Systems, methods, and apparatuses for carbon dioxide capture

EP4743200A2Pending Publication Date: 2026-05-20CORNING INC
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Patent Information

Authority / Receiving Office
EP · EP
Patent Type
Applications
Current Assignee / Owner
CORNING INC
Filing Date
2024-07-08
Publication Date
2026-05-20

AI Technical Summary

Technical Problem

Current carbon dioxide capture technologies using gas adsorption require multiple stages and recycling, leading to complexity and inefficiency in CO2 desorption, often damaging sorbents due to ineffective desorption methods.

Method used

A system utilizing a honeycomb substrate with an adsorbent material and a heat transfer fluid conduit for indirect heating, allowing for efficient CO2 desorption without direct steam contact, which reduces sorbent degradation and enhances cycle efficiency.

Benefits of technology

The system enables efficient CO2 capture and desorption with reduced sorbent damage, improving the overall carbon dioxide capture process by using indirect heating through a heat transfer fluid conduit, enhancing the number of adsorption/desorption cycles and maintaining sorbent integrity.

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Abstract

According to one or more other aspects of the present disclosure, an apparatus for CO2 capture includes a honeycomb substrate including an inlet end, an outlet end, and walls defining channels. An outer surface of the honeycomb substrate is impermeable to heat transfer fluid contacting the outer surface. Adsorbent material is disposed within the channels, a gas inlet in fluid communication with the inlet end, a gas outlet in fluid communication with the outlet end, and a housing surrounding the honeycomb substrate, the housing having housing walls spaced apart from the outer surface of the honeycomb substrate to define a heat transfer fluid conduit. The heat transfer fluid conduit is fluidly isolated from the channels, the gas inlet, and the gas outlet. Also, a heat transfer fluid inlet and a heat transfer fluid outlet, both in fluid communication with the heat transfer fluid conduit.
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Description

SYSTEMS, METHODS, AND APPARATUSES FOR CARBON DIOXIDE CAPTURECROSS-REFERENCE TO RELATED APPLICATIONS

[0001] This application claims the benefit of priority under 35 U.S.C. §119 of U.S. Provisional Application Serial No. 63 / 525,744 filed on July 10, 2023, the content of which is relied upon and incorporated herein by reference in its entirety.FIELD OF THE DISCLOSURE

[0002] The present specification generally relates to systems, methods, and apparatuses for capturing carbon dioxide (CO2) from a gas stream and, more specifically, to systems, methods and apparatuses that include honeycomb structures and adsorbents for adsorbing CO2.BACKGROUND

[0003] Various technologies are currently being used and / or developed to improve the capture of CO2 from gas streams, such as ambient air or process gas streams. Such technologies include, for example, a liquid amine (MEA or KS-1) process, a chilled ammonia process, and gas membranes. Various gas membrane and adsorption technologies are currently employed for the removal of CO2 from gas streams. Systems utilizing gas adsorption technologies require multiple stages and / or recycling in order to achieve the desired amount of CO2 separation. These multiple stages and / or recycling add significant complexity to the CO2 recovery process; once CO2 has been adsorbed by a sorbent, the CO2 must then be desorbed from the sorbent in order for CO2 to be adsorbed in subsequent cycles. However, typical methods for the desorption of CO2 are ineffective, and often result in damage of the sorbent.SUMMARY

[0004] Accordingly, there is an ongoing need for systems, methods, and apparatuses for carbon dioxide capture. Additionally, there may be a need for heating adsorbent materials for the desorption of CO2. A first aspect disclosed herein may be directed to an apparatus for CO2 capture. The apparatus may include at least one honeycomb substrate including an inlet end, an outlet end, and walls defining a plurality of channels extending through the at least one honeycomb substrate from the inlet end to the outlet end, wherein the at least one honeycomb substrate may satisfy the following equation 1 :kso may be a thermal conductivity of a material of construction of the at least one honeycomb substrate, psmay be a solid material density of the material of construction, and cpsmay be a heat capacity of the material of construction. An outer surface of the at least one honeycomb substrate may be impermeable to a heat transfer fluid contacting the outer surface. The apparatus may also include an adsorbent material disposed within each of the plurality of channels of the at least one honeycomb substrate, a gas inlet in fluid communication with the inlet end of the at least one honeycomb substrate, a gas outlet in fluid communication with the outlet end of the at least one honeycomb substrate, and a housing surrounding the at least one honeycomb substrate. The housing may have housing walls spaced apart from at least a portion of the outer surface of the at least one honeycomb substrate to define a heat transfer fluid conduit disposed between the housing walls and the outer surface of the at least one honeycomb substrate, wherein the heat transfer fluid conduit may be fluidly isolated from the plurality of channels, the gas inlet, and the gas outlet. The apparatus may also include a heat transfer fluid inlet and a heat transfer fluid outlet, both of which may be in fluid communication with the heat transfer fluid conduit.

[0005] A second aspect of the present disclosure may include the first aspect, wherein the material of construction of the at least one honeycomb substrate may comprise a metal, high purity alumina, silicon carbide, or combinations thereof.

[0006] A third aspect of the present disclosure may include either one of the first or second aspects, wherein the material of construction of the at least one honeycomb substrate may comprise greater than or equal to 90% of a material selected from the group of a metal, high purity alumina, silicon carbide, or combinations thereof.

[0007] A fourth aspect of the present disclosure may include any one of the first through third aspects, wherein the material of construction of the at least one honeycomb substrate may comprise at least one metal.

[0008] A fifth aspect of the present disclosure may include the fourth aspect, wherein the at least one metal may comprise aluminum, magnesium, or combinations thereof.

[0009] A sixth aspect of the present disclosure may include any one of the first through fifth aspects, wherein the plurality of channels of the at least one honeycomb substrate may beparallel to one another and extend in a straight line from the inlet end to the outlet end of the at least one honeycomb substrate.

[0010] A seventh aspect of the present disclosure may include any one of the first through sixth aspects, wherein the plurality of channels may be open at both the inlet end and the outlet end of the at least one honeycomb substrate.

[0011] An eighth aspect of the present disclosure may include any one of the first through seventh aspects, wherein an open frontal area of the inlet end of the at least one honeycomb substrate may be greater than or equal to 50% of a total frontal area.

[0012] A ninth aspect of the present disclosure may include any one of the first through eighth aspects, wherein the at least one honeycomb substrate may have a cell density of from 5 cells per square inch (cpsi) to 1000 cpsi, wherein the cell density may refer to the number of the plurality of channels per square inch of the inlet end of the at least one honeycomb substrate.

[0013] A tenth aspect of the present disclosure may include any one of the first through ninth aspects, wherein the outer surface of the at least one honeycomb substrate may have a permeability of less than 10% for the heat transfer fluid contacting the outer surface.

[0014] An eleventh aspect of the present disclosure may include any one of the first through tenth aspects, wherein the material of construction may be a porous material and the outer surface of the at least one honeycomb may comprise a skin layer. The skin layer may be impermeable to the heat transfer fluid contacting the outer surface.

[0015] A twelfth aspect of the present disclosure may include the eleventh aspect, wherein the skin layer may comprise an organic or inorganic material comprising a fluoropolymer, a silicone, a silicate, or combinations thereof. The skin layer may remain solid at temperatures of up to 200 °C.

[0016] A thirteenth aspect of the present disclosure may include either one of the eleventh or twelfth aspects, wherein the skin layer may comprise polytetrafluoroethylene.

[0017] A fourteenth aspect of the present disclosure may include any one of the first through thirteenth aspects, wherein the adsorbent material may be bonded to interior surfaces of the walls of the at least one honeycomb substrate.

[0018] A fifteenth aspect of the present disclosure may include any one of the first through fourteenth aspects, wherein the adsorbent material may be selected from the group consisting of zeolites, activated carbon, silica or alumina gels, mesoporous silica, carbonates, metalorganic frameworks (MOF), amine-functionalized organic materials, amine-functionalized inorganic materials, and combinations thereof.

[0019] A sixteenth aspect of the present disclosure may include any one of the first through fifteenth aspects, wherein the adsorbent material may comprise an amine-functionalized organic materials that may be selected from the families of primary, secondary and tertiary amines, a styrene-divinylbenzene based amine, or combinations thereof.

[0020] A seventeenth aspect of the present disclosure may include any one of the first through sixteenth aspects, wherein the adsorbent material may comprise an amine- functionalized organic materials selected from the families of primary, secondary and tertiary amines, such as branched poly(ethylenimine) (PEI), linear poly(ethylenimine) (PEI-ln), poly(allylamine) (PAA), and tetraethylenepentamine (TEPA), monoethanolamine (MEA), diethanolamine (DEA), diethylentriamine, triethylenetetramine, pentaethylenehexamine (PEHA), and 1,6-diaminohexane, cyclic amines, such as hexam ethyl enimine, piperazine, and 4-amino-2-hydroxy-6-methylpyrimidine, aminopropyl trimethoxysilane (APS), methylaminopropyl trimethoxysilane (MAPS), dimethylaminopropyl trimethoxysilane (DMAPS), N-[3 -(trimethoxy silyl)propyl] ethylenediamine (ED), N-(3 -trimethoxy silylpropyl) di ethylenetriamine (DT), and N-(3 -trimethoxy silylpropyl) tri ethylenetetramine (TREN), monoethanolamine (MEA), diethanolamine (DEA), a styrene-divinylbenzene based amine, or combinations thereof.

[0021] An eighteenth aspect of the present disclosure may include any one of the first through seveenteenth aspects, comprising a plurality of honeycomb substrates that may be arranged side-by-side to form a honeycomb stack, wherein the plurality of channels of each of the plurality of honeycomb substrates may be parallel to each other.

[0022] A nineteenth aspect of the present disclosure may include the eighteenth aspect, further comprising a resilient layer disposed between each of the plurality of honeycomb substrates in the honeycomb stack, wherein the resilient layer may form a seal between each of the plurality of honeycomb substrates in the honeycomb stack.

[0023] A twentieth aspect of the present disclosure may include either one of the eighteenth or nineteenth aspects, further comprising a plurality of honeycomb stacks that may be arranged side-by-side, wherein the plurality of honeycomb stacks may be spaced apart from one another.

[0024] A twenty-first aspect of the present disclosure may include the twentieth aspect, further comprising one or more spacers that may be disposed between each of the plurality ofhoneycomb stacks, wherein the one or more spacers may seal the space between each honeycomb stack.

[0025] A twenty-second aspect of the present disclosure may include the twenty-first aspect, wherein the one or more spacers may comprise a first spacer comprising an elongated seal that may be oriented perpendicular to the plurality of channels and disposed proximate to the inlet end of the plurality of honeycomb substrate and a second spacer comprising an elongated seal that may be oriented perpendicular to the plurality of channels and disposed proximate the outlet end of the plurality of honeycomb substrates. The second spacer may be spaced apart from the first spacer.

[0026] A twenty -third aspect of the present disclosure may include any one of the first through twenty-second aspects, comprising at least one module comprising a plurality of honeycomb stacks that may be arranged side-by-side and spaced apart from one another, wherein each of the plurality of honeycomb stacks may comprise a plurality of the honeycomb substrates stacked one on top of the other with the plurality of channels of the plurality of honeycomb substrates parallel to one another. The housing may surround all of the plurality of honeycomb stacks. A plurality of heat transfer fluid conduits may be defined between each of the honeycomb stacks and between the plurality of honeycomb stacks and the housing wall of the housing and the housing may fluidly isolate the plurality of heat transfer fluid conduits from the plurality of channels passing through each of the plurality of honeycomb substrates.

[0027] A twenty -fourth aspect of the present disclosure may include the twenty -third aspect, wherein the plurality of heat transfer fluid conduits may be oriented to provide cross-flow of the heat transfer fluid relative to flow of gases through the plurality of channels extending through the plurality of honeycomb substrates.

[0028] A twenty-fifth aspect of the present disclosure may include either one of the twenty- third aspect or the twenty-fourth aspect, wherein the heat transfer fluid inlet may comprise a heat transfer fluid inlet plenum shaped to direct heat transfer fluid to the plurality of heat transfer fluid conduits and the heat transfer fluid outlet may comprise a heat transfer fluid outlet plenum shaped to receive heat transfer fluid from the plurality of heat transfer fluid conduits.

[0029] A twenty-sixth aspect of the present disclosure may include any one of the twenty- third through twenty-fifth aspects, comprising a plurality of modules that may be arranged in parallel.

[0030] A twenty-seventh aspect of the present disclosure may include the twenty-sixth aspect, wherein the apparatus may further comprise a heat transfer fluid manifold in fluid communication with the heat transfer fluid inlet of each of the modules and a gas inlet manifold in fluid communication with the gas inlet of each of the plurality of modules.

[0031] A twenty-eighth aspect of the present disclosure may include any one of the first through twenty-seventh aspects, further comprising at least one inlet gas flow control device that may be disposed upstream of the inlet end of the at least one honeycomb substrate, wherein the at least one inlet gas flow control device may be operable to control flow of gas between the gas inlet and the plurality of channels of the at least one honeycomb substrate. The apparatus may further include at least one outlet gas flow control device that may be disposed downstream of the outlet end of the at least one honeycomb substrate, wherein the at least one outlet gas flow control device may be operable to control flow of gases between the gas inlet outlet and the plurality of channels of the at least one honeycomb substrate.

[0032] A twenty-ninth aspect of the present disclosure may include the twenty-eighth aspect, wherein the at least one inlet gas flow control device, the at least one outlet gas flow control device, or both may comprise at least one shutter and an actuator that may be operable to transition the at least one shutter between an open position and a closed position.

[0033] A thirtieth aspect of the present disclosure may include either one of the twentyeighth or twenty-ninth aspect, wherein the at least one inlet gas flow control device may be spaced apart from the inlet end of the at least one honeycomb substrate and the at least one outlet gas flow control device may be spaced apart from the outlet end of the at least one honeycomb substrate.

[0034] A thirty-first aspect of the present disclosure may include the thirtieth aspect, wherein the plurality of channels of the at least one honeycomb substrate may define a substrate volume. The housing, the at least one inlet gas flow control device in a closed position, and the inlet end of the at least one honeycomb substrate may define an inlet gas volume. The housing, the at least one outlet gas flow control device in a closed position, and the outlet end of the at least one honeycomb substrate may define an outlet gas volume. A sum of the inlet gas volume and the outlet gas volume may be less than or equal to 40% of the substrate volume, less than or equal to 30% of the substrate volume, or even less than or equal to 20% of the substrate volume.

[0035] A thirty-second aspect of the present disclosure may include the thirty-first aspect, further comprising a desorbate line that may be in fluid communication with the inlet gas volume, the outlet gas volume, or both. Also included may be a vacuum system in fluid communication with the desorbate line.

[0036] A thirty-third aspect of the present disclosure may include the thirty-second aspect, further comprising a purge gas inlet that may be in fluid communication with the inlet gas volume, the outlet gas volume, or both, wherein the purge gas inlet may be fluidly coupled to a purge gas source.

[0037] A thirty-fourth aspect of the present disclosure may include any one of the first through thirty -third aspects, further comprising a suction fan that may be fluidly coupled to the gas outlet and operable to move gas through the plurality of channels in the at least one honeycomb substrate.

[0038] A thirty-fifth aspect of the present disclosure may include any one of the first through thirty-fourth aspects, and a control system comprising at least one processor, at least one memory module, and machine readable and executable instructions stored on the at least one processor.

[0039] A thirty-sixth aspect of the present disclosure may include the thirty-fifth aspect, wherein the apparatus may comprise at least one inlet gas flow control device that may be disposed upstream of the inlet end of the at least one honeycomb substrate, at least one outlet gas flow control device that may be disposed downstream of the outlet end of the at least one honeycomb substrate, a suction fan that may be coupled to the gas outlet, a heat transfer fluid flow control valve, and a desorbate line comprising a desorbate control valve and a vacuum system. The at least one inlet gas flow control device, the at least one outlet gas flow control device, the fan, the heat transfer fluid flow control valve, the desorbate control valve, and the vacuum system may be communicatively coupled to the control system. The machine readable and executable instructions, when executed by the at least one processor, may cause the system to automatically transition the at least one inlet gas flow control device and the at least one outlet gas flow control device to open positions, operate the suction fan to cause gas to flow through the plurality of channels of the at least one honeycomb substrate, where the adsorbent material may adsorb carbon dioxide from the gas as the gas passes through the plurality of channels. The machine readable and executable instructions may also cause the system to automatically transition the at least one inlet gas flow control device and the at least one outletgas flow control device to closed positions, cease operation of the fan, and transition the heat transfer fluid control valve to an open position to pass heat transfer fluid through the at least one heat transfer fluid conduit. The heat transfer fluid may heat the adsorbent material to desorb CO2 from the adsorbent material and following desorption, may transition the desorbate control valve to an open position and operate the vacuum system to withdraw desorbed CO2 from the apparatus.

[0040] A thirty-seventh aspect of the present disclosure may include the thirty-sixth aspect, wherein the machine readable and executable instructions, when executed by the at least one processor, may cause the system to automatically after withdrawal of the desorbed CO2, close the desorbate control valve, close the heat transfer fluid control valve, open the inlet gas flow control device, open the outlet gas flow control device, and operate the suction fan to resume flow of the gas through the at least one honeycomb substrate.

[0041] A thirty-eighth aspect of the present disclosure may include any one of the thirtyfifth through thirty-seventh aspects, further comprising a plurality of modules, wherein each of the plurality of modules comprises the apparatus of the first aspect. Each of the plurality of modules may be communicatively coupled to the control system and the machine readable and executable instructions, when executed by the control system, may cause the system to automatically operate a first subset of the plurality of modules in an adsorbing mode and operate a second subset of the plurality of modules in a desorbing mode. A ratio of the number of modules in the first subset to the number of modules in the second subset may be 0.5 to 50.

[0042] A thirty-ninth aspect of the present disclosure may be directed to an apparatus for CO2 capture, the apparatus comprising a plurality of honeycomb substrates that may be arranged in a honeycomb stack, each honeycomb substrate comprising an inlet end, an outlet end, and walls may define a plurality of channels extending through the honeycomb substrate from the inlet end to the outlet end, wherein the plurality of channels of the plurality of honeycomb substrates may be parallel to one another; each of the plurality of honeycomb substrates may satisfy equation 1 :where kso may be a thermal conductivity of a material of construction of the at least one honeycomb substrate, psmay be a solid material density of the material of construction, and cpsmay be a heat capacity of the material of construction. The outer surface of each of the pluralityof honeycomb substrates may be impermeable to a heat transfer fluid contacting the outer surface and an adsorbent material may be disposed within each of the plurality of channels of the plurality of honeycomb substrates.

[0043] A fortieth aspect of the present disclosure may include the thirty-ninth aspect, further comprising a plurality of honeycomb stacks that may be spaced apart from one another to define heat transfer fluid conduits disposed between each of the honeycomb stacks.

[0044] A forty -first aspect of the present disclosure may include the fortieth aspect, further comprising a heat transfer fluid source that may be in fluid communication with the heat transfer fluid conduits.

[0045] A forty-second of the present disclosure may include either one of the fortieth or forty-first aspect, further comprising spacers that may be disposed between the plurality of honeycomb stacks, where the spacers may fluidly isolate the heat transfer conduits from the inlet end and the outlet end of the plurality of channels.

[0046] A forty-third aspect of the present disclosure may include any one of the fortieth through forty-second aspects, further comprising a housing surrounding the plurality of honeycomb stacks, wherein the housing may be spaced apart from the plurality of honeycomb stacks to define one or more additional heat transfer conduits disposed between the housing and the plurality of honeycomb stacks.

[0047] A forty-fourth aspect of the present disclosure may be directed to a method of capturing carbon dioxide from a gas stream, the method comprising passing the gas stream to an apparatus comprising a plurality of adsorption modules in parallel. Each adsorption module may comprise a plurality of honeycomb substrates that may have an adsorbent material disposed within a plurality of channels extending through the plurality of honeycomb substrates, a housing, and a plurality of heat transfer conduits defined between the housing and the plurality of honeycomb substrates, between one or more of the plurality of honeycomb substrates, or both. The method may further include adsorbing CO2 from the gas stream in a first subset of the adsorption modules, desorbing CO2 from the adsorbent material in a second subset of the adsorption modules. At any given time during operation, a ratio of a number of adsorption modules in the first subset of adsorption modules to a number of adsorption modules in the second subset of adsorption modules may be less than or equal to 50.

[0048] A forty-fifth aspect of the present disclosure may include the forty-fourth aspect, wherein adsorbing may comprise contacting the gas stream with the adsorbent materialdisposed within the plurality of channels extending through the plurality of honeycomb substrates in the first subset of adsorption modules at an adsorption temperature.

[0049] A forty-sixth aspect of the present disclosure may include either one of the fortyfourth or forty-fifth aspects, wherein the adsorption temperature may be less than or equal to 50 °C.

[0050] A forty-sixth aspect of the present disclosure may include either one of the fortyfifth or forty-sixths aspects, wherein the adsorbing further comprising passing a cooling fluid through the heat transfer conduits, wherein the cooling fluid may maintain the adsorption temperature less than or equal to 50 °C.

[0051] A forty-eighth aspect of the present disclosure may include any one of the fortyfourth through forty-seventh aspects, wherein desorbing CO2 in the second subset of the adsorption modules may comprise shutting off glass flow to the plurality of honeycomb substrates in the second subset of adsorption modules, passing a heat transfer fluid through the plurality of heat transfer conduits. The heat transfer fluid may increase the temperature of the adsorbent material to a desorption temperature of from 60 °C to 200 °C. The method may also include desorbing CO2 from the adsorbent material by maintaining the desorption temperature for a desorption period and evacuating the desorbed CO2 from the second subset of adsorption modules.

[0052] Additional features and advantages of the technology disclosed herein will be set forth in the detailed description which follows, and in part will be readily apparent to those skilled in the art from that description or recognized by practicing the technology as described herein, including the detailed description which follows, the claims, as well as the appended drawings.

[0053] It is to be understood that both the foregoing general description and the following detailed description describe various embodiments and are intended to provide an overview or framework for understanding the nature and character of the claimed subject matter. The accompanying drawings are included to provide a further understanding of the various embodiments, and are incorporated into and constitute a part of this specification. The drawings illustrate the various embodiments described herein, and together with the description serve to explain the principles and operations of the claimed subject matter.BRIEF DESCRIPTION OF THE DRAWINGS

[0054] The following detailed description of specific embodiments of the present disclosure can be best understood when read in conjunction with the following drawings, in which like structure may be indicated with like reference numerals and in which:

[0055] FIG. 1 schematically depicts a top-cross-sectional view of an apparatus for CO2 capture, according to embodiments shown and described herein;

[0056] FIG. 2A schematically depicts a front cross-sectional view of a honeycomb stack, according to embodiments shown and described herein;

[0057] FIG. 2B schematically depicts a top cross-sectional view of the honeycomb stack of FIG. 2A, according to embodiments shown and described herein;

[0058] FIG. 2C schematically depicts a seal between honeycomb stacks, according to embodiments shown and described herein;

[0059] FIG. 3 A schematically depicts an inlet gas flow control device and an outlet gas flow control device in an open position, according to embodiments shown and described herein;

[0060] FIG. 3B schematically depicts an inlet gas flow control device and an outlet gas flow control device in a closed position, according to embodiments shown and described herein;

[0061] FIG. 4A schematically depicts a perspective view of a plurality of modules arranged in parallel, according to embodiments shown and described herein;

[0062] FIG. 4B schematically depicts a top cross-sectional view of the plurality of modules arranged in parallel, according to embodiments shown and described herein; and

[0063] FIG. 5 schematically depicts a system for capturing CO2 from a gas, according to embodiments shown and described herein.DETAILED DESCRIPTION

[0064] Embodiments of the present disclosure are described in the detailed description, which follows, examples of which are illustrated in the accompanying drawings. Whenever possible, the same reference numerals will be used throughout the drawings to refer to the same or like parts. The present disclosure may be directed to systems, methods, and apparatuses for CO2 capture. Specifically, the systems, methods, and apparatuses may be directed to a honeycomb substrate with an adsorbent material disposed within a plurality of channels of thehoneycomb substrate and a heat transfer fluid conduit surrounding the honeycomb substrate. Referring now to FIG. 1, one embodiment of an apparatus 100 of the present disclosure for CO2 capture may include at least one honeycomb substrate 102 that may include an inlet end 104, an outlet end 106, and walls 108 defining a plurality of channels 110 extending through the at least one honeycomb substrate 102 from the inlet end 104 to the outlet end 106. A material of construction of the at least one honeycomb substrate 102 may satisfy the following equation 1 :where kso may be a thermal conductivity of the material of construction of the at least one honeycomb substrate 102, psmay be a solid material density of the material of construction, and cPs may be a heat capacity of the material of construction. An outer surface 112 of the at least one honeycomb substrate 102 may be impermeable to a heat transfer fluid 114 contacting the outer surface 112. An adsorbent material 115 may be disposed within each of the plurality of channels 110 of the at least one honeycomb substrate 102, such as coated onto or inside the porosity of the walls 108. The apparatus 100 may further include a gas inlet 116 in fluid communication with the inlet end 104 of the at least one honeycomb substrate 102, a gas outlet117 in fluid communication with the outlet end 106 of the at least one honeycomb substrate 102, and a housing 118 surrounding the at least one honeycomb substrate 102. The housing118 may have housing walls 120 spaced apart from at least a portion of the outer surface 112 of the at least one honeycomb substrate 102 to define a heat transfer fluid conduit 122 disposed between the housing walls 120 and the outer surface 112 of the at least one honeycomb substrate 102. The heat transfer fluid conduit 122 may be fluidly isolated from the plurality of channels 110, the gas inlet 116, and the gas outlet 117. The apparatus 100 may further include a heat transfer fluid inlet 124 and a heat transfer fluid outlet 126, both of which may be in fluid communication with the heat transfer fluid conduit 122.

[0065] Unless otherwise expressly stated, it is in no way intended that any method set forth herein be construed as requiring that its steps be performed in a specific order, nor that specific orientations be required with any apparatus. Accordingly, where a method claim does not actually recite an order to be followed by its steps, or that any apparatus claim does not actually recite an order or orientation to individual components, or it is not otherwise specifically stated in the claims or description that the steps are to be limited to a specific order, or that a specific order or orientation to components of an apparatus is not recited, it is in no way intended thatan order or orientation be inferred, in any respect. This holds for any possible non-express basis for interpretation, including: matters of logic with respect to arrangement of steps, operational flow, order of components, or orientation of components; plain meaning derived from grammatical organization or punctuation, and; the number or type of embodiments described in the specification.

[0066] Where a range of numerical values is recited herein, comprising upper and lower values, unless otherwise stated in specific circumstances, the range is intended to include the endpoints thereof, and all integers and fractions within the range. It is not intended that the scope of the disclosure be limited to the specific values recited when defining a range. Further, when an amount, concentration, or other value or parameter is given as a range, one or more preferred ranges or a list of upper preferable values and lower preferable values, this is to be understood as specifically disclosing all ranges formed from any pair of any upper range limit or preferred value and any lower range limit or preferred value, regardless of whether such pairs are separately disclosed. Finally, when the term "about" is used in describing a value or an end-point of a range, the disclosure should be understood to include the specific value or end-point referred to.

[0067] Directional terms as used herein - for example up, down, right, left, front, back, top, bottom - are made only with reference to the figures as drawn and the coordinate axis provided therewith and are not intended to imply absolute orientation.

[0068] As used herein, the singular forms "a," "an" and "the" include plural referents unless the context clearly dictates otherwise. Thus, for example, reference to “a” component includes aspects having two or more such components, unless the context clearly indicates otherwise.

[0069] As used throughout the present disclosure, the terms “upstream” and “downstream” refer to the relative positioning of unit operations with respect to the direction of flow of the process streams. A first unit operation of a system may be considered “upstream” of a second unit operation if process streams flowing through the system encounter the first unit operation before encountering the second unit operation. Likewise, a second unit operation may be considered “downstream” of the first unit operation if the process streams flowing through the system encounter the first unit operation before encountering the second unit operation.

[0070] As used herein, the term “cell density” refers to a number of channels of a honeycomb substrate per unit cross-sectional area of the honeycomb substrate and is providedin units of cells per square inch. A cell refers to the transverse cross-section of a single elongate channel.

[0071] Carbon capture materials, including gas adsorption technologies, run through cycles where the gas sorbents adsorb and desorb CO2. However, difficulties arise during the desorption of CO2 from the adsorbents. Specifically, gas sorbent technologies typically require elevated temperatures for desorption of CO2. Some technologies used for CO2 desorption feed steam directly through the gas sorbent for heating. However, feeding steam directly through the gas sorbent medium may result in condensation and corrosion of the gas sorbent, which decreases CO2 absorption in subsequent adsorption cycles. Steam may also result in the degradation of the adsorbent materials. Moreover, feeding steam directly through the sorbent requires that the adsorbent unit be at or near a water source.

[0072] An alternative to steam heating is indirect heating through a heat exchange surface. Indirect heating of the sorbent may be done through a multi-tubular vessel that surrounds and heats the sorbent. However, multi-tubular vessels are not economic to scale; surrounding the sorbent with the multi-tubular vessel is challenging when there are multiple columns of sorbent. Thus, an ongoing need exists for systems, method, and apparatuses for efficient CO2 adsorption and desorption.

[0073] The present disclosure solves these problems by providing systems, methods, and apparatuses for CO2 capture from a gas with heat transfer fluid conduits to indirectly heat the adsorbent material for the desorption of CO2. Referring again to FIG. 1, the apparatus 100 comprises the at least one honeycomb substrate 102 comprising the inlet end 104, the outlet end 106, and walls 108 defining the plurality of channels 110 extending through the at least one honeycomb substrate 102 from the inlet end 104 to the outlet end 106. The material of construction of the at least one honeycomb substrate 102 satisfies the following equation 1.In EQU. 1, kso is the thermal conductivity of the material of construction of the at least one honeycomb substrate 102, psis the solid material density of the material of construction, and cPs is the heat capacity of the material of construction. The apparatus also includes the outer surface 112 of the at least one honeycomb substrate 102 that is impermeable to the heat transfer fluid 114 contacting the outer surface 112, the adsorbent material 115 disposed within each of the plurality of channels 110 of the at least one honeycomb substrate 102, such as coated ontoor inside the porosity of the walls 108, the gas inlet 116 in fluid communication with the inlet end 104 of the at least one honeycomb substrate 102, the gas outlet 117 in fluid communication with the outlet end 106 of the at least one honeycomb substrate 102, and the housing 118 surrounding the at least one honeycomb substrate 102. The housing 118 may include housing walls 120 spaced apart from at least a portion of the outer surface 112 of the at least one honeycomb substrate 102 to define the heat transfer fluid conduit 122 disposed between the housing walls 120 and the outer surface 112 of the at least one honeycomb substrate 102. The heat transfer fluid conduit 122 may be fluidly isolated from the plurality of channels 110, the gas inlet 116, and the gas outlet 117. The apparatus also may include the heat transfer fluid inlet 124 and the heat transfer fluid outlet 126, both of which being in fluid communication with the heat transfer fluid conduit 122.

[0074] The systems, methods, and apparatuses of the present disclosure may allow for CO2 capture from a gas and subsequent CO2 desorption from the apparatus through the use of a heat transfer fluid surrounding a honeycomb substrate. Referring again to FIG. 1, the apparatus 100 for CO2 capture may include the at least one honeycomb substrate 102 comprising the inlet end 104, the outlet end 106, and walls 108 defining the plurality of channels 110. The plurality of channels 110 may extend through the at least one honeycomb substrate 102 from the inlet end 104 to the outlet end 106.

[0075] The material of construction of the at least one honeycomb substrate 102 may satisfy the following equation 1 (EQU. 1): soi n-sm2EQU. I- > 10b— Ps ' psThe term kso in EQU. 1 is the thermal conductivity of the material of construction of the at least one honeycomb substrate 102. The thermal conductivity refers to a rate at which heat is transferred by conduction through a cross-sectional area of a material. The term psin EQU. 1 is the solid material density of the material of construction. The solid material density is the ratio of the mass of the material of construction to the volume of the material of construction. The term CpSin EQU. 1 is the heat capacity of the material of construction. The heat capacity of the material of construction is a quantity of heat required to raise the temperature of one gram of the material of construction by one degree Celsius. The thermal conductivity kso, solid material density ps, and the heat capacity cps, all refer to the true material properties of the solid material of construction without porosity. Dividing the thermal conductivity by a product ofthe solid material density and the heat capacity of the material of construction produces a thermal diffusivity for the material of construction.

[0076] The thermal diffusivity of the material of construction of the honeycomb substrates 102 may be from greater than or equal to 10'5m2 / s to less than or equal to 10'3m2 / s, or from greater than or equal to 10'5m2 / s to less than or equal to 5xl0'4m2 / s. A material with a high thermal diffusivity has a high rate of heat transfer through the material. Thus, the greater the thermal diffusivity of the material of construction of the honeycomb substrate 102, as calculated by equation 1 above, the higher the rate of heat transfer between the walls 108 of the honeycomb substrate 102 and the heat transfer fluid 114. For CO2 capture, the material of construction having a high thermal diffusivity (such as greater than 10'5m2 / s) may result in greater heat transfer rate between the walls 108 of the honeycomb substrate 102 and the heat transfer fluid 114. This greater heat transfer rate may result in a higher rate of heating of the adsorbent material 115 and, thus, more efficient and greater CO2 desorption from the adsorbent material 115.

[0077] The material of construction of the at least one honeycomb substrate 102 may be a metal that may be aluminum, magnesium, alloys thereof, or combinations thereof. The material of construction may be a metal, high purity alumina, silicon carbide, or combinations thereof. In embodiments, the material of construction may include a porous material. The porous material may be alumina, silica, zeolite, zirconia, metal carbide, amorphous silica-aluminate, active carbon, carbon-based materials, or combinations thereof. The porous material may have porosity levels of interest 0%-85%, 0%-70%, 0%-10% or 50%-85%, 50%-75%. The more porous the material of construction of the honeycomb substrate 102, the more permeable the material of construction may be to the heat transfer fluid 114.

[0078] Referring again to FIG. 1, the walls 108 of the honeycomb substrate 102 may define the plurality of channels 110 through the honeycomb substrate 102. The plurality of channels 110 may have a diameter from about 10 mil (i.e. 10 thousandths of an inch) (0.254 mm) to about 200 mils (5.08 mm), such as from about 30 mil (0.762 mm) to about 150 mils (3.81 mm), from about 35 mils (0.889 mm) to about 120 mils (3.048 mm), from about 35 mil (0.889 mm) to about 100 mils (2.54 mm), or any other suitable diameter. Moreover, the channels 110 may be circular, square, hexagonal, or any other shape in cross-section. FIG. 1 depicts an exemplary embodiment where the channels 110 of the honeycomb substrate 102 are parallel to one another and extend in a straight line from the inlet end 104 to the outlet end 106 of the honeycomb substrate 102. In embodiments, the channels 110 may run perpendicular or at an angle withrespect to one another, such that channels 110 converge at particular points. Both inlet end 104 and the outlet end 106 of the honeycomb substrate 102 may be open; thus, CCh-containing gas 128 may flow in the inlet end 104 and out the outlet end 106 (as discussed further below).

[0079] Referring again to FIG. 1, a top cross-sectional view of the apparatus 100 is depicted. An open frontal area of the inlet end 104 of the honeycomb substrate 102 may be greater than or equal to 50% and less than or equal to 98%, greater than or equal to 50% and less than or equal to 95%, or greater than or equal to 50% and less than or equal to 90% of a total frontal area of the inlet end 104. The open frontal area of the inlet end 104 may be an area that is the sum of the areas of the inlet ends 104 of the channels 110, while the total frontal area includes the area in which the inlet end 104 of the channels 110 cover and a closed frontal area, which is an area covered by the walls 108 that define the channels 110 and any space that may be between the walls 108 that define the channels 110. The total frontal area is the frontal area circumscribed by the outermost surfaces of the honeycomb substrate 102. The CCh-containing gas 128 may enter the open frontal area of the inlet end 104, while the CCh-containing gas 128 may not enter the closed frontal area of the inlet end 104.

[0080] The honeycomb substrate 102 may have a cell density, which is the number of the channels 110 per unit cross-sectional area, of from 5 cells per square inch (cpsi) to 1000 cpsi, from 50 cpsi to 1000 cpsi, from 50 cpsi to 600 cpsi, from 50 cpsi to 250 cpsi, from 250 cpsi to 600 cpsi, or any other suitable cell density. The walls 108 that define the channels 110 may be of varying thicknesses. In embodiments, the wall thickness of the walls 108 may be less than or equal to 30 mils (0.762 mm), such as no more than 15 mils (0.381 mm), such as no more than 10 mils (0.254 mm), such as no more than 7 mils (0.1778 mm), in thickness. The wall thickness of the walls 108 may be from 2 mils (0.0508 mm) to 30 mils (0.762 mm), from 2 mils (0.0508 mm) to 10 mils (0.254 mm), from 2 mils (0.0508 mm) to 7 mils (0.1778 mm), from 2 mils (0.0508 mm) to 6 mils (0.1524 mm), or from 3 mils (0.0762 mm) to 10 mils (0.254 mm).

[0081] In embodiments, the honeycomb substrate 102 may have a combination of cell density and wall thickness (i.e., noted as: (cell density in cpsi) / (wall thickness in mils)) of about 200 / 8, where left of the “ / ” is the cell density in cpsi and to the right of the “ / ” is the wall thickness in mils. In other embodiments, the honeycomb substrate 102 may have combinations of cell density and wall thickness of 1000 / 30, 1000 / 15, 1000 / 10 1000 / 7, 600 / 30, 600 / 15, 600 / 10, 600 / 7, 400 / 7, 400 / 6, 400 / 5, 400 / 4, 400 / 3, 400 / 2, 300 / 7, 300 / 6, 300 / 5, 300 / 4, 300 / 3, 300 / 2, 250 / 30, 250 / 15, 250 / 10, 250 / 7, 200 / 7, 200 / 6, 200 / 5, 200 / 4, 100 / 15, 100 / 10, 100 / 8,100 / 7, 100 / 6, 100 / 5, 100 / 1, 50 / 30, 50 / 15, 50 / 10, 50 / 8, 50 / 7, 50 / 6, 5 / 30, 5 / 15, 5 / 10, or 5 / 7. In embodiments, the honeycomb substrate 102 may have a cell density of less than 400 cpsi and a wall thickness between channels of from 2 mils (0.0508 mm) to 30 mils (0.762 mm).

[0082] The honeycomb substrate 102 also includes the outer surface 112. Referring again to FIG. 1, the outer surface 112 is in fluid contact with the heat transfer fluid 114. The outer surface 112 of the honeycomb substrate 102 may have a permeability of from 0% to 30%, from 0% to 20%, from 0% to 10%, or from 0% to 5% for the heat transfer fluid 114 contacting the outer surface 112. The permeability of the outer surface 112 of the honeycomb substrate 102 refers to an amount of the heat transfer fluid 114 that may pass through the outer surface 112 of the honeycomb substrate 102 and into the channels 110. As such, only a small portion of or none (if the permeability is 0%) of the heat transfer fluid 114 may pass through the outer surface 112 to the channels 110.

[0083] In embodiments in which the material of construction includes the porous material, the honeycomb substrate 102 may comprise a skin layer 130 on the outer surface 112 that is impermeable to the heat transfer fluid 114 contacting the outer surface 112. The skin layer 130 may be impermeable to the heat transfer fluid 114 contacting the outer surface 112, such that the heat transfer fluid 114 do not pass through the outer surface 112 of the honeycomb substrate 102 and the adsorbent material 115. In other words, the skin layer 130 may have a permeability of from 0% to less than 5%, from 0% to less than 3%, or from 0% to less than 1%. The skin layer 130 may also be included on the outer surface 112 when the honeycomb substrate 102 is a non-porous material. The skin layer 130 may be formed during the formation of the honeycomb substrate 102 or formed in later processing as an after-applied skin layer. The skin layer 130 may be an organic or inorganic material which remains solid at temperatures up to 200°C, up to 180°C, up to 150°C, for example a fluoropolymer, a silicone, a silicate, or other suitable materials; the skin layer may also include polytetrafluoroethylene (Teflon).

[0084] Referring again to FIG. 1, the adsorbent material 115 may be disposed within each of the channels 110 of the honeycomb substrate 102. In embodiments, the adsorbent material 115 may be bonded to interior surfaces 132 of the walls 108 of the honeycomb substrate 102. The adsorbent material 115 may be bonded to the interior surfaces 132 through any suitable method, such as but not limited to washcoating, dipcoating, impregnation, or other known methods. The adsorbent material 115 may be bonded to the interior surfaces 132 by first forming a slurry containing the adsorbent material 115 in a solvent, such as but not limited to water. The honeycomb substrate 102 may then be submerged in the slurry to allow the slurryto infiltrate through the channels 110 from the inlet end 104 to the outlet end 106 of the channels 110. If the material of construction includes the porous material, the adsorbent material 115 may be deposited into pores of the porous material. More specifically, the slurry may enter the channels 110, and permeate through at least a portion of the walls 108, thereby depositing the adsorbent material 115 on the interior surfaces 132 of the walls 108.

[0085] The adsorbent material 115 may include one or more of zeolites, activated carbon, carbonates, silica or alumina gels, mesoporous silica, amine-functionalized organic materials, amine-functionalized inorganic materials, metal organic frameworks (MOF), or combinations thereof. In embodiments, the adsorbent material 115 may also include amine-functionalized organic materials selected from the families of primary, secondary and tertiary amines, such as for example branched poly(ethylenimine) (PEI), linear poly(ethylenimine) (PEI-ln), poly(allylamine) (PAA), and tetraethylenepentamine (TEPA), monoethanolamine (MEA), diethanolamine (DEA), diethylentriamine, triethylenetetramine, pentaethylenehexamine (PEHA), and 1,6-diaminohexane, cyclic amines, such as hexam ethyl enimine, piperazine, and 4-amino-2-hydroxy-6-methylpyrimidine, aminopropyl trimethoxysilane (APS), methylaminopropyl trimethoxysilane (MAPS), dimethylaminopropyl trimethoxysilane (DMAPS), N-[3 -(trimethoxy silyl)propyl] ethylenediamine (ED), N-(3 -trimethoxy silylpropyl) di ethylenetriamine (DT), and N-(3 -trimethoxy silylpropyl) tri ethylenetetramine (TREN), monoethanolamine (MEA), diethanolamine (DEA), a styrene-divinylbenzene based amine, PPI, PPA, or combinations thereof.

[0086] The adsorbent material 115 may adsorb CO2 from the CCE-containing gas 128 as it flows into the gas inlet 116, through the channels 110, and through the gas outlet 117 (explained further below). The adsorbent material 115 may adsorb CO2 until saturated with CO2 (i.e., the adsorbent material is unable to adsorb anymore CO2). The point of saturation of the adsorbent material 115 along the channels 110 may progress from the inlet end 104 to the outlet end 106, such that the adsorbent material 115 at or near the inlet end 104 may become saturated before the adsorbent material 115 at or near the outlet end 106. Once saturated, the CO2 adsorbed by the adsorbent material 115 is then desorbed from the adsorbent material 115 to recover the CO2. Continuous cycles of adsorbing / desorbing CO2 may be executed by the adsorbent material 115.

[0087] Referring again to FIG. 1, the housing 118 surrounding the honeycomb substrate102 may have housing walls 120 spaced apart from at least a portion of the outer surface 112of the honeycomb substrate 102, which may define the heat transfer fluid conduit 122 disposed between the housing walls 120 and the outer surface 112 of the honeycomb substrate 102. The heat transfer fluid conduit 122 may be fluidly isolated from the channels 110, the gas inlet 116, and the gas outlet 117. The heat transfer fluid conduit 122 is fluidly isolated from the channels 110 due to the outer surface 112 having a level of impermeability, as described hereinabove. Moreover, the skin layer 130 may fluidly isolate the channels 110 from the heat transfer fluid conduit 122 and, thus, from the heat transfer fluid 114.

[0088] The heat transfer fluid conduit 122 may be fluidly coupled to the heat transfer fluid inlet 124 and the heat transfer fluid outlet 126. The heat transfer fluid conduit 122 may transfer the heat transfer fluid 114 from the heat transfer fluid inlet 124 to the heat transfer fluid outlet 126. The heat transfer fluid 114 may be a heat transfer fluid that heats up the outer surface 112 or the skin layer 130 of the honeycomb substrate 102 during a desorbing mode (discussed further below). This may result in indirect heating of the adsorbent material 115 to desorb the CO2 from the adsorbent material 115 during the desorbing mode. The heat transfer fluid conduit 122 may also be in fluid communication with a heat transfer fluid source 121. The heat transfer fluid source 121 may store the heat transfer fluid 114 prior to the heat transfer fluid 114 entering the heat transfer fluid conduit 122. The heat transfer fluid source 121 may be a tank, vessel, or any suitable container to store the heat transfer fluid 114. In embodiments, after the desorbing mode, the outer surface 112, the skin layer 130, and / or the adsorbent material 115 may be cooled down through the use of a heat transfer fluid 114 that is a cooling fluid so that the apparatus 100 may return to an adsorbing mode more quickly. The cooling fluid may be transferred through the heat transfer fluid conduit 122 or a separate cooling fluid conduit.

[0089] Referring again to FIG. 1, in embodiments, there may be a heat transfer fluid control valve 157 at the heat transfer fluid inlet 124. The heat transfer fluid control valve 157 may allow the heat transfer fluid 114 to enter the heat transfer fluid conduit 122 when the heat transfer fluid control valve 157 is in an open position. Alternatively, when the heat transfer fluid control valve 157 is in a closed position, the heat transfer fluid 114 may be prevented from entering the heat transfer fluid conduit 122. The heat transfer fluid control valve 157 may include a ball valve, plug valve, check valve, or any other suitable valve for allowing / preventing the heat transfer fluid 114 from entering the heat transfer fluid conduit 122. In desorption mode, the heat transfer fluid 114 may be a heat transfer fluid that includes, but is not limited to, heated atmospheric air, heated water, steam, or any other heated fluid thatmay be suitable for passing through the heat transfer fluid conduit 122 and heating the honeycomb substrate 102.

[0090] Referring now to FIG. 2A, a plurality of the honeycomb substrates 102 may be arranged side-by-side to form a honeycomb stack 300. FIG. 2A is a cross-sectional view seen from the inlet end 104 of the honeycomb substrates 102. The channels 110 of each of the plurality of honeycomb substrates 102 may be parallel to each other, as depicted in FIG. 2A. As such, each of the channels 110 of each of the plurality of honeycomb substrates 102 may be parallel to each other. There may be two, three, four, five, or more than five of the honeycomb substrates 102 in the honeycomb stack 300. In embodiments, there may be one, two, three, four, five, or more than five honeycomb stacks 300 in parallel, upstream, or downstream from one another. In embodiments, the apparatus 100 may comprise a plurality of honeycomb stacks 300 arranged side-by-side in parallel.

[0091] A resilient layer 162 may be disposed between each of the honeycomb substrates 102 in the honeycomb stack 300. The resilient layer 162 may form a seal between each of the honeycomb substrates 102 in the honeycomb stack 300. The resilient layer 162 may be any material suitable for insulating or sealing the space between the honeycomb substrates 102 in the honeycomb stack 300. In embodiments, the resilient layer 162 may contain Elastomers such as EPDM, Nitrile Butadiene Rubber (NBR), Ethylene-propylene-diene(monomer) rubber (EPDM), natural rubber (NR), Chloroprene rubber (CR), Fluoroelastomers (FKM), or other polymetric materials such as Polytetrafluoroethylene (PTFE), Polyurethane (PU), Silicones, foamed materials, fiber containing materials, graphite, or any other suitable material.

[0092] As described hereinabove, the apparatus 100 may comprise a plurality of honeycomb stacks 300, arranged side-by-side and spaced apart from one another. Referring to FIG. 2B, a top cross-sectional view of the plurality of honeycomb stacks 300 is depicted. In embodiments, there may be one or more spacers 164 between each of the honeycomb stacks 300. The one or more spacers 164 may seal the space between each honeycomb stack 300 adjacent to the inlet end 104 and the outlet end 106 of the honeycomb substrates 102. The one or more spacers 164 may include a first spacer 166 including an elongated seal oriented perpendicular to the channels 110 and disposed proximate to the inlet end 104 of the honeycomb substrates 102. The one or more spacers 164 may also include a second spacer 168 also including an elongated seal oriented perpendicular to the channels 110 and disposed proximate to the outlet end 106 of the honeycomb substrates 102, such that the second spacer168 may be spaced apart from the first spacer 166. In embodiments, the one or more spacers 164 may be one continuous spacer. Alternatively, in embodiments, each spacer 163 may comprise a plurality of spacers arranged end-to-end.

[0093] The spacers 164 may function to maintain a constant space between adjacent honeycomb stacks 300. The spacers 164 may also function to absorb any forces if the honeycomb stacks 300 are compressed against one another. A space 170 may act as a portion of the heat transfer fluid conduit 122 (described further below). The space 170 refers to the space between the honeycomb stacks 300, as provided by the spacers 164. As depicted in FIG. 2C, the spacers 164 may include a static element 164A and one or more flexible elements 164F. The flexible elements 164F may change in shape to adsorb compressive forces between the honeycomb stacks 300.

[0094] Referring again to FIG. 2 A, there may be at least one module 172 that may include the plurality of honeycomb stacks 300 arranged side-by-side and spaced apart from one another. Each of the honeycomb stacks 300 may include a plurality of the honeycomb substrates 102 stacked on top of one another, with the channels 110 of the honeycomb substrates parallel to one another. The housing 118 may surround all of the plurality of honeycomb stacks 300 and the heat transfer fluid conduits 122 may be defined between each of the honeycomb stacks 300 and between the honeycomb stacks and the housing wall 120 of the housing 118. The housing 118 in combination with the may fluidly isolate the heat transfer fluid conduits 122 from the channels 110 passing through each of the honeycomb substrates 102. As such, very little or none of the heat transfer fluid 114 may pass through the channels 110.

[0095] In order to maintain a seal between each of the honeycomb stacks 300, compressive forces may be exerted on the honeycomb stacks 300 to keep the honeycomb stacks 300 together. As such, there may be a compressive element 165 on one housing wall 120. The compressive element 165 may be a screw, bolt, or spring that can be adjusted to push one side of the housing walls 120 toward an opposite housing wall 120. The compressive element 165 may compress the honeycomb stacks 300 toward one another, compressing the honeycomb stacks 300 and providing a tighter seal through the spacers 164.

[0096] As depicted in FIG. 2B, the heat transfer fluid conduits 122 may be perpendicular to the flow of the CCh-containing gas 128 through the channels 110; thus, the plurality of heattransfer fluid conduits 122 may be oriented to provide cross-flow of the heat transfer fluid 114 relative to the flow of gases through the channels 110 extending through the honeycomb substrates 102. In embodiments, the heat transfer fluid conduits 122 may be parallel, perpendicular, or any angle in-between with respect to the channels 110. When parallel to the channels 110, the heat transfer fluid conduits 122 may run the heat transfer fluid 114 in a parallel flow or a counter-flow with respect to the flow of gases through the channels 110. For example, when there is counter-flow between the heat transfer fluid 114 and the gases through the channels 110, the heat transfer fluid inlet 124 may be at the outlet end 106 of the honeycomb substrate 102, while the heat transfer fluid outlet 126 may be at the inlet end 104 of the honeycomb substrate 102. Alternatively, when there is parallel flow between the heat transfer fluid 114 and the gases through the channels 110, the heat transfer fluid inlet 124 may be at the inlet end 104 of the honeycomb substrate 102, while the heat transfer fluid outlet 126 may be at the outlet end 106 of the honeycomb substrate 102.

[0097] The heat transfer fluid inlet 124 may also include a heat transfer fluid inlet plenum 125 shaped to direct the heat transfer fluid 114 to the heat transfer fluid conduits 122. Similarly, the heat transfer fluid outlet 126 may include a heat transfer fluid outlet plenum 127 shaped to receive the heat transfer fluid 114 from the heat transfer fluid conduits 122. The heat transfer fluid inlet plenum 125 and the heat transfer fluid outlet plenum 127 may include a housing with pressurized heat transfer fluid 114. The heat transfer fluid inlet plenum 125 may include the heat transfer fluid 114 at a positive pressure with respect to a pressure of the heat transfer fluid 114 within the heat transfer fluid conduits 122, such that the heat transfer fluid inlet plenum 125 distributes the heat transfer fluid 114 to the heat transfer fluid inlet 124 and through the heat transfer fluid conduits 122. In contrast, the heat transfer fluid outlet plenum 127 may include a negative pressure relative to a pressure of the heat transfer fluid 114 within the heat transfer fluid conduits 122, such that the heat transfer fluid outlet plenum 127 may draw the heat transfer fluid 114 from the heat transfer fluid conduits 122.

[0098] The CCh-containing gas 128 may be introduced into the channels 110 of the honeycomb substrate through the gas inlet 116, which is in fluid communication with and upstream from the inlet end 104 of the honeycomb substrate 102. The CCh-containing gas 128 may be any gas containing CO2. In embodiments, the CCh-containing gas 128 may be an exhaust of a chemical reaction including petrochemicals. As such, the CCh-containing gas 128 may also include Carbon Monoxide, Nitrogen Oxides, or any other gas resulting from achemical reaction. After the CCh-containing gas 128 flows through the channels 110, the CO2- containing gas 128 exits the honeycomb substrate 102 through the gas outlet 117, which is downstream from and in fluid communication with the outlet end 106 of the honeycomb substrate 102. Adsorption of CO2 into the adsorbent material 115 may be conducted at a temperature of from -40 °C to 200 °C, from -40 °C to 120 °C, from -30 °C to 80 °C, from -20 °C to 60 °C, or any other suitable temperature. A speed of the CCh-containing gas 128 through the channels 110 may be from 0.01 meters per second to 50 meters per second, from 0.1 meters per second to 10 meters per second, from 0.3 meters per second to 5 meters per second, from 0.3 meters per second to 4 meters per second, or any other suitable speed.

[0099] Referring to FIG. 3 A and FIG. 3B, the gas inlet 116 may include a plurality of CO2 gas valves 136, such that the opening of the plurality of CO2 gas valves 136 permits the CO2- containing gas 128 to enter the channels 110 through the gas inlet 116. The CO2 gas valves 136 may include a ball valve, plug valve, check valve, or any other suitable valve for allowing / preventing the CCh-containing gas 128 entering the channels 110. The CO2 gas valves 136 may be fluidly coupled to a CCh-containing gas source 141, which may house the CO2- containing gas 128. The CCh-containing gas source 141 may be a tank or vessel containing the CCh-containing gas 128 (as depicted in FIG. 1). The CCh-containing gas source 141 may be ambient air but may also be an exhaust of a chemical reaction, such as a chemical reaction involving a petrochemical, such that the exhaust is connected to the inlet gas flow control device 138.

[0100] At least one inlet gas flow control device 138 may be disposed upstream of the inlet end 104 of the honeycomb substrate 102. The at least one inlet gas flow control device 138 may be operable to control flow of the CCh-containing gas 128 between the gas inlet 116 and the channels 110 of the honeycomb substrate 102. Similarly, there may also be at least one outlet gas flow control device 140 (depicted in FIG. 1) disposed downstream of the outlet end 106 of the honeycomb substrate 102. The at least one outlet gas flow control device 140 may be operable to control flow of the CCh-containing gas 128 between the channels 110 of the honeycomb substrate 102 and the gas outlet 117.

[0101] The inlet gas flow control device 138, the outlet gas flow control device 140, or both may include at least one shutter 142 and an actuator 144 operable to transition the at least one shutter 142 from an open position 302 (FIG. 3A) to a closed position 304 (FIG. 3B). Both the inlet gas flow control device 138 and the outlet gas flow control device 140 may both be in theopen position 302. Alternatively, both the inlet gas flow control device 138 and the outlet gas flow control device 140 may be in the closed position 304. In embodiments, the inlet gas flow control device 138 may be in the open position 302, while the outlet gas flow control device 140 may be in the closed position 304. Similarly, the inlet gas flow control device 138 may be in the closed position 304, while the outlet gas flow control device 140 may be in the open position 302.

[0102] The shutter 142 of the inlet gas flow control device 138 may allow the CO2- containing gas 128 to enter the channels 110 in the open position 302, and prevent the CO2- containing gas 128 from entering the channels 110 in the closed position 304. As depicted in FIG. 3A and FIG. 3B, the shutters 142 may be rotatable at a shutter center 142sc. Rotation of the shutters 142 puts the shutters 142 from the open position 302, as depicted in FIG. 3A, to the closed position 304, as depicted in FIG. 3B, or vice versa. The shutters 142 may rotate in a clockwise or counterclockwise direction when the actuator 144 is engaged. As such, the shutters 142 may be rotatably coupled to the actuator 144. In embodiments, the shutters 142 may be slidably coupled to the actuator 144, such that sliding of the shutters 142 may transition the shutters 142 from the open position 302 to the closed position 304, or vice versa. The inlet gas flow control device 138 and the outlet gas flow control device 140 may also include valves, plugs, or any other suitable device for preventing or allowing the CCh-containing gas 128 from entering the channels 110.

[0103] Referring again to FIG. 3 A and FIG. 3B, the inlet gas flow control device 138 may be spaced apart from the inlet end 104 of the honeycomb substrate 102. Similarly, the outlet gas flow control device 140 may be spaced apart from the outlet end 106 of the honeycomb substrate 102. The inlet gas flow control device 138 and the outlet gas flow control device 140 being spaced apart from the inlet end 104 and the outlet end 106 may allow for rotation of the shutters 142 from the closed position 304 to the open position 302. When the shutters 142 are in the closed position 304, various different gaseous volumes may be defined within the apparatus 100 depending on how far the inlet gas flow control device 138 and the outlet gas flow control device 140 are spaced from the inlet end 104 and the outlet end 106 of the honeycomb substrate 102, respectively.

[0104] Referring to FIG. 3B, the channels 110 of the honeycomb substrate 102 may define a substrate volume 145. As such, the substrate gas volume 145 (i.e., a volume of the channels 110 of the honeycomb substrate 102) is equal to the total volume occupied by the honeycombsubstrate 102 less a volume of the walls 108 of the honeycomb substrate. The housing 118, inlet gas flow control device 138, and the inlet end 104 of the honeycomb structure may define an inlet gas volume 146. The housing 118, outlet gas flow control device 140, and the outlet end 106 of the honeycomb substrate 102 may define an outlet gas volume 148. A sum of the inlet gas volume 146 and the outlet gas volume 148 may range from 1% to 70% of the substrate gas volume 145, from 1% to 60% of the substrate gas volume 145, from 5% to 50% of the substrate gas volume 145, from 5% to 40% of the substrate gas volume 145, from 5% to 30% of the substrate gas volume 145, from 5% to 20% of the substrate gas volume 145, or any other suitable volume with respect to the substrate gas volume 145. A sum of the inlet gas volume 146 and the outlet gas volume 148 greater than 70% of the substrate gas volume 145 may result in an excessive amount of the CCh-containing gas 128 being utilized and, thus, less CO2 adsorbed by the adsorbent material 115, leading to inefficiencies in the CO2 adsorption process.

[0105] Referring again to FIG. 3B, in embodiments, the apparatus 100 may also include a desorbate line 150. The desorbate line 150 may be in fluid communication with the inlet gas volume 146, the outlet gas volume 148, or both. A vacuum system 152 may be in fluid communication with the desorbate line 150. The desorbate line 150 and the vacuum system 152 may withdraw gases, such as desorbed CO2, from the inlet gas volume 146, the outlet gas volume 148, or both. The desorbate line 150 may include a desorbate control valve 151. The desorbate control valve 151 may control the flow of gases entering into the desorbate line 150 and, thus, the flow of gases exiting the inlet gas volume 146, the outlet gas volume 148, or both. The desorbate control valve 151 may allow the gases, such as desorbed CO2, purge gas 154, or both, to enter the desorbate line 150 when the desorbate control valve 151 is in an open position. Alternatively, when the desorbate control valve 151 is in a closed position, the gases may be prevented from entering the desorbate line 150. The desorbate control valve 151 may include a ball valve, plug valve, check valve, or any other suitable valve for allowing / preventing the purge gas 154 from entering the desorbate line 150.

[0106] The apparatus 100 may also include a purge gas inlet 153 in fluid communication with the inlet gas volume 146, the outlet gas volume 148, or both. The purge gas inlet 153 may also be fluidly coupled with a purge gas source 156; the purge gas source 156 may include a tank or vessel containing the purge gas 154 before it enters the inlet gas volume 146, the outlet gas volume 148, or both. The purge gas 154 may be introduced to the inlet gas volume 146, the outlet gas volume 148, or both, through the purge gas inlet 153 and a purge gas controlvalve 159. The purge gas control valve 159 may include a valve, pump, or both to introduce the purge gas 154 to the inlet gas volume 146, the outlet gas volume 148, or both. The purge gas 154 may include air from the atmosphere, nitrogen, argon, helium, water (steam), any mixture thereof, or any gas suitable for desorption of CO2 from the adsorbent material 115.

[0107] The purge gas 154 may run through the channels 110, moving the CO2 from the adsorbent material 115 to the desorbate line 150. As the purge gas 154 runs through the channels 110, the purge gas 154, channels 110, and the adsorbent material 115 may be heated through the use of the heat transfer fluid 114 (described further below). Heating of the purge gas 154, channels 110, and the adsorbent material 115 allows for quick and efficient desorption of CO2 from the adsorbent material 115, thus, allowing for the apparatus 100 to be online quicker for subsequent adsorption of CO2. Once 50%, 60%, 70%, 80%, 90% or all of the CO2 has been removed from the adsorbent material 115, the purge gas 154 may be run through the channels 110. The purge gas 154, now containing desorbed CO2, may be extracted through the desorbate line 150 when the vacuum system 152 has been activated. The vacuum system 152 may reduce the pressure level to absolute pressures of from about 0.2 Kilopascal (kPa) to about 98 kPa, from about 1 kPa to about 80 kPa, from about 2 kPa to about 60 kPa, from about 5 kPa to about 50 kPa, or any other suitable pressures to withdraw the purge gas 154 containing the desorbed CO2 from the inlet gas volume 146, the outlet gas volume 148, or both to through the desorbate line 150.

[0108] Referring to FIG. 3 A and FIG. 3B, a fan 155 may also be included downstream the channels 110 at the outlet end 106 of the honeycomb substrate 102. The fan 155 may be downstream of the outlet gas flow control device 140. The fan 155 may be operable to move gas (the CCh-containing gas 128) through the channels 110 in the honeycomb substrate 102 during adsorption mode. As such, the fan 155 may be a suction fan. The apparatus 100 may include one fan 155 or a plurality of fans 155. In embodiments, the fan 155 may be disposed upstream of the channels 110 and upstream of the inlet end 104 of the honeycomb substrate to move the CCh-containing gas 128 through the channels 110 in the honeycomb substrate 102. As such, the fan 155 may be a blower fan.

[0109] As discussed hereinabove, the apparatus 100 may comprise the plurality of modules 172 arranged in parallel, as depicted in FIG. 4 A. In embodiments, there may be a heat transfer fluid manifold 174 in fluid communication with the heat transfer fluid inlet 124 of each of the modules 172. The heat transfer fluid manifold 174 may distribute the heat transfer fluid 114 tothe heat transfer fluid inlets 124 of each of the modules 172. As depicted in FIG. 4B (not depicted in FIG. 4A), a gas inlet manifold 176 that may be in fluid communication with the gas inlet 116 of each of the plurality of modules 175. The gas inlet manifold 176 may distribute the CCh-containing gas 128 to the gas inlet 116 of each of the plurality of modules 175. The heat transfer fluid manifold 174 and the gas inlet manifold 176 may be on the same side of the modules 172, such that there is parallel flow of the CCh-containing gas 128 and the heat transfer fluid 114. In other embodiments, the heat transfer fluid manifold 174 and the gas inlet manifold 176 may be on opposite sides of the modules 172, such that there is cross-flow of the CO2- containing gas 128 and the heat transfer fluid 114.

[0110] Referring now to FIG. 5, a system 500 for capturing CO2 from a gas may include the apparatus 100 of FIG. 1 and a control system 502. The control system 502 may include at least one processor 504, at least one memory module 506, and machine readable and executable instructions 508 stored on the at least one processor 504. The control system 502 may be communicatively coupled to various components of the apparatus 100. For example, the control system 502 may be communicatively coupled to the inlet gas flow control device 138, the outlet gas flow control device 140, the fan 155, the heat transfer fluid control valve 157, the desorbate control valve 151, the vacuum system 152, or any other component of the apparatus 100. The control system 502 may operate the module 175 in the adsorbing mode.

[0111] Referring now to FIGS. 3A and 5, the machine readable and executable instructions 508, when executed by the at least one processor 504, may cause the system 500 to automatically transition the apparatus 100 to an adsorbing mode. Transitioning the apparatus 100 to the adsorbing mode may comprise transitioning the inlet gas flow control device 138 and the at least one outlet gas flow control device 140 to open positions. The inlet gas flow control device 138 and the outlet gas flow control device 140 being in open positions may permit flow of the CCh-containing gas 128 through the channels 110 of the honeycomb substrate(s) 102 from the CO2 gas valves 136. The machine readable and executable instructions 508, when executed by the processor 504, may cause the control system 502 to operate the fan 155 to cause gas to flow through the channels 110 of the honeycomb substrate 102, in the adsorbing mode. During the adsorption in the adsorbing mode, the adsorbent material 115 disposed on the channels 110 may adsorb CO2 from the CCh-containing gas 128 as the CCh-containing gas 128 passes through the channels 110.

[0112] Referring now to FIGS. 3B and 5, the control system 502 may also operate the module 175 in the desorbing mode. The machine readable and executable instructions 508, when executed by the processor 504, may cause the system 500 to automatically transition the apparatus 100 to the desorbing mode. In transitioning the apparatus 100 to the desorbing mode (depicted in FIG. 3B), the machine readable and executable instructions 508, when executed by the processor 504, may cause the system 500 to transition the inlet gas flow control device 138 and the outlet gas flow control device 140 to closed positions, cease operation of the fan 155, and transition the heat transfer fluid control valve 157 to an open position to pass heat transfer fluid 114 through the heat transfer fluid conduit 122. The heat transfer fluid 114 heats the adsorbent material 115 to desorb CO2 from the adsorbent material 115. As such, the heat transfer fluid 114 indirectly heats the adsorbent material 115 through the honeycomb substrate 102. Following desorption, the machine readable and executable instructions 508, when executed by the processor 504, may cause the system 500 to transition the desorbate control valve 151 to an open position and operate the vacuum system 152 to withdraw desorbed CO2 from the apparatus 100.

[0113] After the desorbed vacuum system 152 is operated to withdraw the desorbed CO2 from the apparatus 100, the machine readable and executable instructions 508, when executed by the processor 504, may cause the system 500 to open the purge gas control valve 159 to introduce the purge gas 154 into the channels 110. The purge gas 154 may draw further desorbed CO2 from the adsorbent material 115. As such, the desorbed CO2 may be in the purge gas 154, which may exit the channels 110 through the desorbate line 150.

[0114] After withdrawal of the desorbed CO2, the machine readable and executable instructions 508, when executed by the processor 504, may cause the system 500 to automatically transition the apparatus 100 back to the adsorbing mode. The machine readable and executable instructions 508, when executed by the processor 504, may cause the system 500 to automatically close the desorbate control valve 151, close the heat transfer fluid control valve 157, close the purge gas control valve 159, and cease operation of the vacuum system 152. Then, the machine readable and executable instructions 508, when executed by the processor 504, may cause the system to open the inlet gas flow control device 138, open the outlet gas flow control device 140, open the CO2 gas valves 136, and operate the fan 155 to resume flow of the CCh-containing gas 128 through the honeycomb substrate 102. Thus, entering back into the adsorbing mode. Adsorption of CO2 through the adsorbent material 115in the channels 110 may occur until the adsorbent material 115 is saturated (i.e., unable to further adsorb any CO2, as explained hereinabove). When the adsorbent material 115 is saturated, the system may enter the desorbing mode through opening the heat transfer fluid control valve 157 and the desorbate line 150, as explained hereinabove. This cycle between adsorbing mode and desorbing mode may continue indefinitely during operation of the system 500. In embodiments, a greater number of adsorption / desorption cycles may be executed by system 500 compared to CO2 adsorption systems incorporating traditional direct heating of the adsorbent material 115 through steam during desorption. It is believed that the greater number of adsorption / desorption cycles may be due in-part to the indirect heating of the adsorbent material 115 through the use of the heat transfer fluid conduit 122, which may reduce corrosion and degradation of the adsorbents.

[0115] Referring again to FIG. 5, in embodiments, the plurality of modules 175 may be connected to the control system 502. In embodiments, the machine readable and executable instructions 508, when executed by the control system 502, may cause the system 500 to automatically operate a first subset 180 of the plurality of modules 175 in the adsorbing mode, and operate a second subset 182 of the plurality of modules 175 in the desorbing mode. A ratio of the number of modules 175 in the first subset 180 to the number of modules 175 in the second subset 182 may be from 0.5 to 50, 0.5 to 20, 1 to 10, or 1 to 5.

[0116] Referring again to FIG. 4B, a method of capturing CO2, from the CCh-containing gas 128 may include passing the CCh-containing gas 128 to the apparatus 100, which may include the plurality of adsorption modules 175 in parallel. Each adsorption module 175 may include the honeycomb substrates 102 which may include the adsorbent material 115 disposed within the channels 110 extending through the honeycomb substrates 102. The apparatus 100 may further include the housing 118 and the heat transfer fluid conduits 122 defined between the housing 118 and the honeycomb substrates 102, between one or more of the honeycomb substrates 102, or both. The method may include adsorbing CO2 from the CCh-containing gas 128 in the first subset 180 of the adsorption modules 175, desorbing CO2 from the adsorbent material 115 in the second subset 182 of the adsorption modules 175. At any given time during operation, the ratio of a number of adsorption modules 175 in the first subset 180 of adsorption modules 175 to the number of adsorption modules 175 in the second subset 182 of adsorption modules 175 is less than or equal to 50, less than or equal to 20, less than or equal to 10, less than or equal to 5, less than or equal to 1, or less than or equal to 0.5.

[0117] During the method described hereinabove, the adsorption temperature may be from -40 °C to 200 °C, from -40 °C to 120 °C, from -30 °C to 80 °C, from -20 °C to 60 °C, or any other suitable temperature. During the adsorbing of CO2 from the CCh-containing gas 128, the method may further include passing the cooling fluid through the heat transfer fluid conduits 122; the cooling fluid may maintain the adsorption temperature (the temperature of the adsorbent material 115) from 0 °C to 50 °C, from 5 °C to 40 °C, from 5 °C to 30 °C, or any other suitable temperature range.

[0118] Desorbing CO2 in the second subset 182 of the adsorption modules 175 may include shutting off gas flow to the honeycomb substrates 102 in the second subset 182 of adsorption modules 175, passing the heat transfer fluid 114 through the heat transfer fluid conduits 122. The heat transfer fluid 114 may increase the temperature of the adsorbent material 115 to a desorption temperature of from 60 °C to 200 °C, from 60 °C to 150 °C, from 80 °C to 120 °C, or any other suitable temperature range. The method may also include maintaining the desorption temperature for a desorption period. The desorption period may be 20 minutes, 15 minutes, 10 minutes, 5 minutes, 2 minutes, 1 minutes, or any other suitable amount of time it takes the CO2 to desorb from the adsorbent material 115.

[0119] The control system 502 may communicate with the various components of the apparatus 100 through a network. Although shown in FIG. 5 as being directly communicatively coupled to the apparatus 100, it is understood that the control system 502 may additionally communicate with the apparatus 100 through the network. The network may be a wired or wireless network. In embodiments, the network may be a cloud network.

[0120] Embodiments of the disclosure may be embodied in hardware and / or in software (including firmware, resident software, micro-code, etc.). The control system 502 of the apparatus 100 and / or other controllers on the apparatus 100 may include at least one processor and the computer-readable storage medium (i.e., memory module) as previously described in this specification. The control system 502 may be communicatively coupled to one or more system components (e.g., apparatus 100, the inlet gas flow control device 138, the outlet gas flow control device 140, the fan 155, the heat transfer fluid control valve 157, the desorbate control valve 151, the vacuum system 152, etc.) via any wired or wireless communication pathway. A computer-usable or the computer-readable storage medium or memory module 506 may be any medium that can contain, store, communicate, propagate, or transport the program for use by or in connection with the instruction execution system, apparatus, or device.

[0121] The computer-usable or computer-readable storage medium or memory module 506 may be, for example but not limited to, an electronic, magnetic, optical, electromagnetic, infrared, or semiconductor system, apparatus, device, or propagation medium. More specific examples (a non-exhaustive list) of the computer-readable storage medium or memory module 506 would include the following: an electrical connection having one or more wires, a portable computer diskette, a random access memory (RAM), a read-only memory (ROM), an erasable programmable read-only memory (EPROM or Flash memory), an optical fiber, and a portable compact disc read-only memory (CD-ROM). Note that the computer-usable or computer- readable storage medium or memory module 506 could even be paper or another suitable medium upon which the program is printed, as the program can be electronically captured, via, for instance, optical scanning of the paper or other medium, then compiled, interpreted, or otherwise processed in a suitable manner, if necessary, and then stored in a computer memory.

[0122] The computer-readable storage medium or memory module 506 may include the machine readable and executable instructions 508 for carrying out operations of the present disclosure. The machine readable and executable instructions 508 may include computer program code that may be written in a high-level programming language, such as C or C++, for development convenience. In addition, computer program code for carrying out operations of the present disclosure may also be written in other programming languages, such as, but not limited to, interpreted languages. Some modules or routines may be written in assembly language or even micro-code to enhance performance and / or memory usage. However, software embodiments of the present disclosure do not depend on implementation with a particular programming language. It will be further appreciated that the functionality of any or all of the program modules may also be implemented using discrete hardware components, one or more application specific integrated circuits (ASICs), or a programmed digital signal processor or microcontroller.

[0123] It will be apparent to those skilled in the art that various modifications and variations can be made to the embodiments described herein without departing from the spirit and scope of the claimed subject matter. Thus it is intended that the specification cover the modifications and variations of the various embodiments described herein provided such modification and variations come within the scope of the appended claims and their equivalents.

Claims

CLAIMSWhat is claimed is:

1. An apparatus for CO2 capture, the apparatus comprising: at least one honeycomb substrate comprising an inlet end, an outlet end, and walls defining a plurality of channels extending through the at least one honeycomb substrate from the inlet end to the outlet end, wherein: the at least one honeycomb substrate satisfies the following equation 1 :where kso is a thermal conductivity of a material of construction of the at least one honeycomb substrate, psis a solid material density of the material of construction, and cpsis a heat capacity of the material of construction; and an outer surface of the at least one honeycomb substrate that is impermeable to a heat transfer fluid contacting the outer surface; an adsorbent material disposed within each of the plurality of channels of the at least one honeycomb substrate; a gas inlet in fluid communication with the inlet end of the at least one honeycomb substrate; a gas outlet in fluid communication with the outlet end of the at least one honeycomb substrate; a housing surrounding the at least one honeycomb substrate, the housing having housing walls spaced apart from at least a portion of the outer surface of the at least one honeycomb substrate to define a heat transfer fluid conduit disposed between the housing walls and the outer surface of the at least one honeycomb substrate, wherein the heat transfer fluid conduit is fluidly isolated from the plurality of channels, the gas inlet, and the gas outlet; and a heat transfer fluid inlet and a heat transfer fluid outlet, both of which being in fluid communication with the heat transfer fluid conduit.

2. The apparatus of claim 1, wherein the material of construction of the at least one honeycomb substrate comprises a metal, high purity alumina, silicon carbide, or combinations thereof.

3. The apparatus of claim 1, wherein the material of construction of the at least one honeycomb substrate comprises greater than or equal to 90% of a material selected from the group of a metal, high purity alumina, silicon carbide, or combinations thereof.

4. The apparatus of claim 2, wherein the material of construction of the at least one honeycomb substrate comprises at least one metal.

5. The apparatus of claim 4, wherein the at least one metal comprises aluminum, magnesium, or combinations thereof.

6. The apparatus of claim 1, wherein the plurality of channels of the at least one honeycomb substrate are parallel to one another and extend in a straight line from the inlet end to the outlet end of the at least one honeycomb substrate.

7. The apparatus of claim 1, wherein the plurality of channels are open at both the inlet end and the outlet end of the at least one honeycomb substrate.

8. The apparatus of claim 1, wherein an open frontal area of the inlet end of the at least one honeycomb substrate is greater than or equal to 50% of a total frontal area.

9. The apparatus of claim 1, wherein the at least one honeycomb substrate has a cell density of from 5 cells per square inch (cpsi) to 1000 cpsi, wherein the cell density refers to the number of the plurality of channels per square inch of the inlet end of the at least one honeycomb substrate.

10. The apparatus of claim 1, wherein the outer surface of the at least one honeycomb substrate has a permeability of less than 10% for the heat transfer fluid contacting the outer surface.

11. The apparatus of claim 1, wherein the material of construction is a porous material and the outer surface of the at least one honeycomb comprises a skin layer, wherein the skin layer is impermeable to the heat transfer fluid contacting the outer surface.

12. The apparatus of claim 11, wherein the skin layer comprises an organic or inorganic material comprising a fluoropolymer, a silicone, a silicate, or combinations thereof, wherein the skin layer remains solid at temperatures of up to 200 °C.

13. The apparatus of claim 11, wherein the skin layer comprises polytetrafluoroethylene.

14. The apparatus of claim 1, wherein the adsorbent material is bonded to interior surfaces of the walls of the at least one honeycomb substrate.

15. The apparatus of claim 1, wherein the adsorbent material is selected from the group consisting of zeolites, activated carbon, silica or alumina gels, mesoporous silica, carbonates, metal organic frameworks (MOF), amine-functionalized organic materials, amine- functionalized inorganic materials, and combinations thereof.

16. The apparatus of claim 15, wherein the adsorbent material comprises an amine- functionalized organic materials selected from the families of primary, secondary and tertiary amines, a styrene-divinylbenzene based amine, or combinations thereof.

17. The apparatus of claim 15, wherein the adsorbent material comprises an amine- functionalized organic materials selected from the families of primary, secondary and tertiary amines, such as branched poly(ethylenimine) (PEI), linear poly(ethylenimine) (PEI-ln), poly(allylamine) (PAA), and tetraethylenepentamine (TEPA), monoethanolamine (MEA), diethanolamine (DEA), diethylentriamine, triethylenetetramine, pentaethylenehexamine (PEHA), and 1,6-diaminohexane, cyclic amines, such as hexam ethyl enimine, piperazine, and 4-amino-2-hydroxy-6-methylpyrimidine, aminopropyl trimethoxysilane (APS), methylaminopropyl trimethoxysilane (MAPS), dimethylaminopropyl trimethoxysilane (DMAPS), N-[3 -(trimethoxy silyl)propyl] ethylenediamine (ED), N-(3 -trimethoxy silylpropyl) di ethylenetriamine (DT), and N-(3 -trimethoxy silylpropyl) tri ethylenetetramine (TREN), monoethanolamine (MEA), diethanolamine (DEA), a styrene-divinylbenzene based amine, or combinations thereof.

18. The apparatus of claim 1, comprising a plurality of honeycomb substrates arranged side-by-side to form a honeycomb stack, wherein the plurality of channels of each of the plurality of honeycomb substrates are parallel to each other.

19. The apparatus of claim 18, further comprising a resilient layer disposed between each of the plurality of honeycomb substrates in the honeycomb stack, wherein the resilient layer forms a seal between each of the plurality of honeycomb substrates in the honeycomb stack.

20. The apparatus of claim 18, further comprising a plurality of honeycomb stacks arranged side-by-side, wherein the plurality of honeycomb stacks are spaced apart from one another.

21. The apparatus of claim 20, further comprising one or more spacers disposed between each of the plurality of honeycomb stacks, wherein the one or more spacers seal the space between each honeycomb stack.

22. The apparatus of claim 21, wherein the one or more spacers comprises: a first spacer comprising an elongated seal oriented perpendicular to the plurality of channels and disposed proximate to the inlet end of the plurality of honeycomb substrates; and a second spacer comprising an elongated seal oriented perpendicular to the plurality of channels and disposed proximate the outlet end of the plurality of honeycomb substrates, wherein the second spacer is spaced apart from the first spacer.

23. The apparatus of claim 1, comprising at least one module comprising a plurality of honeycomb stacks arranged side-by-side and spaced apart from one another, wherein: each of the plurality of honeycomb stacks comprises a plurality of the honeycomb substrates stacked one on top of the other with the plurality of channels of the plurality of honeycomb substrates parallel to one another; the housing surrounds all of the plurality of honeycomb stacks; a plurality of heat transfer fluid conduits are defined between each of the honeycomb stacks and between the plurality of honeycomb stacks and the housing wall of the housing; and the housing fluidly isolates the plurality of heat transfer fluid conduits from the plurality of channels passing through each of the plurality of honeycomb substrates.

24. The apparatus of claim 23, wherein the plurality of heat transfer fluid conduits are oriented to provide cross-flow of the heat transfer fluid relative to flow of gases through the plurality of channels extending through the plurality of honeycomb substrates.

25. The apparatus of claim 23, wherein: the heat transfer fluid inlet comprises a heat transfer fluid inlet plenum shaped to direct heat transfer fluid to the plurality of heat transfer fluid conduits; and the heat transfer fluid outlet comprises a heat transfer fluid outlet plenum shaped to receive heat transfer fluid from the plurality of heat transfer fluid conduits.

26. The apparatus of claim 23, comprising a plurality of modules arranged in parallel.

27. The apparatus of claim 26, wherein the apparatus further comprises: a heat transfer fluid manifold in fluid communication with the heat transfer fluid inlet of each of the modules; and a gas inlet manifold in fluid communication with the gas inlet of each of the plurality of modules.

28. The apparatus of claim 1, further comprising: at least one inlet gas flow control device disposed upstream of the inlet end of the at least one honeycomb substrate, wherein the at least one inlet gas flow control device is operable to control flow of gas between the gas inlet and the plurality of channels of the at least one honeycomb substrate; and at least one outlet gas flow control device disposed downstream of the outlet end of the at least one honeycomb substrate, wherein the at least one outlet gas flow control device is operable to control flow of gases between the gas inlet outlet and the plurality of channels of the at least one honeycomb substrate.

29. The apparatus of claim 28, wherein the at least one inlet gas flow control device, the at least one outlet gas flow control device, or both comprises at least one shutter and an actuator operable to transition the at least one shutter between an open position and a closed position.

30. The apparatus of claim 28, wherein: the at least one inlet gas flow control device is spaced apart from the inlet end of the at least one honeycomb substrate; and the at least one outlet gas flow control device is spaced apart from the outlet end of the at least one honeycomb substrate.

31. The apparatus of claim 30, wherein: the plurality of channels of the at least one honeycomb substrate define a substrate volume; the housing, the at least one inlet gas flow control device in a closed position, and the inlet end of the at least one honeycomb substrate define an inlet gas volume; the housing, the at least one outlet gas flow control device in a closed position, and the outlet end of the at least one honeycomb substrate define an outlet gas volume; anda sum of the inlet gas volume and the outlet gas volume is less than or equal to 40% of the substrate volume, less than or equal to 30% of the substrate volume, or even less than or equal to 20% of the substrate volume.

32. The apparatus of claim 31, further comprising: a desorbate line in fluid communication with the inlet gas volume, the outlet gas volume, or both; and a vacuum system in fluid communication with the desorbate line.

33. The apparatus of claim 32, further comprising a purge gas inlet in fluid communication with the inlet gas volume, the outlet gas volume, or both, wherein the purge gas inlet is fluidly coupled to a purge gas source.

34. The apparatus of claim 1, further comprising a suction fan fluidly coupled to the gas outlet and operable to move gas through the plurality of channels in the at least one honeycomb substrate.

35. A system for capturing CO2 from a gas, the system comprising the apparatus of claim 1 and a control system comprising at least one processor, at least one memory module, and machine readable and executable instructions stored on the at least one processor.

36. The system of claim 35, wherein the apparatus comprises: at least one inlet gas flow control device disposed upstream of the inlet end of the at least one honeycomb substrate; at least one outlet gas flow control device disposed downstream of the outlet end of the at least one honeycomb substrate; a suction fan coupled to the gas outlet; a heat transfer fluid flow control valve; and a desorbate line comprising a desorbate control valve and a vacuum system; wherein the at least one inlet gas flow control device, the at least one outlet gas flow control device, the fan, the heat transfer fluid flow control valve, the desorbate control valve, and the vacuum system are communicatively coupled to the control system, and the machine readable and executable instructions, when executed by the at least one processor, causes the system to automatically: transition the at least one inlet gas flow control device and the at least one outlet gas flow control device to open positions;operate the suction fan to cause gas to flow through the plurality of channels of the at least one honeycomb substrate, where the adsorbent material adsorbs carbon dioxide from the gas as the gas passes through the plurality of channels; transition the at least one inlet gas flow control device and the at least one outlet gas flow control device to closed positions; cease operation of the fan; transition the heat transfer fluid control valve to an open position to pass heat transfer fluid through the at least one heat transfer fluid conduit, where the heat transfer fluid heats the adsorbent material to desorb CO2 from the adsorbent material; and following desorption, transition the desorbate control valve to an open position and operate the vacuum system to withdraw desorbed CO2 from the apparatus.

37. The system of claim 36, wherein the machine readable and executable instructions, when executed by the at least one processor, causes the system to automatically: after withdrawal of the desorbed CO2, close the desorbate control valve; close the heat transfer fluid control valve; open the inlet gas flow control device; open the outlet gas flow control device; and operate the suction fan to resume flow of the gas through the at least one honeycomb substrate.

38. The system of claim 35, further comprising a plurality of modules, wherein: each of the plurality of modules comprises the apparatus of claim 1; each of the plurality of modules is communicatively coupled to the control system; and the machine readable and executable instructions, when executed by the control system, cause the system to automatically: operate a first subset of the plurality of modules in an adsorbing mode; and operate a second subset of the plurality of modules in a desorbing mode; wherein a ratio of the number of modules in the first subset to the number of modules in the second subset is 0.5 to 50.

39. An apparatus for CO2 capture, the apparatus comprising:a plurality of honeycomb substrates arranged in a honeycomb stack, each honeycomb substrate comprising an inlet end, an outlet end, and walls defining a plurality of channels extending through the honeycomb substrate from the inlet end to the outlet end, wherein: the plurality of channels of the plurality of honeycomb substrates are parallel to one another; each of the plurality of honeycomb substrates satisfies equation 1 :where kso is a thermal conductivity of a material of construction of the at least one honeycomb substrate, psis a solid material density of the material of construction, and cpsis a heat capacity of the material of construction; and the outer surface of each of the plurality of honeycomb substrates is impermeable to a heat transfer fluid contacting the outer surface; and an adsorbent material disposed within each of the plurality of channels of the plurality of honeycomb substrates.

40. The apparatus of claim 39, further comprising a plurality of honeycomb stacks spaced apart from one another to define heat transfer fluid conduits disposed between each of the honeycomb stacks.

41. The apparatus of claim 40, further comprising a heat transfer fluid source in fluid communication with the heat transfer fluid conduits.

42. The apparatus of claim 40, further comprising spacers disposed between the plurality of honeycomb stacks, where the spacers fluidly isolate the heat transfer conduits from the inlet end and the outlet end of the plurality of channels.

43. The apparatus of claim 40, further comprising a housing surrounding the plurality of honeycomb stacks, wherein the housing is spaced apart from the plurality of honeycomb stacks to define one or more additional heat transfer conduits disposed between the housing and the plurality of honeycomb stacks.

44. A method of capturing carbon dioxide from a gas stream, the method comprising:passing the gas stream to an apparatus comprising a plurality of adsorption modules in parallel, wherein each adsorption module comprises: a plurality of honeycomb substrates having an adsorbent material disposed within a plurality of channels extending through the plurality of honeycomb substrates; a housing; and a plurality of heat transfer conduits defined between the housing and the plurality of honeycomb substrates, between one or more of the plurality of honeycomb substrates, or both; adsorbing CO2 from the gas stream in a first subset of the adsorption modules; desorbing CO2 from the adsorbent material in a second subset of the adsorption modules; wherein, at any given time during operation, a ratio of a number of adsorption modules in the first subset of adsorption modules to a number of adsorption modules in the second subset of adsorption modules is less than or equal to 50.

45. The method of claim 44, wherein adsorbing comprises contacting the gas stream with the adsorbent material disposed within the plurality of channels extending through the plurality of honeycomb substrates in the first subset of adsorption modules at an adsorption temperature.

46. The method of claim 45, wherein the adsorption temperature is less than or equal to 50 °C.

47. The method of claim 45, wherein the adsorbing further comprising passing a cooling fluid through the heat transfer conduits, wherein the cooling fluid maintains the adsorption temperature less than or equal to 50 °C.

48. The method of claim 44, wherein desorbing CO2 in the second subset of the adsorption modules comprises: shutting off glass flow to the plurality of honeycomb substrates in the second subset of adsorption modules; passing a heat transfer fluid through the plurality of heat transfer conduits, wherein the heat transfer fluid increases the temperature of the adsorbent material to a desorption temperature of from 60 °C to 200 °C;desorbing CO2 from the adsorbent material by maintaining the desorption temperature for a desorption period; and evacuating the desorbed CO2 from the second subset of adsorption modules.