Composite thermal barrier and method

Abstract

Battery modules, battery packs, thermal barriers and associated methods are disclosed. A device may include a number of battery cells. A device include at least one thermal barrier separating selected battery cells in the number of battery cells, the thermal barrier including an insulator layer; a dielectric reinforcing layer.

Description

COMPOSITE THERMAL BARRIER AND METHODClaim of Priority

[0001] This application claims priority to U.S. Provisional Application No. 63 / 534,056, filed August 22, 2023; U.S. Provisional Application No. 63 / 546,037. filed October 27, 2023; U.S. Provisional Application No. 63 / 618,143. filed January 5, 2024, which are incorporated by reference herein in their entireties.Technical Field

[0002] The present disclosure relates generally to materials and systems and methods for preventing or mitigating thermal events, such as thermal runaway issues, in energy storage systems. In particular, the present disclosure provides thermal barrier materials. The present disclosure further relates to a battery module or pack with one or more battery cells that includes the thermal barrier materials, as well as systems including those battery modules or packs. Aspects described generally may include aerogel materials.Background

[0003] Lithium-ion batteries (LIBs) are widely used in powering portable electronic devices such as cell phones, tablets, laptops, power tools and other high-current devices such as electric vehicles because of their high working voltage, low memory effects, and high energy density compared to traditional batteries. However, safety is a concern as LIBs are susceptible to catastrophic failure under ‘‘abuse conditions” such as when a rechargeable battery' is overcharged (being charged beyond the designed voltage), over-discharged, operated at or exposed to high temperature and high pressure. Although LIBs are used as an example, the technology7of the present disclosure may be used with any ty pe of battery.

[0004] To prevent cascading thermal runaway events from occurring, there is a need for effective insulation and heat dissipation strategies to address these and other technical challenges of LIBs.Brief Description of the Drawings

[0005] FIG. 1 A shows a baten’ module in accordance with some aspects.

[0006] FIG. 1 B shows another batery module in accordance with some aspects.

[0007] FIG. 2 shows a thermal barrier in accordance with some aspects.

[0008] FIG. 3 shows another thermal barrier in accordance with some aspects.

[0009] FIG. 4 shows another thermal barrier in accordance with some aspects.

[0010] FIG. 5 shows another thermal barrier in accordance with some aspects.

[0011] FIG. 6 A shows another thermal barrier in accordance with some aspects.

[0012] FIG. 6B shows a cross section view of a baten’ module in accordance with some aspects.

[0013] FIG. 6C shows a cross section view of a batten- module in accordance with some aspects.

[0014] FIG. 6D shows another cross section view of a battery module in accordance with some aspects.

[0015] FIG. 7A shows another thermal barrier in accordance with some aspects.

[0016] FIG. 7B shows a cross section view of a thermal barrier in accordance with some aspects.

[0017] FIG. 7C shows another cross section view of a thermal barrier in accordance with some aspects.

[0018] FIG. 8A shows another cross section view’ of a thermal barrier in accordance with some aspects.

[0019] FIG. 8B shows another cross section view of a thermal barrier in accordance with some aspects.

[0020] FIG. 9A shows another thermal barrier in accordance with some aspects.

[0021] FIG. 9B shows another thermal barrier in accordance with some aspects.

[0022] FIG. 10A shows another thermal barrier in accordance with some aspects.

[0023] FIG. 10B shows another thermal barrier in accordance with some aspects.

[0024] FIG. 11 A shows an isometric exploded view of a battery module in accordance with some aspects.

[0025] FIG. 1 IB shows selected cross sections of thermal barriers and housing portions in accordance with some aspects.

[0026] FIG. 12 shows an isometric exploded view of a battery7module in accordance with some aspects.

[0027] FIG. 13 A shows another thermal barrier and a battery cell in accordance with some aspects.

[0028] FIG. 13B shows an end view of another thermal barrier and a battery7cell in accordance with some aspects.

[0029] FIG. 13C shows an isometric view of another thermal barrier in accordance with some aspects.

[0030] FIG. 14A shows an exploded view of another thermal barrier in accordance with some aspects.

[0031] FIG. 14B shows an exploded view of another thermal barrier in accordance with some aspects.

[0032] FIG. 14C shows an exploded view of another thermal barrier in accordance with some aspects.

[0033] FIG. 15 A shows a cross section view of another thermal barrier in accordance with some aspects.

[0034] FIG. 15B shows a cross section view of another thermal barrier in accordance with some aspects.

[0035] FIG. 15C shows a cross section view of another thermal barrier in accordance with some aspects.

[0036] FIG. 15D shows an exploded view of another thermal barrier in accordance with some aspects.

[0037] FIG. 16 shows a cross section view of a battery' module in accordance with some aspects

[0038] FIG. 17 shows an electronic device in accordance with some aspects.

[0039] FIG. 18 shows an electric vehicle in accordance with some aspects.Description of Embodiments

[0040] The following description and the drawings sufficiently illustrate specific embodiments to enable those skilled in the art to practice them. Other embodiments may incorporate structural, logical, electrical, process, and other changes. Portions and features of some embodiments may be included in, or substituted for, those of other embodiments. Embodiments set forth in the claims encompass all available equivalents of those claims.

[0041] Thermal barriers can be used in battery modules to compartmentalize individual battery cells, or groups of battery cells in a battery device. Thermal barriers may include one or more of an insulation material layer, a dielectric reinforcing layer, abrasion resistantan abrasion resistant layer, a thermal conductor layer, a resilient material layer, and combinations thereof. Any one or more of these layers may be configured to have an outer perimeter that is co-extensive with adjacent battery cells or have one or more sides with an edge that extends beyond a corresponding side. These one or more “extended edges’’ can extend beyond a corresponding edge of a cell to form an interference fit with an interior of a battery module housing, as described in aspects and aspects below. Multiple battery cells that are coupled together are referred to in the present disclosure as battery modules. However, devices and methods described can be used in any of several types of multiple battery cell arrangements, that may be termed battery packs, battery7systems, etc.Insulation Material Layer

[0042] Insulation materials as described below can be used as a single heat resistant layer, or in combination with other layers that provide additional function to a multilayer configuration, such as mechanical strength, compressibility, heat dissipation / conduction. etc. Insulator layers described herein are responsible for reliably containing and controlling heat flow from heat-generating parts in small spaces and to provide safety7and prevention of fire propagation for such products in the fields of electronic, industrial and automotive technologies.

[0043] In many aspects of the present disclosure, the insulator layer functions as a flame / fire deflector layer either by itself or in combination with other materials that enhance performance of containing and controlling heat flow. For example, the insulator layer may itself be resistant to flame and / or hot gases and further include entrained particulate materials that modify or enhance heat containment and control.Aerogels in the insulation material layer

[0044] One highly effective material used within an insulator layer is an aerogel. Aerogels describe a class of material based upon their structure, namely low density, open cell structures, large surface areas (often 900 m2 / g or higher) and subnanometer scale pore sizes. The pores may be filled with gases such as air. Aerogels can be distinguished from other porous materials by their physical and structural properties. Although an aerogel material is an exemplary insulation material, the invention is not so limited. Other thermal insulation material layers may also be used in aspects of the present disclosure.

[0045] Selected illustrations of aerogel formation and properties are described. In several illustrations, a precursor material is gelled to form a network of pores that are filled with solvent. The solvent is then extracted, leaving behind a porous matrix. A variety of different aerogel compositions are known, and they may be inorganic, organic and inorganic / organic hybrid. Inorganic aerogels are generally based upon metal alkoxides and include materials such as silica, zirconia, alumina, and other oxides. Organic aerogels include, but are not limited to, urethane aerogels, resorcinol formaldehyde aerogels, and polyimide aerogels.

[0046] Inorganic aerogels may be formed from metal oxide or metal alkoxide materials. The metal oxide or metal alkoxide materials may be based on oxides or alkoxides of any metal that can form oxides. Such metals include, but are not limited to silicon, aluminum, titanium, zirconium, hafnium, yttrium, vanadium, cerium, and the like. Inorganic silica aerogels are traditionally made via the hydrolysis and condensation of silica-based alkoxides (such as tetraethoxylsilane), or via gelation of silicic acid or water glass. Other relevant inorganic precursor materials for silica based aerogel synthesis include, but are not limited to metal silicates such as sodium silicate or potassium silicate,alkoxysilanes, partially hydrolyzed alkoxysilanes, tetraethoxylsilane (TEOS), partially hydrolyzed TEOS, condensed polymers of TEOS, tetramethoxylsilane (TMOS), partially hydrolyzed TMOS, condensed polymers of TMOS, tetra-n- propoxysilane, partially hydrolyzed and / or condensed polymers of tetra-n- propoxysilane, polyethylsilicates, partially hydrolyzed polyethysilicates, monomeric alkylalkoxy silanes, bis-trialkoxy alkyl or aryl silanes, polyhedral silsesquioxanes, or combinations thereof.

[0047] In certain embodiments of the present disclosure, pre-hydrolyzed TEOS, such as Silbond H-5 (SBH5, Silbond Corp), which is hydrolyzed with a water / silica ratio of about 1.9-2, may be used as commercially available or may be further hydrolyzed prior to incorporation into the gelling process. Partially hydrolyzed TEOS or TMOS, such as polyethysilicate (Silbond 40) or polymethylsilicate may also be used as commercially available or may be further hydrolyzed prior to incorporation into the gelling process.

[0048] Inorganic aerogels can also include gel precursors comprising at least one hydrophobic group, such as alkyl metal alkoxides, cycloalkyl metal alkoxides, and aryl metal alkoxides, which can impart or improve certain properties in the gel such as stability and hydrophobicity7. Inorganic silica aerogels can specifically include hydrophobic precursors such as alkylsilanes or arylsilanes. Hydrophobic gel precursors may be used as primary precursor materials to form the framework of a gel material. However, hydrophobic gel precursors are more commonly used as co-precursors in combination with simple metal alkoxides in the formation of amalgam aerogels. Hydrophobic inorganic precursor materials for silica based aerogel synthesis include, but are not limited to trimethyl methoxysilane, dimethyl dimethoxysilane (DMDMS), methyl trimethoxysilane (MTMS), trimethyl ethoxysilane, dimethyl diethoxysilane (DMDS), methyl triethoxysilane (MTES), ethyl triethoxysilane (ETES), diethyl diethoxysilane, dimethyl diethoxysilane (DMDES). ethyl triethoxysilane, propyl trimethoxysilane, propyl triethoxysilane, phenyl trimethoxysilane, phenyl triethoxysilane (PhTES), hexamethyldisilazane and hexaethyldisilazane, and the like. Any derivatives of any of the above precursors may be used and specifically certain polymeric of other chemical groups may be added or cross-linked to one or more of the above precursors.

[0049] Organic aerogels are generally formed from carbon-based polymeric precursors. Such polymeric materials include, but are not limited to resorcinol formaldehydes (RF). polyimide, polyacrylate, polymethyl methacrylate, acrylate oligomers, polyoxyalkylene, polyurethane, polyphenol, polybutadiane, trialkoxysilyl-terminated polydimethylsiloxane, polysty rene, polyacrylonitrile, polyfurfural, melamine-formaldehyde. cresol formaldehyde, phenol-furfural. polyether, polyol, polyisocyanate, polyhydroxybenze, polyvinyl alcohol dialdehyde, polycyanurates, polyacrylamides, various epoxies, agar, agarose, chitosan, and combinations thereof. As one example, organic RF aerogels are ty pically made from the sol-gel polymerization of resorcinol or melamine wi th formaldehyde under alkaline conditions.

[0050] Organic / inorganic hybrid aerogels are mainly comprised of (organically modified silica (“ormosil”) aerogels. These ormosil materials include organic components that are covalently bonded to a silica netyvork. Ormosils are typically formed through the hydrolysis and condensation of organically modified silanes, R-Si(OX)s, with traditional alkoxide precursors, Y(0X)4. In these formulas, X may represent, in some aspects, CH3, C2H5, C3H7, C4H9; Y may represent, in some aspects, Si, Ti, Zr, or Al; and R may be any organic fragment such as methyl, ethyl, propyl, butyl, isopropyl, methacrylate, acrylate, vinyl, epoxide, and the like. The organic components in ormosil aerogel may also be dispersed throughout or chemically bonded to the silica network.

[0051] Aerogels can be formed from flexible gel precursors. Various flexible layers, including flexible fiber-reinforced aerogels, can be readily combined and shaped to give pre-forms that when mechanically compressed along one or more axes, give compressively strong bodies along any of those axes.

[0052] One method of aerogel formation includes batch casting. Batch casting includes catalyzing one entire volume of sol to induce gelation simultaneously throughout that volume. Gel-forming techniques include adjusting the pH and / or temperature of a dilute metal oxide sol to a point where gelation occurs. Suitable materials for forming inorganic aerogels include oxides of most of the metals that can form oxides, such as silicon, aluminum, titanium, zirconium, hafnium, yttrium, vanadium, and the like. Particularly preferred are gels formed primarily from alcohol solutions of hydrolyzed silicate esters due totheir ready availability and low cost (alcogel). Organic aerogels can also be made from melamine formaldehydes, resorcinol formaldehydes, and the like.

[0053] In one aspect, aerogel materials may be monolithic, or continuous throughout a structure or layer. In other aspects, an aerogel material may include a composite aerogel material with aerogel particles that are mixed with a binder or carrier. Other additives may be included in a composite aerogel material, including, but not limited to, surfactants that aid in dispersion of aerogel particles within a binder or carrier. A composite aerogel slurry may be applied to a supporting plate such as a mesh, felt, web, etc. and then dried to form a composite aerogel structure.Reinforcement of the Insulation Material Laver

[0054] As noted above, an aerogel may be organic, inorganic, or a mixture thereof. In some aspects, the aerogel includes a silica-based aerogel. One or more layers in a thermal barrier may include reinforcement material. In some aspects, a reinforcement material is combined with the aerogel material (e.g., a monolithic aerogel, a particulate aerogel) to elements of the insulator layer. The reinforcing material may be any material that provides resilience, conformability, or structural stability to the aerogel material that it is integral with. Aspects of reinforcing materials include, but are not limited to, open-cell macroporous framework reinforcement materials, closed-cell macroporous framework reinforcement materials, open-cell membranes, honeycomb reinforcement materials, polymeric reinforcement materials, and fiber reinforcement materials such as discrete fibers, woven materials, non-woven materials, needled non-wovens, battings, webs, mats, and felts.

[0055] The reinforcement material can be selected from organic polymer-based fibers, inorganic fibers, carbon-based fibers or a combination thereof. The inorganic fibers may be selected from glass fibers, rock fibers, metal fibers, boron fibers, ceramic fibers, basalt fibers, other inorganic fibers, or combinations thereof. The organic polymer-based fibers may be selected from polyester polypropylene fibers, acrylic fibers, polyvinyl chloride fibers, aramid fibers, spandex fibers, nylon fibers, pre-oxidized fibers, pre-oxidized polyacrylonitrile (OP AN) fibers, other organic fibers, or combinations thereof.In some aspects, the reinforcement material can include a plurality of layers of material.Dielectric Reinforcing Laver

[0056] The thermal barrier further includes a dielectric reinforcing layer in addition to the insulation material layer. The dielectric reinforcing layer provides mechanical strength to the thermal barrier in addition to other functions. Its low electrical conductivity prevents inadvertent electric short circuit in the battery module or pack. The dielectric reinforcing layer comprises dielectric materials selected from ceramics, glass, rubber, oil, paper, resins, epoxy resins, plastics, and polymers, such as polyethylene, polypropylene, polytetrafluoroethylene, polyvinylchloride (PVC), PVC elastomeric materials, PVC rigid materials, other dielectric materials, and combinations thereof.

[0057] Alternatively, the dielectric reinforcing layer may comprise mica. The advantage of using mica as dielectric reinforcing layers includes the low thermal conductivity and abundant availability of such materials at a low cost. Mica also occurs naturally in sheets or sheet-like forms that provide good structural properties at a low cost. In contrast to powdered dielectric materials, sheets of mica are mechanically strong, and provide the desired reinforcement and encapsulation for the insulator layer. In one aspect, the dielectric reinforcing layer includes mica particles bound together with binders (e.g., a polymer binder) to form a structural sheet. In one aspect, the dielectric reinforcing layer is flexible. In one aspect, the binders may include a silicone-based polymer, although the disclosure is not so limited. Silicone polymers have the advantage of high heat resistance, and low thermal conductivity. In one aspect, a thickness of the mica dielectric reinforcing layer ranges from less than about 1 pm, about 1 pm to about 10 pm, about 10 pm to about 100 pm, about 100 pm to about 1 mm, or any ranges therebetween.Abrasion Resistant Laver

[0058] The thermal barrier may further include an abrasion resistant layer in addition to the insulation material layer and the dielectric reinforcing layer. The abrasion resistant layer improves the durability of at least the major surfaces of the thermal barrier to impingement of particle bombardments duringextreme conditions, such as thermal runaway. During a thermal runaway event, particulate ejecta from a batten’ cell (e.g., from a battery anode, from a cathode, and / or from structural components of a battery) may be heated to temperatures greater than 500°C and propelled against a (major or minor) surface of a thermal barrier with significant force caused by the combustion of lithium battery materials. These particles, often microns or millimeters in size, are abrasive and can erode unprotected insulation materials (e.g., fiber reinforced aerogels) during the course of a thermal event. This erosion can in turn breach the protection provided by an insulator layer that is intended to prevent a first cell in thermal runaway from igniting adjacent cells. An abrasion resistant layer can be configured to resist the abrasion from ejecta, thereby preserving the underlying thermal insulator layer and the protection it provides adjacent cells.

[0059] In some aspects, the abrasion resistant layer may be formed from any one or more materials that will not erode (or erode slowly) when bombarded with thermal runaway ejecta.

[0060] The abrasion resistant layer may comprise one or more materials selected from silicone glass, silicone glass fabric, glass silicone tape, metal or metal alloy, polycarbonate, Aramid, laminated glass, fiber glass, plexiglass, acrylic, other abrasion resistant layers, or combinations thereof. In one aspect, the abrasion resistant layer may comprise an elastomer or an elastomer reinforced by another material, such as glass fiber. In the case of silicon glass fabrics, the material may include a glass fabric and / or a glass cloth with silicone rubber / resin coating or infiltration. In the case of glass silicone tapes, the glass silicone tape may be a glass silicone tape with PSA silicone adhesive. The metal or metal alloy may include steel, aluminum, other suitable metal or alloy, or combinations thereof. The abrasion resistant layer may also include any materials that may be included in the dielectric reinforcing layer.

[0061] The abrasion resistant layer may have a thickness of about 0.01 mm to about 5 mm. about 0. 1 mm to about 3 mm, about 0. 1 mm to about 1 mm, about 0.1 mm to about 0.5 mm, about 0.2 mm to about 0.3 mm, or any ranges therebetween.

[0062] In some aspects, the abrasion resistant layer may be a flexible layer. In some aspects, the abrasion resistant layer is self-adhesive. Alternatively, the abrasion resistant layer may include an additional adhesive layer, such as adouble-sided tape or a PSA layer. In some aspects, the dielectric reinforcing layer may serve as an abrasion resistant layer or the abrasion resistant layer may serve as a dielectric reinforcing layer.Thermal Conduction

[0063] In addition to thermal insulating layers, dielectric reinforcing layers, abrasion resistant layers, the thermal barrier may further include a thermal conduction layer. The thermally conductive layers in combination with thermal insulating layers are effective at channeling unwanted heat to a desired external location, such as external heat dissipating fins, a heat dissipating housing, or other external structure to dissipate unwanted heat to outside ambient air. In one aspect, a thermally conductive layer or layers helps to dissipate heat away from a localized heat load within a battery module or pack. Types of high thermal conductivity7materials include carbon fiber, carbon nanotubes, graphene, graphite, pyrolytic graphite sheets, silicon carbide, metals including but not limited to copper, stainless steel, aluminum, and the like, as well as combinations thereof.

[0064] To aid in the distribution and removal of heat, in at least one embodiment the thermally conductive layer is coupled to a heat sink. It will be appreciated that there are a variety of heat sink types and configurations, as well as different techniques for coupling the heat sink to the thermally conductive layer, and that the present disclosure is not limited to the use of any one ty pe of heat sink / coupling technique. In an aspect, at least one thermally conductive layer of the multilayer materials disclosed herein can be in thermal communication with an element of a cooling system of a battery module or pack, such as a cooling plate or cooling channel of the cooling system. In another aspect, at least one thermally conductive layer can be in thermal communication with other elements of the battery7pack, battery7module, or battery system that can function as a heat sink, such as the walls of the pack, module or system, or with other ones of the multilayer materials disposed between battery7cells. Thermal communication between the thermally conductive layer and heat sink elements within the battery system can allow for removal of excess heat from the battery cell or battery cells adjacent to the multilayer material to the heat sink, thereby reducing the effect, severity, or propagation of a thermal event that maygenerate excess heat. In addition to removal of heat, a thermally conductive layer can spread, or dissipate heat from a region of high heat concentration to a larger region of lower heat concentration.

[0065] The thermally conductive layer can replace the dielectric reinforcing layer in the applications where heat conduction is needed in addition to the mechanical function of supporting other layers in the thermal barrier.Resilient Materials

[0066] In addition to thermal insulating layers and thermal conductive layers, the thermal barrier may also include one or more resilient material layers. In one aspect, a resilient layer absorbs any volume expansion during the regular operation of one or more battery cells. In some situations during a charge, the battery cells may expand, and during a discharge, the battery' cells may shrink. In one aspect, the resilient layer may also absorb permanent volume expansion caused by any battery cell degradation and / or thermal runaway. Resilient material layers may include, but are not limited to, foam, fiber, fabric, sponge, spring structures, rubber, polymer, etc.Thermal Barriers with Extended Edges

[0067] Figure 1A shows one configuration of a battery module 100. The module 100 includes a stack of battery cells 102. In one aspect, the stack of battery' cells 102 includes lithium-ion battery' cells 102, although other battery' cell types are within the scope of the present disclosure. Several configurations of battery cells 102 are possible. In one aspect, the stack of battery cells 102 includes prismatic battery cells or pouch battery cells, although the disclosure is not so limited. In one aspect, the stack of battery' cells 102 includes lithium ion battery' cells, such as lithium nickel manganese cobalt (NMC) oxide battery cells or lithium ion phosphate (LFP) battery cells, although the disclosure is not so limited. The number of battery cells 102 are grouped into a number of battery' cell subdivisions 112, 114. As noted above, it is desirable to stop or mitigate thermal runaway conditions that can occur in battery' cells such as lithium-ion battery' cells 102. A thermal barrier 110 is shown located between adjacent battery cell subdivisions 112. 114 to stop or mitigate thermal runaway between battery cell subdivisions 112, 114.

[0068] The battery' cells 102 in Figure 1A each include electrical terminals 104. Although battery cells 102 with terminals 104 on a top surface (X-Y plane) of the battery cells 102 are shown in the illustration of Figure 1 A, other configurations are also within the scope of the invention, including, but not limited to other aspects illustrated in Figures below.

[0069] The present disclosure refers to the “lateral footprint” of various components, including the battery cells 102 and the thermal barrier 110. The lateral footprint of a component refers to the area of a maj or surface of the component as defined by the perimeter of the component. As show n in Figure 1A, major surfaces of the battery cells 102 and the thermal barrier 110 are those surfaces in the Y-Z plane (referring to the reference axis in Figure 1 A). For clarity and convenience of explanation, the term battery cell (equivalently “battery ” or “cell”) lateral footprint (“footprint”) refers to a major surface of the battery' cell in the Y-Z plane. Analogously, the thermal barrier lateral footprint (“footprint”) refers to a major surface of the thermal barrier in Y-Z plane. In some aspects described below, a thermal barrier may be fabricated from multiple laminated layers, each of w hich may have its corresponding lateral footprint (i.e., an insulator lateral footprint, a dielectric reinforcing layer lateral footprint). For clarity, “minor surfaces” are those surfaces that are orthogonal to the major surfaces and, using the reference coordinate axes in the figures, disposed in the X-Y plane or in the X-Z plane.

[0070] Figure IB show s an optional configuration of a battery' module 150 that includes a heat sink 154. or cooling plate, located on a side (e.g., bottom side) of the module 150, and in thermal communication with the battery cells 152. Figure IB shows a cross section of battery module 150. One or more of the battery cells 152 are shown separated by one or more thermal barriers 160. Although in Figure IB, only selected groups, or subdivisions, of battery cells 152 are separated by thermal barrier 160, the present disclosure is not so limited. In other aspects, every battery cell 152 is bounded by thermal barriers 160. Side (X-Z plane), bottom (X-Y plane) or top (X-Y plane) surfaces of the battery module 150 may also include thermal barriers 160. Aspects of thermal barriers 110, 160 are shown in more detail in discussion of Figures below.

[0071] In Figures 1A and IB, the thermal barriers 110, 160 are shown with a lateral footprint that matches (i.e., is co-extensive with) a lateral footprintof the battery cells 102. Put another way, a lateral surface area of the thermal barriers 110, 160 is similar or identical to the lateral surface area of the battery cells themselves. The thermal barriers 110, 160 do not extend beyond lateral dimensions of the battery cells 102. The term “footprint” is used to illustrate how different battery cells not illustrated in the configurations shown in Figures 1A and IB may include different lateral geometries apart from rectangular or square. In one aspect, pouch battery cells may be generally rectangular, but may have a less defined outline. A less defined outline of a pouch battery cell will still define a lateral footprint, although the footprint may not be entirely defined by a length times a width as with a rectangular battery cell.

[0072] Figure 2 shows one aspect of a thermal barrier 200 according to the present disclosure. The thermal barrier 200 of Figure 2 includes an insulator layer 202 with major surfaces 203 A, 203B, a first dielectric reinforcing layer 204 and a second dielectric reinforcing layer 206. The assembly of the insulator layer 202. the first dielectric reinforcing layer 204 on the major surface 203 A. and the second dielectric reinforcing layer 206 on the major surface 203B forms the thermal battier 200. While the thermal barrier 200 shown in Figure 2 shows a dielectric reinforcing layer on both major surfaces 203A, 203B of the insulator layer 202. this is not required. In some aspects, the thermal barrier 200 includes the dielectric reinforcing layer 204 on one major surface of the insulator layer 202 but not the other major surface of the insulator layer 202 (e.g, on major surface 203A but not major surface 203B).

[0073] In one aspect, the dielectric reinforcing layers 204, 206 are attached to the major surfaces 203 A, 203B of the insulator layer 202 (e.g., by an adhesive). In one aspect, the adhesive includes a pressure sensitive adhesive (PSA). PSA is useful because its use can simplify manufacture and assembly of parts. Layers, such as dielectric reinforcing layers 204, 206 and insulator layer 202 are attached by applying PSA to the surfaces of one or more of the layers and pressing the layers together to activate the PAS. In one aspect the PSA is included on all or part of one or more major surfaces of each dielectric reinforcing layer 204, 206, although the disclosure is not so limited. The PSA on the major surface of the dielectric reinforcing layer that confronts a corresponding surface of the insulator layer (e.g., major surface 203 A, 203B) may help the dielectric reinforcing layer attach to the insulator layer 202, whilethe PSA on the opposing major surface of the dielectric reinforcing layer may help the dielectric reinforcing layer attach to a battery cell (e.g., battery cells 102 or 152). The adhesive may also help encapsulate a portion of or the entirety of the insulator layer 202, therefore preventing dusts falling off the insulator layer 202. The attachment of the dielectric reinforcing layer 204 may be mechanically stronger (e.g., more rigid, higher module, higher tensile strength, higher bending strength) than the insulator layer 202 itself and therefore provides structural support to the insulator layer 202.

[0074] In one aspect, the insulator layer 202 includes an aerogel layer, although the disclosure is not so limited. Aerogel materials, described above, include ven’ low thermal conductivity, while the addition of one or more dielectric reinforcing layers 204, 206 provides desired mechanical strength for the insulator layer 202 without adding unwanted higher thermal conductivity. The enhanced mechanical strength improves the durability of the thermal barrier 200, especially during particle bombardments under extreme conditions (e.g., thermal runaway). The dielectric reinforcing layer 204 additionally serves as an encapsulation of the insulator layer 202 to reduce or prevent dust from the insulator layer 202.

[0075] In one aspect, the dielectric reinforcing layers 204, 206 may be selected from polyvinylchloride (PVC), PVC elastomeric materials. PVC rigid materials, rubber, other dielectric materials discussed herein, other dielectric materials, and combinations thereof.

[0076] In one aspect, the dielectric reinforcing layers 204, 206 include mica. The advantage of using mica as the dielectric reinforcing layers includes the low thermal conductivity and abundant availability of such materials at a low cost. Mica also occurs naturally in sheets or sheet-like forms that provide good structural properties at a low cost. In contrast to powdered dielectric materials, sheets of mica are mechanically strong, and provide the desired reinforcement and encapsulation for the insulator layer 202. In one aspect, the dielectric reinforcing layer 204 includes mica particles bound together with binders (e.g., a polymer binder) to form a structural sheet. In one aspect, the dielectric reinforcing layer 204 is flexible. In one aspect, the binders may include a silicone-based polymer, although the disclosure is not so limited. Siliconepolymers have an advantage of high heat resistance, and low thermal conductivity.

[0077] In some aspects, the insulator layer, e.g., 202, 302, 402, 502, 602, 702, 802, 822, 902, 952, 1002, 1052, 1123, 1133, 1143, 1153, 1214, 1301, 1402, 1412, 1422, 1502, 1512, 1522, 1532, can include a composite of multiple layers. In one aspect, the insulator layer can include insulator layers and layers of other materials such as structural layers, conductive layers, compressible layers, resilient layers, dielectric layers, adhesive layers, intumescent layers, heat absorbing layers, heat releasing layers, other suitable layers, or combinations thereof.

[0078] In one aspect, the insulator layer can include a structural core layer and insulator layers disposed on both surfaces of the structural core layer. A structural core layer includes layers that have a higher elastic modulus, a higher bending strength, and / or greater rigidity than that exhibited by a foam or fiber reinforced aerogel insulator layer. An insulator layer configured with a structural core layer (and with insulator layer on or adjacent to the major surfaces of the structural core layer) may thus have a mechanically stable footprint.

[0079] In one aspect, the structural core layer may include a dielectric reinforcing layer and / or a thermal conduction layer described earlier. In one aspect, the structural core layer may include a mica layer, a stainless-steel layer, and / or a polymer layer.

[0080] In one aspect, the insulator layer can be foam, fiberglass, nonwoven fabric, aerogel, aerogel composite, fiber reinforced aerogel, other insulation materials discussed herein, other suitable insulation materials, or combinations thereof. In other aspects, the insulator layer can be a composite such as those disclosed in US Patent Publication Nos. 2021 / 0163303, 2021 / 0167438, 2023 / 0032529, and US Serial Nos. 18 / 571,175, 18 / 571,178, 18 / 571.172. each of which are hereby incorporated by reference in their entirety.

[0081]

[0082] Figure 3 shows another aspect of a thermal barrier 300. The thermal barrier 300 includes an insulator layer 302 (having major surfaces 303 A, 303B) and a dielectric reinforcing layer 304 forming a laminate with the insulator layer 302. In one aspect, a second dielectric reinforcing layer 306 isincluded so that a pair of dielectric reinforcing layers 304, 306 are attached to both major surfaces 303A, 303B. respectively, of the insulator layer 302. In the aspect shown in Figure 3, at least one of the dielectric reinforcing layers 304 or 306 extends beyond the insulator lateral footprint as shown at extension 310. In other words, the reinforcing layer 304 is not co-extensive with the major surface 303A of the insulator layer 302, but instead extends beyond it. In this case, the reinforcing layer 304 has a Z dimension greater than the corresponding Z dimension of the insulator layer 302. In the illustration of Figure 3, the reinforcing layer 306 also extends beyond the corresponding major surface 303B of the insulator layer 302 in the Z direction, although the reinforcing layers 304, 306 need not by symmetric.

[0083] The region of the reinforcing layers 304, 306 that extends beyond the dimensions of the corresponding major surfaces 303 A, 303B of the insulator layer 302 are termed herein as “extensions.” In Figure 3, the extensions are indicated as 310A, 310B (generically referred to as extensions 310) where the dashed line shows the upper Z dimension of the insulator layer 302, thereby also indicating the extension 310 of the reinforcing layer 304. Aspects that include one or more extensions 310 provide an increased barrier between adj acent battery cells in a battery module outside of a battery footprint. The one or more extensions 310 reduce or prevent the heat or thermal runaway ejecta from travelling across the battery module. The function of the one or more extensions 310 is illustrated in more detail in Figure 6B below with respect to a nonlimiting extension geometry.

[0084] Figure 4 shows another aspect of a thermal barrier 400. In the aspect of Figure 4, the thermal barrier 400 includes an insulator layer 402 (having major surfaces 403 A, 403B) and dielectric reinforcing layers 404, 406 on the major surfaces 403 A, 403B, thereby forming a laminate with the insulator layer 402. In one aspect, only a single dielectric reinforcing layer 404 or 406 is included on one of the major surfaces 403A or 403B of the insulator layer 402.

[0085] Like the thermal barriers 200 and 300, the outer limits of the major surfaces 402 A, 402B of the insulator layer 402 in the Y-Z plane define the “footprint” of the insulator layer 402, as described above. Like the thermal barrier 300. the thermal barrier 400 includes first extensions 410A and 410B formed by extending the dimension of the dielectric reinforcing layers 404, 406in the positive Z direction beyond the footprint in the Z dimension of the insulator layer 402. The first extensions 410A, 41 OB are indicated in Figure 4 with a dashed line that corresponds to the footprint of the insulator layer 402 in the Z dimension. While not shown in Figure 4, it will be appreciated that other aspects of the thermal barrier 400 may include extensions in the negative Z dimension also.

[0086] In addition to the first extensions 410A, 410B, the thermal barrier 400 also has second extensions 412A, 412B (corresponding to dielectric layers 404, 406, respectively) that extend beyond the insulator layer 402 lateral footprint in the positive Y dimension. The second extension portion 412A is indicated by a vertical dashed line in Figure 4. It will be understood that second extension portion 412B on dielectric layer 406 is analogous to second extension portion 412A. Also, it will be understood that extension portions in the negative Y direction are also possible even if not indicated in Figure 4 to preserve clarity of the figure.

[0087] As described above, and as applicable to any extension portion described herein in any aspect, extensions portions, byextending beyond the footprint of the insulator layer, may contact, engage, or otherwise interact with a sidewall, bottom surface or top lid of a module housing, as discussed in more detail below; to reduce or prevent heat or thermal runaway ejecta from travelling across the battery module.

[0088] Figure 5 show s another aspect of a thermal barrier 500. In the aspect of Figure 5, the thermal barrier 500 includes an insulator layer 502 and a dielectric reinforcing layer 504 forming a laminate with the insulator layer 502. In one aspect, a second dielectric reinforcing layer 506 is included, and forms a pair of dielectric reinforcing layers 504, 506 on both major surfaces of the insulator layer 502. The major surfaces of the insulator layer 502 are not shown in Figure 5 to preserve clarify of the figure. However, because the major surfaces have been defined above and are shown in Figures 2. 3. and 4, the location and presence of the major surfaces of insulator layer 502 will be understood by analogy.

[0089] In the aspect shown in Figure 5, one or more of the dielectric reinforcing layers 504, 506 includes one or more extensions which angle outward away from the insulator layer. A first extension 510 of the dielectricreinforcing layer 504 is shown angling upward (positive Z direction) and to the right (positive X direction) relative to the insulator layer 502 which is coplanar with the Y-Z plane. A second extension 512 is shown angling upward (positive Z direction) and to the left (negative X direction) from the insulator layer 502. The first and second extension 510 and 512 each forms an angle 0 with the positive Z direction. The angle 0 may be an acute or a right angle. The angle 0 provides flexibility to the dielectric reinforcing layers 504 and 506, e.g.. bending flexibility along the length of the extension or at the intersection between the extension and the main body of the reinforcing layer. The angles increase (the first and second extensions 510 and 512 moving downwards in the negative Z direction) when setting the lid of the battery module and therefore seal the space between the battery cells and the lid. This function is further explained with respect to Figure 6B below.

[0090] Figure 6A shows another aspect of a thermal barrier 600. In the aspect of Figure 6A, the thermal barrier 600 includes an insulator layer 602 and a dielectric reinforcing layer 604 forming a laminate with the insulator layer 602. In one aspect, a second dielectric reinforcing layer 606 is included, and forms a pair of dielectric reinforcing layers 604, 606 on both major surfaces of the insulator layer 602.

[0091] In the aspect shown in Figure 6A. one or more of the dielectric reinforcing layers 604, 606 angles outward from the insulator layer. A first extension 610 of the dielectric reinforcing layer 604 is shown angling upward (positive Z direction) and to the right (positive X direction) from a top edge of the insulator layer 602. A second extension 612 is shown angling upward (positive Z direction) and to the left (negative X direction) from the top portion of the insulator layer 602.

[0092] Additionally , in one aspect of Figure 6A, the reinforcing layers 604, 606 each extend laterally upwards and from sides of the insulator layer 602 beyond the battery cell lateral footprint. More specifically, in the aspect illustrated in Figure 6A, a third extension 614 is further shown angling sideways (positive Y direction) and away (positive X direction) from the side edge of the insulator layer 602. A fourth extension 616 is further shown angling sideways (positive Y direction) and away (negative X direction) from the side edge of the insulator layer 602. In one aspect, one edge of the extension 610 connects to oneedge of the extension 614 by a connecting piece 618. In one aspect the connecting piece 618 is in a triangle shape. The connecting piece helps prevent heat and particle travel across the battery module during a thermal runaway event.

[0093] Figure 6B shows one aspect of how the thermal barrier 600 can be used in a battery module 650. A number of battery cells 652 are shown within a module housing 654. One or more of the battery cells 652 are separated by at least one thermal barrier 600. The thermal barrier 600 from Figure 6A is illustrated in Figure 6B, however other thermal barrier geometries described in the present disclosure may also be configured as illustrated in the module 650 shown in Figure 6B.

[0094] The extensions 610, 612 as shown in Figure 6A are located so that the extensions 610, 612 extends into atop space 658 between a top of the battery cells 652 and a lid 656. The extensions 610, 612 divide the top space 658 into a number of separated compartments 659 which better contain any flames and / or ejecta that may result from a failure of one or more battery cells 652. The extensions 610, 612 block the flames, heat, and / or eject from traveling along X direction and confined the flames, heat, and / or eject within compartments 659 corresponding to the thermal runaway battery cell 652 Therefore, preventing thermal runaway from propagating from the thermal runaway battery cells to adjacent healthy battery cells.

[0095] As discussed above, in the configuration illustrated in Figure 6B, the extensions 610, 612 angle outward (positive and negative X direction, respectively) from the insulator layer 602 at an angle 0. In one aspect, the angel 9 is an acute or a right angle. In one aspect, the outward angle facilitates flexing against the lid 656, which forms a better seal with the lid 656 and any imperfections in a spacing betw een the lid 656 and the battery cells 652. The ability of the extensions 610, 612 to flex and accommodate spacing differences forms a better seal with the lid 656 when compared to a non-flexible extension.

[0096] Figure 6C shows a cross section view' of battery module 650 in Figure 6B along line AA‘ cutting across an insulator layer 602. The insulator layer 602 has a minor surface 651 (equivalently described herein generically as an edge, and specifically in this configuration as the bottom edge) contacting the bottom surface of the module housing 654 or a cooling plate (not shown) overthe bottom surface. A minor surface 653 (equivalently described herein as the top edge) of the insulator layer 602 is separated from the lid 656 by an intervening top space 658. The side edges 661, 663 (elsewhere described herein as the third and fourth minor surfaces) of the insulator layer 602 and the sidewalls of the module housing 654 are separated by side space 657.

[0097] Figure 6D shows a cross section view of battery module 650 in Figure 6B along line BB’ cutting across extensions 610, 614 of the dielectric reinforcing layers 604. The extensions 610 and 614 extend into the side space 657 and the top space 658, pushing against the lid 656 and the sidewalls of the module housing 654 at the angle 0. As such, extensions 610 and 614 separate the top space 658 and the side space 657 into separated compartments, therefore preventing heat and / or particles from travelling through the side space 657 and the top space 658 during thermal runaway. The connecting piece 618 in Figure 6A helps seal the comer space 660 of the module housing 654. In one aspect, the connecting piece 618 may be triangle shaped. Alternatives, the connecting piece may be diamond shaped for better sealing.

[0098] In one aspect, one or both the dielectric reinforcing layers 604, 606 over the insulator layer 602 may be replaced by an abrasion resistant layer. In this configuration, an abrasion resistant layer is the exterior layer of the thermal barrier 600, being placed in contact with the major surfaces of the insulator layer 602 instead of the dielectric reinforcing layers 604, 606.

[0099] In one aspect, the thermal barrier 600 may further include at least one abrasion resistant layer in addition to the dielectric reinforcing layers 604, 606. The abrasion resistant layer(s) may be disposed between the insulator layer 602 and the dielectric reinforcing layers 604, 606 (i.e., placed on one or more major surfaces of the insulator layer 602). In this configuration, the dielectric reinforcing layers 604, 606 are the exterior layers of the thermal barrier 600 in this case, thereby being proximate to adjacent battery cells. Alternatively, the dielectric reinforcing layers 604, 606 may be disposed between the insulator layer 602 and the abrasion resistant layer(s). In this configuration, the dielectric reinforcing layers 604, 606 are on the major surfaces of the insulator layer 602 and the abrasion resistant layer(s) is the exterior layer of the thermal barrier 600, thereby being proximate to adjacent battery cells.

[0100] While the presence of an abrasion resistant layer is introduced and described in the context of the thermal barrier 600, it will be understood that an abrasion resistant layer may be added to any of the thermal barrier configurations described herein in the context of any of the figures. Specifically, one or both of the dielectric reinforcing layers 304, 306 shown in Figure 3 on one or more major surfaces of the insulator layer 302, one or both of the dielectric layer 404, 406 shown in Figure 4 on one or more major surfaces of the insulator layer 402, one or both of the dielectric layer 504, 506 shown in Figure 5 on one or more major surfaces of the insulator layer 502, one or both of the dielectric layer 604, 606 shown in Figure 6 on one or more major surfaces of the insulator layer 602. may be replaced by an abrasion resistant layer so that one or more of the layers adjacent to a battery cells is an abrasion resistant layer. The abrasion resistant layers may be described for convenience as the “exterior” layers of the thermal barrier 300, 400, 500, and 600.

[0101] In one aspect, the thermal barrier 300, 400, 500, 600 may further include at least one abrasion resistant layer(s) disposed between the insulator layers 302, 402, 502, 602 and one or both of their corresponding dielectric reinforcing layers 304, 306, 404, 406, 504, 506, 604, 606. In these configurations, the dielectric reinforcing layers 304, 306, 404, 406, 504. 506, 604, 606 are the exterior layers of the thermal barrier 300. 400, 500. and 600 in this case.Thermal Barriers with Sealed Edges

[0102] Figure 7A shows another aspect of a thermal barrier 700 with sealed edges. Figures 7B and 7C are cross section views of the thermal barrier 700 along surface CC’. In the aspect of Figure 7A and 7B, the thermal barrier 700 includes an insulator layer 702 and a dielectric reinforcing layer 704 on a first major surface 703 A of the insulator layer 702, thereby forming a laminate with the insulator layer 702. In one aspect, a second dielectric reinforcing layer 706 is on a second major surface 703B of the insulator layer 702 (e.g., in Figure 7C).

[0103] In Figures 7A and 7B, the thermal barrier 700 further includes an edge seal 708 on at least a portion of a perimeter of the insulator layer 702 and reinforcing layers 704, 706. That is, the edge seal 708 is disposed on at least aportion of one or more minor surfaces of the thermal barrier 700 (i.e., surfaces in the X-Y plane and X-Z plane of Figure 7A).

[0104] The minor surfaces are approximately orthogonal (within normal design and manufacturing tolerances of + / -10) to the major surfaces of the insulator layer 702 and connect the first and second major surfaces together. Turning to Figure 7B, first minor surface 710A and second minor surface 710B correspond to the X-Y plane minor surfaces that connect major surfaces 703 A, 703B oriented in the Y-Z plane.

[0105] The third minor surface and the fourth minor surface are those minor surfaces in the Z-X plane and that connect the first major surface, the second major surface, the first minor surface, and the second minor surface. The third and fourth minor surfaces are not indicated in Figures 7A-7C due to the orientation of the drawings, but will be understood based on these figures and the reference to the Cartesian coordinate system in this description.

[0106] The edge seal 708 is shown in Figure 7A as on all four of the minor surfaces. In some aspects and / or for clarity of description, the edge seal may be described as having portions or areas that named in association with each of the corresponding surface on w hich the edge seal is disposed. Turning to Figures 7A, 7B, and 7C for illustration of this nomenclature, a first edge seal may be disposed on the first minor surface 710A, a second edge seal may be disposed on the second minor surface 710B, a third edge seal may be disposed on the third minor surface, and a fourth edge seal may be disposed on the fourth minor surface.

[0107] In one aspect, the edge seal 708 includes a resilient material that deforms to provide an improved seal with a lid, as illustrated in Figure 6B discussed above. In one aspect, the edge seal 708 is not resilient, and provides a seal with a lid using only close-fitting dimensions (e.g., an interference fit). In one aspect, the edge seal 708 seals all four edges of the insulator layer 702. In one aspect, the edge seal 708 includes tape or other adhesive film. In some aspects, tape or other adhesive film can be affixed to at least a portion of one or more minor surfaces of the thermal barrier (i.e., surfaces in the X-Y plane of Figure 7A). In some aspects, the edge seal can extend onto a portion of the major surfaces of the thermal barrier, e.g., onto the surface of the reinforcing layers. In one aspect, the edge seal 708 includes a molded polymer channel. In one aspect,a polymer edge seal 708 includes rubber, silicone, resin, other resilient polymer material, or combinations thereof.

[0108] In Figure 7C, an edge seal 720 is shown that is dipped, or painted in place. Advantages of edge seal 720 include ease of manufacture and alternative options for polymer material. The dipped or painted edge seal 720 has round edges compared to the edge seals 708 in Figure 7B. In one aspect, edge seal 720 includes aerogel components (e.g., aerogel paint), mica, other heat isolation or antiflame materials, or combinations thereof. In one aspect, edge seal 720 includes an intumescent material. Intumescent materials include an advantage of expanding to form a better seal with a lid when exposed to heat or flame above an activation temperature. As discussed above, an improved seal with a lid of a battery module provides better containment of a runaway thermal event, and as a result, improved safety and improved protection of adjacent components.

[0109] In one aspect, one or both the dielectric reinforcing layers 704. 706 on the insulator layer 702 may be replaced by an abrasion resistant layer. The abrasion resistant layer is the exterior layer of the thermal barrier 700 in this case. In one aspect, the thermal barrier 700 may further include at least one abrasion resistant layer in addition to the reinforcing layers 704, 706. The abrasion resistant layer(s) may be disposed between the insulator layer 702 and the reinforcing layers 704, 706. The reinforcing layers 704, 706 are the exterior layer of the thermal barrier 700 in this case. Alternatively, the reinforcing layers 704, 706 may be disposed between the insulator layer 702 and the abrasion resistant layer(s). The abrasion resistant layer is the exterior layer of the thermal barrier 700 in this case. The edge seal 708 is shown covering at least a portion of a perimeter of the insulator layer 702, the reinforcing layers 704, 706, and the abrasion resistant layer(s). The edge seal 706 may wrap around the edges (also referred to as perimeter) and covers a portion of the major surfaces of the exterior layer of the thermal barrier 700.

[0110] Figures 8A and 8B illustrate further aspects of thermal barriers 800, 820 that can be incorporated into other thermal barriers in the present disclosure. Thermal barrier 800 includes multiple layers 804 and 806 on two opposite major surfaces of an insulator layer 802. An edge seal 808 is also shown in Figure 8A. The multiple layers may include several different layersthat each serve different functions in a multilayer thermal barrier. Configurations with multiple layers may include, but are not limited to, dielectric reinforcing layers, resilient layers, thermal conductor layers, adhesive layers, etc. Thermal conductor layers may be used to transport heat on a given side of a thermal barrier to a heat sink or cooling plate such as heat sink 154 from Figure IB. In one aspect of Figure 8A. the multiple layers 804 and 806 include equal numbers of layers and may include symmetric types and orders of layers. In one aspect, the multiple layers 804 and 806 each comprises a dielectric reinforcing layer 810 attached to the insulator layer 802 by an adhesive layer 812. In one aspect, the multiple layers 804 and 806 each comprises a conductive layer 810 attached to the insulator layer 802 by an adhesive layer 812.

[0111] In Figure 8B, thermal barrier 820 includes multiple layers on two opposite major surfaces of an insulator layer 822. An edge seal 828 is also shown in Figure 8B. As shown in Figure 8B, the multiple layers on a first side 824 are not symmetric with the multiple layers on a second side 826. Different order of layers, different material layers and different numbers of layers between the first side 824 and the second side 826 of the insulator layer 822 can be used to better match conditions in different locations betw een battery' cells within a battery module. In an aspect, thermal barrier 820 with multiple layers only on the first side 824 can be used at the end of a battery module. Only one side of the battery cell at the end of the module has an adjacent battery cell, compared to the battery cells in the middle of the module where both sides have adjacent battery' cells. Additionally, reducing number of layers can reduce size and cost of a battery module.

[0112] In one aspect of Figure 8B, the multiple layers on the first side 824 comprises a dielectric reinforcing layer 827 attached to the insulator layer 822 by an adhesive layer 825. The multiple layers on the second side 826 comprises an adhesive layer 825. The thermal barrier 820 may be used at the end of a battery module w here only one side of the thermal barrier 820 has a battery cell. The multiple layers on the second side 826 with adhesive layer 825 only and without the dielectric reinforcing layer may be used to attach the thermal barrier 820 onto the adjacent battery cell.In one aspect, one or more of the dielectric reinforcing layers 810. 827, the adhesive layers 812, 827 over the insulator layers 802 or 822 may be replaced byan abrasion resistant layer. The abrasion resistant layer is the exterior layer of the thermal barrier 800 or 820 in this case. In one aspect, the thermal barriers 800 or 820 may further include at least one abrasion resistant layer in addition to the reinforcing layers 810, 827 and the adhesive layers 812, 827. The abrasion resistant layer(s) may be disposed between the insulator layer 802, 822 and the dielectric reinforcing layers 810, 827. The dielectric layers 810, 827 are the exterior layers of the thermal barrier 800 or 820 in this case. Alternatively, the dielectric reinforcing layers 810, 827 may be disposed between the insulator layers 802, 822 and the abrasion resistant layer(s). The abrasion resistant layer is the exterior layer of the thermal barrier 800 or 820 in this case. The insulator layers 802, 822, the abrasion resistant layer(s). and the dielectric reinforcing layers 810, 827 may be attached together by an adhesive layer, such as the adhesive layers 812, 825.

[0113] Figure 9A shows another aspect of a thermal barrier 900. The thermal barrier 900 includes a core 902. Some configurations of the core 902 includes a single layer of thermal insulation material, such as insulator layer 202, 302, 402, 502, 602, 702, and 802 as described above in the context of Figures 2- 8B. In one aspect, the core 902 includes multiple layers. In one aspect, at least one of the multiple layers includes a thermal insulation material. In one aspect, the thermal insulation material includes an aerogel material, although the invention is not so limited. In one aspect, the thermal insulation material includes a reinforced aerogel material such as a fiber reinforced aerogel material or a foam reinforced aerogel material. In some aspects, additional layers in the core 902 may include, but are not limited to, heat conducting layers such as metal layers, encapsulation layers, such as polymer film layers, dielectric reinforcing layers, such as mica layers, resilient layers, such as foam layers, etc. In one aspect, the core 902 is one of the thermal barriers 110, 160, 200, 300, 400, 500, 600, 700, or 800 in Figures 1A-8B. In one aspect, the core 902 includes one or more layers selected from the layers of the thermal barriers 110, 160. 200, 300, 400, 500, 600, 700, or 800 in Figures 1A-8B. In one aspect, the core 902 includes an abrasion resistant layer over the insulator layer or between the insulator layer and the dielectric reinforcing layer.

[0114] In the configuration illustrated in Figure 9A, the thermal barrier 900 further includes a dielectric reinforcing layer 906 that encapsulates the core902. The dielectric reinforcing layer 906 comprises edge seal 904 on the third and fourth minor surfaces (i.e. those surfaces in the X-Y plane of Figure 9A). The edge seal 904 covers the edges of the core 902. In one aspect, the dielectric reinforcing layer 906 is formed from a material that is more resistant to abrasion than one or more layers of the core 902, as described above.

[0115] In addition, the dielectric reinforcing layer 906 may contain dust generated by some materials used for thermal insulation in the core 902. In the aspect of an aerogel thermal insulation material included in the core 902, the aerogel thermal insulation material may be prone to dust generation, and / or may easily fracture with handling. The dielectric reinforcing layer 906 is included to suppress dust, and to reduce damage to the core 902 from handling. One aspect of a dielectric reinforcing layer 906 includes a mica containing layer, which may include a silicone polymer matrix filled with mica particles. The silicone acts as a binder for the mica particles, resulting in a composite that is flexible and has a low thermal conductivity. In one aspect, a silicone / mica composite used to form the dielectric reinforcing layer 906 may flex without cracking and have a low thermal conductivity (e.g., between 0.4 Watts / meter-Kelvin and 1.0 W atters / meter-Kel vin)

[0116] Figure 9A further shows a plan view close up of the ends of the minor surfaces of the edge seal 904 of the dielectric reinforcing layer 906. As illustrated in this view, a sheet of dielectric reinforcing layer 906 is continuously wrapped around the core 902 so that the sheet of dielectric reinforcing layer 906 covers the major surfaces of the core 902. The sheet of the dielectric reinforcing layer 906 is continuous (seamless) around the end 904A shown in the inset magnified view. A single seam 912 within the sheet of the dielectric reinforcing layer 906 is present at end 904B.

[0117] Present at both ends 904A and 904B is a gap 914 between an inner surface of the dielectric reinforcing layer 906 and the core 902. The gap 914 with trapped air therein serves as insulation to prevent heat and particle mitigation to adjacent battery cells in the case of thermal runaway. In some aspects, the gap 914 can be filled with one or more other insulation materials, e.g.. foam materials, intumescent materials, e-glass, ceramic, polymer, rubber, aerogel, air. oil. other insulation materials, or combinations thereof. In one aspect, a portion of the core 902 extends into the gap 914.

[0118] Figure 9B shows another aspect of a thermal barrier 950. The thermal barrier 950 includes a core 952. Similar to Figure 9A, in one aspect, the core 952 includes a single layer of thermal insulation material, such as insulator layer 202, 302, 402, 502, 602, 702, and 802 in Figures 2-8B. In one aspect, the core 952 includes multiple layers. In one aspect, at least one of multiple layers include a thermal insulation material. In one aspect, the thermal insulation material includes an aerogel material, although the invention is not so limited. In one aspect, the thermal insulation material includes a reinforced aerogel material such as a fiber reinforced aerogel material or a foam reinforced aerogel material. In one aspect, the core 952 includes an abrasion resistant layer over the insulator layer or between the insulator layer and the dielectric reinforcing layer. In selected aspect, additional layers in the core 952 may include, but are not limited to, heat conducting layers such as metal layers, encapsulation layers, such as polymer film layers, dielectric reinforcing layers, such as mica layers, resilient layers, such as foam layers, etc. In one aspect, the core 902 is one of the thermal barriers 110, 160, 200, 300, 400, 500, 600, 700, or 800 in Figures 1A-8B. In one aspect, the core 902 includes one or more layers selected from the layers of the thermal barriers 110, 160, 200, 300, 400, 500, 600, 700, or 800 in Figures 1A-8B.

[0119] In the configuration shown in Figure 9B, the thermal barrier 950 includes a dielectric edge seal 956 enclosing edges (equivalently described as minor surfaces above in the context of Figures 7A1-7C) of the core 952. The dielectric edge seal 956 and the core 952 form a gap 954 therebetween. In some aspects, the gap 954 can be filled with another material, e.g., foam materials, intumescent materials, e-glass, ceramic, polymer, rubber, aerogel, air, oil, other insulation materials, or combinations thereof. In one aspect, a portion of the core 902 extends into the gap 954. One advantage of only reinforcing the edges of the core 952 includes a reduction in needed material. Another advantage of only reinforcing edges of the core 952 includes protecting only edges where fractures may occur during handling. Another advantage of only reinforcing edges of the core 952 includes maintaining a thin thermal barrier 950 between battery cells, while reinforcing portions of thermal barrier 950 that are exposed to contact with adjacent components such as battery housing components. Another advantage of only reinforcing edges of the core 952 includes flexibility in manufacturing.By only reinforcing edges of the core 952, the dielectric edge seal 956 can be applied to thermal barriers 950 of multiple areal configurations. The only concern between different areal configurations includes selecting an appropriate length of dielectric edge seal 956 to cover edges of the core 952. Although two opposing edges of the core 952 are shown covered by dielectric edge seal 956 in Figure 9B, the invention is not so limited. Three or four minor surfaces may be reinforced using corresponding dielectric edge seals 956.

[0120] Figure 9B further shows a close up view 960 of the dielectric edge seal 956 is shown w rapped around edge of the core 952. In the configuration illustrated in Figure 9B, a crease 909 is formed at one end of the dielectric edge seal 956. An end view 970 of the thermal barrier 950 is further shown in Figure 9B. As discussed above, it may be advantageous to maintain a thinner middle portion of the thermal barrier 950 that will be betw een battery cells. Middle portion 953 of thermal barrier 950 is shown in view 970 where the middle portion 953 is thinner than the reinforced edge seal 956.

[0121] Figure 10A shows another aspect of a thermal barrier 1000. The thermal barrier 1000 includes a core 1002. Similar to other aspects, in one aspect, the core 1002 includes a single layer of thermal insulation material, such as insulator layer 202, 302, 402, 502. 602, 702, and 802 in Figures 2-8B. In one aspect, the core 1002 includes multiple layers. In one aspect, at least one of the multiple layers includes a thermal insulation material, such as an insulator layer. In one aspect, the thermal insulation material includes an aerogel material, although the invention is not so limited. In one aspect, the thermal insulation material includes a reinforced aerogel material such as a fiber reinforced aerogel material or a foam reinforced aerogel material. In one aspect, the core 1002 includes an abrasion resistant layer over the insulator layer or between the insulator layer and the dielectric reinforcing layer. In selected aspects, additional layers in the core 1002 may include, but are not limited to. heat conducting layers such as metal layers, encapsulation layers, such as polymer film layers, dielectric reinforcing layers, such as mica layers, resilient layers, such as foam layers, etc. In one aspect, the core 1002 is one of the thermal barriers 110, 160, 200, 300, 400, 500, 600, 700. or 800 in Figures 1A-8B. In one aspect, the core 1002 includes one or more layers selected from the layers of the thermal barriers 110, 160, 200, 300, 400, 500, 600, 700, or 800 in Figures 1A-8B.

[0122] In the configuration shown in Figure 10A, the thermal barrier 1000 includes a dielectric edge seal 1006 on two of the minor surfaces in the X- Z plane of FIG. 10A (described above as the '‘third” and “fourth” minor surfaces). The dielectric edge seal 1006 and the core 1002 forms a gap 1004. In some aspects, the gap 1004 can be filled with another material, e.g., foam materials, intumescent materials, intumescent materials, e-glass. ceramic, polymer, rubber, aerogel, air. oil. other insulation materials, or combinations thereof. In one aspect, a portion of the core 1002 extends into the gap 1004. As discussed above with respect to other aspect configurations, only reinforcing edges of the core 1002 has a number of advantages. Although two opposing edges of the core 1002 are shown covered by dielectric edge seal 1006 in Figure 10 A, the invention is not so limited. Three edges may also be reinforced, or all four edges may be reinforced.

[0123] The configuration of Figure 10A further shows an encapsulation layer 1008. In the aspect of Figure 10A, the encapsulation layer 1008 covers all of major surfaces of the core 1002, and the minor surfaces (equivalently, the edges) of the core 1002. In one aspect, the encapsulation layer 1008 covers entire surfaces of the core 1002. The encapsulation layer 1008 is shown encapsulating the dielectric edge seal 1006 along with other components of the thermal barrier 1000 in a continuous sheet. The dielectric edge seal 1006 is disposed between the core 1 02 and the encapsulation layer 1008. In one aspect, the encapsulation layer 1008 includes a flexible polymer sheet. Other flexible sheet materials are also within the scope of the invention. In one aspect, the encapsulation layer 1008 is secured using pressure sensitive adhesive strips, tape, etc. In one aspect, the encapsulation layer 1008 includes an adhesive on all or a portion of one surface to provide an attachment mechanism to the core 1002 and dielectric edge seal 1006. In one aspect, the encapsulation layer 1008 is an adhesive layer, such as a pressure sensitive adhesive layer.

[0124] Figure 10A further shows a close up view 1010 of the dielectric edge seal 1006 is shown wrapped around edges of the core 1002 with a gap 1004 therebetween. In the configuration illustrated in Figure 10A, the encapsulation layer 1008 is shown covering both the core 1002 and the dielectric edge seal 1006. The dielectric edge seal 1006 is disposed between the core 1002 and the encapsulation layer 1008. An end view71020 of the thermal barrier 1000 isfurther shown in Figure 10A. As discussed above, it may be advantageous to maintain a thinner middle portion of the thermal barrier 1000 that will be between battery cells. Middle portion 1003 of thermal barrier 1000 shown in view 1020 is thinner than the reinforced edges of the core 1002.

[0125] Figure 10B shows another aspect of a thermal barrier 1050. The thermal barrier 1050 includes a core 1052. Similar to other aspects, in one aspect, the core 1052 includes a single layer of thermal insulation material, such as insulator layer 202, 302, 402, 502, 602, 702, and 802 in Figures 2-8B. In one aspect, the core 1052 includes multiple layers. In one aspect, at least one of the multiple layers includes a thermal insulation material. In one aspect, the thermal insulation material includes an aerogel material, although the invention is not so limited. In one aspect, the thermal insulation material includes a reinforced aerogel material such as a fiber reinforced aerogel material or a foam reinforced aerogel material. In one aspect, the core 1052 includes an abrasion resistant layer over the insulator layer or between the insulator layer and the dielectric reinforcing layer. In selected aspect, additional layers in the core 1052 may include, but are not limited to, heat conducting layers such as metal layers, encapsulation layers, such as polymer film layers, dielectric reinforcing layers, such as mica layers, resilient layers, such as foam layers, etc. In one aspect, the core 902 is one of the thermal barriers 110, 160, 200, 300. 400, 500. 600, 700, or 800 in Figures 1 A-8B. In one aspect, the core 902 includes one or more layers selected from the layers of the thermal barriers 110, 160, 200, 300, 400, 500, 600, 700, or 800 in Figures 1A-8B.

[0126] In the configuration illustrated in Figure 10B, the thermal barrier 1050 includes a dielectric edge seal 1056 enclosing edges of the core 1052. The dielectric edge seal 1056 and the core 1052 forms a gap 1054 therebetw een. As discussed above with respect to other illustrative configurations, reinforcing the minor surfaces (whether those shown in Figure 10B or all four minor surfaces) has a number of advantages. Although two opposing edges of the core 1052 are shown covered by dielectric edge seal 1056 in Figure 10B, the invention is not so limited. Three edges (equivalently, minor surfaces) may also be reinforced, or all four edges may be reinforced.

[0127] The configuration of Figure 10B further shows an encapsulation layer 1058. In the configuration of Figure 10B, the encapsulation layer 1058only covers the dielectric edge seal 1056 and the surfaces of the core 1052 adjacent to the dielectric edge seal 1056. In one aspect, the encapsulation layer 1058 includes a flexible polymer sheet. Other flexible sheet materials are also within the scope of the invention. In one aspect, the encapsulation layer 1058 is secured using pressure sensitive adhesive strips, tape, etc. In one aspect, the encapsulation layer 1058 includes an adhesive on all or a portion of one surface to provide an attachment mechanism to the core 1052 and dielectric edge seal 1056. In one aspect, the encapsulation layer 1058 includes tape. In one aspect, the encapsulation layer 1058 may be replaced with an abrasion resistant layer (e g., an abrasion resistant layer with adhesive property).

[0128] Figure 10B further shows a close up view 1060 of an edge of the thermal barrier 1050. The dielectric edge seal 1056 is shown wrapped around edge of the core 1052. In the configuration shown in Figure 10B, the encapsulation layer 1058 is shown covering only an edge portion of the core 1052 and the dielectric edge seal 1056. An end view 1070 of the thermal barrier 1050 is further shown in Figure 10B. As discussed above, it may be advantageous to maintain a thinner middle portion of the thermal barrier 1050 that will be between battery cells. Middle portion 1053 of thermal barrier 1050 is shown in view 1070 where the middle portion 1053 is thinner than the reinforced edges.

[0129] Figure 1 1 A shows a battery module 1 100 including one or more thermal barriers as described in the present disclosure. The battery module 1100 includes a number of battery cells 1112. The battery cells 1112 are configured to be located within a battery housing 1102. The battery module 1100 includes one or more thermal barriers 1114 similar to thermal barriers described with respect to Figures 9A-10B. In the configuration shown in Figure 11 A, a cooling plate 1110 is included on one side of the stack of battery cells 1112. In selected configurations, the thermal barriers 1114 only extend beyond a lateral footprint of the battery cells 1112 on three sides, thus allowing the cooling plate 1110 to contact the thermal barriers 1114 on a fourth side. In one aspect, thermal barriers 1114 include a heat conducting plate within their core. In these aspects, contact of a heat conducting plate with the cooling plate 1110 facilitates heat conduction from between battery cells 1112 out to the cooling plate 1110 to spread or dissipate heat.

[0130] In the configuration shown in Figure 11 A, one or more slots are included to engage the thermal barriers 1114 and hold them in place within the housing 1102. In athermal runaway event, gasses and / or ejecta may emit from vents 1113 or other locations on the battery cells 1112. The addition of slots facilitates containment of any hot gasses and / or ejecta. Figure 11A shows first slots 1104 included in sidewalls of the housing 1102. Although sides of the housing 1102 are shown with slots 1104. slots may also be included on a bottom or lid of the housing 1102. In the configuration shown in Figure 11 A, a grooved plate 1106 is included with a number of second slots 1107 are included in the grooved plate 1106. The first slots 1104 and / or second slots 1107 are positioned to align with the thermal barriers 1114 and hold them in place. Although the grooved plate 1 106 is shown adjacent to a lid 1108, the invention is not so limited. A grooved plate 1106 can also be utilized adjacent to a bottom of the housing 1102 or on sides of the housing 1102.

[0131] Figure 11 A also shows one or more secondary battery cell separators 1 116. The secondary battery cell separators 1116 do not extend past a lateral cell footprint of the battery cells 1112. In one aspect, the secondary battery7cell separators 1116 comprise heat conducting plates. Although the combination of thermal barriers 1114 and secondary battery cell separators 1116 is shown, the invention is not so limited. Other aspects include only one or the other of thermal barriers 11 14 and secondary battery cell separators 1 1 16.

[0132] Figure 1 IB shows a number of possible cross sectional configurations of slots such as first slots 1104 and second slots 1107 shown in Figure 11 A. View 1120 shows a groove 1121. The groove 1121 includes a taper where a top (e.g., an opening facing the interior of the housing) of the groove 1121 is w ider than a bottom (e.g., an interior surface of the groove opposing the top) of the groove 1121. Dimension 1122 indicates the w idth of the groove 1121 at the top. Dimension 1124 indicates a width of a dielectric edge seal of a thermal barrier 1123. As shown in the Figure, dimension 1122 of the taper helps to capture and align the thermal barrier 1 123 during assembly.

[0133] View71130 shows a groove 1131. The groove 1131 includes a geometry where a top (e.g., an opening facing the interior of the housing) of the groove 1131 is narrower than a bottom (e.g.. an interior surface of the groove opposing the top) of the groove 1131. Dimension 1132 indicates the width ofthe groove 1131 at the top. In one aspect, the groove 1131 includes a contoured cross section that substantially mirrors a cross section of a dielectric edge seal of a thermal barrier 1133. Dimension 1 134 indicates a width of a dielectric edge seal (with the encapsulation layer) of athermal barrier 1133. As shown, dimension 1132 is slightly narrower than dimension 1134. The narrow top, and the contoured shape improve retention of the thermal barrier 1133 within the groove 1131.

[0134] View 1140 shows a groove 1141. The groove 1141 includes a geometry where a top (e.g., an opening facing the interior of the housing) of the groove 1141 is narrower than a bottom (e.g., an interior surface of the groove opposing the top) of the groove 1141. Dimension 1142 indicates the width of the groove 1141 at the top. In one aspect, the groove 1141 includes a trapezoid cross section. The trapezoid cross section allows for more variation in size of edges of the thermal barrier 1143 compared to the contoured cross section of groove 1131. Dimension 1144 indicates a width of a dielectric edge seal of a thermal bam er 1143. As shown, dimension 1142 is slightly narrower than dimension 1144. The narrow top, and the trapezoid cross section improve retention of the thermal barrier 1143 within the groove 1141.

[0135] View 1150 shows a groove 1151. The groove 1151 includes a geometry where a top (e.g.. an interior surface of the groove opposing the top) of the groove 1141 is substantially the same as a bottom (e.g., an interior surface of the groove opposing the top) of the groove 1151. Dimension 1152 indicates the width of the groove 1151 at the top and bottom. Dimension 1154 indicates a width of a dielectric edge seal of a thermal barrier 1153. As shown, dimension 1152 is slightly wider than dimension 1154. This configuration facilitates ease of location of thermal barrier 1153 within the groove 1151, especially if the dielectric edge seal of the thermal barrier 1153 is not very resilient and does not deform into the groove 1151 easily.

[0136] Figure 12 shows a battery module 1200 including one or more thermal barriers as described in the present disclosure. The battery module 1200 includes a number of battery cells 1212. The battery' cells 1212 are configured to be located within a battery housing 1202. The battery module 1200 includes one or more thermal barriers 1214 similar to thermal barriers described with respect to Figures 9A-10B.

[0137] In the configuration of Figure 12, one or more slots are included to engage the thermal barriers 1214 and hold them in place within the housing 1202. In a thermal runaway event, gasses and / or ejecta may emit from vents 1213 or other locations on the battery cells 1212. The addition of slots facilitates containment of any hot gasses and / or ejecta. Figure 12 shows first slots 1204 included in sidewalls of the housing 1202. Although sides of the housing 1202 are shown with slots 1204, slots may also be included on a bottom or lid of the housing 1202. In the configuration of Figure 12, a top grooved plate 1206 adjacent to a lid 1208 is included with a number of second slots 1207. A bottom grooved plate 1218 is also shown with a number of third slots 1219. In one aspect, the bottom grooved plate 1218 is a cooling plate. In one aspect, the bottom grooved plate 1218 may include coolant flows therein. The first slots 1204, second slots 1207, and third slots 1219 are positioned to align with the thermal barriers 1214 and hold them in place.

[0138] Figure 12 also shows one or more secondary battery cell separators 1216. The secondary battery cell separators 1216 do not extend past a lateral cell footprint (e.g., the largest surface of the battery cell) of the battery cells 1212. In one aspect, the secondary7battery7cell separators 1116 include heat conducting plates, and one or more of the top plate 1206 and bottom plate 1218 are formed from a metal or other conductor, and function as cooling plates. In one aspect, the thermal barrier 1214 extends beyond the lateral cell footprint of the battery7cell 1212. Although the combination of thermal barriers 1214 and secondary battery cell separators 1216 is shown, the invention is not so limited. Other aspects include only one or the other of thermal barriers 1214 and secondary battery cell separators 1216.

[0139] Figure 13A shows another aspect of a thermal barrier 1300. The thermal barrier 1300 is shown as it aligns with a battery7cell 1302. A lateral battery footprint 1303 is illustrated by projected lines 1304 as within a middle portion of the thermal barrier 1300. Although only one thermal barrier 1300 and one battery cell 1302 are shown, it should be appreciated that the configuration can be extended to battery7modules w ith multiple thermal barriers 1300 and multiple battery cells 1302 as described in the present disclosure.

[0140] In the configuration shown in Figure 13A, dielectric edge seals 1306 are shown around edges of a core 1301 of the thermal barrier 1300. In theconfiguration shown in Figure 13A, comers 1308 of the core 1301 are not covered by dielectric edge seals 1306. This configuration provides ease of manufacture given that double thicknesses of the dielectric edge seals 1306 at comers are avoided.

[0141] Figure 13B shows an end view of the thermal barrier 1300 with the batter ’ cell 1302 in place adjacent to the thermal barrier 1300. The core 1301 is illustrated with the dielectric edge seals 1306 located at edges of the thermal barrier 1300. The battery cell 1302 is shown in place within the lateral battem footprint 1303 (e.g., the largest surface of the battery). The dielectric edge seals 1306 are shown thicker than the core 1301. The battery footprint is smaller than the largest surface of the core 1301. A portion of the encapsulation layer 1310 over the dielectric edge seals 1306 is disposed between the battery cell 1302 and the core 1301, while the dielectric edge seal 1306 is outside the footprint of the battery’ cell 1302. As discussed above, in this configuration, edges of the thermal barrier 1300 are reinforced, while still alloyving for a thin thermal barrier 1300 within the lateral battery footprint 1303, which keeps an overall dimension of a battery module smaller.

[0142] In one aspect, the encapsulation layer 1310 extends to cover the entire lateral battery footprint 1303. In selected aspects portions of tape, encapsulation layer, etc, that are securing the dielectric edge seals 1306 are within the lateral battery footprint 1303. The encapsulation layer 1310 includes a thickness that is substantially smaller than the dielectric edge seals 1306. As such, the thermal barrier is thinner within the battery footprint 1303 and thicker beyond the battery footprint 1303 to engage with the battery housing.Figure 13C shows another illustration of a thermal barrier 1350. A central portion 1352 of the thermal barrier 1350 is shown, and corresponds to a lateral battery' footprint similar to the illustration in Figure 13 A. In the configuration shoyvn in Figure 13C. dielectric edge seals 1356 are shoyvn around three edges of a core of the thermal barrier 1350. In the configuration shoyvn in Figure 13C. comers 1354 of the core are covered by the dielectric edge seals 1356. This configuration eliminates any pathway that may exist at comers of the core where gasses and / or ejecta may escape past the thermal barrier 1350 in the event of a thermal runaway. In the configuration of Figure 13C, a fourth edge 1353 doesnot include any dielectric edge seals 1356. This configuration may allow for thermal contact with a cooling plate, as illustrated in Figure 11 A.Thermal Barriers with Dielectric Reinforcing Layers of Various Configurations

[0143] Figure 14A shows another aspect of a thermal barrier 1400. The thermal barrier 1400 includes an insulator layer 1402 and a dielectric reinforcing layer 1403 forming a laminate with the insulator layer 1402. In Figure 14A, the dielectric reinforcing layer 1403 includes a fold 1407 that forms an envelope with a first side 1404 and a second side 1406. An edge seal 1408 similar to edge seals described above is also show n as an option in the aspect of Figure 14A. In one aspect, the edge seal 1408 seals three edges of the insulator layer 1402. Thermal barriers that include an envelope configuration include advantages such as easier edge containment along the fold 1407, and reduced manufacturing cost.

[0144] Figure 14B shows another aspect of a thermal barrier 1410. The thermal barrier 1410 includes an insulator layer 1412 and a dielectric reinforcing layer 1413. The dielectric reinforcing layer 1413 has a U shape with a first side 1414 and a second side 1416. The first side 1414 and the second side 1416 are connected by a bottom side 1417. The bottom side 1417 is perpendicular with the first side 1414 and the second side 1416. An edge seal 1418 seals the gaps between the first side 1414 and the second side 1416, enclosing the insulator layer 1412 therebetween.

[0145] Figure 14C shows another aspect of thermal barrier 1420. The thermal barrier 1420 includes an insulator layer 1422 and a dielectric reinforcing layer 1423. The dielectric reinforcing layer 1423 has a slot with an opening in one of its surfaces, e.g.. a minor surface, thereby forming a pocket. The insulator layer 1422 fits into the slot through the opening into the pocket. The thermal barrier 1420 further comprises an edge seal 1428 to seal the insulator layer 1422 into the slot of the dielectric reinforcing layer 1423, e.g., sealing the opening of the pocket.Thermal Barriers with Dielectric Reinforcing Lavers and Encapsulation Laver

[0146] Figure 15A shows a cross section view7of thermal barrier 1500. The thermal barrier 1500 comprises an insulator layer 1502 and dielectric reinforcing layers 1504 and 1506 over at least one opposite major surfaces of the insulator layer 1502. The thermal barrier 1500 further comprises anencapsulation layer 1508 wrapping around the insulator layer 1502 to prevent or contain dust from the insulator layer 1502. The encapsulation layer 1508 may completely or partially enclose the insulator layer 1502. In one aspect, the encapsulation layer 1508 entirely encloses the insulator layer 1502. The encapsulation layer 1508 is disposed between the dielectric reinforcing layers 1504 and 1506. The thermal barrier 1500 may further comprise an adhesive layer (not shown) between the encapsulation layer 1508 and each of the dielectric reinforcing layers 1504 and 1506.

[0147] In one aspect, the encapsulation layer 1508 may comprise polyethylene (PE), polypropylene (PP), polyvinyl chloride (PVC), polyethylene terephthalate (PET), polycarbonate (PC), other polymer, rubber, or resin films, or combinations thereof.

[0148] In one aspect, the encapsulation layer 1508 may comprise an adhesive layer, such as a pressure sensitive adhesive (PSA). The encapsulation layer 1508 is pressed on to and completely encloses the insulator layer 1502. The dielectric reinforcing layers 1504 and 1506 may be pressed and attached to the two major surfaces of the insulator layer 1502 by the encapsulation layer 1508.

[0149] Figure 15B shows a cross section view of thermal barrier 1510. The thermal barrier 1510 comprises at least one of the dielectric reinforcing layers 1514, 1516 and an insulator lay er 1512 disposed thereover. Different from the thermal barrier 1500 illustrated with respect to Figure 15 A, the insulator layer 1512 and the dielectric reinforcing layers 1514 and 1516 are all enclosed in the encapsulation layer 1518. The encapsulation layer 1518 prevents any possible dust from the insulator layer 1512 or the dielectric reinforcing layers 1514 and 1516. The encapsulation layer 1518 may also serve to hold the insulator layer 1512 and the dielectric reinforcing layers 1514 and / or 1516 without adhesives therebetween. In other aspects, the reinforcing layers 1514 and 1516 may be attached or adhered to the insulator layer 1512, e.g., with an adhesive (not shown), and the encapsulation layer 1518 may be attached or adhered to the outer surfaces of the thermal barrier 1510, e.g., with an adhesive (not shown). In some aspects, the encapsulation layer may be attached or adhered only to itself, e.g., by heat sealing or selective use of adhesive on overlapping surfaces.

[0150] Figure 15C shows a cross section view of thermal barrier 1520. The thermal barrier 1520 comprises the insulator layer 1522 and two dielectric reinforcing layers 1524 and 1526 attached to the insulator layer 1522 by adhesives 1523. In one aspect, the adhesives 1523 are spray ed-on adhesives, double sided tapes, or PSA.

[0151] Optionally, the thermal barrier 1520 in Figure 15C may further include adhesives 1527 to attach to the adjacent battery cells (not shown). In one aspect, the adhesives 1527 are double sided tapes, PSA, or sprayed-on adhesives. In one aspect, the adhesives 1527 are multiple stripes in shape. In one aspect, the adhesives 1527 are positioned at different locations on opposite surfaces of the thermal barrier 1520 to reduce the stacking thickness when multiple thermal barriers 1520 are used in a battery module. In one aspect, the adhesives 1527 on the left (negative X direction) of the thermal barrier 1520 are offset in Z direction from the adhesives 1527 on the right (positive X direction) of the thermal barrier 1520.

[0152] In some aspects of Figure 15C, the adhesives 1527 and the encapsulation layer 1528 are protected by release layers 1525, which can be removed to expose the adhesives 1527 when applying the thermal barrier 1520 to battery cells (not shown). In the case where the encapsulation layer 1528 is PSA, the release layers 1525 are attached to the encapsulation layer 1528 directly without the adhesives 1527.

[0153] Figure 15D shows an exploded view of thermal barrier 1530. The thermal barrier 1530 includes an insulator layer 1532 and dielectric reinforcing layers 1534 and 1536. In one aspect, the dielectric reinforcing layers 1534 and 1536 are attached to the major surfaces of the insulator layer 1532 by adhesives 1533. The adhesives 1533 may7cover the major surfaces of the insulator layer 1532 entirely or partially. In one aspect, the adhesives 1533 may be adhesive stripes. In one aspect the adhesives may be sprayed onto the insulator layer 1532 or the dielectric reinforcing layers 1534.

[0154] The thermal barrier 1530 in Figure 15D may further comprise encapsulation layers 1538 wrapping around the insulator layer 1532 and the dielectric reinforcing layers 1534 and 1536. At least one of the encapsulation layers 1538 each comprises a major surface and at least one flap 1539 adjacent to the major surface. In some aspects, one encapsulation layer has a majorsurface with a footprint the same as or smaller than the insulator layer 1532 and the dielectric reinforcing layers 1534 and 1536 and the other encapsulation layer comprises the at least one flap 1539. In various aspects, the at least one flap 1539 may be folded over to wrap around and contact the other encapsulation layer to enclose the insulator layer 1532 and the dielectric reinforcing layers 1534 and 1536.

[0155] The thermal barrier 1530 in Figure 15D may further comprise an adhesive layer 1537 to attach the thermal barrier 1530 to battery cells (not shown). The adhesives 1537 may be double sided tape or spray-on adhesives. The adhesive layers 1537 may optionally be protected by release layers 1535 from external damage, such as scratches or dust. The release layers 1535 are removable when applying the thermal barrier 1530 onto battery cells (not shown).

[0156] Figure 16 shows a battery module 1600 that may include one or more thermal barriers as described in this disclosure. A number of battery’ cells 1602 are shown within a module housing 1604. One or more of the battery cells 1602 are separated by at least one thermal barrier 1610. In Figure 1 , a heat sink 1605 or cooling plate is included adjacent to one edge of the battery' cells 1602 and thermal barriers 1610. As noted above, in one aspect, one or more of the thermal barriers 1610 include a heat conducting layer that helps remove heat laterally to the heat sink 1605. A lid 1606 is shown, containing the battery cells 1602 and the thermal barriers 1610 within the housing 1604. In one aspect, a top insulator layer 1608 is included to protect from heat escaping upwards from the battery module 1600. In one aspect, the top insulator layer 1608 can withstand particle bombardments under extreme conditions (e.g., thermal runaway) to protect components (not shown) over the lid 1606. Aspects of top insulator layer 1608 include, but are not limited to, aerogel materials. In one aspect, the top insulator layer 1608 includes similar structures to thermal barriers described in the present disclosure, such as dielectric reinforcing layers.

[0157] Battery modules and / or battery packs with thermal barriers as described above are used in a number of electronic devices. Figure 17 illustrates an electronic device 1700 that includes a battery module 1710. The battery module 1710 is coupled to functional electronics 1720 by circuitry’ 1712. In the configuration shown, the battery module 1710 and circuitry 1712 are containedin a housing 1702. A charge port 1714 is shown coupled to the batten' module 1710 to facilitate recharging of the battery module 1710 when needed.

[0158] In one aspect, the functional electronics 1720 include devices such as semiconductor devices with transistors and storage circuits. Semiconductor devices include, but are not limited to, telephones, computers, display screens, navigation systems, etc.

[0159] Figure 18 illustrates another electronic system that utilizes battery modules that include thermal management systems as described above. An electric vehicle 1800 is illustrated in Figure 18. The electric vehicle 1800 includes a chassis 1802 and wheels 1822. In the aspect shown, each wheel 1822 is coupled to a drive motor 1820. A battery module 1810 is shown coupled to the drive motors 1820 by circuitry 1806. A charge port 1804 is shown coupled to the battery module 1810 to facilitate recharging of the battery module 1810 when needed.

[0160] Electric vehicle 1800 may include, but are not limited to. consumer vehicles such as cars, trucks, etc. Commercial vehicles such as tractors and semi-trucks are also within the scope of the invention. Although a four wheeled vehicle is shown, the invention is not so limited. For example, two wheeled vehicles such as motorcycles and scooters are also within the scope of the invention.

[0161] To better illustrate the method and apparatuses disclosed herein, a non-limiting list of embodiments is provided here:

[0162] Aspect 1. A battery module, comprising: a number of battery cells; at least one thermal barrier separating selected battery cells in the number of battery cells, the thermal barrier comprising an insulator layer; and a dielectric reinforcing layer forming a laminate with the insulator layer.

[0163] Aspect 2. The battery module of aspect 1, wherein the dielectric reinforcing layer includes mica.

[0164] Aspect 3. The battery module of aspect 2, wherein the mica is included in a silicone binder.

[0165] Aspect 4. The battery module of aspect 1, wherein the insulator layer includes an aerogel.

[0166] Aspect 5. The battery module of aspect 1, wherein the dielectric reinforcing layer includes a pair of dielectric reinforcing layers on both major surfaces of the insulator layer.

[0167] Aspect 6. The battery module of aspect 1, wherein the dielectric reinforcing layer is attached with adhesive to the insulator layer.

[0168] Aspect 7. The battery module of aspect 6, wherein the adhesive includes a first pressure sensitive adhesive.

[0169] Aspect 8. The battery module of aspect 6, further including a second pressure sensitive adhesive attaching the thermal barrier to at least one battery' cell.

[0170] Aspect 9. A battery module, comprising: a number of battery cells within a module housing, the battery cells having a battery' cell lateral footprint; a lid enclosing the module housing, and covering the number of battery cells, wherein the lid defines a top space betw een the number of battery cells and the lid; at least one thermal barrier separating selected battery cells in the number of battery cells, the thermal barrier comprising; an insulator layer having an insulator lateral footprint equal to or greater than the battery cell lateral footprint; and a reinforcing layer including a dielectric forming a laminate with the insulator layer, wherein the reinforcing layer including the dielectric extends beyond the insulator lateral footprint.

[0171] Aspect 10. The battery module of aspect 9, w herein the reinforcing layer includes a pair of reinforcing layers on both major surfaces of the insulator layer.

[0172] Aspect 11. The battery module of aspect 10, wherein the reinforcing layer extends into the top space.

[0173] Aspect 12. The battery module of aspect 9, further including seals betw een the battery cells and the lid.

[0174] Aspect 13. The battery’ module of aspect 9, wherein the reinforcing layer extends laterally upwards and from sides of the insulator layer.

[0175] Aspect 14. The battery module of aspect 9, further including a cooling plate adjacent to a bottom edge of the number of battery' cells.

[0176] Aspect 15. The battery' module of aspect 9, wherein the reinforcing layer angles outward from the insulator layer.

[0177] Aspect 16. The batten' module of aspect 9, wherein the insulator layer includes an aerogel.

[0178] Aspect 17. The battery module of aspect 9, wherein the reinforcing layer includes mica.

[0179] Aspect 18. The batten' module of aspect 9, further including a top thermal barrier between the number of battery cells and the lid.

[0180] Aspect 19. The battery module of aspect 18, wherein the top thermal barrier includes an aerogel and mica laminate.

[0181] Aspect 20. A battery' module, comprising: a number of battery cells within a module housing, the battery' cells having a battery cell lateral footprint; a lid enclosing the module housing, and covering the number of battery cells, wherein the lid defines a top space between the number of battery cells and the lid; at least one layered thermal barrier separating selected battery cells in the number of battery cells, the thermal barrier including an insulator layer; a reinforcing layer comprising a dielectric forming a laminate with the insulator layer; and an edge seal, wherein the layered thermal barrier is dimensioned so that the edge seal contacts the lid.

[0182] Aspect 21. The batten' module of aspect 20, wherein the reinforcing layer includes a pair of reinforcing layers on both major surfaces of the insulator layer.

[0183] Aspect 22. The battery module of aspect 20, wherein the reinforcing layer includes an envelope with a fold.

[0184] Aspect 23. The batten' module of aspect 20, wherein the lid includes a top insulator layer adjacent to a lower lid surface.

[0185] Aspect 24. The battery module of aspect 23, wherein the top insulator layer includes an aerogel and mica laminate.

[0186] Aspect 25. The batten' module of aspect 20, wherein the insulator layer includes an aerogel.

[0187] Aspect 26. The battery module of aspect 20, wherein the reinforcing layer includes mica.

[0188] Aspect 27. The batten' module of aspect 20, wherein the edge seal includes tape.

[0189] Aspect 28. The battery module of aspect 20, wherein the edge seal includes an intumescent material.

[0190] Aspect 29. The batten' module of aspect 20, wherein the edge seal is wider than a width of the insulator layer and the reinforcing layer.

[0191] Aspect 30. A thermal barrier, comprising: an insulator layer; an encapsulation layer wrapping around the insulator layer; and a dielectric reinforcing layer forming a laminate with the insulator layer and the encapsulation layer.

[0192] Aspect 31. The thermal barrier of aspect 30, wherein the encapsulation layer wraps around the dielectric reinforcing layer.

[0193] Aspect 32. The thermal barrier of aspect 30, wherein the insulator layer and the dielectric reinforcing layer are separated by the encapsulation layer.

[0194] Aspect 33. The thermal barrier of aspect 30, wherein the encapsulation layer is an adhesive layer.

[0195] Aspect 34. The thermal barrier of aspect 30, wherein the encapsulation layer is a pressure sensitive adhesive layer.

[0196] Aspect 35. The thermal barrier of aspect 30, wherein the thermal barrier further comprises an adhesive layer between the insulator layer and the dielectric reinforcing layer.

[0197] Aspect 36. The thermal barrier of aspect 30, wherein the thermal barrier further comprises an adhesive layer over the encapsulation layer.

[0198] Aspect 37. The thermal barrier of aspect 33, wherein the thermal barrier further comprises a release layer over the adhesive layer.

[0199] Aspect 38. The thermal barrier of aspect 30, wherein the dielectric reinforcing layer is a first dielectric reinforcing layer disposed over one side of the insulator layer, and wherein the thermal barrier further comprises a second dielectric reinforcing layer disposed on an opposite side of the insulator layer.

[0200] Aspect 39. A battery module, comprising: a number of battery cells within a module housing, each of the battery cells having a corresponding battery cell lateral footprint; at least one thermal barrier separating selected battery cells in the number of battery cells, the at least one thermal barrier comprising; a core insulator layer; and a dielectric reinforcing layer encapsulating the core insulator layer.

[0201] Aspect 40. A battery module, comprising: a number of battery cells within a module housing, each of the battery cells having a corresponding battery cell lateral footprint; at least one thermal barrier separating selected battery cells in the number of battery cells, the at least one thermal barrier comprising : a core insulator layer; and a dielectric edge seal enclosing one or more edges of the core insulator layer.

[0202] Aspect 41. The battery module of aspect 40, wherein the core insulator layer includes an aerogel layer.

[0203] Aspect 42. The battery module of aspect 40, wherein the dielectric edge seal includes mica.

[0204] Aspect 43. The battery module of aspect 40, further including an encapsulation layer covering the dielectric edge seal.

[0205] Aspect 44. The battery' module of aspect 40, further including an encapsulation layer covering the entire dielectric edge seal and the entire core insulator layer.

[0206] Aspect 45. The battery module of aspect 40, wherein the dielectric edge seal covers the entire core insulator layer.

[0207] Aspect 44. The battery’ module of aspect 43, wherein the encapsulation layer includes tape.

[0208] Aspect 45. The battery module of aspect 40, wherein the dielectric edge seal encloses three edges, and where a fourth edge of the thermal barrier contacts a cooling plate.

[0209] Aspect 46. The battery module of aspect 40, wherein one or more sides of housing includes a groove corresponding to an edge of the at least one thermal barrier.

[0210] Aspect 47. The battery' module of aspect 46, wherein the groove is narrower at a top than at a bottom of the groove.

[0211] Aspect 48. The battery module of aspect 46, wherein the groove is narrower at a bottom than at a top of the groove.

[0212] Aspect 49. The battery' module of aspect 46, wherein the groove includes one or more grooves in sidewalls of the housing.

[0213] Aspect 50. The battery module of aspect 40, further including one or more grooved plates contained within the housing.

[0214] Aspect 51. The batten' module of aspect 50, wherein the one or more grooved plates include top and bottom grooved plates.

[0215] Aspect 52. The battery module of aspect 40, wherein the dielectric edge seal encloses edges, but not comers of the core insulator layer.

[0216] Aspect 53. The batten' module of aspect 40, wherein the dielectric edge seal encloses edges and comers of the core insulator layer.

[0217] Aspect 53. The battery module of aspect 40, wherein the dielectric edge seal is continuous across three edges of the core insulator layer.

[0218] Aspect 54. The battery module of aspect 40, wherein the dielectric edge seal covers a portion of the insulator layer laterally outside the battery cell lateral footprint.

[0219] Aspect 54. The battery module of aspect 40, wherein the battery module further comprises a secondary battery cell separator having a smaller footprint than the thermal barrier.

[0220] The above description is intended to be illustrative, and not restrictive. The above-described illustrations (or one or more aspects thereof) may be used in combination with each other. Other embodiments can be used, such as by one of ordinary skill in the art upon reviewing the above description. The Abstract is provided to allow the reader to quickly ascertain the nature of the technical disclosure. It is submitted with the understanding that it will not be used to interpret or limit the scope or meaning of the claims. Also, in the above Detailed Description, various features may be grouped together to streamline the disclosure. This should not be interpreted as intending that an unclaimed disclosed feature is essential to any claim. Rather, inventive subject matter may lie in less than all features of a particular disclosed embodiment. Thus, the following claims are hereby incorporated into the Detailed Description, with each claim standing on its own as a separate embodiment, and it is contemplated that such embodiments can be combined with each other in various combinations or permutations. The scope of the invention should be determined with reference to the appended claims, along with the full scope of equivalents to which such claims are entitled.

[0221] Although an overview of the inventive subject matter has been described with reference to specific embodiments and / or aspects, various modifications and changes may be made to these embodiments withoutdeparting from the broader scope of embodiments of the present disclosure. Such embodiments of the inventive subject matter may be referred to herein, individually or collectively, by the term ‘'invention” merely for convenience and without intending to voluntarily limit the scope of this application to any single disclosure or inventive concept if more than one is, in fact, disclosed.

[0222] The embodiments illustrated herein are described in sufficient detail to enable those skilled in the art to practice the teachings disclosed. Other embodiments may be used and derived therefrom, such that structural and logical substitutions and changes may be made without departing from the scope of this disclosure. The Detailed Description, therefore, is not to be taken in a limiting sense, and the scope of various embodiments is defined only by the appended claims, along with the full range of equivalents to which such claims are entitled.

[0223] As used herein, the term “or” may be construed in either an inclusive or exclusive sense. Moreover, plural instances may be provided for resources, operations, or structures described herein as a single instance. Additionally, boundaries between various resources, operations, modules, engines, and data stores are somewhat arbitrary', and particular operations are illustrated in a context of specific illustrative configurations. Other allocations of functionality are envisioned and may fall within a scope of various embodiments of the present disclosure. In general, structures and functionality presented as separate resources in the above described aspects and / or configurations may be implemented as a combined structure or resource. Similarly, structures and functionality presented as a single resource may be implemented as separate resources. These and other variations, modifications, additions, and improvements fall within a scope of embodiments of the present disclosure as represented by the appended claims. The specification and drawings are, accordingly, to be regarded in an illustrative rather than a restrictive sense.

[0224] The foregoing description, for the purpose of explanation, has been described with reference to specific aspects and / or configurations. However, the illustrative discussions above are not intended to be exhaustive or to limit the possible aspects and / or configurations to the precise forms disclosed. Many modifications and variations are possible in view of the above teachings. The aspects and / or configurations were chosen and described in order to bestexplain the principles involved and their practical applications, to thereby enable others skilled in the art to best utilize the various aspects and / or configurations with various modifications as are suited to the particular use contemplated.

[0225] It will also be understood that, although the terms “first,” “second,” and so forth may be used herein to describe various elements, these elements should not be limited by these terms. These terms are only used to distinguish one element from another. For example, a first contact could be termed a second contact, and, similarly, a second contact could be termed a first contact, without departing from the scope of the present example embodiments. The first contact and the second contact are both contacts, but they are not the same contact.

[0226] The terminology used in the description of the example embodiments herein is for the purpose of describing particular example embodiments only and is not intended to be limiting. As used in the description of the aspects, configurations, embodiments and / or the appended examples, the singular forms “a,” “an,” and “the” are intended to include the plural forms as well, unless the context clearly indicates otherwise. It will also be understood that the term “and / or” as used herein refers to and encompasses any and all possible combinations of one or more of the associated listed items. It will be further understood that the terms “comprises” and / or “comprising,” when used in this specification, specify the presence of stated features, integers, steps, operations, elements, and / or components, but do not preclude the presence or addition of one or more other features, integers, steps, operations, elements, components, and / or groups thereof.

[0227] As used herein, the term “if’ may be construed to mean “when” or “upon” or “in response to determining” or “in response to detecting,” depending on the context. Similarly, the phrase “if it is determined” or “if [a stated condition or event] is detected” may be construed to mean “upon determining” or “in response to determining” or “upon detecting [the stated condition or event]” or “in response to detecting [the stated condition or event],” depending on the context.

Claims

Claims1. A thermal barrier comprising: an insulator layer having a first major surface, a second major surface opposite the first major surface, a first minor surface, and a second minor surface opposite the first minor surface, wherein the first minor surface and the second minor surface are both orthogonal to. and connect, the first major surface and the second major surface; at least one exterior layer on at least one the first major surface or the second major surface of the insulator layer; and a first edge seal on the first minor surface and a second edge seal on the second minor surface.

2. The thermal barrier of claim 1 , wherein the first edge seal and the second edge seal comprise a resilient material.

3. The thermal barrier of claim 2, wherein the resilient material comprises a resilient polymer material.

4. The thermal barrier of claim 3, wherein the resilient polymer material further comprises a heat isolation material, an antiflame material, or both.

5. The thermal barrier of claim 1, further comprising a third minor surface and a third edge seal on a third minor surface, wherein the third edge seal is in contact with the first edge seal and the second edge seal.

6. The thermal barrier of claim 5, wherein the first major surface and the second major surface are connected by a fourth minor surface opposite the third minor surface, and the thermal barrier further comprises a fourth edge seal on the fourth minor surface, wherein the fourth edge seal is in contact with the first edge seal and the second edge seal.

7. The thermal barrier of claim 1, wherein the exterior layer is an abrasion resistant layer.

8. The thermal barrier of claim 7, wherein the thermal barrier further comprising a dielectric reinforcing layer disposed between the insulator layer and the abrasion resistant layer.

9. The thermal barrier of claim 1, wherein the exterior layer is a dielectric reinforcing layer.

10. The thermal barrier of claim 9, further comprising an abrasion resistant layer disposed between the insulator layer and the dielectric reinforcing layer.

11. The thermal barrier of claim 1, further comprising: a module housing comprising sidewalls, a bottom surface, and a top lid; and wherein a first portion of the edge seal on the first minor surface is configured to form an interference fit with the top lid of the module housing.

12. The thermal barrier of claim 11, wherein a second portion of the edge seal on the second minor surface is configured to form an interference fit with a corresponding surface of the module housing.

13. The thermal barrier of claim 11, wherein a third portion of the edge seal on the third minor surface, a fourth portion of the edge seal on the fourth minor surface, or both are configured to form an interference fit with a corresponding surface of the module housing.

14. Athermal barrier comprising: a dielectric reinforcing layer comprising: a first major surface; a second major surface opposite to the first major surface; a first minor surface connected to the first maj or surface and the second major surface at a first end of the dielectric reinforcing layer; a second minor surface opposite the first minor surface, the second minor surface connected to the first maj or surface and the second major surface at a second end of the dielectric reinforcing layer;a third minor surface that is connected to the first major surface, the second major surface, the first minor surface, and the second minor surface at least at the first end and the second end of the dielectric reinforcing layer; wherein the first major surface, the second major surface, the first minor surface, the second minor surface, and the third minor surface define an interior slot of a battery pack housing; and an insulator layer disposed with the interior slot.

15. The thermal barrier of claim 14, further comprising an edge seal over the insulator layer disposed within the interior slot, the edge seal on a fourth minor surface opposite the third minor surface, and wherein the edge seal is in contact with the first major surface, the second major surface, the first minor surface, and the second minor surface.

16. The thermal barrier of claim 15, wherein the edge seal comprises a resilient material.

17. The thermal barrier of claim 16, wherein the resilient material comprises a resilient polymer material.

18. The thermal barrier of claim 17, wherein the resilient polymer material further comprises a heat isolation material, an antiflame material, or both.

19. The thermal barrier of claim 18, further comprising: a module housing comprising sidewalls, a bottom surface, and a top lid; and wherein the edge seal is configured to form an interference fit with the top lid of the module housing.

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