Modular thermal test vehicle

GB2609073BActive Publication Date: 2026-06-10NVIDIA CORP
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Patent Information

Authority / Receiving Office
GB · GB
Patent Type
Patents
Current Assignee / Owner
NVIDIA CORP
Filing Date
2022-05-06
Publication Date
2026-06-10

AI Technical Summary

Technical Problem

Current data center cooling systems are often inefficient due to incorrect design assumptions and high costs associated with testing, as well as the risk of damage during testing, making it challenging to evaluate cooling properties effectively.

Method used

A modular thermal test vehicle with pluggable heat-generating elements that simulate heat flux upwards towards thermal distribution elements, allowing for flexible simulation of various computing units and layouts, reducing costs and risk by mimicking the thermal performance of actual computing components without using expensive or sensitive equipment.

Benefits of technology

Enables efficient evaluation of cooling characteristics and optimization of cooling systems by simulating different heat-generating components and layouts, improving cooling efficiency and reducing energy consumption while minimizing the risk of damage during testing.

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Abstract

A thermal testing system is disclosed for evaluating data center cooling properties. The system comprises: a thermal test vehicle 202 including one or more pluggable heat-generating elements 204 to direct a heat flux in an upward direction toward one or more thermal distribution elements, heat plate 230, cold plate 326, heat spreaders 404; the thermal test vehicle further including a power supply unit to receive power from an external power source and distribute power to the one or more thermal distribution elements; and a liquid cooling system 226 to transfer heat from the one or more thermal distribution elements. The thermal testing vehicle 202 may include a base plate 214 with a plurality of connection mechanisms 242 to enable the one or more pluggable heat-generating elements to be positioned at any of a number of different locations to simulate component layouts for a plurality of different servers to be cooled using the liquid cooling system. The one or more pluggable heat-generating elements may include one or more heat resistors. One or more sensors 216 may be provided for measuring at least one of temperature, power, pressure, or flow rate at one or more locations within the thermal testing rig.
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