Low dielectric constant thin films, a method of producing the same and uses thereof
FI20246556A1Undetermined Publication Date: 2026-07-01PIBOND OY
Patent Information
- Authority / Receiving Office
- FI · FI
- Patent Type
- Applications
- Current Assignee / Owner
- PIBOND OY
- Filing Date
- 2024-12-30
- Publication Date
- 2026-07-01
Abstract
The present invention relates to low dielectric constant films comprising polymerized organopolysiloxane material obtained by polymerization of organo functionalized monomers. The invention also concerns a method of forming such films by applying organopolysiloxane material containing compositions on a substrate in the form of a layer and by curing the layer to form a film. Further, the invention concerns uses of the low dielectric constant films of the invention in semiconductor devices, optical elements and optoelectronic devices.
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