Multilayer structure based on polyamide usable as a card

FR3168792A1Pending Publication Date: 2026-05-29ARKEMA FRANCE SA

Patent Information

Authority / Receiving Office
FR · FR
Patent Type
Applications
Current Assignee / Owner
ARKEMA FRANCE SA
Filing Date
2024-12-03
Publication Date
2026-05-29
Patent Text Reader

Abstract

The present invention relates to a multilayer structure based on polyamide for use as a card. This invention relates to a multilayer structure comprising: - an outer layer - a binder layer - an intermediate layer - a binder layer - a central layer - a binder layer - an intermediate layer - a binder layer - an outer layer. The compositions constituting the outer layers, intermediate layers, and central layer are made of a composition comprising a polyamide matrix and having a melting point above 150°C, preferably above 160°C, and the binder layers are made of a composition comprising a reactive functional polyolefin. The invention also relates to a method for manufacturing the structure and its use as a data card.
Need to check novelty before this filing date? Find Prior Art