Improved flip-chip module smart card

Abstract

The invention relates to a smart card comprising a card body (11) and an electronic module (1) comprising a dielectric substrate (2) the upper face of which is provided with metallic contacts (3) and the lower face of which has a microelectronic chip (5) mounted as a flip-chip, said electronic module (1) being intended to be fixed by means of an adhesive in a cavity (12) of the smart card body having a first zone (13) of depth P1 receiving said substrate (2) and a second zone (14) of depth P2 greater than P1 receiving the microelectronic chip (5), characterized in that a flexible material (15) suitable for forming a mechanical damper is interposed between the surface of the microelectronic chip (5) and the bottom (17) of said second zone (14) of the cavity (12), said flexible material (15) being chosen to be suitable for protecting the microelectronic chip (5) during the use of the smart card (10) or during mechanical resistance tests.Figure for the Abridged version: figure 6.