Low dielectric constant thin films, a method of producing the same and uses thereof

FI20246556A1Undetermined Publication Date: 2026-07-01PIBOND OY

Patent Information

Authority / Receiving Office
FI · FI
Patent Type
Applications
Current Assignee / Owner
PIBOND OY
Filing Date
2024-12-30
Publication Date
2026-07-01
Patent Text Reader

Abstract

The present invention relates to low dielectric constant films comprising polymerized organopolysiloxane material obtained by polymerization of organo functionalized monomers. The invention also concerns a method of forming such films by applying organopolysiloxane material containing compositions on a substrate in the form of a layer and by curing the layer to form a film. Further, the invention concerns uses of the low dielectric constant films of the invention in semiconductor devices, optical elements and optoelectronic devices.
Need to check novelty before this filing date? Find Prior Art