Additive manufacturing process on a perforated substrate

Abstract

Title: Additive Manufacturing Process on a Perforated Support The present invention relates to an additive manufacturing process by powder bed fusion of a radio frequency device comprising a depowdering step during which the powder residue is removed through a through hole (10, 20) provided in the manufacturing support (S) and / or in a wall of the radio frequency device (1) adjacent to the manufacturing support (S), without the fabricated radio frequency device (1) needing to be separated from the manufacturing support (S) during the powder residue removal step. The invention also relates to a manufacturing support comprising at least one through hole (10) for removing powder residue during a depowdering step. Figure for the abstract: Fig. 2.

Description

Title of the invention: Additive manufacturing process on a perforated substrate. Technical field

[0001] The present invention relates to an additive manufacturing method for a radio frequency device on a perforated manufacturing support. STATE OF THE ART

[0002] Additive manufacturing by powder bed fusion, generally metallic, comprises three main steps which are the deposition of a bed of powder to be fused onto a manufacturing support, the melting of this powder bed by selective application of an energy source, and finally the depowdering, that is to say the removal of the powder after the powder has been melted.

[0003] The depowdering stage involves several difficulties of different kinds such as the risks of explosion, the risks to the health of the operators, the high cost due to the manual nature of the work, the recovery of excess powder, the quality of the surface finishes of the manufactured parts, the industrial reproducibility of the processes or the management of the different powders used which sometimes cannot be mixed.

[0004] The difficulty of the depowdering step also depends on the topology of the manufactured parts. Generally speaking, parts with a complex geometry including cavities or curved tubular elements tend to trap some of the excess powder inside and therefore require more handling to remove it.

[0005] Existing depowdering techniques include, in particular: - The vibration and / or shock of the manufacturing support on which the manufactured part is fixed. - The rotation of the manufacturing support on which the manufactured part is fixed, along one or more axes of rotation. - High-pressure cleaning by injection of air, liquid or gas.

[0006] These depowdering techniques are typically performed using dedicated machines separate from the additive manufacturing machine itself, although integrated solutions also exist. It is therefore generally necessary to move the manufactured part, fixed to its build platform, from the 3D printing device to the depowdering machine.

[0007] In the aerospace field, and particularly in the field of passive antennas, the use of additive manufacturing by powder bed fusion has experienced There has been significant growth in recent years. However, components for passive antennas, such as satellite antennas, often have complex geometries, including waveguide arrays, frequently curved due to the need to reduce size imposed by satellite payload limitations. Furthermore, such components often require a very smooth surface finish because of their function of propagating waves. A conductive coating typically covers the internal portions of these components, thus determining their surface finish.

[0008] Thus, depowdering such parts is often a delicate operation requiring a lot of attention and is therefore relatively expensive.

[0009] Furthermore, parts such as radio frequency (RF) devices generally require heat treatment after additive manufacturing. This heat treatment must be performed after the depowdering step to prevent powder residue from fusing with the RF device. Thus, in order to remove powder residue from inside the device, for example, inside a waveguide, it is common practice to separate the printed RF device from its build platform. In this way, the powder residue can exit through any openings in the device located against the build platform.

[0010] This process, however, has the disadvantage of separating the manufacturing support from the RF device, which can be detrimental for heat treatment. Indeed, heat treatment is advantageously performed on the bonded assembly formed by the manufacturing support and the RF device manufactured on it, so that the support can, for example, be used to limit deformations of the RF device and thus obtain increased reproducibility of the parts, since the deformations, which vary from part to part, are limited.

[0011] US2024001447A1 discloses a powder removal device based on the induction of ultrasonic vibrations in a device fabricated by powder bed fusion. The vibrations are induced in the fabrication support to which the device is attached. SUMMARY

[0012] An object of the present invention is to propose an additive manufacturing process for a radio frequency component free from the limitations present in prior art processes.

[0013] Another object of the invention is to propose an additive manufacturing process for a radio frequency component in which the depowdering step is faster and more efficient.

[0014] According to the invention, these objectives are achieved in particular by means of an additive manufacturing process by powder bed fusion of a radio frequency device 1 comprising at least one aperture 30, the process comprising the steps of: - deposit onto a manufacturing support S a bed of powder intended to be fused to form the radio frequency device 1, - to form the radiofrequency device by melting the powder bed in such a way that at least one opening 30 of the device is disposed on the manufacturing support S during manufacturing, - to remove a powder residue from the manufacture of the radio frequency device from inside an assembly formed at least by the manufacturing support S and the radio frequency device 1 to its outside. characterized in that the powder residue is evacuated through a through hole 10, 20 provided in the manufacturing support S and / or in a wall of the radio frequency device 1 adjacent to the manufacturing support S, without the manufactured radio frequency device 1 having to be separated from the manufacturing support S during the powder residue evacuation step.

[0015] Advantageously, the evacuation of the powder residue via the through holes 10, 20 not only makes it easier and faster to depowder the step, but also avoids having to separate the manufactured device from the manufacturing support S.

[0016] According to one embodiment, the radio frequency device 1 is an antenna array comprising a plurality of elementary antennas arranged contiguously on the manufacturing support S, the at least one opening 30 being an opening of a radiating element of an elementary antenna.

[0017] According to one embodiment, the through hole 10 is provided in the manufacturing support S and the radio frequency device 1 is manufactured so that at least one opening 30 is aligned with an opening of the through hole 10.

[0018] According to an embodiment in which the through hole, the powder bed is arranged on the manufacturing support S so as to at least partially fill the through hole 10.

[0019] Thus, internal elements in at least one opening can be additively manufactured by means of the powder bed disposed in the hole passing through 10.

[0020] According to one embodiment, the manufacturing support comprises a plurality of through holes 10, the radio frequency device 1 being manufactured such that at least one opening 30 is aligned with each through hole 10.

[0021] According to one embodiment, a diameter of the cross-section of the through hole 10 is less than the diameter of at least one opening 30 of the radio frequency device 1.

[0022] According to one embodiment, at least one opening 30 of the device is formed by a plurality of openings of the radiating elements of the plurality of elementary antennas.

[0023] According to one embodiment, each through hole 10 is aligned with an opening of a radiating element of an elementary antenna, so that the through holes 10 are arranged in a network of holes aligned with the antenna network.

[0024] According to one embodiment, the through hole 20 is provided in a wall of the radio frequency device 1 adjacent to the manufacturing support S when the radio frequency device is manufactured on the manufacturing support so that the through hole 20 is at least partially delimited by the manufacturing support S and at least partially delimited by the wall of the device 1.

[0025] Advantageously, the through holes 20 allow for easier and faster removal of powder residue. This embodiment can also be combined with through holes provided in the manufacturing support to increase the channels for removing powder residue.

[0026] According to one embodiment, the wall of the device 1 comprises a plurality of through holes 20, each elementary antenna comprising at least one through hole 20 of the plurality of through holes.

[0027] According to one embodiment, the through hole 20 has an arch-shaped section.

[0028] According to one embodiment, a profile of the arch includes a rounded portion and / or a polygonal portion formed of at least two straight segments.

[0029] According to one embodiment, the process includes a step of ablation of a portion of the wall of the device adjacent to the manufacturing support in which the through hole 20 is made so that the final radio frequency device 1 no longer has a through hole 20.

[0030] According to one embodiment, the process includes a step of modifying the geometry of the through hole 20 after additive manufacturing of the device 1 so as to modify the impedance of the device.

[0031] These goals are also achieved by means of a manufacturing support S for powder bed additive manufacturing of a radio frequency device 1, the support S comprising a through hole 10 intended to allow the evacuation of residue from the powder bed from inside the manufactured device to outside the device 1 without the device having to be separated from the manufacturing support S.

[0032] According to one embodiment, the manufacturing support S comprises a plurality of through holes 10 arranged in a network corresponding to an opening network of a radio frequency device intended to be manufactured on the support. BRIEF DESCRIPTION OF THE FIGURES

[0033] Examples of implementation of the invention are given in the description illustrated by the accompanying figures in which:

[0034] [Fig.1] Fig.1 illustrates a radio frequency component manufactured additively on a manufacturing support.

[0035] [Fig.2] Fig.2 illustrates a cross-section of a radio frequency component manufactured on a perforated manufacturing support.

[0036] [Fig.3] Fig.3 is a cross-section of a radio frequency component fabricated on a support perforated manufacturing.

[0037] [Fig.4] Fig.4 illustrates a cross-section of a radio frequency component manufactured on a perforated manufacturing support.

[0038] [Fig. 5] [Fig. 5] illustrates a transparent view of a radio frequency component manufactured on a perforated manufacturing support.

[0039] [Fig. 6] [Fig. 6] illustrates a view of a radio frequency component provided with holes powder evacuation. DETAILED DESCRIPTION

[0040] The term "radio frequency device" used in this text may refer to any type of passive radio frequency (RF) component of an antenna. In particular, this term covers any type of waveguide, polarizer (e.g., septum), frequency and / or polarization multiplexers, filters (e.g., cavity, comb, evanescent mode, coaxial, etc.), radiating elements, antenna horns, and any combination of these elements (e.g., feed chain, antenna arrays, etc.).

[0041] A specific feature of these radio frequency devices is that they include at least one aperture 30, typically an inlet port or a radiating element for propagating an electromagnetic wave into or out of the device. This aperture 30 coincides with an internal channel of the device extending along a longitudinal axis. Due to the constraints related to the sagging of cantilevered portions during additive manufacturing, it is generally advantageous to manufacture the device so that the angle between its longitudinal axis and the manufacturing direction (i.e., the direction perpendicular to the laser-fused layers) does not exceed 45°. Preferably, the longitudinal axis of the device is even substantially parallel to the manufacturing direction, i.e., essentially perpendicular to the manufacturing support S (also called the printing support).

[0042] Fig. 1 illustrates by way of example a radio frequency device 1, for example an antenna array, additively manufactured by a powder bed fusion process on a manufacturing support S. The portion of the device in contact with the manufacturing support S has a longitudinal axis, or as illustrated, a plurality of parallel longitudinal axes, essentially perpendicular to the manufacturing support S.

[0043] The term "powder bed fusion" used herein refers to all additive manufacturing processes in which the manufactured part is produced by melting a powder, typically metallic or partially metallic, using an energy source. In particular, this includes powder melting by laser beam(s) (sometimes abbreviated LPBF for "Laser Powder Bed Fusion") and / or electron beam(s) (sometimes abbreviated EPBF for "Electron-beam Powder Bed Fusion").

[0044] According to one aspect of the invention, the depowdering step advantageously takes advantage of the manufacturing orientation of the RF device 1 relative to the manufacturing support S. Indeed, the invention proposes to facilitate the depowdering step of an RF device manufactured additively by powder bed fusion by means of the introduction of holes (or perforations) allowing the evacuation of powder residues contained inside the RF device after its manufacture without having to detach the device 1 from the support S.

[0045] As illustrated in [Fig. 2], the RF device 1 includes at least one opening 30 arranged on the fabrication support S during manufacturing. The opening 30 may correspond, for example, to a radiating element or to an input / output port of the RF device 1. Generally, the term "opening" refers to a portion of the RF device 1 that establishes electromagnetic communication between the inside and outside of the RF device 1. Due to the constraints related to additive manufacturing, particularly those related to the sagging of cantilevered portions, i.e., those forming too large an angle with respect to the manufacturing direction, it is natural to arrange the opening(s) 30 on the fabrication support S, since they generally correspond to a longitudinal end of the RF device or a portion thereof.

[0046] The manufacturing process according to the invention includes a first step of depositing a bed of powder onto the manufacturing support S. This step is typically carried out using a scraper.

[0047] In a second step, the powder bed is fused by means of an energy source to additively form the RF device 1 so that at least one opening 30 is disposed on the manufacturing support S, i.e. in contact with the manufacturing support S.

[0048] During this step, the melting of the powder bed upon contact with the manufacturing support S generally causes the RF device to fuse to the support itself. As mentioned above, the bonding of these two elements is particularly advantageous for the heat treatment of the RF device. It is also advantageous for depowdering since it allows the device to be handled, vibrated, and even subjected to shocks without being damaged by direct contact.

[0049] The third step of the process includes the removal of powder residue following the formation of the RF 1 device, in particular from the inside to the outside of the RF device. As mentioned above, the RF device typically includes internal channels, e.g. waveguides from which it is complex to remove powder residues without separating the manufacturing support S from the RF device 1.

[0050] Surprisingly and advantageously, the present invention proposes to evacuate this powder residue through a through hole 10, 20 provided in the manufacturing support S and / or in a wall of the RF 1 device adjacent to the manufacturing support S, without the manufactured RF 1 device having to be separated from the manufacturing support S during the powder residue evacuation step.

[0051] As illustrated in [Fig. 1], the present method is particularly suited to the fabrication of RF devices of the "antenna array" type, that is, a plurality of elementary antennas arranged contiguously forming an array of elementary antennas. In such an antenna array, the elementary antennas can be combined with each other by means of a beamforming array. In this way, each elementary antenna can be connected by one or more waveguides to an adjacent elementary antenna.

[0052] Thus, in such an antenna array, the multiplication of elementary antennas coupled with the complex geometry of the beamforming array makes dust removal particularly complex. The introduction of through holes 10, 20 allows for easier and faster removal of the powder residue inside the array.

[0053] According to a first embodiment illustrated in figures 2 to 5, the through hole 10 is provided in the manufacturing support S. This through hole 10 can be provided between an upper face of the support S allowing to support the RF device 1 and an lower face of the support S opposite to the upper face.

[0054] Alternatively or complementarily, the through hole can be provided between the upper face of the support and a lateral face of the support S adjacent to the upper face.

[0055] The RF device 1 is manufactured so that at least one opening 30 of the device is aligned with the through hole 10. In this way, the powder residue inside the device can be evacuated via the opening 30 and the through hole 10 to the outside of the device during depowdering.

[0056] When the RF 1 device has several openings 30, the manufacturing support may likewise include a plurality of through holes 10. Each opening 30 is then aligned with at least one through hole 10 so as to allow the evacuation of powder residues from the inside to the outside of the RF 1 device.

[0057] One such embodiment is illustrated in [Fig. 3], in which the RF device 1 comprises a plurality of apertures 30 aligned with through holes 10. Alternatively, a single aperture 30 may be aligned with several holes through holes. Alternatively, a plurality of 30 openings can be aligned with a single through hole 10.

[0058] According to one embodiment, the step of depositing the powder bed onto the manufacturing support S is carried out by at least partially filling the through hole 10. This operation is typically carried out by means of a scraper allowing the through hole to be filled from the upper surface of the manufacturing support S. In this way, it becomes possible in particular to manufacture elements of the RF device arranged inside at least one opening 30.

[0059] Depending on the requirements, the through hole 10 can be partially filled with powder, for example in order to manufacture internal elements extending outside the opening 30 (e.g. impedance matching protrusions such as striations in the case of a radiating element of an antenna).

[0060] Alternatively, the through hole 10 can be fully filled with powder for the purpose of manufacturing internal elements at the aperture 30 such as, for example, striations, septa or other impedance matching elements in the internal channel of a waveguide.

[0061] According to one embodiment, the through hole 10 can be temporarily obstructed on the lower surface of the manufacturing support S so as to keep the powder bed inside the through hole 10. At the end of the powder bed melting step, the through hole 10 is released so as to allow depowdering via the through hole 10.

[0062] This obstruction is achieved, for example, by means of a removable plate fixed to the lower surface of the manufacturing support S. It can be fixed by means of an adhesive element, screws, clamping elements, clips, or any other means suitable for reversible fastening. Alternatively, each through hole 10 can be blocked individually, for example, by inserting an obstruction element into each through hole 10.

[0063] According to one embodiment, the diameter of the through hole 10 is less than the diameter of the opening 30. In the present context, the term "diameter" designates the greatest straight-line distance between two points on the periphery of the opening 30. Thus, this term is suitable regardless of the geometry of the cross-section of the opening 30.

[0064] In this way, the perimeter of the opening 30 is supported by the manufacturing support S, while ensuring that the through hole 10 is aligned with the opening 30.

[0065] As illustrated in [Fig. 5], the cross-section of the through hole 10 can be circular, polygonal with three, four, five, six or more sides, have curves, or any combination of these geometries. It can have a geometry adapted to that of the cross-section of the opening 30, e.g., the same cross-section geometry, but with a smaller diameter or larger. The diameter of the through hole may vary depending on the printing direction or another direction. The through hole may have internal protrusions such as flats, teeth, or indentations, for example, intended for attaching auxiliary elements (e.g., through-hole blocking elements).

[0066] According to an embodiment in which the RF device is an antenna array comprising a plurality of elementary antennas, the fabrication support S comprises a plurality of through holes 10. Advantageously, the fabrication support comprises at least one through hole 10 for each elementary antenna. As illustrated in [Fig. 4], the fabrication support S can thus comprise an array (or matrix) of through holes 10. This array can be one-dimensional, i.e., consisting of a column (or row) of through holes 10, or two-dimensional, i.e., extending in two directions.

[0067] The network of through holes 10 of the manufacturing support S can therefore be adapted to the geometry of the RF device 1 manufactured, in particular to the number, geometry and arrangement of the openings 30 of the RF device 1.

[0068] According to a complementary or alternative embodiment, the through hole 20 is provided in a wall of the radio frequency device 1 adjacent to the manufacturing support S when the radio frequency device is manufactured on the manufacturing support so that the through hole 20 is at least partially delimited by the manufacturing support S and at least partially delimited by the wall of the device.

[0069] As illustrated in [Fig.6], the through holes 20 are advantageously provided in the portion of the RF device 1 located directly against the manufacturing support S. The through holes 20 are thus arranged at the level of at least one opening 30 of the device.

[0070] This arrangement allows the powder residue(s) to be evacuated from the inside to the outside of the device during the depowdering step. Indeed, these through holes 20 create a passage from the inside to the outside of the device. As mentioned above, the powder residue(s) can thus be evacuated from the inside of the RF device via the through holes 20, for example by successive rotations about one or more axes of the device fixed to the manufacturing support, and / or by vibration / shock, and / or by high-pressure cleaning.

[0071] When the RF device is on the manufacturing support S after being additively manufactured, the through holes 20 are delimited partly by the wall of the RF device and partly by the manufacturing support S. Thus, at least one side of the cross-section of each through hole 20 is formed by the manufacturing support S.

[0072] According to a preferred embodiment, the through holes are made directly by additive manufacturing, i.e. the device is manufactured additively so that the through holes are included during additive manufacturing.

[0073] Advantageously, the geometry of the through holes 20 can be adapted for additive manufacturing such that no external or fabricated support structure is required to support the through holes 20 when the RF device 1 is manufactured. These adaptations include, for example, the absence of cantilevered portions exceeding an angle of 45° with the vertical axis (the manufacturing direction), the creation of circular arc contours for the through holes, or at least curved portions so as to form one or more arches. Thus, an arch profile can typically include a rounded portion and / or a polygonal portion formed from at least two straight segments.

[0074] Alternatively or complementarily, one or more through holes 20 are drilled after the manufacture of the RF device 1.

[0075] According to an embodiment in which at least one through-hole 20 is formed in the wall of the device 1, the method may include a step of removing a portion of the device wall adjacent to the fabrication support in which the through-hole 20 is formed, such that the final radio frequency device 1 no longer has a through-hole 20. Indeed, the profile variations of the RF device caused by the through-holes 20 can have an undesirable effect on the propagation of electromagnetic waves in the device. In particular, these variations can alter the device's impedance.

[0076] However, these variations can also be used to the advantage of the device. Indeed, some RF devices require the use of mechanical impedance matching elements such as raised features (posts, steps, depressions, etc.). Thus, according to one embodiment, the through holes 20 are adapted to serve as impedance matching elements for the device. This implementation is particularly relevant when the RF device is an antenna whose radiating element is located on the side of the fabrication support S. In fact, the impedance matching elements are advantageously arranged at this end of the antenna.

[0077] In order to optimize the effect of the through holes 20 on the radio frequency characteristics of the device 1, the present method may include a step of modifying the geometry (i.e., the cross-section) of the through holes. Their profile may, for example, be cut or ground to obtain a geometry having specific and desired RF characteristics for the application of the RF device 1 in question.

[0078] According to one embodiment, the through holes 10 in the manufacturing support S and the through holes 20 in the wall of the RF 1 device can be combined to optimize the evacuation of powder residues.

[0079] The present application also relates to a manufacturing support S for powder bed additive manufacturing of an RF device 1. The support S includes at least one through hole 10 intended to allow the evacuation of residue from the powder bed from the inside of the device 1 to the outside of the device 1 without the device having to be separated from the manufacturing support S.

[0080] The manufacturing support may include one or more of the features presented above in the context of the description of the manufacturing process.

[0081] In particular, the manufacturing support S may include a plurality of through holes 10 between an upper face of the support S for supporting the RF device 1 and a lower face of the support S opposite the upper face.

[0082] Alternatively or complementarily, the through hole 10 can be provided between the upper face of the support and a lateral face of the support S adjacent to the upper face.

[0083] The arrangement of the through holes 10 on the support is typically adapted to the topology of the RF device to be manufactured. In particular, the manufacturing support S may advantageously comprise a plurality of through holes 10 arranged in a lattice to correspond to a plurality of radiating element apertures in an antenna array. The through holes 10 can thus be arranged at regular intervals from each other to form a row and column pattern.

[0084] Reference numbers used in the figures 1 Radio frequency device 10 Through hole 20 Through hole 30 Opening of the S device Manufacturing support

Claims

Demands

1. A powder bed fusion additive manufacturing process for a radio frequency device (1) comprising at least one aperture (30), the process comprising the steps of: • depositing a powder bed onto a manufacturing support (S) to be melted to form the radio frequency device (1), • melting the powder bed to form the radio frequency device so that at least one aperture (30) of the device is disposed on the manufacturing support (S) during manufacturing, • removing powder residue from the manufacturing of the radio frequency device from the inside of an assembly formed at least by the manufacturing support (S) and the radio frequency device (1) to its outside.Characterized in that the powder residue is evacuated through a through hole (10, 20) provided in the manufacturing support (S) and / or in a wall of the radio frequency device (1) adjacent to the manufacturing support (S), without the manufactured radio frequency device (1) having to be separated from the manufacturing support (S) during the powder residue evacuation step.

2. A method according to claim 1, wherein the radio frequency device (1) is an antenna array comprising a plurality of elementary antennas arranged contiguously on the manufacturing support (S), at least one aperture (30) being an aperture of a radiating element of an elementary antenna.

3. Method according to any one of claims 1 to 2, the through hole (10) being provided in the manufacturing support (S), the radio frequency device (1) being manufactured so that at least one opening (30) is aligned with an opening of the through hole (10).

4. Method according to claim 3, wherein the powder bed is arranged on the manufacturing support (S) so as to at least partially fill the through hole (10).

5. A method according to any one of claims 3 to 4, the manufacturing support comprising a plurality of through holes (10), the radio frequency device (1) being manufactured so that at least one opening (30) is aligned with each through hole (10).

6. A method according to any one of claims 3 to 5, wherein a diameter of the cross-section of the through hole is less than the diameter of at least one opening (30) of the radio frequency device (1).

7. A method according to claims 2 and 3, wherein at least one opening (30) of the device is formed by a plurality of openings of the radiating elements of the plurality of elementary antennas.

8. A method according to claim 7, wherein each through hole (10) is aligned with an opening of a radiating element of an elementary antenna, so that the through holes (10) are arranged in an array of holes aligned with the antenna array.

9. A method according to any one of claims 1 to 2, the through hole (20) being provided in a wall of the radio frequency device (1) adjacent to the manufacturing support (S) when the radio frequency device is manufactured on the manufacturing support such that the through hole (20) is at least partially delimited by the manufacturing support (S) and at least partially delimited by the wall of the device (1).

10. Method according to claims 2 and 9, the wall of the device (1) comprising a plurality of through holes (20), each elementary antenna comprising at least one through hole (20) of the plurality of through holes.

11. A method according to any one of claims 9 to 10, wherein the through hole (20) has an arch-shaped cross-section.

12. A method according to claim 11, wherein a profile of the arch comprises a rounded portion and / or a polygonal portion formed of at least two straight segments.

13. A method according to any one of claims 9 to 12, comprising a step of ablation of a portion of the wall of the device adjacent to the manufacturing support in which the through hole (20) is provided so that the final radio frequency device (1) no longer has a through hole (20).

14. A method according to any one of claims 9 to 12, comprising a step modifying the geometry of the through hole (20) after additive manufacturing of the device (1) so as to modify the impedance of the device.

15. Manufacturing support (S) for powder bed additive manufacturing of a radio frequency device (1), the support (S) comprising a through hole (10) for permitting the evacuation of residue from the powder bed from inside the manufactured device to outside the device (1) without the device having to be separated from the manufacturing support (S).

16. Manufacturing support according to claim 15, comprising a plurality of through holes (10) arranged in a network corresponding to an array of openings (30) of a radio frequency device (1) intended to be manufactured on the support (S).

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