Electronic device

By positioning the speaker assembly adjacent to a middle frame assembly with a sound output channel, the speaker assembly's impact on device thickness and sound quality is minimized, enhancing user experience and reducing heat dissipation.

EP4746449A1Pending Publication Date: 2026-05-20HONOR DEVICE CO LTD
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Patent Information

Authority / Receiving Office
EP · EP
Patent Type
Applications
Current Assignee / Owner
HONOR DEVICE CO LTD
Filing Date
2025-01-27
Publication Date
2026-05-20

AI Technical Summary

Technical Problem

The arrangement position of the speaker assembly in electronic devices affects sound-producing effects and increases the thickness of the device, leading to design challenges such as thickness and weight, as well as potential sound output obstruction and PCB layout issues.

Method used

The speaker assembly is positioned adjacent to a middle frame assembly with a sound output channel, allowing sound to be transmitted through a sound output hole and channel, reducing the overall thickness and improving sound output aesthetics while minimizing user obstruction and heat dissipation impacts.

Benefits of technology

This configuration enhances sound-producing effects, reduces device thickness, improves aesthetics, and optimizes heat dissipation, ensuring stable and efficient sound output without obstructing user usage.

✦ Generated by Eureka AI based on patent content.

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Abstract

This application relates to the field of terminal device technologies, and provides an electronic device, including a middle frame assembly, a sound-producing component, and a sound output channel. The middle frame assembly includes a sound output hole. The sound-producing component is located in the electronic device, and the sound-producing component is adjacent to the middle frame assembly. The sound output channel is located in the electronic device, and the sound output channel is disposed on a side of the sound-producing component in a first direction. The first direction is a thickness direction of the electronic device. A sound output side of the sound-producing component faces the sound output channel, and the sound output channel communicates with the sound output side and the sound output hole. In the implementation solution of this application, the sound-producing component may be disposed at a position adjacent to the middle frame assembly, and a sound emitted by the sound-producing component can be transmitted through the sound output channel and the sound output hole, and sent to an outside of the electronic device through the middle frame assembly, thereby effectively reducing impact of structural arrangement of the sound-producing component on an overall thickness of the electronic device while ensuring a sound-producing effect.
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Description

[0001] This application claims priority to Chinese Patent Application No. 202410172105.9, filed with the China National Intellectual Property Administration on February 6, 2024 and entitled "ELECTRONIC DEVICE", which is incorporated herein by reference in its entirety.TECHNICAL FIELD

[0002] Embodiments of this application relate to the field of terminal technologies, and in particular, to an electronic device.BACKGROUND

[0003] A speaker (Speaker, SPK) assembly is an important component for an electronic device such as a personal computer, a tablet, a mobile phone, or a wearable device to implement a sound playing function. To enable a sound emitted by the SPK assembly to be smoothly transmitted to an outside of the electronic device, an arrangement manner of the SPK assembly in the electronic device and arrangement of a sound output channel corresponding to the SPK assembly become important factors that affect sound playing of the electronic device and a specific architecture of the entire device.

[0004] The SPK assembly is either vertically or horizontally placed in the electronic device. Vertically placing the SPK assembly means that a thickness direction of the SPK assembly is set perpendicular to a thickness direction of the entire electronic device, and the sound output channel is disposed on a middle frame. However, a width of the SPK assembly affects an overall architecture of the electronic device, resulting in a relatively large thickness of the entire device. This is not conducive to designs such as thinning and weight reduction of the electronic device.

[0005] Horizontally placing the SPK assembly means that a thickness direction of the SPK assembly is set in a same direction as a thickness direction of the entire electronic device, and the sound output channel is disposed on a bottom housing. However, in a scenario in which a main board of the electronic device is close to the bottom housing, a relatively large notch is disposed on a printed circuit board (Printed Circuit Board, PCB) to make the SPK assembly and the sound output channel be disposed opposite to each other, which is not conducive to a layout area of the PCB. In addition, in some wearable devices, the sound output channel disposed on the bottom housing may be blocked by a user, which is not conducive to application by the user.SUMMARY

[0006] Embodiments of this application provide an electronic device to resolve a technical problem that an arrangement position of an SPK assembly in the electronic device affects a sound-producing effect and increases a thickness of the entire electronic device.

[0007] An embodiment of this application provides an electronic device, including: a middle frame assembly, where the middle frame assembly includes a sound output hole; a sound-producing component, where the sound-producing component is located in the electronic device, and the sound-producing component is adjacent to the middle frame assembly; and a sound output channel, where the sound output channel is located in the electronic device, the sound output channel is disposed on a side of the sound-producing component in a first direction, and the first direction is a thickness direction of the electronic device. A sound output side of the sound-producing component faces the sound output channel, and the sound output channel communicates with the sound output side and the sound output hole. The sound-producing component may be disposed at a position adjacent to the middle frame assembly, and a sound emitted by the sound-producing component can be transmitted through the sound output channel and the sound output hole to be sent to an outside of the electronic device through the middle frame assembly, thereby effectively reducing impact of structural arrangement of the sound-producing component on an overall thickness of the electronic device while ensuring a sound-producing effect.

[0008] In a feasible implementation, the middle frame assembly includes a middle frame sidewall and an extension portion that are connected to each other; the sound output hole is disposed on the middle frame sidewall; and the extension portion is located in the electronic device, and the extension portion is disposed opposite to and has a gap with the sound output side of the sound-producing component in the first direction, to form the sound output channel.

[0009] In a feasible implementation, the middle frame sidewall includes a middle frame appearance surface facing an outside of the electronic device; an end that is of the sound output hole and that is away from the sound output channel extends to the middle frame appearance surface, so that the sound output hole communicates with the outside of the electronic device; and the sound output hole has a first inclination angle relative to a second direction, so that the end that is of the sound output hole and that is away from the sound output channel is located in a middle part of the middle frame appearance surface in the first direction, and the second direction is perpendicular to the first direction. In this way, an outlet of the sound output hole on the middle frame appearance surface can be disposed at a middle position, to improve aesthetics of the electronic device and reduce blocking of the sound output hole by a user in a use process.

[0010] In a feasible implementation, the electronic device further includes a display screen and a bottom housing, and the display screen and the bottom housing are disposed opposite to each other on two sides of the middle frame assembly in the first direction; and the sound-producing component is located between the display screen and the bottom housing, the sound output side of the sound-producing component faces the display screen, and the extension portion is located between the sound-producing component and the display screen. In this way, the sound-producing component can be disposed toward the display screen, thereby reducing impact of structural arrangement of the sound-producing component on structures of other electronic elements in the electronic device. In addition, arrangement of the sound output channel and the sound output hole can further enable a sound output position of the electronic device to be located in the middle frame assembly, thereby improving a sound-producing effect of the sound-producing component.

[0011] In a feasible implementation, the electronic device further includes a display screen and a bottom housing, and the display screen and the bottom housing are disposed opposite to each other on two sides of the middle frame assembly in the first direction; and the sound-producing component is located between the display screen and the bottom housing, the sound output side of the sound-producing component faces the bottom housing, and the extension portion is located between the sound-producing component and the bottom housing. In this way, a heat source of the sound-producing component can be made closer to the display screen, thereby reducing heat dissipation toward a direction of the bottom housing, avoiding a case in which use by a user is affected because a large amount of heat generated by the sound-producing component during working is dissipated through the bottom housing, and improving user experience.

[0012] In a feasible implementation, a thickness of the sound-producing component is less than a width of the sound-producing component, and a thickness direction of the sound-producing component is set in parallel to the first direction. In this way, the sound-producing component can be horizontally placed in the electronic device to reduce impact of the sound-producing component and a limiting structure of the sound-producing component on a thickness of the electronic device.

[0013] In a feasible implementation, a thickness of the sound-producing component is less than a width of the sound-producing component, and a thickness direction of the sound-producing component has a second inclination angle relative to the first direction. In this way, the sound-producing component can be disposed in the electronic device at a relatively small angle, so that a facing direction of the sound output side is closer to an extension direction of the sound output hole, to improve a sound-producing effect of the electronic device.

[0014] In a feasible implementation, the sound output hole includes a transmission section and a sound output end, and the transmission section is connected to the sound output end; and the sound output end is disposed on the middle frame appearance surface, an extension direction of the sound output end faces the second direction, and a width of the sound output end is greater than a width of the transmission section to form a first stepped surface at a joint between the sound output end and the transmission section. In this way, a structure of the sound output hole on the middle frame appearance surface can be modified to improve aesthetics of the electronic device.

[0015] In a feasible implementation, the electronic device further includes a decorative member, the decorative member is disposed at the sound output end, and the decorative member is disposed adjacent to the first stepped surface. In this way, a structure of the sound output hole on the middle frame appearance surface can be modified to improve aesthetics of the electronic device.

[0016] In a feasible implementation, the electronic device further includes a dust cover, an array of sound-transmitting holes is disposed on the dust cover, the dust cover is disposed at the sound output end, and the dust cover is disposed adjacent to the first stepped surface. In this way, while an appearance of the sound output hole is modified, dust entering the electronic device through the sound output hole can be reduced, to improve running stability of the electronic device.

[0017] In a feasible implementation, the sound output hole includes a transmission section and a sound receiving end, and the transmission section is connected to the sound receiving end; the sound receiving end is disposed on a side that is of the middle frame sidewall and that is close to an inside of the electronic device, and a width of the sound receiving end is greater than a width of the transmission section to form a second stepped surface at a joint between the sound receiving end and the transmission section; and the electronic device further includes a first dust filter assembly, the first dust filter assembly is disposed at the sound receiving end, and the first dust filter assembly is disposed adjacent to the second stepped surface. In this way, a dustproof structure can be disposed between the sound output hole and the sound output channel to implement a dustproof function of the electronic device.

[0018] In a feasible implementation, the first dust filter assembly includes a first dust filter and a first adhesive layer, and the first dust filter is bonded to the second stepped surface through the first adhesive layer. In this way, the dustproof structure can be fastened to improve a dustproof effect of the electronic device.

[0019] In a feasible implementation, the electronic device further includes a second dust filter assembly, and the second dust filter assembly is disposed on the sound output side of the sound-producing component; and the second dust filter assembly includes at least a second adhesive layer and a second dust filter, and the second dust filter is disposed on the sound output side of the sound-producing component through the second adhesive layer. In this way, the dustproof structure can be fastened to the sound output side to directly provide a dustproof function for the sound-producing component, and improve the dustproof effect of the electronic device.

[0020] In a feasible implementation, the second dust filter assembly further includes a third adhesive layer and a fastening layer, and the fastening layer is an annular sheet-like structure; and the fastening layer is disposed on a side that is of the second dust filter and that is away from the sound-producing component through the third adhesive layer. In this way, a fastening function can be provided for the dust filter to prevent looseness of the dustproof structure from affecting the sound-producing effect of the sound-producing component.

[0021] In a feasible implementation, the middle frame assembly further includes a retaining wall, the retaining wall is connected to the extension portion, and the retaining wall extends in the first direction; and the retaining wall is disposed adjacent to the sound-producing component. In this way, a limiting function of the middle frame assembly for the sound-producing component can be enhanced, and mounting stability of the sound-producing component can be improved.

[0022] In a feasible implementation, an elastic protrusion is disposed on a side surface that is of the sound-producing component and that is adjacent to the sound output side, and the sound-producing component is in interference fit with the middle frame sidewall and the retaining wall through the elastic protrusion. In this way, a gap between the sound-producing component and each of the middle frame sidewall and the retaining wall can be reduced, thereby improving waterproof performance of the electronic device and preventing water from entering the electronic device.

[0023] In a feasible implementation, the middle frame assembly further includes a support stand, the support stand is disposed between the sound-producing component and the extension portion, and the support stand is connected to the extension portion or the middle frame sidewall; and a gap is provided between support stands connected to the middle frame sidewall, to increase a height of the sound output channel in the first direction. In this way, the sound-producing component can be further limited to avoid a case in which running stability of the electronic device is affected because the sound-producing component shakes in a structure. In addition, in some implementations, the support stand may further clamp the second dust filter assembly together with the sound-producing component.

[0024] In a feasible implementation, the electronic device further includes a circuit board, and the circuit board is disposed on a side that is of the electronic device and that is close to the bottom housing; and the sound-producing component is disposed between the circuit board and the extension portion. In this way, impact of the sound-producing component and a limiting structure on other electronic elements in the electronic device can be reduced, to facilitate arrangement of the other electronic elements in the electronic device.BRIEF DESCRIPTION OF DRAWINGS

[0025] FIG. 1 is a schematic diagram of a partial structure of an electronic device in which an SPK assembly is vertically placed; FIG. 2 is a schematic diagram of a partial structure of an electronic device in which an SPK assembly is horizontally placed; FIG. 3 is a schematic diagram of an electronic device according to an embodiment of this application; FIG. 4 is a schematic diagram of a partial structure of an electronic device according to an embodiment of this application; FIG. 5 is a schematic diagram of a structure of a middle frame assembly according to an embodiment of this application; FIG. 6 is a schematic diagram of an external structure of a sound output hole according to an embodiment of this application; FIG. 7 is a schematic diagram of a structure of a sound output hole provided with a decorative member according to an embodiment of this application; FIG. 8 is a schematic diagram of a structure of an electronic device according to an embodiment of this application; FIG. 9 is a schematic diagram of a structure of another electronic device according to an embodiment of this application; FIG. 10 is a schematic diagram of a structure of a sound output hole provided with a dust cover according to an embodiment of this application; FIG. 11 is a schematic diagram of a structure of an electronic device provided with a first dust filter assembly according to an embodiment of this application; FIG. 12 is a schematic diagram of a structure of an electronic device provided with a second dust filter assembly according to an embodiment of this application; and FIG. 13 is a partially enlarged schematic diagram of a region B in FIG. 12 according to an embodiment of this application. DESCRIPTION OF EMBODIMENTS

[0026] The technical solutions in embodiments of this application are clearly described blow with reference to the accompanying drawings in embodiments of this application.

[0027] In the descriptions of this application, unless otherwise specified, " / " means "or". For example, A / B may represent A or B. In this specification, "and / or" is merely an association relationship for describing associated objects, and represents that three relationships may exist. For example, A and / or B may represent the following three cases: Only A exists, both A and B exist, and only B exists. In addition, "at least one" means one or more, and "a plurality of" means two or more. The words such as "first" and "second" do not limit a quantity or an execution sequence, and the words such as "first" and "second" do not indicate a definite difference.

[0028] It should be noted that in this application, the words such as "example" or "for example" are used to represent giving an example, an illustration, or a description. Any embodiment or design solution described as "example" or "for example" in this application should not be construed as being preferred or advantageous over other embodiments or design solutions. Exactly, use of the words such as "example" or "for example" is intended to present a related concept in a specific manner.

[0029] An application scenario of embodiments of this application is first described below with reference to the accompanying drawings.

[0030] FIG. 1 is a schematic diagram of a partial structure of an electronic device in which an SPK assembly is vertically placed, and FIG. 2 is a schematic diagram of a partial structure of an electronic device in which an SPK assembly is horizontally placed.

[0031] A speaker (Speaker, SPK) assembly is an important component for an electronic device such as a personal computer, a tablet, a mobile phone, or a wearable device to implement a sound playing function. To enable a sound emitted by the SPK assembly to be transmitted to an outside of the electronic device, a sound output channel needs to be disposed on a housing of the electronic device around the disposed SPK assembly, to propagate the sound emitted by the SPK assembly.

[0032] For example, a watch terminal, a wearable device, is used as an electronic device in which the SPK assembly is disposed. As shown in FIG. 1, in some implementations, an electronic device 100 includes a screen 110, a middle frame 120, a rear housing 130, and an SPK assembly 140 disposed in the electronic device 100. The SPK assembly 140 may be vertically placed in the electronic device 100, so that a sound output direction faces the middle frame 120 of the electronic device 100, and two sides of the SPK assembly 140 in a length direction are respectively disposed adjacent to the screen 110 and a bottom housing 120. A middle frame sound output channel 121 is disposed on the middle frame 120 in the sound output direction of the SPK assembly 140, to propagate a sound emitted by the SPK assembly 140 to an outside of the electronic device 100.

[0033] In addition, due to a size limitation of the electronic device 100, to prevent the SPK assembly 140 from occupying architectural space of other electronic components in the device, a body of the SPK assembly 140 may be of a structure that is approximately rectangular, and a protrusion may be disposed on the SPK assembly 140. A specific structure of the SPK assembly 140 is not limited in this application. However, it should be understood that both a length and a width of the SPK assembly 140 are greater than a thickness. When the SPK assembly 140 is vertically placed, a thickness direction of the SPK assembly 140 is perpendicular to a thickness direction of the entire electronic device 100. In this case, a width direction of the SPK assembly 140 is consistent with the thickness direction of the electronic device 100.

[0034] Therefore, when the SPK assembly 140 is vertically placed, the width of the SPK assembly 140 affects an overall thickness of the electronic device 100, and the overall thickness of the electronic device 100 is greater than a sum of the width of the SPK assembly 140 and thicknesses of the screen 110 and the rear housing 130, making the electronic device 100 relatively thick. This is not conducive to actual user experience.

[0035] As shown in FIG. 2, the SPK assembly 140 may alternatively be horizontally placed in the electronic device 100. A sound output direction of the SPK assembly 140 faces a direction of the rear housing 130. To propagate a sound emitted by the SPK assembly 140 that is horizontally placed to an outside of the electronic device 100, a bottom housing sound output channel 131 is disposed on the rear housing 130, and the bottom housing sound output channel 131 communicates with a sound output position of the SPK assembly 140 and an external environment, to propagate the sound.

[0036] However, when the sound output channel 131 is disposed on the rear housing 130 and the electronic device 100 is a watch terminal, after the electronic device 100 is worn by a user, the sound output channel 131 is easily blocked because the rear housing 130 is close to a body of the user. Consequently, sound quality of a sound emitted by the SPK assembly 140 is affected. In addition, when being horizontally placed, the SPK assembly 140 is disposed close to the rear housing 130, which affects an architecture and arrangement position of a printed circuit board in the electronic device 100. Alternatively, a relatively large notch is disposed on the printed circuit board to enable the printed circuit board to avoid an arrangement position of the SPK assembly 140, which is not conducive to a layout area of the printed circuit board.

[0037] To resolve the foregoing problem, embodiments of this application provide an electronic device, to optimize an arrangement position and manner of an SPK assembly through structural arrangement, thereby resolving a problem that the arrangement position of the SPK assembly affects a sound-producing effect and increases a thickness of the entire electronic device.

[0038] FIG. 3 is a schematic diagram of an electronic device according to an embodiment of this application, FIG. 4 is a schematic diagram of a partial structure of an electronic device according to an embodiment of this application, and FIG. 5 is a schematic diagram of a structure of a middle frame assembly according to an embodiment of this application.

[0039] As shown in FIG. 3 and FIG. 4, an electronic device 300 in this embodiment of this application includes at least a middle frame assembly 310, a sound-producing component 320, and a sound output channel 330. A sound output hole 311 is disposed on the middle frame assembly 310, the sound-producing component 320 is disposed in the electronic device 300, and the sound-producing component 320 is disposed adjacent to the middle frame assembly 310. The sound output channel 330 is also located in the electronic device 300, and the sound output channel 330 is disposed on a side of the sound-producing component 320 in a first direction. A sound output side 321 of the sound-producing component 320 faces the sound output channel 330. The sound output channel 330 communicates with the sound output side 321 and the sound output hole 311, so that a sound emitted by the sound-producing component 320 is emitted through the sound output side 321, sequentially passes through the sound output channel 330 and the sound output hole 311, and is transmitted to an outside of the electronic device 300.

[0040] In this embodiment of this application, the first direction is a thickness direction of the electronic device, that is, a Z direction shown in FIG. 4. An X direction shown in FIG. 4 may be a width direction of the electronic device, and the X direction is perpendicular to the Z direction.

[0041] It should be understood that FIG. 4 and subsequent cross-sectional structures used to display the sound-producing component 320 are all an A-A cross-section in FIG. 3. In addition, it should be noted that the A-A cross-section in FIG. 3 is a structure obtained by taking a cross-section at a position at which the sound output hole 311 is disposed.

[0042] For example, to facilitate arrangement of a position of the sound-producing component 320 and reduce an arrangement position occupied by the sound-producing component 320, the sound-producing component 320 may be of a rectangular columnar structure, a length of the sound-producing component 320 is greater than a width of the sound-producing component 320, and the width of the sound-producing component 320 is greater than a thickness of the sound-producing component 320, so that the sound-producing component 320 can be disposed in the electronic device 300.

[0043] It should be understood that the sound-producing component 320 in this embodiment of this application may be of a same speaker structure as the foregoing SPK assembly 140. This is not limited in this application.

[0044] To implement a sound-producing function, a side of the sound-producing component 320 is the sound output side 321, and a facing direction of the sound output side 321 is a sound output direction of the sound-producing component 320. In addition, to implement a better sound-producing effect, the sound output side 321 of the sound-producing component 320 should be a side with a relatively large surface area in the sound-producing component 320. Therefore, in this embodiment, the sound output side 321 may be a side whose length and width are an overall length and an overall width of the sound-producing component 320, so that the sound output side 321 has a relatively large surface area, to facilitate emission of different sounds from the sound output side 321.

[0045] In this embodiment of this application, the first direction is the thickness direction of the electronic device 300. Therefore, the sound output channel 330 is disposed in the thickness direction of the electronic device 300 in which the sound-producing component 320 is located. In this way, when the sound-producing component 320 is horizontally placed or substantially horizontally placed, a sound emitted from the sound output side 321 can be transmitted to the sound output channel 330, so that a sound emitted by the sound-producing component 320 can be smoothly propagated. It should be understood that horizontally placing the sound-producing component 320 means that a thickness direction of the sound-producing component 320 is the same as the thickness direction of the electronic device 300, while substantially horizontally placing the sound-producing component 320 means that there is an included angle between the thickness direction of the sound-producing component 320 and the thickness direction of the electronic device 300. In some embodiments, the included angle is less than 18°, so that an arrangement posture of the sound-producing component 320 is substantially a horizontal placement.

[0046] In some embodiments, to enable the sound-producing component 320 to be stably mounted in the electronic device 300, a bracket (not shown in the figure) is disposed between a side that is of the sound-producing component 320 in the thickness direction and that is opposite to the sound output side 321 and the electronic device 300, and the bracket may be connected to the middle frame assembly 310, thereby maintaining the posture of the sound-producing component 320 to improve mounting stability of the sound-producing component 320. In this embodiment, the bracket may be connected to the middle frame assembly 310 in a connection manner such as a snap-fit connection or a locking screw, thereby providing support and fastening for the sound-producing component 320. It should be noted that the connection manner of the bracket in this embodiment of this application is merely a feasible implementation. In this application, any other connection manner may be used to connect the bracket and the middle frame assembly 310.

[0047] It should be noted that due to relatively significant attenuation of a sound during transmission transmitted in a solid, the sound output channel 330 and the sound output hole 311 are disposed to send the sound emitted by the sound-producing component 320 to the outside of the electronic device 300. The sound output channel 330 may be disposed by using a structure of the middle frame assembly 310, to be jointly formed with the sound-producing component 320. For example, as shown in FIG. 4, the middle frame assembly 310 may include a middle frame sidewall 312 and an extension portion 313 that are connected to each other. The sound output hole 311 is disposed on the middle frame sidewall 312. The extension portion 313 is disposed in the electronic device 300, and the extension portion 313 is disposed opposite to the sound output side 321 of the sound-producing component 320 in the first direction. In addition, there is a gap between the extension portion 313 and the sound output side 321, to form the sound output channel 330.

[0048] In this embodiment of this application, the middle frame sidewall 312 is a main structure of the middle frame assembly 310, that is, a structure in the middle frame assembly 310 for supporting a side surface form of the electronic device 300, and a specific shape and structure of a side surface of the electronic device 300 are determined based on a shape of the middle frame sidewall 312.

[0049] For example, a side that is of the middle frame sidewall 312 and that faces an external environment of the electronic device 300 includes a middle frame appearance surface 3121, and a specific shape of the middle frame appearance surface 3121 affects an appearance of the electronic device 300. As shown in FIG. 4, the middle frame appearance surface 3121 with specific curvature makes a side that is of the middle frame sidewall 312 and that faces the outside of the electronic device 300 have the same curvature, thereby improving overall aesthetics of the electronic device 300. In addition, the middle frame sidewall 312 with curvature can increase some space in the electronic device 300 to facilitate layout of an electronic component disposed adjacent to the middle frame assembly 310.

[0050] The extension portion 313 is disposed opposite to the sound output side 321 in the first direction, and therefore the extension portion 313 is also disposed in the thickness direction of the electronic device 300. Therefore, when the sound-producing component 320 emits a sound through the sound output side 321, the sound is reflected to the sound output hole 311 through the extension portion 313 and propagated to the outside of the electronic device 300.

[0051] The sound output hole 311 can extend from an inside of the electronic device 300 to the outside of the electronic device 300, thereby communicating the sound output channel 330 with the external environment. As shown in FIG. 4, an extension direction of the sound output hole 311 may have a first inclination angle relative to a second direction, so that an end that is of the sound output hole 311 and that is away from the sound output channel 330 is located in a middle part of the middle frame appearance surface 3121 in the first direction, and an opening position of the sound output hole 311 on the middle frame appearance surface 3121 is located in a middle region, thereby improving aesthetics of the electronic device 300 and reducing blocking during use by the user. It should be understood that the width direction of the electronic device 300 is perpendicular to the thickness direction of the electronic device 300, and therefore the second direction is perpendicular to the first direction. In addition, in this embodiment of this application, the middle part of the middle frame appearance surface 3121 in the first direction is a region range, and the region range includes a central position of the middle frame appearance surface 3121 in the first direction. In addition, the region range has a specific size in the first direction, so that the first inclination angle can be reduced without affecting aesthetics of the middle frame appearance surface 3121, thereby preventing excessive inclination of the sound output hole 311 from affecting sound output.

[0052] For example, the second direction may be the X direction shown in FIG. 4.

[0053] In this embodiment of this application, to limit the sound-producing component 320, the sound-producing component 320 is disposed adjacent to the middle frame assembly 310. As shown in FIG. 5, the middle frame assembly 310 may further include a retaining wall 314 and a support stand 315. The retaining wall 314 may be disposed around the sound-producing component 320, and the extension portion 313 and the retaining wall 314 are combined to form a cavity for accommodating the sound-producing component 320.

[0054] The support stand 315 may be disposed on a side that is of the sound output hole 311 and that is close to the inside of the electronic device 300, thereby providing support for the sound-producing component 320 to prevent the sound-producing component 320 from being misplaced or blocking the sound output hole 311. It should be understood that the foregoing structures of the retaining wall 314 and the support stand 315 are both example implementations in this application. Specific structural arrangement of the retaining wall 314 and the support stand 315 may be adjusted to some extent based on a mounting position and a structure of the sound-producing component 320.

[0055] FIG. 6 is a schematic diagram of an external structure of a sound output hole according to an embodiment of this application.

[0056] As shown in (a) in FIG. 6, in some embodiments of this application, the sound output hole 311 may alternatively be a plurality of circular through-holes 311a. For example, the plurality of circular through-holes 311a may be disposed in an array on the middle frame sidewall 312 in a length direction of the sound-producing component 320, thereby communicating with the sound output channel 330 to send the sound emitted by the sound-producing component 320 to the outside of the electronic device 300.

[0057] As shown in (b) in FIG. 6, the sound output hole 311 may alternatively be a plurality of waist-shaped holes 311b. The waist-shaped hole 311b is a strip-shaped hole with two rounded ends, and a length of the waist-shaped hole 311b may be less than or equal to the length of the sound-producing component 320, so that the sound output hole 311 can communicate with the sound output channel 330 to send the sound emitted by the sound-producing component 320 to the outside of the electronic device 300.

[0058] In some embodiments, a diameter of the circular through-hole 311a and a width of the waist-shaped hole 311b may be between 0.6 mm~2 mm, thereby reducing impact of the sound output hole 311 on a structure of the middle frame sidewall 312 while the sound emitted by the sound-producing component 320 can be transmitted.

[0059] It should be noted that the foregoing shape, size, and the like of the sound output hole 311 are merely several feasible implementations in this application, and a specific shape and size of the sound output hole 311 in this application may alternatively be other values. This is not limited in this application. However, it should be understood that for structural security of the electronic device 300, the specific size of the sound output hole 311 is affected by a length and a width of the middle frame assembly 310. For example, a length of the sound output hole 311 needs to be less than a length of a side that is of the middle frame assembly 310 and on which the sound output hole 311 is disposed, and a width of the sound output hole 311 needs to be less than the width of the middle frame assembly 310.

[0060] FIG. 7 is a schematic diagram of a structure of a sound output hole provided with a decorative member according to an embodiment of this application.

[0061] It may be learned from FIG. 6 that when there is the first inclination angle between the extension direction of the sound output hole 311 and the second direction, inclination of the sound output hole 311 affects an overall appearance of the middle frame sidewall 312. In some embodiments of this application, as shown in FIG. 7, a decorative member 340 may be disposed on a side that is of the sound output hole 311 and that is close to the middle frame appearance surface 3121 to improve aesthetics of the overall appearance of the middle frame assembly 310.

[0062] For example, the sound output hole 311 includes a transmission section 3111 and a sound output end 3112. The transmission section 3111 is a hole, in the sound output hole 311, that extends in a direction that has the first inclination with the second direction, and the transmission section 3111 is connected to the sound output end 3112. It should be understood that the sound output end 3112 is disposed on the middle frame appearance surface 3121. When entering the sound output hole 311, the sound emitted by the sound-producing component 320 first passes through the transmission section 3111, and then is transmitted to the outside of the electronic device 300 through the sound output end 3112.

[0063] To modify the appearance of the sound output hole 311 through the sound output end 3112, an extension direction of the sound output end 3112 is the same as the second direction, so that an outlet of the sound output hole 311 faces the side surface of the electronic device 300, thereby adjusting an emission angle of the sound from the electronic device 300 while beautifying the appearance of the middle frame assembly 310, and improving user experience.

[0064] In some embodiments, to dispose the decorative member 340 at the sound output end 3112, a width of the sound output end 3112 may be greater than a width of the transmission section 3111 to form a first stepped surface 3112a at a joint between the sound output end 3112 and the transmission section 3111. It should be understood that to avoid blocking the transmission section 3111, the first stepped surface 3112a is located on two sides of the joint between the sound output end 3112 and the transmission section 3111 in the first direction, so that the decorative member 340 or another component can be disposed through the first stepped surface 3112a.

[0065] For example, the shape of the sound output hole 311 is a waist-shaped hole 311b. In this case, a width of the waist-shaped hole 311b is a length of the waist-shaped hole 311b in the first direction, and when the width of the sound output end 3112 is greater than that of the transmission section 3111, the first stepped surface 3112a is disposed on two sides of the sound output end 3112 in the first direction to form two strip-shaped first stepped surfaces 3112a. In this embodiment of this application, widths of the two first stepped surfaces 3112a may be the same or different. This is not limited in this application.

[0066] In some embodiments, a length of the sound output end 3112 may alternatively be slightly greater than a length of the transmission section 3111, so that the first stepped surface 3112a is formed into an annular plane in which an inner ring is in the shape of the transmission section 3111 and an outer ring is in the shape of the sound output end 3112, to facilitate arrangement of the decorative member 340 or another component.

[0067] For example, as shown in FIG. 7, the electronic device 300 may further include a decorative member 340. The decorative member 340 may be disposed at the sound output end 3112, and the decorative member 340 is disposed adjacent to the first stepped surface 3112a. It should be understood that to enable the sound emitted by the sound-producing component 320 to be transmitted to the outside of the electronic device 300 through the sound output hole 311, the decorative member 340 is also of a structure with a hole. For example, the decorative member 340 may be of an annular structure in which an inner ring is in the shape of the transmission section 3111 and an outer ring is in the shape of the sound output end 3112, so that a sound can be transmitted directly through the hole.

[0068] In some embodiments, the decorative member 340 may be snap-fitted with two side surfaces of the sound output end 3112 in the first direction, to be disposed at the sound output end 3112. In some other embodiments, the decorative member 340 may alternatively be bonded to the first stepped surface 3112a through an adhesive layer, to be disposed at the sound output end 3112. The foregoing manners in which the decorative member 340 is disposed at the sound output end 3112 are merely two implementations in this embodiment of this application. A manner in which the decorative member 340 is disposed at the sound output end 3112 is not limited in this application.

[0069] FIG. 8 is a schematic diagram of a structure of an electronic device according to an embodiment of this application, and FIG. 9 is a schematic diagram of a structure of another electronic device according to an embodiment of this application.

[0070] As shown in FIG. 8 and FIG. 9, to implement a function of the electronic device 300 and protect an overall structure of the electronic device 300, the electronic device 300 may further include a display screen 350 and a bottom housing 360. The display screen 350 and the bottom housing 360 may be disposed opposite to each other on two sides of the middle frame assembly 310 in the first direction, and the display screen 350, the middle frame assembly 310, and the bottom housing 360 jointly enclose to form an appearance structure of the electronic device 300.

[0071] In this embodiment of this application, because the sound emitted by the sound-producing component 320 is transmitted to the outside of the electronic device 300 through the sound output channel 330 and the sound output hole 311, the sound-producing component 320 may be disposed toward the display screen 350, or may be disposed toward the bottom housing 360. As shown in FIG. 8, the sound-producing component 320 is located between the display screen 350 and the bottom housing 360, the sound output side 321 of the sound-producing component 320 faces the display screen 350, the extension portion 313 is located between the sound-producing component 320 and the display screen 350, and a gap between the extension portion 313 and the sound-producing component 320 is the sound output channel 330.

[0072] In this embodiment, the sound output side 321 of the sound-producing component 320 is disposed toward the display screen 350. The sound-producing component 320 that is horizontally placed or substantially horizontally placed can effectively reduce an overall thickness of the electronic device 300, and send a sound to the outside via the sound output hole 311 disposed in the middle frame assembly 310 through the sound output channel 330, thereby reducing a case in which the user blocks the sound output hole 311, and optimizing a sound-producing effect of the sound-producing component 320.

[0073] It should be noted that to dispose the sound-producing component 320 at a position adjacent to the middle frame assembly 310, the sound-producing component 320 and the middle frame assembly 310 may be fastened together by disposing an adhesive layer at a contact position between the sound-producing component 320 and the middle frame assembly 310. Alternatively, the sound-producing component 320 may be snap-fitted with the middle frame assembly 310 by disposing a snap-fit connection member or the like on the middle frame assembly 310. Alternatively, a bracket may be connected to the middle frame assembly 310 in a manner such as a snap-fit connection or a locking screw, to limit the sound-producing component 320 by using the bracket, so that the sound-producing component 320 and the middle frame assembly 310 are fastened together.

[0074] As shown in FIG. 5 and FIG. 8, the middle frame assembly 310 may further include a retaining wall 314. The retaining wall 314 is connected to the extension portion 313, and the retaining wall 314 may extend in the first direction or the thickness direction of the sound-producing component 320. In addition, the retaining wall 314 is disposed adjacent to the sound-producing component 320, thereby limiting the sound-producing component 320 through the retaining wall 314.

[0075] In some embodiments, the retaining wall 314 may extend in a direction close to the bottom housing 360, or the retaining wall 314 may extend in a direction close to the display screen 350. An extension direction of the retaining wall 314 is related to a facing direction of the sound-producing component 320. For example, as shown in FIG. 8, when the sound output side 321 faces the display screen 350, the retaining wall 314 may extend in the direction close to the bottom housing 360.

[0076] For example, because a thickness of the sound-producing component 320 is less than a width of the sound-producing component 320, when the sound-producing component 320 is horizontally placed, that is, when the thickness direction of the sound-producing component 320 is consistent with the thickness direction of the electronic device 300, an overall thickness of the electronic device 300 can be effectively reduced, thereby implementing thinning of the electronic device 300.

[0077] In some embodiments, when the sound-producing component 320 is inclined at a relatively small angle, for example, when an inclination angle of the sound-producing component 320 in the thickness direction is less than 18°, a facing direction of the sound output side 321 can be made closer to the sound output hole 311, thereby facilitating transmission of the sound emitted by the sound-producing component 320. In addition, when the sound-producing component 320 is inclined at a relatively small angle, because the sound-producing component 320 has a protrusion, inclining the sound-producing component 320 at a relatively small angle in actual application may further reduce a scale of the sound-producing component 320 in the first direction, so that the scale of the sound-producing component 320 in the first direction is less than the width of the sound-producing component 320. Therefore, such arrangement of the sound-producing component 320 can thin the electronic device 300. It should be noted that the inclination angle of the sound-producing component 320 in the thickness direction is an included angle relative to the thickness direction of the electronic device 300.

[0078] As shown in (a) and (b) in FIG. 8, in some embodiments of this application, the sound-producing component 320 is inclined, the first direction is a direction a shown in the figure, and the thickness direction of the sound-producing component 320 is a direction b shown in the figure. When the sound-producing component 320 is inclined, the thickness direction of the sound-producing component 320 has a second inclination angle relative to the first direction, and an inclination direction of the sound-producing component 320 faces the sound output hole 311. This shortens a distance between the sound output side 321 and the sound output hole 311 and improves sound transmission efficiency. It should be understood that the second inclination angle is an included angle between the direction a and the direction b shown in (a) in FIG. 8. In this embodiment, a specific value of the second inclination angle may be 8°.

[0079] The sound-producing component 320 is inclined and an extension direction of the extension portion 313 is the same as the second direction. Therefore, when the sound-producing component 320 is inclined, a gap between the extension portion 313 and the sound output side 321 gradually increases from the inside to the outside of the electronic device 300 in the second direction. Therefore, when the sound-producing component 320 is inclined, the sound output channel 330 gradually increases from the inside to the outside of the electronic device 300, so that the sound emitted by the sound-producing component 320 is more easily propagated from the inside of the electronic device 300.

[0080] For example, the specific value of the second inclination angle may be between 0° and 18°, so that a scale variation of the sound-producing component 320 in the thickness direction of the electronic device 300 is relatively small when the sound-producing component 320 is inclined, to improve sound transmission efficiency and reduce impact of the sound-producing component 320 on the thickness of the electronic device 300.

[0081] It should be understood that in some embodiments of this application, a width of an end that is of the sound output hole 311, that is located on the middle frame sidewall 312, and that is close to the sound output channel 330 may be different from a width of an end that is of the sound output hole 311 and that is located on the middle frame appearance surface 3121. The width of the end that is of the sound output hole 311, that is located on the middle frame sidewall 312, and that is close to the sound output channel 330 may be greater than the width of the end that is of the sound output hole 311 and that is located on the middle frame appearance surface 3121, so that the width of the sound output hole 311 gradually decreases from the inside to the outside of the electronic device 300, thereby achieving a purpose of aesthetically pleasing arrangement.

[0082] In this embodiment of this application, the width of the sound output hole 311 indicates scale information of the sound output hole 311 in the first direction. The width of the end that is of the sound output hole 311 and that is disposed on the middle frame appearance surface 3121 may range from 0.6 mm to 2 mm, to improve structural aesthetics while a sound can be propagated.

[0083] It should be noted that the foregoing width range of the sound output hole 311 is merely a feasible implementation in this application. The width range of the sound output hole 311 is not limited in this application.

[0084] As shown in (c) and (d) in FIG. 8, in some embodiments of this application, the sound-producing component 320 may alternatively be horizontally placed, so that the thickness direction of the sound-producing component 320 is the same as the first direction to reduce space occupied by the sound-producing component 320 in the thickness direction of the electronic device 300. In this case, a sound output direction of the sound-producing component 320 is perpendicular to the extension portion 313.

[0085] In some embodiments of this application, to improve mounting stability of the sound-producing component 320, an elastic protrusion 322 may be disposed on the sound-producing component 320 to reduce a gap between the sound-producing component 320 and each of the middle frame sidewall 312 and the retaining wall 314 and improve waterproof performance of the electronic device 300.

[0086] As shown in (a) in FIG. 8, a plurality of elastic protrusions 322 may be disposed on a side surface that is of the sound-producing component 320 and that is adjacent to the sound output side 321. The sound-producing component 320 is in interference fit with the middle frame sidewall 312 and the retaining wall 314 through the elastic protrusions 322, so that the sound-producing component 320 is disposed adjacent to the middle frame assembly 310 and is limited through the middle frame sidewall 312 and the retaining wall 314.

[0087] The elastic protrusions 322 have a specific deformation function. During actual mounting, the elastic protrusions 322 on the sound-producing component 320 closely adhere to the middle frame sidewall 312 and the retaining wall 314, and seal the gap between the sound-producing component 320 and each of the middle frame sidewall 312 and the retaining wall 314, to reduce a gap that is around the sound-producing component 320 and that leads to the inside of the electronic device 300, thereby implementing a waterproof effect.

[0088] It should be understood that the elastic protrusions 322 shown in (a) in FIG. 8 are merely an example description in this application. The elastic protrusion 322 may be of a strip-shaped protruding structure. A specific shape of the elastic protrusion 322 is not limited in this application. However, it should be noted that a height by which the elastic protrusion 322 protrudes from a side surface of the sound-producing component 320 is slightly greater than the gap between the sound-producing component 320 and each of the middle frame sidewall 312 and the retaining wall 314, thereby implementing interference fit. If a protruding height of the elastic protrusion 322 is excessively large, the sound-producing component 320 cannot be placed between the middle frame sidewall 312 and the retaining wall 314.

[0089] In addition, in some embodiments, the elastic protrusion 322 may also be disposed on the retaining wall 314 and / or the middle frame sidewall 312, so that when the sound-producing component 320 is disposed between the middle frame sidewall 312 and the retaining wall 314, the gap between both the middle frame sidewall 312 and the retaining wall 314 and the sound-producing component 320 is reduced, thereby improving waterproof performance of the electronic device 300.

[0090] Further, the elastic protrusion 322 may alternatively be disposed in a scenario in which the sound-producing component 320 is horizontally placed, as shown in (c) or (d) in FIG. 8, to reduce the gap between the sound-producing component 320 and each of the middle frame sidewall 312 and the retaining wall 314. Details are not described in this application.

[0091] In some embodiments, as shown in FIG. 5 and (b) and (d) in FIG. 8, to better dispose the sound-producing component 320 adjacent to the middle frame assembly 310, the middle frame assembly 310 may further include a support stand 315. The support stand 315 is disposed between the sound-producing component 320 and the extension portion 313, and the support stand 315 is connected to the extension portion 313 or the middle frame sidewall 312, thereby forming a structure that is in contact with the sound-producing component 320.

[0092] It should be understood that a function of the support stand 315 is to fasten the sound-producing component 320, and fit with the sound-producing component 320 to fasten a dust filter disposed on the sound output side 321, thereby clamping the dust filter to prevent the dust filter from falling off. To implement the functions of fastening and clamping, the support stand 315 needs to have a specific thickness, and therefore the support stand 315 reduces a width of the sound output channel 330 or increases the overall thickness of the electronic device 300. Therefore, during actual application, as shown in FIG. 5, a gap is disposed between support stands 315 connected to the middle frame sidewall 312, to reduce blocking of the sound output channel 330 and the sound output hole 311 by the support stand 315, and increase a height of the sound output channel 330 at a connection position with the sound output hole 311 in the first direction.

[0093] In addition, to implement other functions, the electronic device 300 further needs to be provided with other electronic elements. For example, as shown in (a) in FIG. 8, the electronic device 300 may further include a circuit board 370. The circuit board 370 is disposed on a side that is of the electronic device 300 and that is close to the bottom housing 360, and the circuit board 370 can provide carrying and architecture functions of a device module for the electronic device 300. To improve utilization of space in the electronic device 300, and avoid reducing an area of the circuit board 370 to provide a mounting position for the sound-producing component 320, the circuit board 370 may be disposed on a side close to the bottom housing 360, to dispose the sound-producing component 320 between the circuit board 370 and the extension portion 313, thereby implementing layout of the circuit board 370. In this way, through structural arrangement, reduction of a layout area of the circuit board 370 can be avoided, and an utilization rate of the space in the electronic device 300 can be improved.

[0094] As shown in FIG. 9, when the sound-producing component 320 in the electronic device 300 is disposed, the sound-producing component 320 is located between the display screen 350 and the bottom housing 360, the sound output side 321 of the sound-producing component 320 faces the bottom housing 360, the extension portion 313 is located between the sound-producing component 320 and the bottom housing 360, and a gap between the extension portion 313 and the sound-producing component 320 is the sound output channel 330.

[0095] In this embodiment, the sound output side 321 of the sound-producing component 320 is disposed toward the bottom housing 360. The sound-producing component 320 that is horizontally placed or substantially horizontally placed can effectively reduce an overall thickness of the electronic device 300, and send a sound to the outside via the sound output hole 311 disposed in the middle frame assembly 310 through the sound output channel 330, thereby reducing a case in which the user blocks the sound output hole 311, and optimizing a sound-producing effect of the sound-producing component 320.

[0096] It should be understood that a side that is of the sound-producing component 320 and that is opposite to the sound output side 321 is a main heat source of the sound-producing component 320. By making the sound output side 321 face the bottom housing 360, a heat dissipation position of the sound-producing component 320 can be made away from the bottom housing 350. Therefore, disposing the sound output side 321 toward the bottom housing 360 further has a function of reducing heat transferred to the user through the bottom housing 360 during working of the sound-producing component 320, thereby improving thermal experience of the user.

[0097] It should be noted that during use of the electronic device 300, the display screen 350 usually faces the user. Therefore, a side on which the display screen 350 is located may be determined as an upper side of the electronic device 300. Correspondingly, a side on which the bottom housing 360 is located is a lower side of the electronic device 300. When the sound output side 321 is disposed toward the bottom housing 360, to avoid instability of fastening the inverted sound-producing component 320, the extension portion 313 and the middle frame sidewall 312 need to provide more stable limiting and support for the sound-producing component 320.

[0098] For example, as shown in FIG. 9, to implement better support and limiting effects, the middle frame assembly 310 may further include the retaining wall 314 in the foregoing embodiment. The retaining wall 314 is connected to the extension portion 313, and the retaining wall 314 extends in a direction close to the display screen 350, thereby providing a limiting function for the sound-producing component 320 disposed close to the display screen 350. As shown in (a) and (b) in FIG. 9, the sound-producing component 320 is inclined at a specific angle, and the thickness direction of the sound-producing component 320 has a second inclination angle relative to the first direction, so that the sound-producing component 320 is inclined to some extent. In addition, an inclination direction of the sound-producing component 320 faces the sound output hole 311. This shortens a distance between the sound output side 321 and the sound output hole 311. For example, a specific value of the second inclination angle may be 8°.

[0099] As shown in (c) and (d) in FIG. 9, in some embodiments of this application, the sound-producing component 320 may alternatively be horizontally placed, so that the thickness direction of the sound-producing component 320 is the same as the first direction to reduce space occupied by the sound-producing component 320 in the thickness direction of the electronic device 300. In this case, a sound output direction of the sound-producing component 320 is perpendicular to the extension portion 313. In this way, a structure that occupies less space in the thickness direction can be obtained, thereby reducing the thickness of the electronic device 300 and optimizing the structure of the electronic device 300.

[0100] Therefore, when the sound output side 321 of the sound-producing component 320 is disposed toward the bottom housing 360, the thickness direction of the sound-producing component 320 may be made same as an actual thickness direction of the electronic device 300, or the sound-producing component 320 may be made inclined at a specific angle. Specific structures of the sound-producing component 320 being horizontally placed and being inclined at a specific angle are the same as the foregoing arrangement manner when the sound output side 321 faces the display screen 350, and a structure that is used to limit a position and reduce the thickness of the electronic device 300 when the sound output side 321 faces the bottom housing 360 is the same as the foregoing structure that is used when the sound output side 321 faces the display screen 350. Details are not described herein in this application.

[0101] FIG. 10 is a schematic diagram of a structure of a sound output hole provided with a dust cover according to an embodiment of this application.

[0102] In some embodiments of this application, because the sound output hole 311 communicates with the inside and the outside of the electronic device 300, there may be an object such as dust that affects an electronic element inside the electronic device 300 in the external environment. Therefore, to reduce impact of a factor such as the dust in the external environment of the electronic device 300, as shown in FIG. 10, the electronic device 300 may further include a dust cover 341. The dust cover 341 is disposed at the sound output end 3112, and the dust cover 341 is disposed adjacent to the first stepped surface 3112a.

[0103] In this embodiment of this application, an array of a plurality of sound-transmitting holes 3411 is disposed on the dust cover 341, so that the sound emitted by the sound-producing component 320 is sent to the outside of the electronic device 300 through the sound-transmitting holes 3411. Further, to improve aesthetics of an appearance of the electronic device 300, a material of the dust cover 341 may be the same as a material of the middle frame assembly 310.

[0104] It should be understood that like the manner in which the decorative member 340 is disposed at the sound output end 3112, the dust cover 341 may be bonded to the first stepped surface 3112a or snap-fitted with two sides of the sound output end 3112 in the first direction, to fasten the dust cover 341 to the sound output end 3112. In some embodiments, only one of the dust cover 341 and the decorative member 340 can be disposed at the sound output end 3112. For example, the dust cover 341 may be disposed at the sound output end 3112 as a special decorative member 340.

[0105] FIG. 11 is a schematic diagram of a structure of an electronic device provided with a first dust filter assembly according to an embodiment of this application.

[0106] Further, a dustproof structure may alternatively be disposed on a side that is of the sound output hole 311 and that is close to the sound output channel 330 to implement a dustproof effect. As shown in (a) in FIG. 11, the sound output hole 311 may further include a transmission section 3111 and a sound receiving end 3113. The transmission section 3111 is connected to the sound receiving end 3113, and the sound receiving end 3113 communicates with the sound output channel 330.

[0107] Specifically, the sound receiving end 3113 is disposed on a side that is of the middle frame sidewall 312 and that is close to the inside of the electronic device 300, and a width of the sound receiving end 3113 is greater than a width of the transmission section 3111 to form a second stepped surface 3113a at a joint between the sound receiving end 3111 and the transmission section 3113. The second stepped surface 3113a may be used to dispose a dustproof structure at a connection position between the sound output channel 330 and the sound output hole 311.

[0108] For example, the electronic device 300 may further include a first dust filter assembly 380. The first dust filter assembly 380 is disposed at the sound receiving end 3113, and the first dust filter assembly 380 is disposed adjacent to the second stepped surface 3113a, so that the first dust filter assembly 380 is disposed at the connection position between the sound output channel 330 and the sound output hole 311. In this way, the first dust filter assembly 380 may be used to provide a dustproof function for the sound-producing component 320.

[0109] In some embodiments of this application, as described in (a) and (b) in FIG. 11, the first dust filter assembly 380 may include a first dust filter 381 and a first adhesive layer 382. The first dust filter 381 is bonded to the second stepped surface 3113a through the first adhesive layer 382, so that the first dust filter 381 is disposed at the connection position between the sound output channel 330 and the sound output hole 311.

[0110] In some embodiments, the first dust filter 381 includes a flexible dust filter and a hard dust filter that is wrapped around the flexible dust filter. The flexible dust filter may be made of nylon or another flexible material, while the hard dust filter may be made of metal. A hole of the hard dust filter is relatively large. The hard dust filter can support the flexible dust filter to maintain a form of the flexible dust filter, thereby preventing the first dust filter 381 from losing a support effect. For example, the hard dust filter may be of an L-shaped structure, and one portion of the hard dust filter is bonded to the second stepped surface 3113a, and the other portion is bonded to the extension portion 313, thereby improving a fastening effect of the flexible dust filter through fastening to the extension portion 313.

[0111] It should be noted that structural arrangement of the first dust filter 381 is merely a feasible implementation in this application. A structure and an arrangement manner of the first dust filter 381 are not limited in this application.

[0112] As shown in (b) in FIG. 11, a position that is of the display screen 350 and that is away from the bottom housing 360 is used as a top-view angle to obtain a cross-sectional structure of the connection position between the sound output channel 330 and the sound output hole 311. In some embodiments, because the sound output hole 311 is relatively long, a fastening block 3113b may be disposed at a middle position of the sound output end 3113. The fastening block 3113b protrudes from a surface of the sound receiving end 3113, and a side surface of the fastening block 3113b is disposed adjacent to the first dust filter assembly 380. For example, a side of the fastening block 3113b may be bonded to the first dust filter 381 through the first adhesive layer 382, thereby achieving a purpose of strengthening the first dust filter assembly 380.

[0113] FIG. 12 is a schematic diagram of a structure of an electronic device provided with a second dust filter assembly according to an embodiment of this application, and FIG. 13 is a partially enlarged schematic diagram of a region B in FIG. 12 according to an embodiment of this application.

[0114] In some embodiments of this application, because the dustproof structure is mainly used to protect the sound-producing component 320 communicating with the sound output channel 330, a dustproof structure may alternatively be directly disposed between the sound-producing component 320 and the sound output channel.

[0115] As shown in FIG. 12 and FIG. 13, in some embodiments of this application, the electronic device 300 may include a second dust filter assembly 390. The second dust filter assembly 390 is disposed on the sound output side 321 of the sound-producing component 320. The second dust filter assembly 390 includes at least a second adhesive layer 391 and a second dust filter 392, and the second dust filter 392 is disposed on the sound output side 321 of the sound-producing component 320 through the second adhesive layer 391.

[0116] The second dust filter 392, a mesh structure whose area is greater than or equal to an area of the sound output side 321, is used to prevent dust outside the electronic device 300 from entering the sound-producing component 320 and from affecting a sound-producing effect of the sound-producing component 320. The second adhesive layer 391 is of an annular sheet-like structure, and the second adhesive layer 391 is disposed between the sound output side 321 and the second dust filter 392, to fasten the second dust filter 392 to the sound output side 321 without affecting sound output of the sound output side 321.

[0117] In some embodiments, the support stand 315 may not be disposed around the entire sound-producing component 320. As shown in FIG. 13, to reduce a problem such as falling off or wrinkling of the second adhesive layer 391 during prolonged use of the second dust filter 392, in some embodiments, the second dust filter assembly 390 may further include a third adhesive layer 393 and a fastening layer 394. The fastening layer 394 is of an annular sheet-like structure or a sheet-like structure with a hollow, and the fastening layer 394 is disposed on a side that is of the second dust filter 392 and that is away from the sound-producing component 320 through the third adhesive layer 393. It should be understood that shapes and structures of the fastening layer 394 and the third adhesive layer 393 are merely example descriptions in this embodiment of this application. In actual application, there may be other structures that do not affect sound output of the sound-producing component 320. Details are not described herein in this application.

[0118] The third adhesive layer 393 and the second adhesive layer 392 may be made of any material that has an adhesive property and that can be used to bond the electronic device 300. Materials used for the third adhesive layer 393 and the second adhesive layer 392 may be the same or different. This is not limited in this application.

[0119] In some embodiments, the fastening layer 394 may be a metal sheet to support and fasten the second dust filter 392 through a high stiffness characteristic of the metal sheet. Further, during actual application, to enhance mounting stability of the extension portion 313 and the sound-producing component 320, a fourth adhesive layer 395 is disposed on a side that is of the fastening layer 394 and that is away from the second dust filter 392, so that the fourth adhesive layer 395 is bonded to the extension portion 313 to improve mounting stability of the sound-producing component 320. It should be noted that the foregoing structural stacking of the second dust filter assembly 390 is merely an optional specific solution. Removing some of the adhesive layers or adjusting a position relationship between the second dust filter 392 and the fastening layer 394 still falls within the protection scope of this patent.

[0120] It should be noted that a person skilled in the art can easily figure out another implementation solution of this application after considering this specification and practicing this application that is disclosed herein. This application is intended to cover any variations, functions, or adaptive changes of this application. These variations, functions, or adaptive changes comply with general principles of this application, and include common knowledge or a commonly used technical means in the art that is not disclosed in this application. This specification and the embodiments are merely considered as examples, and the actual scope of this application is pointed out by the following claims.

[0121] It should be understood that this application is not limited to the precise structures described above and shown in the accompanying drawings, and various modifications and changes may be made without departing from the scope thereof. The scope of this application is limited only by the appended claims.

Claims

1. An electronic device, comprising: a middle frame assembly, wherein the middle frame assembly comprises a sound output hole; a sound-producing component, wherein the sound-producing component is located in the electronic device, and the sound-producing component is adjacent to the middle frame assembly; and a sound output channel, wherein the sound output channel is located in the electronic device, the sound output channel is disposed on a side of the sound-producing component in a first direction, and the first direction is a thickness direction of the electronic device, wherein a sound output side of the sound-producing component faces the sound output channel, and the sound output channel communicates with the sound output side and the sound output hole.

2. The electronic device according to claim 1, wherein the middle frame assembly comprises a middle frame sidewall and an extension portion that are connected to each other; the sound output hole is disposed on the middle frame sidewall; and the extension portion is located in the electronic device, and the extension portion is disposed opposite to and has a gap with the sound output side of the sound-producing component in the first direction, to form the sound output channel.

3. The electronic device according to claim 2, wherein the middle frame sidewall comprises a middle frame appearance surface facing an outside of the electronic device; an end that is of the sound output hole and that is away from the sound output channel extends to the middle frame appearance surface, so that the sound output hole communicates with the outside of the electronic device; and the sound output hole has a first inclination angle relative to a second direction, so that the end that is of the sound output hole and that is away from the sound output channel is located in a middle part of the middle frame appearance surface in the first direction, and the second direction is perpendicular to the first direction.

4. The electronic device according to claim 3, wherein the electronic device further comprises a display screen and a bottom housing, and the display screen and the bottom housing are disposed opposite to each other on two sides of the middle frame assembly in the first direction; and the sound-producing component is located between the display screen and the bottom housing, the sound output side of the sound-producing component faces the display screen, and the extension portion is located between the sound-producing component and the display screen.

5. The electronic device according to claim 3, wherein the electronic device further comprises a display screen and a bottom housing, and the display screen and the bottom housing are disposed opposite to each other on two sides of the middle frame assembly in the first direction; and the sound-producing component is located between the display screen and the bottom housing, the sound output side of the sound-producing component faces the bottom housing, and the extension portion is located between the sound-producing component and the bottom housing.

6. The electronic device according to claim 4 or 5, wherein a thickness of the sound-producing component is less than a width of the sound-producing component, and a thickness direction of the sound-producing component is set in parallel to the first direction.

7. The electronic device according to claim 4 or 5, wherein a thickness of the sound-producing component is less than a width of the sound-producing component, and a thickness direction of the sound-producing component has a second inclination angle relative to the first direction.

8. The electronic device according to claim 3, wherein the sound output hole comprises a transmission section and a sound output end, and the transmission section is connected to the sound output end; and the sound output end is disposed on the middle frame appearance surface, an extension direction of the sound output end faces the second direction, and a width of the sound output end is greater than a width of the transmission section to form a first stepped surface at a joint between the sound output end and the transmission section.

9. The electronic device according to claim 8, wherein the electronic device further comprises a decorative member, the decorative member is disposed at the sound output end, and the decorative member is disposed adjacent to the first stepped surface.

10. The electronic device according to claim 8, wherein the electronic device further comprises a dust cover, an array of sound-transmitting holes is disposed on the dust cover, the dust cover is disposed at the sound output end, and the dust cover is disposed adjacent to the first stepped surface.

11. The electronic device according to claim 3, wherein the sound output hole comprises a transmission section and a sound receiving end, and the transmission section is connected to the sound receiving end; the sound receiving end is disposed on a side that is of the middle frame sidewall and that is close to an inside of the electronic device, and a width of the sound receiving end is greater than a width of the transmission section to form a second stepped surface at a joint between the sound receiving end and the transmission section; and the electronic device further comprises a first dust filter assembly, the first dust filter assembly is disposed at the sound receiving end, and the first dust filter assembly is disposed adjacent to the second stepped surface.

12. The electronic device according to claim 11, wherein the first dust filter assembly comprises a first dust filter and a first adhesive layer, and the first dust filter is bonded to the second stepped surface through the first adhesive layer.

13. The electronic device according to claim 1, wherein the electronic device further comprises a second dust filter assembly, and the second dust filter assembly is disposed on the sound output side of the sound-producing component; and the second dust filter assembly comprises at least a second adhesive layer and a second dust filter, and the second dust filter is disposed on the sound output side of the sound-producing component through the second adhesive layer.

14. The electronic device according to claim 13, wherein the second dust filter assembly further comprises a third adhesive layer and a fastening layer, and the fastening layer is of an annular sheet-like structure; and the fastening layer is disposed on a side that is of the second dust filter and that is away from the sound-producing component through the third adhesive layer.

15. The electronic device according to claim 2, wherein the middle frame assembly further comprises a retaining wall, the retaining wall is connected to the extension portion, and the retaining wall extends in the first direction; and the retaining wall is disposed adjacent to the sound-producing component.

16. The electronic device according to claim 15, wherein an elastic protrusion is disposed on a side surface that is of the sound-producing component and that is adjacent to the sound output side, and the sound-producing component is in interference fit with the middle frame sidewall and the retaining wall through the elastic protrusion.

17. The electronic device according to claim 3, wherein the middle frame assembly further comprises a support stand, the support stand is disposed between the sound-producing component and the extension portion, and the support stand is connected to the extension portion or the middle frame sidewall; and a gap is disposed between support stands connected to the middle frame sidewall, to increase a height of the sound output channel in the first direction.

18. The electronic device according to claim 4, wherein the electronic device further comprises a circuit board, and the circuit board is disposed on a side that is of the electronic device and that is close to the bottom housing; and the sound-producing component is disposed between the circuit board and the extension portion.