Bond wires for fluid ejection device assemblies

Abstract

A fluid ejection device assembly may include a fluid ejection die and a plurality of bond wires, each wire of the plurality of bond wires electrically connected to the fluid ejection die at a first point of connection and electrically connected to an interface circuit at a second point of connection, the plurality of bond wires to transmit signals between the interface circuit and the die, wherein the plurality of bond wires are covered by encapsulant, the plurality of bond wires engaging a wire support separate from the encapsulant, between the first point of connection and the second point of connection.

Description

BOND WIRES FOR FLUID EJECTION DEVICE ASSEMBLIESBACKGROUND

[0001] Inkjet printing involves depositing ink onto a surface, such as sheet of paper. Print fluid can be stored in a print fluid reservoir until it is used for printing. Print dies may dispense the print fluid for printing.BRIEF DESCRIPTION OF THE DRAWINGS

[0002] FIG. 1 illustrates a fluidic structure assembly of a fluid ejection device assembly.

[0003] FIG. 2 illustrates a close-up view of a portion of FIG. 1.

[0004] FIG. 3 illustrates a cross-section view of the fluidic structure assembly of FIG. 1.

[0005] FIG. 4 illustrates a cross-section view of the fluidic structure assembly of FIG. 1 including an encapsulant.

[0006] FIG. 5 illustrates a perspective view of a plurality of bond wires of an example fluidic structure assembly with the plurality of bond wires unsupported.

[0007] FIG. 6 illustrates a cross-section view of an example fluidic structure assembly with a plurality of bond wires supported by a fluid ejection device.

[0008] FIG. 7 illustrates a cross-section view of an example fluidic structure assembly with a plurality of bond wires supported by an adhesive on top of an edge of a fluid ejection device.

[0009] FIG. 8 illustrates a cross-section view of an example fluidic structure assembly with a plurality of bond wires supported by an adhesive on a corner of a fluid ejection device.

[0010] FIG. 9 illustrates a cross-section view of an example fluidic structure assembly with a plurality of bond wires supported by an adhesive on a bevel of a fluid ejection device.

[0011] FIG. 10 illustrates a cross-section view of an example fluidic structure assembly with a plurality of bond wires supported by tape on top of an edge of a fluid ejection device.

[0012] FIG. 11 illustrates a cross-section view of an example fluidic structure assembly with a plurality of bond wires supported by tape on a comer of a fluid ejection device.

[0013] FIG. 12 illustrates a perspective view of a plurality of bond wires of an example fluidic structure assembly with the plurality of bond wires supported by a support material.

[0014] FIG. 13 is a block diagram illustrating a plurality of bond wires connecting a die and an interface circuit of a fluid ejection device assembly.

[0015] FIG. 14 illustrates a first bond wire and a second bond wire electrically connected to a bond pad of a fluid ejection die.

[0016] FIG. 15 illustrates a single bond wire electrically connected to a bond pad of a fluid ejection die.

[0017] FIG. 16 is a perspective view of the first bond wire and the second bond wire electrically connected to the bond pad of the fluid ejection die of FIG. 14.

[0018] FIG. 17 is a perspective view of the single bond wire electrically connected to the bond pad of the fluid ejection die of FIG. 15.

[0019] FIG. 18 is a top view of the first bond wire and the second bond wire electrically connected to the bond pad of the fluid ejection die of FIG. 14.

[0020] FIG. 19 is a top view of the single bond wire electrically connected to the bond pad of the fluid ejection die of FIG. 15.

[0021] FIG. 20 is a block diagram of a single bond wire electrically connecting a first fluid ejection die, a second fluid ejection die, and an interface circuit of a fluid ejection device assembly.

[0022] FIG. 21 is a block diagram of a first single bond wire electrically connecting at least three dies and an interface circuit of a fluid ejection device assembly.

[0023] The foregoing and other features of the present disclosure will become apparent from the following description and appended claims, taken in conjunction with the accompanying drawings. Understanding that these drawings depict only several examples in accordance with the disclosure and are therefore, not to be considered limiting of its scope, the disclosure will be described with additional specificity and detail through use of the accompanying drawings.DETAILED DESCRIPTION

[0024] In the following detailed description, reference is made to the accompanying drawings, which form a part hereof. In the drawings, similar symbols typically identify similar components, unless context dictates otherwise. The illustrative examples described in the detailed description, drawings, and claims are not meant to be limiting. Other embodiments may be utilized, and other changes may be made, without departing from the spirit or scope of the subject matter presented here. It will be readily understood that the aspects of the present disclosure, as generally described herein, and illustrated in the figures, can be arranged, substituted, combined, and designed in a wide variety of different configurations, all of which are explicitly contemplated and made part of this disclosure.

[0025] This disclosure relates to fluid ejection device assemblies. A fluid ejection device assembly may include a fluid ejection device for dispensing print fluid and a reservoir for storing the print fluid. The print fluid may include any 2D or 3D print agent including ink for printing on a medium such as paper (2D) or (e.g., powdered) build material (3D). The print fluid may include dispensable fluid to be dispensed at relatively high precision (as to volumeand / or location) for fields of implementation other that 2D or 3D imaging, including but not limited to forensic, laboratory or pharmaceutical applications.

[0026] FIG. 1 illustrates a fluidic structure assembly 100 of a fluid ejection device assembly. The fluidic structure assembly 100 includes an interface circuit 110, a fluidic structure 120, and a fluid ejection device 130. The fluidic structure 120 may be a molded interface part between one or more reservoirs of a fluid ejection device assembly and the fluid ejection device 130. The fluidic structure 120 may provide one or more fluid paths to carry print fluid between the one or more reservoirs and respective one or more print dies of the fluid ejection device 130. The fluidic structure 120 may support the fluid ejection device 130. The fluidic structure 120 may support the interface circuit 110, an encapsulant, and a plurality of wires connecting the fluid ejection device 130 and the interface circuit. The combination of the fluidic structure 120, the interface circuit 110, the fluid ejection device, the encapsulant, and the plurality of wires may form the fluidic structure assembly 100.

[0027] The fluid ejection device includes a molded body 132 and fluid ejection dies 134. The fluid ejection dies 134 may be supported by, or partially enclosed within the molded body 132. The fluid ejection dies 134 may each dispense a different color of print fluid. In an example, a first die of the fluid ejection dies 134 dispenses cyan print fluid, a second die of the fluid ejection dies 134 dispenses magenta print fluid, and a third die of the fluid ejection dies 134 dispenses yellow print fluid. In another example, the fluid ejection device includes only one die, which dispenses black print fluid. In yet another example, the fluid ejection device may include two dies. The fluid ejection dies 134 may each include a substrate, thin film circuitry and a nozzle plate. The fluid ejection dies 134 may include drop generators or drop ejectors which may include nozzles in the nozzle plate, resistors in the thin film circuitry to drive drops out of the nozzles, and transistors in the thin film circuitry to activate the resistors. In the examples illustrated in the different figures, a fluid ejection device includesone or more dies embedded in a rigid molded compound. The compound fluid ejection device is attached to a fluidic structure. In other examples, the fluid ejection device may include a single print die with one or more drop generator arrays, not embedded in compound.

[0028] The fluid ejection dies 134 are electrically connected to the interface circuit 110 by a plurality of bond wires 136. In some examples, other wire types or electrical routings can be used instead of bond wires. The plurality of bond wires 136 may extend parallel to each other. In some examples, the fluid ejection dies 134 are electrically connected to each other by the plurality of bond wires 136. In other examples, a single fluid ejection die is connected to the interface circuit 110. The interface circuit 110 may transmit signals between a host controller, for example of a printer, and the at least one fluid ejection die 134. For example, the interface circuit 110 may transmit signals from the host controller to the fluid ejection dies 134 to cause the fluid ejection dies 134 to dispense print fluid, for example fire power, logic power, data signals, analog signals, and more. In certain examples, the interface circuit 110 may also transmit signals from the fluid ejection dies 134 to the host controller, for example analog signals, sensor signals and / or (e.g., analog) data transmissions. At least one ground wire may be included.

[0029] The plurality of bond wires 136 may be an electrically conductive metal, such as gold. The plurality of bond wires 136 may electrically connect bond pads of the fluid ejection dies 134 to contacts of the interface circuit 110. In other examples, wire types other than bond wires could be used to connect the interface circuit to the dies. The bond pads of the fluid ejection dies 134 may be electrically connected to circuitry of the fluid ejection dies 134 to control fluid ejection of the fluid ejection dies 134.

[0030] FIG. 2 illustrates a close-up view of a portion 105 of FIG. 1. The fluid ejection dies 134 may include a first fluid ejection die 134a, a second fluid ejection die 134b, and a third fluid ejection die 134c. The plurality of bond wires 136 may include a first segment 136a, asecond segment 136b, and a third segment 136c. The first segment 136a may connect the first fluid ejection die 134a to the second fluid ejection die 134b. The second segment 136b may connect the second fluid ejection die 134b to the third fluid ejection die 134c. The third segment 136c may connect the third fluid ejection die 134c to the interface circuit 110. First segment 136a, the second segment 136b, and the third segment 136c may each include separate bond wires of the plurality of bond wires 136. In other examples, the first segment 136a, the second segment 136b, and the third segment 136c may be segments of the same bond wire, between respective die bond pads.

[0031] In some examples, the fluid ejection device 130 includes only a single fluid ejection die. The plurality of bond wires 136 thus includes only the third segment to connect the single fluid ejection die to the interface circuit 110.

[0032] FIG. 3 illustrates a cross-section view of the fluidic structure assembly 100 of FIG. 1. A bond wire of the third segment 136c extends from the third fluid ejection die 134c to a contact 112 of the interface circuit 110. The bond wire of the third segment 136c extends over the molded body 132 and does not contact the molded body 132. The bond wire of the third segment 136c is not supported between the third fluid ejection die 134c and the contact 112 of the interface circuit 110.

[0033] FIG. 4 illustrates a cross-section view of the fluidic structure assembly of FIG. 1 including an encapsulant 140. The encapsulant 140 may entirely cover the plurality of bond wires 136. A height of the encapsulant 140 may depend on a height of the plurality of bond wires 136. The encapsulant 140 may protect the plurality of bond wires 136. The encapsulant 140 may contact the interface circuit 110 and cover an exposed portion of the interface circuit110.

[0034] FIG. 5 illustrates a perspective view of a plurality of bond wires 536 of an example fluidic structure assembly with the plurality of bond wires 536 unsupported. The plurality of bond wires 536 may extend parallel to each other. The plurality of bond wires 536 may connect contacts 512 of an interface circuit 510 to fluid ejection dies (not shown). The plurality of bond wires 536 may include a first segment 536a, a second segment 536b, and a third segment 536c. The first segment 536a and the second segment 536b may not be included in some examples. In some examples, the plurality of bond wires 536 includes only the third segment 536c, connecting the interface circuit 110 to a single fluid ejection die for dispensing black print fluid. The third segment 536c does not contact a molded body of a fluid ejection device including the fluid ejection dies. The third segment is not supported between the fluid ejection dies and the contacts 512 of the interface circuit 510, similar to the third segment 136c of the plurality of bond wires 136 of FIG. 3. The plurality of bond wires 536 may be bent. The plurality of bond wires 536 may be bent during the manufacturing process. The third segment 536c may be longer and more susceptible to bending than the first segment 536a and the second segment 536b. As illustrated, a risk could exist that the plurality of bond wires 536 are accidentally moved or bent during manufacturing, in such a way that they accidentally contact each other, causing unintended electrical connections between the plurality of bond wires.

[0035] FIG. 6 illustrates a cross-section view of an example fluidic structure assembly 600 with a plurality of bond wires 636 supported by a molded body 632 of a fluid ejection device 630. The plurality of bond wires includes parallel wires, only one of which is shown in this view. Of course, Fig. 6 is a computer-generated drawing while in the real world the bond wires need not be perfectly parallel. Each bond wire of the plurality of bond wires 636 includes a first segment 636a, a second segment 636b, and a third segment 636c. The first segment 636a connects a first fluid ejection die to a second fluid ejection die, which isconnected to a third fluid ejection die by the second segment 636b. The third segment 636c connects the third fluid ejection die to contacts 612 of an interface circuit 610. The third segment 636c contacts the molded body 632 of the fluid ejection device 630. The molded body 632 may support the third segment 636c of the plurality of bond wires 636. The molded body 632 may be a wire support for the third segments 636c of the parallel adjacent wires. Contacting the molded body 632 may restrict lateral movement of the third segment 636c of the wires. The third segment 636c may be less susceptible to unintended electrical connections between adjacent bond wires than the unsupported third segment 536c of FIG. 5 or the unsupported third segment 136c of FIG. 3. Similarly, a fluid ejection device 630 could comprises a single die or two dies, whereby there is a segment in each of the parallel wires that connects a nearest die to the interface circuit 610, which segment is supported by the molded body 632 like the third segment 632 of Fig. 6, thereby facilitating isolation with respect to the adjacent wires.

[0036] The third segment 636c may be under tension, increasing a force exerted by the third segment 636c on the molded body 632 and further restricting lateral movement of the third segment 636c. The tension in the third segment 636c may exert a force on the third segment 636c towards the molded body 632. The force on the third segment 636c towards the molded body 632 increases a friction between the third segment 636c and the molded body 632. Placing the third segment 636c of the plurality of bond wires 636 under tension may reduce lateral movement and lateral bending of the third segment 636c of the plurality of bond wires 636 and prevent unintended electrical connections between the plurality of bond wires 636.

[0037] In some examples, the wire support includes a support bed including at least one of a compound, adhesive, or tape, as shown in FIGS. 7-11.

[0038] FIG. 7 illustrates a cross-section view of an example fluidic structure assembly 700 with a plurality of bond wires 736 supported by an adhesive 752 on top of an edge of a moldedbody 732 of a fluid ejection device 730. Of course, Fig. 6 is a computer-generated drawing while in the real world the bond wires need not be perfectly parallel. Each bond wire of the plurality of bond wires 736 includes a first segment 736a, a second segment 736b, and a third segment 736c. The first segment 736a connects a first fluid ejection die to a second fluid ejection die, which is connected to a third fluid ejection die by the second segment 736b. The third segment 736c connects the third fluid ejection die to contacts 712 of an interface circuit 710. The third segment 736c contacts the adhesive 752. The third segment 736c may bend over the adhesive 752. The third segment 736c may contact the adhesive 752 adjacent a bend in the third segment 736c. The adhesive 752 may support the third segment 736c of the plurality of bond wires 736. The adhesive 752 may be a wire support or support bed for the third segments 736c of the parallel adjacent wires. Contacting the adhesive 752 may restrict lateral movement of the third segment 736c. The third segment 736c may be less susceptible to unintended electrical connections between adjacent bond wires than the unsupported third segment 536c of FIG. 5 or the unsupported third segment 136c of FIG. 3. Similarly, a fluid ejection device 730 could comprises a single die or two dies, whereby there is a segment in each of the parallel wires that connects a nearest die to the interface circuit 710, which segment is supported by the molded body 732 like the third segment 732 of Fig. 7, thereby facilitating isolation with respect to the adjacent wires.

[0039] The third segment 736c may be under tension, increasing a force exerted by the third segment 736c on the adhesive 752 and further restricting lateral movement of the third segment 736c. The first segment 736a and the second segment 736b may be under tension, restricting lateral movement of the first segment 736a and the second segment 736b, respectively. Placing the plurality of bond wires 736 under tension may reduce lateral movement and bending of the plurality of bond wires and prevent unintended electrical connections between the plurality of bond wires 736. In some examples, the third segment736c contacts the adhesive 752 before the adhesive has fully cured. The third segment 736c may be under tension and press into the partially-cured adhesive 752. The third segment 736c may be partially embedded in the adhesive 752.

[0040] The adhesive 752 may have a different modulus of thermal expansion than the molded body 732. The molded body 732 may expand, causing the plurality of bond wires 736 to break if they are under tension and / or in contact with the molded body 732, as in FIG. 6. The adhesive 752 may have a different modulus of thermal expansion than the molded body to prevent breakage of the plurality of bond wires 736 due to thermal expansion. The adhesive 752 may have a lower modulus of thermal expansion than the molded body 732. The adhesive 752 may be more flexible than the molded body 732, allowing for additional tension in the plurality of bond wires 736 caused by thermal expansion to be taken up by the adhesive 752.

[0041] The adhesive 752 may have different electrical properties than the molded body 732. The adhesive 752 may have a different dielectric property than the molded body. The adhesive 752 may electrically isolate the plurality of bond wires 736 from the molded body 732.

[0042] The plurality of bond wires 736 in FIGS. 7-11 may be covered by an encapsulant similar to the encapsulant 140 of FIG. 4.

[0043] FIG. 8 illustrates a cross-section view of the fluidic structure assembly of FIG. 7, where the adhesive 752 is on a corner of the molded body 732.

[0044] FIG. 9 illustrates a cross-section view of the fluidic structure assembly of FIG. 7, where the adhesive 752 is on a bevel 731 of the molded body 732.

[0045] FIG. 10 illustrates a cross-section view of the fluidic structure assembly of FIG. 7, with the plurality of bond wires 736 supported by tape 754 on the edge of the molded body 732. The tape 754 may be a wire support or support bed similar to the adhesive 752. The tape754 may have a different modulus of thermal expansion than the molded body 732. The tape 754 may have a different modulus of thermal expansion than the molded body to prevent breakage of the plurality of bond wires 736 due to thermal expansion. The tape 754 may have a lower modulus of thermal expansion than the molded body 732. The tape 754 may be more flexible than the molded body 732, allowing for additional tension in the plurality of bond wires 736 caused by thermal expansion to be taken up by the tape 754.

[0046] The tape 754 may have different electrical properties than the molded body 732. The tape 754 may have a different dielectric property than the molded body. The tape 754 may electrically isolate the plurality of bond wires 736 from the molded body 732.

[0047] FIG. 11 illustrates a cross-section view of the fluidic structure assembly of FIG. 7, with the plurality of bond wires 736 supported by tape 754 on a corner of the molded body 732.

[0048] FIG. 12 illustrates a perspective view of a plurality of bond wires 1236 of an example fluidic structure assembly with the plurality of bond wires supported by a support material (not shown). The plurality of bond wires 1236 may extend parallel to each other, at least sufficiently parallel to avoid unintended contact between adjacent wires. The plurality of bond wires 1236 may be supported by a support material to restrict lateral movement and bending of the plurality of bond wires 1236 as in FIGS. 6-11. The plurality of bond wires 1236 may include at least one segment 1236c that is supported by the wire support. In the illustrated example, the wires include a first segment 1236a, a second segment 1236b, and a third segment 1236c, which may be segments of a single wire of the plurality of wires, or in some examples, discrete segments of separate wires. The third segment may connect a fluid ejection die to contacts 1212 of an interface circuit 1210. The third segment 1236c may contact the wire support to prevent lateral movement and bending of the third segment 1236c, as in FIGS. 6-11. The third segment 1236c may have less bending and fewer unintentional electricalconnections than the unsupported third segment 536c of FIG. 5. As said, for an embodiment with one die, a plurality of parallel wires without segments (AKA of each time a single segment) is provided.

[0049] FIG. 13 is a block diagram illustrating a fluid ejection device assembly 1300 including a plurality of bond wires 1336 connecting a fluid ejection die 1332 and an interface circuit 1310 of a fluid ejection device assembly. The plurality of bond wires 1336 may be electrically connected to the fluid ejection die 1332 at a first point of connection 1335 and electrically connected to the interface circuit 1310 at a second point of connection 1312. The first point of connection 1335 may be a bond pad of the fluid ejection die 1332 and the second point of connection 1312 may be a contact of the interface circuit 1310. The plurality of bond wires 1336 may be to transmit signals between the interface circuit 1310 and the fluid ejection die 1332. The interface circuit 1310 may be to transmit signals between the fluid ejection die 1332 and a fluid ejection device such as a printer. The plurality of bond wires 1336 are covered by an encapsulant 1340. The encapsulant 1340 may protect the plurality of bond wires 1336. The plurality of bond wires 1336 may contact a wire support 1350 between the first point of connection 1335 and the second point of connection 1312. The wire support 1350 may be an edge of a molded body, an adhesive on the molded body, or tape on the molded body, as discussed herein.

[0050] FIG. 14 illustrates a side view of a first bond wire 1436a and a second bond wire 1436b electrically connected to a bond pad 1435 of a fluid ejection die 1434. The fluid ejection die 1434 may be electrically connected to other fluid ejection dies and an interface circuit as in FIGS. 1-12. The first bond wire 1436a may connect the fluid ejection die 1434 to another fluid ejection die or an interface circuit. The second bond wire 1436b may connect the fluid ejection die 1434 to another fluid ejection die or an interface circuit. The first bond wire 1436a may be connected to a first bond element 1437a on the bond pad 1435. The secondbond wire 1436b may be connected to a second bond element 1437b on the bond pad 1435. The first bond wire 1436a may be electrically connected to the second bond wire 1436b through the first bond element 1437a, the bond pad 1435, and the second bond element 1437b. The first bond wire 1436a, the first bond element 1437a, the bond pad 1435, the second bond element 1437b, and the second bond wire 1436b may be or include a conductive material, such as gold. The second bond wire 1436b may extend substantially vertically from the second bond element 1437b.

[0051] FIG. 15 illustrates a single bond wire 1536 electrically connected to a bond pad 1535 of a fluid ejection die 1534. The fluid ejection die 1534 may be electrically connected to at least one other fluid ejection die and an interface circuit as in FIGS. 1-14. The single bond wire 1536 may connect at least two fluid ejections dies 1534, and / or to an interface circuit. The single bond wire 1536 may connect three fluid ejection dies 1534 to the interface circuit, such as a fluid ej ection die 1534 to another fluid ej ection die on a first side of the fluid ej ection die 1534 and to another fluid ejection die or an interface circuit on a second side of the fluid ejection die 1534. The single bond wire 1536 may be connected to a single bond element 1537 on the bond pad 1535. The single bond wire 1536 may be electrically connected to the fluid ejection die 1534 through the single bond element 1537 and the bond pad 1535.

[0052] A first angle 1580 between the single bond wire 1536 and the surface of the fluid ejection die 1534 on a first side of the fluid ejection die 1534 may be less than or equal to 60°. A second angle 1590 between the single bond wire 1536 and the surface of the fluid ejection die 1534 on a second, opposite side of the fluid ejection die 1534 may be less than or equal to 60°. The first angle 1580 may be less than the second angle 1590. The first angle 1580 and the second angle 1590 may determine a height of the single bond wire 1536 above the fluid ejection die 1534. The single bond wire 1536 may have a height above the fluid ejection die 1534 lower than a height of the first bond wire 1436a and the second bond wire1436b above the fluid ejection die 1434 of FIG. 14. A lower height of the single bond wire 1536 is advantageous as it allows for use of less encapsulant and allows for a lower encapsulant profile. In an example, a height of an encapsulant covering the single bond wire 1536 may be 115 pm between a fluid ejection die nearest the interface circuit and the interface circuit. The height of the encapsulant covering the single bond wire 1536 may be 175 pm between adjacent fluid ejection dies.

[0053] Furthermore, use of the single bond wire 1536 is advantageous compared to use of the first bond wire 1436a and the second bond wire 1436b of FIG. 14, as use of the single bond wire 1536 requires fewer touchdowns during manufacturing. A touchdown during manufacturing is required to make a bond between a bond wire and a bond element. Use of the single bond wire 1536 reduces the number of touchdowns required, resulting in faster manufacturing, less wear on a machine forming the bonds between the bond wires and the bond elements, and fewer contacts which may damage the fluid ejection dies and / or the bond wires. In an example, a fluid ejection device assembly using segmented bond wires may require one hundred and seventeen touchdowns while a fluid ejection device assembly using single bond wires may require ninety-two touchdowns.

[0054] The single bond wire 1536 may connect multiple fluid ejection dies together and to the interface circuit. In an example, the single bond wire 1536 electrically connects three fluid ejection dies to each other and to the interface circuit. In another example, a plurality of single bond wires extend in parallel to electrically connect three fluid ejection dies to each other and the interface circuit.

[0055] FIG. 16 is a perspective view of the first bond wire 1436a and the second bond wire1436b electrically connected to the bond pad 1435 of the fluid ejection die 1434 of FIG. 14.

[0056] FIG. 17 is a perspective view of the single bond wire 1536 electrically connected to the bond pad 1535 of the fluid ejection die 1534 of FIG. 15.

[0057] FIG. 18 is a top view of the first bond wire 1436a and the second bond wire 1436b electrically connected to the bond pad 1435 of the fluid ejection die 1434 of FIG. 14.

[0058] FIG. 19 is a top view of the single bond wire 1536 electrically connected to the bond pad 1535 of the fluid ejection die 1534 of FIG. 15.

[0059] FIG. 20 is a block diagram of a single bond wire 2036 electrically connecting a first fluid ejection die 2034, a second fluid ejection die 2036, and an interface circuit 2010 of a fluid ejection device assembly. The first fluid ejection die 2034 may include a first die bond pad 2035 electrically connected to first die circuitry 2039 in the first fluid ejection die 2034. The second fluid ejection die 2064 may include a second die bond pad 2065 electrically connected to second die circuitry 2069 in the second fluid ejection die 2064. The interface circuit 2010 may include a contact 2012. The single bond wire 2036 may be electrically connected to the first die bond pad 2035, the second die bond pad 2065, and the contact 2012. Each of the first die bond pad 2035 and the second die bond pad 2065 may include a single bond element to which the single bond wire 2036 is attached. The single bond wire 2036 may contact only a first single bond element of the first die bond pad 2035, a second single bond element of the second die bond pad 2065, an encapsulant, and the contact of the interface circuit. The single bond wire 2036 may be covered in its entirety by the encapsulant.

[0060] The fluid ejection device assembly may include a molded body such as the molded body 732 of FIGS. 7-11. The molded body may support the first fluid ejection die and the second ejection die. The fluid ejection device assembly may include a wire support adjacent an edge of the molded body, such as the wire supports of FIGS. 7-11. The single bond wire 2036 may contact the molded body or the wire support to reduce lateral movement andbending of the single bond wire 2036, as discussed herein. Similarly, the embodiments discussed in FIGS. 1-13 may include a single bond wire instead of separate bond wires making up different segments of an electrical connection.

[0061] FIG. 21 is a block diagram of a first single bond wire 2036 of a plurality of bond wires and a second single bond wire 2066 of the plurality of bond wires electrically connecting at least three dies and an interface circuit 2110 of a fluid ejection device assembly. The first single bond wire 2036 may extend parallel to the second single bond wire 2066. The at least three dies may each include a distal bond pad and a proximal bond pad, where the first single bond pad connects to a first contact of the interface circuit 2110 and the distal bond pad of each of the at least three dies, and where the second single bond wire 2066 connects to a second contact 2114 of the interface circuit 2110 and the proximal bond pad of each of the at least three dies. The at least three dies may include a first fluid ejection die 2134, a second fluid ejection die 2164, and a third fluid ejection die 2174. The first fluid ejection die 2134 may include a first die distal bond pad 2135 and a first die proximal bond pad 2133. The second fluid ejection die 2164 may include a second die distal bond pad 2165 and a second die proximal bond pad 2163. The third fluid ejection die 2174 may include a third die distal bond pad 2175 and a third die proximal bond pad 2173. The first single bond wire 2036 may connect to the first die distal bond pad 2135, the second die distal bond pad 2165, the third die distal bond pad 2175, and the first contact 2112. The second single bond wire 2066 may connect to the first die proximal bond pad 2133, the second die proximal bond pad 2163, the third die proximal bond pad 2173, and the second contact 2114.

[0062] Each of the first die distal bond pad 2135, the second die distal bond pad 2165, and the third die distal bond pad 2175 may include a first single bond element. The first single bond wire 2036 may contact only the first single bond element of the first die distal bond pad 2135, the second die distal bond pad 2165, the third die distal bond pad 2175, the first contact2112, and an encapsulant covering the first single bond wire 2036 in its entirety. The encapsulant may cover the second single bond wire 2066 in its entirety. Each of the first die proximal bond pad 2133, the second die proximal bond pad 2163, and the third die proximal bond pad 2173 may include a second single bond element The second single bond wire 2066 may contact only the second single bond element of the first die proximal bond pad 2133, the second die proximal bond pad 2163, the third die proximal bond pad 2173, the second contact 2114, and the encapsulant.

[0063] In some examples, the fluid ejection device assembly includes a molded body supporting the at least three dies. The first single bond wire 2036 and the second single bond wire 2066 may contact a support bed on an edge of the molded body between a die nearest the interface circuit 2110 of the at least three dies and the interface circuit 2110. The support bed may include at least one of a compound, an adhesive, or tape. The first single bond wire 2036 and the second single bond wire 2066 may bend within the encapsulant between the interface circuit 2110 and the die nearest the interface circuit 2110 without touching the interface circuit or the die at the bend. In an example, the first single bond wire 2036 bends and contacts the support bed between the third die distal bond pad 2175 and the first contact 2112 and the second single bond wire bends and contacts the support bed between the third die proximal bond pad 2173 and the second contact 2114.

[0064] A fluid ejection device assembly may include a fluid ejection die, and a plurality of bond wires, each wire of the plurality of bond wires electrically connected to the fluid ejection die at a first point of connection and electrically connected to an interface circuit at a second point of connection, the plurality of bond wires to transmit signals between the interface circuit and the die, where the plurality of bond wires are covered by encapsulant, the plurality of bond wires engaging a wire support separate from the encapsulant, between the first point of connection and the second point of connection.

[0065] The plurality of bond wires may engage the wire support near an edge of a fluid ejection device that includes the die, and adjacent a bend of the wires. The plurality of bond wires may extend parallel to each other. The wire support may be a molded body to support the die, and the plurality of bond wires may engage the molded body at an edge of the molded body. The wire support may include a support bed including at least one of a compound, adhesive, or tape. The fluid ejection device assembly may also include a molded body to support the die, and the support bed may be located adjacent an edge of the molded body. The support bed may electrically isolate the plurality of bond wires from the molded body. The edge of the molded body may include a bevel. The support bed may have a different modulus of thermal expansion than the molded body. The support bed may have a different dielectric property than the molded body. The wire support may prevent lateral movement of the plurality of bond wires.

[0066] A fluid ejection device assembly may include an interface circuit including a contact, a first bond pad of, and electrically connected to circuitry in, a first fluid ejection die, a second bond pad of, and electrically connected to circuitry in, a second fluid ejection die, and a single bond wire connected to the first die at the first bond pad, the second die at the second bond pad, and the contact of the interface circuit.

[0067] The single bond wire may contact only a first single bond element of the first bond pad, a second single bond element of the second bond pad, an encapsulant, and the contact of the interface circuit. A first angle between the single bond wire and the single second bond pad may be less than or equal to 60 degrees, and a second angle between the single bond wire and the single second bond pad may be less than or equal to 60 degrees. The single bond wire may be covered in its entirety by an encapsulant. The fluid ejection device assembly may include a molded body supporting the first fluid ejection die and the second ejection die, and a wire support adjacent an edge of a molded body.

[0068] A fluid ejection device assembly may include a first single bond wire of a plurality of bond wires, a second single bond wire of the plurality of bond wires, and at least three dies each having a distal bond pad and a proximal bond pad, where the first single bond wire connects to a first contact of an interface circuit and the distal bond pad of each of the at least three dies, and where the second single bond wire connects to a second contact of the interface circuit and the proximal bond pad of each of the at least three dies.

[0069] The first single bond wire and the second single bond wire may extend parallel to each other. Each of the distal bond pads of each of the at least three dies may include a first single bond element, where the first single bond wire contacts only the first single bond element of the distal bond pad of each of each of the at least three dies and an encapsulant, where each of the proximal bond pad of each of the at least three dies includes a second single bond element, and where the second single bond wire contacts only the second single bond element of the proximal bond pad of each of the at least three dies and an encapsulant. The first single bond wire and the second single bond wire may be covered by an encapsulant in their entirety. The fluid ejection device assembly may include a molded body supporting the at least three dies, where the first single bond wire and the second single bond wire contact a wire support other than the encapsulant adjacent an edge of the molded body between, on the one hand, a die nearest the interface circuit of the at least three dies and, on the other hand, the interface circuit. The fluid ejection device assembly may include a molded body supporting the at least three dies, where the first single bond wire and the second single bond wire contact a support bed on an edge of the molded body between, on the one hand, a die nearest the interface circuit of the at least three dies and, on the other hand, the interface circuit. The support bed may include at least one of a compound, an adhesive, or tape. The wires may bend within the encapsulant between the interface circuit and the die without touching the interface circuit or die at the bend.

[0070] The herein described subject matter sometimes illustrates different components contained within, or connected with, different other components. It is to be understood that such depicted architectures are merely exemplary, and that in fact many other architectures can be implemented which achieve the same functionality. In a conceptual sense, any arrangement of components to achieve the same functionality is effectively "associated" such that the desired functionality is achieved. Hence, any two components herein combined to achieve a particular functionality can be seen as "associated with" each other such that the desired functionality is achieved, irrespective of architectures or intermedial components. Likewise, any two components so associated can also be viewed as being "operably connected," or "operably coupled," to each other to achieve the desired functionality, and any two components capable of being so associated can also be viewed as being "operably couplable," to each other to achieve the desired functionality. Specific examples of operably couplable include but are not limited to physically mateable and / or physically interacting components and / or wirelessly interactable and / or wirelessly interacting components and / or logically interacting and / or logically interactable components.

[0071] With respect to the use of substantially any plural and / or singular terms herein, those having skill in the art can translate from the plural to the singular and / or from the singular to the plural as is appropriate to the context and / or application. The various singular / plural permutations may be expressly set forth herein for sake of clarity. For example, recitations of plural elements can be understood to include of the element discussed.

[0072] It will be understood by those within the art that, in general, terms used herein, and especially in the appended claims (e.g., bodies of the appended claims) are generally intended as "open" terms (e.g., the term "including" should be interpreted as "including but not limited to," the term "having" should be interpreted as "having at least," the term "includes" should be interpreted as "includes but is not limited to," etc.). It will be further understood by thosewithin the art that if a specific number of an introduced claim recitation is intended, such an intent will be explicitly recited in the claim, and in the absence of such recitation no such intent is present. For example, as an aid to understanding, the following appended claims may contain usage of the introductory phrases "at least one" and "one or more" to introduce claim recitations. However, the use of such phrases should not be construed to imply that the introduction of a claim recitation by the indefinite articles "a" or "an" limits any particular claim containing such introduced claim recitation to inventions containing only one such recitation, even when the same claim includes the introductory phrases "one or more" or "at least one" and indefinite articles such as "a" or "an" (e.g., "a" and / or "an" should typically be interpreted to mean "at least one" or "one or more"); the same holds true for the use of definite articles used to introduce claim recitations. In addition, even if a specific number of an introduced claim recitation is explicitly recited, those skilled in the art will recognize that such recitation should typically be interpreted to mean at least the recited number (e.g., the bare recitation of "two recitations," without other modifiers, typically means at least two recitations, or two or more recitations). Furthermore, in those instances where a convention analogous to "at least one of A, B, and C, etc." is used, in general such a construction is intended in the sense one having skill in the art would understand the convention (e.g., "a system having at least one of A, B, and C" would include but not be limited to systems that have A alone, B alone, C alone, A and B together, A and C together, B and C together, and / or A, B, and C together, etc.). In those instances where a convention analogous to "at least one of A, B, or C, etc." is used, in general such a construction is intended in the sense one having skill in the art would understand the convention (e.g., "a system having at least one of A, B, or C" would include but not be limited to systems that have A alone, B alone, C alone, A and B together, A and C together, B and C together, and / or A, B, and C together, etc.). It will be further understood by those within the art that virtually any disjunctive word and / or phrasepresenting two or more alternative terms, whether in the description, claims, or drawings, should be understood to contemplate the possibilities of including one of the terms, either of the terms, or both terms. For example, the phrase "A or B" will be understood to include the possibilities of "A" or "B" or "A and B." Further, unless otherwise noted, the use of the words “approximate,” “about,” “around,” “substantially,” etc., mean plus or minus ten percent.

[0073] The foregoing description of illustrative examples has been presented for purposes of illustration and of description. It is not intended to be exhaustive or limiting with respect to the precise form disclosed, and modifications and variations are possible in light of the above teachings or may be acquired from practice of the disclosed embodiments. It is intended that the scope of the invention be defined by the claims appended hereto and their equivalents.

[0074] According to different aspects, the present disclosure may relate to interconnect circuits for connecting print components with host controllers, such as printer ASICs. The interconnect circuits may be any thin circuit, such as a flexible circuit (flex circuit) or a thin or ultra-thin PCB. for example, a flexible circuit could be replaced by a thin PCB. The print component may comprise a fluid ejection device or memory device or any component of a print cartridge. Connecting circuitry of the interconnect circuit may comprise lines, wires, traces or routings or the like. Bonds such as wires such as bond wires may connect electrical interconnect pads of the interconnect circuit to an integrated circuit of the print component.

[0075] In one aspect of this disclosure, a fluid ejection device assembly is provided, the assembly comprising: a fluid ejection die; and a plurality of wires, each wire of the plurality of wires electrically connected to the fluid ejection die at a first point of connection and electrically connected to an interface circuit at a second point of connection, the plurality of wires to transmit signals between the interface circuit and the die. The plurality of wires may be covered by encapsulant. The plurality of wires may engage a wire support separate from the encapsulant, between the first point of connection and the second point of connection.

[0076] In another aspect, a fluid ejection device assembly is provided, comprising: an interface circuit comprising a contact; a first bond pad of, and electrically connected to circuitry in, a first fluid ejection die; and, a second bond pad of, and electrically connected to circuitry in, a second fluid ejection die. A single bond wire may be connected to the first die at the first bond pad, the second die at the second bond pad, and the contact of the interface circuit.

[0077] In another aspect, a fluid ejection device assembly may be provided, comprising: a first single bond wire of a plurality of bond wires; a second single bond wire of the plurality of bond wires; and at least two dies each having a distal bond pad and a proximal bond pad, wherein the first single bond wire connects to a first contact of an interface circuit and the distal bond pad of each of the at least two dies. The second single bond wire may connect to a second contact of the interface circuit and the proximal bond pad of each of the at least two dies.

[0078] Any or any combination of these aspects may be provided with any or any combination of the following features. Each of the following features may be combined into the foregoing aspects, or omitted. The wires may be bond wires or other connective circuitries. The plurality of wires may engage the wire support near an edge of a fluid ejection device that comprises the die, and adjacent a bend of the wires. The plurality of wires may extend parallel to each other, at least approximately. The wire support may be a molded body to support the die. The plurality of wires may engage the molded body at an edge of the molded body. The wire support may comprise a support bed comprising at least one of a compound, adhesive, and / or tape. The fluid ejection device assembly may comprise a molded body to support the die. The support bed may be located adjacent an edge of the molded body. The support bed may electrically isolates the plurality of bond wires from the molded body. The edge of the molded body may comprise a bevel. The support bed may have a differentmodulus of thermal expansion than the molded body. The support bed may have a different dielectric property than the molded body. The wire support may prevent lateral movement of the plurality of wires, lateral with respect to a length direction of the bond wires. The single bond wire may contact the first die only at a first single bond element of the first bond pad and the second die only at a second single bond element of the second bond pad. A first angle between the single bond wire and the first die surface, at a point where the single bond wire touches the single second bond pad, may be less than or equal to 60 degrees. A second angle between the single bond wire and the second die surface, at a point where the single bond wire touches the single second bond pad, may be less than or equal to 60 degrees. The single bond wire may be covered in its entirety by an encapsulant or any suitable compound. The fluid ejection device assembly may comprise a molded body supporting the first fluid ejection die and the second ejection die, and the wire support adjacent an edge of the molded body. The first single bond wire and the second single bond wire may extend parallel to each other. Each of the distal bond pads of each of the at least three dies may include a first single bond element, wherein the first single bond wire contacts each of the at least three dies only at the first single bond element of the distal bond pad of each of each of the at least three dies, wherein each of the proximal bond pad of each of the at least three dies includes a second single bond element, and wherein the second single bond wire contacts each of the at least three dies only at the second single bond element of the proximal bond pad of each of the at least three dies. The first single bond wire and the second single bond wire may be covered by an encapsulant in their entirety. The molded body may supporting the at least three dies, wherein the first single bond wire and the second single bond wire contact a wire support other than the encapsulant adjacent an edge of the molded body between, on the one hand, a die nearest the interface circuit of the at least three dies and, on the other hand, the interface circuit.The molded body may support the at least three dies, wherein the first single bond wireand the second single bond wire contact a support bed on an edge of the molded body between, on the one hand, a die nearest the interface circuit of the at least three dies and, on the other hand, the interface circuit. The support bed may comprise at least one of a compound, an adhesive, and / or tape. The wires may bend within the encapsulant between the interface circuit and the die without touching the interface circuit or die at the bend.

Claims

WHAT IS CLAIMED IS:

1. A fluid ejection device assembly comprising: a fluid ejection die; and a plurality of wires, each wire of the plurality of wires electrically connected to the fluid ejection die at a first point of connection and electrically connected to an interface circuit at a second point of connection, the plurality of wires to transmit signals between the interface circuit and the die, wherein the plurality of wires are covered by encapsulant, the plurality of wires engaging a wire support separate from the encapsulant, between the first point of connection and the second point of connection.

2. The fluid ejection device assembly of claim 1, wherein the wires are bond wires.

3. The fluid ejection device assembly of claim 1 or claim 2, wherein the plurality of wires engage the wire support near an edge of a fluid ejection device that comprises the die, and adjacent a bend of the wires.

4. The fluid ejection device assembly of any of claims 1-3, wherein the plurality of wires extend parallel to each other.

5. The fluid ejection device assembly of any of claims 1 - 4, wherein the wire support is a molded body to support the die, and wherein the plurality of wires engage the molded body at an edge of the molded body.

6. The fluid ejection device assembly of any of claims 1 - 5, wherein the wire support comprises a support bed comprising at least one of a compound, adhesive, and / or tape.

7. The fluid ejection device assembly of claim 6, wherein the fluid ejection device assembly further comprises a molded body to support the die, and wherein the support bed is located adjacent an edge of the molded body.

8. The fluid ejection device assembly of claim 6 or claim 7, wherein the support bed electrically isolates the plurality of bond wires from the molded body.

9. The fluid ejection device assembly of any of claims 5-8, wherein the edge of the molded body comprises a bevel.

10. The fluid ejection device assembly of any of claims 6-9 , wherein the support bed has a different modulus of thermal expansion than the molded body.

11. The fluid ejection device assembly of any of claims 6-10, wherein the support bed has a different dielectric property than the molded body.

12. The fluid ejection device assembly of any of claims 1-11, wherein the wire support prevents lateral movement of the plurality of wires, lateral with respect to a length direction of the bond wires.

13. A fluid ejection device assembly comprising: an interface circuit comprising a contact; a first bond pad of, and electrically connected to circuitry in, a first fluid ejection die; a second bond pad of, and electrically connected to circuitry in, a second fluid ejection die; and a single bond wire connected to the first die at the first bond pad, the second die at the second bond pad, and the contact of the interface circuit.

14. The fluid ejection device assembly of claim 13, wherein the single bond wire contacts the first die only at a first single bond element of the first bond pad and the second die only at a second single bond element of the second bond pad.

15. The fluid ejection device assembly of claim 13 or claim 14, wherein a first angle between the single bond wire and the first die surface, at a point where the single bond wire touches the single second bond pad, is less than or equal to 60 degrees, and wherein a second angle between the single bond wire and the second die surface, at a point where the single bond wire touches the single second bond pad, is less than or equal to 60 degrees.

16. The fluid ejection device assembly of any of claims 13-15, wherein the single bond wire is covered in its entirety by an encapsulant.

17. The fluid ejection device assembly of any of claims 13 - 16, further comprising a molded body supporting the first fluid ejection die and the second ejection die, and a wire support adjacent an edge of the molded body, of any of the claims 1 - 12.

18. A fluid ejection device assembly comprising: a first single bond wire of a plurality of bond wires; a second single bond wire of the plurality of bond wires; and at least two dies each having a distal bond pad and a proximal bond pad, wherein the first single bond wire connects to a first contact of an interface circuit and the distal bond pad of each of the at least two dies, and wherein the second single bond wire connects to a second contact of the interface circuit and the proximal bond pad of each of the at least two dies.

19. The fluid ejection device assembly of claim 18, wherein the first single bond wire and the second single bond wire extend parallel to each other.

20. The fluid ejection device assembly of claim 18 or claim 19, wherein each of the distal bond pads of each of the at least three dies includes a first single bond element, wherein the first single bond wire contacts each of the at least three dies only at the first single bond element of the distal bond pad of each of each of the at least three dies, wherein each of the proximal bond pad of each of the at least three dies includes a second single bond element, and wherein the second single bond wire contacts each of the at least three dies only at the second single bond element of the proximal bond pad of each of the at least three dies.

21. The fluid ejection device assembly of any of claims 18-20, wherein the first single bond wire and the second single bond wire are covered by an encapsulant in their entirety.

22. The fluid ejection device assembly of any of claims 18-21, further comprising a molded body supporting the at least three dies, wherein the first single bond wire and the second single bond wire contact a wire support other than the encapsulant adjacent an edge of the molded body between, on the one hand, a die nearest the interface circuit of the at least three dies and, on the other hand, the interface circuit.

23. The fluid ejection device assembly of any of claims 18-21, further comprising a molded body supporting the at least three dies, wherein the first single bond wire and the second single bond wire contact a support bed on an edge of the molded body between, on the one hand, a die nearest the interface circuit of the at least three dies and, on the other hand, the interface circuit.

24. The fluid ejection device assembly of claim 23, wherein the support bed comprises at least one of a compound, an adhesive, and / or tape.

25. The fluid ejection device assembly of any of claims 18-24, wherein the wires bend within the encapsulant between the interface circuit and the die without touching the interface circuit or die at the bend.

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