equal to 50 µm. The distance D2 between hole centers of neighboring liquid guiding holes 1113 in each row is set to be less than or equal to 100 µm, to ensure that the neighboring liquid guiding holes 1113 in each row are independent of each other. The spacing between the neighboring liquid guiding holes 1113 in each row hardly affects the cross-sectional area of the heating film 112 through which the current flows. Therefore, the spacing between the neighboring liquid guiding holes 1113 in each row may be made as small as practicable under process constraints. An excessively large distance D2 between hole centers of the neighboring liquid guiding holes 1113 in each row is not beneficial for increasing the porosity of the substrate 111; reduces liquid supply of the substrate 111; and may prevent the heating film 112 from achieving the required atomization. For example, the distance D2 between hole centers of neighboring liquid guiding holes 1113 in each row is greater than or equal to 30 µm and less than or equal to 90 µm. For example, the distance D2 between hole centers of neighboring liquid guiding holes 1113 in each row is 50 µm. For example, the distance D2 between hole centers of neighboring liquid guiding holes 1113 in each row is 40 µm.

[0044] In an implementation, the plurality of liquid guiding holes 1113 are arranged in a plurality of rows and a plurality of columns, a row direction is parallel to the first direction X, and a column direction is parallel to the second direction Y. At least two of the plurality of liquid guiding holes 1113 in each row are in communication with each other. By in communication with each other means that the liquid guiding holes 1113 are in direct communication. A plurality of liquid guiding holes 1113 in each column are spaced apart (as shown in FIG. 6a to FIG. 8b). It should be noted that, the arrangement density of the liquid guiding holes 1113 in the row direction is increased by making at least two of the plurality of liquid guiding holes 1113 in each row to in communication with each other; and / or the arrangement density of the liquid guiding holes 1113 in the column direction is increased by reducing the spacing between neighboring liquid guiding holes 1113 in each column.

[0045] Optionally, ports of at least two liquid guiding holes 1113 of the plurality of liquid guiding holes 1113 in each row overlap with each other on the atomizing surface 1112, to achieve that at least two liquid guiding holes 1113 are in communication with each other. By ports of the two liquid guiding holes 1113 overlap with each other on the atomizing surface 1112 means that the ports of the two liquid guiding holes 1113 partially overlap on the atomizing surface 1112, such that portions of the two liquid guiding holes 1113 near the atomizing surface 1112 are partially in communication with each other. For example, referring to FIG. 6b, portions of the two liquid guiding holes 1113 above a dashed line L are in communication with each other, and portions of the two liquid guiding holes 1113 below the dashed line L are independent of each other.

[0046] Optionally, a plurality of liquid guiding holes 1113 in each row are divided into a plurality of groups of liquid guiding holes 1113. Each group of liquid guiding holes 1113 includes at least two liquid guiding holes 1113, and all the liquid guiding holes 1113 in each group of liquid guiding holes 1113 are in communication with each other. Ports of two neighboring liquid guiding holes 1113 in each group of liquid guiding holes 1113 overlap with each other on the atomizing surface 1112. Each group of liquid guiding holes 1113 comprises the same number of the liquid guiding holes 1113; and / or the distances between hole centers of neighboring liquid guiding holes 1113 in each group of liquid guiding holes 1113 are the same; and / or among the plurality of groups of liquid guiding holes 1113 into which the plurality of liquid guiding holes 1113 in each row are divided, two neighboring groups of liquid guiding holes 1113 are spaced apart by the same spacing, so as to facilitate processing and ensure uniform liquid supply across the substrate 111. It should be noted that, in each group of the liquid guiding holes 1113 may have different number of the liquid guiding holes 1113, the distances between hole centers of neighboring liquid guiding holes 1113 in each group of the liquid guiding holes 1113 may be different, and the spacings between two neighboring groups of the liquid guiding holes 1113 may be different, which is specifically designed according to requirements.

[0047] Optionally, the distance D1 between hole centers of neighboring liquid guiding holes 1113 in each column is greater than or equal to 40 µm and less than or equal to 100 µm. It may be understood that, the distance D1 between hole centers of neighboring liquid guiding holes 1113 in each column is related to the aperture of the liquid guiding hole 1113. The aperture of the liquid guiding hole 1113 is approximately greater than or equal to 20 µm and less than or equal to 50 µm. The distance D1 between hole centers of the neighboring liquid guiding holes 1113 in each column is set to be greater than or equal to 40 µm and less than or equal to 100 µm, to ensure that the neighboring liquid guiding holes 1113 in each column are independent of each other, and to ensure that a part of the heating film 112 between two neighboring rows of liquid guiding holes 1113 has a sufficient width to achieve electrical conduction. For example, the distance D1 between hole centers of neighboring liquid guiding holes 1113 in each column is greater than or equal to 40 µm and less than or equal to 80 µm. For example, the distance D1 between hole centers of neighboring liquid guiding holes 1113 in each column is 50 µm. For example, the distance D1 between hole centers of neighboring liquid guiding holes 1113 in each column is 90 µm.

[0048] Optionally, a plurality of liquid guiding holes 1113 in each row are divided into a plurality of groups of liquid guiding holes 1113, and the hole center distance between neighboring liquid guiding holes 1113 is less than or equal to 100 µm. The hole center distance between neighboring liquid guiding holes 1113 is greater than or equal to 10 µm. It may be understood that, the distance between hole centers of neighboring liquid guiding holes 1113 in each row is related to the aperture of the liquid guiding hole 1113. The aperture of the liquid guiding hole 1113 is approximately greater than or equal to 20 µm and less than or equal to 50 µm. The distance between hole centers of the neighboring liquid guiding holes 1113 in each row is set to be less than or equal to 100 µm, to ensure that the neighboring liquid guiding holes 1113 in each row may be either independent or overlap, that is, the plurality of liquid guiding holes 1113 in each row may be divided into a plurality of groups of liquid guiding holes 1113, two neighboring groups of liquid guiding holes 1113 are spaced apart, and the plurality of liquid guiding holes 1113 in each group of liquid guiding holes 1113 overlap. The distance between hole centers of neighboring liquid guiding holes 1113 is set to be greater than or equal to 10 µm, such that when the neighboring liquid guiding holes 1113 overlap, the neighboring liquid guiding holes 1113 overlap by at most half.

[0049] The spacing D3 between two neighboring groups of liquid guiding holes 1113 is the spacing between two neighboring liquid guiding holes 1113 between the two groups of liquid guiding holes 1113, and the spacing between the two neighboring groups of liquid guiding holes 1113 is greater than or equal to 30 µm. If the spacing D3 between two neighboring groups of liquid guiding holes 1113 is less than 30 µm, the liquid supply may be excessive, and the heating film 112 may not be able to atomize in time, resulting in liquid leakage and degrading the atomization taste. For example, the pacing D3 between two neighboring groups of liquid guiding holes 1113 is greater than or equal to 30 µm and less than or equal to 90 µm. For example, the spacing D3 between two neighboring groups of liquid guiding holes 1113 is 50 µm. For example, the spacing D3 between two neighboring groups of liquid guiding holes 1113 is 40 µm.

[0050] Optionally, a plurality of liquid guiding holes 1113 in each row are divided into a plurality of groups of liquid guiding holes 113. In each group of liquid guiding holes 1113, the distance between hole centers of neighboring liquid guiding holes 1113 is greater than or equal to 20 µm and less than or equal to 60 µm. It may be understood that, the distance between hole centers of neighboring liquid guiding holes 1113 in each group of liquid guiding holes 1113 affects the porosity of the substrate 111, thereby affecting the liquid supply capability. The distance of hole centers is set to be greater than or equal to 20 µm and less than or equal to 60 µm, such that the substrate 111 has a better liquid supply capability while ensuring the strength of the substrate 111.

[0051] In an implementation, cross-sectional shapes are the same throughout the liquid guiding holes 1113. The cross-sectional area of the liquid guiding hole 1113 gradually decreases in the direction from the atomizing surface 1112 towards the liquid absorbing surface 1111. By cross-section refers to a section taken in a direction parallel to the atomizing surface 1112. Optionally, the cross-sectional shape of the liquid guiding hole 1113 is a circle, and the longitudinal sectional shape of the liquid guiding hole 1113 is an isosceles trapezoid. By longitudinal section refers to a section taken in a direction parallel to the thickness direction of the substrate 111. It should be noted that, at this point, the aperture of the liquid guiding hole 1113 is the aperture of a port of the liquid guiding hole 1113 at the atomizing surface 1112. The distance D1 between hole centers of neighboring liquid guiding holes 1113 in each column is the distance between hole centers of ports of neighboring liquid guiding holes 1113 in each column that are located on the atomizing surface 1112. The distance D2 between hole centers of neighboring liquid guiding holes 1113 in each row is the distance between hole centers of ports of neighboring liquid guiding holes 1113 in each row at the atomizing surface 1112.

[0052] In an implementation, cross-sectional shapes are the same throughout the liquid guiding holes 1113. The cross-sectional area of the liquid guiding hole 1113 is constant in the direction from the atomizing surface 1112 towards the liquid absorbing surface 1111, By cross-section refers to a section taken in a direction parallel to the atomizing surface 1112. Optionally, the cross-sectional shape of the liquid guiding hole 1113 is a circle, and the longitudinal sectional shape of the liquid guiding hole 1113 is a rectangle. By longitudinal section refers to a section taken in a direction parallel to the thickness direction of the substrate 111.

[0053] In an implementation, the liquid absorbing surface 1111 and the atomizing surface 1112 are disposed in parallel, to facilitate processing and assembly.

[0054] In an implementation, the substrate 111 is a dense substrate. Optionally, the material of the substrate 111 is at least one of glass and dense ceramic. It may be understood that, the material of the substrate 111 includes, but is not limited to, glass and dense ceramic, and is specifically designed according to requirements. The substrate 111, made of dense materials such as glass, has a smooth surface, allowing a continuous and stable metal heating film 112 deposited on the surface of the substrate 111 in a manner of physical vaporous deposition or chemical vaporous deposition. The thickness of the heating film 112 is in the range of several micrometers to nanometers, which not only allows the heating assembly 11 to be miniaturized, but also reduces consumption of the heating film 112 material.

[0055] In an implementation, the substrate 111 is a porous substrate. Optionally, the material of the substrate 111 is porous ceramic. Porous ceramic is a type of porous ceramic material with open pore aperture and high open porosity, and prepared by shaping raw materials followed by a special high-temperature sintering process. During the preparation process, porous ceramic forms multiple disordered pores.

[0056] In an implementation, the thickness of the substrate 111 is 0.2 mm to 2.5 mm. When the thickness of the substrate 111 is greater than 2.5 mm, the liquid supply requirement cannot be satisfied, resulting in a decrease in the amount of aerosols and an increase in heat loss, and it is difficult to penetrate the substrate when forming the liquid guiding holes 1113, and the cost of creating the liquid guiding holes 1113 is high. When the thickness of the substrate 111 is less than 0.2 mm, the strength of the substrate 111 cannot be ensured, which is not beneficial for improving the performance of the electronic atomization device. Optionally, the thickness of the substrate 111 is 0.2 mm to 0.5 mm. Optionally, the thickness of the substrate 111 is 0.2 mm to 1 mm.

[0057] In some implementations, the heating film 112 includes a heating portion 1122, a first electrode 1122, and a second electrode 1123. The heating portion 1121 is strip-shaped, and the heating portion 1121 extends linearly in the first direction X. The first electrode 1122 and the second electrode 1123 are respectively disposed at two opposite ends of the heating portion 1121 in the first direction X. For example, the first electrode 1122 is a positive electrode, the second electrode 1123 is a negative electrode, and a current flow direction in the heating portion 1121 is from the first electrode 1122 to the second electrode 1123.

[0058] For example, as shown in FIG. 6a and FIG. 6b, the plurality of liquid guiding holes 1113 are arranged in a plurality of rows and a plurality of columns, a row direction is parallel to the first direction X, and a column direction is parallel to the second direction Y. Two neighboring rows of liquid guiding holes 1113 are spaced apart. A plurality of liquid guiding holes 1113 in each row are divided into a plurality of groups of liquid guiding holes 1113. Each group of liquid guiding holes 1113 includes two liquid guiding holes 1113, and the two liquid guiding holes 1113 in each group of liquid guiding holes 1113 are in communication with each other. The number of liquid guiding holes 1113 in each group of liquid guiding holes 1113 is two. The distance between hole centers of neighboring liquid guiding holes 1113 in each group of liquid guiding holes 1113 is the same. A plurality of liquid guiding holes 1113 in each row are divided into a plurality of groups of liquid guiding holes 1113, and two neighboring groups of liquid guiding holes 1113 are spaced apart by the same spacing. Ports of two liquid guiding holes 1113 in each group of liquid guiding holes 1113 overlap with each other on the atomizing surface 1112, increasing the volumetric porosity and improving the liquid supply effect, thereby facilitating increased atomization, without affecting current flow through the heating film 112 on the atomizing surface 1112. Ports of the two liquid guiding holes 1113 in each group of liquid guiding holes 1113 are spaced from each other on the liquid absorbing surface 1111, helping reduce air backflow during heating and atomization. The cross-sectional shape of the liquid guiding hole 1113 is a circle, and the longitudinal sectional shape of the liquid guiding hole 1113 is an isosceles trapezoid.

[0059] For example, as shown in FIG. 7a and FIG. 7b, the plurality of liquid guiding holes 1113 are arranged in a plurality of rows and a plurality of columns, a row direction is parallel to the first direction X, and a column direction is parallel to the second direction Y. Two neighboring rows of liquid guiding holes 1113 are spaced apart. A plurality of liquid guiding holes 1113 in each row are divided into a plurality of groups of liquid guiding holes 1113. Each group of liquid guiding holes 1113 includes five liquid guiding holes 1113, and the neighboring liquid guiding holes 1113 in each group of liquid guiding holes 1113 are in communication with each other. The number of liquid guiding holes 1113 in each group of liquid guiding holes 1113 is five. The distance between hole centers of neighboring liquid guiding holes 1113 in each group of liquid guiding holes 1113 is the same. The plurality of liquid guiding holes 1113 in each row are divided into a plurality of groups of liquid guiding holes 1113, and two neighboring groups of liquid guiding holes 1113 are spaced apart by the same spacing. Ports of five liquid guiding holes 1113 in each group of liquid guiding holes 1113 overlap with each other on the atomizing surface 1112, increasing the volumetric porosity and improv the liquid supply effect, thereby facilitating increased atomization, without affecting current flow through the heating film 112 on the atomizing surface 1112. The ports of the five liquid guiding holes 1113 in each group of liquid guiding holes 1113 are spaced from each other on the liquid absorbing surface 1111, helping reduce air backflow during heating and atomization. The cross-sectional shape of the liquid guiding hole 1113 is a circle, and the longitudinal sectional shape of the liquid guiding hole 1113 is an isosceles trapezoid.

[0060] For example, as shown in FIG. 8a and FIG. 8b, the plurality of liquid guiding holes 1113 are arranged in a plurality of rows and a plurality of columns, a row direction is parallel to the first direction X, and a column direction is parallel to the second direction Y. Two neighboring rows of liquid guiding holes 1113 are spaced apart. A plurality of liquid guiding holes 1113 in each row are divided into a plurality of groups of liquid guiding holes 1113. Each group of liquid guiding holes 1113 includes twelve liquid guiding holes 1113, and the neighboring liquid guiding holes 1113 in each group of liquid guiding holes 1113 are in communication with each other. The number of liquid guiding holes 1113 in each group of liquid guiding holes 1113 is twelve. The distance between hole centers of neighboring liquid guiding holes 1113 in each group of liquid guiding holes 1113 is the same. The plurality of liquid guiding holes 1113 in each row are divided into a plurality of groups of liquid guiding holes 1113, and two neighboring groups of liquid guiding holes 1113 are spaced apart by the same spacing. Ports of twelve liquid guiding holes 1113 in each group of liquid guiding holes 1113 overlap with each other on the atomizing surface 1112, increasing the volumetric porosity and improving the liquid supply effect, thereby facilitating increased atomization, without affecting current flow through the heating film 112 on the atomizing surface 1112. The ports of the twelve liquid guiding holes 1113 in each group of liquid guiding holes 1113 are spaced from each other on the liquid absorbing surface 1111, helping reduce air backflow during heating and atomization. The cross-sectional shape of the liquid guiding hole 1113 is a circle, and the longitudinal sectional shape of the liquid guiding hole 1113 is an isosceles trapezoid.

[0061] Referring to FIG. 9 and FIG. 10, FIG. 9 is a comparison diagram of the current density distribution of a first test specimen, a second test specimen, and a third test specimen, and FIG. 10 is a comparison diagram of the Joule heat distribution of a first test specimen, a second test specimen, and a third test specimen.

[0062] A substrate in the prior art is defined as a first test specimen. The substrate in the prior art has a plurality of liquid guiding holes, and the plurality of liquid guiding holes are arranged in a plurality of rows and a plurality of columns. Any two neighboring rows of liquid guiding holes are spaced apart, and any two neighboring columns of liquid guiding holes are spaced apart. Any two neighboring rows of liquid guiding holes are spaced apart by the same spacing, any two neighboring columns of liquid guiding holes are spaced apart by the same spacing, and the spacing between two neighboring rows of liquid guiding holes is the same as the spacing between two neighboring columns of liquid guiding holes.

[0063] The porosity is increased by using a conventional method for the substrate in the prior art, and the substrate whose porosity is increased by using the conventional method is defined as a second test specimen. Specifically, the spacing between two neighboring rows of liquid guiding holes is reduced, the spacing between two neighboring columns of liquid guiding holes is reduced at the same time, and other parameters, such as aperture and open hole shape, remain unchanged.

[0064] The substrate in the prior art whose porosity is increased by using the methods in this application is defined as a third test specimen. Specifically, a plurality of liquid guiding holes 1113 in each row are divided into a plurality of groups of liquid guiding holes 1113, each group of liquid guiding holes 1113 includes five liquid guiding holes 1113, and neighboring liquid guiding holes 1113 in each group of liquid guiding holes 1113 are in communication with each other. Meanwhile, the spacing between two neighboring rows of liquid guiding holes is not changed, and other parameters, such as aperture and open hole shape, remain unchanged.

[0065] It can be seen by comparing the current distribution density and the Joule heat distribution of the first test specimen, the second test specimen, and the third test specimen that the methods provided in this application increase the porosity. Despite the increased porosity, the cross-sectional area of the conductive channel between neighboring rows of liquid guiding holes 1113 and the heat flux remain unchanged. Thereby the current distribution density is almost basically the same as that of the first test specimen, and localized excessively high heat flux can be avoided.

[0066] What are described above are only implementations of this application, and do not limit the patent scope of this application. Any equivalent structure or equivalent process transformation made on the basis of the contents of the description and drawings of this application or directly or indirectly applied to other related technical fields is similarly included in the patent protection scope of this application.

Examples

Embodiment Construction

[0021]Technical solutions in embodiments of this application are clearly and completely described below with reference to accompanying drawings in the embodiments of this application. Apparently, the described embodiments are merely some rather than all of the embodiments of this application. All other embodiments derived by a person of ordinary skill in the art based on the embodiments of this application without creative efforts shall fall within the protection scope of this application.

[0022]In the following description, for the purpose of illustration rather than limitation, specific details such as the specific system structure, interface, and technology are proposed to thoroughly understand this application.

[0023]The terms "first", "second", and "third" in this application are merely intended for a purpose of description, and shall not be understood as indicating or implying of relative importance or implicitly indicating the number of indicated technical features. Therefore, ...

Claims

1. A heating assembly, applied to an electronic atomization device to atomize an aerosol generating substrate, the heating assembly comprising: a substrate, comprising a liquid absorbing surface and an atomizing surface that are oppositely disposed, wherein the substrate is provided with a plurality of liquid guiding holes that run through the liquid absorbing surface and the atomizing surface; and a heating film, disposed on the atomizing surface, wherein the liquid guiding holes extend to the heating film and run through the heating film; wherein a current flow direction in the heating film is defined as a first direction, a direction perpendicular to the current flow direction in heating film is defined as a second direction, and the arrangement density of the plurality of liquid guiding holes in the first direction is greater than the arrangement density of the plurality of liquid guiding holes in the second direction.

2. The heating assembly of claim 1, wherein the heating film comprises a heating portion, a first electrode, and a second electrode; the heating portion is strip-shaped, and the heating portion extends linearly in the first direction; and the first electrode and the second electrode are respectively disposed at two opposite ends of the heating portion in the first direction.

3. The heating assembly of claim 1, wherein the plurality of liquid guiding holes are arranged in a plurality of rows and a plurality of columns, a row direction is parallel to the first direction, and a column direction is parallel to the second direction; a plurality of liquid guiding holes in each row are spaced apart, a plurality of liquid guiding holes in each column are spaced apart.

4. The heating assembly of claim 3, wherein the aperture of the liquid guiding holes is greater than or equal to 20 µm and less than or equal to 50 µm; the distance between hole centers of neighboring liquid guiding holes in each row is less than or equal to 100 µm; and / or the distance between hole centers of neighboring liquid guiding holes in each column is greater than or equal to 40 µm and less than or equal to 100 µm.

5. The heating assembly of claim 1, wherein the plurality of liquid guiding holes are arranged in a plurality of rows and a plurality of columns, a row direction is parallel to the first direction, and a column direction is parallel to the second direction; at least two of a plurality of liquid guiding holes in each row are in communication with each other; and a plurality of liquid guiding holes in each column are spaced apart.

6. The heating assembly of claim 5, wherein ports of at least two of the plurality of liquid guiding holes in each row overlap with each other on the atomizing surface.

7. The heating assembly of claim 5, wherein the plurality of liquid guiding holes in each row are divided into a plurality of groups of liquid guiding holes; each group of liquid guiding holes comprises at least two liquid guiding holes, and all the liquid guiding holes in each group of liquid guiding holes are in communication with each other.

8. The heating assembly of claim 7, wherein each group of liquid guiding holes comprises the same number of the liquid guiding holes; and / or the distances between hole centers of neighboring liquid guiding holes in each group of liquid guiding holes are the same; and / or among the plurality of groups of liquid guiding holes into which the plurality of liquid guiding holes in each row are divided, two neighboring groups of liquid guiding holes are spaced apart by the same spacing.

9. The heating assembly of claim 7, wherein the aperture of the liquid guiding holes is greater than or equal to 20 µm and less than or equal to 50 µm; among the plurality of groups of liquid guiding holes into which the plurality of liquid guiding holes in each row are divided, the distance between hole centers of neighboring liquid guiding holes is less than or equal to 100 µm; and / or the distance between hole centers of neighboring liquid guiding holes in each column is greater than or equal to 40 µm and less than or equal to 100 µm.

10. The heating assembly of claim 1, wherein the substrate is a dense substrate or a porous substrate.

11. The heating assembly of claim 10, wherein the substrate is the dense substrate, and the material of the substrate is at least one of glass and dense ceramic; or the substrate is the porous substrate, and the material of the substrate is porous ceramic.

12. The heating assembly of claim 1, wherein the thickness of the substrate is 0.2 mm to 2.5 mm.

13. An atomizer, comprising: a liquid storage cavity, configured to store an aerosol generating substrate; and a heating assembly, wherein the heating assembly is in fluid communication with the liquid storage cavity, the heating assembly is configured to atomize the aerosol generating substrate; the heating assembly being the heating assembly of any one of claims 1 to 12.

14. An electronic atomization device, comprising: the atomizer of claim 13; and a main unit, configured to supply electric energy for operation of the heating assembly of the atomizer and control the heating assembly of the atomizer to atomize the aerosol generating substrate.

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