Electronic module, electronic board and manufacturing process of an electronic module

Abstract

Electronic module, electronic board and method for manufacturing an electronic module. An electronic module (10) comprises: - a printed circuit board (12) having an opposing upper face (26) and lower face (28), the printed circuit board (12) including a reference conductor, - electrical components (14A, 14B, 14C, 14D) mounted on the upper face (26) of the printed circuit board (12), - an encapsulation layer (16) disposed on the upper face (26) of the printed circuit board (12) encapsulating the electrical components (14A, 14B, 14C, 14D), the encapsulation layer (16) being made of a dielectric material, - a metallic protective cage (18) covering the encapsulation layer (16), and - at least one protective via (20), each protective via (20) connecting the protective cage (18) to the reference conductor by passing through the encapsulation layer. (16). Figure for the abbreviation: Figure 2

Description

Title of the invention: Electronic module, electronic board and method for manufacturing an electronic module

[0001] The present invention relates to an electronic module, an electronic board and a method for manufacturing an electronic module.

[0002] It is possible to integrate on an electronic board numerous heterogeneous electrical components usually distributed in functional areas, each area grouping the electrical components performing a particular function, such as a power supply function, a signal processing function, a graphics control function, a graphical interface function,...

[0003] It is possible to manufacture an electronic circuit board by assembling one or more electronic modules on a printed circuit board, each electronic module itself comprising a printed circuit board on which electrical components are mounted. The electrical components of each electronic module can be divided into zones, each zone having a specific function.

[0004] This manufacturing method is called PCMA (Printed Circuit Module Assembly) technology.

[0005] This PCMA technology has the advantages of increasing the density of areas, while using economical manufacturing techniques, even for low production volumes.

[0006] However, this high density of areas leads to a close proximity between the electrical components within the electronic module.

[0007] However, this proximity is particularly disadvantageous in the case where one of the areas of the electronic module emits electromagnetic disturbances likely to disturb a neighboring area sensitive to electromagnetic disturbances.

[0008] These electromagnetic interferences between the areas of the electronic module potentially reduce the performance of the electronic module.

[0009] One of the aims of the invention is to overcome this drawback and to reduce electromagnetic interference between areas of an electronic module.

[0010] To this end, the invention proposes an electronic module comprising:

[0011] - a printed circuit board having an opposing upper and lower face, the printed circuit board including a reference conductor,

[0012] - electrical components mounted on the top surface of the printed circuit board,

[0013] - a coating layer disposed on the upper surface of the printed circuit board in encapsulating the electrical components, the encapsulation layer being made of a dielectric material,

[0014] - a protective metal cage covering the coating layer, and

[0015] - at least one protective via, each protective via connecting to the protective cage to the reference conductor by passing through the coating layer. Depending on specific implementation methods, the electronic module includes one or more of the following optional features, taken individually or in all technically possible combinations:

[0016] - the electrical components include at least one third electrical component having a connection terminal electrically connected to the reference conductor, at least one or each protective via connecting the connection terminal of a third electrical component associated with this via to the protective cage by passing through the encapsulation layer;

[0017] - the third electrical component associated with one or each via is a component passive electrical element, such as a resistive element, a capacitive element or an inductive element;

[0018] - one or each of the protective vias is a metallized passage, preferably an orifice metallic, in particular a metallic orifice with a circular cross-section;

[0019] - each protective via has its transverse dimensions, taken perpendicularly to a direction of extension of the protection via through the coating layer, between 100 sqm and 300 pm;

[0020] - the electronic module includes at least one polluting area likely to emit electromagnetic disturbances and a sensitive area susceptible to being disturbed by electromagnetic disturbances, the module comprising a plurality of protection vias arranged so as to define an internal protective partition between the polluting area and the sensitive area;

[0021] - the printed circuit board is laminated and comprises at least one insulating layer and at minus one conductive layer, each insulating layer being made of a dielectric material and each conductive layer being made of an electrically conductive material;

[0022] - the reference conductive layer is configured to be at an electrical potential reference; and

[0023] - the metal protective cage is electrically connected to the conductive layer of reference.

[0024] The invention also relates to an electronic card comprising at least one electronic module as described above.

[0025] The invention also relates to a method for manufacturing an electronic module, said method comprising the following steps:

[0026] - a drilling step of at least one passage through a coating layer made of a dielectric material and covering the upper surface of a circuit printed material on which electrical components are mounted, the encapsulating layer surrounding the electrical components, and

[0027] - a metal deposition step in each passage to form a protective via connecting a metallic protective cage covering the coating layer to a printed circuit board reference conductor by passing through the coating layer.

[0028] According to particular embodiments, the method comprises one or more of the following optional features, taken individually or in all technically possible combinations:

[0029] - the electrical components include at least one third electrical component having a connection terminal electrically connected to a reference conductor, at least one or each protective via connecting the connection terminal of a third electrical component associated with this via to the protective cage by passing through the encapsulation layer;

[0030] - the method is implemented in such a way as to form a plurality of protection vias arranged so as to define an internal protective partition between a polluting area likely to emit electromagnetic disturbances and a sensitive area likely to be disturbed by electromagnetic disturbances;

[0031] - the method includes a step of assembling electrical components on a upper surface of a printed circuit board, the printed circuit board preferably being laminated and comprising at least one insulating layer and at least one conductive layer, each insulating layer being made of a dielectric material and each conductive layer being made of an electrically conductive material, one conductive layer defining the reference conductive layer configured to be at the same electrical reference potential as the system; and

[0032] - the method includes a step of applying a coating layer to the face upper part of the printed circuit board by encapsulating the electrical components, the encapsulation layer being made of a dielectric material.

[0033] The invention and its advantages will be better understood upon reading the following description, given solely by way of non-limiting example, and made with reference to the accompanying drawings, in which:

[0034] - [Fig. 1] [Fig. 1] is a schematic top view representation of an electronic module electronics according to the invention; and

[0035] - [Fig.2] [Fig.2] is a cross-sectional view of the electronic module of the [Fig.l], according to II - II on the [Fig.l].

[0036] The electronic module 10 illustrated in Figures 1 and 2 is, for example, intended to be mounted on a printed circuit board of an electronic board (not shown), possibly with one or more other electronic modules and / or one or more electrical components mounted directly on the printed circuit board of the electronic board. tronique.

[0037] The electronic module 10 comprises a printed circuit board 12, electrical components 14A, 14B, 14C, 14D, an encapsulation layer 16, a metal protective cage 18 and at least one protective via 20, and preferably a plurality of protective vias 20.

[0038] For reasons of readability, the metal protective cage 18 and the coating layer 16 are not shown in [Fig.1].

[0039] The electronic module 10 is configured for example to implement a plurality of individual functions, such as an audio function, a power supply function, a signal processing function, a graphic control function, or a graphic interface function.

[0040] The electrical components 14A, 14B, 14C, 14D are preferably grouped into separate zones, each zone grouping the electrical components 14A, 14B, 14C, 14D associated for the implementation of a determined function.

[0041] For this purpose, the electronic module 10 is, for example, divided into several functional zones 22, 24. Each functional zone 22, 24 corresponds to a function, i.e., groups together the elements and, in particular, electrical components that together perform a function of the electronic module 10.

[0042] For example, the electrical components 14B, 14C, 14D are grouped in the same functional area 24 to implement a function of the electronic module 10

[0043] In the example illustrated in [Fig. 1], the electronic module 10 comprises a first, distinct, adjacent functional zone 22 and second zone 24, preferably corresponding to different functions. The first zone 22 corresponds, for example, to a power supply function. The second zone 24 corresponds, for example, to an audio signal processing function.

[0044] It is possible that an area of ​​the electronic module 10, hereafter referred to as "polluting", may be liable to emit electromagnetic disturbances, and that another area of ​​the electronic module 10, hereafter referred to as "sensitive", may have its operation disturbed by the electromagnetic disturbances emitted by the polluting area.

[0045] A polluting area includes, for example, one or more electrical components 14A, hereafter referred to as "pollutants", capable of emitting electromagnetic waves.

[0046] A sensitive area includes, for example, one or more electrical components 14B, hereafter referred to as "sensitive", capable of capturing electromagnetic waves.

[0047] In one example, the first zone 22 is a polluting zone likely to emit electromagnetic disturbances and the second zone 24 is a sensitive area likely to be disturbed by electromagnetic disturbances, and in particular by those emitted by the first zone 22.

[0048] The printed circuit board 12 has an upper face 26 and a lower face 28 opposite each other.

[0049] As illustrated in [Fig.2], the printed circuit 12 is preferably laminated and comprises a plurality of layers stacked one on top of the other, in particular between the upper face 26 and the lower face 28.

[0050] More particularly, the printed circuit 12 comprises at least one insulating layer 30 and at least one conductive layer 32, and advantageously an alternation of insulating layers 30 and conductive layers 32, 34.

[0051] In the example illustrated in [Fig. 2], the printed circuit board 12 comprises five insulating layers 30 and four conductive layers 32, 34. The conductive layers 32, 34 are, for example, interleaved between the insulating layers 30. Preferably, each conductive layer 32, 34 is interleaved between two insulating layers 30.

[0052] Preferably, each insulating layer 30 is made of a dielectric material, such as a matrix of plastic or resin material, optionally reinforced with fibers, for example, glass fibers. A material comprising a glass fiber reinforced resin matrix is ​​known as FR4.

[0053] Preferably, each conductive layer 32,34 is made of an electrically conductive material, such as a metallic material, in particular copper or a copper alloy.

[0054] The printed circuit board 12 includes a reference conductor intended to be connected to a reference electrical potential. Such a reference conductor is, for example, connected to electrical ground.

[0055] In an example embodiment, the reference conductor is one of the conductive layers 32, 34, hereafter referred to as the reference conductive layer 34.

[0056] In the example illustrated in [Fig.2], the reference conductive layer 34 corresponds, for example, to the third conductive layer of the printed circuit 12 from the top face 26.

[0057] The reference conductive layer 34 is advantageously configured to be brought to a reference electrical potential, preferably being connected to electrical ground.

[0058] The printed circuit board 12 optionally includes connection pads 35 arranged under the lower face 28 and / or on the upper face 26.

[0059] The connection pads 35 under the lower face 28 are, for example, intended to be connected to connection pads of a printed circuit board of an electronic board during the mounting of the electronic module 10 on said printed circuit board or to pads of connection of another electronic module for mounting electronic module 10 on said other electronic module.

[0060] The connection pads 35 on the upper face 26 are for example intended to be connected to electrical components 14A, 14B, 14C, 14D.

[0061] The printed circuit 12 also advantageously includes connecting vias 36, each connecting via 36 being electrically conductive and extending between at least two of the conductive layers 32, 34 to electrically connect them together or between at least one of the conductive layers 32, 34 and one or more connecting pads 35 to electrically connect them.

[0062] The electrical components 14A, 14B, 14C, 14D are mounted on the upper face 26 of the printed circuit board 12, preferably by soldering.

[0063] As illustrated in [Fig.2], each electrical component 14A, 14B, 14C, 14D comprises, for example, a main body 38 and at least one connection terminal 40 for connecting the electrical component 14A, 14B, 14C, 14D to the printed circuit board 12. Each electrical component 14A, 14B, 14C, 14D preferably comprises at least two connection terminals 40.

[0064] Each electrical component 14A, 14B, 14C, 14D is advantageously chosen from a passive electrical component, an active electrical component, a component comprising an integrated circuit or a microelectromechanical system.

[0065] Electrical components 14A, 14B, 14C, 14D are more particularly arranged on the printed circuit 12 in each of the first zone 22 and the second zone 24 in order to perform the corresponding function.

[0066] In particular, the electrical components 14A, 14B, 14C, 14D include, for example, at least one polluting component 14A emitting electromagnetic disturbances arranged in the first zone 22 (polluting zone).

[0067] For example, the polluting component 14A emits low-frequency electromagnetic waves, for example with a frequency between 200 kHz and 2 MHz.

[0068] The polluting component 14A is, for example, an unshielded inductor.

[0069] Similarly, the electrical components 14A, 14B, 14C, 14D include, for example, at least one sensitive component 14B arranged in the second zone 24 (sensitive zone) which is susceptible to being disturbed by electromagnetic disturbances, and in particular by those emitted by the polluting component(s) 14A of the first zone 22.

[0070] The sensitive component 14B is, for example, another inductance whose magnetic field couples with that of the inductance of component 14A.

[0071] The coating layer 16 is arranged on the upper face 26 of the printed circuit 12, coating the electrical components 14A, 14B, 14C, 14D.

[0072] The coating layer 16 is preferably made of a dielectric material.

[0073] For example, the coating layer 16 is made of resin, in particular resin of epoxy type.

[0074] The coating layer 16, for example, has a thickness, measured along an extension direction Z, of between 2 mm and 5 mm. The extension direction Z is preferably normal to the extension plane along which the upper face of the printed circuit board 12 extends.

[0075] As illustrated in [Fig.2], the metal protective cage 18 covers the coating layer 16.

[0076] Advantageously, the metal protective cage 18 also at least partially covers the lateral faces of the printed circuit board 12.

[0077] In particular, the metallic protective cage 18 comprises an upper face 42 extending over the coating layer 16 and lateral portions 44 covering lateral faces of the coating layer 16 and preferably extending downwards to at least partially cover lateral faces of the printed circuit board 12.

[0078] Preferably, the metallic protective cage 18 is electrically connected to the reference conductor, in particular to the reference conductive layer 34, especially at the side faces of the printed circuit 12.

[0079] In particular, advantageously the reference conductor, in particular the reference conductive layer 34, is flush with one or more lateral faces of the printed circuit 12 and / or protrudes from one or more lateral faces of the printed circuit 12 by being electrically connected to the protective cage 18.

[0080] The metal protective cage 18 has, for example, a thickness between 5 pm and 50 pm.

[0081] The metal protective cage 18 makes it possible in particular to protect the electrical components 14A, 14B, 14C, 14D against moisture infiltration and to provide electromagnetic shielding of the electronic module 10 as a whole, against, for example, external electromagnetic disturbances.

[0082] As illustrated in [Fig.2], each protective via 20 connects the protective cage 18 to the reference conductor, in particular to the reference conductive layer 34, by passing through the encapsulation layer 16 and, preferably, by connecting to the terminal 40 of a component 14C itself connected to the reference potential as will be specified below.

[0083] Preferably, the electrical components 14A, 14B, 14C, 14D include at least a third electrical component 14C having a connection terminal 40 electrically connected to the reference conductor, in particular to the reference conductive layer 34, for example by an electrically conductive via 48.

[0084] Advantageously, at least one or each of the protective via 20 connects the connection terminal 40 of one of the third electrical components 14C associated with this via 20 to the protective cage 18 by passing through the encapsulation layer 16.

[0085] Each third electrical component 14C associated with one or each protection via 20 is for example a passive electrical component, such as a resistive element like a resistor, a capacitive element like a capacitor or an inductive element like a coil.

[0086] Advantageously, each third electrical component 14C is disposed in the second zone 24 (sensitive zone), preferably at the boundary with the first zone 22 (polluting zone).

[0087] Preferably, as can be seen in the example embodiment illustrated in [Fig.1], the third electrical components 14C are arranged side by side along the boundary between the first zone 22 and the second zone 24.

[0088] Each protective via 20 advantageously extends inside the coating layer 16, and in particular away from the lateral portions of said coating layer 16.

[0089] In other words, each protective via 20 is, for example, laterally delimited by the coating layer 16 extending all around the protective via 20. Preferably, one or each of the protective via 20 is a metallized passage, preferably a metallized orifice, in particular a metallized orifice with a circular cross-section.

[0090] Each protective via 20 extends for example into the coating layer 16 along the extension direction Z.

[0091] In particular, each protection via 20 extends between the upper face 42 of the protection cage 18 and the connection terminal 40 of the third electrical component 14C associated with this via 20.

[0092] More particularly, each protective via 20 has its transverse dimensions, taken perpendicular to the extension direction Z through the coating layer 16, between 100 pm and 300 pm, and preferably between 100 pm and 250 pm.

[0093] In the case where the protective via 20 is a metallized orifice with a circular cross-section, the transverse dimension corresponds to the diameter of the circular section.

[0094] In the embodiment illustrated in [Fig.1], several separate protective vias 20 are formed and arranged so as to define an internal protective partition 50, for example between the polluting zone 22 and the sensitive zone 24.

[0095] In particular, the internal protective partition 50 is defined by the arrangement of the protective vias 20 next to each other.

[0096] In the embodiment illustrated in [Fig.1], the internal protective partition 50 is formed of several separate vias 20 distributed along a line and being spaced apart along said line.

[0097] For example, the via 20 are spaced at a distance of between 120 pm and 1 mm.

[0098] The formation of the internal protective partition 50 by the arrangement of several via Having 20 separate units makes it easier to manufacture, since each via 20 is manufactured individually, for example by mechanical drilling or laser.

[0099] The internal protective partition 50 makes it possible to limit the passage of electromagnetic waves emitted from the polluting zone 22 to the sensitive zone 24, in particular so as to protect the sensitive component 14B.

[0100] In particular, the closer the protective vias 20 are to each other, the denser the internal protective partition 50 is and the more the passage of electromagnetic waves is blocked, especially for high frequencies.

[0101] The internal protective partition 50, viewed from above, is for example substantially straight as illustrated in [Fig.1].

[0102] Alternatively, the internal protective partition 50 has a different shape, for example following a curvilinear line or a line having one or more curvilinear segments and / or one or more straight segments.

[0103] The internal protective partition 50 extends for example between two distinct ends as illustrated in [Fig.1].

[0104] Alternatively, the internal protective partition 50 extends along a closed line. In this case, it surrounds, for example, a sensitive area or a polluting area.

[0105] As an alternative or as an option, at least one via 20 is extended to form a continuous partition or a portion of a continuous partition.

[0106] In operation, the polluting zone 22, and in particular the polluting component 14A, emits electromagnetic waves in all directions, and especially towards the sensitive zone 24. The internal protective partition 50 formed by the via(s) 20 blocks at least partially the electromagnetic waves emitted towards the sensitive zone 24. Only a part of the electromagnetic waves therefore reaches the sensitive component 14B, which is thus little disturbed by them.

[0107] A method for manufacturing such an electronic module 10 will now be described.

[0108] The process preferably includes a first step of assembling the electrical components 14A, 14B, 14C, 14D on the printed circuit board 12, and in particular on its upper face 26.

[0109] Preferably, during this first assembly stage, the electrical components 14A, 14B, 14C, 14D are more particularly arranged by zones 22, 24, each corresponding to an individual function.

[0110] Advantageously, during this first assembly stage, the electrical components 14A, 14B, 14C, 14D are mounted on the upper face 26 of the printed circuit 12 according to the CMS technology (acronym for the English "Component Mounted Surface"). [YES] More specifically, the electrical components 14A, 14B, 14C, 14D are brazed to the surface of the printed circuit board 12.

[0112] Advantageously, during this first assembly step, a connection terminal 40 of at least one of the electrical components 14A, 14B, 14C, 14D (hereafter referred to as the third electrical component 14C) is electrically connected to the reference conductor, in particular to the reference conductive layer 34 of the printed circuit board 12.

[0113] Preferably, the method includes a step of applying the coating layer 16 disposed on the upper face 26 of the printed circuit 12 by coating the electrical components 14A, 14B, 14C, 14D.

[0114] For example, this application step is carried out by spraying a dielectric material, such as resin for example.

[0115] The process includes a step of drilling at least one passage 52 in said coating layer 16.

[0116] Preferably, the process includes a step of drilling a plurality of passages 52 in said coating layer 16.

[0117] This step is implemented more specifically in such a way as to form a plurality of passages 52 arranged between the polluting zone 22 and the sensitive zone 24.

[0118] Advantageously, at least one or each passage 52 extends between an upper face of the encapsulation layer 16 and the connection terminal 40 of one of the third electrical components 14C connected to the reference conductor, in particular to the reference conductive layer 34 of the printed circuit 12.

[0119] The drilling of the passage(s) 52 is carried out by laser drilling.

[0120] The process then includes a metal deposition step in each passage 52 to form a protective via 20 connecting the metallic protective cage 18 covering the coating layer 16 to the reference conductor, in particular to the reference conductive layer 34 of the printed circuit 12, by passing through the coating layer 16.

[0121] Preferably, the metal protective cage 18 is also formed during this metal deposition step.

[0122] Advantageously, at least one or each of the protective via 20 connects the connection terminal 40 of one of the third electrical components 14C associated with this via 20 to the protective cage 18, in particular to the upper face 42 thereof, by passing through the coating layer 16.

[0123] This step is preferably implemented so as to form a plurality of protection vias 20 arranged so as to define the internal protection partition 50 between the polluting zone 22 and the sensitive zone 24.

[0124] Preferably, the process then includes a step of marking, testing and / or conditioning the electronic module 10.

[0125] The marking includes, for example, a polarity indicator, a product reference and a batch reference.

[0126] The electronic module 10 according to the invention is particularly advantageous, in that the protection vias 20, and more particularly the internal partition 50, limit the electromagnetic disturbances of the sensitive area 24 by the polluting area 22.

[0127] For example, such an internal protective partition 50 attenuates electromagnetic interference between the two zones 22, 24 by a factor of at least 100 for a frequency band from 100 Hz to 15 GHz.

[0128] Furthermore, the connection of the protection vias 20 to the connection terminals 40 of one of the third electrical components 14C makes it possible not to allocate additional space to the formation of this internal protection partition 50, and therefore not to reduce the densification of the electronic module 10.

[0129] In addition, each metallic protective via 20 advantageously allows the heat of the third associated electrical component 14C to be evacuated by the protective cage 18.

[0130] The electronic module 10 equipped with protective via 20 can be easily manufactured by providing, for each via 20, a passage 52 through the coating layer 16 before metallization to make the protective cage 18.

[0131] Each passage 52 is easily provided by digging or machining the coating layer 16, for example mechanically or by laser.

[0132] The connection of each via 20 to a connection terminal 40 of an electrical component 14C, in particular a passive electrical component, makes it easy to form the via 20 by cutting the coating layer up to the terminal 40, which can be carried out reliably and controlled, in particular by laser machining, limiting any risk of damaging the printed circuit 12 and / or the electrical components 14A, 14B, 14C, 14D.

[0133] The invention is not limited to the embodiments and variants discussed above. Other embodiments and variants are conceivable.

[0134] For example, alternatively, the electronic module 10 is not divided into two functional areas 22, 24, but into a number of functional areas greater than or equal to three.

[0135] Alternatively, the electronic module 10 does not include only one polluting zone 22, but at least two polluting zones.

[0136] Similarly, alternatively, the electronic module 10 does not include only one sensitive area 24, but at least two sensitive areas.

[0137] According to another embodiment, the printed circuit board 12 comprises a number of conductive layers 32 other than four. For example, the printed circuit board 12 comprises a single conductive layer 32 or a number of conductive layers 32 between two and four or greater than four.

[0138] In a particular embodiment, several electronic modules 10 are manufactured simultaneously on the same printed circuit board grouping several printed circuits 12 initially joined together, by the process as described above, this method of implementation including the separation of the printed circuits 12.

[0139] In particular, in this embodiment, the process includes, before the metal deposition step, a sawing step of passages extending between the upper face of the coating layer 16 and the reference layer 34 of the printed circuits 12. Each passage defines a boundary between two adjacent electronic modules 10.

[0140] Furthermore, the process includes, following the metal deposition step, a step of separating the plurality of electronic modules 10 thus formed, preferably by sawing the passages to the lower face 28 of each of the printed circuits 12. This gives a plurality of electronic modules 10 separated from each other.

Claims

Demands

1. An electronic module (10) comprising: - a printed circuit board (12) having an opposing upper face (26) and lower face (28), the printed circuit board (12) comprising a reference conductor, - electrical components (14A, 14B, 14C, 14D) mounted on the upper face (26) of the printed circuit board (12), - an encapsulation layer (16) disposed on the upper face (26) of the printed circuit board (12) encapsulating the electrical components (14A, 14B, 14C, 14D), the encapsulation layer (16) being made of a dielectric material, - a metallic protective cage (18) covering the encapsulation layer (16), and - at least one protective via (20), each protective via (20) connecting the protective cage (18) to the reference conductor by passing through the encapsulation layer (16), each protective via (20) being a metallized orifice of circular cross-section.

2. Electronic module (10) according to claim 1, wherein the electrical components (14A, 14B, 14C, 14D) include at least one third electrical component (14C) having a connection terminal (40) electrically connected to the reference conductor, at least one or each of the protective vias (20) connecting the connection terminal (40) of a third electrical component (14C) associated with this via (20) to the protective cage (18) by passing through the encapsulation layer (16).

3. Electronic module (10) according to claim 2, wherein the third electrical component (14C) associated with one or each via (20) is a passive electrical component, such as a resistive element, a capacitive element or an inductive element.

4. Electronic module (10) according to any one of the preceding claims, wherein each protective via (20) has its transverse dimensions, taken perpendicular to an extension direction (Z) of the protective via (20) through the coating layer (16), between 100 pm and 300 pm.

5. Electronic module (10) according to any one of the preceding claims, comprising at least one polluting zone (22) capable of emitting electromagnetic disturbances and a sensitive zone (24) capable of being disturbed by electromagnetic disturbances, the module (10) comprising a plurality of protection vias (20) arranged so as to define an internal protection partition (50) between the polluting zone (22) and the sensitive zone (24).

6. Electronic card comprising at least one electronic module (10) according to any one of the preceding claims.

7. A method for manufacturing an electronic module (10), said method comprising the following steps: - a step of drilling at least one passage (52) through an encapsulation layer (16) made of a dielectric material and covering the upper face (26) of a printed circuit board (12) on which electrical components (14A, 14B, 14C, 14D) are mounted, the encapsulation layer (16) encapsulating the electrical components (14A, 14B, 14C, 14D), and - a step of depositing metal in each passage (52) to form a protective via (20) connecting a metallic protective cage (18) covering the encapsulation layer (16) to a reference conductor of the printed circuit board (12) by passing through the encapsulation layer (16), each protective via (20) being a metallized orifice of circular cross-section.

8. Manufacturing method according to claim 7, the electrical components (14A, 14B, 14C, 14D) include at least one third electrical component (14C) having a connection terminal (40) electrically connected to a reference conductor, at least one or each of the protective vias (20) connecting the connection terminal (40) of a third electrical component (14C) associated with this via (20) to the protective cage (18) through the encapsulation layer (16).

9. A manufacturing method according to claim 7 or 8, implemented so as to form a plurality of protective vias (20) arranged so as to define an internal protective partition (50) between a polluting zone (22) capable of emitting electromagnetic disturbances and a sensitive zone (24) capable of being disturbed by electromagnetic disturbances.

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